JP2013207065A - Ceramic substrate manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve a manufacturing method using a multiple substrate which is easy to be divided into substrate units while ensuring appropriate mechanical strength when forming ceramic substrates by dividing the multiple substrate which is composed of ceramic and in which division grooves are preliminarily formed into individual substrate units along the division grooves.SOLUTION: A ceramic substrate manufacturing method comprises: forming on one surface 11 side of a multiple substrate 10, linear division grooves 21 continuously extending from one end 10a to another end 10b of the multiple substrate 10; depressing and bending parts on another surface 12 of the multiple substrate 10 on the one end 10a side of the multiple substrate 10 corresponding to the division grooves 21 by a jig to create cracks in the division grooves 21 on the one end 10a side; and dividing the multiple substrate 10 into individual substrate units by causing the cracks to extend along the division grooves to the other end 10b. In this case, the division groove 21 is formed in such a manner that a groove depth is deeper on the one end 10a side than on a center side of the multiple substrate 10.

Description

  The present invention relates to a method for manufacturing a ceramic substrate, in which a multiple substrate made of ceramics in which division grooves are formed in advance is divided into individual substrate units along the division grooves.

  In general, in this type of method for manufacturing a ceramic substrate, first, a multiple substrate in which a plurality of ceramic substrates are integrally connected is prepared. And the linear division | segmentation groove | channel extended continuously from one edge part of the said multiple substrate to the other edge part is provided in the one surface side of the multiple substrate.

  Next, on one end portion side of the multiple substrate, a portion corresponding to the division groove on the other surface opposite to the division groove of the multiple substrate is pushed and bent with a jig such as a pin. Specifically, by performing three-point bending, a crack is generated in the split groove on one end side of the multiple substrate, and the crack progresses to the other end of the multiple substrate along the split groove. Let As a result, by dividing the multiple substrate into individual substrate units, individualized ceramic substrates are completed.

  Here, in the multiple substrate, it is necessary to satisfy both the cracking property (that is, the ease of cracking) in the dividing step and the cracking resistance (that is, the resistance to cracking) in the other steps before the dividing. Conventionally, as a method for realizing the cracking property in the dividing step, a method of forming dividing grooves on both the front and back surfaces of the multiple substrate has been proposed.

JP 2011-93799 A

  However, in the dividing method of the above-mentioned Patent Document 1, since the dividing grooves are provided on both the front and back surfaces of the multiple substrate, the cracking property in the dividing step is improved, but the mechanical strength of the multiple substrate tends to be reduced. There arises a problem that it is difficult to simultaneously achieve crack resistance in other previous steps.

  In addition, simply pursuing easy cracking results in deeper dividing grooves, the mechanical strength of the multiple substrate decreases, and the multiple substrate easily breaks during handling before division. On the other hand, if the difficulty of cracking at the time of handling is pursued, the dividing groove is made shallow, and the mechanical strength of the multiple substrate becomes large, and it becomes difficult to break at the time of dividing.

  The present invention has been made in view of the above problems, and a ceramic substrate is formed by dividing a multiple substrate made of ceramics in which division grooves are formed in advance into individual substrate units along the division grooves. An object of the present invention is to realize a manufacturing method using a multiple substrate that can be easily divided into substrate units while appropriately ensuring the mechanical strength of the multiple substrate.

  In order to achieve the above object, according to the first aspect of the present invention, a preparation step of preparing a multiple substrate (10) in which a plurality of ceramic substrates (1) are integrally connected, and at least one surface of the multiple substrate ( 11) a groove forming step of providing a linear dividing groove (21, 22) continuously extending from one end (10a, 10c) to the other end (10b, 10d) of the multiple substrate; On one end side of the multiple substrate, the portion corresponding to the division groove on the other surface (12) opposite to the division groove of the multiple substrate is pushed and bent by the jig (120), and the one A splitting step for splitting the multiple substrate into individual substrate units by generating a crack in the split groove on the end side and advancing the crack to the other end of the multiple substrate along the split groove; In the groove forming step, as one of the divided grooves, one end of the multiple substrate Towards the side from the center side, a manufacturing method of a ceramic substrate and forming what groove depth becomes deeper is provided.

  Here, in the dividing step, a crack is generated from one end of the multiple substrate as a starting point for the dividing groove, and this crack is advanced from the center of the multiple substrate to the other end that is the end point. As a result, the multiple substrates are divided. In this case, the force applied to the multiple substrate is maximum when a crack is generated, and the subsequent progress of the crack may be smaller than that when the crack is generated.

  Therefore, in the manufacturing method of the present invention, by increasing the groove depth and reducing the substrate thickness on one end side of the multiple substrate that is the starting point of crack generation in the divided grooves, the multiple substrate is obtained. The mechanical strength of the steel is weakened and cracks are easily generated.

  Here, on the central side of the multiple substrate, the mechanical strength of the multiple substrate is increased compared to the one end side by increasing the substrate thickness by reducing the groove depth. If a crack occurs, the crack progresses with a smaller force than that at the time of crack occurrence, so that the multiple substrate is appropriately divided.

  Also, by reducing the groove depth on the center side of the multiple substrate and increasing the substrate thickness, the mechanical strength of the entire multiple substrate can be secured, so that the multiple substrate can be prevented from cracking during handling. Can do.

  Therefore, according to the present invention, when a ceramic substrate is formed by dividing a multiple substrate made of ceramic, in which division grooves are formed in advance, into individual substrate units along the division grooves, It is possible to realize a manufacturing method using a multiple substrate that can be easily divided into substrate units while ensuring the mechanical strength of the substrate.

  Further, in the invention according to claim 2, in the method for manufacturing a ceramic substrate according to claim 1, in the groove forming step, as one of the divided grooves, one end side of the multiple substrate is more than the center side. It is characterized in that a groove having a deeper groove depth and a groove depth deeper on the other end side than on the central side is formed.

  According to this, since the other end portion side of the multiple substrate, which is the end point of the substrate division in the dividing groove, is also easily broken, there is an advantage that burrs are hardly generated at the other end portion after the division. is there.

Further, as in the third aspect of the present invention, the multiple substrate has a quadrangular plate shape, and in the groove forming step, the dividing groove is parallel to the first side (13) of the multiple substrate. A plurality of first grooves (21) arranged in a stripe shape extending from one end (10a) to the other end (10b) of the multiple substrate, and the multiple substrate orthogonal to the first side A plurality of second grooves (22) arranged in a stripe shape extending in parallel with the second side (14) from one end (10c) of the multiple substrate to the other end (10d). In the dividing step, the multiple substrate is formed along the first groove from one end (10a) to the other end (10b) of the multiple substrate. To form an elongated plate-like first divided portion (15), and then the first divided portion is separated along the second groove. If one intends to split the substrate unit,
In the groove forming step, it is preferable that the first groove as the divided groove is formed such that the groove depth is deeper on one end side of the multiple substrate than on the center side.

  This is because the first groove as the dividing groove and the second groove orthogonal to the first groove are divided into the first groove having a long dividing length by being divided first. This is because, by adopting a configuration in which the groove depth is changed, it is possible to appropriately realize a multiple substrate that can be easily divided into substrate units while ensuring adequate mechanical strength.

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

It is a figure which shows the preparation process and groove | channel formation process in the manufacturing method of the ceramic substrate concerning 1st Embodiment of this invention, (a) is a schematic plan view of a multiple substrate, (b) is the dashed-dotted line in (a). It is a schematic sectional drawing of the multiple substrate along AA. It is a schematic sectional drawing which shows the division | segmentation process in the manufacturing method of the ceramic substrate concerning the said 1st Embodiment. It is a schematic plan view which shows the middle state of the division | segmentation of the multiple substrate in the above-mentioned division | segmentation process. FIG. 4 is a schematic plan view showing a halfway state of division of the multiple substrate following FIG. 3. FIG. 5 is a schematic plan view showing a halfway state of division of the multiple substrate following FIG. 4. It is a schematic sectional drawing which shows the 1st example of the division | segmentation groove | channel of the multiple substrate concerning 2nd Embodiment of this invention. It is a schematic sectional drawing which shows the 2nd example of the division | segmentation groove | channel of the multiple substrate concerning the said 2nd Embodiment. It is a schematic sectional drawing which shows the 3rd example of the division | segmentation groove | channel of the multiple substrate concerning the said 2nd Embodiment. It is a schematic sectional drawing which shows the 4th example of the division | segmentation groove | channel of the multiple substrate concerning the said 2nd Embodiment. It is a schematic sectional drawing which shows the 5th example of the division | segmentation groove | channel of the multiple substrate concerning the said 2nd Embodiment. It is a schematic sectional drawing which shows the 6th example of the division | segmentation groove | channel of the multiple substrate concerning the said 2nd Embodiment. It is a schematic plan view of the multiple substrate concerning 3rd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
A method for manufacturing a ceramic substrate according to the first embodiment of the present invention will be described with reference to FIGS.

  In the manufacturing method of the ceramic substrate 1 of the present embodiment, as shown in FIG. 1, first, as a preparation step, a multiple substrate as a multiple substrate ceramic substrate 1 in which a plurality of ceramic substrates 1 are integrally connected. 10 is prepared.

  The multiple substrate 10 is a substrate made of ceramic that is configured as a plate surface in which one surface 11 and the other surface 12 are in a front-back relationship, and is made of, for example, alumina. Here, the multiple substrate 10 may be a single layer substrate or a multilayer substrate, may be in the form of a ceramic green sheet, or may be obtained by firing the green sheet. That is, the ceramic substrate 1 that is finally divided and formed may be a single-layer wiring substrate or a multilayer wiring substrate.

  Here, the multiple substrate 10 has a rectangular plate shape. In FIG. 1, among the four sides of the quadrangle constituting the planar shape of the multiple substrate 10, the direction parallel to the first side 13 is the y direction, and the second side 14 orthogonal to the first side 13. The direction parallel to is the x direction.

  Here, the multiple substrate 10 after the division grooves 21 and 22 is formed is shown. However, each ceramic substrate 1 is formed in each rectangular region defined by the division grooves 21 and 22 in FIG. It is equivalent. That is, here, a plurality of rectangular ceramic substrates 1 connected in a lattice form to be integrated constitute a multiple substrate 10.

  Next, as shown in FIG. 1, the divided grooves 21 and 22 are formed on the one surface 11 side of the prepared multiple substrate 10 by a groove forming step. Here, when the prepared multiple substrate 10 is in a green sheet state, the dividing grooves 21 and 22 are formed by pressing, and when the substrate is after firing, the dividing grooves 21 and 22 are formed by laser irradiation or the like. 22 is formed.

  The dividing grooves 21 and 22 are used to divide the multiple substrate 10 into individual substrate units, that is, one ceramic substrate 1 at a time. One of the finally divided ceramic substrates 1 corresponds to one of the lattice regions defined by the dividing grooves 21 and 22, and is a planar rectangular substrate.

  The divided grooves 21 and 22 are linear grooves that continuously extend from one end 10a or 10c of the multiple substrate 10 to the other end 10b or 10d on the opposite side. Here, the cross-sectional shape in the direction orthogonal to the longitudinal direction of the dividing grooves 21 and 22 can be various groove shapes such as a V shape, a U shape, or a rectangular shape.

  Here, the dividing grooves 21 and 22 are formed such that a plurality of stripe-shaped first grooves 21 and a plurality of stripe-shaped second grooves 22 are orthogonal to each other on one surface 11 of the multiple substrate 10. Assume that they are arranged in a grid.

  Specifically, each first groove 21 is a linear groove extending from one end portion 10a of the multiple substrate 10 to the other end portion 10b in parallel with the first side 13 of the multiple substrate 10. It is. That is, the 1st groove | channel 21 is a groove | channel extended between the both ends 10a and 10b of the multiple substrate 10 along the said y direction in parallel with the y direction in FIG. Then, both ends of the first groove 21 in the longitudinal direction are portions located at one end portion 10a of the multiple substrate 10 as they are and portions located at the other end portion 10b.

  Each of the second grooves 22 extends from one end 10c of the multiple substrate 10 to the other end 10d in parallel to the second side 14 of the multiple substrate 10 orthogonal to the first side 13. It is a straight groove. In other words, the second groove 21 is a groove extending between both ends 10c and 10d of the multiple substrate 10 along the x direction in parallel with the x direction in FIG. Then, both ends of the second groove 22 in the longitudinal direction are portions located at one end portion 10c of the multiple substrate 10 as they are and portions located at the other end portion 10d.

  Here, in the groove forming step of the present embodiment, as the first groove 21 among the divided grooves 21 and 22, the groove depth is greater on the one end 10 a side in the multiple substrate 10 than on the center side. Form what became. As will be described later, in the present manufacturing method, the multiple substrate 10 is first divided along the first groove 21, and then this substrate is divided through the second groove 22 to be divided into individual substrate units. Like to do.

  Therefore, in the present embodiment, the groove depth is set as described above with respect to the first groove 21 which is divided first and has the longer division distance among the first groove 21 and the second groove 22. Groove formation is performed so as to obtain a partially changed configuration. On the other hand, in the groove forming process of the present embodiment, the second groove 22 is formed so that the groove depth is uniform as a whole as in the normal case.

  Specifically, as shown in FIG. 1, in the first groove 21, one end portion 10 a that is a portion that is pushed and bent by a jig 120 (see FIG. 2) described later in the multiple substrate 10. The side is formed on the assumption that the groove depth is deeper than the central side of the multiple substrate 10.

  Further, as shown in FIG. 1B, in the groove forming process of the present embodiment, the first groove 21 is further formed on the other end 10b side of the multiple substrate 10 on the multiple substrate 10 side. The groove depth is deeper than that at the center.

  Here, the first groove 21 has a relatively shallow uniform groove depth in the central portion of the multiple substrate 10, and the groove depth increases linearly from the central portion toward both end portions 10 a and 10 b. The shape is going to be. That is, the thickness of the substrate by the first groove 21 is changed to a trapezoid.

  The first groove 21 having a configuration in which the groove depth is partially changed is formed by pressing the shape of the press die corresponding to the first groove 21 when the groove is formed by pressing, for example. Can be formed. Further, the first groove 21 can be formed by changing the depth of digging by laser when the groove is formed by laser irradiation.

  Thus, the multiple substrate 10 in which the divided grooves 21 and 22 are formed on the one surface 11 is completed by the groove forming step of the present embodiment. Next, a dividing step for dividing the multiple substrate 10 into individual substrate units is performed. This dividing step will be described with reference to FIGS.

  In the present dividing step, as described above, after dividing along the first groove 21, dividing along the second groove 22 is performed. Specifically, along the first groove 21, the multiple substrate 10 is divided from one end 10 a to the other end 10 b of the multiple substrate 10 to form an elongated plate-like first divided portion 15. (See FIGS. 3 and 4), and thereafter, the first dividing portion 15 is divided into individual substrate units along the second grooves 22 (see FIG. 5).

  In this dividing step, as shown in FIG. 2, a jig 120 made of a rod-like push pin or the like is used. Then, the multiple substrate 10 is split at the split grooves 21 and 22 by the stress and strain applied to the split grooves 21 and 22 by the jig 120 to perform the splitting.

  That is, with each of the divided grooves 21 and 22, the bending stress generated on the starting point side starts from one end portion 10 a or 10 c that is pushed and bent by the jig 120 and the other end portion 10 b or 10 d opposite to the end portion 10 a or 10 c. Generate cracks. Then, the cracks are divided by proceeding along the dividing grooves 21 and 22 toward the end point side.

  Specifically, as shown in FIG. 2, the multiple substrate 10 before division is mounted in a state where it is pressed by a pressing member 110 on a support base 100. Then, the multiple substrate 10 is pressed and fixed by the pressing member 110 from the one surface 11 side of the multiple substrate 10. The pressing member 110 is made of, for example, resin or rubber so as not to damage the multiple substrate 10.

  And in this division | segmentation process, in the state which fixed the multiple substrate 10 with the pressing member 110 in this way, as shown in FIG. A portion corresponding to the first groove 21 on the other surface 12 is pushed and bent by the jig 120.

  Here, the jig 120 is attached to the support base 100, and a tip portion is pushed up onto the support base 100 by an actuator (not shown) so as to push the other surface 12 side of the multiple substrate 10.

  The tip of the jig 120 has a preferable shape for applying a load to the dividing grooves 21 and 22 of the multiple substrate 10, such as a spherical shape, a conical shape, and a mountain shape. The material of the jig 120 may be resin or the like, but the tip of the jig 120 is made of an elastic body such as rubber, so that damage to the multiple substrate 10 can be suppressed.

  In this manner, the multiple substrate 10 is brought into a three-point bending state by the holding member 110 and the jig 120. Thereby, first, a crack is generated in the first groove 21 on the one end portion 10 a side of the multiple substrate 10, and the other end portion 10 b of the multiple substrate 10 is formed along the first groove 21. To make progress. Then, as shown in FIGS. 3 and 4, this operation is performed on all the first grooves 21, thereby forming the first divided portion 15 having an elongated plate shape.

  Thereafter, in the present dividing step, as shown in FIG. 5, the first dividing portion 15 is divided along the second groove 22 into individual substrate units. Specifically, by adopting a method using the same jig 120 as the method shown in FIG. 2 for the second groove 21 in each first divided portion 15, the second groove 22 is interposed through the second groove 22. Split.

  As a result, in the second groove 22 of each first divided portion 15, a crack is generated on the start point side with one end portion pushed and bent by the jig 120 as the start point and the other end portion as the end point. Dividing is done by advancing cracks. Thereby, as shown in FIG. 5, the multiple substrate 10 is divided into individual substrate units. The steps up to here are the dividing step of the present embodiment, and the separated ceramic substrate 1 is completed with the end of the dividing step.

  As described above, in the manufacturing method of the present embodiment, a preparation step of preparing the multiple substrate 10, a groove forming step of providing the linear division grooves 21 and 22 on the one surface 11 side of the multiple substrate 10, the division grooves 21, The dividing step of dividing the multiple substrate 10 into individual substrate units along 22 is sequentially performed. In this embodiment, first, the multiple substrate 10 is divided via the first groove 21, and then the divided first divided portion 15 is divided via the second groove 22. It is carried out.

  For this reason, when realizing the multiple substrate 10 that is easily divided into substrate units while appropriately securing the mechanical strength of the multiple substrate 10, the first division that has the longer division length is performed first. The groove 21 needs to be both hard to break and easy to break.

  On the other hand, in the subdivided first division portion 15, the division length via the second groove 22 is significantly shorter than that of the first groove 21. About the groove | channel 22, what is necessary is just the groove depth which gave priority to ensuring of the said mechanical strength.

  Therefore, in the groove forming step of the present embodiment, the first groove 21 is formed such that one end 10a side of the multiple substrate 10 is deeper than the center side. Therefore, both the difficulty of cracking and the ease of cracking are achieved.

  As described above, in the dividing step, first, a crack is generated in the first groove 21 from one end portion 10a of the multiple substrate 10 as a starting point, and this crack is started from the center of the multiple substrate 10 to the end point. To the other end 10b. Thereby, the multiple substrate 10 is divided via the first groove 21. In this case, the force applied to the multiple substrate 10 is maximum when the crack is generated, and the subsequent progress of the crack may be smaller than that when the crack is generated.

  Therefore, in the manufacturing method of the present embodiment, the groove depth is increased and the substrate thickness is reduced on the one end portion 10a side of the multiple substrate 10 that is the starting point of crack generation in the first groove 21. Thus, the mechanical strength of the multiple substrate 10 is weakened and cracks are easily generated.

  In other words, the bending strength on the one end 10a side is reduced by reducing the remaining thickness on the one end 10a side that becomes the division starting point of the first groove 21 in the multiple substrate 10. Therefore, when a bending moment is applied to the first groove 21 on the one end portion 10a side, a crack is easily generated on the one end portion 10a side, and the splitting property is improved.

  Here, on the central side of the multiple substrate 10, the depth of the first groove 21 is reduced to increase the substrate thickness, so that the mechanical property of the multiple substrate 10 is increased as compared with the one end 10 a side. Although the strength is increased, once a crack is generated, the crack progresses with a smaller force than when the crack is generated, so that the multiple substrate 10 is appropriately divided.

  Further, by reducing the depth of the first groove 21 on the center side of the multiple substrate 10 and increasing the substrate thickness, the mechanical strength of the entire multiple substrate 10 can be secured. It is possible to prevent the multiple substrate 10 from cracking during the handling of the process.

  In other words, by increasing the remaining thickness of the multiple substrate 10 other than the division starting point of the first groove 21, the bending strength of the entire first groove 21 is increased. It is possible to prevent the occurrence of unintended division as much as possible when a bending moment is applied to the entire first groove 21.

  Therefore, according to the present embodiment, the multiple substrate 10 made of ceramic in which the division grooves 21 and 22 are formed in advance is divided into individual substrate units along the division grooves 21 and 22, thereby providing a ceramic substrate. In forming 1, it is possible to realize a manufacturing method using the multiple substrate 10 that can be easily divided into substrate units while appropriately securing the mechanical strength of the multiple substrate 10.

  Further, as described above, in the groove forming step of the present embodiment, the groove depth of the first groove 21 as the dividing groove is larger on the one end 10a side in the multiple substrate 10 than on the center side. In addition to being deeper, the groove is formed on the other end portion 10b side to be deeper than the center side.

  According to this, since the other end portion 10b of the multiple substrate 10 which is the end point of the substrate division in the first groove 21 is easily broken, burrs are hardly generated in the other end portion 10b after the division. There is an advantage of becoming. In addition, a burr | flash is a part which the division part protrudes compared with the target shape after a division | segmentation, or becomes a thing missing.

(Second Embodiment)
In the second embodiment of the present invention, as shown in FIGS. 6 to 11, the groove depth is greater on the one end 10 a side of the multiple substrate 10 than on the center side of the divided grooves. The variation of the 1st groove | channel 21 formed as a thing is provided. 6 to 11, the second groove 22 is the same as that shown in FIG.

  In the first example of the present embodiment shown in FIG. 6, the first groove 21 has the shallowest part at the center of the multiple substrate 10 as the apex, and the groove depth from the apex toward both ends 10a and 10b. It is assumed that the shape becomes deeper in a straight line. That is, the thickness of the substrate by the first groove 21 is changed to a triangular shape.

  In the second example of the present embodiment shown in FIG. 7, the first groove 21 has the shallowest part at the center of the multiple substrate 10 as the top, and the groove depth from the apex toward both ends 10a and 10b. The bottom of the first groove 21 forms a convex curved surface so that the depth becomes deeper. In other words, the substrate thickness by the first groove 21 is changed to an arc shape.

  In the third example of the present embodiment shown in FIG. 8, the first groove 21 has the shallowest portion at the center of the multiple substrate 10, and the first groove 21 does not have a step from the vertex toward the both end portions 10 a and 10 b. The shape is such that the groove depth increases continuously. That is, the thickness of the substrate by the first groove 21 is changed stepwise.

  In the fourth example of the present embodiment shown in FIG. 9, in the first groove 21, one end 10a side which is a portion of the multiple substrate 10 that is pushed and bent by a jig 120 described later. However, the groove depth is deeper than that of the center side of the multiple substrate 10. Even in this case, it is needless to say that a manufacturing method using the multiple substrate 10 that can be easily divided into substrate units can be realized while appropriately securing the mechanical strength of the multiple substrate 10. The first grooves 21 in the first to fourth examples can be formed by pressing, laser irradiation, or the like.

  In the fifth example of the present embodiment shown in FIG. 10, the thickness of the multiple substrate 10 at both ends of the first groove 21, that is, at both end portions 10 a and 10 b of the multiple substrate 10 in the first groove 21. A notch 16 penetrating in the vertical direction is provided. Such a notch 16 can be formed by pressing or laser irradiation in the groove forming step.

  This notch 16 makes it easy for cracks to occur at one end 10a of the multiple substrate 10 during division via the first groove 21, and at the other end 10b of the multiple substrate 10. Burrs are less likely to occur. Note that the notch 16 may be provided only at one end of the first groove 21. Furthermore, this notch 16 can of course be combined with the above examples.

  In the sixth example of this embodiment shown in FIG. 11, the third groove 17 is formed as a dividing groove on the other surface 12 side in a portion corresponding to the first groove 21 on the other surface 12 of the multiple substrate 10. Shall be provided. Such a third groove 17 can be formed by pressing or laser irradiation in the groove forming step.

  The third groove 17 is a sub-divided groove mainly using the first groove 21 on the one surface 11 side of the multiple substrate 10, and has a function of promoting the progress of cracks in the thickness direction of the multiple substrate 10. Demonstrate. Of course, the third groove 17 can be combined with each of the above examples. Further, the third groove 17 may be provided for the second groove 22 as long as the mechanical strength of the multiple substrate 10 is ensured.

(Third embodiment)
In the third embodiment of the present invention, the multiple substrate 10 prepared by the above preparation process is partially deformed, and this deformed portion will be mainly described with reference to FIG. As shown in FIG. 12, in the preparation process of this embodiment, a dummy portion 30 that protects the outer portion of the multiple substrate 10 is prepared around the outer periphery of the multiple substrate 10.

  Here, the dummy portion 30 has a frame shape that is slightly larger than the multiple substrate 10 in correspondence with the outline shape of the quadrilateral multiple substrate 10. The dummy portion 30 is provided by extending the outer periphery of the multiple substrate 10 and is made of a ceramic made of the same material as the multiple substrate 10. However, in this case, the multiple substrate 10 does not include the dummy portion 30, and the inner peripheral portion of the dummy portion 30 is of course the multiple substrate 10.

  As shown in FIG. 12, a dummy dividing groove 31 for dividing the dummy portion 30 is provided between the dummy portion 30 and the outer portion of the multiple substrate 10. The dummy dividing grooves 31 are formed by pressing or laser irradiation together with the dividing grooves 21 and 22 of the multiple substrate 10 in the groove forming step.

  Prior to the division of the multiple substrate 10, other processes such as printing solder on the multiple substrate 10 are performed. In this case, in handling the multiple substrate 10 in another process before the division, the multiple substrate 10 comes into contact with a jig or a hand through the dummy portion 30. The part which becomes the end is protected.

  And after dividing the dummy part 30 from the multiple substrate 10 via this dummy dividing groove 31, the multiple substrate 10 is subjected to a dividing step. Here, the division of the dummy portion 30 via the dummy dividing groove 31 is performed by performing three-point bending with the jig 120 in the same manner as the dividing of the multiple substrate 10 by the dividing grooves 21 and 22.

  The dummy dividing groove 31 may have a uniform groove depth as a whole, or may have a shape in which the groove depth is changed in the same manner as the first groove 21 of the multiple substrate 10. Also in this case, in the division of the dummy portion 30 via the dummy dividing groove 31, the effect of easy cracking as in the case of the first groove 21 is exhibited. Further, in handling through the dummy part 30, it is expected that the mechanical strength of the multiple substrate 10 including the dummy part 30 is ensured.

  Further, in the present embodiment, since the dummy portion 30 is further provided outside the multiple substrate 10, it is needless to say that any combination of the first embodiment and the second embodiment is possible.

(Other embodiments)
In each of the above embodiments, the first groove 21 and the second groove 22 orthogonal to each other are divided first through the first groove 21, and then divided through the second groove 22. Although it performed, the division | segmentation via the 2nd groove | channel 22 may be performed previously in the reverse order, and the division | segmentation via the 1st groove | channel 21 may be performed after that.

  In this case, in the dividing step, first, the jig 120 is pressed against the other surface 12 of the multiple substrate 10 on one end portion 10c side of the end portions 10c and 10d separated in the x direction in the multiple substrate 10. Then, a crack may be generated in the second groove 22 and the crack may be advanced along the second groove 22 to the other end 10d.

  In this case, in the groove forming step, the second groove 22 is formed so that the second groove 22 has a structure in which the groove depth is partially changed, similar to the first groove 21. I do. That is, in the second groove 22, the groove depth of the multiple substrate 10 on the one end 10 c side, which is a portion that is pushed and bent by the jig 120, is larger than the central side of the multiple substrate 10. It is formed as a deepening.

  Here, in this case, the second groove 22 may be formed so that the groove depth is deeper at the other end 10d side of the multiple substrate 10 than at the center side. Of course, each form shown in the second embodiment may be applied. In this case, the first groove 21 may be formed so that the groove depth is uniform as a whole as in the normal case.

  Furthermore, in the groove forming step, for both the first groove 21 and the second groove 22, the one end portions 10 a, 10 c which are the division starting points in the multiple substrate 10 are closer to the multiple substrate 10. The groove may be formed so that the groove depth is deeper than the center side.

  According to this, not only when dividing from the first groove 21, but also when dividing from the second groove 22 on the contrary, the mechanical strength of the multiple substrate 10 is increased as described above. The multiple substrate 10 that can be easily divided into substrate units can be obtained while being appropriately secured.

  That is, in this case, the above-described effect of realizing the manufacturing method using the multiple substrate 10 that is easy to divide without being dependent on the division order of the first groove 21 and the second groove 22 and is difficult to break except at the time of division. Can demonstrate.

  Also in this case, the groove depth of both the first groove 21 and the second groove 22 is deeper on the other end portion 10d side of the multiple substrate 10 than on the center side. Of course, it may be formed, and each form shown in the second embodiment may be applied.

  Further, in the sixth example of the second embodiment shown in FIG. 11, the third groove 17 provided in the portion corresponding to the first groove 21 on the other surface 12 of the multiple substrate 10 is also the above-mentioned Similarly to the first groove 21 and the second groove 22, the groove depth may be deeper on the other end 10 d side of the multiple substrate 10 than on the center side. In this case, when the division through the third groove 17 is performed, the pressing by the jig 120 may be performed on the one surface 11.

  Of course, the other embodiments described above can be combined with the third embodiment. Furthermore, in addition to the combination of the above-described embodiments, the above-described embodiments may be appropriately combined within a possible range.

DESCRIPTION OF SYMBOLS 1 Ceramic substrate 10 Multiple substrate 10a, 10c One end part 10b of a multiple substrate 10b, 10d The other end of a multiple substrate 11 One surface of a multiple substrate 12 The other surface of a multiple substrate 21 1st as a division | segmentation groove | channel Groove 22 Second groove 120 as a split groove 120 Jig

Claims (3)

A preparation step of preparing a multiple substrate (10) in which a plurality of ceramic substrates (1) are integrally connected;
Linear division grooves (21, 21) extending continuously from one end (10a, 10c) of the multiple substrate to the other end (10b, 10d) on at least one surface (11) side of the multiple substrate. 22) providing a groove;
At one end of the multiple substrate, by bending the portion corresponding to the division groove on the other surface (12) opposite to the division groove of the multiple substrate with a jig (120), Cracks are generated in the divided grooves on the one end side, and the multiple substrates are separated into individual substrates by advancing the cracks to the other end of the multiple substrates along the divided grooves. A dividing step of dividing into units,
In the groove forming step, the divided groove is formed such that one end side of the multiple substrate has a groove depth deeper than the center side. .   In the groove forming step, as the divided grooves, one end side of the multiple substrate has a deeper groove depth than the center side, and the other end side also from the center side. 2. The method of manufacturing a ceramic substrate according to claim 1, wherein a groove having a deep groove is formed. The multiple substrate is a rectangular plate,
In the groove forming step, the dividing groove is formed in a stripe shape extending from one end (10a) of the multiple substrate to the other end (10b) in parallel with the first side (13) of the multiple substrate. A plurality of first grooves (21) arranged on the first substrate and one end (10c) of the multiple substrate parallel to the second side (14) of the multiple substrate orthogonal to the first side. ) To the other end (10d), and a plurality of second grooves (22) arranged in a stripe shape to be formed in a lattice shape,
In the dividing step, along the first groove, the multiple substrate is divided from one end portion (10a) to the other end portion (10b) of the multiple substrate to form an elongated plate-shaped first. And dividing the first divided portion into individual substrate units along the second groove, and
In the groove forming step, the first groove as the divided groove is formed on the one side of the multiple substrate as having a groove depth deeper than the center side. A method for producing a ceramic substrate according to claim 1 or 2.

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