JPH0299394A - Memory card module - Google Patents

Abstract

PURPOSE:To enable the title memory card module to have large capacity by increasing a mounting area and besides to enable said memory card to be thinned by a method wherein a chip capacitor and a chip resistance are mounted on an outer peripheral side surface of a resin substrate. CONSTITUTION:For a memory card module, memory semiconductor device connecting pads 12, 22, circuit wiring, etc., are formed with metals of copper foil or the like on circuit substrate 11, 21 such as a resin substrate or a fiber reinforced resin substrate and others, and a plurality of ultra thinned SOP (TSOP) structure memory semiconductor devices 23 are mounted on their surfaces by soft solder. Then, chips 25 such as a chip capacitor, a chip resistance, etc., are mounted by solder on a mounting pattern part 14 provided on an outer peripheral side surface of the circuit substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to memory card modules, and more particularly to the mounting of chip capacitors and chip resistors.

[Conventional technology]

Conventionally, this type of memory card module has a memory semiconductor device (SOP, FLAT) on a resin substrate.

Chip capacitors, chip resistors, etc. were surface mounted.

[Problem to be solved by the invention]

In the conventional memory cart model mentioned above, memory semiconductor devices such as SOP, flat, etc., chip capacitors, chip resistors, etc. are surface mounted on the resin substrate, so the mounting area of the memory semiconductor device is limited to the chip capacitor. , it was difficult to mount large numbers of chip resistors, etc., and it was difficult to make them thinner due to limitations on the thickness of SOP, flat mold type memory semiconductor devices, chip capacitors, and chip resistors. .

[Differences between the invention and the prior art]

1-1 The present invention differs from the conventional memory card module described above in that it uses a memory semiconductor device with an ultra-thin SOP (TSOP) structure, and also mounts chip capacitors, chip resistors, etc. on the outer peripheral side of the resin substrate. has.

[Means to solve the problem]

The memory card module of the present invention is an ultra-thin SOP in which memory semiconductor device connection pads, circuit wiring, etc. are formed on a circuit board such as a resin substrate or a fiber-reinforced resin substrate.
This is a memory card module in which multiple memory semiconductor devices of (TSOP) structure are surface-mounted, and has a mounting pattern section for mounting chip capacitors and chip resistors on the outer peripheral side of the circuit board.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a perspective view of a circuit board according to an embodiment of the present invention, and FIG. 2 is a partial view of the implementation of the present invention.

On a circuit board 11.21 such as a resin board or fiber-reinforced resin board with a thickness of 0.3 to 0.8 mm, memory semiconductor device connection pads 12.22 and circuit wiring etc. are formed of metal such as copper foil, Memory semiconductor device 2 with ultra-thin SOP (TSOP) structure with a thickness of 1°0 to 1.5 am'
3 is a memory card module in which a plurality of chip parts 25 such as a chip capacitor and a chip resistor are mounted by soldering on a mounting pattern part 14 installed on the outer peripheral side of a circuit board.

FIG. 3 is a front view of another embodiment of the present invention, and FIG. 4 is a front view of another embodiment of the present invention.
FIG. 3 is an enlarged side view of the figure. As shown in FIGS. 3 and 4, the chip component 25 is mounted perpendicularly to the mounting pattern section 14 which is provided on the outer peripheral side of the circuit board 21 and has the circuit board terminal section 31 provided on the front and back surfaces of the circuit board 21. installed in
Thereafter, the circuit board terminal section 31 and the chip component terminal section 32 are mounted by soldering or the like. In this example,
Since the chip component 25 and the circuit board 21 are installed perpendicularly, the mounting pattern section 14 provided on the circuit board 21
It has the advantage that it can be made smaller.

〔Effect of the invention〕

As explained above, the present invention provides mounting areas for chip components, special chip capacitors, and chip resistors on the side of the circuit board, thereby increasing the mounting area for memory semiconductor devices and making it possible to increase capacity. . Also, ultra-thin SO
By implementing P (TSOP), it became possible to create a thin memory card.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a circuit board for a memory card module according to an embodiment of the present invention, and FIG. 2 is a diagram showing a portion of the embodiment. FIG. 3 is a front view of another embodiment of the present invention, and FIG. 4 is an enlarged side view thereof. 11.21...Circuit board, 12.22...mark...
Memory semiconductor device connection pad, 23... group memory semiconductor device, 14... mounting pattern section, 25
...Chip parts, 31...Circuit board terminal part, 32...Group/chip parts terminal part. Agent Patent Attorney Susumu Uchihara 2nd Country

Claims (1)

[Claims] In a memory card module in which memory semiconductor device connection pads, circuit wiring, etc. are formed on a resin substrate or a fiber-reinforced resin substrate, and a plurality of ultra-thin memory semiconductor devices are surface-mounted, the outer periphery of the resin substrate is A memory card module characterized by mounting a chip capacitor and a chip resistor on the side.