JPH10264130A - Ceramic base with break groove and electronic component manufactured from the ceramic base - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify machining for break grooves and to prevent cracking at the time of packaging, printing, carrying and others. SOLUTION: Break grooves 2 and 3 are formed longitudinally and laterally in the surface of a ceramic base 1 and this base is divided into individual bases by breaking it along these break grooves. Dummy parts 5 are formed in the peripheral part of the ceramic base 1, while a product part 4 is formed inside them, and the longitudinal and lateral break grooves 2 and 3 are formed in continuity from the product part 4 to the dummy parts 5. The break grooves extending from the outermost-side break grooves 2a and 3a to the dummy parts 5 are formed to be shallow in comparison with the break grooves 2 and 3 dividing the product part 4 and the outermost-side break grooves 2a and 3a partitioning the product part from the dummy parts, and therefore the strength of the ceramic base l can be ensured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic substrate with break grooves suitable for dividing a single base material into a plurality of substrates.

[0002]

2. Description of the Related Art Heretofore, as this type of ceramic substrate with a break groove, there has been known a ceramic substrate in which break grooves are formed vertically and horizontally on the surface, and the substrate is divided into individual substrates by breaking along these break grooves. ing.

In the case of such a ceramic substrate, first, break grooves are formed vertically and horizontally, electrodes are formed on the surface of the ceramic substrate having the break grooves, and electronic component elements are mounted. It is designed to be split along. However, if the break grooves are formed vertically and horizontally as described above, when a load is applied to the ceramic substrate during mounting of an electronic component element or printing of an electrode, the break grooves may be broken at the break grooves. Therefore, in order to ensure the strength of the ceramic substrate, the break groove must be made shallow to some extent. However, this has a problem that burrs and chips are likely to occur when breaking the ceramic substrate. In particular, in the case of a minute electronic component having a size of each substrate of about several mm square, even a slight burr or chip may result in a defective product.

[0004] Therefore, as described in Japanese Patent Application Laid-Open No. 9-112221, there has been known a structure in which a dummy portion is formed on a peripheral portion, and a plurality of break grooves are formed in a lattice shape excluding the dummy portion. The outermost break grooves extend outwardly from the four intersections to a part of the way to the edge of the substrate, and the inclined break grooves inclined at 45 degrees are arranged on the edge end side of each intersection and on the outermost vertical and horizontal sides. The groove is provided so as to obliquely cross the position near the tip of the break groove. Then, first, a break is made along the inclined break groove, and then a break is made along the outermost break groove, so that a break can be performed as in the conventional case.

[0005] In this case, since the vertical and horizontal break grooves do not reach the peripheral edge but end at the middle of the dummy portion, the strength of the dummy portion is large, and a load is applied during mounting, printing, transport and the like. However, there is an advantage that cracking of the ceramic substrate can be prevented.

[0006]

However, in the above case, the vertical and horizontal break grooves must be processed so as to be terminated in the middle of the dummy portion, and there is a problem that the groove processing is troublesome. In addition, in addition to the vertical and horizontal break grooves, four inclined break grooves must be formed, and these inclined break grooves are closer to the edge than the intersection of the outermost break grooves and are the outermost vertical and horizontal break grooves. It is necessary to provide a position obliquely crossing the position near the front end of the device, so that there is a problem that dimensional accuracy is required and the production cost is increased.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a ceramic substrate with a break groove, in which a break groove can be easily processed and cracks can be prevented during mounting, printing, transport, and the like. Another object is to provide an electronic component which can be mass-produced with a high yield by using the ceramic substrate.

[0008]

In order to achieve the above-mentioned object, the present invention provides a ceramic in which break grooves are formed longitudinally and laterally on the surface and the substrate is divided into individual substrates by breaking along these break grooves. On the substrate, a dummy portion is formed in a peripheral portion, and a product portion is formed inside the dummy portion. Vertical and horizontal break grooves are formed continuously from the product portion to the dummy portion, and a break groove for dividing the product portion and the product portion and the dummy portion are formed. A break groove extending from the outermost break groove to the dummy portion is formed to be shallower than an outermost break groove partitioning between the outermost break grooves.

That is, since the depth of the break groove of the dummy portion is made shallower than the depth of the break groove of the product portion, the strength of the peripheral portion (dummy portion) of the ceramic substrate is high, so that it can be mounted, printed, transported, and the like. Cracking of the ceramic substrate can be prevented. Also, since the vertical and horizontal break grooves need only be formed continuously from the product portion to the peripheral portion across the dummy portion, there is no need to terminate at the middle of the dummy portion unlike the conventional case, and the inclined break groove is formed. Since there is no need to perform, the groove processing is simplified.

When the ceramic substrate is to be broken, a method of chucking one end of the ceramic substrate and generating a crack at one end to cause the crack to run to the other end to break the ceramic substrate may be used. In this case, if the depth of the break groove of the dummy part on all four sides is reduced,
Since the thickness at the other end is large, there is a disadvantage that the crack deviates in an oblique direction at the time when the crack runs to the other end, and it cannot be broken cleanly.

Therefore, of the break grooves extending from the outermost break groove to the dummy portion, the break groove extending to one side of the dummy portion is formed at the same depth as the break groove defining the product portion, and the remaining three sides are formed. It is desirable that the break groove extending to the dummy portion is formed shallower than the break groove defining the product portion. In this case, if the break is performed so that the crack runs from the shallow groove depth direction to the deep groove direction, the thickness at the terminal end portion is thin, so that the break can be performed finely to the end.

It is desirable that the ceramic substrate of the present invention be applied to a surface mount electronic component. That is, in the product part of the ceramic substrate according to claim 1 or 2, the electronic component element is mounted on each of the parts partitioned by the vertical and horizontal break grooves, and the ceramic substrate is broken along the vertical and horizontal break grooves. Thus, a surface-mounted electronic component can be easily obtained. In such an electronic component, the ceramic substrate is less likely to be broken when mounting the electronic component element or forming the electrodes, and the break grooves other than the dummy portion are easily broken. The load on the component element is small, and the incidence of defective products can be reduced.

There are various methods for forming a break groove, such as a method of forming a green sheet with a press die, a method of forming a groove on a hardened ceramic substrate with a dicer, and a method of forming a groove with a laser. Conceivable. In the present invention, the ceramic substrate is not limited to a single ceramic substrate, but may be a multilayer substrate. Alumina is generally used as the ceramic material, but is not limited thereto.

[0014]

1 and 2 show an example of a ceramic substrate having a break groove according to the present invention. The ceramic substrate 1 is formed of, for example, an alumina substrate having a thickness of 635 μm. On the surface thereof, electrodes (not shown) are formed, and a large number of electronic component elements (not shown) are arranged vertically and horizontally. It is installed. V-shaped break grooves 2 and 3 are formed vertically and horizontally on the surface of the ceramic substrate 1 so as to partition between mounted electronic component elements. A product part 4 used as a product is formed inside the outermost break grooves 2a and 3a, and the outermost break grooves 2a and 3a are formed.
A dummy portion 5, which is a discarded portion, is formed outside 3a.

Of the break grooves 2 and 3, the groove section defining the product part 4 including the outermost break grooves 2a and 3a has a width of, for example, 100 μm and a depth of 220 μm as shown by a thick line in FIG. It is processed into a deep groove. On the other hand, the groove portion corresponding to the dummy portion 5 is formed into a shallow groove having a width of, for example, 100 μm and a depth of 180 μm, as shown by a thin line in FIG. As described above, since the break groove of the dummy portion 5 is shallower than the break groove of the product portion 4, the peripheral portion of the ceramic substrate 1 has higher strength than the central portion. Therefore, the rigidity of the entire ceramic substrate 1 is increased, and it is possible to prevent the ceramic substrate 1 from being cracked at the time of mounting electronic component elements, printing electrodes, transporting, and the like.

The break grooves 2 and 3 are formed by pressing a green sheet with a press die, forming a groove on a hardened ceramic substrate by a dicer, or forming a groove by a laser. A known method such as a method may be used. In particular, in the groove processing method using a CO ₂ laser, the width and the depth can be freely adjusted, so that the ceramic substrate 1 as in the present invention can be easily manufactured.

Here, a method of breaking the ceramic substrate 1 will be described. First, as shown in FIG.
Then, the ceramic substrate 1 is chucked for one row along the vertical break groove 2, the next row is chucked by the chuck B, and the primary break is performed by rotating the chuck A in the direction of the arrow. Similarly, the ceramic substrate 1 is firstly broken along all the vertical break grooves 2 to obtain a strip-shaped ceramic substrate 1a. At this time, since both ends of the vertical break groove 2 are shallower than the central part, burrs and chipping may occur at both ends. However, since this part is a waste part corresponding to the dummy part 5, No problem.

Next, the strip-shaped ceramic substrate 1a broken in the vertical direction is chucked by the chucks C and D as shown in FIG. Break next. At this time, since the lateral break grooves 3 are all formed deep, cracks do not run obliquely during the secondary break, and burrs and chips can be prevented. Therefore, the four sides of the substrate 6 can be made to have a beautiful broken surface.

The method of breaking the ceramic substrates 1 and 1a is not limited to the method of breaking the upper and lower surfaces of the ceramic substrates 1 and 1a by chucks A to D as shown in FIG. Ceramic substrate 1, 1
a may be passed between the two transport rollers E and F and one pressing roller G to continuously break. In this case, it is sufficient to supply the ceramic substrate 1 or 1a with the grooved surface facing downward (toward the transport rollers E and F).

FIG. 6 shows an example of a surface-mounted electronic component obtained by using the ceramic substrate 1 as described above. In the figure, strip-shaped electrodes 10 and 11 are formed on the front and back surfaces of a substrate 6, and an oscillator element 12 is connected and fixed to the electrodes 10 and 11 by conductive adhesives 13 and 14. A cap 15 is adhered on the substrate 6 with an insulating adhesive 16, and the oscillator element 12 is sealed. Grooves 6a extending in the front and back directions are formed on both side edges of the substrate 6, and the electrodes 10 and 11 on the front and back are electrically connected through the electrodes formed on the inner surface of the grooves 6a. The groove 6a is formed by dividing a through hole formed on one of the vertical and horizontal break grooves 2 and 3 of the ceramic substrate 1.

The electrodes 10 and 11 as described above are formed on almost the entire surface of the ceramic substrate 1, and the oscillator element 12 and the cap 15 are vertically and horizontally arranged at the portions of the product portion 4 separated by the break grooves 2 and 3. It is installed. If the product portion 4 and the dummy portion 5 have the same groove depth as in the prior art, the ceramic substrate 1 is easily broken when the electrodes 10 and 11 are formed or when the element 12 is mounted. Since the groove depth of the portion 5 is shallow, the strength of the dummy portion 5 is high, and cracking of the ceramic substrate 1 can be prevented. In addition, since the groove depth of the product part 4 is large, the shock applied to the element 12 and the cap 15 when dividing into individual electronic components is small, and the occurrence rate of defective products can be reduced.

The electronic component element in the present invention is not limited to the oscillator element 12 shown in FIG. 6, but may be, for example, a capacitor element or a resistance element, or a combination of a plurality of elements. Is also good.

FIG. 7 shows a second embodiment of the ceramic substrate according to the present invention. Of the break grooves 2 and 3 formed in the ceramic substrate 1 ', the outermost break grooves 2a and 3
The groove portion corresponding to the product part 4 including a is processed into a deep groove having a width of, for example, 100 μm and a depth of 220 μm, as shown by a thick line in FIG. The portion corresponding to the dummy portion 5a on one side is also processed into a similar deep groove. The groove portions corresponding to the remaining three sides of the dummy portions 5b to 5d have a width of, for example, 100 μm and a depth of 18 as indicated by thin lines in FIG.
It is processed into a shallow groove of 0 μm.

In the case of this embodiment, one side of the dummy portion 5
Is deep, and the break grooves of the dummy portions 5 on the remaining three sides are shallow, so that the peripheral portion of the ceramic substrate 1 'has higher strength than the central portion. Therefore, as in the first embodiment, the rigidity of the entire ceramic substrate 1 'is increased, and it is possible to prevent the ceramic substrate 1' from breaking when mounting electronic components, printing electrodes, or transporting.

FIG. 8 shows a method of breaking the ceramic substrate 1 'of the above embodiment. That is, the chuck H chucks one end side of the ceramic substrate 1, in particular, the end of the shallow dummy portion 5 c facing the deep groove dummy portion 5 a by about one piece, and the chuck I chucks the adjacent about one piece by the chuck I. The primary break is performed by chucking and rotating the chuck H in the direction of the arrow. At this time, cracks first occur in the chucked part,
This crack runs along the longitudinal break groove 2 toward the other end (in the direction of arrow Y). Since the crack terminates at the dummy portion 5a having a deep groove, the crack does not deviate in the oblique direction at the terminal portion, and a clean break can be performed to the end.

Similarly, by making a primary break along the longitudinal break groove 2, a strip-shaped ceramic substrate 1a can be obtained. The method of secondary breaking the strip-shaped ceramic substrate 1a is the same as that of FIG.

In the above-described breaking method, the same chucks H and I can be used for the primary break and the secondary break, and there is no need to chuck a plurality of substrates at the same time.
The chuck device can be downsized. In addition, there is a characteristic that a broken surface is made beautiful because a break is caused by running a crack.

The present invention is not limited to the above embodiment, and it goes without saying that various modifications are possible. For example, in the embodiment, the deep break groove is provided halfway in the dummy portion, but a boundary portion between the product portion and the dummy portion, that is, the outermost break groove may be an end of the deep break groove. Further, among the product parts provided with the deep break grooves, the intersections of the vertical and horizontal break grooves may be further deepened.

[0029]

As is apparent from the above description, according to the present invention, as compared with the break groove for partitioning the product part and the outermost break groove for partitioning between the product part and the dummy part,
Since the break groove extending from the outermost break groove to the dummy part is made shallow, the strength of the peripheral part of the ceramic substrate is high,
The ceramic substrate can be prevented from cracking during mounting, printing, transportation, and the like. Since the groove of the dummy portion is shallow, burrs or chipping may occur in the dummy portion at the time of a break. However, since the dummy portion is a portion to be discarded, there is no problem. In addition, since the vertical and horizontal break grooves may be formed continuously from the product portion to the peripheral portion across the dummy portion, there is no need to terminate the dummy portion in the middle, and it is not necessary to form an inclined break groove or the like. So the groove processing is easy,
Manufacturing costs can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of an example of a ceramic substrate with a break groove according to the present invention.

FIG. 2 is an enlarged sectional view taken along line XX of FIG.

FIG. 3 is a perspective view of a ceramic substrate during a primary break.

FIG. 4 is a perspective view of the ceramic substrate during a secondary break.

FIG. 5 is an explanatory view of another embodiment showing a method of breaking a ceramic substrate.

FIG. 6 is an exploded perspective view of an example of a surface-mounted electronic component obtained from the ceramic substrate of the present invention.

FIG. 7 is a perspective view of a ceramic substrate with a break groove according to a second embodiment of the present invention.

FIG. 8 is a perspective view showing a method of breaking the ceramic substrate of FIG. 7;

[Description of Signs] 1 Ceramic substrate 2, 3 Break groove 4 Product part 5 Dummy part 6 Substrate

Claims (3)

[Claims] 1. A ceramic substrate in which break grooves are formed longitudinally and laterally on the surface, and divided along the ceramic substrate by breaking along the break grooves, a dummy portion is provided at a peripheral portion, and a product portion is provided inside the dummy portion. The vertical and horizontal break grooves are formed continuously from the product section to the dummy section, and compared to the break groove that partitions the product section and the outermost break groove that partitions between the product section and the dummy section, A ceramic substrate with a break groove, wherein a break groove extending from the outermost break groove to the dummy portion is formed shallow. 2. The ceramic substrate according to claim 1, wherein, among the break grooves extending from the outermost break groove to the dummy portion, the break groove extending to one side of the dummy portion has a depth equivalent to the break groove defining the product portion. The break groove formed on the substrate and extending to the remaining three sides of the dummy portion is formed shallower than the break groove defining the product portion. 3. The product part of the ceramic substrate according to claim 1, wherein electronic component elements are respectively mounted on portions partitioned by vertical and horizontal break grooves, and the ceramic substrate is mounted along the vertical and horizontal break grooves. An electronic component characterized by being divided individually by breaking.