JPH0230199B2 - FUKUGOPURINTOHAISENBANNOSEIZOHOHO - Google Patents
FUKUGOPURINTOHAISENBANNOSEIZOHOHOInfo
- Publication number
- JPH0230199B2 JPH0230199B2 JP16387984A JP16387984A JPH0230199B2 JP H0230199 B2 JPH0230199 B2 JP H0230199B2 JP 16387984 A JP16387984 A JP 16387984A JP 16387984 A JP16387984 A JP 16387984A JP H0230199 B2 JPH0230199 B2 JP H0230199B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- substrate
- circuit board
- flexible
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 80
- 229910000679 solder Inorganic materials 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 21
- 239000002131 composite material Substances 0.000 claims description 19
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 2
- 239000010408 film Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は可撓性プリント基板（以下可撓性基
板という）と硬質プリント基板（以下硬質基板と
いう）とを組合せて構成される複合プリント基板
に関し、可撓性基板と硬質基板とを接合し、可撓
性基板に装貼した半田を熱溶融することにより、
電気的に信頼性の高い配線接続できる複合プリン
ト基板の製造方法を提供するものである。特に本
発明は、立体的なプリント配線基板が要求される
電子機器の小型化を可能とするものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a composite printed circuit board constructed by combining a flexible printed circuit board (hereinafter referred to as a flexible printed circuit board) and a rigid printed circuit board (hereinafter referred to as a rigid printed circuit board). Regarding this, by joining a flexible substrate and a hard substrate and thermally melting the solder attached to the flexible substrate,
The present invention provides a method for manufacturing a composite printed circuit board that allows electrically reliable wiring connections. In particular, the present invention enables miniaturization of electronic devices that require three-dimensional printed wiring boards.
最近、電子機器の軽量化、薄型化および短小化
の要求から、それに使用されるプリント配線基板
は高密度化、多層化および立体化されている。特
に限られた空間を立体的に利用するために可撓性
基板と硬質基板とを接合し、可撓性基板を折曲げ
立体的な回路を形成する試みがなされてきた。ま
た、可撓性基板と硬質基板をを電気的に信頼性の
高い接続を行なう目的で、多くの技術が提案され
ている。
Recently, due to the demand for lighter, thinner, and shorter electronic devices, the printed wiring boards used therein have become more dense, multilayered, and three-dimensional. In particular, in order to utilize limited space three-dimensionally, attempts have been made to bond a flexible substrate and a rigid substrate, and to form a three-dimensional circuit by bending the flexible substrate. Furthermore, many techniques have been proposed for the purpose of electrically connecting a flexible substrate and a rigid substrate with high reliability.
例えば（）特開昭53−25866号公報には、フ
レキシブル基板の配線パターン導電部に透孔を形
成し、その透孔より大径なるリード線挿入孔を有
する硬質基板とを帖合せ後フレキシブル基板の配
線パターン導電部を硬質基板の孔内壁部に絞り込
み、内壁部パターンと上記リード線とを半田付け
により固着し得るようにしたプリント配線板の製
造方法が開示されている。 For example, in Japanese Patent Application Laid-Open No. 53-25866, a through hole is formed in the conductive portion of the wiring pattern of a flexible board, and after the flexible board is assembled with a hard board having a lead wire insertion hole with a diameter larger than that of the through hole, the flexible board is A method of manufacturing a printed wiring board is disclosed in which a conductive portion of a wiring pattern is formed on an inner wall of a hole of a hard substrate, and the inner wall pattern and the lead wire can be fixed by soldering.
次に、（）特開昭54−157271号公報には硬質
基板とフレキシブル基板とに、その両者に一体化
したスルーホールを形成せしめたことを特徴とす
る硬質フレキシブル基板複合印刷配線板が開示さ
れている。 Next, JP-A-54-157271 discloses a hard-flexible board composite printed wiring board characterized in that a through-hole is formed integrally in a hard board and a flexible board. ing.
また、（）特開昭55−77094号公報には硬質基
板にスルーホールを設けフレキシブル基板のガス
抜き穴を有する接続端子をスルーホール上に重ね
合せ、硬質基板に電気部品をマウントする半田付
け工程時にスルーホールを上昇する半田により接
合するフレキシブル基板と硬質基板との接続法が
開示されている。 In addition, Japanese Patent Application Laid-open No. 55-77094 discloses a soldering process in which a through hole is formed in a hard board, a connection terminal with a gas vent hole of a flexible board is superimposed on the through hole, and electrical components are mounted on the hard board. A method of connecting a flexible substrate and a rigid substrate is disclosed, in which a flexible substrate and a rigid substrate are bonded together by solder that sometimes rises through a through hole.
そして、（）特開昭56−115593号公報にはフ
レキシブル基板の接続部をなす導体ランド部およ
び穴部の大きさを硬質基板のそれよりも大きくす
ると共に、ランド径は対応した大きさとし、これ
ら接続部を互に重ね合せて固着した後、フレキシ
ブル基板側から半田を盛り上げ接続してなること
を特徴とするフレキシブル基板の接続方法が開示
されている。 JP-A-56-115593 discloses that the sizes of the conductor lands and holes that form the connection parts of the flexible board are made larger than those of the rigid board, and the land diameter is made to correspond to the size of the A method for connecting flexible substrates is disclosed, which is characterized in that after the connecting portions are overlapped and fixed together, solder is applied from the flexible substrate side for connection.
さらにまた、（）特開昭57−121297号公報に
は両面に導電性を有する配線パターンが形成され
た第１の基板と少なくとも片面に導電性を有する
パターンが形成された第２の基板とを、相互の配
線パターンに形成された透孔付き接続ランドが対
向するように且つ、この接続ランドには空隙が生
じるように重合する工程と重合された両プリント
基板において、第１のプリント基板面から半田デ
イツピングする工程とを含む複合プリント基板の
製造方法が開示されている。 Furthermore, JP-A No. 57-121297 discloses a first substrate on which a conductive wiring pattern is formed on both sides, and a second substrate on which a conductive pattern is formed on at least one side. , a step of superimposing so that the connection lands with through holes formed in the mutual wiring patterns face each other and a gap is created in the connection lands; and in both of the superposed printed circuit boards, A method of manufacturing a composite printed circuit board is disclosed, which includes a step of solder dipping.
このように（）〜（）のプリント配線基板
およびその製造法においていずれもフレキシブル
基板と硬質基板との接続箇所の接続を確実に行な
うと同時にフレキシブル基板の持つている屈曲性
を利用して立体的な配線回路を形成することを目
的としたものである。 In this way, the printed wiring boards () to () and their manufacturing methods all reliably connect the connection points between the flexible board and the rigid board, and at the same time utilize the flexibility of the flexible board to create a three-dimensional shape. The purpose is to form a wiring circuit.
前記（）によつて接合されたフレキシブル基
板と硬質基板との接合部は、フレキシブル基板の
導電部を絞り込むために多大の時間を費し、経済
的な接合方法ではない。また前記（）はフレキ
シブル基板と硬質基板とを一体化し、スルホール
形成されているため接続の信頼性は著しく改善さ
れるが両基板を一体化後穴明、メツキ、パターニ
ング、エツチング等の加工を行なうもので、工程
が複雑であり、両面に配線回路を有する基板への
適用は難かしく立体的な高密度配線回路を得るこ
とができない。
The joint between the flexible substrate and the rigid substrate in the above method () requires a lot of time to narrow down the conductive parts of the flexible substrate, and is not an economical joining method. Also, in () above, a flexible substrate and a hard substrate are integrated and through holes are formed, so the reliability of the connection is significantly improved, but after the two substrates are integrated, processing such as drilling, plating, patterning, etching, etc. is performed. However, the process is complicated, and it is difficult to apply to a board having wiring circuits on both sides, making it impossible to obtain a three-dimensional high-density wiring circuit.
そして（）は、両面硬質基板のスルホール上
にガス抜き穴を有するフレキシブル基板の接続端
子をスルホール上に重ね合せ半田接合する場合に
硬質基板とフレキシブル基板とを治具により固定
した状態で半田付けする必要があり量産性に乏し
い。 In parentheses, when connecting terminals of a flexible board that has gas vent holes on a double-sided hard board are stacked and soldered onto the through-holes, the hard board and flexible board are fixed with a jig and then soldered. It is necessary and is not suitable for mass production.
（）、（）はいずれも半田デイツピングによ
りフレキシブル基板と硬質基板との配線接続を行
なうもので、一般にフレキシブル基板側から半田
を盛り上げることにより配線接続を行なうためチ
ツプ部品等の実装位置に制約を受ける。又硬質基
板側から半田を盛り上げる場合に径が１mm以下の
配線接続穴においてブローホールが多発し、信頼
性の高い配線接続ができない。又配線接続穴径を
１mm以上とすると盛り上がつた半田を落下による
信頼性低下が起こり易い等の欠点を有していた。 Both () and () connect wiring between a flexible board and a hard board using solder dipping.Generally, wiring connections are made by piling up solder from the flexible board side, so there are restrictions on the mounting position of chip components, etc. . Furthermore, when applying solder from the hard substrate side, blowholes occur frequently in wiring connection holes with a diameter of 1 mm or less, making it impossible to make highly reliable wiring connections. Furthermore, if the diameter of the wiring connection hole is 1 mm or more, there is a drawback that reliability is likely to be lowered due to the solder bulge falling off.
本発明はこのような欠点を解決するためになさ
れたもので高密度に配線された硬質基板と可撓性
基板との電気接続を信頼性の高くすることのでき
る複合プリント基板の製造方法を提供するもので
ある。 The present invention has been made to solve these drawbacks, and provides a method for manufacturing a composite printed circuit board that can make the electrical connection between a rigid board and a flexible board with high density wiring highly reliable. It is something to do.
本発明によれば、可撓性基板と硬質基板とを配
線接続するために、可撓性基板および硬質基板は
それぞれ対向する配線接続部に接続穴を設ける。
この場合、可撓性基板の接続穴径は硬質基板のそ
れよりも大きくすることが有利である。
According to the present invention, in order to connect the flexible substrate and the rigid substrate by wiring, the flexible substrate and the rigid substrate are provided with connection holes in the wiring connection portions facing each other.
In this case, it is advantageous that the connection hole diameter of the flexible substrate is larger than that of the rigid substrate.
可撓性基板と硬質基板との配線接続穴が相互に
対向する位置に整合させ、配線接続穴周囲に空隙
が設けられるように接着層を設け、接合硬化され
る。このようにして可撓性基板と硬質基板とを接
合する工程のあと可撓性基板面に半田を装貼した
後加熱溶融する工程により溶融半田を硬質基板の
配線接続穴まで流入させ、極めて信頼性の高い電
気接続を得ることができる。 The flexible substrate and the rigid substrate are aligned so that the wiring connection holes face each other, an adhesive layer is provided so that a gap is provided around the wiring connection hole, and the bonding is cured. In this way, after the process of joining the flexible board and the hard board, the solder is attached to the surface of the flexible board and then heated and melted, allowing the molten solder to flow into the wiring connection hole of the hard board, making it extremely reliable. A highly reliable electrical connection can be obtained.
上記配線接続穴の周囲には導電接続ランドが設
けられていると同時に配線接続表面は銅、半田、
金、スズなどの材料で構成されている。可撓性基
板および硬質基板の片面あるいは両面は半田レジ
スト用のカバーフイルムあるいはインクにより必
要部分を保護している。 A conductive connection land is provided around the wiring connection hole above, and at the same time, the wiring connection surface is made of copper, solder, etc.
It is made of materials such as gold and tin. One or both sides of the flexible substrate and the rigid substrate are protected with a cover film or ink for solder resist.
本発明において使用できる可撓性基板の基材と
しては、ポリイミド樹脂、エポキシ樹脂、ビスマ
レイミドトリアジン樹脂、ポリエステル樹脂など
のフイルムおよびそれらとガラスクロスとの複合
化されたものがある。また、接着層は熱硬化性樹
脂を加熱硬化することにより構成することができ
る。 Examples of the base material of the flexible substrate that can be used in the present invention include films of polyimide resin, epoxy resin, bismaleimide triazine resin, polyester resin, and composites of these and glass cloth. Further, the adhesive layer can be formed by heating and curing a thermosetting resin.
一方、硬質基板は、通常ガラスエポキシ基板が
用いられるが、ガラスポリイミド、ガラスエポキ
シコンポジツト、紙フエノール基板であつてもよ
い。 On the other hand, as the hard substrate, a glass epoxy substrate is usually used, but it may also be a glass polyimide, glass epoxy composite, or paper phenol substrate.
また、本発明によつて得られた複合プリント基
板は立体的に配線回路を形成するはめに多く使用
されることから、硬質基板は可撓性基板と半田溶
融により配線接続した後、可撓性基板の折曲げ部
分に対応する硬質基板の不要部分は予め、スリツ
トあるいはミシン目等により容易に取除き可能と
するため加工されたものを使用し、且つ取除かれ
る不要部分は可撓性基板と接着されていない。 In addition, since the composite printed circuit board obtained by the present invention is often used to form three-dimensional wiring circuits, the hard board is connected to the flexible board by solder melting, and then the flexible board is connected to the flexible board by solder melting. The unnecessary parts of the rigid board corresponding to the bent parts of the board are processed in advance by slits or perforations so that they can be easily removed, and the unnecessary parts to be removed are made of flexible boards. Not glued.
以下本発明を図面を参照しつゝ詳しく説明す
る。第１図は可撓性基板と硬質基板とを接着層を
介して接合し、その両者を配線接続するための半
田ペーストを印刷した状態の配線接続穴断面図で
ある。 The present invention will be described in detail below with reference to the drawings. FIG. 1 is a cross-sectional view of a wiring connection hole in a state where a flexible substrate and a rigid substrate are bonded via an adhesive layer and solder paste is printed for wiring connection between the two.
第２図は印刷した半田ペーストを加熱溶融し、
配線接続穴の中へ落とし込んだ状態の配線接続穴
断面図である。 Figure 2 shows the printed solder paste heated and melted.
FIG. 3 is a sectional view of the wiring connection hole in a state where it has been dropped into the wiring connection hole.
可撓性基板１に形成された配線接続穴２の表面
が露出するように半田レジスト膜３が設けられて
いる。硬質基板４にも同様に配線接続穴５と半田
レジスト膜６が設けられている。可撓性基板と硬
質基板は接着層７により接合硬化されている。 A solder resist film 3 is provided so that the surface of the wiring connection hole 2 formed in the flexible substrate 1 is exposed. Similarly, the hard substrate 4 is also provided with a wiring connection hole 5 and a solder resist film 6. The flexible substrate and the rigid substrate are bonded and hardened by an adhesive layer 7.
この接着層は可撓性基板と硬質基板のそれぞれ
対向する配線接続穴の周囲に空隙が設けられてい
る。可撓性基板上に印刷された半田ペースト８は
加熱溶融し、硬質基板の配線接続穴へ落し込むこ
とができる。また、同様に半田は印刷法以外にデ
イスペンサー等により装貼形成されていてもよ
い。溶融固化後の半田９が形成され、可撓性基板
と硬質基板との電気的信頼性の高い配線接続が行
なわれる。この場合装貼される半田の量は可撓性
基板と硬質基板の配線接続穴体積と接着層に設け
られた空隙の体積を目安として決定することが好
ましい。 In this adhesive layer, gaps are provided around opposing wiring connection holes in the flexible substrate and the rigid substrate, respectively. The solder paste 8 printed on the flexible substrate is heated and melted, and can be dropped into the wiring connection hole of the rigid substrate. Moreover, similarly, the solder may be applied and formed using a dispenser or the like instead of the printing method. Solder 9 is formed after being melted and solidified, and wiring connection with high electrical reliability is made between the flexible substrate and the hard substrate. In this case, the amount of solder to be pasted is preferably determined based on the volume of the wiring connection hole in the flexible substrate and the hard substrate and the volume of the void provided in the adhesive layer.
また、このようにして配線接続された複合プリ
ント基板へ、電子部品を面付実装又は挿入実装し
部品付を行なうに際し、半田溶融槽へ浸される。
この場合、硬質基板の配線接続穴径は0.8mm以下
が好ましい。0.8mm以上の配線接続穴においては、
半田の加熱溶融による、配線接続後、半田溶融槽
に浸されたときに、配線接続された半田が落下
し、配線接続部の電気的信頼性が低下する。 Further, when surface-mounting or insert-mounting electronic components onto the composite printed circuit board wire-connected in this manner, the electronic components are immersed in a solder melting bath.
In this case, the wiring connection hole diameter of the hard substrate is preferably 0.8 mm or less. For wiring connection holes of 0.8mm or more,
After wiring is connected by heating and melting the solder, when the wiring is immersed in a solder melting tank, the solder connected to the wiring falls, reducing the electrical reliability of the wiring connection.
さらに、配線接続の信頼性を高めるために、接
着槽７は配線接続穴のランド部分が被覆されない
ように設けることが好ましい。 Further, in order to improve the reliability of the wiring connection, it is preferable that the adhesive tank 7 is provided so that the land portion of the wiring connection hole is not covered.
回路配線および部品配置する上で可撓性基板と
硬質基板とに設けられた配線接続穴へ部品リード
を挿入し、半田溶融槽へ浸すことによつて、半田
盛り上げによる配線接続する部分と本発明による
半田の加熱溶融による配設接続との組合せにより
接続することも可能である。 When arranging circuit wiring and components, component leads are inserted into the wiring connection holes provided in the flexible substrate and the rigid substrate, and the parts are connected by solder build-up by inserting the component leads into the wiring connection holes provided in the flexible substrate and the hard substrate, and by immersing them in the solder melting tank. It is also possible to connect by combining the arrangement and connection by heating and melting solder.
第３図は複数個の硬質基板と可撓性基板とを配
線接続した状態の断面図である。立体的な配線回
路を形成するための折曲げ部分あるいは不要部分
１０は本発明による配線接続および部品実装後容
易に取り除くことができるように、硬質基板は予
め、その折曲げ部分および不要部分と必要部分と
の間にミシン目あるいはスリツト１１加工し、一
体化された状態で可撓性基板と接着層を介し接合
硬化する。同時に折曲げ部分および不要部分は容
易に除去するため、接着層を設けない。 FIG. 3 is a sectional view of a state in which a plurality of rigid substrates and flexible substrates are connected by wiring. The hard board is preliminarily separated from the bent portions and unnecessary portions 10 so that the bent portions or unnecessary portions 10 for forming a three-dimensional wiring circuit can be easily removed after wiring connection and component mounting according to the present invention. Perforations or slits 11 are formed between the parts, and the integrated state is bonded and hardened to the flexible substrate via an adhesive layer. At the same time, no adhesive layer is provided on the bent portions and unnecessary portions so that they can be easily removed.
本発明において可撓性基板と硬質基板との配線
接続は単に端子を接続するだけでなく、配線接続
穴を介して多層構造をもつた基板とすることがで
きる特徴がある。 In the present invention, the wiring connection between the flexible substrate and the rigid substrate is not limited to simply connecting terminals, but is also characterized in that it is possible to form a substrate with a multilayer structure through wiring connection holes.
部品実装時の半田溶融槽への浸漬面は可撓性基
板側および硬質基板側どちらから行なつてもよい
が、立体配線回路の外形の平坦性を得るため通常
チツプ部品を硬質基板面へ装着し、半田溶融槽へ
浸漬する場合が多い。 When mounting components, immersion into the solder melting tank can be done from either the flexible board side or the hard board side, but chip parts are usually mounted on the hard board side in order to obtain flatness of the external shape of the three-dimensional wiring circuit. However, it is often immersed in a solder melting tank.
また、本発明において使用する可撓性基板とし
て通常ポリイミド樹脂、エポキシ樹脂、ビスマレ
イミドトリアジン樹脂、あるいはポリエステル樹
脂からなるフイルムを使用する。しかしながら高
密度配線回路の配線接続においては、可撓性基板
と硬質基板とを接着層を介して接合するときにそ
れぞれの対向する配線接続穴位置の精度を高める
必要があり、ガラスクロスと前記樹脂とで複合化
された可撓性基板を使用することが好ましい。 Further, as the flexible substrate used in the present invention, a film usually made of polyimide resin, epoxy resin, bismaleimide triazine resin, or polyester resin is used. However, in wiring connections for high-density wiring circuits, when bonding a flexible substrate and a rigid substrate via an adhesive layer, it is necessary to increase the precision of the positions of the wiring connection holes that face each other. It is preferable to use a flexible substrate composited with.
この複合化された可撓性基板の板厚は0.3mm以
下のものが使用できる。 The thickness of this composite flexible substrate can be 0.3 mm or less.
以上説明したように本発明によれば、可撓性基
板と硬質基板との複合プリント基板の接続方法
は、半田ブローホール半田落下などの従来法によ
り配線接続において発生した問題点を本質的に解
決することができる。そして本発明によれば、配
線接続の高い信頼性が得られることから、端子の
接続のみならず可撓性基板と硬質基板との多層配
線構造を持つた高密度配線回路形成を立体回路形
成と同時に行なうことができる利点がある。
As explained above, according to the present invention, the method for connecting a composite printed circuit board with a flexible board and a rigid board essentially solves the problems that occur in wiring connections by conventional methods such as solder blowhole solder drop. can do. According to the present invention, since high reliability of wiring connections can be obtained, not only terminal connections but also high-density wiring circuit formation with a multilayer wiring structure of a flexible substrate and a rigid substrate can be formed using three-dimensional circuit formation. There is an advantage that they can be done at the same time.
このように本発明は電子機器の軽薄短小化およ
び立体化の行なううえで極めて有用なものであ
る。 As described above, the present invention is extremely useful for making electronic equipment lighter, thinner, shorter, and three-dimensional.
第１図は本発明による半田ペースト印刷工程後
の配線接続穴の断面図、第２図は本発明による半
田ペースト印刷後半田を加熱溶融工程により配線
接続された配線接続穴の断面図、第３図は、本発
明によつて得られた複合プリント基板の一実施例
を示す断面図である。
１……可撓性基板、２……配線接続穴、３……
半田レジスト、４……硬質基板、５……配線接続
穴、６……半田レジスト、７……接着層、８……
半田ペースト、９……加熱溶融された半田、１０
……折曲げするための取除かれる部分、１１……
スリツト。
FIG. 1 is a sectional view of a wiring connection hole after the solder paste printing process according to the present invention, FIG. The figure is a sectional view showing an example of a composite printed circuit board obtained by the present invention. 1... Flexible board, 2... Wiring connection hole, 3...
Solder resist, 4... Hard substrate, 5... Wiring connection hole, 6... Solder resist, 7... Adhesive layer, 8...
Solder paste, 9...Heat-melted solder, 10
...Removed part for bending, 11...
Slits.
Claims (1)
撓性基板と両面もしくは多層に印刷配線回路を有
する硬質基板とを配線接続する複合プリント基板
の製造方法において、可撓性基板と硬質基板との
配線接続穴を相互に対向するように設け、且つ配
線接続穴の周囲に空間を有するように接着層を介
して積層する工程と、可撓性基板と硬質基板の配
線接続部の一部又は全部を、可撓性基板表面へ装
貼された半田を加熱溶融することにより接続する
工程とを少くとも含むことを特徴とする複合プリ
ント基板の製造方法。 ２ 硬質基板の不要部分および取除く部分には接
着層が存在していないことを特徴とする特許請求
の範囲第１項記載の複合プリント基板の製造方
法。 ３ 硬質基板の配線接続穴径が0.8mm以下である
ことを特徴とする特許請求の範囲第１項記載の複
合プリント基板の製造方法。 ４ 可撓性基板と硬質基板との配線接続が多層配
線構造になるように接続することを特徴とする特
許請求の範囲第１項記載の複合プリント基板の製
造方法。 ５ 可撓性基板基材としてポリイミド樹脂、エポ
キシ樹脂、ビスマレイミドトリアジン樹脂、ポリ
エステル樹脂のいずれかからなるフイルムあるい
は、それらの樹脂とガラスクロスとを複合化した
基材を使用することを特徴とする特許請求の範囲
第１項記載の複合プリント基板の製造方法。[Claims] 1. A method for manufacturing a composite printed circuit board in which a flexible substrate having a printed wiring circuit on one or both sides and a rigid substrate having printed wiring circuits on both sides or in multiple layers is connected by wiring. A process of forming wiring connection holes with the hard substrate so as to face each other and laminating them via an adhesive layer so as to have a space around the wiring connection holes, and a process of laminating the wiring connection part between the flexible substrate and the hard substrate. 1. A method for manufacturing a composite printed circuit board, the method comprising at least the step of connecting a part or all of the circuit board to the surface of the flexible circuit board by heating and melting solder attached to the surface of the flexible circuit board. 2. The method for manufacturing a composite printed circuit board according to claim 1, characterized in that no adhesive layer is present in unnecessary parts and parts to be removed of the hard board. 3. The method for manufacturing a composite printed circuit board according to claim 1, wherein the wiring connection hole diameter of the hard substrate is 0.8 mm or less. 4. The method of manufacturing a composite printed circuit board according to claim 1, characterized in that the flexible substrate and the rigid substrate are connected so as to form a multilayer wiring structure. 5. The flexible substrate is characterized by using a film made of polyimide resin, epoxy resin, bismaleimide triazine resin, or polyester resin, or a composite material of these resins and glass cloth. A method for manufacturing a composite printed circuit board according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16387984A JPH0230199B2 (en) | 1984-08-06 | 1984-08-06 | FUKUGOPURINTOHAISENBANNOSEIZOHOHO |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16387984A JPH0230199B2 (en) | 1984-08-06 | 1984-08-06 | FUKUGOPURINTOHAISENBANNOSEIZOHOHO |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6236900A JPS6236900A (en) | 1987-02-17 |
| JPH0230199B2 true JPH0230199B2 (en) | 1990-07-04 |
Family
ID=15782521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16387984A Expired - Lifetime JPH0230199B2 (en) | 1984-08-06 | 1984-08-06 | FUKUGOPURINTOHAISENBANNOSEIZOHOHO |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0230199B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0347341Y2 (en) * | 1985-12-18 | 1991-10-08 | ||
| JPH01135774U (en) * | 1988-03-10 | 1989-09-18 | ||
| JP2757594B2 (en) * | 1991-07-17 | 1998-05-25 | 日立電線株式会社 | Film carrier equipment |
| US7745912B2 (en) * | 2005-03-25 | 2010-06-29 | Intel Corporation | Stress absorption layer and cylinder solder joint method and apparatus |
-
1984
- 1984-08-06 JP JP16387984A patent/JPH0230199B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6236900A (en) | 1987-02-17 |
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