JP2002237683A - Method for manufacturing circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board, capable of incorporating electronic components in the circuit board with high positional accuracy. SOLUTION: The method for manufacturing the circuit board comprises the step of first blocking one opening 21a of a through-hole 21 with a pressure sensitive adhesive 24, so that the adhesive 24 is directed toward the inside, so as to dispose a capacitor element 13 in the hole 21. The method further comprises the steps of filling a filling resin 4 in the hole 21, in a state in which the element 13 is adhered to a sheet material 23, when the element 13 is disposed in the hole 21, and causing the resin to cure. Thus, the element 13 can be disposed in the hole 21 with high positional accuracy, that is, inside a circuit board body 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a wiring board containing electronic components.

[0002]

2. Description of the Related Art Conventionally, integrated circuit elements (hereinafter referred to as "IC
In order to reduce the switching noise of the IC chip and stabilize the operating power supply voltage, a capacitor element is provided on the wiring board on which the chip is mounted. However, when the capacitor element is provided on the wiring board, the longer the wiring length between the IC chip and the capacitor element, the greater the inductance component of the wiring, and it is difficult to sufficiently achieve the above object. It is desirable to provide as close as possible to the IC chip.

[0003] Therefore, the following technology is conventionally known. That is, first, a concave portion is provided in a substrate, and a capacitor element is arranged in the concave portion. An electrode pad is formed in advance at a position where the capacitor element is to be arranged, and the electrode terminal of the capacitor element is connected to the wiring of the substrate via the electrode pad by reflow soldering. Thereafter, the capacitor element is covered with a resin so that the capacitor element is built in the wiring board.

When the capacitor element is built in the wiring board in this way, the wiring length between the IC chip and the capacitor element can be reduced as compared with the case where the capacitor element is mounted on the surface, and the switching noise is reduced. This is advantageous in stabilizing the operating power supply voltage.

[0005]

However, in the above-mentioned conventional techniques, it is not easy to arrange a capacitor element in a concave portion provided on a substrate with high accuracy. That is, even if the capacitor element is placed at a desired position with high precision, the position of the capacitor element may be shifted due to external vibration or the like until the terminal of the capacitor element is fixed to the substrate, or soldering may occur. In this case, the position of the capacitor element may be shifted due to the surface tension of the molten solder. As a result, a problem occurs in the electrical connection with the wiring of the substrate.

The above problem is not limited to the case where the capacitor element is built in the substrate. In order to suppress electrical characteristics that are difficult to control, such as the parasitic inductance and parasitic capacitance of the wiring board, it is desirable to shorten the wiring length, and it is considered that electronic components other than capacitor elements should be built into the board. Can be The built-in electronic components include, for example, chip-shaped passive components such as capacitors, inductors, resistors, and filters, and active components such as memories, transistors, and low-noise amplifiers (LNA). However, for the same reason as described above, it is difficult to arrange electronic components with high positional accuracy.

The present invention has been made to solve such a problem, and an object of the present invention is to provide a manufacturing method capable of incorporating an electronic component into a wiring board with high positional accuracy.

[0008]

Means for Solving the Problems and Effects of the Invention According to an aspect of the invention as set forth in claim 1, which has been made to solve the above problems, the present invention has a plate shape having a first main surface and a second main surface. A wiring board main body having a through hole penetrating from one of the main surfaces to the other, and an electronic component arranged and fixed in the through hole,
A method of manufacturing a wiring board comprising: a sheet material having an adhesive on a surface thereof, wherein the opening on the second main surface side of the through hole is exposed to the inside of the through hole. A closing step of closing, an arranging step of arranging the electronic component inside the through hole so that the electronic component is adhered to the sheet material via an adhesive, and a filling resin in the through hole in which the electronic component is arranged. And a fixing step of injecting and curing, and using a sheet material having an adhesive force of 8.0 N / 25 mm or more as the sheet material.

That is, in the method of manufacturing a wiring board according to the present invention, first, in the closing step, one of the openings of the through hole of the wiring board body (the surface on the opening side to be closed is conveniently used). (Referred to as “second main surface”) with a sheet material. This sheet material has an adhesive on its surface, and closes the opening so that the adhesive is exposed inside the through-hole.

[0010] In this specification, the wiring board main body refers to a substrate that is a skeleton of the wiring board. The wiring board body includes a wiring board in which a conductor layer (conductor pattern) is built in the board, for example, a wiring board in which a plurality of insulating layers and conductor layers are alternately stacked. In the arranging step, the electronic component is arranged inside the through hole, and at this time, the electronic component is in a state of being adhered to the sheet material via the adhesive. In the fixing step, the electronic component is fixed in the through-hole by injecting a resin into the through-hole in which the electronic component is arranged and curing the resin. Note that the arrangement step does not necessarily need to be performed after the closing step, and may be performed simultaneously. If the electronic component is adhered to the sheet material and the through-hole is closed with the sheet material and the electronic component is arranged inside the through-hole, the closing step and the arranging step can be performed simultaneously.

The above-mentioned sheet material has an adhesive strength of 8.
The adhesive strength is 0 N / 25 mm or more, and the adhesive strength is measured by a 180 ° peeling method (JIS Z0237). Also, the unit [N / 25mm]
Means a force measured using a sheet material having a width of 25 mm as a sample (the same applies hereinafter).

According to the method of manufacturing a wiring board according to the first aspect, an electronic component can be arranged inside the through hole, that is, inside the wiring board with high positional accuracy. Therefore, electrical connection between the electronic component and the wiring can be reliably established, and a highly reliable wiring board can be obtained.

The sheet material has an adhesive force of 8.0 N / 25.
mm or more, the accuracy of the position of the electronic component can be further improved. That is, when the adhesive strength of the sheet material is small, even if the electronic component is placed at an accurate position on the surface of the sheet material, the position is shifted or tilted by being pushed by the filling resin injected thereafter. It is possible that the connection between the electrode terminal of the electronic component and the wiring pattern becomes difficult. On the other hand, claim 1
In the method for producing a sheet material, the adhesive strength of the sheet material is 8.0 N /
Since it is 25 mm or more, even when the filling resin is injected into the through-hole in which the electronic component is arranged, the electronic component becomes difficult to move, and the position accuracy of the electronic component can be further improved.

According to a second aspect of the present invention, there is provided a wiring board body having a plate shape having a first main surface and a second main surface, and having a through hole penetrating from one of the two main surfaces to the other. A method of manufacturing a wiring board, comprising: an electronic component disposed and fixed in the through hole, wherein a sheet material having an adhesive on a surface thereof has an opening on a second main surface side of the through hole. A closing step of closing the adhesive so as to be exposed inside the through-hole,
An arranging step of arranging the electronic component inside the through-hole so as to be in a state of being adhered to the sheet material via an adhesive, and injecting and curing a filling resin into the through-hole where the electronic component is arranged and fixing the electronic component; And using a sheet material having a thickness of 30 μm or more and less than 70 μm as a sheet material.

That is, in the method of manufacturing a wiring board according to the second aspect, the electronic component is built in the wiring board main body by performing the closing step, the arranging step, and the fixing step as in the first aspect of the present invention. Therefore, the electronic components can be arranged with high positional accuracy inside the through holes, that is, inside the wiring board. Therefore, electrical connection between the electronic component and the wiring can be reliably established, and a highly reliable wiring board can be obtained.

Further, in the method of manufacturing a wiring board according to the second aspect, the thickness of the adhesive is 15 μm or more and 70
Those having a size smaller than μm are used. The thickness of the adhesive is 70
If it is more than μm, a part of the electronic component enters the adhesive, and the position of the electronic component cannot be accurately determined. For example, when the electronic component is to be adhered to the sheet material at the electrode terminal portion, the electrode terminal is buried in the adhesive, and it may be difficult to accurately determine the position of the electronic component. In order to protect the electronic component main body (parts other than the electrode terminals (external electrodes)), it is preferable to cover the electronic component main body with the filling resin. There may be a disadvantage that the filling resin cannot flow in between, and as a result, the electronic component body cannot be covered with the filling resin.

On the other hand, if the thickness of the pressure-sensitive adhesive on the surface of the sheet material is small, it is difficult to obtain a predetermined adhesive force, it is difficult to hold the electronic component securely, and the position of the electronic component is easily shifted. In order to increase the precision of the position of the electronic component, it is preferable that the thickness of the adhesive is 15 μm or more to secure a predetermined adhesive force. As described above, according to the method for manufacturing a wiring board according to the second aspect, since the thickness of the adhesive is 15 μm or more and less than 70 μm as the sheet material, the electronic component can be located at a more accurate position. Can be arranged.

According to a third aspect of the present invention, there is provided a wiring board body having a plate shape having a first main surface and a second main surface, and having a through hole penetrating from one of the two main surfaces to the other. A method of manufacturing a wiring board, comprising: an electronic component disposed and fixed in the through hole, wherein a sheet material having an adhesive on a surface thereof has an opening on a second main surface side of the through hole. A closing step of closing the adhesive so as to be exposed inside the through-hole,
An arranging step of arranging the electronic component inside the through-hole so as to be in a state of being adhered to the sheet material via an adhesive, and injecting and curing a filling resin into the through-hole where the electronic component is arranged and fixing the electronic component; And the sheet material has a tensile strength of 100 N / 25 m as a sheet material.
m or more.

Thus, in the method of manufacturing a wiring board according to the third aspect, the electronic component is built in the wiring board main body by performing the closing step, the arranging step, and the fixing step as in the first aspect of the present invention. Therefore, the electronic components can be arranged with high positional accuracy inside the through holes, that is, inside the wiring board. Therefore, electrical connection between the electronic component and the wiring can be reliably established, and a highly reliable wiring board can be obtained.

If the strength of the sheet material is low, inconveniences such as deformation of the sheet material when the electronic component is placed on the surface of the sheet material and displacement of the electronic component may occur. Since it is difficult to improve the positional accuracy of the sheet material, the tensile strength (JIS Z0237) of the sheet material is 100 in the method of manufacturing a wiring board according to claim 3.
A sheet material having a certain strength of N / 25 mm or more is used. This makes it possible to more accurately arrange the electronic components. The tensile strength is 150N
/ 25 mm or more is more preferably used.

The material (base material) of the sheet material is as follows.
For example, a material composed of polyimide, polyester, PET, and Teflon (registered trademark) can be considered. Among them, Teflon (registered trademark) which is excellent in heat resistance and chemical resistance
It is relatively preferred to use Further, as the adhesive applied to the surface of the sheet material, for example, a silicone-based adhesive, an acrylic-based adhesive, a thermoplastic rubber-based adhesive, or the like can be considered. Among them, releasability (that is, ease of peeling),
It is relatively preferable to use a silicone-based pressure-sensitive adhesive which is excellent in heat resistance.

The surface of the electrode of the electronic component is preferably roughened to have a roughness Rz of 0.3 to 20 μm. The surface roughness Rz of the electrode of the electronic component is 0.5 to 1.
0 μm is more preferred, and 0.5 to 5 μm is even more preferred. This is because the filling resin cuts into the unevenness of the electrode surface and has an anchor effect of improving the adhesion. Roughness Rz
Is not particularly limited, and may be performed by a known method such as a micro-etching method or a blackening process.

On the other hand, it is preferable that a filler (for example, SiO 2 or the like) having a smaller coefficient of thermal expansion than the filler resin is mixed with the filler resin (to form a composite material containing the resin).
This makes it possible to accurately control the thermal expansion coefficient of the composite of the filler resin and the filler. As a result, for example, it is easy to match the thermal expansion coefficient between the wiring (conductor layer) formed of Cu or the like or the IC chip formed of Si or the like and the wiring board, and the configuration on the wiring board becomes easy. Peeling of the wiring pattern to be performed can be prevented, and the reliability against heat can be improved.

In particular, the filler resin preferably contains an inorganic filler as a component which is hardly dissolved in the oxidizing agent. The surface of the filling resin may be subjected to a roughening treatment with an oxidizing agent in order to increase the adhesion to a wiring pattern or an electronic component.
Therefore, when an inorganic filler is contained as a component that is hardly dissolved in the oxidizing agent, the coefficient of thermal expansion can be adjusted, and the inorganic filler functions as an aggregate after curing of the filling resin. Can be prevented from being deformed more than necessary.

The inorganic filler which does not substantially dissolve in the oxidizing agent is not particularly limited, but crystalline silica, fused silica, alumina, silicon nitride and the like are preferable, and they can effectively reduce the thermal expansion coefficient of the filling resin. it can. These inorganic fillers are added as a filler so as to have a high filling rate, and the thermal expansion coefficient of the filled resin is 40 ppm / ° C. or less (preferably 30 ppm / ° C. or less, more preferably 25 ppm / ° C. or less, and further preferably 20 ppm / ° C. or less). C. or lower. The lower limit is 10 ppm / ° C. or higher.)
Stress concentration due to a difference in thermal expansion coefficient between the embedded electronic component and the mounted semiconductor element can be reduced.

The shape of the inorganic filler is preferably substantially spherical in order to increase the fluidity and the filling rate of the filling resin. In particular, a silica-based inorganic filler is preferable because a spherical one can be easily obtained. In order to further improve the low viscosity and high filling rate of the filling resin, it is preferable to add two or more kinds of inorganic fillers having different particle shapes.

Regarding the filler diameter of the inorganic filler, it is preferable to use a filler having a coarse diameter of 50 μm or less because the filling resin must easily flow into the gap between the electrodes of the electronic component.
The preferred range of the particle size is preferably 30 μm or less,
More preferably, it is 20 μm or less, more preferably 10 μm or less. If it exceeds 50 μm, the filler is likely to be clogged in the gap between the electrodes of the electronic component, and a portion having an extremely different coefficient of thermal expansion locally occurs due to a defective filling of the filling resin. In addition, when polishing to flatten the surface, the filler drops and large recesses are generated, which hinders formation of fine wiring by subsequent plating. As the lower limit of the filler diameter,
0.1 μm or more is preferable. If it is smaller than this, it becomes difficult to secure the fluidity of the filling resin. It is preferably at least 0.3 μm, more preferably at least 0.5 μm. In order to achieve low viscosity and high filling of the filling resin, the particle size distribution should be widened.

The surface of the inorganic filler may be treated with a coupling agent, if necessary. This is because the wettability of the inorganic filler with the resin component is improved, and the fluidity of the filled resin can be improved. As the type of the coupling agent, a silane-based, titanium-based, aluminum-based or the like is used.

As the component which is not substantially dissolved in the oxidizing agent, a curing accelerator, silicone oil, reactive silicone gel, reactive diluent, defoaming agent and the like can be used. When a thermosetting resin is contained in the filling resin, it is necessary to add a curing agent. The type of the curing agent is not particularly limited, but an imidazole type, an amine type, an acid anhydride type, a novolak resin type, or the like is preferably used. In particular, when an epoxy resin is used as the thermosetting resin, the use of a liquid curing agent such as an imidazole-based, amine-based or acid-anhydride-based resin makes it easy to reduce the viscosity of the filling resin. It may be effective when adding.

The filling resin is preferably roughened at least at the contact interface with the wiring. This is because the fine irregularities on the roughened surface have an anchor effect of improving the adhesion to the wiring formed by electroless plating. The roughened surface is preferably adjusted so that the surface roughness Rz is 0.1 to 15 μm. Preferably 0.5 to 10 μm, more preferably 1 to 8 μm, still more preferably 3 to 7 μm, especially 5 to 7 μm.
μm. It is preferable that the wiring substantially penetrates the fine irregularities on the roughened surface. If there is a fine gap or poor adhesion part where the wiring does not substantially bite into the unevenness,
This is because wiring blisters easily occur in the reliability test.

The inclusion of the inorganic filler in the filling resin is also significant in adjusting the surface shape (roughness) of the filling resin after roughening. That is, the filling resin contains at least one type of inorganic filler, and the content of the inorganic filler is in the range of 35 to 65% by volume (preferably 40 to 60% by volume, more preferably 40 to 50% by volume). %). By adjusting the ten-point average roughness Rz of the irregularities formed at the interface between the filling resin and the wiring layer to be within a predetermined range, and by regulating the content of the inorganic filler within a predetermined range, the adhesion of the wiring layer can be improved. Anchor effect required to obtain the property can be obtained more effectively, and the shape of the filling resin after the roughening treatment is maintained, and potential defects such as excessively large pores are formed below the wiring layer. There is an advantage that generation can be suppressed.

In particular, a filler resin containing a thermosetting resin, a curing agent thereof and at least one kind of inorganic filler, wherein the thermosetting resin is selected from bisphenol epoxy resin, naphthalene type epoxy resin and phenol novolak resin. It is preferable to use a filler resin in which the content of the inorganic filler is 35 to 65% by volume and the curing agent is an acid anhydride-based curing agent.
This is because the adhesive strength of the wiring layer to the filling resin can be improved, and high reliability can be obtained in reliability tests such as a thermal shock test and a water resistance test.

[0033]

Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 1A is a view for explaining the internal configuration of a wiring board 1 manufactured by the method of the first embodiment.
As shown in FIG. 1B, the wiring board 1 of this embodiment is divided into a plurality of circuit boards 2 (approximately 40 mm × 4 mm).
0mm) multi-cavity wiring board (approximately 330m vertically and horizontally)
mx 330 mm).

As shown in FIG. 1, in this wiring board 1, both sides (first main body) of a wiring board main body 3 which is an insulating substrate made of a glass-epoxy resin composite material having a thickness of about 0.8 mm. The surface 3a and the second main surface 3b) have a thickness of about 25 μm.
About m first conductor layers 5a and 5b are formed.

In the wiring board main body 3, a plated through hole 11 having a diameter of about 250 μm is formed on an inner wall of a through hole through hole 9 penetrating from one of the main surfaces 3a and 3b to the other. With this through hole 11,
The first conductor layer 5a on the first main surface 3a and the first conductor layer 5b on the second main surface 3b are mutually connected. The inside of the through hole 11 is filled with resin.

A through hole 21 (about 12 mm × 12 mm) for disposing electronic components is formed in the wiring board main body 3, and a plurality of capacitor elements 13 (about 3. 2mm × 1.6mm × 0.7
mm) is provided. The capacitor element 13 is composed of Ba
It comprises a main body 15 made of a high dielectric ceramic mainly composed of TiO ₃ and an electrode terminal 14 mainly composed of Pd.

Inside the through hole 21, the capacitor element 13 is fixed by the cured filling resin 4.
The capacitor element 13 is for suppressing switching noise generated in the IC chip 16 provided on the wiring board 1 and stabilizing an operation power supply voltage to be supplied to the IC chip 16. .

On the first conductor layers 5a and 5b, first interlayer insulating layers 103a and 103b (about 30 μm in thickness) are laminated, and further, the first interlayer insulating layers 103a and 103b
Second conductor layers 105a and 105b (about 15 μm in thickness and about 25 μm in width) are formed on 3b.
That is, the first conductor layer 5a (5b) and the second conductor layer 105
a (105b) refers to the first interlayer insulating layer 103a (103b).
b) are interposed therebetween. Also, the first conductor layer 5a
(5b) and the second conductor layer 105a (105b)
Filled vias 104a (104b) having an opening diameter of about 50 μm formed in interlayer insulating layer 103a (103b), 1
15a (115b).

The second interlayer insulating layers 107a and 107b are further laminated on the second conductor layers 105a and 105b. Among them, the second interlayer insulating layer 10 on the first main surface 3a side
7a, an IC chip 16 and a wiring board 1 indicated by a broken line
A large number of flip chip pads 111 are formed to connect with the wiring of FIG.
Substantially hemispherical flip chip bump 1 made of high-temperature solder
12 are formed. The flip chip pad 11 is formed on the second interlayer insulating layer 107a on the first main surface 3a side.
1 is formed with a solder resist layer 109a (having a thickness of about 2) for preventing the solder from flowing around the flip chip pad 111 when the flip chip bump 112 is formed.
(About 0 μm).

On the other hand, the second interlayer insulating layer 107 on the second main surface side
On Lb, a number of LGA pads 113 for connecting with wiring of another wiring board such as a motherboard and wiring of the wiring board 1 are formed. And the second main surface 3b
On the side second interlayer insulating layer 107b, a solder resist layer 109b is also formed around the LGA pad 113.

The second conductor layer 105a and the flip chip pad 111 on the first main surface 3a are connected to each other by a filled via 117a formed in the second interlayer insulating layer 107a. Then, on the second main surface side 3b, the second conductor layer 105b and the LGA pad 113
Filled via 11 formed in second interlayer insulating layer 107b
7b. By using the filled via for the interlayer connection in this manner, the electrode terminal 14 of the capacitor element and the flip chip pad 111 can be connected in a straight line (that is, a stacked via can be formed).
Therefore, it is possible to connect the IC chip 16 and the capacitor element 13 at a short distance, and it is possible to improve the electrical characteristics.

After going through each of the steps described below, the wiring board 1 is divided into a plurality of circuit boards 2 by dicing or the like. Hereinafter, a method for manufacturing the wiring board 1 will be described with reference to FIG.
This will be described with reference to FIG. FIG. 2 shows the vicinity of one through hole 21 in an enlarged manner.

As shown in FIG. 2 (a), it is preferable to use a wiring board main body 3 which is previously configured as a part of a copper-clad laminate. The copper-clad laminate has a structure in which copper foil is placed on both sides of an insulating substrate made of resin, and conductor layers 20a and 20b made of copper are stacked on the insulating substrate by heating and pressing. Note that, as the wiring board main body 3, an insulating substrate on which such conductor layers 20a and 20b are not laminated may be used.

A large number of through-holes 9 for forming the through-holes 11 are formed in the wiring board body 3 (for example, by drilling), and a through-hole 21 for disposing the capacitor element 13 is formed. (Eg, by punching). The diameter of the through-hole 9 and the through-hole 21 can be reduced by drilling with a laser (CO2, YAG, excimer, etc.). In addition, as shown in FIG. 1B, a large number of through holes 21 are formed in the wiring board 1.

Next, as shown in FIG. 2B, one of the openings (opening 21a on the second principal surface 3b side) of the through-hole 21 for disposing electronic components is attached to one side with a silicone-based adhesive. The sheet 23 is covered with a sheet material 23 made of polyimide. At that time, the surface 23 a having the adhesive 24 is directed toward the wiring board main body 3, and the sheet material 23 is attached to the wiring board main body 3.

At this time, the adhesive 24 is exposed inside the through hole 21. The wiring board 1 has a large number of through holes 21.
Are formed, but these openings 21a are covered with one sheet material 23 (closing step). After closing the through-hole 21 with the sheet material 23, the capacitor element 13 is disposed inside the through-hole 21 so as to adhere to the sheet material 23 via the adhesive 24 as shown in FIG. At this time, the capacitor element 13 is connected to the sheet material 2 at the electrode terminal 14.
3 and arranged so as to form a gap 25 between the main body 15 and the sheet material 23 into which the filling resin 4 can flow (arrangement step). The electrode terminal 14 has ends 14a and 14b facing in opposite directions. The ends 14a and 14b are respectively connected to the first main surface 3a and the second
It is directed to the main surface 3b side. Here, an end directed toward the first main surface 3a is referred to as an upper end 14a, and the second main surface 3a is referred to as an upper end 14a.
The end directed toward the b side is referred to as a lower end 14b.

The sheet material 23 is 8.83 N / 2.
When a material having an adhesive strength of 5 mm was used, 7.1
% Pieces (8 pieces of capacitor element 13 per piece)
), Peeling from the sheet material was confirmed. From this, to hold the electronic components on the sheet material,
It seems preferable to use a sheet material having an adhesive force of 8.0 N / 25 mm or more. In addition, the above-mentioned sheet material 23
Has a thickness of the adhesive 24 of 30 μm and a tensile strength of 215 N / 25 mm.

After the capacitor element 13 is placed inside the through hole 21 as described above, the filling resin 4 is injected into the through hole 21 as shown in FIG. 4 is cured (fixing step). As a result, the capacitor element 13 as an electronic component is embedded inside the wiring board body 3. The space between the main body 15 of the capacitor element 13 and the sheet material 23 is also filled with the filling resin 4. After injecting the filling resin 4 into the through holes 21 and before curing, bubbles are removed from the filling resin 4 by vacuum defoaming.

To cure the filling resin 4, the filling resin 4
Various methods are conceivable depending on the type. In this embodiment, a thermosetting epoxy resin is used as the filling resin 4, and the resin is cured (cured) by heating and drying. Specifically, the filling resin 4 filled in the through hole 21 is
The curing is performed by maintaining the temperature at 100 ° C. to 120 ° C. for about 1 to 3 hours.

The filler 4 is preferably mixed with a filler (for example, SiO 2) having a smaller thermal expansion coefficient than that of the filler 4 (a composite material containing the resin). This makes it possible to accurately control the thermal expansion coefficient of the composite of the filling resin 4 and the filler. As a result, for example, it becomes easy to match the thermal expansion coefficient between the wiring (conductor layer) formed of Cu or the like or the IC chip 16 formed of Si or the like and the wiring board 1, and the wiring board 1 This means that the reliability of the wiring formed thereon can be improved with respect to heat.

After the filling resin 4 has been cured, the sheet material 23 is then applied to the electrode terminals 14 of the capacitor element 13, the filling resin 4 and the wiring board main body 3 (specifically, the conductor layer 20).
a), and then the filling resin 4 and the main surfaces 3a and 3b of the wiring board main body 3 are polished by a belt sander (FIG. 2 (e)).

By polishing the filling resin 4 on the first main surface 3a side, the upper end 14a of the electrode terminal 14 is exposed to the outside of the filling resin 4 from the first main surface 3a side. 2nd main surface 3
From the side b, the electrode material 1 is removed by removing the sheet material 23.
4 is exposed to the outside of the filling resin 4. The main body 15 of the capacitor element 13 is buried in the filling resin 4.

In polishing the main surfaces 3a and 3b,
The filling resin 4 formed around the capacitor element 13 is flattened, and the heights of the surfaces of the conductor layers 20a and 20b and the surface of the filling resin 4 are made uniform. That is, the first main surface 3a
On the side, the conductor layer 20a and the filling resin 4 form the same plane, and also on the second main surface 3b side, the conductor layer 20b and the filling resin 4 form the same plane. as a result,
A flat conductor layer and an interlayer insulating layer can be formed on both main surfaces 3a and 3b by a known build-up method.

The conductor layer 20 is used as the wiring board body 3.
When an insulating substrate on which no a and 20b are laminated is used, the first main surface 3a and the second main surface 3b are polished as a result of polishing.
And the height of the surface of the filling resin 4 are aligned. That is, the first main surface 3a and the filling resin 4 are on the same plane, and the second main surface 3b and the filling resin 4 are on the same plane.

The abrasive cloth (specified in JIS R6004) used for polishing the filling resin 4 has fineness of # 4.
00 (specified in JIS R6001), but it is preferable to use # 320 or abrasive cloth finer than # 320.
More preferably, the following abrasive cloth is used. The reason is as follows.

That is, as shown in Table 1, # 120, # 240
When the filling resin 4 was ground with the polishing cloth paper, the conductor layers 20a and 20b were peeled off, scratches were observed on the surfaces of the conductor layers 20a and 20b, and the polishing cloth paper of # 800 was used. Although no scratches were found on the conductor layers 20a and 20b, they were partially peeled off. This is because, when the size of the polishing cloth is fine, the metal portion (in this embodiment, Cu) is relatively easily cut, although the resin is hard to be cut, and the conductor layer is peeled off. It is thought that it was done.

[0057]

[Table 1] In Table 1, ○ indicates good and x indicates bad. In the present embodiment, a silicone-based adhesive is used as the adhesive 24 of the sheet material 23, but this is based on the following experiment. Table 2 shows, for various combinations of the sheet material (base material) and the adhesive, the ease of peeling from the cured filling resin 4 and the heat resistance of the sheet material (presence or absence of deformation and deterioration in a 200 ° C. environment). The result of the examination is shown. In this experiment, an epoxy resin was used as the filling resin 4 and a mixture of the epoxy resin and the silica filler was used.

[0058]

[Table 2] In Table 2, ○ indicates good, x indicates bad, and-indicates unconfirmed. As shown in Table 2, when the base material is polyester or polyimide, the sheet material 23 has excellent heat resistance and is not deformed or deteriorated. It can be seen that it is easy to peel off after curing.

In this embodiment, since the polyimide is used as the base material of the sheet material 23 and the silicon-based adhesive 24 is used, the sheet material 2 is hardened when the filling resin 4 is thermally cured.
3, the electronic components (capacitor elements 13) arranged on the sheet material 23 are less displaced, and the electronic components can be provided in the wiring board body 3 with high positional accuracy. Further, since the sheet material 23 is easily peeled off from the cured filling resin 4, it is possible to prevent a part of the sheet material 23 from becoming a residue and hindering a later build-up process.

In this embodiment, after the main surfaces 3a and 3b are polished, as shown in FIG.
1 and the first conductor layer 5 on each of the main surfaces 3a, 3b
a and 5b are formed. The formation of the first conductor layers 5a and 5b is performed as follows. That is, the entirety of the wiring board main body 3 in which the capacitor element 13 is built in the through hole 21
After the electroless plating is performed, the entire wiring board body 3 is subjected to panel plating by further performing electroplating with Cu. Then, unnecessary portions of the conductor layer are removed by etching to form first conductor layers 5a and 5b. At the time of the above-mentioned panel plating, a plating layer is also formed on the inner peripheral surface of the through-hole through-hole 9 for forming a through-hole, and then the resin 1 is filled inside the through-hole through-hole 9.
2 is filled and cured to form a through hole 11 (FIG. 2 (f)). The filling resin 12 is made of SiO2
It is preferable to mix an inorganic filler such as iron or Cu powder or a metal filler (to become a composite material containing a resin).

A through-hole 9 for forming a through-hole is formed in the wiring board main body 3, a plating layer is formed on the inner peripheral surface thereof, and the through-hole 9 is filled with a resin 12. The through hole 21 may be formed to incorporate the capacitor element 13 in the same manner as described above, but this embodiment will be described later as a fourth example.

After forming the first conductor layers 5a and 5b, the following build-up process is performed. First, on the first main surface 3a side and the second main surface 3b side, the filling resin 4, the first conductor layer 5a,
5b and on the upper end 14a and the lower end 14b,
A film-forming photosensitive resin mainly composed of an epoxy resin is attached. Then, by exposing and developing this photosensitive resin, via holes are formed at positions where the upper end portion 14a and the lower end portion 14b are to be exposed, and the photosensitive resin is cured to form the first interlayer insulating layer 103a, 103b is formed. In addition, the via holes are formed in the first interlayer insulating layers 103a, 103a.
After 03b is formed of a non-photosensitive resin, it may be perforated using a laser or the like.

Further, electroless plating and electrolytic plating are performed with Cu, the via holes formed in the first interlayer insulating layers 103a and 103b are filled with a conductor, and panel plating is performed to form a plating layer. A dry film is stuck on the plating layer, exposed and developed to form an etching resist, and unnecessary portions in the plating layer are removed by etching. As a result, the second conductor layers 105a, 1
A wiring made of 05b is formed. The conductive layer may be formed by a full-additive method or a semi-additive method, in addition to a well-known subtractive method.

Thereafter, similarly, the second interlayer insulating layer 107
a, 107b, filled vias 117a, 117b, and flip chip pads 111 (LGA pads 113) are formed in this order, and then solder resist layers 109a, 109b are formed. Then, on the flip chip pad 111 exposed from the solder resist layer 109a, Ni-Au
A flip layer bump 112 is formed by forming a plating layer, further applying a solder paste, and performing reflow.

As described above, the wiring board 1 having the structure shown in FIG. 1 is completed. Note that a Ni-Au plating layer is preferably formed on the surface of the LGA pad 113 to prevent oxidation. According to the manufacturing method of the first embodiment described above, the following effects can be obtained. That is, before arranging the capacitor element 13 inside the through hole 21, first, one of the openings 21 of the through hole 21 is
Block a. At this time, the sheet material 23 closes the through-hole 21 such that the surface 23a to which the adhesive 24 is attached faces the inside of the through-hole 21. Then, the capacitor element 13 is connected to the through hole 2.
When arranging the inside of 1, the capacitor element is adhered to the sheet material 23 so that the position of the capacitor element 13 is not shifted inside the through hole 21, and the filling resin 4 is placed inside the through hole 21 in this state. Fill and cure.
Therefore, the capacitor element 13 can be arranged with high positional accuracy inside the through hole 21, that is, inside the wiring board body 3.
Since the positional accuracy of the capacitor element 13 is high, the electrical connection between the capacitor element 13 and the wiring can be reliably established, and the wiring substrate 1 with high reliability can be obtained.

Further, since the sheet member 23 has an adhesive force of 8.83 N / 25 mm, the position of the capacitor element 13 is not easily shifted, and the capacitor element 13 can be arranged more accurately. . Also,
The thickness of the adhesive 24 of the sheet material 23 is 30 μm,
Since it is 5 μm or more and less than 70 μm, the capacitor element 1
The third electrode terminal 14 is hardly buried in the adhesive 24, and the capacitor element 13 can be provided at a more accurate position. Further, a space 25 into which the filling resin 4 can flow can be formed between the main body 15 of the capacitor element 13 and the sheet material 23, and the main body of the capacitor element 13 is protected by being covered with the filling resin 4. Can be.

The tensile strength of the sheet material 23 is 215
Since N / 25 mm and 100 N / 25 mm or more, when the capacitor element 13 is placed on the surface of the sheet material 23, the sheet material 23 is not broken, and the capacitor element 13 can be more accurately arranged accurately. be able to.

(Second Embodiment) Next, a second embodiment will be described. In the first embodiment, as described with reference to FIG. 2E, the surface of the filling resin 4 is polished to expose the upper end 14a on the first main surface 3a side. However, depending on the size of the capacitor element 13 and the posture in the through hole 21, the filling resin 4
Even if the surface of the portion is polished, the upper end portion 14a may not be exposed on the first main surface 3a side as shown in FIG. 3 (e1).

Therefore, as shown in FIG.
To form a hole 214 in the filled resin 4 portion, thereby connecting the electrode terminal 14 of the capacitor element 13 to the first main surface 3a.
Expose to the side. Then, as shown in FIG. 3 (e 3), a conductor is formed in the formed hole 214 by Cu plating (electrolytic plating is preferable because of its high speed), and a filled via 215 is formed.

The procedure before and after the above procedure is as follows.
Since the procedure is the same as that described in the description of the first embodiment, the description is omitted. According to the manufacturing method of the second embodiment, the wiring board 1 having the configuration as shown in FIG. 4 is obtained. That is, the wiring board 1 obtained by the first embodiment (see FIG. 1)
Unlike the first main surface 3a, the first wiring layer 5a
And the upper end 14a of the electrode terminal 14
15.

According to the manufacturing method of the second embodiment described above, the same effects as those of the first embodiment can be obtained.
Note that, in addition to the case where the filled via 215 is on the IC chip 16 side, the structure may be such that the filled via 215 is on the opposite side to the IC chip 16.

(Third Embodiment) Next, a third embodiment will be described. In the description of the first embodiment, FIG.
As shown in (d), the first main surface 3a side (that is, the sheet material 2)
It has been described that the filling resin 4 is injected into the through-hole 21 only from the side of the opening where the through-hole 21 is not closed by 3).

However, depending on the relationship between the viscosity of the filling resin 4 and the gap in the through hole 21, as shown in FIG.
In the through hole 21, there is a possibility that the filling resin 4 does not sufficiently reach the second main surface 3b side. The gap in the through hole 21 is between the capacitor elements 13, between the capacitor element 13 and the inner wall of the through hole 21, between the main body 15 of the capacitor element 13 and the sheet material 23, and the like.

Therefore, in the third embodiment, the filling resin 4 is further injected from the second main surface 3b side (that is, the side of the opening 21a in which the through hole 21 is closed by the sheet material 23). That is, as shown in FIG. 5D1, the filling resin 4 is injected into the through-hole 21 from the first main surface 3a side. After removing air bubbles from the injected filling resin 4, the filling resin 4 is cured. Thereby, the plurality of capacitor elements 13 are fixed in the through holes 21 (fixing step).

Next, as shown in FIG. 5D2, the front and back surfaces of the wiring board main body 3 (that is, the first main surface 3a and the second main surface 3b).
(Inversion step), and the sheet material 23 is removed as shown in FIG. 5 (d3). Note that the wiring substrate body 3 may be inverted after the sheet material 23 is peeled off.

Then, as shown in FIG. 5D4, the filling resin 4 is injected into the through hole 21 from the second main surface 3b side, and after the defoaming from the filling resin 4, the filling resin 4 is cured. (Refilling step). Thus, the first main surface 3a and the second main surface 3
By injecting and curing the filling resin 4 from the b side,
After filling the through-hole 21 with the filling resin 4 without fail, the filling resin 4 and the main surfaces 3a and 3b of the wiring board main body 3 are polished by a belt sander (see FIG. 2E).

The upper end 14a of the electrode terminal 14 is exposed to the outside of the filling resin 4 from the first main surface 3a by polishing the portion of the filling resin 4 on the first main surface 3a side. In addition, the lower end 14b of the electrode terminal 14 is exposed to the outside of the filling resin 4 from the second main surface 3b side by polishing the filling resin 4 on the second main surface 3b side. Note that the capacitor element 13
Is buried in the filling resin 4.

The procedure before and after the above procedure is as follows.
Since the procedure is the same as that described in the description of the first embodiment, the description is omitted. According to the manufacturing method of the second embodiment described above, the same effect as that of the first embodiment can be obtained.

(Fourth Embodiment) Next, a fourth embodiment will be described. In the above-described first to third embodiments, the description has been given assuming that the plurality of capacitor elements 13 are fixed in the through holes 21 with the filling resin 4 and then the through holes 11 are formed.
That is, first, as shown in FIG. 6A, the capacitor element 13 is fixed to the through-hole 21 with the filling resin 4 and then plated with the panel as shown in FIG. Cu plating) to form the plating layer 12
0 is formed. The inner peripheral surface of the through hole 9 and the two main surfaces 3a, 3b of the wiring board body 3 are formed by panel plating.
(In the above embodiment, specifically, the conductor layers 20a, 20
b) The plating layer 120 is formed on the exposed surface of the filling resin 4.
The through-hole 9 covered with 0 is filled with a resin 112 as shown in FIG. 6C, and thus the through-hole 11 is formed.

However, when such a procedure is adopted, the following problem occurs. That is, the filling resin 4 filled in the through hole 21 for fixing the capacitor element 13 does not completely adhere to the wiring board main body 3 and the conductor layers 20a and 20b, and a slight gap 118 is formed therebetween. Is formed, a groove 122 is formed in the plating layer 120 formed thereon.
May occur. The groove 122 is a boundary between the filling resin 4 portion and the wiring board main body 13 (that is, an edge of the through hole 21).
However, when filling the through-hole through hole 9 for forming a through hole with the resin 112 for filling the hole, there is a fear that a part of the resin 124 may enter the groove portion 122. is there. As a result, when the wiring pattern is formed by etching, the resin 12
4 hinders etching, and a desired wiring pattern may not be obtained.

Therefore, as in the manufacturing method of the fourth embodiment described below with reference to FIGS. 7 and 8, the configuration of the through holes may be performed first. In the manufacturing method of the fourth embodiment, as shown in FIG. 7A, an insulating substrate on which the conductor layers 20a and 20b are not laminated as in the first embodiment is used as the wiring board main body 403. It will be described as an example.

In the fourth embodiment, first, as shown in FIG. 7B, a large number of through-hole through holes 409 for forming the through holes 11 are formed in the wiring board main body 403 by drilling. Note that a laser may be used. Next, as shown in FIG. 7C, the first main surface 403a, the second main surface 403b and the through-hole through hole 409 of the wiring board main body 403 are subjected to panel plating. A plating layer 402 made of Cu is formed on the peripheral surface, and as shown in FIG.
Resin 41 for filling holes in through holes 409
2 and the resin 412 is cured. The resin 412 filled in the through-hole 409 constituting the through-hole 411 may be polished in the same manner as in the first embodiment so as to form substantially the same surface as the plating layer 402.

Thereafter, as shown in FIG. 7E, a through hole 421 for incorporating the capacitor element 13 is provided by punching. The through hole 421 is provided with a laser (CO2, Y
AG, excimer, etc.). Also, the through hole 42
1 are provided in a large number as in the through holes 21 shown in FIG.

Next, in the same manner as described above with reference to FIGS. 2B and 2C, one of the openings of the through hole 421 (the second main surface side 403b side in this embodiment) is made of the sheet material 23. The capacitor element 1 is inserted into the through hole 421 so that the electrode terminal 14 is adhered to the sheet material 23 via an adhesive.
Place 3. Then, among the openings of the through holes 421,
The filling resin 404 is injected into the through-hole 421 from an opening not closed by the sheet material 23 (in this embodiment, the first main surface 403a side). And, this filling resin 404
After the bubbles are removed from the substrate, the filling resin 404 is cured (FIG. 8A).

Further, similarly to the procedure described with reference to FIGS. 5 (d2) to (d4), the filling resin 404 is also filled from the second main surface 403b side, defoamed, and cured (FIG. 8).
(B)). Here, if the through hole 421 is completely filled with resin only by injecting the resin from the first main surface 403a side, the second resin filling from the second main surface 403b side may be omitted.

After the filling resin 404 is cured, the surface of the filling resin 404 is polished in the same manner as in the first embodiment, so that it is substantially the same as the plating layer 402 on the first main surface 403a and the second main surface 403b. The surface is flattened (FIG. 8C). As a result, the upper end 14 a and the lower end 14 b of the electrode terminal 14 of the capacitor element 13 are exposed outside the filling resin 404. Polishing of the resin 412 filled in the through-hole through-hole 409 constituting the through-hole 411 can be performed at any time after the resin 412 is hardened. Is good.

Thereafter, the plating layer 414 made of Cu is formed by panel plating so that the plating layer 402
04, the exposed surface of the electrode terminal 14 and the through hole 4
The first conductive layers 405a and 405b (first conductive layers 5a and 405b of the first embodiment) are laminated on the exposed surface of the resin 412 constituting the first conductive layer 11 (FIG. 8D) and unnecessary portions are removed by etching. 5b) (FIG. 8).
(E)).

After the first conductor layers 405a and 405b are formed, a build-up process similar to the procedure described in the first embodiment is performed to obtain the same structure as the wiring board 1 shown in FIG. Can be obtained. According to the manufacturing method of the fourth embodiment described above, the same effects as in the first embodiment can be obtained.

In each of the above embodiments, the multi-cavity wiring board 1 having the built-in capacitor element 13 is used.
Is divided into, for example, a dicing process or the like to become a circuit board 2 as a final product. As mentioned above, although one Example of this invention was described, this invention is not limited to the said Example, For example, the following various aspects also belong to the technical scope of this invention.

For example, in the above-described embodiment, a plurality of capacitor elements 13 are illustrated and described in each through hole 21. However, the present invention is not limited to this, and a single capacitor element 13 may be included. Further, in the above-described embodiment, the capacitor element 13 is incorporated in the wiring board as an electronic component. However, the present invention is not limited to this. Chip-like resistors, inductors, filters (SAW filters, LC filters, etc.), transistors , Memory, low noise amplifier (LN
A), various electronic components such as a semiconductor element, an FET, an antenna switch module, a coupler, and a diplexer may be incorporated. Further, among them, different kinds of electronic components may be incorporated in the same through hole.

In the third embodiment, it is described that the sheet material 23 is removed (FIG. 5 (d3)) after the wiring substrate body 3 is turned upside down (FIG. 5 (d2)). Not limited to this. That is, after the removal of the sheet material 23,
The wiring board body 3 may be inverted.

In the above embodiment, the glass-epoxy resin composite material is used as the material of the wiring board main body 3. However, the present invention is not limited to this, and the heat resistance, mechanical strength, flexibility, and ease of processing are easy. Etc. may be selected in consideration. Therefore, for example, a glass fiber-resin composite material which is a composite material of a glass fiber such as a glass woven fabric and a glass nonwoven fabric and a resin such as an epoxy resin, a polyimide resin, and a BT resin can be used. In addition, a composite material of an organic fiber and a resin such as a polyimide fiber, a resin-resin composite material in which a resin such as an epoxy resin is impregnated with a fluororesin having a three-dimensional network structure such as PTFE having continuous pores, or the like can be used. .

Further, as the wiring board body, a multilayer board having a built-in conductor layer (conductor pattern) may be used. For example, the wiring board body 503 of the wiring board shown in FIG.
Are formed with conductor layers 505a and 505b. This wiring board main body 503 can be obtained, for example, by a procedure as shown in FIG.

First, a copper-clad laminate as shown in FIG. 10A is prepared. This is, for example, BT resin, FR-4, F
The conductor layers 505a and 505b are formed by laminating copper on both surfaces of an insulating substrate 506 made of R-5 or the like. Copper conductor layers 50 formed on both surfaces of this insulating substrate 506
A required pattern is formed by etching 5a and 505b (see FIG. 10B).

Next, both sides of the copper clad laminate were roughened,
As shown in (c), insulating materials 507a and 507b are laminated on both surfaces. The insulating materials 507a and 507b may be different from or the same as the resin forming the insulating substrate 506, for example, epoxy resin or the like.
Various resins can be used. In this manner, the wiring board body 503 having the conductor layers 505a and 505b therein.
Can be obtained.

Next, as shown in FIG. 10D, a hole 508 for forming a via is formed in the insulating materials 507a and 507b by a laser, and a through-hole 509 for forming a through-hole is formed. Is formed by a laser or a drill. Next, as shown in FIG. 10E, the surfaces of the insulating materials 507a and 507b,
A plating layer 512 made of Cu is formed on the inner surface of the through-hole 08 and the inner peripheral surface of the through-hole through-hole 509, and a silica filler is provided inside the through-hole through-hole 509 as shown in FIG. A filling resin 514 such as an epoxy resin is filled and cured. The filling resin 514 is polished so as to form substantially the same surface as the plating layer 512 on the surfaces of the insulating materials 507a and 507b.

In order to incorporate electronic parts, it is necessary to use FIG.
As shown in (g), through holes 521 for disposing electronic components are formed. Then, for example, by the procedure described with reference to FIG. 8, the electronic component can be built in the wiring board main body 503, and a build-up layer can be formed.

For example, as shown in FIG. 11, a wiring board main body 60 having conductor layers 605a and 605b therein in advance.
3 may be used. In order to obtain a wiring board substantially similar to that of FIG. 9 using this, first, the wiring board main body 6 shown in FIG.
03, a through hole 607, a hole (not shown) for forming a via, and the like are formed (FIG. 11B). Next, a plating layer 609 is laminated on both surfaces of the wiring board main body 603 and the inner peripheral surface of the through-hole through-hole 607 by panel plating (FIG. 11C), and the through-hole through-hole 607 is formed.
Is filled with a filling resin 611 (FIG. 11D).
Further, a through hole 621 for disposing an electronic component is formed (FIG. 11E). Thereafter, the electronic component can be built in the wiring board main body 603 and the build-up layer can be formed by the procedure described with reference to FIG.

As described above, when a wiring board body having a built-in conductor layer is used, the number of conductor layers to be laminated on the wiring board body can be reduced. For example,
In FIG. 1 and the like, three conductor layers are laminated on both main surfaces of the wiring board body. However, when a wiring board body having a built-in conductor layer is used, FIG.
As shown in the figure, the number of conductor layers to be laminated on both main surfaces is reduced by two.

Therefore, the conduction path between the electronic component and the IC chip can be shortened, and the loop inductance, switching noise, crosstalk noise, etc. can be reduced, that is, the electrical characteristics of the wiring board can be improved. It becomes possible. Also, since the through-holes penetrate the wiring board main body and the number of conductor layers to be laminated on both main surfaces of the wiring board main body is two each, a stacked via (stacked via) is formed. You don't have to. And
Since stacked vias are not required, there is no need to form filled vias (vias completely filled with conductors).
Since a conformal via (a via that is not completely filled with a conductor) is sufficient, the cost for forming the via can be suppressed.

In FIG. 9 and the like, the wiring board main body 503 is shown.
2 conductor layers are laminated on both main surfaces of
The number of layers is not limited to this. Also, the wiring board body 5
Although the description has been made assuming that there are two conductor layers 505a and 505b inside 03, the number of layers is not limited to this.

In the above embodiment, the first interlayer insulating layer 1
03a, 103b, second interlayer insulating layers 107a, 107b
Used is mainly composed of an epoxy resin, but may be appropriately selected in consideration of heat resistance, pattern moldability, and the like. For example, polyimide resin, BT resin, PPE resin,
A resin-resin composite material in which a resin such as an epoxy resin is impregnated with a fluorine-based resin having a three-dimensional network structure such as PTFE having continuous pores can be used. The insulating layer may be formed by applying a liquid resin with a roll coater or the like, in addition to a method of thermocompression bonding a film of the insulating layer.

In the above embodiment, the first conductor layers 5a, 5a
5b, the second conductor layers 105a, 105b, etc. are formed by electroless Cu plating and electrolytic plating, but may be formed by other materials, for example, Ni, Ni-Au, or the like. It may be formed by a method such as applying a conductive resin.

In the above embodiment, the filled via is used as the via conductor. However, it is possible to adopt a form in which the via hole is not completely filled by plating. Further, in the above-described embodiment, it has been described that a large number of flip chip pads 111 and flip chip bumps 112 are provided on the upper surface of the wiring board for connection with the IC chip 16. However, as the IC connection terminals, those having an appropriate form may be used in accordance with the terminals formed on the IC chip to be connected. In addition to those having flip-chip bumps, only those having flip-chip pads or wires Examples include a bonding pad and a pad on which a TAB connection pad is formed. For solder such as flip chip bumps, Sn-Ag, Sn-Ag-Cu, Sn-Pb, Sn
-Sb, Sn-Zn based solder or the like can be used.

In the above embodiment, the capacitor element 1
A high dielectric ceramic containing BaTiO ₃ as a main component was used for the main body 15 of the _third embodiment, but the material is not limited to this material.
bTiO ₃ , PbZrO ₃ , TiO ₂ , SrTiO ₃ , Ca
_{TiO 3, MgTiO 3, KNbO 3} , NaTiO 3, KT
aO ₃ , RbTaO ₃ , (Na _1/2 Bi _1/2 ) TiO ₃ , P
b (Mg _1/2 W _1/2 ) O ₃ , (K _1/2 Bi _1/2 ) TiO _{3 and the} like may be appropriately selected according to the required capacitance of the capacitor and the like.

Although the electrode terminal 14 is made of a material containing Pd as a main component, it may be selected in consideration of compatibility with the material of the main body 15 and the like. For example, Pt, Ag, Ag-
Pt, Ag-Pd, Cu, Au, Ni and the like can be mentioned.
Furthermore, a dielectric layer mainly composed of a high dielectric ceramic, an electrode layer made of Ag-Pd, or the like, a resin or Cu plating,
A capacitor formed by combining a via conductor or a wiring layer made of Ni plating or the like can also be used.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating a configuration of a wiring board manufactured by a manufacturing method according to a first embodiment.

FIG. 2 is an explanatory view showing a manufacturing method of the first embodiment.

FIG. 3 is an explanatory view showing a manufacturing method according to a second embodiment.

FIG. 4 is an explanatory diagram illustrating a configuration of a wiring board manufactured by a manufacturing method according to a second embodiment.

FIG. 5 is an explanatory view showing a manufacturing method according to a third embodiment.

FIG. 6 is an explanatory diagram showing a state in which a resin enters a groove of a conductor layer.

FIG. 7 is an explanatory view showing a manufacturing method according to a fourth embodiment.

FIG. 8 is an explanatory view showing a manufacturing method according to a fourth embodiment.

FIG. 9 is a diagram illustrating a modification of the wiring board body.

FIG. 10 is a view illustrating a method of manufacturing a wiring board body of a modified example.

FIG. 11 is a view showing another modification of the wiring board main body.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Wiring board 3,403,503,603 ... Wiring board main body 3a, 403a ... First main surface 3b, 403b ... Second main surface 4,404 ... Filled resin 5a, 5b, 405a, 405b ... First conductor layer ( wiring,
Wiring connection portion 13 Capacitor element (electronic component) 14 Electrode terminal 15 Main body (electronic component main body) 21, 421, 521, 621 Through hole 21a Opening 23 Sheet material 24 Adhesive 105a, 105b ... second conductor layer (wiring) 111 ... flip chip pad (wiring) 115, 117 ... filled via (wiring) 215 ... filled via (connection part between wiring and electrode terminal)

Continued on the front page (72) Inventor Yuki Ogawa 14-18 Takatsuji-cho, Mizuho-ku, Nagoya-shi, Aichi F-term in Japan Special Ceramics Co., Ltd. 5E317 AA30 BB02 BB12 CC15 5E346 AA02 AA12 AA43 CC04 CC09 CC32 DD02 DD25 DD32 EE33 FF04 FF07 GG15 GG17 GG18 GG22 GG24 GG26 HH40

Claims (3)

[Claims] 1. A wiring board body having a plate shape having a first main surface and a second main surface, having a through hole penetrating from one of the two main surfaces to the other, and disposed and fixed in the through hole. An electronic component, comprising: a sheet material having an adhesive on the surface thereof, wherein the adhesive is formed on the opening on the second main surface side of the through-hole, A closing step of closing the electronic component so as to be exposed to the inside; an arranging step of arranging the electronic component inside the through-hole so that the electronic component is adhered to the sheet material via an adhesive; And a fixing step of injecting and curing the filling resin into the holes, and wherein the sheet material has an adhesive force of 8.0 N /
A method for manufacturing a wiring board, wherein a wiring board having a length of 25 mm or more is used. 2. A wiring board body having a plate shape having a first main surface and a second main surface, having a through hole penetrating from one of the two main surfaces to the other, and disposed and fixed in the through hole. An electronic component, comprising: a sheet material having an adhesive on a surface thereof, wherein the adhesive has an opening on the second main surface side of the through hole, A closing step of closing the electronic component so as to be exposed to the inside; an arranging step of arranging the electronic component inside the through hole so that the electronic component is adhered to the sheet material via an adhesive; A method of manufacturing a wiring board, comprising: a step of injecting a filling resin into holes and curing the holes; and using a sheet material having a thickness of 15 μm or more and less than 70 μm as the sheet material. 3. A wiring board body having a plate shape having a first main surface and a second main surface, having a through hole penetrating from one of the two main surfaces to the other, and disposed and fixed in the through hole. An electronic component, comprising: a sheet material having an adhesive on a surface thereof, wherein the adhesive has an opening on the second main surface side of the through hole, A closing step of closing the electronic component so as to be exposed to the inside; an arranging step of arranging the electronic component inside the through-hole so that the electronic component is adhered to the sheet material via an adhesive; And a fixing step of injecting and curing the filling resin into the holes, wherein the sheet material has a tensile strength of 100N.
/ 25 mm or more is used, the method of manufacturing a wiring board characterized by the above-mentioned.