JP4810884B2 - Divided blade type unit - Google Patents

Divided blade type unit Download PDF

Info

Publication number
JP4810884B2
JP4810884B2 JP2005150725A JP2005150725A JP4810884B2 JP 4810884 B2 JP4810884 B2 JP 4810884B2 JP 2005150725 A JP2005150725 A JP 2005150725A JP 2005150725 A JP2005150725 A JP 2005150725A JP 4810884 B2 JP4810884 B2 JP 4810884B2
Authority
JP
Japan
Prior art keywords
blade
support plate
lower support
molds
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005150725A
Other languages
Japanese (ja)
Other versions
JP2006332167A (en
Inventor
涼太 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP2005150725A priority Critical patent/JP4810884B2/en
Publication of JP2006332167A publication Critical patent/JP2006332167A/en
Application granted granted Critical
Publication of JP4810884B2 publication Critical patent/JP4810884B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Description

本発明は、プリント基板を切断により基板単体に分割する基板分割刃型ユニットに関するものである。   The present invention relates to a substrate dividing blade type unit that divides a printed circuit board into single substrates by cutting.

図３に示すように、基板分割装置３０は、上下の刃型３１、３２と、これら刃型３１、３２を平行かつ近接離間自在に支持する上下の支持盤３３、３４とを備えて構成されており、刃型３１、３２間にプリント基板（図示せず）を挟んで基板単体に分割するように構成されている。上下の刃型３１、３２はそれぞれ平面視略矩形状に形成されており、四隅を支持盤３３、３４にボルト３５にて固定されている。   As shown in FIG. 3, the substrate dividing apparatus 30 includes upper and lower blade molds 31 and 32 and upper and lower support plates 33 and 34 that support the blade molds 31 and 32 in a parallel, close and separable manner. The printed circuit board (not shown) is sandwiched between the blade dies 31 and 32 so as to be divided into single boards. The upper and lower blade molds 31 and 32 are each formed in a substantially rectangular shape in plan view, and their four corners are fixed to the support boards 33 and 34 with bolts 35.

特開平８−１４１９９８号公報JP-A-8-141998

ところで、刃型３１、３２は、上下別々にボルト３５にて固定するものであるため、位置決め、段取り替えに手間と時間がかかるという課題があった。   By the way, since the blade dies 31 and 32 are fixed separately by the bolts 35 at the upper and lower sides, there is a problem that it takes time and effort to position and change the setup.

そこで、本発明の目的は、上記課題を解決し、刃型の位置決めと、段取り替えを容易に、かつ、短時間で行うことができる基板分割刃型ユニットを提供することにある。   SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems and to provide a substrate split blade type unit that can easily perform positioning and changeover of a blade mold in a short time.

上記課題を解決するために本発明は、プリント基板を切断により基板単体に分割する上下の刃型を保持するための基板分割刃型ユニットにおいて、上下の支持盤を開閉自在に連結すると共にその上下の支持盤にスライド自在に刃型を設け、上下いずれか一方の刃型に、先細の位置決めピンを設け、他方の刃型に、上記位置決めピンをガイドして挿入させる位置決め穴を形成し、上下の支持盤を開閉自在に連結する連結部材は、上部支持盤と下部支持盤を回動自在に連結する軸部と、上部支持盤と下部支持盤を近接離間させるスライド部とを有するものである。 In order to solve the above-mentioned problems, the present invention relates to a substrate dividing blade type unit for holding an upper and lower blade mold that divides a printed circuit board into single substrates by connecting the upper and lower support plates in an openable and closable manner. A blade is slidably provided on the support plate, a tapered positioning pin is provided on one of the upper and lower blades, and a positioning hole is formed on the other blade to guide and insert the positioning pin. The connecting member for connecting the support plate in an openable and closable manner has a shaft portion for rotatably connecting the upper support plate and the lower support plate, and a slide portion for bringing the upper support plate and the lower support plate close to and away from each other. .

上部支持盤と下部支持盤には、上記刃型をスライド自在に支持するガイドレールが形成されるとよい。   The upper support plate and the lower support plate may be provided with guide rails that slidably support the blade mold.

本発明によれば、刃型の位置決めと、段取り替えを容易に、かつ、短時間で行うことができる。   According to the present invention, positioning of the blade mold and changeover can be performed easily and in a short time.

図１（ａ）に示すように、基板分割刃型ユニット１は、上下の支持盤２、３と、これら支持盤２、３にそれぞれスライド自在に設けられる刃型４、５とを備えて構成されており、図示しないプレス機のプレス台上に設置されるようになっている。上下の支持盤２、３は連結部材７を介して回動自在かつ近接離間自在に連結されている。連結部材７は、上部支持盤２と下部支持盤３を回動自在に連結する軸部９と、上部支持盤２と下部支持盤３を近接離間させるスライド部８とを有する。スライド部８は、ピストン状に伸縮自在に形成されており、連結部材７の軸部９と支持盤２、３との間に介設されている。スライド部８は、上部支持盤２と下部支持盤３とを離間させるように弾発付勢するものであり、上部支持盤２と下部支持盤３とを軸部９回りに回動させて閉じたとき、図１（ｂ）に示すように、互いに離間した状態で平行にするようになっている。そして、上部支持盤２と下部支持盤３とが互いに離間して平行となっているとき、上部支持盤２と下部支持盤３とに互いに近接させる力を加えることでスライド部８が縮退し、図１（ｃ）に示すように、上部支持盤２と下部支持盤３とが平行な姿勢のまま近接するようになっている。   As shown in FIG. 1 (a), the substrate dividing blade type unit 1 includes upper and lower support plates 2 and 3 and blade types 4 and 5 that are slidably provided on the support plates 2 and 3, respectively. It is installed on a press stand of a press machine (not shown). The upper and lower support plates 2 and 3 are connected via a connecting member 7 so as to be rotatable and close to and away from each other. The connecting member 7 includes a shaft portion 9 that rotatably connects the upper support plate 2 and the lower support plate 3, and a slide portion 8 that moves the upper support plate 2 and the lower support plate 3 close to and away from each other. The slide portion 8 is formed in a piston shape so as to be extendable and contracted, and is interposed between the shaft portion 9 of the connecting member 7 and the support plates 2 and 3. The slide portion 8 is elastically biased so as to separate the upper support plate 2 and the lower support plate 3, and is closed by rotating the upper support plate 2 and the lower support plate 3 around the shaft portion 9. In this case, as shown in FIG. 1 (b), they are parallel to each other while being separated from each other. When the upper support plate 2 and the lower support plate 3 are spaced apart and parallel to each other, the slide portion 8 is degenerated by applying a force to bring the upper support plate 2 and the lower support plate 3 close to each other, As shown in FIG. 1C, the upper support plate 2 and the lower support plate 3 are brought close to each other in a parallel posture.

図１（ａ）及び図２に示すように、上部支持盤２と下部支持盤３とには、それぞれ刃型４、５をスライド自在に支持するためのガイドレール１０が形成されている。ガイドレール１０は、支持盤２、３の開閉端側から回動中心側へ延びるように形成されており、開閉端側の端から刃型４、５を挿抜するように形成されている。また、ガイドレール１０は、支持盤２、３の両側に断面コ字状の溝１１を互いに開口を向かい合わせるようにして形成されており、ガイドレール１０間に支持盤２、３を支持するようになっている。また特に、溝１１を区画する面のうち、刃型４、５の裏面（図示せず）に当接される受面２０は、幅広に形成されており、プリント基板切断時の反力を広い面積で安定して受けるようになっている。ガイドレール１０には、刃型４、５のスライドを止めるためのストッパ１２が設けられている。   As shown in FIGS. 1A and 2, the upper support plate 2 and the lower support plate 3 are respectively formed with guide rails 10 for slidably supporting the blade dies 4 and 5. The guide rail 10 is formed so as to extend from the open / close end side of the support plates 2 and 3 to the rotation center side, and is formed so that the blade dies 4 and 5 are inserted and extracted from the end of the open / close end side. The guide rail 10 is formed with grooves 11 having a U-shaped cross section on both sides of the support plates 2 and 3 so that the openings face each other so that the support plates 2 and 3 are supported between the guide rails 10. It has become. In particular, the receiving surface 20 that is in contact with the back surfaces (not shown) of the blade dies 4 and 5 among the surfaces that define the grooves 11 is formed wide so that the reaction force when cutting the printed circuit board is wide. It is designed to receive a stable area. The guide rail 10 is provided with a stopper 12 for stopping the sliding of the blade dies 4 and 5.

また、下部支持盤３には、上部支持盤２を弾発的に受けるためのスプリング１３が設けられており、接近する上部支持盤２の勢いを吸収して柔軟に受けるようになっている。   The lower support plate 3 is provided with a spring 13 for elastically receiving the upper support plate 2 so as to absorb the momentum of the approaching upper support plate 2 and receive it flexibly.

刃型４、５は、ガイドレール１０に係合される凸部１４を有する。凸部１４は刃型４、５の両側にそれぞれ形成されており、ガイドレール１０に遊嵌されるようになっている。すなわち、凸部１４はガイドレール１０の溝１１よりも若干小さく形成されており、ガイドレール１０の延長方向のみならず、側方にも若干スライド可能となっている。また、上側の刃型４には、テーパ加工で先細に形成された位置決めピン１５が下側の刃型５に向くように設けられており、下側の刃型５には、位置決めピン１５をガイドして挿入させる位置決め穴１６が形成されている。位置決めピン１５は、刃型４、５のいずれの切断刃１７よりも長く形成されており、切断刃１７に先行して位置決め穴１６内に挿入されるようになっている。位置決め穴１６は、位置決めピン１５をほとんど遊びのない状態で挿入するサイズ（径）に形成されている。また、上下の刃型４、５には、それぞれ挿抜方向後端に取っ手１８が設けられており、取っ手１８を持って挿入方向前端をガイドレール１０間に位置させることで、両側の凸部１４をそれぞれガイドレール１０の溝１１内に挿入できるようになっている。   The blade molds 4, 5 have convex portions 14 that are engaged with the guide rail 10. The convex portions 14 are formed on both sides of the blade molds 4 and 5, respectively, and are loosely fitted to the guide rail 10. That is, the convex portion 14 is formed to be slightly smaller than the groove 11 of the guide rail 10, and can be slightly slid not only in the extending direction of the guide rail 10 but also to the side. The upper blade mold 4 is provided with a positioning pin 15 that is tapered by taper so as to face the lower blade mold 5. The lower blade mold 5 is provided with a positioning pin 15. A positioning hole 16 to be inserted by guiding is formed. The positioning pin 15 is formed longer than any of the cutting blades 17 of the blade molds 4 and 5, and is inserted into the positioning hole 16 prior to the cutting blade 17. The positioning hole 16 is formed in a size (diameter) into which the positioning pin 15 is inserted with almost no play. The upper and lower blade dies 4 and 5 are each provided with a handle 18 at the rear end in the insertion / extraction direction. By holding the handle 18 and positioning the front end in the insertion direction between the guide rails 10, the convex portions 14 on both sides are provided. Can be inserted into the groove 11 of the guide rail 10.

次に本実施の形態の作用を述べる。   Next, the operation of this embodiment will be described.

刃型４、５の段取り替えをする場合、図２に示すように上部支持盤２を上方に回動させて基板分割刃型ユニット１を開き、既設の刃型４、５の取っ手１８を引く。これにより、刃型４、５を支持盤２、３から容易に引き抜くことができる。この後、図２に示すように、新たな刃型４、５を両側のガイドレール１０に係合させる。このとき、刃型４、５の取っ手１８を持って挿入方向前端側の凸部１４をそれぞれガイドレール１０の位置に合わせることで容易にガイドレール１０間に挿入することができる。   When replacing the blade dies 4 and 5, as shown in FIG. 2, the upper support board 2 is rotated upward to open the substrate dividing blade die unit 1, and the handle 18 of the existing blade dies 4 and 5 is pulled. . Thereby, the blade molds 4 and 5 can be easily pulled out from the support plates 2 and 3. Thereafter, as shown in FIG. 2, new blade dies 4, 5 are engaged with the guide rails 10 on both sides. At this time, it is possible to easily insert between the guide rails 10 by holding the handles 18 of the blade dies 4 and 5 and aligning the convex portions 14 on the front end side in the insertion direction with the positions of the guide rails 10.

図１（ａ）に示すように、上下の支持盤２、３にそれぞれ刃型４、５を係合させたら、上部支持盤２を軸部９回りに下方に回動させて基板分割刃型ユニット１を閉じる。図１（ｂ）に示すように、上部支持盤２と下部支持盤３とは平行な姿勢で離間された状態となり、段取り替えの作業は完了となる。   As shown in FIG. 1A, when the blade molds 4 and 5 are engaged with the upper and lower support plates 2 and 3, respectively, the upper support plate 2 is rotated downward around the shaft portion 9 to divide the substrate. Close unit 1. As shown in FIG. 1B, the upper support plate 2 and the lower support plate 3 are separated in a parallel posture, and the setup change operation is completed.

この後、下部支持盤３上の刃型５に分割すべきプリント基板（図示せず）をセットし、図示しないプレス機で上部支持盤２を下方にプレスすると、図１（ｃ）に示すように、連結部材７のスライド部８が縮んで上部支持盤２と下部支持盤３とが近接される。このとき、位置決めピン１５がいずれの切断刃１７よりも先に位置決め穴１６内に挿入される。位置決めピン１５が位置決め穴１６内に入るとき、位置決めピン１５は必ずしも位置決め穴１６と同軸上にはないが、先細に形成されているため多少ずれていても位置決め穴１６内に入る。位置決めピン１５と位置決め穴１６の軸がずれている場合、位置決めピン１５はテーパ状に形成された外周面１９を位置決め穴１６の開口縁に当接され、位置決め穴１６の開口縁を径方向（水平方向）に押す。それぞれの刃型４、５はガイドレール１０に沿って水平方向に微動され、位置決めピン１５と位置決め穴１６とが同軸上となる。これにより、上下の刃型４、５が自動的に位置決めされる。この後更に上下の刃型４、５が接近することで、プリント基板に切断刃１７が当たり、プリント基板が正確に分割されることとなる。   Thereafter, a printed circuit board (not shown) to be divided is set in the blade mold 5 on the lower support board 3, and when the upper support board 2 is pressed downward by a press machine (not shown), as shown in FIG. 1 (c). Further, the slide portion 8 of the connecting member 7 is contracted to bring the upper support plate 2 and the lower support plate 3 close to each other. At this time, the positioning pin 15 is inserted into the positioning hole 16 before any of the cutting blades 17. When the positioning pin 15 enters the positioning hole 16, the positioning pin 15 is not necessarily coaxial with the positioning hole 16, but enters the positioning hole 16 even if it is slightly deviated because it is tapered. When the axes of the positioning pin 15 and the positioning hole 16 are shifted, the positioning pin 15 is brought into contact with the opening edge of the positioning hole 16 on the outer peripheral surface 19 formed in a taper shape, and the opening edge of the positioning hole 16 is in the radial direction ( Press horizontally. The respective blade dies 4 and 5 are finely moved in the horizontal direction along the guide rail 10 so that the positioning pins 15 and the positioning holes 16 are coaxial. Thereby, the upper and lower blade molds 4 and 5 are automatically positioned. Thereafter, when the upper and lower blade molds 4 and 5 further approach, the cutting blade 17 hits the printed circuit board, and the printed circuit board is accurately divided.

このように、上下の支持盤２、３を開閉自在に連結すると共にその上下の支持盤２、３にスライド自在に刃型４、５を設け、上下いずれか一方の刃型４に、先細の位置決めピン１５を設け、他方の刃型５に、位置決めピン１５をガイドして挿入させる位置決め穴１６を形成したため、支持盤２、３に刃型４、５を設けるときの刃型４、５の位置決めを省略することができ、刃型４、５同士を接近させるだけで位置決めピン１５と位置決め穴１６との軸が合って刃型４、５同士の位置決めを行うことができ、刃型４、５の位置決めと、段取り替えを容易に短時間で行うことができる。そして、従来段取り替えに約３０分間を要していたものを、約１分間に短縮できる。   In this way, the upper and lower support plates 2 and 3 are connected to be freely opened and closed, and the upper and lower support plates 2 and 3 are slidably provided with the blade dies 4 and 5, and the upper and lower blade dies 4 are tapered. Since the positioning pin 15 is provided and the positioning hole 16 in which the positioning pin 15 is guided and inserted is formed in the other blade mold 5, the blade molds 4 and 5 when the blade molds 4 and 5 are provided in the support boards 2 and 3 are provided. Positioning can be omitted, and by simply bringing the blade dies 4 and 5 close to each other, the axes of the positioning pins 15 and the positioning holes 16 can be aligned so that the blade dies 4 and 5 can be positioned. 5 positioning and changeover can be easily performed in a short time. And what conventionally required about 30 minutes for setup change can be shortened to about 1 minute.

また、上下の支持盤２、３を開閉自在に連結する連結部材７は、上部支持盤２と下部支持盤３を回動自在に連結する軸部９と、上部支持盤２と下部支持盤３を近接離間させるスライド部８とを有するものとしたため、簡易な構造で容易に上下支持盤２、３を開閉させることができると共に、互いに平行な姿勢で近接離間させることができる。   The connecting member 7 that connects the upper and lower support plates 2 and 3 so as to be freely opened and closed includes a shaft portion 9 that rotatably connects the upper support plate 2 and the lower support plate 3, and the upper support plate 2 and the lower support plate 3. Therefore, the upper and lower support plates 2 and 3 can be easily opened and closed with a simple structure, and can be moved close to and away from each other in a parallel posture.

上部支持盤２と下部支持盤３には、刃型４、５をスライド自在に支持するガイドレール１０が形成されるものとしたため、簡易な構造で確実に刃型４、５をスライド自在に支持することができる。   Since the upper support plate 2 and the lower support plate 3 are formed with guide rails 10 for supporting the blade dies 4 and 5 slidably, the blade dies 4 and 5 are slidably supported with a simple structure. can do.

なお、上側の刃型４に位置決めピン１５を設け、下側の刃型５に位置決め穴１６を設けるものとしたが、逆に上側の刃型４に位置決め穴１６を設け、下側の刃型５に位置決めピン１５を設けるものとしてもよい。   Although the positioning pin 15 is provided on the upper blade mold 4 and the positioning hole 16 is provided on the lower blade mold 5, the positioning blade 16 is provided on the upper blade mold 4. 5 may be provided with positioning pins 15.

また、スプリング１３は下部支持盤３に設けるものとしたが、上部支持盤２に設けてもよい。また、スプリング１３は上下の刃型４、５の勢いを緩和する緩衝手段であればよく、ウレタンやスポンジ、ゴム等であってもよい。   Further, although the spring 13 is provided on the lower support board 3, it may be provided on the upper support board 2. Further, the spring 13 may be a buffer means for relaxing the momentum of the upper and lower blade molds 4, 5, and may be urethane, sponge, rubber or the like.

本発明の好適実施の形態を示す基板分割刃型ユニットの側面図であり、（ａ）は開かれた状態を示し、（ｂ）は閉じられた状態示し、（ｃ）は基板を分割している状態を示す。It is a side view of the board | substrate division | segmentation blade type | mold unit which shows suitable embodiment of this invention, (a) shows the open state, (b) shows the closed state, (c) divides the board | substrate. Indicates the state. 下部支持盤に刃型を装着する状態の概略斜視図である。It is a schematic perspective view of the state which mounts a blade type | mold on a lower support board. 従来の基板分割装置の要部斜視図である。It is a principal part perspective view of the conventional board | substrate division | segmentation apparatus.

符号の説明Explanation of symbols

１ 基板分割刃型ユニット
２ 上部支持盤
３ 下部支持盤
４ 刃型
５ 刃型
７ 連結部材
８ スライド部
１０ ガイドレール
１５ 位置決めピン
１６ 位置決め穴
DESCRIPTION OF SYMBOLS 1 Substrate division | segmentation blade type unit 2 Upper support board 3 Lower support board 4 Blade type 5 Blade type 7 Connecting member 8 Slide part 10 Guide rail 15 Positioning pin 16 Positioning hole

Claims (2)

プリント基板を切断により基板単体に分割する上下の刃型を保持するための基板分割刃型ユニットにおいて、上下の支持盤を開閉自在に連結すると共にその上下の支持盤にスライド自在に刃型を設け、上下いずれか一方の刃型に、先細の位置決めピンを設け、他方の刃型に、上記位置決めピンをガイドして挿入させる位置決め穴を形成し、
上下の支持盤を開閉自在に連結する連結部材は、上部支持盤と下部支持盤を回動自在に連結する軸部と、上部支持盤と下部支持盤を近接離間させるスライド部とを有することを特徴とする基板分割刃型ユニット。 In the board split blade type unit for holding the upper and lower blade molds that divide the printed circuit board into single substrates by cutting, the upper and lower support boards are connected openably and closably and the upper and lower support boards are provided with slidable blade molds In addition, a tapered positioning pin is provided in one of the upper and lower blade molds, and a positioning hole is formed in the other blade mold to guide and insert the positioning pin .
The connecting member that connects the upper and lower support plates so as to be openable and closable includes a shaft portion that rotatably connects the upper support plate and the lower support plate, and a slide portion that moves the upper support plate and the lower support plate close to and away from each other. A featured board split blade unit. 上部支持盤と下部支持盤には、上記刃型をスライド自在に支持するガイドレールが形成された請求項１記載の基板分割刃型ユニット。 2. The substrate dividing blade unit according to claim 1, wherein a guide rail for slidably supporting the blade mold is formed on the upper support plate and the lower support plate .
JP2005150725A 2005-05-24 2005-05-24 Divided blade type unit Expired - Fee Related JP4810884B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005150725A JP4810884B2 (en) 2005-05-24 2005-05-24 Divided blade type unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005150725A JP4810884B2 (en) 2005-05-24 2005-05-24 Divided blade type unit

Publications (2)

Publication Number Publication Date
JP2006332167A JP2006332167A (en) 2006-12-07
JP4810884B2 true JP4810884B2 (en) 2011-11-09

Family

ID=37553574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005150725A Expired - Fee Related JP4810884B2 (en) 2005-05-24 2005-05-24 Divided blade type unit

Country Status (1)

Country Link
JP (1) JP4810884B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111069478B (en) * 2019-12-30 2021-09-03 金鹏飞 Many specifications diode pin cutting device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2609214B2 (en) * 1993-05-12 1997-05-14 ダイワ電機精工株式会社 Circuit board dividing method and circuit board dividing mold
JP2714556B2 (en) * 1993-05-18 1998-02-16 北陸電気工業株式会社 Circuit board dividing mold driving method and circuit board dividing apparatus
JPH10112572A (en) * 1996-10-07 1998-04-28 Kokusai Electric Co Ltd Attaching jig apparatus for dividing board
JP2000127098A (en) * 1998-10-23 2000-05-09 Sony Corp Printed circuit board splitting device
JP3807710B2 (en) * 1999-09-02 2006-08-09 株式会社浅野研究所 Trimming device and lower table of trimming device

Also Published As

Publication number Publication date
JP2006332167A (en) 2006-12-07

Similar Documents

Publication Publication Date Title
US9480182B2 (en) Cable management arm
US20120181737A1 (en) Positioning fixture
CN101377702A (en) Data memory fixing device
CN111113098B (en) Positioning mechanism for drilling automobile brake pad
KR101986494B1 (en) Clamping apparatus and machining apparatus using the same
WO2022262205A1 (en) Quick-release hard disk bracket
JP4810884B2 (en) Divided blade type unit
CN103815681B (en) Drawer type workbox
EP3041329A1 (en) Cable management arm
KR101363450B1 (en) Press apparatus for flexible printed circuit board
JP5772603B2 (en) Switching hub device and connector lock release tool
DE202017106391U1 (en) Press for a casting machine and casting machine
KR20160076768A (en) Flask for casting mold
KR100895755B1 (en) Sheet pattern molding appartus
CN214981127U (en) Material positioning and clamping device and turnover manipulator
CN102310368B (en) Gripper jaw
CN105690630A (en) Device for reworking an injection-molded component and arrangement with multiple devices
CN207806315U (en) Perforating device
CN111044880A (en) Integrated circuit test fixture
CN215218736U (en) Laboratory harmful gas monitoring devices
WO2014038523A1 (en) Holding jig, printing device and printing method
CN205363656U (en) Processing revolving stage
CN204800907U (en) Quick installation and mould of dismantling oblique top
CN216419961U (en) Side opening door structure of infiltration workpiece frame
CN217176177U (en) Locking and separating device for drawer lock

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080516

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110301

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110325

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110726

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110808

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140902

Year of fee payment: 3

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees