JPH0639470Y2 - PCB for printed wiring - Google Patents
PCB for printed wiringInfo
- Publication number
- JPH0639470Y2 JPH0639470Y2 JP1987134484U JP13448487U JPH0639470Y2 JP H0639470 Y2 JPH0639470 Y2 JP H0639470Y2 JP 1987134484 U JP1987134484 U JP 1987134484U JP 13448487 U JP13448487 U JP 13448487U JP H0639470 Y2 JPH0639470 Y2 JP H0639470Y2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- printed wiring
- wiring board
- board
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案はプリント配線用基板の改良に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to an improvement of a printed wiring board.
従来分割型プリント配線基板の継手部を通るパターンの
形状は一定の幅でかつ継手部とその付近のパターン断面
積が同一面積であるため継手部を打ち抜いた時パターン
が打ち抜き型の間隙に入って第3図に示すように残留パ
ターン(5)として残ることが多かった。The shape of the pattern that passes through the joint part of the conventional split type printed wiring board has a constant width and the pattern cross-sectional area of the joint part and its vicinity are the same area, so when the joint part is punched out, the pattern enters the punching die gap. As shown in FIG. 3, it often remained as a residual pattern (5).
本考案は前記問題を解決するためパターン4の一部に切
り欠きを具備させて一定の場所でパターンが切れるよう
にさせたものであって,残留パターン(5)の装置組込
後の他部品との接触問題を解決する効果がある。In order to solve the above-mentioned problem, the present invention provides a part of the pattern 4 with a notch so that the pattern can be cut at a certain place. It has the effect of solving the contact problem with.
従来分割型プリント配線基板は第2図に示すようにプリ
ント基板1と除去基板2との間に分割溝3と継手部7を
具備させたものであって,前記継手部7にパターンを通
す必要がある場合は,前記パターン4の形状を一定の幅
でかつ同一断面積とすることが一般的な方法であった。As shown in FIG. 2, a conventional split type printed wiring board has a split groove 3 and a joint portion 7 between a printed board 1 and a removal substrate 2, and it is necessary to pass a pattern through the joint portion 7. If there is, it is a general method to make the shape of the pattern 4 to have a constant width and the same cross-sectional area.
しかし,前記プリント基板1と除去基板2を分割する場
合打ち抜き型等によって継手部7を打ち抜いた時に打ち
抜き型の間隙よりもパターン4の厚さの方が薄いためパ
ターン4が第3図に示すように打ち抜き面8の上に残留
パターン(5)として残ることが多かった。However, when the printed board 1 and the removal board 2 are divided, when the joint part 7 is punched by a punching die or the like, the thickness of the pattern 4 is thinner than the gap of the punching die, so that the pattern 4 is as shown in FIG. In many cases, the residual pattern (5) remained on the punched surface 8.
この残留パターン(5)は装置等に組込後他の部品に接
触を起しやすく製品の信頼性の確保を困難にする問題が
あった。This residual pattern (5) has a problem that it is easy to make contact with other parts after it is incorporated in a device or the like, and it is difficult to secure the reliability of the product.
前述の従来技術には,前記残留パターンが発生する欠点
がある。本考案はこれらの欠点を解決するためパターン
4の一部に他の部分より強度の弱い部分を設けて,残留
パターンを発生させないことを目的とする。The above-mentioned conventional technique has a drawback that the residual pattern is generated. In order to solve these drawbacks, the present invention aims to prevent a residual pattern from occurring by providing a part of the pattern 4 with a weaker strength than other parts.
本考案は上記の目的を達成するため継手部近傍のパター
ンの一部の断面積が,他の部分のパターンの断面積より
小さくなるようにしたものである。In order to achieve the above object, the present invention is designed so that the cross-sectional area of a part of the pattern near the joint is smaller than the cross-sectional area of the pattern of the other part.
その結果,打ち抜き面10をプレス等で打ち抜き時にパタ
ーン4が抜型の間隙に入った場合でもパターン4の切断
場所は最も断面積の小さい部分となり結果的に残留パタ
ーンはなくなる。As a result, even when the pattern 4 enters the gap of the die during punching of the punching surface 10 with a press or the like, the cutting place of the pattern 4 becomes the portion having the smallest cross-sectional area, and as a result, the residual pattern disappears.
以下この考案の一実施例を第1図により説明する。 An embodiment of the present invention will be described below with reference to FIG.
1はプリント配線基板,2は除去基板で10は前記プリント
配線基板1と除去基板2を分離するための打ち抜き面10
である。又,4はプリント基板1側から除去板側2側へ通
るパターンであり,このパターン4の一部に本考案によ
る切り欠き6を具備させたものである。切り欠き6を有
する部分のパターンの断面積は他の部分より小さく,強
度が弱くなっている。1 is a printed wiring board, 2 is a removal board, and 10 is a punching surface 10 for separating the printed wiring board 1 and the removal board 2.
Is. Further, 4 is a pattern passing from the printed board 1 side to the removal plate 2 side, and the notch 6 according to the present invention is provided in a part of the pattern 4. The cross-sectional area of the pattern of the portion having the notch 6 is smaller than that of the other portions, and the strength is weakened.
以下この切り欠き6について説明する。第1図の打ち抜
面10を打ち抜き時において,パターン4の厚さが抜き型
の間隙よりも小さく,パターン4に引張り応力が発生し
た場合でも,第4図に示すように断面積の最も小さい切
り欠き6の部分からパターン4が切断される構造にした
ものである。The notch 6 will be described below. When the punching surface 10 of FIG. 1 is punched, the thickness of the pattern 4 is smaller than the gap of the die and even if tensile stress is generated in the pattern 4, the cross-sectional area is the smallest as shown in FIG. The pattern 4 is cut from the notch 6.
本考案によればパターン4が通る継手部7を有する基板
を分割する場合に発生しやすい残留パターンの発生を防
止する効果がある。そのため残留パターンによって発生
しやすい装置組込後の他部品との接触等による問題を解
決する効果がある。According to the present invention, there is an effect of preventing the occurrence of a residual pattern that tends to occur when a substrate having a joint portion 7 through which the pattern 4 passes is divided. Therefore, there is an effect of solving a problem that is likely to occur due to the residual pattern due to contact with other parts after the device is assembled.
第1図は本考案の実施例の斜視図である。 第2図は従来のプリント配線基板の平面図である。 第3図は従来のプリント配線基板を分割した斜視図であ
る。 第4図は本考案のプリント配線基板を分割した時の斜視
図である。 1:プリント基板,2:除去基板,3:分割溝,4:パターン,5:残
留パターン,6:切り欠き,7:継手部,8:打ち抜き面,9:残留
パターン(b),10:打ち抜き面FIG. 1 is a perspective view of an embodiment of the present invention. FIG. 2 is a plan view of a conventional printed wiring board. FIG. 3 is a perspective view in which a conventional printed wiring board is divided. FIG. 4 is a perspective view when the printed wiring board of the present invention is divided. 1: Printed board, 2: Removal board, 3: Dividing groove, 4: Pattern, 5: Residual pattern, 6: Notch, 7: Joint part, 8: Stamped surface, 9: Residual pattern (b), 10: Stamped surface
Claims (1)
ト配線基板のうち継手部分を通るパターンを有する基板
において、前記パターンの継手部分近傍の一部に他より
強度の弱いパターン部分を設け、その部分を基板分割時
のパターン切断部としたことを特徴とするプリント配線
基板。1. A split type printed wiring board having a split groove and a joint portion, which has a pattern passing through the joint portion, wherein a pattern portion having a weaker strength than others is provided in a portion near the joint portion of the pattern. A printed wiring board, characterized in that the portion is used as a pattern cutting portion when the board is divided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987134484U JPH0639470Y2 (en) | 1987-09-04 | 1987-09-04 | PCB for printed wiring |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987134484U JPH0639470Y2 (en) | 1987-09-04 | 1987-09-04 | PCB for printed wiring |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6439672U JPS6439672U (en) | 1989-03-09 |
JPH0639470Y2 true JPH0639470Y2 (en) | 1994-10-12 |
Family
ID=31393280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987134484U Expired - Lifetime JPH0639470Y2 (en) | 1987-09-04 | 1987-09-04 | PCB for printed wiring |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0639470Y2 (en) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5729180U (en) * | 1980-07-28 | 1982-02-16 | ||
JPS6127362U (en) * | 1984-07-23 | 1986-02-18 | 日立電子株式会社 | Split board type printed circuit board |
-
1987
- 1987-09-04 JP JP1987134484U patent/JPH0639470Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS6439672U (en) | 1989-03-09 |
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