JP3386568B2 - Electronic component and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component and its manufacturing method.

[0002]

2. Description of the Related Art Conventionally, electronic parts as shown in FIGS. 8 to 10 have been known. 8 is a front view of a conventional electronic component, FIG. 9 is a side view of FIG. 8, and FIG. 10 is a bottom view of FIG. This conventional electronic component includes a main body A having an outer shape of a warhead,
A plurality of leads B derived from the bottom A1 of the main body A
And a first connecting rod C for connecting and fixing the tip of the lead B.
And a second connecting rod D, which is provided between the first connecting rod C and the main body A and connects the lead B, has a main structure.
The plurality of leads B derived from the main body A are shown in FIG.
Two leads B1 along two virtual straight lines I and J of 0,
B2, and both of the leads B1 in front view,
They are arranged so that B2 overlaps each other.

In the conventional manufacturing process of such a conventional electronic component, the first connecting rod C and the second connecting rod D are cut to separate the leads B from each other. In the case of separation in this way, first, as shown by the chain double-dashed line in FIG.
With the receiving blade E inserted between B and B2, the cutting blade F,
F is moved in the direction of arrow F2 in FIG. 9 to be cut. Specifically, the convex blade F1 formed on the cutting blade F is inserted into the concave blade E1 formed on the receiving blade E to separate the lead B from the first and second connecting rods C and D. .

Further, the thickness H of the receiving blade E is formed to be approximately the same width as the distance between the leads B1 and B2, and the cutting blade F is
Width W is formed to be approximately the same as the distance between the leads B1 and B1 or the distance between the leads B2 and B2.

[0005]

In the conventional electronic component, when cutting the first connecting portion C and the second connecting portion D, the leads B1 and B2 are arranged so as to overlap each other when viewed from the front. Therefore, the cutting edge E is inserted between the leads B1 and B2 for cutting, but if the cutting edge E is not inserted in this way, the lead B is in a cantilever state, and the cutting is performed at the time of cutting. There is a problem that bending occurs.
If the lead B is bent, there is a problem that the lead cannot be automatically inserted into the mounting hole of the printed circuit board when it is mounted on the printed circuit board or the like.

Due to such a problem, it is necessary to avoid lead bending as much as possible, and the receiving blade E is required to cut without lead bending. The thickness H of the receiving blade E is the lead. Due to the insertion between B1 and B2, there is a constraint that the distance between both leads B1 and B2 cannot exceed the distance between them, and since this distance is as small as several millimeters, the strength to withstand the force during cutting is secured. In order to do so, it is necessary to pay close attention to the material and shape, and there are large restrictions on the design. Especially when cutting, the receiving blade E
The stress concentrates at the concave blade E1 portion, but since this portion is concave, the strength is weak and the durability of the blade itself is reduced.

In addition, in the conventional electronic component, when the leads B1 and B2 or the first connecting portion C and the second connecting portion D are cut, there is no choice but to cut the leads B1 and B2 in a cantilever state. In some cases, the following problems occur. That is, as shown in FIG. 9, the receiving blade E has the first connecting rods C, C.
It is inserted from the bottom to the top in the drawing. At this time, the receiving blade E is fixed on the lower side. Then, the cutting blades F (F1, F1) are pressed from the left and right sides for cutting, but it is very difficult to press the left and right cutting blades at the same time and with the same force, and actually, it is slightly Due to the time lag and non-uniformity of the force, either the left or right force is applied to the receiving blade E, and the receiving blade E fixed in a cantilever shape bends. Such flexure adversely affects the cutting accuracy of the leads B1 and B2 to be cut, and if it is bad, a problem that cutting cannot be performed may occur. In order to avoid such a problem, the thickness H of the receiving blade E may be increased, but there is a disadvantage that it cannot be increased due to the above-mentioned restrictions.

Further, with the miniaturization of electronic parts, the pitch between leads has become a small interval of about several millimeters,
The above-mentioned problems are becoming more prominent. An object of the present invention is to provide an electronic component intended to solve the above problems, and further to provide a method for producing an electronic component in which bending of leads is less likely to occur.

[0009]

According to a first aspect of the present invention, there is provided an electronic component having a main body having at least one plane and a plurality of lead groups that are substantially orthogonal to the plane and are arranged in a line. The respective groups are arranged such that the alignment directions thereof are parallel to each other and face each other, and the individual leads of the arbitrary group are arranged so as not to overlap with the leads of the other groups in a front view.

According to a second aspect of the electronic component, the leads of each group in the first aspect are connected by connecting rods, and the connecting rods are arranged so as not to overlap other connecting rods in a front view. It is characterized by being. According to a third aspect of the present invention, in manufacturing the electronic component according to the first aspect, one of a receiving blade and a cutting blade having a width equal to or smaller than a space between the leads of the same group is inserted, and the insertion is performed. The blade is arranged on the back surface of the lead to be cut, while the other blade different from the inserted blade is arranged on the front surface of the lead, and the lead is cut by the receiving blade and the cutting blade.

[0011]

According to the electronic component of the first aspect, each group of a plurality of leads led out from the main body is arranged so as to be parallel and opposed to each other and the leads of each group do not overlap each other. Thus, it is not necessary to insert a cutting blade between the rows of groups, for example very closely spaced.
Therefore, it is possible to avoid lead bending and the like due to insufficient strength of the receiving blade.

Further, in the electronic component of claim 2, since the connecting rods of each of the groups do not overlap each other, when the connecting rods are cut, the receiving blade and the cutting blade are provided from the front and back of the connecting rods. Since it can be applied, it is possible to avoid lead bending when cutting the connecting rod. Further, according to the method of manufacturing an electronic component of claim 3, the blade is applied to one of the two blades which is inserted between adjacent leads and cut, and the other blade is applied to the lead to be cut. It becomes possible. That is, according to the invention of claim 3, since it is not necessary to insert the receiving blade from between the lead group and another group as described in the conventional example of the lead, cutting due to insufficient strength of the receiving blade. It is possible to reduce bending of the lead and improve cutting accuracy.

[0013]

EXAMPLES Examples of the present invention will be described below with reference to FIGS. 1 to 4 by taking a light emitting diode as an electronic component as an example, but the present invention is not limited to these examples. It is widely applicable to various electronic components such as ICs and sensors. 1 is a front view of a light emitting diode as an electronic component according to an embodiment of the present invention, FIG. 2 is a side view of the light emitting diode, FIG. 3 is a bottom view of the light emitting diode, and FIG. 4 is a view of the light emitting diode. It is a top view.

The light emitting diode includes a light emitting diode body 1 made of a transparent resin, and the light emitting diode 1
The main structure is the lead 5 which is a terminal derived from. In the present embodiment, the main body 1 is formed in a warhead shape as shown in the figure, but the present invention is not limited to this, and if the main body 1 has at least one flat surface, a tetrahedral shape, 6
The shape of the face piece can be arbitrarily selected.

The leads 5 ... 5 are led out from the main body 1 in two rows along the alternate long and short dash lines L, L shown in FIG. 3, and are arranged along the alternate long and short dash lines. The tips are respectively connected to the support leads 6 as connecting rods, and the leads 5 ... Of each group are shown in FIGS.
Are arranged so that they do not overlap with each other (see FIGS. 1 and 3). As described above, in the present embodiment, the plurality of leads 5 led out from the main body 1 are two groups along the two parallel one-dot chain lines L, L, but the present invention is not limited to this and each group is as described above. As long as the leads 5 ... 5 of each other are arranged so as not to overlap each other, for example, there may be three groups aligned in parallel along the three-dot chain line, four groups, and five groups. It can also be applied to

The support lead 6 and the main body 1 are connected by a tie bar 7 as another connecting rod for reinforcing the lead 6. The tie bar 7 is reinforced in order to prevent the problem that the leads 5 cannot be arranged at regular mounting positions when they are mounted on a printed circuit board or the like because the pitch between the leads 5 and 5 changes due to some external stress. It is a thing, not a mandatory thing. However, in the case of providing such a tie bar 7, if the tie bar 7 for each group of the flat plate leads 5 ... As will be described later, when cutting the tie bar 7, there is an advantage that a blade for cutting can enter the other tie bar 7 without being disturbed.

The lead 5 and the tie bar 7 are finally cut along two-dot chain lines S1 and S2 in FIG.
First, a method of cutting (S1) the flat plate lead 5 will be described. As described above, the leads 5 ··· 5 connected to one support lead 6 and the leads 5 ··· 5 connected to the other support lead 6 are arranged so as not to overlap with each other, and the leads 5 to be cut. The receiving blade 10 is inserted from between the leads 5 and 5 of another group different from the lead 5 while the cutting blade 11 is applied from the front surface corresponding to the back surface to the receiving blade 10 and the cutting blade 11 The lead 5 to be cut is cut with and.

Next, a method of cutting (S2) the tie bar 7 described above will be described with reference to FIGS. 5 and 6. As described above, the two tie bars 7, 7 are arranged so as not to overlap each other. The light emitting diode configured as described above is inserted into the concave blade portion 12B of the receiving blade 12 having a plurality of convex blade portions 12A protruding in a comb shape while the leads 5 are inserted into the convex blade portion 12A. 5 different leads from 5
.. Place 5 The leads 5 ... 5 in which the convex and concave portions 12A and 12B of the receiving blade 12 are parallel to each other
It is preferable that the undulation h is obtained by adding the thickness of the lead 5 to the space between the groups. If the undulations are set to such dimensions, the lead 5 of the other group can be brought into contact with the bottom of the concave blade portion 12B with the lead 5 placed on the convex blade portion 12A. 12, the light emitting diode is seated better, and the lead 5 can be cut with high accuracy.

As described above, the blade 12 for receiving the light emitting diode
After the installation, the convex blade portion 13A and the concave blade portion 13B have a comb tooth shape like the receiving blade 12, and at least the undulations of the convex blade portion 13A and the concave blade portion 13B are equal to or larger than the thickness of the lead 5. The cutting blade 13 thus prepared is arranged at the upper side in FIG. Furthermore, the concave blade portion 13B of the cutting blade 13 has the convex blade portion 12
The lead 5 arranged in A is vertically aligned so that it is inserted into the concave blade portion 13B, and the cutting blade 13 is received by the receiving blade 1
Press on 2 to cut tie bar 7. As in the conventional example described above, the free end side of the thin plate-shaped receiving blade is inserted from between the leads 5 and 5 and is perpendicular to the longitudinal direction of the receiving blade formed by this free end side and the other end (fixed end). Compared with the conventional method of pressing the cutting blade against the lead to be cut from the direction and cutting in a cantilever state, in this method, the convex blade portions 12A, 13A are moved in the protruding direction and the concave blade portions 12B, 13B are opposed to each other. Since it is inserted and cut, it does not cut in a cantilever state.

Subsequently, with respect to the other tie bar 7, the light emitting diode is inverted, a lead 5 of a group different from the lead 5 inserted in the concave blade portion 12B is inserted, and the same method as described above is repeatedly cut. . As described above, an example of the method of cutting the tie bar 7 has been shown, but the method is not limited to this, and it is possible to cut by another method. A modification of the method of cutting the tie bar 7 is shown in FIG.

Another method of cutting the tie bar 7 will be described with reference to FIG. In the drawing, 14 is a receiving blade, 15 is a cutting blade, and the receiving blade 14 has a convex portion 14A at its tip.
And the convex portion 14 is provided at the tip of the cutting blade 15.
A concave portion 15A having a shape dimension into which A is fitted is formed. Then, the leads 5 of the two groups arranged above and below
・ One-to-one for the tie bar 7 connecting each of the 5
The receiving blade 14 and the cutting blade 15 are arranged vertically so as to correspond to each other.

The protrusion size and the recess size of the convex portion 14A and the concave portion 15A are the thickness M of the lead 5 (see FIG. 2).
It is preferable that it is almost the same as. In this way, the tie bar 7 is sandwiched between the blades 14 and 15 and cut from the state where the blades 14 and 15 are arranged.

[Brief description of drawings]

FIG. 1 shows a front view of an embodiment in which the present invention is applied to a light emitting diode.

FIG. 2 is a side view of FIG.

FIG. 3 is a bottom view of FIG.

FIG. 4 is a plan view of FIG.

5 is a cross-sectional view of FIG.

FIG. 6 is a reference diagram illustrating a cutting method.

FIG. 7 is a reference diagram illustrating another cutting example of the cutting method of FIG.

FIG. 8 is a front view of a conventional electronic component.

9 is a side view of FIG.

10 is a bottom view in which the first and second connecting rods of FIG. 8 are cut.

[Explanation of symbols]

1 body 5 leads 6 Support lead 7 Thai bar 10, 12, 14 Receiving blade 11, 13, 15 cutting blades

Claims (3)

(57) [Claims] 1. A body having at least one flat surface,
A plurality of groups of leads that are substantially orthogonal to the plane and are arranged to be aligned in a row are provided, and the groups are arranged such that their alignment directions are parallel to each other and face each other, and the individual leads of the arbitrary group are arranged. Is arranged so that it does not overlap the leads of other groups when viewed from the front. 2. The electronic component according to claim 1, wherein the leads of each group are connected by a connecting rod, and the connecting rods are arranged so as not to overlap with each other in a front view. Characterize. 3. The electronic component according to claim 1 or 2,
In a method for manufacturing an electronic component that cuts with a pair of blades of a receiving blade or a cutting blade, from between the leads of each group, one of the receiving blade and the cutting blade having a width equal to or less than the interval between the leads is inserted, While the inserted blade is arranged on the back surface of the connecting portion to be cut, the other blade different from the inserted blade is arranged on the surface of the connecting portion, and the lead is cut by the receiving blade and the cutting blade. And