JPH04284660A - Semiconductor device - Google Patents

Abstract

PURPOSE:To enable the deformation and displacement due to the external force of the leads in narrowing width to be avoided by a method wherein the width of the leads on both end parts is made wider than that of the leads on the inner side out of multiple leads to be arrayed on the side of a package. CONSTITUTION:The title semiconductor device is provided with an insulating member 1 sealing a chip formed of integrated circuits as well as a multitude of conductive leads 2 having outer conductors extending from one ends electrically connected to the integrated circuits and passing through the insulating member 1 to be arrayed in parallel with one another. At this time, the outer leading part of the leads 21 of the first group at least positioned on both end parts out of the leads 2 are formed wider than the leads 22 of the second group positioned inner side of the leads 21 in the direction making a right angle with said extending direction. Furthermore, for example, the outer leading parts of the leads 21 of the first group are made narrower than the ends of the leads 22 of the second group.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device enclosed in a package having leads for connecting an integrated circuit chip to an external circuit, and in particular to prevention of deformation of the leads during handling of the semiconductor device. .

0002

2. Description of the Related Art An integrated circuit chip sealed using a resin molded package or some ceramic packages is connected to the outside through leads embedded in the package. FIG. 7 shows an example of a resin mold package, in which an integrated circuit chip (not shown) is sealed inside a resin layer 1 molded by a transfer molding method, etc., and a plurality of leads 2 are used as external connection means for this integrated circuit chip. is provided. Usually, such external connection leads 2 are arranged in a line on each of two or four sides of the resin layer 1.

0003

[Problems to be Solved by the Invention] On the other hand, as packages become smaller and integrated circuits become more sophisticated, lead
There is a need to reduce the width and arrangement pitch of the As a result, when the package is tested, transported, or mounted on a printed wiring board, etc., the leads 2 are likely to be deformed by external force or the arrangement pitch may be misaligned. Due to such deformation and misalignment, soldering to the printed wiring pattern cannot be completed completely, resulting in poor connections. In particular, as the mounting process of mounting onto a printed wiring board and soldering has become automated, it has become more susceptible to the effects of slight deformation of the external connection leads mentioned above.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for preventing lead deformation and displacement caused by external forces as described above.

[0005]

[Means for Solving the Problem] The above object is to provide an insulating member that encapsulates a chip on which an integrated circuit is formed, and an insulating member that extends from one end electrically connected to the integrated circuit and that extends through the insulating member. and a plurality of conductive leads having external lead-out portions arranged in parallel with each other, and for the first group of leads located at least at both end portions of the leads, a second group of leads located at the inner side thereof. The semiconductor device according to the present invention is characterized in that the external lead-out portion is formed to have a wider width in the direction perpendicular to the extending direction than the leads of the first group. The semiconductor device according to the present invention, wherein the width of the tip of the external lead-out portion is narrower than the tip of the second group of leads, or in the above, the width of the first group of leads is This is achieved by any one of the semiconductor devices according to the present invention, characterized in that the widened tip portion is provided with a slit extending in a direction parallel to the extending direction.

[0006]

[Operation] According to the research conducted by the present inventors, among the external connection leads 2 arranged on each side of the package, the leads closer to the outer edge are more susceptible to the above-mentioned deformation, and as shown in FIG. It was found that the lead 21 located at the inner part was extremely prone to deformation, while deformation of the lead 22 located at the inner part was rare.

Based on this result, as shown in the structural principle diagram of FIG. 1, for the leads 21 at both ends,
When we attempted to expand the width of the leads 2 in the arrangement direction, we were able to reduce the number of connection failures across the leads 2. Since only the leads 21 at both end portions are mainly widened, there is no need to change the arrangement pitch of the leads 2, and the overall arrangement width of the leads 2 on each side surface hardly increases.

[0008]

[Example] As a first example, the width of the leads 21 at both ends in FIG.
For example, increase the width by 1.5 to 2 times. This was effective in preventing the deformation and the like. By the way, the width of the lead 22 is 450 μm, which is the same as the conventional one, whereas the width of the lead 21 is 600 to 9 μm.
00 μm. The length of both lead 21 and lead 22 is about 1300 μm, and the thickness of both is about 15 μm.
It is 0 μm.

FIG. 2 is a diagram illustrating a second embodiment in which the present invention is applied to a ceramic package, in which a low melting point glass layer 3
An integrated circuit chip (not shown) is enclosed between the two ceramic plates 4 bonded together. Among the external connection leads 5 arranged to penetrate the low melting point glass layer 3, the widths of the leads 51 at both ends are wider than those of the leads 52 located on the inner side. The leads 5 in the illustrated ceramic package consisting of the low melting point glass layer 3 and the ceramic plate 4 are not bent unlike the leads 2 in FIG. 1, but the effect of preventing deformation etc. is the same as in FIG. be.

FIG. 3 is an explanatory diagram of a third embodiment of the present invention, in which the tips of the leads 21 at the widened both ends of a package similar to that shown in FIG. is selectively narrowed so that it is approximately equal to . In other words, the width of the lead 21 excluding the tip is expanded. The widths of the widened portion and the narrowed portion are the same as in the previous embodiment. especially,
It is preferable that the notch for narrowing is provided on the outside of both leads 21. This makes the overall arrangement pitch of the leads 21 and 22 uniform, and there is no need to make any changes to the printed wiring pattern. That is, the semiconductor device of the present invention can be made compatible with conventional semiconductor devices. This advantage is due to the fact that the leads on both ends of a ceramic package as shown in Figure 2
It is also valid for 1.

FIG. 4 is an explanatory diagram of a fourth embodiment of the present invention, showing a structure in which external connection leads 2 similar to those in FIG. 1 are provided on four sides of the package. Even for such a package, expanding the width of the leads 21 at both ends is effective in preventing deformation, etc., and the tips of the leads 21 can be made similar to the embodiment shown in Fig. 3. Similarly, by making the width of the lead 22 narrow to be equal to the width of the lead 22 located inside, compatibility with conventional semiconductor devices can be achieved.

FIG. 5 is a diagram illustrating a fifth embodiment of the present invention, and shows a case where the present invention is applied to a so-called ZIP type package. That is, in the ZIP type package, for example, a plurality of external connection leads 6 arranged on one side of the resin layer 1 are alternately bent upside down. Among such leads 6, deformation can be prevented by expanding the width of the leads 61 at both ends. In addition, by making the tip of the lead 61 equal to that of the lead 62 located inside, the conventional Z
Like the leads of an IP type package, it can be inserted into a through hole on a printed wiring board.

FIG. 6 is an explanatory diagram of a sixth embodiment of the present invention, showing a structure in which slits are provided in the leads at both ends of the lead which are widened. In the same figure (a), among a plurality of leads 2 arranged in a straight line on one side of the package, slits are formed in the leads 21 at the widened ends of both sides, extending in a direction intersecting the direction in which the leads 2 are arranged. 7 is provided. Figure (b) shows the case where the slit 7 is divided into two along its extending direction. The same figure (c) is
This is a case where the slit 7 is provided in the widened part of the lead 21 whose tip end is narrowed in the embodiment shown in FIG.

Generally, the external connection lead 2 is formed by press working to form a curved shape as shown in FIG. 1 and the like. The widened leads 21 at both ends are as follows:
The yield stress is greater than that of the lead 22 located on the inner side. Therefore, after curve forming, these leads 21
In order to form the leads 21 so that they are aligned in a straight line, it is necessary to bend the leads 21 by a larger angle, but such a processing method is difficult in practice. As in the above embodiment, by providing the slit 7 in the widened lead 21, the lead 2 located on the inner side
2, and it becomes easy to arrange these leads 21 and 22 in a straight line. In other words, multiple leads, including the widened leads at both ends, can be curved without making any changes to the conventional pressing process. In addition, the above slit 7
For example, the width of the lead 21 is approximately 150 μm, assuming that the lead 21 with a thickness of 150 μm is expanded to twice the width of the lead 22.
That's about it.

[0015]

[Effects of the Invention] According to the present invention, the leads for external connection in a small package enclosing a semiconductor integrated circuit or a package enclosing a high-density integrated circuit are deformed by external force and misaligned with the printed wiring. This has the effect of reducing connection failures caused by.

[Brief explanation of the drawing]

[Figure 1] Structural principle diagram of the present invention

[Figure 2] Explanatory diagram of the second embodiment of the present invention

[Figure 3] Explanatory diagram of the third embodiment of the present invention

[Fig. 4] Explanatory diagram of the fourth embodiment of the present invention

[Fig. 5] Explanatory diagram of the fifth embodiment of the present invention

[Figure 6
] Explanatory diagram of the sixth embodiment of the present invention

[Figure 7] A perspective view showing an example of a resin molded package.

[Figure 8] Illustration of conventional problem investigation results

[Explanation of symbols]

1 Resin layer 2, 5 External connection leads 21, 51, 61 Leads on both ends 22, 5
2, 62, Lead located inside 3 Low melting point glass layer 4 Ceramic plate 7 Slit

Claims (3)

[Claims] Claim 1: An insulating member enclosing a chip on which an integrated circuit is formed, and external leads extending from one end electrically connected to the integrated circuit and extending through the insulating member and arranged in parallel to each other. a plurality of electrically conductive leads having a plurality of electrically conductive leads;
A semiconductor device characterized in that, regarding the leads of the group, the external lead-out portion is formed to have a wider width in a direction perpendicular to the extending direction than the leads of the second group located inside the group. 2. The semiconductor device according to claim 1, wherein tips of the first group of leads at the external lead-out portions are narrower than tips of the second group of leads. 3. A slit extending in a direction parallel to the extending direction is provided in the widened end portion of the first group of leads.
Or the semiconductor device according to 2.