JPS62101239U - - Google Patents

Info

Publication number
JPS62101239U
JPS62101239U JP19247785U JP19247785U JPS62101239U JP S62101239 U JPS62101239 U JP S62101239U JP 19247785 U JP19247785 U JP 19247785U JP 19247785 U JP19247785 U JP 19247785U JP S62101239 U JPS62101239 U JP S62101239U
Authority
JP
Japan
Prior art keywords
board
recess
conductor
film
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19247785U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19247785U priority Critical patent/JPS62101239U/ja
Publication of JPS62101239U publication Critical patent/JPS62101239U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例の組立て工程を示
す説明図、第２図は従来例を示す説明図である。 １…凹部、２…基板、３…導体膜、４…電極、
５…リード端子、７…ハンダ。 FIG. 1 is an explanatory diagram showing the assembly process of an embodiment of this invention, and FIG. 2 is an explanatory diagram showing a conventional example. DESCRIPTION OF SYMBOLS 1... Recessed part, 2... Substrate, 3... Conductor film, 4... Electrode,
5...Lead terminal, 7...Solder.

Claims (1)

【実用新案登録請求の範囲】 樹脂封止される片面実装の厚膜ハイブリツドＩ
Ｃにおいて、 基板端面に形成され基板表面から裏面に貫通す
る凹部と、基板表面に実装部品から電極を延出し
て前記凹部表面に形成した導体膜と、基板外から
前記凹部の基板裏面に端部を当接させた外部接続
用導体片とを備え、ハンダを前記凹部に充填して
前記導体膜と前記導体片とを接続してなることを
特徴とする厚膜ハイブリツドＩＣ。[Claims for Utility Model Registration] Single-sided mounting thick film hybrid I sealed with resin
In C, a recess formed on the end surface of the board and penetrating from the front surface to the back surface of the board, a conductive film formed on the surface of the recess by extending an electrode from a mounted component onto the surface of the board, and an end portion formed on the back surface of the board in the recess from outside the board. 1. A thick film hybrid IC, comprising: a conductor piece for external connection that is brought into contact with the conductor film, and the conductor film and the conductor piece are connected by filling the recess with solder.
JP19247785U 1985-12-14 1985-12-14 Pending JPS62101239U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19247785U JPS62101239U (en) 1985-12-14 1985-12-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19247785U JPS62101239U (en) 1985-12-14 1985-12-14

Publications (1)

Publication Number Publication Date
JPS62101239U true JPS62101239U (en) 1987-06-27

Family

ID=31147591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19247785U Pending JPS62101239U (en) 1985-12-14 1985-12-14

Country Status (1)

Country Link
JP (1) JPS62101239U (en)

Similar Documents

Publication Publication Date Title
JPS62101239U (en)
JPS58195484U (en) Printed circuit board mounting structure
JPS61156239U (en)
JPS6343495U (en)
JPS61146977U (en)
JPS61156265U (en)
JPS61157363U (en)
JPS583057U (en) printed circuit board circuit unit
JPS587221U (en) magnetic head
JPS6096817U (en) Chip type electronic components
JPS588946U (en) semiconductor equipment
JPS58131654U (en) Thick film electrode structure
JPS61149334U (en)
JPS58192492U (en) IC socket
JPS59140450U (en) Hybrid integrated circuit device
JPS6155337U (en)
JPS6289175U (en)
JPH0317665U (en)
JPS60192456U (en) Mixed function circuit device with protective cap
JPS5743450A (en) Manufacture of hybrid integrated circuit
JPS6265872U (en)
JPS62199367U (en)
JPS611871U (en) Short prevention structure of hermetic terminal part
JPS58111522U (en) Crystal unit structure
JPS60149159U (en) thick film circuit board