JPS5743450A - Manufacture of hybrid integrated circuit - Google Patents

Manufacture of hybrid integrated circuit

Info

Publication number
JPS5743450A
JPS5743450A JP55119965A JP11996580A JPS5743450A JP S5743450 A JPS5743450 A JP S5743450A JP 55119965 A JP55119965 A JP 55119965A JP 11996580 A JP11996580 A JP 11996580A JP S5743450 A JPS5743450 A JP S5743450A
Authority
JP
Japan
Prior art keywords
lead frame
substrate
manufacture
integrated circuit
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55119965A
Other languages
Japanese (ja)
Other versions
JPS6130748B2 (en
Inventor
Eiji Kobayashi
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55119965A priority Critical patent/JPS6130748B2/ja
Publication of JPS5743450A publication Critical patent/JPS5743450A/en
Publication of JPS6130748B2 publication Critical patent/JPS6130748B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49548Cross section geometry
    • H01L23/49551Cross section geometry characterised by bent parts
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405Edge mounted components, e.g. terminals

Abstract

PURPOSE:To prevent the exfoliation of the connecting part of an external terminal lead frame from a substrate by securing a wiring lead frame to an external terminal lead frame having a bottom part, then bonding a substrate to the bottom part and electrically connecting the wiring lead frame to the substrate. CONSTITUTION:After a wiring lead frame 3 is secured in advance to an external terminal lead frame 1, a substrate 5 is secured with an adhesive 6 to the bottom part 2 of the lead frame 1. Thereafter, the end 4 of the wiring lead frame 3 is electrically connected with solder 8 to an electrode terminal 7 formed on the substrate 5. Since external force is not applied directly to the substrate in this manner, the connecting part of the lead frame 1 is not exfoliated from the substrate 5.
JP55119965A 1980-08-28 1980-08-28 Expired JPS6130748B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55119965A JPS6130748B2 (en) 1980-08-28 1980-08-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55119965A JPS6130748B2 (en) 1980-08-28 1980-08-28

Publications (2)

Publication Number Publication Date
JPS5743450A true JPS5743450A (en) 1982-03-11
JPS6130748B2 JPS6130748B2 (en) 1986-07-15

Family

ID=14774574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55119965A Expired JPS6130748B2 (en) 1980-08-28 1980-08-28

Country Status (1)

Country Link
JP (1) JPS6130748B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01261555A (en) * 1988-04-06 1989-10-18 Kubota Ltd Lubrication structure for continuously variable transmission

Also Published As

Publication number Publication date
JPS6130748B2 (en) 1986-07-15

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