JPH0563112B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for manufacturing a high-density mounting module in which chip components are built into a board using solder bumps.

(Conventional technology) Multiple resin substrates with wiring patterns are laminated,
For the purpose of miniaturization, holes are provided in the multilayer substrate for embedding components such as ceramic chip capacitors and chip resistors, and the components are inserted into the holes and soldered together using solder bumps. There are high-density mounting modules for communication equipment.

(Problem to be Solved by the Invention) Conventionally, chip parts used in this type of device are small in size, for example, with external dimensions of 0.5 mm in width and 1.0 mm in length. When forming solder bumps on a surface, the amount of solder on the solder bumps becomes uneven, and when stacking components with built-in components, excessive solder tends to cause short circuits between circuit patterns and between different poles of components, resulting in a large number of short circuits. It is difficult to embed parts. Furthermore, since the amount of solder at the bonded portion is non-uniform, there is a problem in that when a large number of substrates are bonded together and a thermal shock is applied, the bonded portion is likely to peel off. As a countermeasure for this, there is a method of printing solder in advance on the circuit pattern on the mounting side of the component and raising the temperature to form solder bumps, but it is difficult to align the mounting land bump surface and the component to be embedded. However, the problem was that it was difficult to mount a large number of components.

(Means for Solving the Problem) In order to solve these problems, the present invention provides a hole for embedding components in a board having a circuit pattern, inserts the component in advance, and fixes the surplus area and the inserted component. It is characterized by filling a resin and curing it, configuring a component mounting land on the same plane as the circuit pattern surface, and configuring solder bumps on the component mounting area.The purpose is to distribute a uniform amount of solder. The purpose of the present invention is to provide a high-density mounting module that does not cause short circuits due to bumps, is strong against thermal shock, and has a large number of components embedded therein.

This will be explained in detail below using the drawings.

(Example) Fig. 1 is an explanatory diagram of an embodiment of the present invention, and is an explanatory diagram of a process for fixing components to a substrate, and Fig. 2 is an explanatory diagram of an embodiment of the present invention.
Fig. 3 is an explanatory diagram of the process of fixing components to a board and configuring a mounting land for the components on the same plane as the circuit pattern. FIG. 3 is a cross-sectional view of the substrate.
In the figure, 1 is a first layer board on which components are embedded and has a circuit pattern, 2 is a hole for embedding components, 3 is a circuit pattern on the first layer board 1, and 4 is a mounting of the circuit pattern and the embedding components. A positioning film that is simply used to make the parts on the same plane, 5 is a part for embedding such as a chip condenser,
6 is a resin filled to fix the embedded component to the first layer board; 7 is a mounting land for the embedded component; 8 is a solder bump formed on the mounting land for the embedded component;
9 is a solder bump formed on the circuit pattern of the first layer for bonding with the circuit pattern of the second layer board; 1
1 is a resin for filling voids.

In carrying out the present invention, an embedding component 5 having an external circuit such as a ceramic chip capacitor and a mounting electrode is placed in advance into a embedding hole 2 provided in a first layer substrate 1 made of a glass epoxy resin material or the like. For example, a polyether ether ketone film having adhesive properties is bonded to the positioning film 4 which is pressed and bonded at elevated temperatures to both sides that abut the second layer substrate 10 to obtain the structure shown in FIG. After that, a liquid resin having bonding properties such as epoxy resin is injected into the hole 2, solidified, and the parts are filled with the filling resin 6 into the first layer substrate 1.
Fix it in the hole 2 of. Furthermore, when the positioning film 4 is peeled off from the substrate bonding surface, the mounting land of the embedding component 5 is positioned on the same surface as the circuit pattern 3 surface. For example, a 325 mesh screen is used to print solder cream on the part where the second layer board 10 and the circuit pattern 3 are joined and on the mounting land 7 of the embedded component 5, and the temperature is increased to melt the solder. Solder bumps 8 and 9 are formed to obtain the configuration shown in FIG. After cleaning with an organic solvent so that no flux components are present on the interface surface when laminating with the second layer substrate 10, the second layer substrate 10 and the second layer substrate 10 are brought into contact with each other to achieve positional accuracy via a pin guide or the like. Furthermore, the temperature is increased while applying pressure using a jig or the like so that a uniform load is applied to the entire surface of the substrate, and the circuit pattern 11 of the second layer substrate 10 is bonded to the circuit pattern 11 of the second layer substrate 10 via the solder bumps 8.
After laminating the third and fourth layer substrates using the same method and structure, liquid resin 12 is applied to the gap between the substrates.
is vacuum-injected to obtain a high-density mounting module with a multilayer structure of a board with built-in components.

To further explain, when configuring multi-layers of this type of component via solder bumps for embedding on the board, the solder joint surfaces are flat, and it is difficult to bond with a small amount due to the thermal shock caused by multi-layering. This prevents problems such as peeling of the bonded surface. In addition, it is effective to obtain a uniform thickness on the same plane when bonding substrates without any gaps in the bonded portion of the substrates, as a measure to prevent similar defects.According to the present invention, the amount of solder bumps Because it is possible to accurately configure the circuit pattern, the conductor such as copper foil that makes up the circuit pattern on the board is deposited by vacuum evaporation or sputtering.
By setting the thickness of the solder bumps to a micrometer or less and making the thickness of the solder bumps a very small amount, it is possible to form a multilayer structure without voids only by joining the solder bumps without intervening a resin filled in the bonded portion of the substrates.

(Effect of the invention) As explained above, a component is inserted into a board having a circuit pattern and a hole for embedding the component, the component is held on the same plane as the circuit pattern, and a half-tone cream is printed and soldered. By forming bumps and bonding them to different boards, it is possible to create multiple layers with a uniform amount of solder and a very small amount of solder, so parts can be created without shorting between circuits and without being damaged by thermal shock. It has the advantage of providing a built-in high-density mounting module.

[Brief explanation of the drawing]

1 and 2 are process explanatory diagrams of an embodiment of the present invention, and FIG. 3 is a sectional view of the embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... First layer board, 2... Hole, 3... Circuit pattern of first layer board, 4... Positioning film, 5... Parts for embedding, 6... Resin to be filled.
7... Mounting land for embedding parts, 8... Solder bumps for embedding parts, 9... Solder bumps for circuit pattern bonding, 10... Second layer board, 11... Gap filling resin.

Claims (1)

[Scope of Claims] 1. A resin substrate having a circuit pattern, a means for drilling a hole in the resin substrate for embedding a component, and a means for placing the component mounted on a positioning film in the hole on the same plane as the circuit pattern. 1. A high riser characterized by comprising: means for filling the hole with resin for fixing the component; and means for bonding a plurality of substrates together via solder bumps provided on the component. A method for manufacturing a density-mounted module. 2. A method for producing a high-density mounting module, characterized in that the positioning film according to claim 1 is made of polyetheretherketone.