JPH0697619A - Printed wiring board - Google Patents

Abstract

PURPOSE:To obtain a low-cost, high-reliability printed wiring board for card- edge connectors by covering plating electrodes with an insulative protective film. CONSTITUTION:On the surface and the rear of a printed wiring board 10, a plurality of gold-plating plugs 2 are arranged within a constant distance from the outer periphery of the board. In order to plate the plugs 2, a series of plating electrodes 4 stretching from the plugs 2 toward the outer peripheral edge is arranged. An insulative protective film 11 which collectively covers a series of the plating electrodes 4 is formed. Since the plating electrodes are covered with the insulative protecting film, the plating electrodes are not deformed by V trench machining. Thereby the plating electrodes can be left, so that the work for eliminating the individual plating electrodes can be omitted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION This invention mounts electronic parts,
The present invention relates to a printed wiring board having wirings for electrically connecting components to each other and further composed of front and back conductive layers.

[0002]

2. Description of the Related Art FIGS. 3 to 6 are plan views showing a conventional card edge type printed wiring board. In the figure, 10
Is a printed wiring board including a gold-plated plug 2, a VIA hole 3, a plated electrode 4, a power supply terminal 5, a square hole 6, and a discarding plate 7. Also, 8 and 9 are the printed wiring board 10
It is a V-groove machined into.

Next, the operation will be described. FIG. 6 shows the final shape of the printed wiring board. With this shape, when an electronic component is mounted on this printed wiring board 10, it cannot be automatically mounted. Therefore, a square or rectangular shape is formed until the electronic component is mounted, and a circuit is formed within a certain distance on the outer circumference. There is a restriction condition that electronic parts should not be mounted. Hereinafter, FIGS. 3 to 5 show this process. In FIG. 3, the VIA hole 3 is a conduction hole for forming an electronic circuit, and the gold-plated connector 2 is a conductive terminal portion for connection for inputting / outputting a signal to / from the printed wiring board 10. Reference numerals 4 and 5 denote a plating electrode and a power supply terminal for performing the gold plating process on the gold plating connector 2, and the plating electrode 4 is used for the front surface and the back surface of the printed wiring board 10 (that is, the first and second outer layers). Layers).
The square hole 6 and the discard plate 7 are for mounting the electronic component on the printed wiring board 10 and then finishing it into a predetermined shape shown in FIG. 6, and the discard plate 7 is removed after the electronic component is mounted. Also, FIG.
Shows a state in which V-grooves 8 and 9 for removing the discard plate 7 after component mounting are processed, and the plating electrode 4 is deformed by the processing of the V-groove 8. FIG. 5 shows a state in which the deformed plating electrode 4 of the portion A of FIG. 4 is removed.

[0004]

Since the conventional printed wiring board is constructed as described above, there is a risk that the plating electrode may be deformed during the V-groove processing and that a short circuit accident may occur in this state. For this reason, there is a problem that it is necessary to carefully remove each of the plated electrodes one by one.

The present invention has been made to solve the above problems, and an object thereof is to obtain a printed wiring board having high reliability and good workability.

[0006]

In the printed wiring board according to the present invention, at least the gold-plated plug side of a series of plated electrodes cut by V-groove processing is protected by an insulating protective film.

[0007]

Since the plated electrode in the present invention is protected by the insulating protective film, it is highly reliable because it is not deformed by the V-groove processing of the waste plate of the printed wiring board, and therefore it is necessary to remove individual plated electrodes. Productivity is improved.

[0008]

EXAMPLES Example 1. An embodiment of the present invention will be described below with reference to FIG.
2 will be described. In the figure, 10 is a printed wiring board composed of a gold-plated connector (conductive terminal portion) 2, a VIA hole 3, a plated electrode 4, a power supply terminal 5, a square hole 6 and a discarding plate 7. Further, 8 and 9 are V grooves processed on the printed wiring board 10, and 11 is applied or adhered to at least the gold-plated connector 2 side of the series of plated electrodes 4 cut by the V groove processing. It is an insulating protective film.

Next, the operation of this embodiment will be described. In FIG. 1, the VIA hole 3 is a conduction hole for forming an electronic circuit. The gold-plated connector 2 is a conductive terminal portion for connection for inputting / outputting a signal to / from the printed wiring board 10. Reference numerals 4 and 5 indicate a plating electrode and a power supply terminal for performing a gold plating process on the gold plating connector 2, and the plating electrode 4 is formed on the front surface and the back surface of the printed wiring board 10. The square hole 6 and the discard plate 7 are the printed wiring board 10
This is for finishing electronic components after mounting them into a predetermined shape. Further, reference numeral 11 denotes an insulating protective film which is applied or adhered on the series of plated electrodes 4 in a uniform manner (in the case shown, it is provided on the gold-plated plug side among those cut by the V groove. It may be provided entirely on both sides). Further, FIG. 2 shows a state where the V-grooves 8 and 9 for removing the discarding plate 7 after mounting the components are provided. According to the present invention, even if the V groove 8 is processed, the plating electrode 4 cut by this is not deformed because it is protected by the insulating protective film 11. Therefore, the work of removing the plating electrode 4 remaining on the gold-plating connector 2 side becomes unnecessary.

[0010]

As described above, according to the present invention, the insulating protective film is applied or adhered over the series of plated electrodes, so that the plated electrodes are not deformed, and the reliability and workability are high. There is an effect that a good and cheap one can be obtained.

[Brief description of drawings]

FIG. 1 is a plan view showing a state before a V groove is formed on a printed wiring board according to an embodiment of the present invention.

FIG. 2 is a plan view showing a state after V-groove processing of the printed wiring board according to the embodiment of the present invention.

FIG. 3 is a plan view showing a state of a conventional printed wiring board before V-groove processing.

FIG. 4 is a plan view showing a state of a conventional printed wiring board after V-groove processing.

FIG. 5 is a plan view showing a state in which a plating electrode connected to a gold-plated plug is further removed after processing a V groove in a conventional printed wiring board.

FIG. 6 is a plan view showing a final shape of a conventional printed wiring board.

[Explanation of symbols] 2 Gold-plated plug (conductive terminal for connection) 3 VIA hole 4 Plated electrode 5 Power supply terminal 6 Square hole 7 Discard plate 8 V groove 9 V groove 10 Printed wiring board 11 Insulating protective film

Claims (1)

[Claims] 1. A printed wiring board has a plurality of connecting conductive terminal portions on a front surface and a back surface thereof within a certain distance from an outer periphery of the printed wiring board, and these terminal portions are plated to plate these terminal portions. A printed wiring board having a series of plating electrodes extending to the outer peripheral edge and having an insulating protective film that covers the series of plating electrodes.