JP2017038085A - Circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit module that allows high-density wiring by providing auxiliary wiring not connected to an integrated circuit element for an IC package having the integrated circuit element.SOLUTION: A circuit module includes an IC package 2 having an integrated circuit element 5 and a wiring board 3 on which the IC package 2 is mounted, and the integrated circuit element 5 is connected to a plurality of land electrodes of the wiring board 3 via a part of a plurality of pads formed on a surface of the IC package 2. At least the two pads not connected to the integrated circuit element 5 among the plurality of pads are provided on the IC package 2, and they are connected by auxiliary wiring 8 not connected to the integrated circuit element 5. Further, a plurality of wiring patterns 10 provided in the wiring board 3 are connected via at least the two pads not connected to the integrated circuit element 5 and the auxiliary wiring 8.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a circuit module in which an IC package is mounted on a wiring board.

  Various mobile terminal devices typified by cellular phones and the like include various electronic components such as IC packages having semiconductor circuit elements that form various functional circuits such as RF circuits, baseband circuits, liquid crystal drive circuits, and power supply circuits. Built-in circuit module. In recent years, with the miniaturization and high functionality of mobile terminal devices, there has been a demand for miniaturization and high functionality of circuit modules. In such a case, the wiring board which is the base board of the circuit module becomes small, and various electronic components are mounted in close proximity on the wiring board. Therefore, it is difficult to secure a space on the surface of the wiring board for forming a wiring pattern for connecting various electronic components mounted on the wiring board.

  Therefore, as shown in FIG. 9, a technique for multilayering a wiring board on which various electronic components such as an IC package are mounted has been proposed (see, for example, Patent Document 1). In this case, each wiring layer 201 constituting the multilayered wiring board is provided with a through-via-hole conductor 202, a semi-through-hole via-hole conductor 203, a line conductor 204, and the like, so that various electronic components mounted on the wiring board are provided. A wiring pattern for connecting 205 is formed in the inner layer of the wiring board.

Japanese Patent Laying-Open No. 2011-9786 (see paragraphs 0027 to 0030, FIG. 1, etc.)

  However, as in the prior art, by increasing the number of wiring boards, the wiring pattern of the circuit module can be increased in density and various electronic components can be connected by the wiring pattern. Then, it is necessary to increase the number of layers of the wiring board. In this case, by increasing the number of layers, the manufacturing cost of the circuit module increases, the thickness of the wiring board also increases, and consequently the height dimension of the circuit module increases. Moreover, there is a possibility that a transmission loss of an electric signal or the like may occur when the wiring pattern is routed around the wiring board or the surface of the wiring board.

  The present invention has been made in view of the above problems, and provides a circuit module capable of high-density wiring by providing auxiliary wiring not connected to an integrated circuit element in an IC package having the integrated circuit element. The purpose is to do.

  In order to achieve the above object, a circuit module of the present invention includes an IC package having an integrated circuit element and a wiring board on which the IC package is mounted, and a plurality of pads are formed on the surface of the IC package. In the circuit module in which the integrated circuit element is connected to the plurality of land electrodes of the wiring board through a part of the plurality of pads, the IC package is disposed on the active surface side of the integrated circuit element. A plurality of pads formed on a surface of the redistribution layer, the redistribution layer formed of a resin, and an auxiliary not internally connected to the integrated circuit element; Columnar conductors provided in the redistribution layer, wherein at least two pads that are provided with wiring and are not connected to the integrated circuit element among the plurality of pads, A plurality of wiring patterns provided on the wiring board are connected via the auxiliary wiring and the at least two pads are connected via the auxiliary wiring (Claim 1). .

  Further, the auxiliary wiring is provided so as to connect the at least two pads which are respectively arranged on opposite sides of the IC package and are not connected to the integrated circuit element (claims). Item 2).

  In addition, an inductor may be provided in the auxiliary wiring (Claim 3), or a capacitor may be provided (Claim 4).

  According to the invention of claim 1, in the IC package to be mounted on the circuit module, at least two pads that are not connected to the integrated circuit element among the plurality of pads are provided in the IC package, and A plurality of wiring patterns provided on the wiring board are connected to the at least two pads via the auxiliary wiring, and are connected by auxiliary wiring not connected to the integrated circuit element.

  Since the auxiliary wiring is formed using an empty pad that is not connected to the integrated circuit element of the IC package, a wiring pattern to be formed on the wiring board is formed on the IC package side by using this auxiliary wiring. be able to. Therefore, high density wiring of the circuit module can be achieved.

  In addition, by using auxiliary wiring, for example, when the wiring board has a multilayer structure, high-density wiring is possible without increasing the number of layers of the wiring board. Increase in the manufacturing cost of the module due to the increase in the number of layers of the wiring board can be suppressed.

  Further, since the rewiring layer is formed on the active surface side of the integrated circuit element, and the rewiring layer is provided with a plurality of pads of the IC package and the auxiliary wiring, High density wiring can be achieved.

  According to the invention of claim 2, the auxiliary wiring is provided so as to connect at least two pads which are respectively arranged on the opposite sides of the IC package and are not connected to the integrated circuit element. For example, when connecting a plurality of electronic components mounted on a position across the IC package with a wiring pattern formed on the surface of the wiring board, form the wiring pattern linearly so as to pass under the IC package. Is preferable in consideration of transmission loss of electric signals and the like, but there is a case where the wiring pattern cannot be formed linearly due to the relationship with other wiring patterns. In such a case, conventionally, it does not pass under the IC package. When the wiring pattern is routed around and the wiring board has a multilayer structure, the electronic components are electrically connected by increasing the number of layers of the wiring board.

  The auxiliary wiring provided in the IC package according to the invention of claim 2 is formed so as to connect at least two pads which are respectively arranged on opposite sides of the IC package and not connected to the integrated circuit element. By using this auxiliary wiring, even when the wiring pattern cannot be formed linearly as described above, the electronic components can be connected linearly while avoiding other wiring patterns.

  Therefore, it is not necessary to route an extra wiring pattern in order to avoid other wiring patterns, and the wiring board of the module can be made small. In addition, since it is not necessary to increase the number of layers of the wiring board, it is possible to reduce the height of the circuit module and to suppress an increase in manufacturing cost of the circuit module due to the multilayered wiring board. Further, since the length of the wiring pattern can be shortened, transmission loss of an electric signal or the like caused by drawing the wiring pattern can be suppressed.

  According to the invention of claim 3, since the inductor is provided in the auxiliary wiring on the IC package side, it is not necessary to form the inductor on the wiring board, and the module can be miniaturized.

  According to the invention of claim 4, since the capacitor is provided in the auxiliary wiring on the IC package side, it is not necessary to form the capacitor on the wiring board, and the module can be miniaturized.

It is a figure which shows the circuit module concerning 1st Embodiment of this invention. It is a figure which shows an example of the electrode pad of the integrated circuit element concerning 1st Embodiment of this invention, the rewiring pattern of IC package, and the wiring pattern of a circuit module. It is a figure which shows the circuit module concerning 2nd Embodiment of this invention. It is a figure which shows the circuit module concerning 3rd Embodiment of this invention. It is a figure which shows the circuit module concerning 4th Embodiment of this invention. It is a figure which shows the circuit module concerning 5th Embodiment of this invention. It is a figure which shows an example of the inductor provided in IC package. It is a figure which shows an example of the capacitor provided in IC package. It is a figure which shows an example of the conventional circuit module.

<First Embodiment>
The module according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view of a circuit module according to a first embodiment of the present invention, FIG. 2 (a) is a plan view of an IC package, and (b) is a plan view of a wiring board on which a wiring pattern is formed. is there. 2A shows only the outline of the IC package, a plurality of pads, the electrode pads of the integrated circuit element, the redistribution line, and the auxiliary wiring as viewed from the integrated circuit element side for the sake of simplicity. The other parts are shown as transparent. FIG. 2B shows the outline of the IC package when the IC package is mounted on the wiring board and the auxiliary wiring provided on the IC package by dotted lines. Moreover, in FIG.2 (b), the electronic components 4a and 4b mounted in the wiring board 3 are represented by the dotted line.

  A circuit module 1 shown in FIG. 1 is mounted on a mother board included in a communication terminal device. In this embodiment, an IC package 2 including an integrated circuit element 5 on which various circuits are formed, and other integrated circuits. It includes various electronic components 4a and 4b such as circuit elements, filters, resistors, capacitors, and inductors, and an IC package 2 and a wiring board 3 for mounting the various electronic components 4, and is provided with an RF-ID (Radio Frequency IDentification). It is formed as a circuit module of a communication terminal device for RW of the system.

  As shown in FIG. 1, the IC package 2 has a wafer level-chip size package (WL-CSP) structure, and is composed of an integrated circuit element 5 on which various functional circuits are formed, and an insulating material such as polyimide or epoxy resin. The formed rewiring layer 6, a plurality of pads 7 for external connection, and an auxiliary wiring 8 are provided. Examples of the integrated circuit element 5 include an RF-ID RW IC, a high-frequency front-end SW-IC, and a power SW-IC. Further, the auxiliary wiring 8 formed on the rewiring layer 6 can be formed on the rewiring layer 6 formed of polyimide using a photolithography technique.

  Further, each external connection pad 7 provided in the IC package 2 is connected to the integrated circuit element via a post electrode 13a (for example, Cu post), a rewiring line 14 formed in the rewiring layer 6, and a via conductor 13b. 5 are electrically connected to each electrode pad 9 and auxiliary wiring 8. Then, by mounting the IC package 2 at a predetermined position on the wiring board 3, each pad 7 of the IC package 2 and the IC package land electrode 11 a provided on the wiring board 3 are electrically connected via the solder 12. Connected to. In this case, the IC package 2 may be mounted by a general surface mounting technique such as ultrasonic bonding or solder reflow. Each electrode pad 9 of the integrated circuit element 5 is made of, for example, Al, and the auxiliary wiring 8 formed in the rewiring layer 6 is made of, for example, Cu.

  In this embodiment, the wiring board 3 is integrally formed as a ceramic laminate by laminating and firing a plurality of dielectric layers formed of ceramic green sheets. That is, the ceramic green sheets forming each dielectric layer are formed by forming a slurry in which a mixed powder such as alumina and glass is mixed with an organic binder and a solvent, and the sheet is about 1000 ° C. So that it can be fired at a low temperature. Then, via holes are formed in the ceramic green sheet by laser processing or the like, and the formed via holes are filled with a conductive paste containing Ag, Cu or the like, or via fill plating is performed to form via conductors for interlayer connection Then, various electrode patterns are formed by printing with a conductive paste, and each dielectric layer is formed.

  As described above, the wiring board 3 is provided with various electrode patterns such as the wiring pattern 10, the IC package 2 and the electronic component land electrodes 11a and the electronic component land electrodes 11b for mounting the electronic components 4a and 4b. However, the wiring board 3 can be formed of a printed circuit board, LTCC, alumina substrate, glass substrate, composite material substrate, single layer substrate, multilayer substrate, etc. using resin, ceramic, polymer material, etc. The wiring board 3 may be formed by selecting an optimal material as appropriate according to the purpose of use of the module 1.

  Next, the wiring structure of the circuit module 1 will be described in detail with reference to FIG. 1 and FIG.

  As shown in FIGS. 1 and 2A, the IC package 2 can be connected to an IC package land electrode 11a formed on the surface of the wiring board 3 when the IC package 2 is mounted on the wiring board 3. A plurality of pads 7 for external connection are formed on the surface of the rewiring layer 6 at various positions, and a part of each pad 7 formed on the rewiring layer 6 is a rewiring line 14 formed on the rewiring layer 6. The plurality of electrode pads 9 formed on the active surface of the integrated circuit element 5 are electrically connected via the post electrode 13a and the via conductor 13b. Of the pads 7, pads 7 a that are arranged on opposite sides of the IC package 2 and are not connected to the integrated circuit element 5 are connected by auxiliary wiring 8 formed in the rewiring layer 6. The auxiliary wiring 8 connects not only the pads 7 arranged on the opposite sides of the IC package 2 but also the pads 7 that are not connected to the integrated circuit element 5. It doesn't matter. Further, the auxiliary wiring 8 only needs to be provided on the IC package 2 side, and it is not always necessary to form the rewiring layer 6 and provide it on the rewiring layer 6.

  FIG. 2B shows an IC package land electrode 11a, electronic component land electrode 11b and wiring patterns 10a and 10b formed on the surface of the wiring board 3, and electronic components 4a and 4b mounted on the wiring board 3. An IC package 2 is shown. Of the IC package land electrode 11a, the electronic component land electrode 11b, and the wiring pattern formed on the surface of the wiring board 3, portions other than those related to the description are not shown.

  As shown in FIG. 2B, a plurality of IC package land electrodes 11a, electronic component land electrodes 11b, and wiring patterns 10a and 10b are formed on the surface of the wiring substrate 3, and predetermined IC package land electrodes are formed. The IC package 2 is mounted so that the pads 7 formed on the surface of the rewiring layer 6 of the IC package 2 are connected to 11a (white circles), and the electronic components 4a and 4b are located across the IC package 2. Mounted on the wiring board 3. At this time, the wiring pattern 10 a of the wiring board 3 is formed so as to pass under the IC package 2. In addition, the electronic components 4a and 4b are electrically connected to each other through the wiring pattern 10b and the auxiliary wiring 8 provided in the rewiring layer 6 of the IC package 2, whereby the wiring pattern 10a and the electronic components 4a and 4b are connected. This prevents a short circuit between the wiring patterns 10b connecting the two.

  Note that the connection target of the auxiliary wiring 8 is not limited to the electronic components 4 a and 4 b mounted on the wiring board 3, and an integrated circuit element, a via-hole conductor, an electrode pad, or the like mounted or formed on the wiring board 3 is a connection target. can do.

  By the way, as shown in FIG. 2 (b), when a plurality of electronic components 4a, 4b and the like mounted at a position across the IC package 2 are connected by a wiring pattern 10b formed on the surface of the wiring substrate 3, the IC package It is preferable to form the wiring pattern 10b linearly so as to pass under 2 in view of transmission loss of an electric signal or the like. However, if the wiring pattern 10b that linearly connects the electronic components 4a and 4b is to be formed on the surface of the wiring board 3, the wiring pattern 10a formed on the surface of the wiring board 3 is short-circuited. Both wiring patterns 10a and 10b cannot be formed on the surface. In such a case, conventionally, the wiring pattern 10b is routed around so as not to pass under the IC package 2, or when the wiring board 3 has a multilayer structure, the number of layers of the wiring board 3 is increased. The electronic components 4a and 4b are electrically connected.

  Therefore, according to the circuit module 1 according to the first embodiment, the two pads 7a that are respectively arranged on the opposite sides of the IC package 2 and not connected to the integrated circuit element 5 of the IC package 2 are connected to each other. An auxiliary wiring 8 is provided on the rewiring layer 6 of the IC package 2. Therefore, by connecting the auxiliary wiring 8 and the wiring pattern 10b formed on the wiring substrate 3, the electronic components 4a and 4b are avoided by the linear wiring pattern while avoiding the wiring pattern 10a formed on the surface of the wiring substrate 3. You can connect each other. Therefore, it is not necessary to route the wiring pattern 10b on the surface of the wiring board 3 in order to connect the electronic components 4a and 4b, and the circuit module 1 can be reduced in size. Further, when the wiring board 3 has a multilayer structure, it is not necessary to increase the number of layers, so that the circuit module 1 can be reduced in height, and the manufacturing cost of the circuit module 1 accompanying the multilayered wiring board 3 is increased. Can be suppressed. Further, since the length of the wiring pattern can be shortened, transmission loss of an electric signal or the like caused by drawing the wiring pattern can be suppressed.

Second Embodiment
A circuit module according to a second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a diagram showing a circuit module according to the second embodiment of the present invention.

  The circuit module 1a according to the second embodiment differs from the first embodiment described above in that the electronic component 4 mounted on the wiring board 3 is placed on the rewiring layer 6 of the IC package 2 as shown in FIG. The point is that it is connected to the ground electrode 15 through the formed auxiliary wiring 8. In addition, a wiring pattern 10 b that connects the electronic component 4 and the ground electrode 15 to the auxiliary wiring 8 is formed inside the wiring substrate 3. In addition, since the other structure is the structure similar to above-described 1st Embodiment, description of the structure is abbreviate | omitted by attaching | subjecting the same code | symbol. In this case, a wiring pattern 10 b that connects each of the electronic component 4 and the ground electrode 15 to the auxiliary wiring 8 may be formed on the surface of the wiring board 3.

  With this configuration, a part of the wiring pattern 10b for connecting the electronic component 4 and the ground electrode 15 can be formed on the IC package 2 side, so that the circuit module 1a can be downsized. In addition, the circuit module 1a can be densely wired. Further, when the wiring board 3 has a multilayer structure, it is not necessary to increase the number of layers of the wiring board 3 in forming the wiring pattern 10b for connecting the electronic component 4 and the ground electrode 15. Therefore, the circuit module 1a The increase in the manufacturing cost of the circuit module 1a due to the multilayered wiring board 3 can be suppressed. Further, since the length of the wiring pattern can be shortened, transmission loss of an electric signal or the like caused by drawing the wiring pattern can be suppressed.

<Third Embodiment>
A circuit module according to a third embodiment of the present invention will be described with reference to FIG. FIG. 4 is a diagram showing a circuit module according to a third embodiment of the present invention.

  The circuit module 1b according to the third embodiment differs from the first embodiment described above in that the IC package 2a has a chip size package (CSP) structure as shown in FIG. 4 and the electronic components 4a and 4b, respectively. A wiring pattern 10 b for connecting the auxiliary wiring 8 and the auxiliary wiring 8 is formed inside the wiring board 3. In addition, since the other structure is the structure similar to above-described 1st Embodiment, description of the structure is abbreviate | omitted by attaching | subjecting the same code | symbol. At this time, a wiring pattern 10b for connecting each of the electronic components 4a and 4b and the auxiliary wiring 8 may be formed on the surface of the wiring board 3.

  In this case, the IC package 2a includes a package substrate 16, an integrated circuit element 5, and a sealing resin 17. The package substrate 16 on which the integrated circuit element 5 is mounted includes a plurality of pads 7 for external connection, The auxiliary wiring 8, the wiring pattern 18, and the post electrode 19 (or via hole conductor) that are not connected to the integrated circuit element 5 are formed, and the auxiliary wiring 8 and the integrated circuit element 5 respectively connect the wiring pattern 18 and the post electrode 19. And are electrically connected to a plurality of pads 7 for external connection.

  With this configuration, even in the circuit module 1b on which the IC package 2a having the CSP structure is mounted, a part of the wiring pattern 10b that connects the electronic components 4a and 4b formed on the wiring board 3 is integrated with the IC. Since the circuit module 1b can be formed on the package 2a side, the circuit module 1b can be reduced in size, and wiring patterns can be formed on the circuit module 1b with high density. Further, when the wiring board 3 has a multilayer structure, it is not necessary to increase the number of layers when forming a wiring pattern for connecting the electronic components 4a and 4b, so that the circuit module 1b can be reduced in height. In addition, it is possible to suppress an increase in manufacturing cost of the circuit module 1b due to the multilayered wiring board 3. Further, since the length of the wiring pattern can be shortened, transmission loss of an electric signal or the like caused by drawing the wiring pattern can be suppressed.

<Fourth embodiment>
A circuit module according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 5 is a diagram showing a circuit module according to a fourth embodiment of the present invention.

  The circuit module 1c according to the fourth embodiment differs from the first embodiment described above in that the IC package 2 is built in the wiring board 3 and the electronic components 4a and 4b are different from each other as shown in FIG. The wiring pattern 10 b to be connected is formed inside the wiring substrate 3, and the IC package 2 and the electronic components 4 a and 4 b are sealed with a resin 17. In addition, since the other structure is the structure similar to above-described 1st Embodiment, description of the structure is abbreviate | omitted by attaching | subjecting the same code | symbol.

  With this configuration, the wiring pattern 10b for connecting the electronic components 4a and 4b can be formed on the IC package 2 side, so that the same effect as in the first embodiment can be obtained. In particular, in the case of such an embodiment, since the number of wiring substrates stacked under the IC package 2 is reduced, the effect of reducing the height of the module is enhanced.

<Fifth Embodiment>
A circuit module according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 6 is a diagram showing a circuit module according to a fifth embodiment of the present invention.

  The circuit module 1d according to the fifth embodiment is different from the first embodiment described above in that vias provided in the wiring board 3 from the pads 7 of the IC package 2 connected to the auxiliary wiring 8 as shown in FIG. It is directly connected to one external electrode of the built-in electronic component 4 c embedded in the wiring board through the conductor 19 a and the other external electrode is connected to the ground electrode 15 of the wiring board 3. In addition, since the other structure is the structure similar to above-described 1st Embodiment, description of the structure is abbreviate | omitted by attaching | subjecting the same code | symbol.

  With this configuration, a wiring pattern for connecting the built-in electronic component 4c and other electronic components (not shown) can be formed on the IC package 2 side, which is the same as in the first embodiment. The effect of can be produced. Further, by incorporating the electronic component 4c in the wiring board 3, the circuit module 1d can be reduced in size.

  The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention.

  For example, in the inventions according to the first to fifth embodiments, the auxiliary wirings 8 are formed one by one in the rewiring layer 6, but a plurality of other pads 7 that are not connected to the integrated circuit element 5 are used. The auxiliary wiring 8 may be formed in the rewiring layer 6. By providing the plurality of auxiliary wirings 8 in this way, the wiring patterns of the circuit modules 1, 1a, 1b, 1c, 1d can be further densified.

  Further, the auxiliary wiring 8 formed in the rewiring layer 6 of the IC package 2 may be formed in a meander shape as shown in FIG. Further, as shown in FIG. 7B, the inductor 20 may be provided by forming the auxiliary wiring 8 in a spiral shape. By doing in this way, it becomes unnecessary to mount the chip inductor conventionally mounted on the wiring board 3, and the circuit modules 1, 1a, 1b, 1c, and 1d can be downsized. In addition, since these inductors 20 are patterned with high precision on the rewiring layer 6 formed of polyimide or the like by using a photolithography technique, the inductors 20 are higher in comparison with the case where the inductors 20 are formed on the wiring board 3. The inductor 20 can be formed with high accuracy.

  Further, as shown in FIG. 8 (a), a portion of the auxiliary wiring 8 formed in the rewiring layer 6 of the IC package 2 is cut off in the vicinity, and the wiring interval is optimized, whereby the rewiring layer 6 has a capacitor. 21 may be formed. With this configuration, it is not necessary to mount a chip capacitor that has been conventionally mounted on the wiring board 3, and the circuit modules 1, 1a, 1b, 1c, and 1d can be downsized. In addition, since the capacitor 21 is patterned with high accuracy on the rewiring layer 6 formed of polyimide or the like using a photolithography technique, the capacitor 21 has higher accuracy than the case where the capacitor 21 is formed on the wiring substrate 3. Capacitor 21 can be formed.

  Further, as shown in FIG. 8B, the auxiliary wiring 8 may be formed in a comb structure (IDT structure). By doing so, the area of the opposing electrode can be increased, and the capacitor 21 having a large capacity can be formed in the rewiring layer 6 with high accuracy.

  Further, as shown in FIG. 8C, the auxiliary wiring 8 may be multilayered like an electrode-insulator-electrode structure to form the capacitor 21. By doing in this way, compared with the case where the capacitor 21 is formed on a plane, the capacitor 21 having a large capacity in the redistribution layer 6 can be formed with high accuracy.

DESCRIPTION OF SYMBOLS 1 Circuit module 2 IC package 3 Wiring board 4, 4a, 4b Electronic component 5 Integrated circuit element 6 Rewiring layer 7 Pad 8 Auxiliary wiring 10, 10a, 10b Wiring pattern 11a Land electrode (land electrode for IC package)
20 Inductor 21 Capacitor

Claims (4)

An IC package having an integrated circuit element; and a wiring board on which the IC package is mounted. A plurality of pads are formed on a surface of the IC package, and the integrated circuit element is a part of the plurality of pads. In the circuit module connected to the plurality of land electrodes of the wiring board via
The IC package includes a rewiring layer formed on an active surface side of the integrated circuit element,
The plurality of pads are formed on a surface of the redistribution layer,
The rewiring layer is formed of resin, and an auxiliary wiring not connected to the integrated circuit element is provided inside,
At least two pads that are not connected to the integrated circuit element among the plurality of pads are connected via the columnar conductor provided in the rewiring layer and the auxiliary wiring, and provided on the wiring board. A circuit module, wherein a plurality of wiring patterns are connected to the at least two pads via the auxiliary wiring.   The auxiliary wiring is provided so as to connect the at least two pads which are respectively arranged on opposite sides of the IC package and are not connected to the integrated circuit element. The circuit module as described.   The circuit module according to claim 1, wherein an inductor is provided in the auxiliary wiring.   4. The circuit module according to claim 1, wherein a capacitor is provided in the auxiliary wiring.

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