JPH09172238A - Connecting terminal of circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connecting terminal of circuit board doing no damage to an electrode on connector side in the fitting step. SOLUTION: A circuit board is chamferred to provide a bevel surface 40 while a contact part 3 to be brought into contact with an electrode on a connector side in the fitted state as well as a leading part 40 to take a continuity with the contact part 3 in the manufacturing step are provided in a contact electrode 5 so that the leading part 4 in narrower width than that of the contact part 3 may be arranged on the position slipped from the center of the electrode 5. Through these procedures, at most a part of the electrode 5 is damaged in the fitting step so that the contact part 3 may be brought into contact with the no-damaged part of the electrode 5. Otherwise, the edge part b on the bevel surface 40 may be covered with a protective material.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a beveler (chamfer) provided at the end of a circuit board for connection with a connector.
More specifically, the present invention relates to a processed connection terminal, and more particularly, to a connection terminal of a circuit board that reduces damage to the connector side when the connector is mounted on the connector.

[0002]

2. Description of the Related Art Conventionally, in various electronic devices,
A circuit board is used in which a circuit pattern is formed on the surface of an insulating material such as resin as a base material. A connection terminal for electrical connection with the device side is formed at the end of the circuit board, and the connection terminal is used by inserting it into a connector provided on the device side.

The structure of a conventional connecting terminal is shown in the sectional view of FIG. 10 together with the connector on the device side. This connection terminal 101 is
The contact electrodes 104 are formed on both surfaces of the insulating substrate 103,
Beveler surface 106 by beveling the edge with the end face 105
Is provided. Then, as shown in the plan view of FIG. 11, a large number of contact electrodes 104 are provided in parallel on the insulating substrate 103. Here, the contact electrode 104 of the connection terminal 101 is formed from the bottom by three-layer plating including electroless copper plating, nickel plating, and hard gold plating. The thickness of each layer is typically 30 μm, 5 μm, 0.
It is about 5 μm. Then, the beveler surface 106 is processed after the formation of the three-layer plated layer. 10 and 11, a indicates the tip position (end surface 105) of the insulating substrate 103, and b indicates the edge position between the beveler surface 106 and the surface.

When this is inserted into the connector 111, the connection terminal 101 enters the connector 111 while the contact electrode 113 on the connector 111 side is expanded by the beveler surface 106.
Then, when the connecting terminal 101 is pushed until the contact electrodes 104 and the contact electrode 113 of both are brought into contact with each other, the circuit board is attached to the device. It should be noted that the connector 111 side has a large number of contact electrodes 1 as in the connection terminal 101.
Needless to say, 13 are provided in parallel, and each contact electrode 113 on the connector 111 side has a connection terminal 101.
The same width as the contact electrode 104 is provided.

[0005]

However, the connection terminal of the circuit board according to the prior art described above has a connector 111.
There was a problem that the other party's contact electrode 113 was damaged when it was attached to. This is because the contact electrode 104 forms a metal edge at the edge portion with the beveler surface 106, and since the uppermost layer thereof is hard gold plating, the contact electrode 113 is attacked by this hard metal edge. For this reason, when the connector 111 is repeatedly attached and detached, the contact electrode 113 of the connector 111 may be worn away, resulting in poor contact.

The present invention has been made in order to solve the above-mentioned conventional problems, and reduces or eliminates contact by a metal edge with respect to the contact portion of the other party, prevents damage to the other party, and repeatedly attaches and detaches. It is also an object of the present invention to provide a connection terminal for a circuit board in which poor contact does not occur.

[0007]

In order to achieve the above object, the invention according to claim 1 is a circuit in which a contact electrode is provided on the surface of a circuit board and a beveler surface is provided by chamfering between the surface and the end surface. In the connection terminal of the substrate, the contact electrode, a contact portion provided away from the beveler surface, and a width narrower than the contact portion from the contact portion to the edge of the surface and the beveler surface. It has a drawer part provided.

In this connection terminal of the circuit board, the beveler surface first comes into contact with the contact electrode on the connector side when it is inserted into the connector side, and the contact electrode on the connector side is expanded with the pushing operation. As the pushing further proceeds, the edge between the surface and the beveler surface reaches the contact electrode on the connector side. Here, since the lead-out part of the contact electrode is narrower than the contact part,
The lead-out portion at the edge contacts at most a part of the contact electrode on the connector side. Therefore, the lead-out portion at the edge does not damage at least a part of the contact electrode on the connector side. Then, when the pushing further proceeds and the contact portion of the contact electrode comes into contact with the contact electrode on the connector side, the attachment of the connection terminal to the connector is completed. At this time, a portion of the contact electrode on the connector side that is not attacked by the lead-out portion at the edge always comes into contact with the contact portion, and therefore contact failure does not occur even after repeated attachment and detachment.

The invention according to claim 2 is the connection terminal of the circuit board according to claim 1, wherein the lead-out portion is provided offset from the center of the contact electrode in the width direction. It is characterized by

In this connection terminal of the circuit board, since it is offset with respect to the center in the width direction of the lead-out portion contact electrode, the edge of the contact electrode on the connector side is further reduced.

According to a third aspect of the present invention, there is provided a connection terminal for a circuit board, wherein a contact electrode is provided on the surface of the circuit board, and a beveled surface is provided by chamfering between the surface and the end surface. It is characterized by comprising a protective member for covering the edges of the working electrode and the beveler surface. As the protective member, for example, a resin material such as a solder resist or a polyimide film can be considered.

In this connection terminal of the circuit board, the beveler surface first contacts the contact electrode on the connector side when it is inserted into the connector side, and pushes the contact electrode on the connector side together with the pushing operation. As the pushing further proceeds, the edge between the surface and the beveler surface reaches the contact electrode on the connector side. Here, since the edge is covered with the protective member, the lead-out portion of the contact electrode does not come into direct contact with the contact electrode on the connector side at the edge and is not damaged. Then, when the pushing further proceeds and the contact portion of the contact electrode comes into contact with the contact electrode on the connector side, the attachment of the connection terminal to the connector is completed. Since the contact electrode on the connector side is not attacked by the lead-out portion at the edge, contact failure does not occur even after repeated attachment and detachment.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments in which the connection terminals of a circuit board according to the present invention are embodied will be described in detail below with reference to the drawings.

First embodiment. This embodiment corresponds to claims 1 and 2.

FIG. 1 is a plan view showing the vicinity of an end portion of a circuit board 60 having a circuit pattern formed on the surface of an insulating substrate 61, and a large number of connection terminals 1 are provided in parallel. The ends of the insulating substrate 61 are beveled between the front and back surfaces and the end face 62 to form an inclined bevel surface 40 (see the sectional view of FIG. 2). And each connection terminal 1
Is obtained by plating the surface of an insulating substrate 61 with a contact electrode 5 having a predetermined shape. Each contact electrode 5 is for contacting with the contact electrode of the connector when it is attached to the connector on the device side to establish conduction. 1 and 2, a indicates the tip position (end face 62) of the insulating substrate 61, and b indicates the edge position between the beveler face 40 and the surface (the same applies hereinafter).

Each contact electrode 5 has a wide contact portion 3 located away from the beveler surface 40 and a narrow lead-out provided from the contact portion 3 to the edge (position b) of the beveler surface 40. And part 4. The lead-out portion 4 is provided offset from the center of the contact portion 3 in the width direction. It is the contact portion 3 that has a role of contacting the contact electrode of the connector in the mounted state. The lead-out portion 4 is inevitably present in the process during plating, and is not necessary for the function as a connection terminal. Although the plating process will be described later, the uppermost layer is hard gold plating because it requires wear resistance to withstand attachment / detachment to / from the connector. Since the beveler surface 40 is formed by beveling after plating, there is no plating layer on the beveler surface 40.

A circuit board 6 provided with each connection terminal 1
The mounting of 0 on the connector is performed by inserting the end portion of the circuit board 60 on which the connection terminal 1 is provided into the connector, and the operation itself is the same as that of the conventional one shown in FIG. That is, the end portion of the circuit board 60 is connected to the connector 11
1, the beveler surface 40 first comes into contact with the contact electrode 113 on the connector 111 side from the inside, and the contact terminal 113 is expanded while the beveler surface 40 spreads the connection terminal 1 into the connector 11.
Enter 1 Needless to say, a large number of contact electrodes 113 are provided in parallel on the connector 111 side as well as the connection terminal 1, and each contact electrode 1 on the connector 111 side is also provided.
The width 13 is given to be approximately the same as or slightly smaller than the contact portion 3 of the contact electrode 5.

When the circuit board 60 is further pushed, the edge b reaches the contact electrode 113 on the connector 111 side. At this time, as shown in the enlarged view of FIG. 3, since the lead-out portion 4 is narrow and provided at a position displaced from the center of the contact portion 3 in the width direction, most of the contact electrode 113 is led out at the edge b. It passes through the width c without the portion 4 and hardly passes through the width d with the drawer portion 4. Therefore, the contact electrode 113
Is hardly attacked by the hard gold-plated metal edge when crossing the edge b. Edge b is contact electrode 11
Beyond 3, the surface of the contact electrode 11 instead of the beveler surface 40
It comes into contact with 3. However, at this point, since the lead-out portion 4 is narrow and is provided at a position displaced from the center of the contact portion 3 in the width direction, the contact electrode 11 on the connector 111 side is provided.
3 and the contact electrode 5 of the connection terminal 1 are hardly in contact with each other.

When the circuit board 60 is pushed further in, the contact portion 3 of the contact electrode 5 causes the contact electrode 113 on the connector 111 side.
Is in contact with. In this state, the circuit board 60 is attached to the connector 111 on the device side. As will be described later, since there is no step between the contact electrode 5 and the other portion, the edge of the contact portion 3 has the contact electrode 113.
The contact electrode 113 is not damaged when reaching the contact point. In this state, most of the contact electrode 113 is in contact with the contact electrode 5 of the connection terminal 1, and the conduction is good. In particular, even if the contact electrode 113 is hardly damaged when passing through the edge b, even if a part in the width direction passes through the width d at the edge b and the part is damaged by the metal edge of hard gold plating, Since most of the remaining non-damaged portion contacts the contact portion 3, good electrical continuity between both electrodes is maintained.

Next, a manufacturing process of the circuit board 60 having the connection terminal 1 will be described.

First, a pattern is formed on the insulating substrate 61 by plating. By this pattern formation, not only the pattern of the connection terminal 1 near the end portion but also the circuit pattern of the central portion of the substrate is formed. This plating is a three-layer plating, and is electroless copper plating, nickel plating, and hard gold plating from the bottom. The thickness of each layer is usually 30 μm, 5 μm from the bottom,
It is about 0.5 μm. Since the pattern is formed by plating, the permanent resist pattern is first formed on the insulating substrate 61 by a known photolithography method using a permanent resist film. The pattern of this permanent resist is a negative pattern of the terminal or circuit pattern to be formed, and its thickness is made equal to the total thickness of the plating layer to be formed.

When electroless copper plating is applied, catalytic activity is imparted in advance. The plating layer is formed on the insulating substrate 61, but the plating layer is not formed on the permanent resist having no catalytic activity. Therefore, a negative pattern with respect to the pattern of the permanent resist, that is, a copper plating layer of the terminal or circuit pattern to be formed is formed. The pattern thus formed includes the contact portion 3 and the lead-out portion 4 as well as the lead portion 7, as shown in FIG. This lead part 7
Is for conducting to each contact portion 3 when the subsequent nickel plating and hard gold plating are performed by electroplating,
It is provided outside the position a which becomes the end face when the substrate is completed.

After forming a 30 μm-thick copper plating layer by electroless copper plating, the lead portion 7 is electrically connected to the cathode to perform nickel plating by electroplating. At this time, the nickel plating layer is formed on the lead portion 7, the lead-out portion 4, and the contact portion 3 which are supplied with power through the already formed copper plating layer, and the plating layer is formed on the permanent resist which is not supplied with electricity because it is an insulator. Is not formed. Electric power is supplied to the contact part 3 via the drawing part 4. After forming a nickel plating layer with a thickness of 5 μm, similarly electroplating with a thickness of 0.5 μm
When the thick hard gold plating layer is formed, the plating process ends. At this time, since the total thickness of the plating layer is equal to the total thickness of the permanent resist pattern, there is no step between the plating pattern portion and other portions. Although not shown, a circuit pattern is also formed by the same three-layer plating layer in the central portion of the substrate. A sectional view of this state is shown in FIG.

After the plating process is completed, the substrate is cut at the position a and the lead portion 7 is removed. This is because the contact portions 3 and the lead-out portions 4 are electrically separated from each other. A plan view and a cross-sectional view of this state are shown in FIG. 6 and FIG. 7, respectively. When the end face 62 is beveled, the state shown in FIGS. 1 and 2 is obtained, and the circuit board 60 having the connection terminal 1 is completed. Beveler processing is performed on the connection terminal 1
Bevel surface 40 when inserting the connector into the connector on the device side
This is because the electrodes on the connector side are pushed apart by this so that the mounting is smooth.

Second embodiment. This embodiment corresponds to claim 3.

The connection terminal of the circuit board according to this embodiment is similar to that of the first embodiment in that the connection terminal is beveled as shown in the sectional view of FIG. To the edge b of the beveler surface 40 from the resin film 10
It is covered with. As the resin film 10, for example, a polyimide film having a thickness of about 25 μm is suitable. In this embodiment, as in the case of the first embodiment, the contact electrode 5 does not necessarily have a narrow lead-out portion 4.
Need not be provided, and the entire width up to the edge b may be the same width. The contact electrode 5 itself is formed of the same three-layer plating layer as that of the first embodiment.

When the connection terminal is attached to the connector on the device side, first, as in the case of the first embodiment, the contact electrode on the connector side is spread by the oblique beveler surface 40, and the edge b is removed. It is mounted by passing through the contact electrode. Furthermore, when the entire resin film 10 passes through the contact electrodes, the electrodes on the board side and the connector side come into contact with each other to establish conduction. At this time, the edge b is the resin film 1
Since it is covered with 0, the contact electrode on the connector side is not damaged by the metal edge at the edge b.

Third embodiment. This embodiment also corresponds to claim 3 as in the second embodiment.

The connection terminal of the circuit board according to this embodiment is the same as that of each of the above-mentioned embodiments in that it is beveled as shown in the sectional view of FIG. Protective resin 1 only in the vicinity of edge b with beveler surface 40
It is covered with 1. As the protective resin 11, for example, a solder resist formed by pattern printing is suitable, and its thickness is preferably about 20 μm. As in the case of the first embodiment, it is not necessary to provide the contact electrode 5 with the narrow lead-out portion 4 as in the case of the first embodiment. The entire width may be the same width. The contact electrode 5 itself is formed of the same three-layer plating layer as in the above-mentioned respective embodiments.

When this connecting terminal is attached to the connector on the device side, the contact electrode on the connector side is first spread by the oblique beveler surface 40, and the edge b is covered, as in the case of each of the above-described embodiments. The protective resin 11 is attached by passing through the contact electrode. When the protective resin 11 passes through the contact electrode, the electrodes on the substrate side and the connector side come into contact with each other to establish conduction. At this time, since the edge b is covered with the protective resin 11, the contact electrode on the connector side is not damaged by the metal edge at the edge b.

As described in detail above, according to each of the above-mentioned embodiments, the damage to the electrodes of the connector is extremely small when the board is mounted on the connector on the device side.
A connection terminal of a circuit board has been realized which does not cause a contact failure even if it is repeatedly attached to and detached from a connector.

That is, according to the first embodiment, a portion of the contact electrode 5 of the connection terminal from the contact portion 3 to the edge b is formed as a narrow lead-out portion 4 at the center of the contact portion 3 in the width direction. Because of the offset, the edge b portion (metal edge) of the lead-out portion 4 attacks at most a part of the entire width of the electrode of the connector at the time of mounting, and the contact portion 3 makes contact with the portion that has not attacked. Therefore, even if a part of the entire width of the electrode of the connector wears due to repeated attachment / detachment, the contact portion 3 is surely in contact with the non-wearing portion in the mounted state, and no conduction failure occurs. Further, according to this embodiment, there is also an advantage that the conventional product can be manufactured without a special additional step simply by changing the electrode shape.

Further, according to the second or third embodiment, since the edge b which is the main cause of the attack of forming the metal edge on the electrode of the connector is covered with the protective material such as polyimide or solder resist, the mounting is prevented. At this time, the metal edge is prevented from attacking the electrode of the connector, and the electrode of the connector is not abraded even if the connector is repeatedly attached and detached, so that the conduction failure does not occur.

The present invention is not limited to the above-mentioned embodiments, and it goes without saying that various improvements and modifications can be made without departing from the gist of the present invention. For example, the numerical values shown in each of the above-mentioned embodiments and the material of each part are
However, it is not limited to this. Further, in the first embodiment, the lead-out portion 4 is offset in the width direction within the range of the entire width of the contact portion 3. However, the lead-out portion 4 may be offset beyond the range as long as it does not contact the adjacent terminal. Further, in each of the above-described embodiments, the method of forming the pattern of the circuit board serving as the base is based on the full-additive method, but the same effect can be obtained by using a subtractive method which is generally used. Needless to say.

[0035]

As described above, according to the present invention, the contact by the metal edge with the contact portion of the other party is reduced or eliminated, and as a result, the other party is prevented from being damaged, and the contact failure occurs even after the detachment is repeated. Circuit board connection terminals that do not occur are provided.

[Brief description of the drawings]

FIG. 1 is a plan view of a connection terminal of a circuit board according to a first embodiment.

2 is a cross-sectional view of a connection terminal of the circuit board of FIG.

3 is an enlarged view of a connection terminal of the circuit board of FIG.

FIG. 4 is a plan view showing a manufacturing process of the connection terminal of the circuit board of FIG.

5 is a cross-sectional view of the state of FIG.

6A and 6B are plan views showing a manufacturing process of the connection terminal of the circuit board of FIG.

7 is a cross-sectional view of the state of FIG.

FIG. 8 is a cross-sectional view of a connection terminal of the circuit board according to the second embodiment.

FIG. 9 is a cross-sectional view of a connection terminal of a circuit board according to a third embodiment.

FIG. 10 is a cross-sectional view of a connection terminal of a conventional circuit board.

FIG. 11 is a plan view of a connection terminal of a conventional circuit board.

[Explanation of symbols]

 3 Contact part 4 Drawing part 5 Contact electrode 10 Resin film 11 Protective resin 40 Beveler surface 60 Circuit board b Edge

Claims (3)

[Claims] 1. A connection terminal of a circuit board, wherein a contact electrode is provided on the surface of a circuit board and a bevel surface is provided by chamfering between the surface and an end surface, wherein the contact electrode is separated from the bevel surface. A connection terminal of a circuit board, comprising: a contact portion provided on the circuit board; and a lead-out portion provided from the contact portion to an edge of the surface and the beveler surface to be narrower than the contact portion. 2. The connection terminal of the circuit board according to claim 1, wherein the lead-out portion is provided offset from the center of the contact electrode in the width direction. . 3. A connection terminal of a circuit board, wherein a contact electrode is provided on the surface of a circuit board, and a beveler surface is provided by chamfering between the surface and the end surface, and an edge between the contact electrode and the beveler surface is provided. A connection terminal for a circuit board, comprising a protective member for covering.