JP2008034731A - High-frequency module, manufacturing method therefor and method for fitting shielding case - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily position a shielding case to a substrate. <P>SOLUTION: The substrate (10B) has a pair of first through-holes (18) positioning the substrate penetrated to the surface and rear of the substrate near a pair of mutually opposed first corners on a first diagonal line. A ceiling (21B) for the shielding case (20B) has a pair of holes (28) for positioning the case at places corresponding to a pair of the through-holes for positioning the substrate. The substrate (10B) and the shielding case (20B) are inserted into a jig for a positioning having a pair of pins for the positioning extended to upper sections at places corresponding to a pair of the through-holes (18) for positioning the substrate. The shielding case (20B) is fixed onto the main surface (10a) of the substrate (10B) by a soldering (30). <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a high-frequency module used as a component of a wireless LAN (local area network) or Bluetooth transceiver, and more particularly to a method for mounting a shield case on a substrate of a high-frequency module.

  As is well known in this technical field, a wireless LAN refers to a local area network (LAN) that uses a transmission path other than electric wires (wired cables) such as electromagnetic waves (radio waves) and light (infrared rays). Bluetooth, on the other hand, is a short-range wireless technology development code jointly developed by Intel, IBM, Sweden, Ericsson, Finland, and Toshiba. .45 GHz is used for wireless communication between personal computers, PDAs (personal digital assistants) and mobile phones. Such wireless LAN and Bluetooth require a transceiver, and a high-frequency module is used as one component of the transceiver.

  This type of high-frequency module includes a substantially rectangular substrate and a shield case. The substrate has an upper surface (main surface), and electronic components (circuit elements) are mounted (mounted) on the upper surface (main surface). The shield case is mounted on the upper surface (main surface) of the substrate so as to cover the electronic component (circuit element). The substrate may be a ceramic multilayer substrate, for example. The electronic component (circuit element) is, for example, an IC (integrated circuit) or a capacitor. The shield case has a ceiling portion and a frame portion continuous to the ceiling portion.

 In order to manufacture such a high-frequency module, it is necessary to mount the shield case on the upper surface (main surface) of the substrate. Hereinafter, the first and second conventional shield case mounting methods will be described with reference to FIGS. 1 and 2.

  First, a first conventional shield case mounting method will be described with reference to FIG. FIG. 1A is a view showing a state before the shield case is mounted, in which the upper side is a top view (plan view) and the lower side is a side view. FIG. 1B is a diagram showing a state after the shield case is mounted, in which the upper side is a top view (plan view) and the lower side is a side view.

  As shown in FIG. 1A, the high frequency module includes a multilayer ceramic substrate 10 having a substantially rectangular shape and a shield case 20.

  The multilayer ceramic substrate 10 has an upper surface 10a, and a mounted component 12 that is an electronic component is mounted on the upper surface 10a. The multilayer ceramic substrate 10 is obtained by laminating and integrating a plurality of ceramic sheets. The electronic component (circuit element, mounted component) 12 includes a chip component such as an IC or a capacitor. At the four corners of the upper surface 10a of the multilayer ceramic substrate 10, four case fixing land patterns 14 for soldering a shield case 20 described later are formed.

  The illustrated shield case 20 includes a ceiling portion 21 and a frame portion (described later) continuous to the ceiling portion 21. More specifically, the ceiling 21 has an octagonal shape with four corners chamfered. The frame portion includes four side wall portions 24 extending at right angles in a predetermined direction at four sides of the ceiling portion 21, and four corner portions (chamfered portions) 24 extending at right angles in the predetermined direction at four corners of the ceiling portion 21. And have.

  1B, the shield case 20 is placed on the upper surface 10a of the multilayer ceramic substrate 10, and the four corners (chamfered portions) 24 of the shield case 20 and the four layers of the multilayer ceramic substrate 10 are disposed. Two case fixing land patterns 14 are joined by soldering 30.

  In an actual high-frequency module assembly process, an electronic component 12 such as an IC or a chip component is mounted (mounted) on the main surface 10a in a state of an aggregate substrate (motherboard) in which a large number of multilayer ceramic substrates 10 are gathered, and then the aggregate After the substrate (motherboard) is divided for each multilayer ceramic substrate 10, the shield case 20 is mounted on the multilayer ceramic substrate 10 by soldering 30.

  This first conventional shield case mounting method has a problem that positioning is difficult because there is no means (member) for positioning the shield case 20 on the upper surface 10a of the multilayer ceramic substrate 10.

  Next, a second conventional shield case mounting method will be described with reference to FIG. FIG. 2A is a diagram showing a state before the shield case is mounted, in which the upper side is a top view (plan view) and the lower side is a side view. FIG. 2B is a diagram showing a state after the shield case is mounted, in which the upper side is a top view (plan view) and the lower side is a side view.

  As shown in FIG. 2A, the high-frequency module includes a multilayer ceramic substrate 10A having a substantially rectangular shape and a shield case 20A.

  The multilayer ceramic substrate 10A has an upper surface 10a, and a mounted component 12 that is an electronic component is mounted on the upper surface 10a. The multilayer ceramic substrate 10A is obtained by laminating and integrating a plurality of ceramic sheets. The electronic component (circuit element, mounted component) 12 includes a chip component such as an IC or a capacitor. Two substrate end face through-holes 16 for positioning and soldering a shield case 20A described later are formed on both end faces of the multilayer ceramic substrate 10A facing each other. The side surface of the substrate end face through hole 16 is metal plated.

  The illustrated shield case 20A includes a ceiling portion 21A and a frame portion (described later) continuous to the ceiling portion 21A. More specifically, the ceiling portion 21A has a quadrangular shape. The frame portion is composed of four side wall portions 22A extending at right angles to a predetermined direction on four sides of the ceiling portion 21A. The two side wall portions 22A facing each other among the four side wall portions 22A have two positioning projections 26 protruding downward at the corresponding positions of the two substrate end surface through holes 16.

  Then, as shown in FIG. 2B, two positioning projections 26 corresponding to the two substrate end face through holes 16 are inserted, and the shield case 20A is placed on the upper surface 10a of the multilayer ceramic substrate 10A. The two substrate end face through holes 16 and the two positioning projections 26 corresponding to them are joined by soldering.

  In the actual high-frequency module assembly process, an IC or chip component electronic component 12 is mounted (mounted) on the main surface 10a in a state of a collective substrate (motherboard) in which a large number of multilayer ceramic substrates 10A are gathered, and then the collective substrate. After dividing the (motherboard) for each multilayer ceramic substrate 10A, the shield case 20A is mounted on the multilayer ceramic substrate 10A by soldering.

  The reason is as follows. When the motherboard is a multilayer ceramic aggregate substrate, it is often arranged without taking a margin between the products in order to secure the number of products. Therefore, even when two substrate end face through holes (attachment holes) 16 are provided on both end faces (side faces) of the multilayer ceramic substrate 10A as in the second conventional shield case mounting method shown in FIG. This is because the shield case 20A cannot be easily mounted on the upper surface 10a of the multilayer ceramic substrate 10A unless the motherboard is divided into units of the multilayer ceramic substrate 10A.

  A high-frequency module manufactured using such a second conventional shield case mounting method is disclosed in Patent Document 1, for example. Patent Document 1 proposes a high-frequency module having no burr in a signal electrode formed on a cut surface. The high-frequency module disclosed in Patent Document 1 has an electronic component mounted on the upper surface, a substantially rectangular substrate, a recess formed in the cut surface of the substrate, and a signal electrode formed in the recess. With. A removal portion is provided between the end portion of the signal electrode and the cut surface. A metal shield case is placed on the substrate so as to cover the electronic component. The legs of the seal case are soldered to signal electrodes to which a ground signal is connected.

  In order to solve the problems that occur in the first and second shield case mounting methods described above, a technical idea is proposed in which a plurality of shield cases are mounted on a motherboard and then the motherboard is cut to obtain a plurality of products. (For example, refer to Patent Document 2). More specifically, in the method of manufacturing an electronic component disclosed in Patent Document 2, a mother board that can be divided into a plurality of substrates by cutting, a rectangular ceiling part, a frame part continuous to the ceiling part, and an end of the frame part The shield case provided with the nail | claw for joining provided in the edge is used. In the mother board, through holes that pass through the front and back surfaces of the mother board are provided on the boundary line and in the portion corresponding to the approximate center of each side of the outer periphery of the board. A circuit pattern and bonding electrodes are collectively printed on the surface of the motherboard corresponding to each of the plurality of substrates. Input / output electrodes are printed on the back side of the motherboard. After the circuit elements are mounted on the circuit pattern formed on the surface of the mother board, the shield case positioning claws are inserted into the through holes of the mother board, thereby positioning the shield case. The joining claw bent in the L shape of the shield case comes into contact with the joining electrode of the mother board. The outer dimension of the ceiling part of the shield case is set smaller than the area of the surface of the substrate defined on the motherboard. The frame part of the shield case is disposed inside the boundary line. Therefore, a plurality of shield cases are arranged on the motherboard via the boundary line without contacting each other. Soldering of the circuit elements to the circuit pattern on the mother board and soldering of the claw for joining the shield case to the joining electrode are performed at once by a single reflow soldering process. The dicer cuts the motherboard on the boundary line to form a plurality of electronic components.

  Further, a “substrate and shield case mounting structure” capable of accurately mounting the substrate and the shield case has been proposed (see, for example, Patent Document 3). In the “substrate and shield case mounting structure” disclosed in Patent Document 3, a substantially L-shaped fitting boss with one side facing outward at an appropriate position near the opening edge in the left and right and upper and lower wall portions of the shield case. Are protruding from each other. A plurality of square hole portions into which one side of the fitting boss is fitted are provided at locations corresponding to the fitting bosses in the main body of the substrate. When the board is fitted into the opening of the shield case, each fitting boss of the shield case is fitted into each square hole of the main body of the board and attached.

JP 2002-94204 A Japanese Patent Laid-Open No. 11-145669 JP 2002-26565 A

  In the method of manufacturing an electronic component disclosed in Patent Document 2, the positioning of the shield case on the substrate is performed by fitting a positioning claw provided on the edge of the frame portion of the shield case into the recess provided on the side surface of the substrate. It is done by doing. Therefore, the electronic component manufacturing method disclosed in Patent Document 2 has a problem that it takes time to position the shield case. In other words, in order to position the shield case, it is necessary to align the positioning claw of the shield case with the concave portion of the substrate, and this alignment takes time. That is, in Patent Document 2, some alignment mechanism is required.

  Further, in the electronic component manufacturing method disclosed in Patent Document 2, a plurality of shield cases are arranged on a motherboard without contacting each other. However, with the shield case positioning member (means) disclosed in Patent Document 2, it is very difficult to dispose a plurality of shield cases on the mother board.

  The “substrate and shield case mounting structure” disclosed in Patent Document 3 has the same problem as the electronic component manufacturing method disclosed in Patent Document 2. That is, even in Patent Document 3, since it is necessary to fit the fitting boss corresponding to the positioning claw of Patent Document 2 into the square hole portion of the substrate, it takes time for alignment.

  Therefore, an object of the present invention is to provide a high-frequency module, a shield case mounting method, and a high-frequency module manufacturing method capable of easily positioning the shield case with respect to the substrate.

  According to the first aspect of the present invention, the substrate (10B) having a rectangular shape having a main surface (10a) on which a circuit element (12) is mounted on the main surface (10a), and a ceiling portion (21B) and a shield case (20B) having a frame portion (22B, 24) continuous to the ceiling portion, and the circuit element (12) is placed on the main surface (10a) of the substrate (10B). In the high-frequency module having the shield case (20B) attached so as to cover the substrate (10B), the substrate (10B) is located near the first pair of corners facing each other on the first diagonal line. A pair of substrate positioning through holes (18) penetrating the front and back surfaces, and the ceiling portion (21B) of the shield case (20B) is located at a position corresponding to the pair of substrate positioning through holes. Positioning hole (28 With high-frequency module can be obtained, characterized in that.

  In the high-frequency module according to the first aspect of the present invention, the substrate (10B) has a second diagonal line on the main surface (10a) opposite to each other on a second diagonal line intersecting the first diagonal line. It is preferable to have a pair of case fixing land patterns (14) formed at the pair of corners. In this case, the frame portion of the shield case (20B) has a pair of chamfered portions (24) at positions corresponding to the pair of case fixing land patterns.

  According to the second aspect of the present invention, the main surface of the substrate (10B) which has a rectangular shape having a main surface (10a) and on which the circuit element (12) is mounted on the main surface (10a). (10a) A method of mounting a shield case (20B) having a ceiling portion (21B) and a frame portion (22B, 24) continuous to the ceiling portion so as to cover the circuit element (12). A pair of substrate positioning through holes (18) are formed near the first pair of corners facing each other on the first diagonal of the substrate (10B) so as to penetrate the front and back surfaces of the substrate. A step of drilling a pair of case positioning holes (28) in the position of the ceiling portion (21B) of the shield case corresponding to the pair of substrate positioning through holes, and the pair of substrate positioning Extending upward at a position corresponding to the through hole (18) In a state where the pair of positioning pins (41) are inserted into the pair of substrate positioning through holes (18) in a positioning jig (40) having a pair of positioning pins (41) to be (10B) is inserted, and the pair of positioning pins (41) are inserted into the pair of case positioning holes (28) so as to cover the circuit element (12). Inserting the shield case (20B) into the jig (40) and fixing the shield case (20B) on the main surface (10a) of the substrate (10B) by soldering (30). Thus, a shield case mounting method can be obtained.

  In the shield case mounting method according to the second aspect of the present invention, the substrates (10B) face each other on a second diagonal line intersecting the first diagonal line on the main surface (10a). A pair of case fixing land patterns (14) formed on the second pair of corners are provided, and the frame portion of the shield case is placed at a position corresponding to the pair of case fixing land patterns. You may have a chamfer (24). In this case, the fixing step includes a step of fixing the pair of chamfered portions (24) to the pair of case fixing land patterns (14) by the soldering (30).

  According to the third aspect of the present invention, a mother board (50) that can be divided into a plurality of substrates (10B) by cutting, a rectangular ceiling part (21B) and a frame part (22B) continuous to the ceiling part. 24), and a plurality of shield cases (20B) having a first diagonal line to each of the plurality of substrates (10B) defined on the mother board (50). Forming a pair of board positioning through holes (18) in the vicinity of one pair of corners so as to penetrate the front and back surfaces of the motherboard; and the ceiling part of each of the plurality of shield cases (20B) (21B), a step of forming a pair of case positioning holes (28) at positions corresponding to the pair of substrate positioning through holes (18), and a step of forming each of the plurality of substrates (10B). On the other hand, The positioning jig (40A) having a pair of positioning pins (41) extending upward at a position corresponding to the pair of substrate positioning through holes (18) is provided with the pair of substrate positioning through holes (18). In the state where the pair of positioning pins (41) are inserted into the motherboard, the step of inserting the mother board (50) and the pair of case positioning holes (for each of the plurality of shield cases (20B)) 28) inserting the plurality of shield cases (20B) into the positioning jig (40A) in a state where the pair of positioning pins (41) are inserted, and the plurality of shield cases (20B). A step of fixing on the mother board (50) by soldering (30), and a step of obtaining a plurality of high frequency modules by cutting the mother board. Method for producing a wave module is obtained.

  In the method for manufacturing a high-frequency module according to the third aspect of the present invention, each of the plurality of substrates (10B) defined on the mother board (50) has the first surface on the main surface (10a). Each of the plurality of shield cases (20B) has a pair of case fixing land patterns (14) formed on a second pair of corners facing each other on a second diagonal intersecting the diagonal. The frame portion may have a pair of chamfered portions (24) at positions corresponding to the pair of case fixing land patterns. In this case, in the fixing step, the pair of chamfered portions (24) of each of the plurality of shield cases (20B) is placed on the pair of case fixing land patterns (14) of the plurality of substrates. It consists of the process of fixing by said soldering (30).

  In addition, the code | symbol in the said parenthesis is attached | subjected in order to make an understanding of this invention easy, and it is only an example, and is not limited to these.

  In the present invention, since the positioning pins of the positioning jig are inserted into the substrate positioning through holes of the substrate and the case positioning holes of the shield case, the shield case can be easily positioned with respect to the substrate. Is possible.

  With reference to FIG. 3, the high frequency module which concerns on one embodiment of this invention is demonstrated. FIG. 3A is a diagram showing a state before the shield case is mounted, in which the upper side is a top view (plan view) and the lower side is a side view. FIG. 3B is a diagram showing a state after the shield case is mounted, in which the upper side is a top view (plan view) and the lower side is a side view.

  As shown in FIG. 3A, the high-frequency module includes a multilayer ceramic substrate 10B having a substantially rectangular shape and a shield case 20B.

  The multilayer ceramic substrate 10B has an upper surface 10a, and a mounted component 12 that is an electronic component is mounted on the upper surface 10a. The multilayer ceramic substrate 10B is obtained by laminating and integrating a plurality of ceramic sheets. The electronic component (mounted component) 12 includes a chip component such as an IC or a capacitor. The multilayer ceramic substrate 10B has a pair of substrate positioning through holes 18 penetrating the front and back surfaces of the multilayer ceramic substrate 10B in the vicinity of the first pair of corners facing each other on the first diagonal line. Each of the pair of substrate positioning through holes 18 has a circular cross section. The multilayer ceramic substrate 10B includes a pair of case fixing land patterns 14 formed on a second pair of corners facing each other on a second diagonal line intersecting the first diagonal line on the main surface 10a. Have.

  The illustrated shield case 20B has a ceiling portion 21B and a frame portion (described later) continuous to the ceiling portion 21B. Specifically, the ceiling portion 21B has a quadrangular shape in which a second pair of corner portions facing each other on the second diagonal line are chamfered. The frame portion includes four side wall portions 22B extending at right angles to a predetermined direction at four sides of the ceiling portion 21B, and a pair of chamfered portions 24 formed at corresponding positions of the pair of case fixing land patterns 14. Become. The ceiling portion 21B of the shield case 20B has a pair of case positioning holes 28 at positions corresponding to the pair of substrate positioning through holes 18. The pair of case positioning holes 28 has a circular shape with the same dimensions as the pair of substrate positioning through holes 18.

  Next, referring to FIG. 4 in addition to FIG. 3 (B), a shield case mounting method according to the first embodiment of the present invention will be described.

  In the present embodiment, a positioning jig 40 having a pair of positioning pins 41 extending upward at a position corresponding to the pair of substrate positioning through holes 18 as shown in FIG. Use. The pair of positioning pins 41 has a circular cross section that is slightly smaller than the pair of substrate positioning through holes 18. The length (height) of the pair of positioning pins 41 is longer (higher) than the sum of the thickness of the multilayer ceramic substrate 10B and the thickness (height) of the shield case 20B. The multilayer ceramic substrate 10B is inserted into the positioning jig 40 with the pair of positioning pins 41 inserted in the pair of substrate positioning through holes 18.

  Next, as shown in FIG. 4B, in a state where the pair of positioning pins 41 are inserted into the pair of case positioning holes 28 so as to cover the electronic component 12, Insert the shield case 20B.

  Finally, as shown in FIG. 4C, the shield case 20B is fixed onto the main surface 10a of the multilayer ceramic substrate 10B by soldering 30.

  Thus, in the first embodiment of the present invention, the pair of positioning pins 41 of the positioning jig 40 is replaced with the pair of substrate positioning through holes 18 of the multilayer ceramic substrate 10B and the pair of cases of the shield case 20B. Since it is inserted into the positioning hole 28, the shield case 20B can be easily positioned with respect to the multilayer ceramic substrate 10B.

  In the above-described first embodiment of the present invention, an example in which one shield case 20B is mounted on one multilayer ceramic substrate 10B is described. In this case, the outer dimension of the ceiling portion 21B of the shield case 20B is substantially the same as the outer dimension of the main surface 10a of the multilayer ceramic substrate 10B.

  With reference to FIG. 5 thru | or FIG. 7, the high frequency module manufacturing method which concerns on the 2nd Embodiment of this invention is demonstrated. In this example, a plurality of shield cases are collectively mounted on a motherboard.

  A motherboard 50 as shown in FIG. 5 is prepared. The mother board 50 is formed by stacking and integrating a plurality of ceramic sheets (not shown) and forming an inner via (not shown) therein. The mother board 50 can take a large number (in this example, nine) of the multilayer ceramic substrates 10B shown in FIG. 6A by cutting along the boundary lines 51a and 51b.

  Next, for each of the nine multilayer ceramic substrates 10B defined on the mother board 50, a pair of front and back surfaces of the mother board 50 are related in the vicinity of the first corners facing each other on the first diagonal. The substrate positioning through hole 18 is drilled.

  Next, a circuit pattern (not shown) and a pair of case fixing land patterns 14 are collectively printed on the surface (main surface) 50a of the mother board 50 corresponding to each of the nine multilayer ceramic substrates 10B. (It is formed. Here, the pair of case fixing land patterns 14 are formed on the second pair of corners facing each other on the second diagonal line intersecting the first diagonal line on the main surface 10a of each multilayer ceramic substrate 10B. It is formed.

  Next, the electronic component 12 such as an IC or a capacitor is mounted on the circuit pattern formed on the surface 50a of the mother board 50.

  On the other hand, a pair of case positioning holes 28 are formed in the ceiling portions 21B of the nine shield cases 20B at positions corresponding to the pair of substrate positioning through holes 18.

  Here, the outer dimension of the ceiling portion 21B of the shield case 20B is smaller than the dimension of the main surface 10a of the multilayer ceramic substrate 10B defined by the mother board 50, unlike the one shown in FIG.

  Next, as shown in FIG. 7A, for each of the nine multilayer ceramic substrates 10B, a pair of positioning members extending upward at positions corresponding to the pair of substrate positioning through holes 18 A positioning jig 40A having pins 41 is prepared. The mother board 50 is inserted into the positioning jig 40A in a state where the pair of positioning pins 41 are inserted into the pair of substrate positioning throughs 18.

  Next, as shown in FIG. 7B, for each of the nine shield cases 20B, the positioning jig 41 is inserted into the pair of case positioning holes 28. Nine shield cases 20B are inserted into the tool 40A. At this time, as shown in FIG. 7C, the frame portion of each shield case 20B is disposed inside the boundary lines 51a and 51b. Therefore, the nine shield cases 20B are arranged on the mother board 50 through the boundary lines 51a and 51b without contacting each other.

  Next, the soldering of the electronic components of the circuit pattern on the mother board 50 and the soldering 30 of the chamfered portion 24 to the case fixing land pattern 14 are collectively performed by a single reflow soldering process. As a result, the nine shield cases 20 </ b> B are fixed to the mother board 50 by the soldering 30.

  Next, after the mother board 50 to which the nine shield cases 20B are joined is taken out from the positioning jig 40A, the mother board 50 is cut at the boundary lines 51a and 51b by a dicer, as shown in FIG. 6B. Nine high-frequency modules are formed.

  As described above, in the second embodiment of the present invention, the positioning pins 41 of the positioning jig 40A are replaced with the plurality of substrate positioning through holes 18 of the motherboard 50 and the case positioning of the plurality of shield cases 20B. Since they are inserted into the holes 28, the plurality of shield cases 20B can be easily positioned with respect to the mother board 50. In any case, in the second embodiment of the present invention, when a plurality of shield cases are mounted together in the state of the mother board 50, a positioning jig in which positioning pins 41 are set up in accordance with all hole positions. 40A is used.

  Although the present invention has been described above with reference to preferred embodiments, it is needless to say that the present invention is not limited to the above-described embodiments. For example, in the above-described embodiment, a case has been described in which a substrate (motherboard) in which a plurality of ceramic sheets are stacked and integrated is used. However, a plurality of flexible substrates are stacked and integrated as a substrate (motherboard). Or a single plate material may be used. In the above-described embodiment, in order to solder and fix the shield case on the main surface of the substrate, a pair of case fixing land patterns are formed on the main surface of the substrate, and the frame portion of the shield case has a pair of frame portions. Although it has a chamfered portion, the soldering location is not limited to this. Further, in the above-described embodiment, the board positioning through hole, the case positioning hole, and the positioning pin have a circular cross section, but the cross sectional shape is not limited to a circular shape, and other shapes such as a rectangle and an ellipse are used. The shape may also be

It is a figure for demonstrating the 1st conventional shield case mounting method, (A) is a figure which shows the state before shield case mounting, an upper side is a top view (plan view), and a lower side is a side view. (B) is a figure which shows the state after mounting | wearing with a shield case, an upper side is a top view (plan view), and a lower side is a side view. It is a figure for demonstrating the 2nd conventional shield case mounting method, (A) is a figure which shows the state before shield case mounting, an upper side is a top view (plan view), and a lower side is a side view. (B) is a figure which shows the state after mounting | wearing with a shield case, an upper side is a top view (plan view), and a lower side is a side view. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure for demonstrating the high frequency module which concerns on one embodiment of this invention, (A) is a figure which shows the state before mounting | wearing with a shield case, an upper side is a top view (plan view), and a lower side is a side view. (B) is a figure which shows the state after mounting | wearing with a shield case, an upper side is a top view (plan view), and a lower side is a side view. It is a figure for demonstrating the shielding case mounting method which concerns on the 1st Embodiment of this invention, (A) is a front view which shows the state which inserts a board | substrate in a positioning jig, (B) is a positioning jig. It is a front view which shows the state which inserts a shield case in (C), and is a front view which shows the state which fixed the shield case on the main surface of a board | substrate by soldering. It is a schematic plan view which shows the motherboard used for the high frequency module manufacturing method which concerns on the 2nd Embodiment of this invention. It is a figure for demonstrating the high frequency module manufacturing method which concerns on the 2nd Embodiment of this invention, (A) is a figure which shows the state before shield case mounting | wearing, an upper side is a top view (plan view), The side is a side view, (B) is a view showing a state after the shield case is mounted, the upper side is a top view (plan view), and the lower side is a side view. It is a figure for demonstrating the high frequency module manufacturing method which concerns on the 2nd Embodiment of this invention, (A) is a front view which shows the state which inserts a motherboard in a positioning jig, (B) is a positioning jig. It is a front view which shows the state which inserts a several shield case in (C), and is a front view which shows the state which fixed the some shield case on the main surface of a motherboard by soldering.

Explanation of symbols

10B Multilayer ceramic substrate 10a Main surface 12 Electronic parts (mounted parts)
DESCRIPTION OF SYMBOLS 14 Case fixing land pattern 18 Substrate positioning through-hole 20B Shield case 21B Ceiling part 22B Side wall part 24 Chamfering part 28 Case positioning hole 30 Soldering 40, 40A Positioning jig 41 Positioning pin 50 Mother board (multilayer ceramic aggregate board) )
50a Main surface (surface)
51a, 51b boundary line

Claims (6)

A shield case having a rectangular shape having a main surface, a circuit board mounted on the main surface, a ceiling portion, and a frame portion continuous to the ceiling portion, the main surface of the substrate In the high frequency module having the shield case attached to cover the circuit element,
The substrate has a pair of substrate positioning through holes penetrating the front and back surfaces of the substrate in the vicinity of the first pair of corners facing each other on the first diagonal line,
The ceiling portion of the shield case has a pair of case positioning holes at positions corresponding to the pair of substrate positioning through holes.
A high-frequency module characterized by that. The substrate has a pair of case fixing land patterns formed on a second pair of corners facing each other on a second diagonal intersecting the first diagonal on the main surface,
The frame portion of the shield case has a pair of chamfered portions at positions corresponding to the pair of case fixing land patterns.
The high frequency module according to claim 1. A shield case having a rectangular shape having a main surface and having a ceiling portion and a frame portion continuous to the ceiling portion on the main surface of the substrate on which the circuit element is mounted on the main surface. It is a method of wearing so as to cover,
Drilling a pair of substrate positioning through holes in the vicinity of the first pair of corners facing each other on the first diagonal of the substrate so as to penetrate the front and back surfaces of the substrate;
Drilling a pair of case positioning holes at the position of the ceiling portion of the shield case corresponding to the pair of substrate positioning through holes;
The pair of positioning pins are inserted into the pair of substrate positioning through holes in a positioning jig having a pair of positioning pins extending upward at a position corresponding to the pair of substrate positioning through holes. In a state, inserting the substrate;
Inserting the shield case into the positioning jig in a state where the pair of positioning pins are inserted into the pair of case positioning holes so as to cover the circuit elements;
Fixing the shield case onto the main surface of the substrate by soldering. The substrate has a pair of case fixing land patterns formed on a second pair of corners facing each other on a second diagonal intersecting the first diagonal on the main surface, The frame portion of the shield case has a pair of chamfered portions at corresponding positions of the pair of case fixing land patterns,
4. The shield case mounting method according to claim 3, wherein the fixing step is a step of fixing the pair of chamfered portions to the pair of case fixing land patterns by the soldering. Using a motherboard that can be divided into a plurality of substrates by cutting, and a plurality of shield cases each having a rectangular ceiling portion and a frame portion continuous to the ceiling portion,
For each of the plurality of substrates defined on the motherboard, a pair of substrate positioning so as to penetrate the front and back surfaces of the motherboard in the vicinity of the first pair of corners facing each other on a first diagonal line Forming a through-hole for use,
Drilling a pair of case positioning holes in positions corresponding to the pair of substrate positioning through holes, with respect to the ceiling portion of each of the plurality of shield cases;
For each of the plurality of substrates, a positioning jig having a pair of positioning pins extending upward at a position corresponding to the pair of substrate positioning through holes, the pair of substrate positioning through holes Inserting the motherboard with the pair of positioning pins inserted; and
Inserting the plurality of shield cases into the positioning jig in a state where the pair of positioning pins are inserted into the pair of case positioning holes for each of the plurality of shield cases;
Fixing the plurality of shield cases on the motherboard by soldering;
And a step of obtaining a plurality of high-frequency modules by cutting the mother board. Each of the plurality of substrates defined on the mother board is formed in a second pair of corners opposed to each other on a second diagonal line intersecting the first diagonal line on the main surface. Each of the plurality of shield cases has a pair of chamfered portions at corresponding positions of the pair of case fixing land patterns,
The fixing step is a step of fixing the pair of chamfered portions of each of the plurality of shield cases to the pair of case fixing land patterns of the plurality of substrates by the soldering. 5. A method for manufacturing a high-frequency module according to 5.

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