JP2003318297A - Electronic component device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component device insusceptible to noise in which unwanted radiation noise signal is suppressed. <P>SOLUTION: A shield case 3 is arranged on a board 2 such that terminal electrodes 22 for signal formed on the end face of the board 2 are covered, at a specified interval, by the side face 32 of the shield case 3. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component device with a shield case having a structure in which an electronic component element mounted on a substrate is housed in a shield case.

[0002]

2. Description of the Related Art In an electronic component device, unnecessary radiation to the outside is reduced (especially when an oscillation circuit is mounted), or the influence of noise from the outside or other circuits is prevented (especially,
For high-gain high-frequency amplifiers, etc.), a shield case made of metal having good conductivity is mounted on the circuit board so as to cover the circuit board.

Such an electronic component device 60 is, for example, a V
A CO module, a PLL module, etc. can be exemplified, and the structure is as shown in FIG. That is, the wiring (not shown) forming a predetermined circuit is formed on the substrate 61, and the electronic component element 63 for forming the predetermined circuit is mounted. Further, an external terminal electrode 64 connected to a predetermined circuit was formed on the end face of the outer periphery of the substrate 61. Also, the substrate 6
1, especially the electronic component element 63 was covered by the shield case 62 of ground potential.

The external terminal electrode 64 is composed of a signal terminal electrode for inputting, outputting, and supplying power to a predetermined circuit, and a ground potential terminal electrode. In particular, the ground terminal electrode is at least on each side of the substrate. It was formed on the end face and joined to a part of the shield case 62. Specifically, a recess is formed in the thickness direction of the outer peripheral end surface of the substrate 61, and a conductor film serving as a grounding terminal electrode is formed on the inner wall surface of the recess, and the shield case 62 has a part of its side surface. Extension part for joining 65
And both are joined by solder. The shield case 62 is formed into a box shape by pressing or bending a metal material such as iron, SUS, copper or nickel silver. The opening size of the shield case 62 is slightly smaller than the external size of the substrate 61 in order to expose the signal terminal electrode, and moreover, the step portion which is the base of the joining extension 65 of the shield case 62. Substrate 6 except 66
It was placed on the substrate 61 so as to float with 1. This prevents a short circuit between the signal terminal electrode and the shield case 62.

[0005]

However, in the conventional structure, the external terminal electrode 64, particularly the signal input / output terminal electrode and the signal terminal electrode serving as a power supply terminal, are exposed to the outside of the shield case 62. , The unwanted radiation noise signal from this part is emitted, or it is affected by noise emitted from the outside or other circuits, and the characteristics of the electronic component device itself are deteriorated, or other circuits The characteristics of will be deteriorated.

The present invention has been devised in order to solve the above problems, and an object thereof is to provide a structure of an electronic component device which is small in size, can easily perform joint positioning of a shield case, and is excellent in shield effect. Especially.

[0007]

SUMMARY OF THE INVENTION The present invention provides a circuit board having a plurality of grounding terminal electrodes and signal terminal electrodes formed on the outer peripheral end surface of the board and wiring formed on the surface of the board, and the wiring. An electronic component element arranged so as to be connected to
An electronic component device having a ceiling surface and a side surface, covering the electronic component element, and comprising a shield case joined and fixed to the grounding terminal electrode, wherein the signal terminal electrode is spaced a predetermined distance from the side surface of the shield case. The electronic component device is covered with.

The electrode surface of the signal terminal electrode is
It is formed to be recessed inside the substrate with respect to the electrode surface of the grounding terminal electrode joined to the shield case.

Further, the grounding terminal electrode joined to the shield case is arranged in a 1/4 circular recess formed at the corner of the substrate.

Further, the signal terminal electrode is arranged in a 1/2 oval recess formed on the end face of the substrate.

Further, the signal terminal electrode is
It is arranged in a semicircular second concave portion formed on the inner wall surface of the two oval concave portions.

According to the electronic component device of the present invention, the signal terminal electrode is covered with the shield case when viewed from the side surface of the substrate, so that the unwanted radiation signal applied from the signal terminal electrode to other circuits is blocked. However, it is possible to cut off noise or the like from the outside or other circuits, and the electronic component device has an excellent shield effect. Further, it is possible to prevent a short circuit between the shield case and the signal terminal electrode, and to stably and reliably join the signal terminal electrode to the mounting substrate (motherboard) via solder.

Further, since the shield case is joined to the grounding terminal electrode formed at the corner of the substrate, the positioning can be easily performed. In addition, the part where the shield case and the board contact is
Since it is in the vicinity of the corner of the substrate on which the grounding terminal electrode is formed, the degree of freedom in routing the wiring on the substrate is improved, the size of the substrate can be reduced, and the electronic component device has an excellent shield effect.

Further, the signal terminal electrode and the grounding terminal electrode are formed by depositing a conductor film on the inner wall surface of the recess formed in the end face of the outer peripheral portion of the substrate. Therefore, since it is possible to manufacture using a large-sized board that can extract a large number of circuit boards in the manufacturing process,
Production efficiency is improved.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an electronic component device of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view of an electronic component device of the present invention.

The electronic component device 1 comprises a substrate 2 made of a ceramic material, a ceramic-glass material or a glass epoxy material, an electronic component element 4, and a shield case 3. The substrate 2 is made of a single plate or a laminated structure, and wiring (not shown) forming a predetermined circuit is formed on the surface thereof. Further, when the substrate 2 has a laminated structure, a predetermined wiring may be arranged inside and a cavity for accommodating various electronic component elements 4 may be formed on the surface at the same time. The circuit board of the present invention refers to a state in which terminal electrodes and wirings are formed on the board 2.

A plurality of terminal electrodes 21 to 22 are formed on the outer peripheral end surface of the substrate 2. This terminal electrode 21-22
Among them, reference numeral 21 indicates a terminal electrode having a ground potential (grounding terminal electrode), and reference numeral 22 indicates a terminal electrode for inputting / outputting signals and supplying power (signal terminal electrode).

The surface of the terminal electrodes 21 and 22 has a positional relationship in which the surface of the signal terminal electrode 22 is recessed toward the center of the substrate 2 with respect to the surface of the terminal electrode 21 at the ground potential.
In FIG. 1, the grounding terminal electrode 21 has a size of
4 is composed of a conductor film adhered to the inner wall surface of the circular recess,
The signal terminal electrode 22 was formed by forming a second concave portion having a quarter circle on the inner wall surface of the concave portion having a half oval shape on the side of the substrate 2 and being attached to the inner wall surface of the twenty second concave portion. It is composed of a conductor film. In addition to the structure of the substrate 2 of FIG. 1, the structure of the terminal electrode is shown in FIGS.

For example, in FIG. 2A, the grounding terminal electrode 21 is formed on the end face portion of the outer periphery of the substrate 2. That is, a half circular recess is formed on the end surface of the substrate 2 to form the inner wall surface. The signal-side terminal electrode 22 is formed with a (Δx) 1/2 oval recess that is deeper in the center of the substrate than in the ground potential-side recess formed on the end face of the substrate 2. Specifically, the signal terminal electrode 22 is formed of a flat conductor film on the inner wall surface of the 1/2 oval recess.

As shown in FIG. 2B, the grounding terminal electrode 21 and the signal side terminal electrode 22 are formed on different end surfaces of the substrate 2. The signal terminal electrode 22 is formed flat on the inner wall surface of the 1/2 oval recess formed on the end surface (upper and lower sides in the figure) of the substrate 2, and the grounding terminal electrode 21 is formed on the end surface (left and right in the figure) of the substrate 2. Is formed in a flat shape on the inner wall surface of the half-elliptical concave portion formed on the side of the.

In FIG. 2C, the grounding terminal electrode 21 is formed on the inner wall surface of the 1/4 circular recess at the corner of the substrate 2, and the signal terminal electrode 22 is 1/2 of the side of the substrate 2. It is formed on the inner wall surface of the oval recess.

In FIG. 2D, the ground potential terminal electrode 21
Are directly formed on the end surface of the substrate 2. In this case, the signal terminal electrode 22 is formed by utilizing the inner wall surface inside the 1/2 oval recess formed on the end surface of the substrate 2. In addition, in FIGS. 2A to 2D, the signal terminal electrode 22 is, as shown in FIG. 1, a half-elliptical concave portion as a first concave portion, and is formed on the inner wall surface of the first concave portion. Further, the second concave portion (half circle or half ellipse may be used)
May be formed, and the inner wall surface of the second recess may be covered with and filled with a conductor film.

In short, when the grounding terminal electrode 21 and the signal terminal electrode 22 are present on the same end face of the substrate 2, the surface position of the grounding terminal electrode 21 and the surface position of the signal terminal electrode 22 are To provide a difference ΔX to connect the signal terminal electrode 22 to the substrate 2
It is important to form it by denting it toward the center. Also, as shown in FIG. 2B, when the grounding terminal electrode 21 and the signal terminal electrode 22 are separately formed on the end faces of the substrate, the shield case 3 is not short-circuited to the signal terminal electrode 22. Is important.

The shield case 3 is formed by squeezing or bending a thin metal plate, and has a structure having a ceiling surface and at least two side surfaces bent from the ceiling surface. Preferably, it is a casing-like structure in which a ceiling surface and one surface having four side surfaces bent from the ceiling surface are open. The design of the shield case 3 is appropriately designed according to the shape of the substrate shown in FIG. 2 and the like.
The joint portion 31 separated from the side surface is formed. Then, it is fitted in the recess in which the grounding terminal electrode 21 is formed,
Further, it is arranged so as to be in contact with the grounding terminal electrode 21, and is joined and fixed by soldering. At this time, the signal terminal electrode 2
2 is a side surface 32 of the shield case 3 as shown in FIG.
At a predetermined interval d. Further, when this electronic component device is mounted on the mother board 42, it is important to keep a gap h between the lower end of the side surface 32 of the shield case 3 and the surface of the mother board 42 so that the solder meniscus 41 does not come into contact with the mother board 42. is there. In FIG. 3, reference numeral 43 is an electrode pad on the motherboard side, which is used for the signal terminal electrode 22.
When is soldered to the electrode pad 43, a solder meniscus due to the rising of the solder is generated between the signal terminal electrode 22 and the electrode pad 43.

Next, a method of manufacturing the electronic component device 1 shown in FIG. 1 according to the present invention will be described with reference to FIG. Figure 5
FIG. 3 is a perspective view of a sheet substrate (large substrate) from which a plurality of substrates (circuit boards) 2 can be extracted.

The sheet substrate 5 has a circular through hole 52 formed at the intersection of the boundary lines of the adjacent substrates 2, an oval through hole 53 formed on the boundary line, and the through hole 53. 1/2 formed on the inner wall
A circular second through hole (convenience letter reference numeral 22) is formed. Then, on the inner wall surface of the through hole 53, a conductor film to be the grounding terminal electrode 21 is formed.
On the inner wall surface of the through hole, a conductor film to be the signal terminal electrode 22 is formed. In each substrate area of such a large-sized substrate 5, a wiring on the surface is formed at the same time when the above-mentioned conductor film is formed, and various electronic component elements 4 are soldered on this wiring.

After that, cream solder is injected into the through holes 52. In the figure, cream solder is omitted.
Then, the side surface portion 31 of the shield case 3 and the sheet substrate 5
The through-holes 53 are aligned and the joint portion 31 of the shield case 3 is engaged with the through-holes 52.

Then, the whole is heated to a predetermined temperature to melt and solidify the cream solder, and the joint portion 31 of the shield case 3 is adhesively fixed to the through hole 52 of the sheet substrate 5. After that, the sheet substrate 5 is cut along a boundary line (cutting line) BB ′ by a dicing machine or the like to obtain the electronic component device 1 with the individual shield cases 3 as shown in FIG. 1. In the electronic component device 1 according to this embodiment, the plurality of joint portions 31 of the shield case 3 are inserted into the through hole electrodes 21 of the substrate 2, and the joint portions 31 and the grounding terminal electrodes 21 are soldered. It is firmly bonded and fixed.

As described above, the electronic component device of the present invention does not require any special process in its manufacturing method. In the above embodiment, the case where the sheet substrate 5 is used, the surface mount component 4 is mounted and the shield case 3 is mounted, and then the sheet substrate 5 is cut into individual electronic component devices is described. Although described by way of example, there is no limitation in the order of steps of the method for manufacturing an electronic component with a shield case of the present invention, and in some cases, a divided substrate for individual electronic components may be used without using a sheet substrate. It is also possible to configure. Further, the present invention can be applied to the case of manufacturing other types of electronic component devices. The present invention is not limited to the above-described embodiments in other points as well, and the specific configurations and shapes of the substrate and the shield case, or the constituent materials, the extending portions for joining, the engaging recesses, the electrodes. Various applications and modifications can be made within the scope of the invention with respect to the arrangement position and shape of the forming recesses, the pattern of the land electrode, and the like.

[0029]

As described above, according to the present invention, since the signal terminal electrodes are covered by the side surface of the shield case at a predetermined interval, the unnecessary radiation noise signal is emitted to other circuits, and , It is possible to block noise signals from the outside or other circuits.

Further, as compared with the surface of the terminal electrode at the ground potential,
The above-mentioned structure can be easily achieved due to the recessed position on the center side of the board, and moreover, stable mounting on the motherboard is possible, and even in the manufacturing process, it can be formed collectively from the sheet board. Therefore, the production efficiency is improved.

[Brief description of drawings]

FIG. 1 is a divided perspective view of an electronic component device of the present invention.

2A to 2D are plan views of a substrate used in the electronic component device of the present invention.

FIG. 3 is a cross-sectional view showing the relationship between the side surface of the shield case and the signal terminal electrode and the positional relationship of the motherboard in the electronic component device of the present invention.

FIG. 4 is a diagram illustrating a conventional electronic component device,
(A) is a perspective view of a partially transparent state, and (b) is a side view.

FIG. 5 is a schematic view of a sheet substrate for explaining a method for manufacturing an electronic component device of the present invention.

[Explanation of symbols]

1 ... Electronic component device 2 ... Substrate 21 ... Ground potential terminal electrode 22 ... Signal terminal electrode 3 ... Shield case 31 ... Joint 32 ... Side 4 ... Electronic component element 5 ... Sheet substrate

Claims (5)

[Claims] 1. A circuit board having a plurality of grounding terminal electrodes and signal terminal electrodes formed on the outer peripheral end surface of the board, and wiring formed on the surface of the board, and a circuit board mounted so as to be connected to the wiring. An electronic component device comprising: an electronic component element; and a shield case which has a ceiling surface and a side surface, covers the electronic component element, and is joined and fixed to the grounding terminal electrode, wherein the signal terminal electrode comprises: An electronic component device characterized in that it is covered with a predetermined distance from the side surface of the shield case. 2. The electrode surface of the signal terminal electrode is recessed toward the inside of the substrate from the electrode surface of the grounding terminal electrode joined to the shield case. Electronic component device. 3. The electronic component device according to claim 1, wherein the grounding terminal electrode joined to the shield case is arranged in a 1/4 circular recess formed in the corner portion of the substrate. . 4. The electronic component device according to claim 1, wherein the signal terminal electrode is arranged in a ½ oval recess formed in the end surface of the substrate. 5. The signal terminal electrode is arranged in a semi-circular second concave portion formed on an inner wall surface of the 1/2 oval concave portion. Electronic component device.