JPS624000B2 - - Google Patents
Info
- Publication number
- JPS624000B2 JPS624000B2 JP11995381A JP11995381A JPS624000B2 JP S624000 B2 JPS624000 B2 JP S624000B2 JP 11995381 A JP11995381 A JP 11995381A JP 11995381 A JP11995381 A JP 11995381A JP S624000 B2 JPS624000 B2 JP S624000B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- metal
- insulating resin
- metal plate
- metal core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 38
- 239000002184 metal Substances 0.000 claims description 38
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 239000012467 final product Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
【発明の詳細な説明】 本発明は、金属芯入配線板の製造法に関する。[Detailed description of the invention] The present invention relates to a method for manufacturing a metal-core wiring board.
金属芯入配線板は、放熱特性にすぐれており、
高密度実装に適している。金属芯入配線板の製造
法特にスルホール内壁の絶縁化法には、各種の方
法が提案されているが、その一つとして、金属板
にスルホールとなる部分にあらかじめ、スルホー
ルより大なる穴を明け、この穴に絶縁樹脂を充填
し、再度、スルホールを明け、穴内を金属化し、
表面に配線パターンを形成する方法がある。 Metal core wiring boards have excellent heat dissipation properties,
Suitable for high-density mounting. Various methods have been proposed for manufacturing metal-cored wiring boards, especially for insulating the inner walls of through-holes. , Fill this hole with insulating resin, drill the through hole again, and metalize the inside of the hole.
There is a method of forming a wiring pattern on the surface.
この方法によれば、最終製品は、配線パターン
を形成した後外形を任意の形状に切断加工するの
で、端部に金属芯が露出する。露出した金属芯
は、電気的な問題例えば、シヨート、雑音の混入
などの他、腐食性、金属粉の発生などの問題があ
る。特に問題となるのは接栓部であり接栓部の金
属芯の露出は、さけなければならない。 According to this method, the outer shape of the final product is cut into an arbitrary shape after the wiring pattern is formed, so that the metal core is exposed at the end. Exposed metal cores pose electrical problems such as shot and noise, as well as corrosion and generation of metal powder. Particularly problematic is the plug, and exposure of the metal core of the plug must be avoided.
本発明は、このような点に鑑みなされたもの
で、その目的は最終製品の大きさに切断加工した
時に、接栓部等の金属芯端面の露出が防止される
金属芯入配線板の製造法を提供するものである。 The present invention was made in view of the above, and its purpose is to manufacture a wiring board with a metal core that prevents the end face of the metal core such as a plug from being exposed when it is cut to the size of a final product. It provides law.
本発明は金属板にスルホールを設け、スルホー
ル内壁を含む金属板全表面に絶縁樹脂層を形成さ
せた後、配線パターンを形成し、外形を最終製品
の大きさに切断加工する金属芯入配線板の製造法
に於て、金属板に最終径より大なるスルホール、
及び、最終製品の大きさに切断加工した時に金属
芯端面の露出が望まれない位置に長溝を設け、ス
ルホール長溝に絶縁樹脂を充填し、絶縁樹脂が充
填したスルホール部に金属板に設けられたスルホ
ールより小なるスルホールをあけると共に、絶縁
樹脂が充填した長溝の中で最終製品の大きさに切
断加工することを特徴とするものである。 The present invention is a wiring board with a metal core in which a through hole is provided in a metal plate, an insulating resin layer is formed on the entire surface of the metal plate including the inner wall of the through hole, a wiring pattern is formed, and the outer shape is cut to the size of the final product. In the manufacturing method, through holes larger than the final diameter are formed in the metal plate.
Also, a long groove is provided at a position where the end face of the metal core is not desired to be exposed when it is cut to the size of the final product, the through hole long groove is filled with insulating resin, and the through hole portion filled with insulating resin is provided in the metal plate. It is characterized by drilling a through hole smaller than the through hole and cutting it to the size of the final product in a long groove filled with insulating resin.
すなわち、金属板に穴をあけると共に、接栓の
先端となる部分等最終製品の大きさに切断加工し
た時に金属芯端面の露出が望まれない部分に長溝
を設けるのである。 That is, in addition to drilling holes in the metal plate, long grooves are provided in areas where the end face of the metal core is not desired to be exposed when the metal plate is cut to the size of the final product, such as the tip of the plug.
そして、スルホール内に絶縁樹脂を充填すると
同時に、この長溝にも樹脂を充填する。回路加工
後、外形を加工する時、外形は、この長溝の中に
おいて切断加工するよう設計することにより、製
品の接栓部は、金属芯が端部より露出することを
防止できる。 Then, at the same time that the through holes are filled with insulating resin, the long grooves are also filled with resin. When processing the outer shape after circuit processing, the outer shape is designed to be cut within this long groove, so that the metal core of the plug part of the product can be prevented from being exposed from the end.
図面はこのようにして得られた配線板で、第１
図は断面図、第２図は平面図を示し、１は接栓、
２は金属芯、３は絶縁層、４は長溝に充填された
絶縁樹脂である。 The drawing shows the wiring board obtained in this way.
The figure shows a cross-sectional view, and the second figure shows a plan view. 1 is a plug;
2 is a metal core, 3 is an insulating layer, and 4 is an insulating resin filled in the long groove.
本発明に於ては、金属板として、厚さ約0.3〜
２mmの鉄板、アルミニウム板、銅板、銅ニツケル
合金板等が用いられる。絶縁樹脂としてはエポキ
シ樹脂、ポリイミド等が好ましい。 In the present invention, the metal plate has a thickness of about 0.3 to
2 mm steel plates, aluminum plates, copper plates, copper-nickel alloy plates, etc. are used. As the insulating resin, epoxy resin, polyimide, etc. are preferable.
これらの樹脂をスルホール、長溝に充填するに
は、絶縁樹脂フイルムをスルホール、長劇を有す
金属板にプレスする、液状、粉体状の絶縁樹脂粉
体を埋込みプレスする等により行うことが出来
る。 Filling these resins into through-holes and long grooves can be done by pressing an insulating resin film onto a through-hole or a long metal plate, or by embedding and pressing insulating resin powder in liquid or powder form. .
長溝は、最終製品の大きさに切断加工した時に
金属芯端面の露出が望まれない箇所にもよるが、
接栓の場合通常幅３〜５mm、長さ30〜200mm程度
のものである。 The length of the long groove depends on the location where the end face of the metal core is not desired to be exposed when cutting to the size of the final product.
In the case of a plug, it is usually about 3 to 5 mm in width and 30 to 200 mm in length.
実施例
金属板として、厚さ１mmのアルミ板を用い、ド
リル穴あけ機により、直径２mmのスルホールを明
けた。Example An aluminum plate with a thickness of 1 mm was used as a metal plate, and a through hole with a diameter of 2 mm was drilled using a drilling machine.
次に、外形加工時に接栓先端となる位置に、直
径４mmのルーターを用いて長溝を形成した。 Next, during external processing, a long groove was formed using a router with a diameter of 4 mm at the position that would become the tip of the plug.
この金属板の表面をサンドペーパー（＃400）
により研磨した後、エポキシ樹脂を充填した。 Sand the surface of this metal plate (#400)
After polishing, it was filled with epoxy resin.
次に、厚さ35μｍの銅箔をガラス−エポキシプ
リプレグを用いて加熱圧着し、穴内のエポキシ樹
脂も同時に硬化せしめた。 Next, a 35 μm thick copper foil was heat-pressed using glass-epoxy prepreg, and the epoxy resin in the hole was also cured at the same time.
この金属芯入り銅張積層板を通常のスルホール
プリント板の製造法（プリントアンドエツチ法）
により、スルホールおよび配線パターンを形成し
た。外形加工は、数値制御加工機により切断し
た。かくして得た金属芯配線板の接栓部は、エポ
キシ樹脂により絶縁されており、電気的、機械的
にも充分な性能を有していた。 This copper-clad laminate with a metal core is manufactured using the normal through-hole printed board manufacturing method (print and etch method).
Through-holes and wiring patterns were formed. The external shape was cut using a numerically controlled processing machine. The plug portion of the metal core wiring board thus obtained was insulated with epoxy resin and had sufficient electrical and mechanical performance.
本発明に於ては接栓部等の金属芯の露出を防止
したため、次の効果がある。 In the present invention, since the metal core of the plug etc. is prevented from being exposed, the following effects can be obtained.
(1) 接栓をコネクタに挿入する時金属芯が、コネ
クタコンタクト表面（金メツキ層）を傷つける
ことがなくなつた。(1) When inserting the plug into the connector, the metal core no longer damages the connector contact surface (gold plating layer).
(2) 活線挿抜時、金属芯による回路短絡を防止で
きる。(2) Prevents short circuits caused by the metal core during hot insertion and removal.
(3) 腐食性雰囲気における金属芯の腐食を防止で
きる。(3) Corrosion of the metal core in a corrosive atmosphere can be prevented.
図面は、本発明の方法により得られた金属芯入
配線板を示すもので、第１図は断面図、第２図は
平面図である。
符号の説明、１……接栓、２……金属芯、３…
…絶縁層、４……絶縁樹脂。
The drawings show a metal-core wiring board obtained by the method of the present invention, with FIG. 1 being a sectional view and FIG. 2 being a plan view. Explanation of symbols, 1...Plug, 2...Metal core, 3...
...Insulating layer, 4...Insulating resin.
Claims (1)
を含む金属板全表面に絶縁樹脂層を形成させた
後、配線パターンを形成し、外形を最終製品の大
きさに切断加工する金属芯入配線板の製造法に於
て、金属板に、最終径より大なるスルホール、及
び、最終製品の大きさに切断加工した時に金属芯
端面の露出が望まれない位置に長溝を設け、スル
ホール、長溝に絶縁樹脂を充填し、絶縁樹脂が充
填したスルホール部に金属板に設けられたスルホ
ールより小なるスルホールをあけると共に、絶縁
樹脂が充填した長溝の中で最終製品の大きさに切
断加工することを特徴とする金属芯入配線板の製
造法。1 Manufacture of a wiring board with a metal core in which a through hole is provided in a metal plate, an insulating resin layer is formed on the entire surface of the metal plate including the inner wall of the through hole, a wiring pattern is formed, and the outer shape is cut to the size of the final product. In the method, a through hole larger than the final diameter is formed in a metal plate, and a long groove is formed in a position where the end face of the metal core is not desired to be exposed when cut to the size of the final product, and insulating resin is applied to the through hole and long groove. The metal is filled with insulating resin, and a through hole smaller than the through hole provided in the metal plate is opened in the through hole portion filled with insulating resin, and the metal is cut into the size of the final product in the long groove filled with insulating resin. Manufacturing method for cored wiring boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11995381A JPS5821395A (en) | 1981-07-29 | 1981-07-29 | Method of producing metal core-filled circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11995381A JPS5821395A (en) | 1981-07-29 | 1981-07-29 | Method of producing metal core-filled circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5821395A JPS5821395A (en) | 1983-02-08 |
| JPS624000B2 true JPS624000B2 (en) | 1987-01-28 |
Family
ID=14774277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11995381A Granted JPS5821395A (en) | 1981-07-29 | 1981-07-29 | Method of producing metal core-filled circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5821395A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62274691A (en) * | 1986-05-22 | 1987-11-28 | イビデン株式会社 | Metal core printed wiring board and manufacture of the same |
| JPH01319995A (en) * | 1988-06-21 | 1989-12-26 | Ibiden Co Ltd | Substrate for loading electronic part and manufacture thereof |
-
1981
- 1981-07-29 JP JP11995381A patent/JPS5821395A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5821395A (en) | 1983-02-08 |
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