JP2000294997A - Structure and method for connecting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a load from being applied to a pin connection part by displacement due to the exposion and shrinkage of each member after connection in the connection structure of electronic parts using an alignment member for aligning a plurality of pins for electrically connecting first and second members. SOLUTION: An aligning member 50 in the connection structure aligns a pin 20 at an outer peripheral part in the axial direction A, rotates it with the axial direction A as a reference for separating from the pin 20 and then is removed from the pin 20. In the aligning member 50, the ratio of the vertical and horizontal dimensional of a cross section for orthogonally crossing the axial direction A differs, a plurality of aligned grooves 51 for aligning the pin 20 to the side in the longitudinal dimensional direction in the cross section are formed. The grooves 51 are formed so that they become narrower from the side in the longitudinal dimension direction in the cross section as toward the center of the cross section.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a first member and a second member.
The present invention relates to a connection structure of an electronic component using an alignment member for aligning a plurality of pins for electrically connecting the member and a method of connecting the electronic component.

[0002]

2. Description of the Related Art As a connection structure of an electronic component which facilitates insertion of a pin by using an alignment member of this kind, for example, a connection structure disclosed in Japanese Patent Laid-Open No. 6-104600 has been proposed. This is because a lead (pin) extending from a connector (first member) side is aligned with an alignment plate (alignment member) made of an insulating material.
By making the lead portion hard to bend and further devising the alignment plate, it is possible to automatically insert the lead portion into the printed wiring board (second member).

[0003]

However, in the connection structure of the prior art described above, it is not easy to remove the alignment plate in the state after connection, so that the state is the same as when the pins are inserted. For example, in the above-mentioned conventional publication, the alignment plate remains as it is even after the lead portion (pin) is inserted into the printed wiring board. In the connection structure in which the alignment plate does not remain, even if a temperature change occurs, only stress due to expansion and contraction of the printed circuit board is applied to the pin connection portion. Such a problem arises. This problem will be described with reference to FIG.

FIG. 7A schematically shows a connection structure using a conventional alignment plate. An electronic component (element) 1 as a first member is mounted on a printed circuit board 30 as a second member.
0 is connected. FIG. 7B is an enlarged view of the connection portion viewed from the end face direction of the printed circuit board 30.
The alignment plate J1 has a plurality of insertion holes J3 aligned with a plate-shaped main body J2, and one end of the alignment plate J1 has a pin connection portion 4 of the electronic component 10.
The other ends of the plurality of pins 20 connected to the pins 0 are respectively inserted into the insertion holes J3 of the alignment plate J1 to be aligned, and are also inserted into the insertion holes (through holes) 31 of the printed circuit board 30 and soldered. The connection shown in FIG.

After each pin 20 is fixed, a displacement is applied to the pin connecting portion 40 due to expansion and contraction of the printed circuit board 30 due to a temperature change or the like. Further, the alignment plate J1 is also displaced by expansion and contraction due to a temperature change or the like. At this time,
Since the alignment plate J1 remains on the pins 20 and the effective length of the pins 20 is reduced, the printed board 30
And the pin joint 40 due to the expansion and contraction of the alignment plate J1.
Will amplify the stress applied to Further, if the displacement of the alignment plate J1 and the displacement of the printed board 30 are not properly adjusted, as shown in FIG.
Is pressed and bent, and a lot of stress is applied to the pin connecting portion 40, for example, stress is applied due to the rigidity of the pin 20.
Fatigue progresses rapidly. When the temperature change is repeated between high and low temperatures, a great deal of stress is caused, and the pin joint 40
This causes a problem of breakage.

Thus, the alignment plate J1 remaining after the connection is
This has a great relationship with the breakage of the pin connection portion 40. The same applies to the pin connection portion (the portion of the insertion hole 31) on the printed circuit board 30 side. However, on the other hand, it is difficult to insert the pins 20 into the printed circuit board 30 unless the pins 20 are aligned by the alignment plate J1. Also,
Adjustment and selection of the coefficient of thermal expansion depending on the material of the alignment plate has a great possibility of causing problems in cost and strength.

SUMMARY OF THE INVENTION In view of the above problems, the present invention relates to a connection structure for electronic parts using an alignment member for aligning a plurality of pins for electrically connecting a first member and a second member. An object is to prevent a load from being applied to a pin connection portion due to a displacement due to expansion and contraction of a member.

[0008]

SUMMARY OF THE INVENTION According to the present invention, the above-mentioned objects are provided.
The invention according to claim 1 is based on the fact that an alignment member for aligning the pins is generated because the pins remain as they were when the pins were inserted even after the pins were inserted into the printed circuit board. After aligning the pin (20) at the outer peripheral portion in the axial direction (A), the member (50) is rotated with reference to the axial direction (A) to be separated from the pin (20), and is separated from the pin (20). It is characterized by being removed.

Thus, the alignment member (50) which becomes unnecessary after the pins (20) are connected to the printed circuit board (30).
Can be easily provided from the pin (20). Therefore,
Even when the printed circuit board (30) expands or contracts due to a temperature change or the like, the force applied to the pin connection portion (40) can be suppressed, and the pin connection portion (40) is prevented from being damaged. Can be.

[0010] More specifically, the alignment member (50) has a different ratio of a vertical dimension to a horizontal dimension in a cross section orthogonal to the axial direction (A), as in the second aspect of the present invention. May be formed with a plurality of aligned grooves (51) for aligning the pins (20) on the side in the longitudinal dimension direction. The invention according to claim 3 is characterized in that the groove (51) is formed so as to become narrower from the side in the longitudinal dimension direction in the transverse section toward the center of the transverse section.

This makes it possible to more accurately align the pins (20). Further, the invention according to claim 4 is an invention of a method for manufacturing an electronic component, wherein one end side is the first side.
Aligning the plurality of pins (20) connected to the member (10) at the outer periphery in the axial direction (A) of the alignment member (50), and connecting the other end of the pin (20) to the second member. Connecting to the member (30), rotating the alignment member (50) with respect to the axial direction (A) to separate from the pin (20), and removing the alignment member (50) from the pin (20) And characterized in that:

According to this, it is possible to provide the electronic component connection structure according to the first aspect, and even if the printed circuit board (30) expands or contracts due to a temperature change or the like, the pin connection portion ( The force applied to the pin connection (40) can be suppressed, and damage to the pin connection portion (40) can be prevented. It should be noted that reference numerals in parentheses of the above-described units are examples showing the correspondence with specific units described in the embodiments described later.

[0013]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing a first embodiment of the present invention. (First Embodiment) In this embodiment, an electronic device is arranged such that the other ends of a plurality of pins having one ends connected to a first member are aligned using an alignment member and connected to a second member. It relates to the connection structure of parts. In this embodiment,
The first member is an electronic component for mounting on a printed circuit board (for example, S
IP or semiconductor element), and the second member is a printed circuit board.

Hereinafter, a configuration of a connection structure for electronic components to which the present embodiment is applied will be described with reference to FIGS.
FIG. 1 shows a state in which the pins 20 aligned by the alignment plate 50 are connected to the printed circuit board 30, and FIG.
0 shows the configuration of a single unit. 3A shows a state where the pins 20 are aligned by the alignment plate 50, FIG. 3B shows a state where the alignment plate 50 is rotated, and FIG.
(B) as viewed from the X direction. In FIG. 3, the cross section of the alignment plate 50 is made elliptical for convenience.

As shown in FIG. 1, a pin connection portion 40 is formed on the electronic component 10, and one end side of the plurality of pins 20 is electrically connected to the pin connection portion 40. The other end of the pin 20 includes a plurality of first row pins 21 (front side in FIG. 1) and a plurality of second row pins 22 parallel to the first row pin 21.
(The back side in FIG. 1). The other end of the pin 20 is inserted into a through hole (through hole) 31 formed in the printed circuit board 30 and connected to the printed circuit board 30 by soldering.

An alignment plate 50 for aligning the pins 20
Since it is a jig, it is formed of a material such as resin or ceramic which has high mechanical strength and excellent durability. The alignment plate 50 is configured such that the ratio of the vertical dimension to the horizontal dimension of a cross section orthogonal to the axial direction A is different. In the present embodiment, a plate-like member having a rectangular cross section shown in FIG. 2 is used as the alignment plate 50.

As shown in FIGS. 1 and 2, a plurality of grooves 51 for aligning the pins 20 are formed on the side in the longitudinal direction in the cross section of the alignment plate 50. The groove 51 is formed in accordance with the interval between the pins 20 to be aligned. The number of the grooves 51 is required to be at least equal to the number of the pins 20 to be aligned, but may be formed more than the number of the pins. The longitudinal dimension m of the cross section is formed to be longer than the distance w between the first row side pin 21 and the second row side pin 22 as shown in FIG. Also, as shown in FIG.
The lateral dimension n is configured to be shorter than the interval w between the pins, and the longitudinal dimension m is configured to be shorter than the effective pin length h.

Hereinafter, a method for connecting electronic components according to the present embodiment will be described with reference to FIG. FIG. 4 shows the connecting process of the electronic components in order. 4, the cross section of the alignment member 50 is made elliptical for convenience similarly to FIG.
First, the electronic component 1 in which one ends of a plurality of pins 20 are connected.
0, a printed circuit board 30 and an alignment plate 50 are prepared (FIG. 4A). At this time, the other end of the pin 20 is formed to bend slightly inward.

Next, the alignment plate 50 is held between the first row side pins 21 and the second row side pins 22 while the longitudinal dimension of the cross section is held perpendicular to the printed circuit board 30. Insert (FIG. 4B). Next, the alignment plate 50 is rotated by 90 ° with respect to the axial direction (the direction of the front and back of the paper) (FIG. 4).
(C)). Thus, the pins 20 are fitted into the grooves 51 formed on the side of the alignment plate 50 and aligned.

Next, the other end of the aligned pins 20 is inserted into the through hole 31 of the printed circuit board 30 (FIG. 4).
(D)). Next, the alignment plate 50 is again rotated by 90 ° with respect to the axial direction (FIG. 4E). As a result, the alignment plate 50 is separated from the pins 20, and a gap is formed between the alignment plate 50 and the pins 20.

Next, the alignment plate 5 protruding from the pin 20
By pinching the knob 52 of 0, the alignment plate 50 is pulled out from between the first row side pin 21 and the second row side pin 22 in parallel with the printed circuit board 30 (FIG. 4 (f)). Thus, the alignment plate 50 can be completely removed from the pins 20. At this time, since the pin 20 is formed to bend slightly inward, the pin 20 is fixed while being inserted into the through hole 31.

Finally, the other end of the pin 20 and the through hole 31 are connected by soldering. This allows
The electronic component 10 and the printed circuit board 30 are electrically connected by a plurality of pins 20. As described above, according to the present embodiment, after connecting the other end of the pin 20 to the printed circuit board 30, the alignment plate 50 can be easily removed from the pin 20. Thereby, the effective length h of the pin 20 is increased, and even when the printed circuit board 30 expands or contracts due to a temperature change or the like, it is possible to minimize the influence on the pin connection portion 40. Become. (Other Embodiments) In the above embodiment, the grooves 51 are formed alternately on both sides of the alignment plate 50. However, the present invention is not limited to this. As shown in FIG. May be formed such that the grooves 51 are symmetrically positioned on both sides of the groove. With such a configuration, the pins 20 can be aligned regardless of whether the alignment plate 50 is rotated left or right with respect to the axial direction A, and the mounting efficiency can be improved.

In the above embodiment, the shape of the cross section orthogonal to the axial direction A of the alignment plate 50 is rectangular, but the present invention is not limited to this, and the configuration is such that the ratio of the vertical dimension to the horizontal dimension of the horizontal section is different. For example, the cross section may be a rhombus or an ellipse as shown in FIG. When the cross section is made elliptical in this manner, when the pins 20 are aligned, the area facing the pins 20 is reduced, the pins 20 can be smoothly aligned, and the pins 20 are largely bent. It is possible to accurately align the pins even when the pins are large.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of a connection structure of an electronic component to which the present invention is applied.

FIG. 2 is an enlarged perspective view of an alignment plate in the electronic component connection structure of FIG. 1;

FIG. 3 is a process diagram showing an outline of a connection procedure in the connection structure for electronic components in FIG. 1;

FIG. 4 is a process diagram showing a connection procedure in the connection structure of the electronic component in FIG. 1;

FIG. 5 is a modified example of the alignment plate.

FIG. 6 is a modified example of the alignment plate.

FIG. 7A is a perspective view showing a connection structure of a conventional electronic component, and FIG. 7B is a side view thereof.

[Explanation of symbols]

Reference numeral 10: electronic component (first member), 20: pin, 30: printed circuit board (second member), 50: alignment plate (alignment member).

Claims (4)

[Claims] The other end of a plurality of pins (20), one end of which is connected to a first member (10), is connected to an alignment member (50).
A connection structure for electronic components, which is arranged by using an electronic component and connected to a second member (30), wherein the alignment member (50) has an outer peripheral portion in an axial direction (A). ), After being aligned, is rotated about the axial direction (A) to separate from the pin (20), and is removed from the pin (20). 2. The alignment member (50) has a different ratio of a vertical dimension to a horizontal dimension in a cross section orthogonal to the axial direction (A), and the pin (2) is provided laterally in a longitudinal dimension direction in the cross section.
2. The connection structure for an electronic component according to claim 1, wherein a plurality of aligned grooves (51) for aligning (0) are formed. 3. The groove (51) is formed so as to become narrower from a side in a longitudinal dimension direction of the cross section toward a center of the cross section.
Or the connection structure of the electronic component of 2. 4. A step of aligning a plurality of pins (20), one end of which is connected to the first member (10), at an outer peripheral portion in the axial direction (A) of the alignment member (50); A step of connecting the other end of the pin (20) to the second member (30); a step of rotating the alignment member (50) with respect to the axial direction (A) to separate from the pin (20); Removing the alignment member (50) from the pin (20).