CN206301969U - Usb interface module attachment structure and carrier arrangement - Google Patents
Usb interface module attachment structure and carrier arrangement Download PDFInfo
- Publication number
- CN206301969U CN206301969U CN201621396920.0U CN201621396920U CN206301969U CN 206301969 U CN206301969 U CN 206301969U CN 201621396920 U CN201621396920 U CN 201621396920U CN 206301969 U CN206301969 U CN 206301969U
- Authority
- CN
- China
- Prior art keywords
- polyviyl
- rigid
- usb interface
- circuit
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
The utility model provides a kind of usb interface module attachment structure and carrier arrangement, is related to USB interface field.The usb interface module attachment structure includes USB interface seat, the first rigid polyviyl circuit plate, flexible PCB and rigid polyviyl circuit mainboard.USB interface seat is arranged on the first rigid polyviyl circuit plate, and the first rigid polyviyl circuit plate is connected by flexible PCB with rigid polyviyl circuit mainboard.The carrier arrangement employs above-mentioned usb interface module attachment structure.The usb interface module attachment structure and carrier arrangement that the utility model is provided replace existing cable using flexible PCB, to realize the connection between the first rigid polyviyl circuit plate and rigid polyviyl circuit mainboard, can effectively ensure that usb signal laser propagation effect and preferable EMC performances, and configuration structure can be made simpler clean and tidy, improve production technology level, connect simple and reliable, low cost.
Description
Technical field
The utility model is related to USB interface field, in particular to a kind of usb interface module attachment structure and application
The carrier arrangement of the usb interface module attachment structure.
Background technology
USB interface seat can be present on independent platelet under normal circumstances, and now this USB platelets can be connected to by cable
On other one block of plate, USB functions and performance can be caused to be affected using general connection cables, and then influence whether system
EMC problems, and configuration in system is scattered.
Utility model content
The purpose of this utility model is to provide a kind of usb interface module attachment structure, and it ensure that usb signal is transmitted
Effect and preferable EMC performances, and configuration structure can be made simpler.
Another object of the present utility model is to provide a kind of carrier arrangement, its ensure that usb signal laser propagation effect and
Preferable EMC performances, and configuration structure can be made simpler.
What embodiment of the present utility model was realized in：
A kind of usb interface module attachment structure, including USB interface seat, the first rigid polyviyl circuit plate, flexible PCB and hard
Printed circuit mainboard, the USB interface seat is arranged on the first rigid polyviyl circuit plate, and the first rigid polyviyl circuit plate leads to
The flexible PCB is crossed to be connected with the rigid polyviyl circuit mainboard.
Further, in the utility model preferred embodiment, the usb interface module attachment structure also includes connection
Plate, the flexible PCB is connected by the connecting plate with the rigid polyviyl circuit mainboard.
Further, in the utility model preferred embodiment, the connecting plate is the second rigid polyviyl circuit plate, described
Flexible PCB is connected by the second rigid polyviyl circuit plate with the rigid polyviyl circuit mainboard.
Further, in the utility model preferred embodiment, the second rigid polyviyl circuit plate passes through stamp eyelet welding
It is connected to the rigid polyviyl circuit mainboard.
Further, in the utility model preferred embodiment, the second rigid polyviyl circuit plate is provided with multiple the
One half bore, the rigid polyviyl circuit mainboard is provided with multiple second half bore, multiple first half bore and multiple described the second half
Hole corresponds and combines to form the stamp hole.
Further, in the utility model preferred embodiment, the usb interface module attachment structure also includes connection
Device, the second rigid polyviyl circuit plate is plugged on the rigid polyviyl circuit mainboard by the connector.
Further, in the utility model preferred embodiment, the first rigid polyviyl circuit plate includes multiple first
Plate, first plate stacks gradually arrangement, and the flexible PCB is clamped between the first plate described in per adjacent two layers.
Further, in the utility model preferred embodiment, the second rigid polyviyl circuit plate includes multiple second
Plate, second plate stacks gradually arrangement, and the flexible PCB is clamped between the second plate described in per two-layer.
Further, in the utility model preferred embodiment, the connecting plate is flexible PCB.
A kind of carrier arrangement, including shell body and usb interface module attachment structure, the usb interface module attachment structure
Including USB interface seat, the first rigid polyviyl circuit plate, flexible PCB and rigid polyviyl circuit mainboard, the USB interface seat is arranged on
On the first rigid polyviyl circuit plate, the first rigid polyviyl circuit plate passes through the flexible PCB and the rigid polyviyl circuit
Mainboard is connected, and the first rigid polyviyl circuit plate is installed on the shell body.
The usb interface module attachment structure of the utility model embodiment offer and the beneficial effect of carrier arrangement are：Using
Flexible PCB replaces existing cable to realize the connection between the first rigid polyviyl circuit plate and rigid polyviyl circuit mainboard, energy
The usb signal transmission distortion problem occurred in USB switching processes is enough effectively improved, improves the EMC problems of system, it is ensured that USB believes
Number laser propagation effect and preferable EMC performances, and configuration structure can be made simpler clean and tidy, improve production technology water
It is flat, connect simple and reliable, low cost.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme of the utility model embodiment, below will be to be used needed for embodiment
Accompanying drawing be briefly described, it will be appreciated that the following drawings illustrate only some embodiments of the present utility model, therefore should not be by
Regard the restriction to scope as, for those of ordinary skill in the art, on the premise of not paying creative work, may be used also
Other related accompanying drawings are obtained with according to these accompanying drawings.
The structural representation of the usb interface module attachment structure that Fig. 1 is provided for the utility model first embodiment；
Fig. 2 is the cutting structural representation of the first rigid polyviyl circuit plate in Fig. 1 and the connecting portion of flexible PCB；
Fig. 3 is the structural representation of the flexible PCB of the usb interface module attachment structure in Fig. 1；
Fig. 4 is the structural representation of the kink of the flexible PCB of the usb interface module attachment structure in Fig. 1；
Fig. 5 is the cutting structural representation of the second rigid polyviyl circuit plate in Fig. 1 and the connecting portion of flexible PCB；
Fig. 6 is the structural representation of the second rigid polyviyl circuit plate of the usb interface module attachment structure in Fig. 1；
Fig. 7 is the structural representation of the rigid polyviyl circuit mainboard of the usb interface module attachment structure in Fig. 1；
The structural representation of the usb interface module attachment structure that Fig. 8 is provided for the utility model second embodiment.
Icon：10-USB interface module attachment structures；100- the first rigid polyviyl circuit plates；The plates of 110- first；130-USB connects
Mouth seat；150- fixed hole positions；200- flexible PCBs；210- top plates；220- mesosphere boards；230- lower plywoods；240- rolls
Copper Foil；250- gums；260- insulating substrates；270- diaphragms；280- kinks；300- the second rigid polyviyl circuit plates；310-
Two plates；The half bore of 330- first；400- rigid polyviyl circuit mainboards；The half bore of 410- second；500- stamp holes.
Specific embodiment
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer
Accompanying drawing in type embodiment, is clearly and completely described, it is clear that retouched to the technical scheme in the utility model embodiment
The embodiment stated is a part of embodiment of the utility model, rather than whole embodiments.Generally described in accompanying drawing herein and
The component of the utility model embodiment for showing can be arranged and designed with a variety of configurations.
Therefore, the detailed description of embodiment of the present utility model below to providing in the accompanying drawings is not intended to limit requirement
The scope of the present utility model of protection, but it is merely representative of selected embodiment of the present utility model.Based in the utility model
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all
Belong to the scope of the utility model protection.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined in individual accompanying drawing, then it need not be further defined and explained in subsequent accompanying drawing.
In description of the present utility model, it is to be understood that term " on ", the orientation of the instruction such as D score or position relationship
It is or the orientation or position that the utility model product is usually put when using based on orientation shown in the drawings or position relationship
Relation, or the usual orientation for understanding of those skilled in the art or position relationship, are for only for ease of description the utility model
Described with simplified, must be with specific orientation, with specific orientation structure rather than the equipment or element for indicating or imply meaning
Make and operate, therefore it is not intended that to limitation of the present utility model.
Additionally, term " first ", " second " etc. are only used for distinguishing description, and it is not intended that indicating or implying relatively important
Property.
In description of the present utility model, in addition it is also necessary to explanation, unless otherwise clearly defined and limited, term " sets
Put ", " connection " should be interpreted broadly, for example, it may be being fixedly connected, or being detachably connected, or be integrally connected；Can
Being to mechanically connect, or electrically connect；Can be joined directly together, it is also possible to be indirectly connected to by intermediary, Ke Yishi
Two connections of element internal.For the ordinary skill in the art, with concrete condition above-mentioned term can be understood at this
Concrete meaning in utility model.
First embodiment
Fig. 1 is referred to, a kind of carrier arrangement is present embodiments provided（It is not shown）, the carrier arrangement include shell body（Figure
Do not show）With usb interface module attachment structure 10.The usb interface module attachment structure 10 is installed on shell body.The carrier arrangement by
In this usb interface module attachment structure 10 is employed, usb signal laser propagation effect and preferable EMC performances are ensure that, and
Configuration structure can be made simpler.The carrier arrangement can be unmanned plane, picture pick-up device etc., as long as USB can be realized
The equipment of switching.
The usb interface module attachment structure 10 includes USB interface seat（It is not shown）, it is the first rigid polyviyl circuit plate 100, flexible
Circuit board 200, the second rigid polyviyl circuit plate 300 and rigid polyviyl circuit mainboard 400.First rigid polyviyl circuit plate 100 is installed on outer
Housing, it can be fixed on shell body by screw or other modes.In the present embodiment, USB interface seat is arranged on first
On rigid polyviyl circuit plate 100.First rigid polyviyl circuit plate 100 is connected by flexible PCB 200 with the second rigid polyviyl circuit plate 300
Connect, the second rigid polyviyl circuit plate 300 is connected with rigid polyviyl circuit mainboard 400.Thus, the second rigid polyviyl circuit plate 300 and embossing seal
Plate is formed between circuit main board processed 400 to the connected mode of plate, preferable usb signal transmission quality is ensure that.
Wherein, the second rigid polyviyl circuit plate 300 can use various connection sides with the connection of rigid polyviyl circuit mainboard 400
Formula, to realize connected mode of the plate to plate.In the present embodiment, the second rigid polyviyl circuit plate 300 is welded in firmly by stamp hole 500
Printed circuit mainboard 400.It is consequently formed postal of the plate to plate between the second rigid polyviyl circuit plate 300 and rigid polyviyl circuit mainboard 400
The connected mode of ticket hole 500, both can guarantee that the integrality and preferable EMC performances of signal, can make connection simple and reliable again, cost
It is low.
It should be noted that in the present embodiment, the second rigid polyviyl circuit plate 300 is straight using the welding manner of stamp hole 500
Connect and be welded on rigid polyviyl circuit mainboard 400, it would however also be possible to employ other connected modes.In other embodiment of the present utility model
In, the usb interface module attachment structure 10 can also include connector, and the second rigid polyviyl circuit plate 300 is inserted by connector
In on rigid polyviyl circuit mainboard 400, without by the way of the connection of stamp hole 500.
It should be appreciated that the first rigid polyviyl circuit plate 100, the second rigid polyviyl circuit plate 300 mentioned in the present embodiment and
Rigid polyviyl circuit mainboard 400 is hardboard, and flexible PCB 200 is soft board, and comparatively " hard " and " soft " herein be.
So, the usb interface module attachment structure 10 of Rigid Flex is formed.
In addition, it is necessary to explanation, in other embodiment of the present utility model, it is also possible to cancel the second embossing seal system that sets
Circuit board 300, is connected by flexible PCB 200 by the first rigid polyviyl circuit plate 100 with rigid polyviyl circuit mainboard 400.So
Connected mode of the line between flexible PCB 200 and rigid polyviyl circuit mainboard 400 to plate can be formed, can equally complete whole
Signal communication link.
Fig. 2 is referred to, the first rigid polyviyl circuit plate 100 is connected with flexible PCB 200.In the present embodiment, the first embossing seal
Circuit board processed 100 includes multiple first plates 110, and the first plate 110 stacks gradually arrangement, is clamped with per between the first plate of two-layer 110
Flexible PCB 200.
It should be appreciated that the first rigid polyviyl circuit plate 100 can be using two-layer, four layers, six layers or even more layers, each layer
One the first plate 110, so the quantity of the first plate 110 and being not specifically limited.It is flexible per being clamped between the first plate of two-layer 110
Circuit board 200 refers to, is one group per different the first plates of two-layer 110, and every group is clamped with one layer of flexible PCB 200.For example, such as
Really the first rigid polyviyl circuit plate 100 is two-layer, then one layer of flexible PCB 200 is clamped between the first plate of two-layer 110；If first
Rigid polyviyl circuit plate 100 is four layers, then ground floor and the second layer are one group, and third layer and the 4th layer are one group, ground floor and the
One layer of flexible PCB 200 is clamped between two layers, one layer of flexible PCB 200 is clamped between third layer and the 4th layer, then soft
Property circuit board 200 be two-layer.In the present embodiment, the first plate 110 is preferably six layers.
In addition, can have various, this reality per the mode of being clamped and connected between the first plate of two-layer 110 and flexible PCB 200
Apply example to use, one layer of flexible PCB 200 is embedded between the first plate of every two-layer 110, and the first plate of two-layer 110 is pressed
Flexible PCB 200, so that flexible PCB 200 is sandwiched in therebetween.
Flexible PCB 200 is used to connect the first rigid polyviyl circuit plate 100 and the second rigid polyviyl circuit plate 300, Huo Zhelian
Connect the first rigid polyviyl circuit plate 100 and rigid polyviyl circuit mainboard 400.Flexible PCB 200 can be one layer, two-layer, three layers or
Person's more layers, the quantity of flexible PCB 200 is simultaneously not specifically limited.
In the application one embodiment, flexible PCB 200 be three layers, respectively top plate 210, mesosphere board 220 and
Lower plywood 230.Top plate 210, mesosphere board 220 and lower plywood 230 stack gradually arrangement, top plate 210, mesosphere board 220
And one end of lower plywood 230 is held between every adjacent two layers of multiple first plates 110 successively respectively, the other end and the second embossing seal
Circuit board processed 300 is connected.It should be appreciated that flexible PCB 200 is three layers, the first rigid polyviyl circuit plate 100 is six layers, six layers the
One layer of flexible PCB 200 is clamped between every adjacent two layers of one plate 110.In such manner, it is possible to the first rigid polyviyl circuit plate will be connected
100 and second the signal of rigid polyviyl circuit plate 300 be wrapped in the mesosphere board 220 of flexible PCB 200, and top plate 210 and
Lower plywood 230 does whole floor file treatment, can so play more preferable signal shielding effect, and signal integrity is optimal.
In addition, every layer of concrete structure of flexible PCB 200 can be with identical, it is also possible to different.Refer to Fig. 3, this implementation
In example, every layer of structure of flexible PCB 200 is identical, and it includes rolled copper foil 240, gum 250, insulating substrate 260 and protection
Film 270.Rolled copper foil 240, gum 250, insulating substrate 260 and diaphragm 270 are stacked gradually and pressed.
It should be noted that in embodiment of the present utility model, referring to Fig. 4, flexible PCB 200 can have curved
Folding part 280.That is, flexible PCB 200 can bend according to structure, adapter structure is more flexible.
Fig. 5 is referred to, the second rigid polyviyl circuit plate 300 is used to connect flexible PCB 200 and rigid polyviyl circuit mainboard
400, to realize the connected mode of plate and plate.In the present embodiment, the second rigid polyviyl circuit plate 300 includes multiple second plates 310, the
Two plates 310 stack gradually arrangement, and flexible PCB 200 is clamped with per between the second plate of two-layer 310.
It should be appreciated that the second rigid polyviyl circuit plate 300 is similar with the first rigid polyviyl circuit plate 100, the second rigid polyviyl circuit
Plate 300 can be using two-layer, four layers, six layers or even more layers, and each layer is second plate 310, so the number of the second plate 310
Measure and be not specifically limited.Refer to per flexible PCB 200 is clamped between the second plate of two-layer 310, per different two-layers second
Plate 310 is one group, and every group is clamped with one layer of flexible PCB 200.For example, if the second rigid polyviyl circuit plate 300 is two-layer,
One layer of flexible PCB 200 is clamped between the second plate of two-layer 310；If the second rigid polyviyl circuit plate 300 is four layers, ground floor
It is one group with the second layer, third layer and the 4th layer are one group, one layer of flexible PCB 200 is clamped between ground floor and the second layer,
One layer of flexible PCB 200 is clamped between third layer and the 4th layer, then flexible PCB 200 is two-layer.In the present embodiment, the
Two rigid polyviyl circuit plates 300 are six layers.And flexible PCB 200 is three layers, top plate 210, mesosphere board 220 and lower plywood
230 are held between the adjacent two layers of multiple second plates 310 successively respectively away from one end of the first rigid polyviyl circuit plate 100, with
The signal for connecting the first rigid polyviyl circuit plate 100 and the second rigid polyviyl circuit plate 300 is wrapped in the centre of flexible PCB 200
Laminate 220.
In addition, can have various, this reality per the mode of being clamped and connected between the second plate of two-layer 310 and flexible PCB 200
Apply example to use, one layer of flexible PCB 200 is embedded between the second plate of every two-layer 310, and the second plate of two-layer 310 is pressed
Flexible PCB 200, so that flexible PCB 200 is sandwiched in therebetween.
It should be noted that the second rigid polyviyl circuit plate 300 can also use flexible PCB, that is to say, that use other
Flexible PCB replace the second rigid polyviyl circuit plate 300, and be connected with above-mentioned flexible PCB 200, so, it is also possible to think
It is to eliminate the second rigid polyviyl circuit plate 300, and flexible PCB 200 is extended, is connected with rigid polyviyl circuit mainboard 400.
Above-mentioned the second rigid polyviyl circuit plate 300 and may be collectively referred to as connecting instead of the flexible PCB of the second rigid polyviyl circuit plate 300
Fishplate bar.Certainly, connecting plate can also use other attachment structures.
Fig. 6 is referred to, wherein, the second rigid polyviyl circuit plate 300 is provided with multiple first half bore 330, multiple first half bore
330 are intervally arranged successively.First half bore 330 is used to combine to form stamp hole with the counter structure on rigid polyviyl circuit mainboard 400
500.The shape of the first half bore 330 can be semicircle, half elliptic, zigzag, rectangle etc..
Fig. 7 is referred to, rigid polyviyl circuit mainboard 400 is for any number of plies and with the circuit board of USB functions.The present embodiment
In, rigid polyviyl circuit mainboard 400 is provided with multiple second half bore 410, and multiple second half bore 410 are intervally arranged successively.Multiple the
One half bore 330 corresponds and combines to form stamp hole 500 with multiple second half bore 410.Likewise, the shape of the second half bore 410
Shape can be semicircle, half elliptic, zigzag, rectangle etc..So, 410 groups of multiple first half bore 330 and multiple second half bore
It can be the shapes such as circle, ellipse, rhombus, rectangle to close the stamp hole 500 for being formed, and the shape of stamp hole 500 is not made specifically
Limitation.
In sum, the usb interface module attachment structure 10 and carrier arrangement of the present embodiment offer are due to using flexible electrical
Road plate 200 replaces existing cable to realize the connection between the first rigid polyviyl circuit plate 100 and rigid polyviyl circuit mainboard 400,
The usb signal transmission distortion problem occurred in USB switching processes can be effectively improved, improves the EMC problems of system, it is ensured that USB
Signal transmission effect and preferable EMC performances, and configuration structure can be made simpler clean and tidy, improve production technology water
It is flat.Also, the present embodiment is by setting the second rigid polyviyl circuit plate 300, using plate and the connected mode of stamp hole 500 of plate, enter
One step ensures the integrality and preferable EMC performances of signal, can make connection simple and reliable again, low cost.
Second embodiment
Fig. 8 is referred to, another carrier arrangement is present embodiments provided, its basic structure, operation principle and technique effect
Essentially identical with the carrier arrangement that first embodiment is provided, the content of the present embodiment not specified (NS) refers to first embodiment.This
The difference of carrier arrangement that the carrier arrangement that embodiment is provided is provided with first embodiment is, usb interface module attachment structure
10 the first rigid polyviyl circuit plate 100 and the structure of the second rigid polyviyl circuit plate 300 are different.
In the present embodiment, the first rigid polyviyl circuit plate 100 is connected with one end of flexible PCB 200, flexible PCB 200
The other end be connected with the second rigid polyviyl circuit plate 300, the second rigid polyviyl circuit plate 300 is connected with rigid polyviyl circuit mainboard 400.
Wherein, the first rigid polyviyl circuit plate 100 is provided with USB interface seat 130, USB interface seat 130 and flexible PCB
200 connections.Multiple fixed hole positions 150 are provided with first rigid polyviyl circuit plate 100, are connected for the shell body with carrier arrangement
Connect, the position of fixed hole position 150 can arbitrarily adjust, and be adapted to with shell body.Certainly, the first rigid polyviyl circuit plate 100 can also
Other attachment structures are set to be connected with shell body.
Second rigid polyviyl circuit plate 300 is substantially t-shaped, and its free end is provided with multiple the first half bore being intervally arranged successively
330, and two shoulders of its T-shaped are also equipped with multiple the first half bore 330 being intervally arranged successively near the side of free end.
Multiple second half bore 410 combination corresponding with rigid polyviyl circuit mainboard 400 of multiple first half bore 330 forms stamp hole 500.
So, stamp hole 500 weld side of the plate to plate is employed between the second rigid polyviyl circuit plate 300 and rigid polyviyl circuit mainboard 400
Formula, this connected mode both can guarantee that the integrality and preferable EMC performances of signal, can make connection simple and reliable again, low cost.
Preferred embodiment of the present utility model is the foregoing is only, the utility model is not limited to, for this
For the technical staff in field, the utility model can have various modifications and variations.It is all it is of the present utility model spirit and principle
Within, any modification, equivalent substitution and improvements made etc. should be included within protection domain of the present utility model.
Claims (10)
1. a kind of usb interface module attachment structure, including USB interface seat, the first rigid polyviyl circuit plate and rigid polyviyl circuit mainboard,
Characterized in that, also including flexible PCB, USB interface seat is arranged on the first rigid polyviyl circuit plate, described the
One rigid polyviyl circuit plate is connected by the flexible PCB with the rigid polyviyl circuit mainboard.
2. usb interface module attachment structure according to claim 1, it is characterised in that the usb interface module connection knot
Structure also includes connecting plate, and the flexible PCB is connected by the connecting plate with the rigid polyviyl circuit mainboard.
3. usb interface module attachment structure according to claim 2, it is characterised in that the connecting plate is the second embossing seal
Circuit board processed, the flexible PCB is connected by the second rigid polyviyl circuit plate with the rigid polyviyl circuit mainboard.
4. usb interface module attachment structure according to claim 3, it is characterised in that the second rigid polyviyl circuit plate
The rigid polyviyl circuit mainboard is welded in by stamp hole.
5. usb interface module attachment structure according to claim 4, it is characterised in that the second rigid polyviyl circuit plate
Be provided with multiple first half bore, the rigid polyviyl circuit mainboard is provided with multiple second half bore, multiple first half bore with it is many
Individual second half bore corresponds and combines to form the stamp hole.
6. usb interface module attachment structure according to claim 3, it is characterised in that the usb interface module connection knot
Structure also includes connector, and the second rigid polyviyl circuit plate is plugged on the rigid polyviyl circuit mainboard by the connector.
7. the usb interface module attachment structure according to claim any one of 3-6, it is characterised in that first embossing seal
Circuit board processed includes multiple first plates, and first plate stacks gradually arrangement, is clamped between the first plate described in per adjacent two layers
The flexible PCB.
8. usb interface module attachment structure according to claim 7, it is characterised in that the second rigid polyviyl circuit plate
Including multiple second plates, second plate stacks gradually arrangement, and the flexible circuit is clamped between the second plate described in per two-layer
Plate.
9. usb interface module attachment structure according to claim 2, it is characterised in that the connecting plate is flexible circuit
Plate.
10. a kind of carrier arrangement, including shell body, it is characterised in that the carrier arrangement is also included as claim 1-9 is any
Usb interface module attachment structure described in, the first rigid polyviyl circuit plate is installed on the shell body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621396920.0U CN206301969U (en) | 2016-12-19 | 2016-12-19 | Usb interface module attachment structure and carrier arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621396920.0U CN206301969U (en) | 2016-12-19 | 2016-12-19 | Usb interface module attachment structure and carrier arrangement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206301969U true CN206301969U (en) | 2017-07-04 |
Family
ID=59214455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621396920.0U Active CN206301969U (en) | 2016-12-19 | 2016-12-19 | Usb interface module attachment structure and carrier arrangement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206301969U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708295A (en) * | 2017-11-17 | 2018-02-16 | 珠海市魅族科技有限公司 | Printed circuit board assembly and terminal device |
| CN113411950A (en) * | 2021-05-11 | 2021-09-17 | 深圳市景旺电子股份有限公司 | Circuit board and manufacturing method thereof |
| CN114336112A (en) * | 2021-12-10 | 2022-04-12 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
-
2016
- 2016-12-19 CN CN201621396920.0U patent/CN206301969U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708295A (en) * | 2017-11-17 | 2018-02-16 | 珠海市魅族科技有限公司 | Printed circuit board assembly and terminal device |
| CN113411950A (en) * | 2021-05-11 | 2021-09-17 | 深圳市景旺电子股份有限公司 | Circuit board and manufacturing method thereof |
| CN113411950B (en) * | 2021-05-11 | 2023-02-17 | 深圳市景旺电子股份有限公司 | Circuit board and manufacturing method thereof |
| CN114336112A (en) * | 2021-12-10 | 2022-04-12 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
| CN114336112B (en) * | 2021-12-10 | 2023-10-03 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206301969U (en) | Usb interface module attachment structure and carrier arrangement | |
| CN103841752B (en) | Welding structure of flexible circuit board and connector | |
| CN105792516B (en) | Rigid Flex and mobile terminal | |
| CN104902678B (en) | Flexible printed circuit board and preparation method thereof | |
| CN109068478B (en) | Flexible circuit board and display device | |
| TWI434278B (en) | Device and method for protecting the pins of an electronic component | |
| CN106028643B (en) | The production method of flexible mainboard, flexible display device and flexible mainboard | |
| US20140273552A1 (en) | Interconnect architecture with stacked flex cable | |
| CN201234406Y (en) | Flexible printed circuit board | |
| JPWO2019131288A1 (en) | Transmission line equipment | |
| JPH01251787A (en) | Connecting device for electronic parts | |
| TW497230B (en) | Tape carrier package and an LCD module using the same | |
| CN105578749B (en) | Circuit board connection component and mobile terminal | |
| WO2013166742A1 (en) | Liquid crystal display module and liquid crystal display device | |
| CN105636338B (en) | Flexible PCB Wiring structure and mobile terminal | |
| TWI533766B (en) | Flexible circuit assemblies with stacked flex interconnects and connector assemblies having the same | |
| JP2020167427A (en) | Multilayer substrate and electronic device | |
| CN106604540A (en) | Circuit board | |
| CN211457497U (en) | Flexible circuit board and electronic equipment | |
| JPS62120097A (en) | Flexible circuit structure and electrical connection assembly which connects the structure with other circuit means mutually | |
| CN209089278U (en) | The connection structure of circuit board and conducting wire | |
| CN206294418U (en) | A kind of single-plate component and electronic equipment | |
| CN201893139U (en) | Ffc | |
| CN217158699U (en) | Connection structure of flexible circuit board and mainboard and electronic equipment | |
| JPH11177198A (en) | Flexible wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: USB interface module connection structure and carrier device Effective date of registration: 20180102 Granted publication date: 20170704 Pledgee: XinDa national equity investment fund (Shanghai) partnership (L.P.) Pledgor: ZEROTECH (BEIJING) INTELLIGENCE TECHNOLOGY Co.,Ltd.|CHONGQING ZERO INTELLIGENT CONTROL TECHNOLOGY CO.,LTD. Registration number: 2017990001217 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20221008 Granted publication date: 20170704 Pledgee: XinDa national equity investment fund (Shanghai) partnership (L.P.) Pledgor: CHONGQING ZERO INTELLIGENT CONTROL TECHNOLOGY CO.,LTD. Registration number: 2017990001217 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |