JPS607997U - Punching mold for printed circuit board - Google Patents

Punching mold for printed circuit board

Info

Publication number
JPS607997U
JPS607997U JP9851583U JP9851583U JPS607997U JP S607997 U JPS607997 U JP S607997U JP 9851583 U JP9851583 U JP 9851583U JP 9851583 U JP9851583 U JP 9851583U JP S607997 U JPS607997 U JP S607997U
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
punching mold
punch
punching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9851583U
Other languages
Japanese (ja)
Inventor
永岡　英紀
正信 小笠原
Original Assignee
松下電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電工株式会社 filed Critical 松下電工株式会社
Priority to JP9851583U priority Critical patent/JPS607997U/en
Publication of JPS607997U publication Critical patent/JPS607997U/en
Pending legal-status Critical Current

Links

Landscapes

  • Punching Or Piercing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図イ、咀ま従来例、第２図イ〜ハは本考案の第１実
施例で、イは各パンチを正面から見た説明図、口、ハは
動作状態を示す説明図、第３図は本考案の第２実施例、
第４図、第５図および第６図はそれぞれ同第３、第４の
よび第５実施例、第７図は本考案が適用された積層板打
抜金型の全体説明図である。 １・・・・・・パンチ、１ａ〜１ｅ・・・・・・切部、
２・・・・・・積層板。 第５図 第６図 １　　　１　　　１Figure 1A shows a conventional masticating example; Figures 2A to 2C show the first embodiment of the present invention; A is an explanatory diagram of each punch seen from the front; Figure 3 shows the second embodiment of the present invention.
4, 5, and 6 are the third, fourth, and fifth embodiments, respectively, and FIG. 7 is an overall explanatory diagram of a laminate punching die to which the present invention is applied. 1... Punch, 1a to 1e... Cutting section,
2... Laminated board. Figure 5 Figure 6 1 1 1

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パンチを有し、このパンチを介しプリント回路板の如き
積層板に穴抜きを行うものにおいて、互いに離間して配
列された複数個の各パンチの先端部に突部を形成し、か
つ前記パンチを前記突部が対向するように配ダｌルたこ
とを特徴とするプリント回路板用打抜金型。In an apparatus having a punch and punching a hole in a laminated board such as a printed circuit board through this punch, a protrusion is formed at the tip of each of a plurality of punches arranged at a distance from each other, and the punch is A punching die for a printed circuit board, characterized in that the protrusions are arranged so as to face each other.
JP9851583U 1983-06-24 1983-06-24 Punching mold for printed circuit board Pending JPS607997U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9851583U JPS607997U (en) 1983-06-24 1983-06-24 Punching mold for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9851583U JPS607997U (en) 1983-06-24 1983-06-24 Punching mold for printed circuit board

Publications (1)

Publication Number Publication Date
JPS607997U true JPS607997U (en) 1985-01-19

Family

ID=30233858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9851583U Pending JPS607997U (en) 1983-06-24 1983-06-24 Punching mold for printed circuit board

Country Status (1)

Country Link
JP (1) JPS607997U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06320496A (en) * 1993-05-12 1994-11-22 Daiwa Denki Seiko Kk Method for dividing circuit substrate and mold therefor
JP2003322184A (en) * 2002-05-09 2003-11-14 Nsk Warner Kk Method and device for manufacturing frictional disc
JP2010167540A (en) * 2009-01-23 2010-08-05 Nippon Mektron Ltd Punch die

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315393B2 (en) * 1972-03-31 1978-05-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315393B2 (en) * 1972-03-31 1978-05-24

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06320496A (en) * 1993-05-12 1994-11-22 Daiwa Denki Seiko Kk Method for dividing circuit substrate and mold therefor
JP2003322184A (en) * 2002-05-09 2003-11-14 Nsk Warner Kk Method and device for manufacturing frictional disc
JP2010167540A (en) * 2009-01-23 2010-08-05 Nippon Mektron Ltd Punch die

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