WO2021145219A1 - Board structure - Google Patents

Board structure Download PDF

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Publication number
WO2021145219A1
WO2021145219A1 PCT/JP2020/049172 JP2020049172W WO2021145219A1 WO 2021145219 A1 WO2021145219 A1 WO 2021145219A1 JP 2020049172 W JP2020049172 W JP 2020049172W WO 2021145219 A1 WO2021145219 A1 WO 2021145219A1
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WO
WIPO (PCT)
Prior art keywords
terminals
notch
bent
fuse element
substrate
Prior art date
Application number
PCT/JP2020/049172
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French (fr)
Japanese (ja)
Inventor
典子 岡本
小田　昭博
侑弥 松尾
龍弥 大道寺
竜馬 濱田
Original Assignee
住友電装株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 住友電装株式会社 filed Critical 住友電装株式会社
Publication of WO2021145219A1 publication Critical patent/WO2021145219A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/143—Electrical contacts; Fastening fusible members to such contacts
    • H01H85/147—Parallel-side contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the present disclosure relates to a substrate structure.
  • This application claims priority based on Japanese Application No. 2020-003762 filed on January 14, 2020, and incorporates all the contents described in the Japanese application.
  • Patent Document 1 in a circuit board in which a metal plate is partially bonded to an insulating substrate, a recess is provided in the metal plate, and a lead (terminal) of an element is bonded in the recess to form such a recess. It is disclosed that the thickness of the metal plate at the joint portion between the lead and the metal plate is suppressed to be small by the depth of the metal plate, and the thermal stress is reduced.
  • the substrate structure according to the embodiment of the present disclosure is a substrate structure having a pair of terminals projecting from one surface and having a fuse element connected to the substrate via the terminals, and the fuse element is a substrate structure. , At least one of the pair of terminals is connected in a bent state.
  • FIG. 10 is an arrow view taken along the line XI-XI of FIG.
  • Patent Document 1 When soldering by the reflow method using circuit parts with long terminals, it is difficult to hold the circuit parts during soldering, and stable soldering is difficult. However, in Patent Document 1, such a problem is not considered and cannot be solved.
  • the purpose is to provide a substrate structure that can be soldered by the reflow method and can increase productivity.
  • the substrate structure according to the embodiment of the present disclosure is a substrate structure having a pair of terminals projecting from one surface and having a fuse element connected to the substrate via the terminals.
  • the fuse element is connected in a state where at least one of the pair of terminals is bent.
  • At least one of the fuse elements is connected to the substrate in a bent state. Therefore, it is possible to cope with soldering by the reflow method and to secure a wide contact surface with the substrate.
  • the pair of terminals are arranged side by side and bent in opposite directions.
  • the pair of terminals are bent in opposite directions, they can stand on their own. Therefore, workability can be improved in the soldering process by the reflow method.
  • the bent terminals have two surfaces facing each other in a direction intersecting the bending direction, and the two surfaces at the base have a first notch. It is formed.
  • the first notch is formed at the base of the bent terminal. Therefore, it is possible to induce such bending of the terminal at the position of the base of each terminal.
  • the bent terminals have two surfaces facing each other in the bending direction, and the two surfaces at the base are formed with a second notch. There is.
  • the second notch is formed at the base of the bent terminal. Therefore, it is possible to induce such bending of the terminal at the position of the base of each terminal.
  • each of the pair of terminals has two surfaces facing each other in the bending direction, and one of the pair of terminals has the above 2 at the base.
  • a third notch is formed on one of the two surfaces, and the other of the pair of terminals is a fourth of the two surfaces at the base, which is opposite to the one.
  • a notch is formed.
  • each of the pair of terminals has two surfaces facing each other in the bending direction, and one of the pair of terminals has a third surface on either of the two surfaces.
  • a notch is formed, and on the other hand, a fourth notch is formed on the surface of the two surfaces opposite to the surface on which the third notch is formed. Therefore, at the position of the base of each terminal, it is possible to induce the respective terminals to bend in opposite directions.
  • the pair of terminals are projected from the one surface of a flat rectangular parallelepiped housing, and are bent in opposite directions in the thickness direction of the housing. ing.
  • the fuse element since the pair of terminals are bent in opposite directions in the thickness direction of the housing, the fuse element can stand on its own. Therefore, workability can be improved in the soldering process by the reflow method.
  • FIG. 1 is a perspective view showing the appearance of the electrical connection box 100 according to the first embodiment.
  • the electrical junction box 100 is a so-called vehicle junction box equipped with a fuse element.
  • the "front”, “rear”, “left”, “right”, “top”, and “bottom” of the electrical junction box 100 are set according to the front-back, left-right, and up-down directions shown in FIG. Define.
  • the front-back, left-right, and up-down directions defined in this way will be used for explanation.
  • the electrical junction box 100 includes a case member 30 for accommodating the substrate structure 20 described later, and the case member 30 has an upper case portion 31 and a lower case portion 32.
  • the substrate structure 20 is attached to the lower case portion 32, and the upper case portion 31 covers the lower case portion 32.
  • FIG. 2 is a perspective view showing a state in which the upper case portion 31 is removed in the electrical connection box 100 according to the first embodiment.
  • the lower case portion 32 has a rectangular bottom plate and side plates that rise vertically from each edge of the bottom plate.
  • the substrate structure 20 is mounted on the bottom plate.
  • the board structure 20 includes a board 21 that covers substantially the entire surface of the bottom plate of the lower case portion 32, and circuit components mounted on the upper surface of the board 21. Further, in the lower case portion 32, a plurality of connection ports 60 are provided on the front and rear side plates. Each connection port 60 is connected to the substrate 21 via a connection terminal 61 bent in an L shape.
  • a plurality of fuse elements 10 are mounted on the substrate 21.
  • the plurality of fuse elements 10 are mounted in a row along the left edge of the substrate 21, and are connected to the conductive pattern 80 (see FIG. 5) formed on the substrate 21 by, for example, soldering.
  • FIG. 3 is a perspective view showing the fuse element 10 according to the first embodiment
  • FIG. 4 is a schematic front view of the fuse element 10 according to the first embodiment. 3 and 4 show a state before mounting on the substrate 21.
  • the fuse element 10 includes a fuse element 111, two connecting portions 13, and a housing 112 (housing) made of an insulating material for accommodating them.
  • the two connecting portions 13 are made of a conductive material and have a long rectangular shape in one direction, and are arranged at appropriate lengths apart in a direction intersecting the one direction.
  • the fuse element 111 is a thin wire made of a conductive material.
  • the fuse element 111 is bent in a U shape and arranged between the two connecting portions 13, and both ends thereof are connected to the respective connecting portions 13.
  • Each of the two connecting portions 13 is integrally extended and includes a pair of terminals 12a and 12b protruding from one surface 14 of the housing 112. That is, one connection portion 13 and the terminal 12a are integrally formed, and the other connection portion 13 and the terminal 12b are integrally formed.
  • the pair of terminals 12a and 12b will also be referred to as terminals 12.
  • the fuse element 10 configured in this way is used by connecting a pair of terminals 12a and 12b to the substrate 21.
  • the fuse element 111 is interposed in the circuit related to the substrate 21 via the pair of terminals 12a and 12b and the two connecting portions 13. When an overcurrent flows through such a circuit, the fuse element 111 blows to cut off the overcurrent.
  • FIG. 5 is an explanatory diagram showing a connection state between the fuse element 10 and the substrate 21 in the substrate structure 20 according to the first embodiment.
  • the fuse element 10 is connected to the substrate 21 with the terminals 12a and 12b bent.
  • the terminals 12a and 12b have a prismatic shape and are bent in opposite directions in the thickness direction of the housing 112. The ends of the terminals 12a and 12b are soldered with solder 70 and electrically connected to the conductive pattern 80 formed on the substrate 21.
  • the substrate structure 20 according to the present embodiment can be soldered by the reflow method in the manufacturing process thereof, and the productivity can be improved.
  • the terminals of the circuit element are passed from one side to the other side of the board through the through holes, so long terminals are required.
  • long terminals are unnecessary because soldering is performed on the mounting surface of the board.
  • the fuse element 10 is soldered to the substrate 21 with the terminals 12a and 12b bent. Therefore, soldering by the reflow method is possible without the need for a separate process such as cutting the terminals 12a and 12b of the fuse element 10 into short pieces.
  • the terminals 12a and 12b are bent in opposite directions in the thickness direction of the housing 112, so that they can stand on their own. Therefore, the fuse element 10 may be placed at a required position and soldered by the reflow method, and the productivity in the manufacturing process of the substrate structure 20 can be further improved. Moreover, the contact area between the terminals 12a and 12b and the substrate 21 (conductive pattern 80) can be increased, and stable soldering is possible.
  • both the terminals 12a and 12b are bent has been described as an example, but the present invention is not limited to this. Only one of the terminals 12a and 12b may be connected to the substrate 21 in a bent state. Further, the terminals 12a and 12b may have a cylindrical shape.
  • the terminals 12a and 12b are passed through the through holes (not shown) formed in the substrate 21 from one side of the substrate 21 in a state where the terminals 12a and 12b are not bent, and the terminals 12a and 12b are passed through the substrate. Soldering by the dip flow method is performed on the other surface side of 21.
  • FIG. 6 is a schematic front view of the fuse element 10 according to the second embodiment
  • FIG. 7 is an arrow view taken along the line VII-VII of FIG.
  • first notches 15 are formed at terminals 12a and 12b of the fuse element 10, respectively.
  • the first notch 15 is the terminal 12a at the positions of the bases 125a and 125b on the terminals 12a and 12b in a direction (hereinafter, the bending direction) intersecting the direction in which the terminals 12a and 12b should be bent (the D1 direction in FIG. , 12b are formed on both sides.
  • the bending direction is the direction in which the terminals 12a and 12b are bent when the fuse element 10 is soldered to the substrate 21.
  • the base portions 125a and 125b are portions of the terminals 12a and 12b between the intermediate positions in the longitudinal direction and the housing 112.
  • the terminal 12a has two facing surfaces 121a and 122a facing each other in the D1 direction, and the first notch 15 is formed on each of the facing surfaces 121a and 122a related to the base portion 125a of the terminal 12a.
  • the terminal 12b has two facing surfaces 121b and 122b facing each other in the D1 direction, and a first notch 15 is formed on each of the facing surfaces 121b and 122b related to the base portion 125b of the terminal 12b.
  • the first notch 15 extends in the bending direction.
  • the substrate structure 20 is formed by increasing the contact area with the substrate 21 and performing stable soldering. It is possible to improve the productivity in embedding. Further, for this purpose, it is preferable that the terminals 12a and 12b are bent at the positions of the bases 125a and 125b, that is, at the positions closer to the housing 112.
  • the first notch 15 is formed in the bases 125a and 125b, and in the first notch 15, the terminals 12a and 12b are arranged in parallel.
  • the dimension L1 of the terminals 12a and 12b is sharply reduced in the installation direction (D1 direction). Therefore, the terminals 12a and 12b can be easily bent, and the bending at the first notch 15 is induced.
  • FIG. 8 is a schematic front view of the fuse element 10 according to the third embodiment
  • FIG. 9 is an arrow view taken along the line IX-IX of FIG.
  • second notches 16 are formed at terminals 12a and 12b of the fuse element 10, respectively.
  • the second notch 16 is formed on both sides of the terminals 12a and 12b at the positions of the bases 125a and 125b on the terminals 12a and 12b in the bending direction of the terminals 12a and 12b (D2 direction in FIG. 9).
  • the terminal 12a has two facing surfaces 123a and 124a facing each other in the D2 direction, and a second notch 16 is formed on each of the facing surfaces 123a and 124a related to the base portion 125a of the terminal 12a.
  • the terminal 12b has two facing surfaces 123b and 124b facing each other in the D2 direction, and a second notch 16 is formed on each of the facing surfaces 123b and 124b related to the base portion 125b of the terminal 12b.
  • the second notch 16 extends in a direction intersecting the D2 direction.
  • the terminals 12a and 12b are bent at positions closer to the housing 112 (bases 125a and 125b).
  • the second notch 16 is formed at the bases 125a and 125b (closer to the housing 112), and the second notch 16 is bent.
  • the dimensions L2 of the terminals 12a and 12b are sharply reduced. Therefore, the terminals 12a and 12b can be easily bent, and the bending at the second notch 16 is induced.
  • FIG. 10 is a schematic front view of the fuse element 10 according to the fourth embodiment, and FIG. 11 is an arrow view taken along the line XI-XI of FIG.
  • the third notch 17 is formed in the terminal 12a of the fuse element 10, and the fourth notch 18 is formed in the terminal 12b.
  • the third notch 17 is the position of the base portion 125a in the terminal 12a, and is formed on any one of the two facing surfaces 123a and 124a of the terminal 12a in the bending direction of the terminal 12a (D2 direction in FIG. 11).
  • the fourth notch 18 is the position of the base portion 125b at the terminal 12b, and is formed on any one of the two facing surfaces 123b and 124b of the terminal 12b in the bending direction of the terminal 12b (D2 direction in FIG. 11). ..
  • the third notch 17 is formed only on the facing surface 123a of the facing surfaces 123a and 124a related to the base portion 125a of the terminal 12a. Further, of the facing surfaces 123b and 124b related to the base portion 125b of the terminal 12b, the fourth notch 18 is formed only on the facing surface 124b on the side opposite to the facing surface 123a of the terminal 12a.
  • the terminals 12a and 12b are bent at positions closer to the housing 112 (bases 125a and 125b).
  • the third notch 17 and the fourth notch 18 are formed at the bases 125a and 125b (closer to the housing 112) at the terminals 12a and 12b, respectively.
  • the terminals 12a and 12b can be easily bent, and the bending at the third notch 17 and the fourth notch 18 is induced.
  • the third notch 17 of the terminal 12a and the fourth notch 18 of the terminal 12b are respectively only on the surfaces (opposing surfaces 123a, 124b) opposite to each other in the bending direction (D2 direction) of the terminals 12a and 12b. Since it is formed, it can be guided so that the terminals 12a and 12b face in opposite directions in the bending step of the terminals 12a and 12b.
  • the third notch 17 is formed only on the facing surface 124a of the two facing surfaces 123a and 124a facing each other in the D2 direction, and at the terminal 12b, the third notch 17 is formed.
  • the fourth notch 18 may be formed only on the facing surface 123b out of the two facing surfaces 123b and 124b facing each other in the D2 direction.
  • the present invention is not limited to the above description, and the third notch 17 and the fourth notch 18 are formed on the opposite side surfaces of the terminals 12a and 12b in the parallel direction (D1 direction in FIG. 10), respectively. Is also good. That is, at the terminal 12a, the third notch 17 is formed only on the facing surface 121a (or the facing surface 122a) of the two facing surfaces 121a and 122a facing each other in the D1 direction, and at the terminal 12b, the 2 facing surfaces in the D1 direction 2 Of the two facing surfaces 121b and 122b, the fourth notch 18 may be formed only on the facing surface 122b (or the facing surface 121b) (see FIG. 6).
  • Fuse element 12 12a, 12b terminal 13 Connection part 15 1st notch 16 2nd notch 17 3rd notch 18 4th notch 20 Board structure 21 Board 30 Case member 31 Upper case part 32 Lower case part 60 Connection port 70 Solder 80 Conductive pattern 100 Electrical junction box 111 Fuse element 112 Housing 121a, 122a Facing surface 121b, 122b Facing surface 123a, 124a Facing surface 123b, 124b Facing surface 125a, 125b Base

Abstract

A board structure provided with a fuse element (10) which has a pair of terminals (12a, 12b) projecting from one surface thereof, and is connected to a board (21) via said terminals (12a, 12b), wherein the fuse element (10) is connected to the board (21) with at least one of the pair of terminals (12a, 12b) in a bent state.

Description

基板構造体Board structure
　本開示は、基板構造体に関する。
　本出願は、２０２０年１月１４日出願の日本出願第２０２０－００３７６２号に基づく優先権を主張し、前記日本出願に記載された全ての記載内容を援用するものである。 The present disclosure relates to a substrate structure.
This application claims priority based on Japanese Application No. 2020-003762 filed on January 14, 2020, and incorporates all the contents described in the Japanese application.
　特許文献１には、絶縁基板上へ部分的に金属板が接合された回路基板において、前記金属板に凹部を設け、該凹部内に素子のリード（端子）を接合させることによって、斯かる凹部の深さの分、リードと金属板との接合部分における金属板の厚みを小さく抑え、熱応力を低減することについて開示されている。 In Patent Document 1, in a circuit board in which a metal plate is partially bonded to an insulating substrate, a recess is provided in the metal plate, and a lead (terminal) of an element is bonded in the recess to form such a recess. It is disclosed that the thickness of the metal plate at the joint portion between the lead and the metal plate is suppressed to be small by the depth of the metal plate, and the thermal stress is reduced.
特開２０１９－１４０４２０号公報JP-A-2019-140420
　本開示の実施形態に係る基板構造体は、一面に突設された一対の端子を有し、該端子を介して基板に接続されたヒューズ素子を備える基板構造体であって、前記ヒューズ素子は、前記一対の端子の少なくとも一方が屈曲した状態で接続している。 The substrate structure according to the embodiment of the present disclosure is a substrate structure having a pair of terminals projecting from one surface and having a fuse element connected to the substrate via the terminals, and the fuse element is a substrate structure. , At least one of the pair of terminals is connected in a bent state.
実施形態１に係る電気接続箱の外見を示す斜視図である。It is a perspective view which shows the appearance of the electric connection box which concerns on Embodiment 1. FIG. 実施形態１に係る電気接続箱において、上ケース部を取り外した状態を示す斜視図である。It is a perspective view which shows the state which the upper case part was removed in the electric connection box which concerns on Embodiment 1. FIG. 実施形態１に係るヒューズ素子を示す斜視図である。It is a perspective view which shows the fuse element which concerns on Embodiment 1. FIG. 実施形態１に係るヒューズ素子の概略的正面図である。It is a schematic front view of the fuse element which concerns on Embodiment 1. FIG. 実施形態１に係る基板構造体において、ヒューズ素子と基板との接続状態を示す説明図である。It is explanatory drawing which shows the connection state of a fuse element and a substrate in the substrate structure which concerns on Embodiment 1. FIG. 実施形態２に係るヒューズ素子の概略的正面図である。It is a schematic front view of the fuse element which concerns on Embodiment 2. FIG. 図６のＶＩＩ－ＶＩＩ線による矢視図である。FIG. 6 is an arrow view taken along the line VII-VII of FIG. 実施形態３に係るヒューズ素子の概略的正面図である。It is a schematic front view of the fuse element which concerns on Embodiment 3. 図８のＩＸ－ＩＸ線による矢視図である。FIG. 8 is an arrow view taken along the line IX-IX of FIG. 実施形態４に係るヒューズ素子の概略的正面図である。It is a schematic front view of the fuse element which concerns on Embodiment 4. FIG. 図１０のＸＩ－ＸＩ線による矢視図である。FIG. 10 is an arrow view taken along the line XI-XI of FIG.
［本開示が解決しようとする課題］
　一方、リード（端子）を有する回路部品を基板に半田付けする場合、ディップフロー法又はリフロー法が用いられる。ディップフロー法を用いる場合は貫通孔を介して基板の一面側から他面側まで端子を通し、基板の他面側にて半田付けが行われるので長い端子が必要である。しかし、リフロー法を用いる場合は基板の実装面で半田付けが行われるので長い端子は不要である。 [Issues to be solved by this disclosure]
On the other hand, when a circuit component having a lead (terminal) is soldered to a substrate, a dip flow method or a reflow method is used. When the dip flow method is used, terminals are passed from one side to the other side of the board through through holes, and soldering is performed on the other side of the board, so long terminals are required. However, when the reflow method is used, long terminals are not required because soldering is performed on the mounting surface of the board.
　長い端子の回路部品を用いてリフロー法による半田付けを行う場合、半田付けの際に回路部品の保持が難しく、安定した半田付けが困難である。
　しかしながら、特許文献１においては、このような問題に対して考慮されておらず、解決することができない。 When soldering by the reflow method using circuit parts with long terminals, it is difficult to hold the circuit parts during soldering, and stable soldering is difficult.
However, in Patent Document 1, such a problem is not considered and cannot be solved.
　そこで、リフロー法による半田付けに対応でき、かつ生産性を高めることができる基板構造体を提供することを目的とする。 Therefore, the purpose is to provide a substrate structure that can be soldered by the reflow method and can increase productivity.
［本開示の効果］
　本開示によれば、リフロー法による半田付けに対応でき、かつ安定した半田付けにより生産性を高めることができる。 [Effect of the present disclosure]
According to the present disclosure, it is possible to cope with soldering by the reflow method, and it is possible to improve productivity by stable soldering.
［本発明の実施形態の説明］
　最初に本開示の実施態様を列挙して説明する。また、以下に記載する実施形態の少なくとも一部を任意に組み合わせてもよい。 [Explanation of Embodiments of the Present Invention]
First, embodiments of the present disclosure will be listed and described. In addition, at least a part of the embodiments described below may be arbitrarily combined.
（１）本開示の実施形態に係る基板構造体は、一面に突設された一対の端子を有し、該端子を介して基板に接続されたヒューズ素子を備える基板構造体であって、前記ヒューズ素子は、前記一対の端子の少なくとも一方が屈曲した状態で接続している。 (1) The substrate structure according to the embodiment of the present disclosure is a substrate structure having a pair of terminals projecting from one surface and having a fuse element connected to the substrate via the terminals. The fuse element is connected in a state where at least one of the pair of terminals is bent.
　本実施形態にあっては、前記ヒューズ素子の少なくとも一方が屈曲した状態で前記基板に接続されている。従って、リフロー法による半田付けに対応でき、かつ前記基板との接触面を広く確保できる。 In the present embodiment, at least one of the fuse elements is connected to the substrate in a bent state. Therefore, it is possible to cope with soldering by the reflow method and to secure a wide contact surface with the substrate.
（２）本開示の実施形態に係る基板構造体は、前記一対の端子は、並設されており、相互反対向きに屈曲している。 (2) In the substrate structure according to the embodiment of the present disclosure, the pair of terminals are arranged side by side and bent in opposite directions.
　本実施形態にあっては、前記一対の端子が相互反対向きに屈曲しているので、自立可能である。従って、リフロー法による半田付けの工程において、作業性を高めることができる。 In the present embodiment, since the pair of terminals are bent in opposite directions, they can stand on their own. Therefore, workability can be improved in the soldering process by the reflow method.
（３）本開示の実施形態に係る基板構造体は、屈曲している端子は、屈曲方向と交差する方向に対向する２つの面を有し、基部における前記２つの面に第１切り欠きが形成されている。 (3) In the substrate structure according to the embodiment of the present disclosure, the bent terminals have two surfaces facing each other in a direction intersecting the bending direction, and the two surfaces at the base have a first notch. It is formed.
　本実施形態にあっては、屈曲している端子の基部に前記第１切り欠きが形成されている。従って、各端子の基部の位置での斯かる端子の屈曲を誘導することができる。 In the present embodiment, the first notch is formed at the base of the bent terminal. Therefore, it is possible to induce such bending of the terminal at the position of the base of each terminal.
（４）本開示の実施形態に係る基板構造体は、屈曲している端子は、屈曲方向に対向する２つの面を有し、基部における前記２つの面には第２切り欠きが形成されている。 (4) In the substrate structure according to the embodiment of the present disclosure, the bent terminals have two surfaces facing each other in the bending direction, and the two surfaces at the base are formed with a second notch. There is.
　本実施形態にあっては、屈曲している端子の基部に前記第２切り欠きが形成されている。従って、各端子の基部の位置での斯かる端子の屈曲を誘導することができる。 In the present embodiment, the second notch is formed at the base of the bent terminal. Therefore, it is possible to induce such bending of the terminal at the position of the base of each terminal.
（５）本開示の実施形態に係る基板構造体は、前記一対の端子の夫々は、屈曲している方向に対向する２つの面を有し、前記一対の端子の一方は、基部における前記２つの面のうちのいずれか一面に、第３切り欠きが形成され、前記一対の端子の他方は、基部における前記２つの面のうち、前記一方の前記一面とは反対側の面に、第４切り欠きが形成されている。 (5) In the substrate structure according to the embodiment of the present disclosure, each of the pair of terminals has two surfaces facing each other in the bending direction, and one of the pair of terminals has the above 2 at the base. A third notch is formed on one of the two surfaces, and the other of the pair of terminals is a fourth of the two surfaces at the base, which is opposite to the one. A notch is formed.
　本実施形態にあっては、前記一対の端子の夫々は屈曲している方向に対向する２つの面を有しており、前記一対の端子の一方には前記２つの面のいずれかに第３切り欠きが形成され、他方には前記２つの面のうち、前記第３切り欠きが形成された面とは反対側の面に第４切り欠きが形成されている。従って、各端子の基部の位置にて、相互反対向きに、夫々の端子が屈曲することを誘導することができる。 In the present embodiment, each of the pair of terminals has two surfaces facing each other in the bending direction, and one of the pair of terminals has a third surface on either of the two surfaces. A notch is formed, and on the other hand, a fourth notch is formed on the surface of the two surfaces opposite to the surface on which the third notch is formed. Therefore, at the position of the base of each terminal, it is possible to induce the respective terminals to bend in opposite directions.
（６）本開示の実施形態に係る基板構造体は、前記一対の端子は、扁平な直方体形状の筐体の前記一面から突出されており、前記筐体の厚み方向において相互反対向きに屈曲している。 (6) In the substrate structure according to the embodiment of the present disclosure, the pair of terminals are projected from the one surface of a flat rectangular parallelepiped housing, and are bent in opposite directions in the thickness direction of the housing. ing.
　本実施形態にあっては、前記一対の端子が前記筐体の厚み方向において相互反対向きに屈曲しているので、前記ヒューズ素子が自立可能である。従って、リフロー法による半田付けの工程において、作業性を高めることができる。 In the present embodiment, since the pair of terminals are bent in opposite directions in the thickness direction of the housing, the fuse element can stand on its own. Therefore, workability can be improved in the soldering process by the reflow method.
[本発明の実施形態の詳細]
　本開示の実施形態に係る基板構造体を、以下に図面を参照しつつ説明する。なお、本発明はこれらの例示に限定されるものではなく、請求の範囲によって示され、請求の範囲と均等の意味及び範囲内でのすべての変更が含まれることが意図される。 [Details of Embodiments of the present invention]
The substrate structure according to the embodiment of the present disclosure will be described below with reference to the drawings. It should be noted that the present invention is not limited to these examples, and is indicated by the scope of claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.
（実施形態１）
　図１は、実施形態１に係る電気接続箱１００の外見を示す斜視図である。電気接続箱１００はヒューズ素子が装着された、いわゆる車両用のジャンクションボックスである。 (Embodiment 1)
FIG. 1 is a perspective view showing the appearance of the electrical connection box 100 according to the first embodiment. The electrical junction box 100 is a so-called vehicle junction box equipped with a fuse element.
　本実施形態では、便宜上、図１に示す前後、左右、上下の各方向により、電気接続箱１００の「前」、「後」、「左」、「右」、「上」、「下」を定義する。以下では、このように定義される前後、左右、上下の各方向を用いて説明する。 In the present embodiment, for convenience, the "front", "rear", "left", "right", "top", and "bottom" of the electrical junction box 100 are set according to the front-back, left-right, and up-down directions shown in FIG. Define. In the following, the front-back, left-right, and up-down directions defined in this way will be used for explanation.
　電気接続箱１００は、後述する基板構造体２０を収容するケース部材３０を備え、ケース部材３０は上ケース部３１と、下ケース部３２とを有する。下ケース部３２には基板構造体２０が取り付けられており、上ケース部３１は、下ケース部３２を覆う。 The electrical junction box 100 includes a case member 30 for accommodating the substrate structure 20 described later, and the case member 30 has an upper case portion 31 and a lower case portion 32. The substrate structure 20 is attached to the lower case portion 32, and the upper case portion 31 covers the lower case portion 32.
　図２は、実施形態１に係る電気接続箱１００において、上ケース部３１を取り外した状態を示す斜視図である。下ケース部３２は、矩形の底板と該底板の各辺縁から垂直に立ち上がる側板を有する。前記底板上には基板構造体２０が取り付けられている。 FIG. 2 is a perspective view showing a state in which the upper case portion 31 is removed in the electrical connection box 100 according to the first embodiment. The lower case portion 32 has a rectangular bottom plate and side plates that rise vertically from each edge of the bottom plate. The substrate structure 20 is mounted on the bottom plate.
　基板構造体２０は、下ケース部３２の前記底板の略全面を覆う基板２１と、該基板２１の上面に実装された回路部品とを備える。また、下ケース部３２において、前後の側板には、接続口６０が複数設けられている。各接続口６０は、Ｌ字状に屈曲した接続端子６１を介して基板２１に接続されている。 The board structure 20 includes a board 21 that covers substantially the entire surface of the bottom plate of the lower case portion 32, and circuit components mounted on the upper surface of the board 21. Further, in the lower case portion 32, a plurality of connection ports 60 are provided on the front and rear side plates. Each connection port 60 is connected to the substrate 21 via a connection terminal 61 bent in an L shape.
　また、基板２１においては、複数のヒューズ素子１０が実装されている。複数のヒューズ素子１０は、基板２１の左側の辺縁に沿って一列に実装されており、基板２１に形成された導電性パターン８０（図５参照）に、例えば半田付けによって接続されている。 Further, a plurality of fuse elements 10 are mounted on the substrate 21. The plurality of fuse elements 10 are mounted in a row along the left edge of the substrate 21, and are connected to the conductive pattern 80 (see FIG. 5) formed on the substrate 21 by, for example, soldering.
　図３は、実施形態１に係るヒューズ素子１０を示す斜視図であり、図４は、実施形態１に係るヒューズ素子１０の概略的正面図である。図３及び図４は、基板２１への実装前の状態を示している。 FIG. 3 is a perspective view showing the fuse element 10 according to the first embodiment, and FIG. 4 is a schematic front view of the fuse element 10 according to the first embodiment. 3 and 4 show a state before mounting on the substrate 21.
　ヒューズ素子１０は、ヒューズエレメント１１１及び２つの接続部１３と、これらを収納する絶縁性材料製のハウジング１１２（筐体）とを備える。２つの接続部１３は、導電材料製の一方向に長い矩形状であり、前記一方向と交差する方向に適長離隔して配置されている。 The fuse element 10 includes a fuse element 111, two connecting portions 13, and a housing 112 (housing) made of an insulating material for accommodating them. The two connecting portions 13 are made of a conductive material and have a long rectangular shape in one direction, and are arranged at appropriate lengths apart in a direction intersecting the one direction.
　ヒューズエレメント１１１は、導電材料製の細い線状である。ヒューズエレメント１１１はＵ字形に屈曲されて２つの接続部１３の間に配置され、その両端が夫々の接続部１３に接続している。２つの接続部１３は、夫々に一体に延設され、ハウジング１１２の一面１４から突出する一対の端子１２ａ，１２ｂを備えている。即ち、一方の接続部１３及び端子１２ａが一体形成され、他方の接続部１３及び端子１２ｂが一体形成されている。以下、一対の端子１２ａ，１２ｂを端子１２とも称する。 The fuse element 111 is a thin wire made of a conductive material. The fuse element 111 is bent in a U shape and arranged between the two connecting portions 13, and both ends thereof are connected to the respective connecting portions 13. Each of the two connecting portions 13 is integrally extended and includes a pair of terminals 12a and 12b protruding from one surface 14 of the housing 112. That is, one connection portion 13 and the terminal 12a are integrally formed, and the other connection portion 13 and the terminal 12b are integrally formed. Hereinafter, the pair of terminals 12a and 12b will also be referred to as terminals 12.
　このように、構成されたヒューズ素子１０は、一対の端子１２ａ，１２ｂを基板２１に接続して使用する。ヒューズエレメント１１１は、一対の端子１２ａ，１２ｂ及び２つの接続部１３を介して基板２１に係る回路中に介装される。斯かる回路に過電流が流れる場合、ヒューズエレメント１１１が溶断して過電流を遮断する。　 The fuse element 10 configured in this way is used by connecting a pair of terminals 12a and 12b to the substrate 21. The fuse element 111 is interposed in the circuit related to the substrate 21 via the pair of terminals 12a and 12b and the two connecting portions 13. When an overcurrent flows through such a circuit, the fuse element 111 blows to cut off the overcurrent.
　図５は、実施形態１に係る基板構造体２０において、ヒューズ素子１０と基板２１との接続状態を示す説明図である。ヒューズ素子１０は、端子１２ａ，１２ｂが屈曲した状態で基板２１に接続されている。 FIG. 5 is an explanatory diagram showing a connection state between the fuse element 10 and the substrate 21 in the substrate structure 20 according to the first embodiment. The fuse element 10 is connected to the substrate 21 with the terminals 12a and 12b bent.
　端子１２ａ，１２ｂは、角柱形状であり、ハウジング１１２の厚み方向において、互いに反対方向に屈曲している。端子１２ａ，１２ｂの夫々の端部は、半田７０を用いて半田付けされ、基板２１に形成された導電性パターン８０に電気的に接続されている。 The terminals 12a and 12b have a prismatic shape and are bent in opposite directions in the thickness direction of the housing 112. The ends of the terminals 12a and 12b are soldered with solder 70 and electrically connected to the conductive pattern 80 formed on the substrate 21.
　このような構成を有することから、本実施形態に係る基板構造体２０は、その製造過程において、リフロー法による半田付けに対応でき、かつ生産性を高めることができる。 Since it has such a configuration, the substrate structure 20 according to the present embodiment can be soldered by the reflow method in the manufacturing process thereof, and the productivity can be improved.
　ディップフロー法による半田付けの場合は貫通孔を介して基板の一面側から他面側まで回路素子の端子を通すので長い端子が必要である。しかし、リフロー法による半田付けの場合は基板の実装面で半田付けが行われるので長い端子は不要である。 In the case of soldering by the dip flow method, the terminals of the circuit element are passed from one side to the other side of the board through the through holes, so long terminals are required. However, in the case of soldering by the reflow method, long terminals are unnecessary because soldering is performed on the mounting surface of the board.
　長い端子の回路部品を用いてリフロー法による半田付けを行う場合、半田付けの際に回路部品の保持が難しく、安定した半田付けが困難であるので、歩留まりが悪くなる。従って、生産性の低下を招く。 When soldering by the reflow method using circuit parts with long terminals, it is difficult to hold the circuit parts during soldering, and stable soldering is difficult, resulting in poor yield. Therefore, it causes a decrease in productivity.
　これに対して、本実施形態に係る基板構造体２０においては、端子１２ａ，１２ｂが屈曲した状態でヒューズ素子１０が基板２１に半田付けされる。従って、ヒューズ素子１０の端子１２ａ，１２ｂを短く切断する等の別途の処理を必要とせず、リフロー法用による半田付けが可能である。 On the other hand, in the substrate structure 20 according to the present embodiment, the fuse element 10 is soldered to the substrate 21 with the terminals 12a and 12b bent. Therefore, soldering by the reflow method is possible without the need for a separate process such as cutting the terminals 12a and 12b of the fuse element 10 into short pieces.
　更に、本実施形態に係る基板構造体２０では、端子１２ａ，１２ｂが、ハウジング１１２の厚み方向において、互いに反対方向に屈曲しているので自立可能である。従って、ヒューズ素子１０を必要箇所に置いてリフロー法による半田付けを行えば良く、基板構造体２０の製造過程における生産性を更に高めることができる。かつ、端子１２ａ，１２ｂと基板２１（導電性パターン８０）との接触面積を増やすことができ、安定した半田付けが可能である。 Further, in the substrate structure 20 according to the present embodiment, the terminals 12a and 12b are bent in opposite directions in the thickness direction of the housing 112, so that they can stand on their own. Therefore, the fuse element 10 may be placed at a required position and soldered by the reflow method, and the productivity in the manufacturing process of the substrate structure 20 can be further improved. Moreover, the contact area between the terminals 12a and 12b and the substrate 21 (conductive pattern 80) can be increased, and stable soldering is possible.
　なお、本実施形態においては、端子１２ａ，１２ｂの両方が屈曲している場合を例に挙げて説明したが、これに限定されるものではない。端子１２ａ，１２ｂの何れか一つのみが屈曲した状態にして基板２１に接続されても良い。また、端子１２ａ，１２ｂは円柱形状であっても良い。 In the present embodiment, the case where both the terminals 12a and 12b are bent has been described as an example, but the present invention is not limited to this. Only one of the terminals 12a and 12b may be connected to the substrate 21 in a bent state. Further, the terminals 12a and 12b may have a cylindrical shape.
　一方、ディップフロー法を用いる場合は、端子１２ａ，１２ｂが屈曲していない状態で、基板２１に形成された貫通孔（図示せず）に基板２１の一面側から端子１２ａ，１２ｂを通し、基板２１の他面側でディップフロー法による半田付けが行われる。 On the other hand, when the dip flow method is used, the terminals 12a and 12b are passed through the through holes (not shown) formed in the substrate 21 from one side of the substrate 21 in a state where the terminals 12a and 12b are not bent, and the terminals 12a and 12b are passed through the substrate. Soldering by the dip flow method is performed on the other surface side of 21.
（実施形態２）
　図６は、実施形態２に係るヒューズ素子１０の概略的正面図であり、図７は、図６のＶＩＩ－ＶＩＩ線による矢視図である。 (Embodiment 2)
FIG. 6 is a schematic front view of the fuse element 10 according to the second embodiment, and FIG. 7 is an arrow view taken along the line VII-VII of FIG.
　実施形態２に係る基板構造体２０は、ヒューズ素子１０の端子１２ａ，１２ｂに、第１切り欠き１５が夫々形成されている。第１切り欠き１５は、端子１２ａ，１２ｂにおける基部１２５ａ，１２５ｂの位置で、端子１２ａ，１２ｂを屈曲させるべき方向（以下、屈曲方向）と交差する方向（図６のＤ１方向）に、端子１２ａ，１２ｂの両側に形成されている。なお、前記屈曲方向は、ヒューズ素子１０が基板２１に半田付けされた場合、端子１２ａ，１２ｂが屈曲している方向である。また、基部１２５ａ，１２５ｂは、端子１２ａ，１２ｂにおいて長手方向の中間位置からハウジング１１２までの間の部分である。 In the substrate structure 20 according to the second embodiment, first notches 15 are formed at terminals 12a and 12b of the fuse element 10, respectively. The first notch 15 is the terminal 12a at the positions of the bases 125a and 125b on the terminals 12a and 12b in a direction (hereinafter, the bending direction) intersecting the direction in which the terminals 12a and 12b should be bent (the D1 direction in FIG. , 12b are formed on both sides. The bending direction is the direction in which the terminals 12a and 12b are bent when the fuse element 10 is soldered to the substrate 21. Further, the base portions 125a and 125b are portions of the terminals 12a and 12b between the intermediate positions in the longitudinal direction and the housing 112.
　即ち、端子１２ａはＤ１方向において対向する２つの対向面１２１ａ，１２２ａを有しており、端子１２ａの基部１２５ａに係る対向面１２１ａ，１２２ａに第１切り欠き１５が夫々形成されている。また、端子１２ｂはＤ１方向において対向する２つの対向面１２１ｂ，１２２ｂを有しており、端子１２ｂの基部１２５ｂに係る対向面１２１ｂ，１２２ｂに第１切り欠き１５が夫々形成されている。第１切り欠き１５は屈曲方向に延びている。 That is, the terminal 12a has two facing surfaces 121a and 122a facing each other in the D1 direction, and the first notch 15 is formed on each of the facing surfaces 121a and 122a related to the base portion 125a of the terminal 12a. Further, the terminal 12b has two facing surfaces 121b and 122b facing each other in the D1 direction, and a first notch 15 is formed on each of the facing surfaces 121b and 122b related to the base portion 125b of the terminal 12b. The first notch 15 extends in the bending direction.
　端子１２ａ，１２ｂが屈曲した状態でヒューズ素子１０が基板２１に半田付けされる場合、上述したように、基板２１との接触面積の増大、及び、安定した半田付け等によって、基板構造体２０の組み込みにおける生産性の向上を図ることができる。また、このためには、端子１２ａ，１２ｂが基部１２５ａ，１２５ｂの位置、即ちハウジング１１２寄りの位置で屈曲することが好ましい。 When the fuse element 10 is soldered to the substrate 21 with the terminals 12a and 12b bent, as described above, the substrate structure 20 is formed by increasing the contact area with the substrate 21 and performing stable soldering. It is possible to improve the productivity in embedding. Further, for this purpose, it is preferable that the terminals 12a and 12b are bent at the positions of the bases 125a and 125b, that is, at the positions closer to the housing 112.
　実施形態２に係る基板構造体２０では、上述したように、端子１２ａ，１２ｂにおいて、基部１２５ａ，１２５ｂに第１切り欠き１５が形成されており、第１切り欠き１５では端子１２ａ，１２ｂの並設方向（Ｄ１方向）において端子１２ａ，１２ｂの寸法Ｌ１が急減している。従って、端子１２ａ，１２ｂの曲げが容易にできるうえ、第１切り欠き１５での屈曲が誘導される。 In the substrate structure 20 according to the second embodiment, as described above, in the terminals 12a and 12b, the first notch 15 is formed in the bases 125a and 125b, and in the first notch 15, the terminals 12a and 12b are arranged in parallel. The dimension L1 of the terminals 12a and 12b is sharply reduced in the installation direction (D1 direction). Therefore, the terminals 12a and 12b can be easily bent, and the bending at the first notch 15 is induced.
　実施の形態１と同様の部分については、同一の符号を付して詳細な説明を省略する。　 The same parts as those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.
（実施形態３）
　図８は、実施形態３に係るヒューズ素子１０の概略的正面図であり、図９は、図８のＩＸ－ＩＸ線による矢視図である。 (Embodiment 3)
FIG. 8 is a schematic front view of the fuse element 10 according to the third embodiment, and FIG. 9 is an arrow view taken along the line IX-IX of FIG.
　実施形態３に係る基板構造体２０は、ヒューズ素子１０の端子１２ａ，１２ｂに、第２切り欠き１６が夫々形成されている。第２切り欠き１６は、端子１２ａ，１２ｂにおける基部１２５ａ，１２５ｂの位置にて、端子１２ａ，１２ｂの屈曲方向（図９のＤ２方向）に、端子１２ａ，１２ｂの両側に形成されている。 In the substrate structure 20 according to the third embodiment, second notches 16 are formed at terminals 12a and 12b of the fuse element 10, respectively. The second notch 16 is formed on both sides of the terminals 12a and 12b at the positions of the bases 125a and 125b on the terminals 12a and 12b in the bending direction of the terminals 12a and 12b (D2 direction in FIG. 9).
　即ち、端子１２ａはＤ２方向において対向する２つの対向面１２３ａ，１２４ａを有しており、端子１２ａの基部１２５ａに係る対向面１２３ａ，１２４ａに第２切り欠き１６が夫々形成されている。また、端子１２ｂはＤ２方向において対向する２つの対向面１２３ｂ，１２４ｂを有しており、端子１２ｂの基部１２５ｂに係る対向面１２３ｂ，１２４ｂに第２切り欠き１６が夫々形成されている。第２切り欠き１６はＤ２方向と交差する方向に延びている。 That is, the terminal 12a has two facing surfaces 123a and 124a facing each other in the D2 direction, and a second notch 16 is formed on each of the facing surfaces 123a and 124a related to the base portion 125a of the terminal 12a. Further, the terminal 12b has two facing surfaces 123b and 124b facing each other in the D2 direction, and a second notch 16 is formed on each of the facing surfaces 123b and 124b related to the base portion 125b of the terminal 12b. The second notch 16 extends in a direction intersecting the D2 direction.
　端子１２ａ，１２ｂが屈曲した状態でヒューズ素子１０が基板２１に半田付けされる場合、端子１２ａ，１２ｂはハウジング１１２寄りの位置（基部１２５ａ，１２５ｂ）で屈曲することが好ましい。
　実施形態３に係る基板構造体２０では、上述したように、端子１２ａ，１２ｂにおいて、基部１２５ａ，１２５ｂ（ハウジング１１２寄り）に第２切り欠き１６が形成されており、第２切り欠き１６では屈曲方向（Ｄ２方向）において端子１２ａ，１２ｂの寸法Ｌ２が急減している。従って、端子１２ａ，１２ｂの曲げが容易にできるうえ、第２切り欠き１６での屈曲が誘導される。 When the fuse element 10 is soldered to the substrate 21 with the terminals 12a and 12b bent, it is preferable that the terminals 12a and 12b are bent at positions closer to the housing 112 ( bases 125a and 125b).
In the substrate structure 20 according to the third embodiment, as described above, at the terminals 12a and 12b, the second notch 16 is formed at the bases 125a and 125b (closer to the housing 112), and the second notch 16 is bent. In the direction (D2 direction), the dimensions L2 of the terminals 12a and 12b are sharply reduced. Therefore, the terminals 12a and 12b can be easily bent, and the bending at the second notch 16 is induced.
　実施の形態１又は２と同様の部分については、同一の符号を付して詳細な説明を省略する。 The same parts as those of the first or second embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.
（実施形態４）
　図１０は、実施形態４に係るヒューズ素子１０の概略的正面図であり、図１１は、図１０のＸＩ－ＸＩ線による矢視図である。 (Embodiment 4)
FIG. 10 is a schematic front view of the fuse element 10 according to the fourth embodiment, and FIG. 11 is an arrow view taken along the line XI-XI of FIG.
　実施形態４に係る基板構造体２０は、ヒューズ素子１０の端子１２ａに第３切り欠き１７が形成され、端子１２ｂに第４切り欠き１８が形成されている。第３切り欠き１７は、端子１２ａにおける基部１２５ａの位置であって、端子１２ａの屈曲方向（図１１のＤ２方向）における端子１２ａの２つの対向面１２３ａ，１２４ａのいずれか一面に形成されている。第４切り欠き１８は、端子１２ｂにおける基部１２５ｂの位置であって、端子１２ｂの屈曲方向（図１１のＤ２方向）における端子１２ｂの２つの対向面１２３ｂ，１２４ｂのいずれか一面に形成されている。 In the substrate structure 20 according to the fourth embodiment, the third notch 17 is formed in the terminal 12a of the fuse element 10, and the fourth notch 18 is formed in the terminal 12b. The third notch 17 is the position of the base portion 125a in the terminal 12a, and is formed on any one of the two facing surfaces 123a and 124a of the terminal 12a in the bending direction of the terminal 12a (D2 direction in FIG. 11). .. The fourth notch 18 is the position of the base portion 125b at the terminal 12b, and is formed on any one of the two facing surfaces 123b and 124b of the terminal 12b in the bending direction of the terminal 12b (D2 direction in FIG. 11). ..
　即ち、端子１２ａの基部１２５ａに係る対向面１２３ａ，１２４ａのうちの対向面１２３ａにのみ第３切り欠き１７が形成されている。また、端子１２ｂの基部１２５ｂに係る対向面１２３ｂ，１２４ｂのうち、端子１２ａの対向面１２３ａとは反対側の対向面１２４ｂにのみ第４切り欠き１８が形成されている。 That is, the third notch 17 is formed only on the facing surface 123a of the facing surfaces 123a and 124a related to the base portion 125a of the terminal 12a. Further, of the facing surfaces 123b and 124b related to the base portion 125b of the terminal 12b, the fourth notch 18 is formed only on the facing surface 124b on the side opposite to the facing surface 123a of the terminal 12a.
　端子１２ａ，１２ｂが屈曲した状態でヒューズ素子１０が基板２１に半田付けされる場合、端子１２ａ，１２ｂはハウジング１１２寄りの位置（基部１２５ａ，１２５ｂ）で屈曲することが好ましい。
　実施形態４に係る基板構造体２０では、上述したように、端子１２ａ，１２ｂにおいて、基部１２５ａ，１２５ｂ（ハウジング１１２寄り）に第３切り欠き１７及び第４切り欠き１８が夫々形成されているので、端子１２ａ，１２ｂの曲げが容易にできるうえ、第３切り欠き１７及び第４切り欠き１８での屈曲が誘導される。 When the fuse element 10 is soldered to the substrate 21 with the terminals 12a and 12b bent, it is preferable that the terminals 12a and 12b are bent at positions closer to the housing 112 ( bases 125a and 125b).
In the substrate structure 20 according to the fourth embodiment, as described above, the third notch 17 and the fourth notch 18 are formed at the bases 125a and 125b (closer to the housing 112) at the terminals 12a and 12b, respectively. , The terminals 12a and 12b can be easily bent, and the bending at the third notch 17 and the fourth notch 18 is induced.
　更に、端子１２ａの第３切り欠き１７と、端子１２ｂの第４切り欠き１８とが、端子１２ａ，１２ｂの屈曲方向（Ｄ２方向）において互いに反対側の面（対向面１２３ａ、１２４ｂ）にのみ夫々形成されているので、端子１２ａ，１２ｂの曲げ工程で、端子１２ａ，１２ｂが夫々反対方向を向くように誘導できる。 Further, the third notch 17 of the terminal 12a and the fourth notch 18 of the terminal 12b are respectively only on the surfaces (opposing surfaces 123a, 124b) opposite to each other in the bending direction (D2 direction) of the terminals 12a and 12b. Since it is formed, it can be guided so that the terminals 12a and 12b face in opposite directions in the bending step of the terminals 12a and 12b.
　なお、以上の記載に限定されるものではなく、端子１２ａにおいては、Ｄ２方向で対向する２つの対向面１２３ａ，１２４ａのうち対向面１２４ａにのみ第３切り欠き１７が形成され、端子１２ｂにおいては、Ｄ２方向で対向する２つの対向面１２３ｂ，１２４ｂのうち対向面１２３ｂにのみ第４切り欠き１８が形成されても良い。 The description is not limited to the above. At the terminal 12a, the third notch 17 is formed only on the facing surface 124a of the two facing surfaces 123a and 124a facing each other in the D2 direction, and at the terminal 12b, the third notch 17 is formed. , The fourth notch 18 may be formed only on the facing surface 123b out of the two facing surfaces 123b and 124b facing each other in the D2 direction.
　また、以上の記載に限定されるものではなく、端子１２ａ，１２ｂの並設方向（図１０のＤ１方向）における相互反対側面に、第３切り欠き１７及び第４切り欠き１８が夫々形成されても良い。
　即ち、端子１２ａにおいてはＤ１方向で対向する２つの対向面１２１ａ，１２２ａのうち対向面１２１ａ（又は対向面１２２ａ）にのみ第３切り欠き１７が形成され、端子１２ｂにおいてはＤ１方向で対向する２つの対向面１２１ｂ，１２２ｂのうち対向面１２２ｂ（又は対向面１２１ｂ）にのみ第４切り欠き１８が形成されても良い（図６参照）。 Further, the present invention is not limited to the above description, and the third notch 17 and the fourth notch 18 are formed on the opposite side surfaces of the terminals 12a and 12b in the parallel direction (D1 direction in FIG. 10), respectively. Is also good.
That is, at the terminal 12a, the third notch 17 is formed only on the facing surface 121a (or the facing surface 122a) of the two facing surfaces 121a and 122a facing each other in the D1 direction, and at the terminal 12b, the 2 facing surfaces in the D1 direction 2 Of the two facing surfaces 121b and 122b, the fourth notch 18 may be formed only on the facing surface 122b (or the facing surface 121b) (see FIG. 6).
　実施の形態１～３と同様の部分については、同一の符号を付して詳細な説明を省略する。 The same parts as those in the first to third embodiments are designated by the same reference numerals, and detailed description thereof will be omitted.
　今回開示された実施形態はすべての点で例示であって、制限的なものではないと考えられるべきである。本発明の範囲は、上記した意味ではなく、請求の範囲によって示され、請求の範囲と均等の意味及び範囲内でのすべての変更が含まれることが意図される。 The embodiments disclosed this time should be considered to be exemplary in all respects and not restrictive. The scope of the present invention is indicated by the scope of claims, not the above-mentioned meaning, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.
　１０　ヒューズ素子
　１２，１２ａ，１２ｂ　端子
　１３　接続部
　１５　第１切り欠き
　１６　第２切り欠き
　１７　第３切り欠き
　１８　第４切り欠き
　２０　基板構造体
　２１　基板
　３０　ケース部材
　３１　上ケース部
　３２　下ケース部
　６０　接続口
　７０　半田
　８０　導電性パターン
　１００　電気接続箱
　１１１　ヒューズエレメント
　１１２　ハウジング
　１２１ａ，１２２ａ　対向面
　１２１ｂ，１２２ｂ　対向面
　１２３ａ，１２４ａ　対向面
　１２３ｂ，１２４ｂ　対向面
　１２５ａ，１２５ｂ　基部
　
　
  10 Fuse element 12, 12a, 12b terminal 13 Connection part 15 1st notch 16 2nd notch 17 3rd notch 18 4th notch 20 Board structure 21 Board 30 Case member 31 Upper case part 32 Lower case part 60 Connection port 70 Solder 80 Conductive pattern 100 Electrical junction box 111 Fuse element 112 Housing 121a, 122a Facing surface 121b, 122b Facing surface 123a, 124a Facing surface 123b, 124b Facing surface 125a, 125b Base

Claims (6)

  1. 　一面に突設された一対の端子を有し、該端子を介して基板に接続されたヒューズ素子を備える基板構造体であって、
    　前記ヒューズ素子は、前記一対の端子の少なくとも一方が屈曲した状態で接続している基板構造体。     A substrate structure having a pair of terminals projecting from one surface and having a fuse element connected to the substrate via the terminals.
    The fuse element is a substrate structure in which at least one of the pair of terminals is connected in a bent state.
  2. 　前記一対の端子は、並設されており、相互反対向きに屈曲している請求項１に記載の基板構造体。 The substrate structure according to claim 1, wherein the pair of terminals are arranged side by side and bent in opposite directions.
  3. 　屈曲している端子は、
    　屈曲方向と交差する方向に対向する２つの面を有し、
    　基部における前記２つの面に第１切り欠きが形成されている請求項１又は２に記載の基板構造体。     The bent terminal is
    It has two surfaces facing each other in the bending direction and intersecting the bending direction.
    The substrate structure according to claim 1 or 2, wherein the first notch is formed on the two surfaces at the base.
  4. 　屈曲している端子は、
    　屈曲方向に対向する２つの面を有し、
    　基部における前記２つの面には第２切り欠きが形成されている請求項１又は２に記載の基板構造体。     The bent terminal is
    It has two surfaces facing each other in the bending direction.
    The substrate structure according to claim 1 or 2, wherein a second notch is formed on the two surfaces at the base.
  5. 　前記一対の端子の夫々は、屈曲している方向に対向する２つの面を有し、
    　前記一対の端子の一方は、基部における前記２つの面のうちのいずれか一面に、第３切り欠きが形成され、
    　前記一対の端子の他方は、基部における前記２つの面のうち、前記一方の前記一面とは反対側の面に、第４切り欠きが形成されている請求項２に記載の基板構造体。     Each of the pair of terminals has two surfaces facing each other in the bending direction.
    One of the pair of terminals has a third notch formed on one of the two surfaces at the base.
    The substrate structure according to claim 2, wherein the other of the pair of terminals has a fourth notch formed on the surface of the two surfaces at the base opposite to the one surface.
  6. 　前記一対の端子は、
    　扁平な直方体形状の筐体の前記一面から突出されており、
    　前記筐体の厚み方向において相互反対向きに屈曲している請求項２に記載の基板構造体。
          The pair of terminals
    It protrudes from the one side of the flat rectangular parallelepiped housing.
    The substrate structure according to claim 2, which is bent in opposite directions in the thickness direction of the housing.
PCT/JP2020/049172 2020-01-14 2020-12-28 Board structure WO2021145219A1 (en)

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JP2020003762A JP2021111723A (en) 2020-01-14 2020-01-14 Substrate structural body

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60151121U (en) * 1984-03-16 1985-10-07 日本電気株式会社 Chip-shaped electronic components
JPH05326782A (en) * 1992-05-21 1993-12-10 Hitachi Ltd Lead frame and semiconductor device provided therewith
JPH07227027A (en) * 1994-02-08 1995-08-22 Furukawa Electric Co Ltd:The Structure for branch circuit
JPH07272775A (en) * 1994-03-30 1995-10-20 Furukawa Electric Co Ltd:The Electric circuit board for mounting electric part
JP2002084631A (en) * 2000-09-08 2002-03-22 Sumitomo Wiring Syst Ltd Fuse circuit construction of junction box
JP2003217557A (en) * 2002-01-21 2003-07-31 Tocad Energy Co Ltd Lead-plate folding structure
JP2005167156A (en) * 2003-12-05 2005-06-23 Tokyo Coil Engineering Kk Surface-mounting coil component
JP2007220641A (en) * 2006-02-20 2007-08-30 Taiheiyo Seiko Kk Multi-electrode fuse

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60151121U (en) * 1984-03-16 1985-10-07 日本電気株式会社 Chip-shaped electronic components
JPH05326782A (en) * 1992-05-21 1993-12-10 Hitachi Ltd Lead frame and semiconductor device provided therewith
JPH07227027A (en) * 1994-02-08 1995-08-22 Furukawa Electric Co Ltd:The Structure for branch circuit
JPH07272775A (en) * 1994-03-30 1995-10-20 Furukawa Electric Co Ltd:The Electric circuit board for mounting electric part
JP2002084631A (en) * 2000-09-08 2002-03-22 Sumitomo Wiring Syst Ltd Fuse circuit construction of junction box
JP2003217557A (en) * 2002-01-21 2003-07-31 Tocad Energy Co Ltd Lead-plate folding structure
JP2005167156A (en) * 2003-12-05 2005-06-23 Tokyo Coil Engineering Kk Surface-mounting coil component
JP2007220641A (en) * 2006-02-20 2007-08-30 Taiheiyo Seiko Kk Multi-electrode fuse

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