JP2001210738A - Package for storing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for storing an electronic component, which can solve a problem of a low reliability in airtight storage of an electronic component caused by an inaccurate bonding of a cover by securing a specified bonding width on the upper face of a sealing frame. SOLUTION: The package for storing an electronic component consists of the main body 1 and the cover 2 bonded to the frame 4. The main body 1 of the package is made by bonding the frame 4, which has the inner and outer surfaces and which is made by punching, on an insulation substrate 3 having, a mounting section 3 for mounting an electronic component 5 on the upper face, so as to surround the mounting section 3c. The frame 4 consists of a lower frame 4a bonded to the insulation substrate 3 and an upper frame 4b which is so laminated as to cover the upper face of the lower frame 4a and which is wider than the lower frame 4a. When the frame 4 is viewed from the top, only the upper frame 4b is seen and therefore the inner and outer edges of the frame 4 can be accurately recognized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component housing package for housing electronic components such as semiconductor elements.

[0002]

2. Description of the Related Art Conventionally, as a package for accommodating an electronic component such as a semiconductor element, a mounting portion for mounting the electronic component is provided at the center of the upper surface, and each electrode of the electronic component is connected. A package body in which a ceramic sealing frame is joined to an upper surface of a ceramic insulating base having a plurality of wiring conductors so as to surround a mounting portion, and a metal or glass joined to an upper surface of the sealing frame. 2. Description of the Related Art There is known an electronic component storage package including a lid body and the like. In this electronic component storage package, the electronic component is mounted and fixed on the mounting portion of the insulating base, and each electrode of the electronic component is connected to a wiring conductor via an electrical connection means such as a bonding wire. The electronic component is hermetically sealed inside by joining a lid to the upper surface of the device via a sealing material such as a resin sealing material.

When the lid is joined to the sealing frame of the electronic component storage package, the inner peripheral edge and the outer peripheral edge of the sealing frame are recognized by an image recognition device and based on the data. A method is adopted in which the lid is positioned at a predetermined position on the upper surface of the sealing frame, placed, and joined in that state.

In this conventional package for storing electronic components, the sealing frame is formed by punching a ceramic green sheet using a punching die and firing it. When the ceramic green sheet is punched by a punching die, if the thickness of the ceramic green sheet exceeds, for example, about 1 mm, the punching becomes difficult and the impact accompanying the punching increases, and cracks and chips are formed in the ceramic green sheet. This will make it difficult to obtain a sealing frame having a desired shape. Therefore, in order to obtain a sealing frame having a thickness exceeding 1 mm, for example, a plurality of ceramic green sheets having a thickness of 1 mm or less are prepared, and these ceramic green sheets are punched into the same shape and size. A method is adopted in which these are stacked one above the other and then fired.

[0005]

However, in this conventional package for storing electronic components, for example, a plurality of ceramic green sheets punched into the same shape and size to obtain a sealing frame having a thickness exceeding 1 mm. When lamination is performed, a step portion whose lower layer protrudes is formed on the side surface of the sealing frame due to an alignment error at the time of lamination, so that when viewed from above, the inner peripheral edge and the outer peripheral edge of the sealing frame are upper and lower layers. And the recognition of the inner peripheral edge and the outer peripheral edge of the sealing frame by the image recognition device becomes inaccurate.
As a result, the lid cannot be accurately bonded to the upper surface of the sealing frame with a predetermined bonding width, and the airtight reliability of the electronic components housed therein becomes low. Had.

The present invention has been devised in view of such a conventional problem, and an object of the present invention is to provide an airtight reliability capable of accurately joining a lid to a predetermined position on an upper surface of a sealing frame. Another object of the present invention is to provide a package for storing electronic components which is excellent.

[0007]

An electronic component housing package according to the present invention has an inner peripheral surface and an outer peripheral surface formed by punching on an insulating base having a mounting portion on which an electronic component is mounted on an upper surface. An electronic component storage package comprising a package body formed by joining a sealing frame so as to surround a mounting portion and a lid joined to the sealing frame, wherein the sealing frame is formed on an insulating base. A joined lower frame,
The upper frame is wider than the lower frame laminated over the upper surface of the lower frame.

According to the electronic component housing package of the present invention, the sealing frame is formed on the lower frame so that the upper frame, which is wider than the lower frame, covers the upper surface of the lower frame. Since the sealing frame is viewed from above,
Only the upper frame is visible, so that the inner and outer edges of the sealing frame do not overlap.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a sectional view showing an embodiment of an electronic component storage package according to the present invention, wherein 1 is a package body and 2 is a lid. FIG. 2 is a partially cutaway perspective view of the package body 1 shown in FIG.

The package body 1 is mainly composed of an insulating substrate 3
And a sealing frame 4.

Insulating base 3 constituting package body 1
Is a substantially rectangular flat plate made of a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, and a glass ceramic, In this example, the insulating base 3 is formed by laminating two insulating layers 3a and 3b made of a ceramic material. The insulating base 3 functions as a support member for supporting the electronic component 5, and has a mounting portion 3 c on which the electronic component 5 is mounted at the center of the upper surface.

Further, the insulating base 3 has a plurality of wirings made of metal powders of metal such as tungsten and molybdenum / molybdenum-manganese / copper / silver / silver / palladium which are led out from around the mounting portion 3c to the lower surface of the insulating base 3. A conductor 6 is formed. The wiring conductor 6 functions to electrically connect the electrodes of the electronic component 5 to a predetermined external electric circuit, and the electrodes of the electronic component 5 are formed around the mounting portion 3c of the wiring conductor 6 by, for example, solder or gold. The portion led out to the lower surface of the insulating base 3 is electrically connected to a wiring conductor of an external electric circuit board (not shown) via solder or the like. The wiring conductor 6 is provided with a metal having excellent corrosion resistance, such as nickel or gold, and excellent connectivity with bumps 7 and solder, with a thickness of 1 to 20 μm by plating, on the exposed surface. Oxidation and corrosion of the wiring conductor 6 can be effectively prevented, and the connection between the wiring conductor 6 and the bump 7 and the connection between the wiring conductor 6 and the wiring conductor of the external electric circuit board can be made strong. Therefore, it is preferable to apply a metal having excellent corrosion resistance, such as nickel or gold, and excellent bonding property with the bump 7 or solder to a thickness of 1 to 20 μm on the surface of the wiring conductor 6 by plating.

The sealing frame 4 is made of an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, a glass ceramic, or the like. It has a substantially square frame shape formed by laminating a lower frame 4a and an upper frame 4b made of a ceramic material, and is joined to the upper surface of the insulating base 3 so as to surround the mounting portion 3c. The sealing frame 4 is a cover 2
Functions as a base member for attaching the electronic component 5, and also functions as a side wall member for forming a space for accommodating the electronic component 5 between the insulating base 3 and the lid 2. Are joined.

The sealing frame 4 is formed by an upper frame 4b.
Is wider than the width of the lower frame 4a,
It is manufactured so that the upper surface of the lower frame 4a is completely covered by the upper frame 4b. Thus, the width of the upper frame 4b is wider than the width of the lower frame 4a, and the upper frame 4a is manufactured so that the upper surface of the lower frame 4a is completely covered by the upper frame 4b. Therefore, when the sealing frame 4 is viewed from above, only the upper frame 4b is visible, so that the inner peripheral edge and the outer peripheral edge of the sealing frame 4 have the upper frame 4b and the lower frame 4a. And do not look redundant. Therefore, the lid 2 can be accurately attached to the upper surface of the sealing frame 4 by using an image recognition device, and the electronic component 5 is sealed inside the package with high hermetic reliability. And it can be operated stably.

On the other hand, the lid 2 is made of glass or ceramics.
It is a substantially rectangular flat plate made of metal, and is joined to the upper surface of the sealing frame 4 of the package body 1 on which the electronic component 5 is mounted via a sealing material 8 made of, for example, epoxy resin, so that the package body 1 The electronic component 5 is hermetically sealed inside the container including the lid 2.

Incidentally, such a package body 1 is manufactured by the following method.

First, as shown in a perspective view in FIG. 3, two ceramic green sheets 11 and 12 for an insulating base and two ceramic green sheets 13 and 14 for a sealing frame are prepared. Such ceramic green sheets 11, 12, 13
14 is an organic binder and solvent suitable for a raw material powder of aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc., when the insulating base 3 and the sealing frame 4 are made of, for example, an aluminum oxide sintered body. Is added and mixed to form a slurry, which is formed into a sheet by employing a conventionally known doctor blade method or calendar roll method. In this example, each ceramic green sheet 11, 12, 13, 14 has an area for manufacturing four package bodies 1.

Next, as shown in a perspective view in FIG. 4, through-holes 11a and 12a for leading the wiring conductor 6 to the ceramic green sheets 11 and 12 for the insulating base are formed in the ceramic green sheets 11 and 12 for the sealing frame 4. The through holes 13a and 14a for forming the inner peripheral surface of the sealing frame 4 and the through holes 13b and 14b for forming the outer peripheral surface of the sealing frame 4 are formed on the green sheets 13 and 14 by a known punching process. Drill by the method. At this time, the through holes 13a and 13
b is 0.05 times smaller than the inner diameters of the through holes 14a and 14b.
About 0.5 mm, so that the through hole 14
The width between a and 14b is set to be about 0.05 to 0.5 mm wider than the width between through holes 13a and 13b.

Next, as shown in a perspective view in FIG. 5, metal pastes 15 and 16 for the wiring conductors 6 are printed and coated in a predetermined pattern on the ceramic green sheets 11 and 12 for the insulating substrate by a conventionally known screen printing method. I do. The metal pastes 15 and 16 for the wiring conductor 6 are prepared, for example, when the wiring conductor 6 is made of tungsten powder metallization, by adding and mixing an appropriate organic binder and solvent to the tungsten powder to form a paste having a predetermined viscosity. Be produced.

Next, as shown in a perspective view in FIG. 6, ceramic green sheets 11 and 12 for an insulating substrate and ceramic green sheets 13 and 14 for a sealing frame are laminated to form a ceramic green sheet laminate 21. obtain. At this time, it is important that the ceramic green sheet 14 of the upper layer for the ceramic frame is laminated so as to completely cover the ceramic green sheet 13 of the lower layer in a region to be each package body 1. Therefore, in the present invention, the through holes 13a
b is 0.05 times smaller than the inner diameters of the through holes 14a and 14b.
By increasing the through holes 14a and 14
b is smaller than the width between the through holes 13a and 13b by 0.05.
It is about 0.5 mm wide. Then, even if a stacking deviation of, for example, about 0.05 mm occurs between the ceramic green sheets 13 and 14 at the time of stacking, the lower ceramic green sheet 13 is replaced with the upper ceramic green sheet in the region to become each package body 1. Sheet 14
Does not protrude from The through holes 14a and 14a
b is smaller than the width between the through holes 13a and 13b by 0.05.
When the width is less than mm, the ceramic green sheet 13
It is difficult to laminate the lower ceramic green sheet 13 without protruding from the upper ceramic green sheet 14 in the region that will become each package body 1 when laminating 14 and the package body 1. When the ceramic green sheets 13 and 14 are laminated, the upper ceramic green sheet 14 tends to be easily deformed. Therefore, it is preferable that the width between the through holes 14a and 14b is wider than the width between the through holes 13a and 13b by about 0.05 to 0.5 mm.

Finally, as shown in a perspective view in FIG. 7, the ceramic green sheet laminate 21 is cut into regions to become the respective package bodies 1 to obtain a green ceramic molded body 22 for the package body 1. By firing this green ceramic molded body 22 at a high temperature, the package body 1 as shown in FIGS. 1 and 2 is manufactured. In this case, the lower frame 4a in the obtained package body 1
The inner and outer peripheral surfaces of the sealing frame 4 do not protrude from the upper frame 4b, and the inner and outer peripheral edges of the sealing frame 4 are accurately recognized by the image recognition device, and the lid 2 is sealed with the sealing frame. It is possible to provide a package for accommodating a semiconductor element which can be accurately joined to a predetermined position of the body 4 and has excellent airtight reliability.

It should be noted that the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the scope of the present invention. For example, in the above-described embodiment, Although the sealing frame 4 is formed by stacking two layers of frames, the sealing frame 4 may be formed by stacking three or more layers of frames. Further, in the above-described embodiment, the sealing frame 4 is formed by cutting a part of the outer peripheral side, but the sealing frame 4 may be formed by punching the entire outer peripheral side. Good.

[0024]

According to the electronic component housing package of the present invention, the sealing frame covers the lower frame with the upper frame wider than the lower frame covered by the upper surface of the lower frame. When the sealing frame is viewed from above, only the upper frame is visible, so that the inner and outer edges of the sealing frame do not appear to overlap, Therefore, the lid can be accurately bonded to the upper surface of the sealing frame using the image recognition device, and as a result, a highly reliable airtight package for electronic components can be provided.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of an embodiment of an electronic component storage package according to the present invention.

FIG. 2 is a partially broken perspective view of a package body 1 of the electronic component storage package shown in FIG.

FIG. 3 is a perspective view for explaining a method of manufacturing the package body shown in FIG.

FIG. 4 is a perspective view for explaining a method of manufacturing the package body shown in FIG.

FIG. 5 is a perspective view for explaining a method of manufacturing the package body shown in FIG.

FIG. 6 is a perspective view for explaining a method of manufacturing the package body shown in FIG.

FIG. 7 is a perspective view for explaining a method of manufacturing the package body shown in FIG.

[Explanation of symbols]

 1 Package body 2 Lid 3 Insulating base 3c Mounting section 4 Sealing frame 4a Lower frame 4b: Upper frame 5: Electronic component

Claims (1)

[Claims] 1. A sealing frame having an inner peripheral surface and an outer peripheral surface formed by punching is joined to an insulating base having a mounting portion on which an electronic component is mounted on an upper surface so as to surround the mounting portion. An electronic component storage package comprising: a package body comprising: a package body; and a lid body joined to the sealing frame body, wherein the sealing frame body includes a lower frame body joined to the insulating base; An electronic component storage package, comprising: an upper layer frame, which is wider than the lower layer frame and is stacked so as to cover an upper surface of the lower layer frame.