CN202738252U - Double-faced flexible circuit board with asymmetric copper thicknesses on two faces - Google Patents

Double-faced flexible circuit board with asymmetric copper thicknesses on two faces Download PDF

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Publication number
CN202738252U
CN202738252U CN2012203777102U CN201220377710U CN202738252U CN 202738252 U CN202738252 U CN 202738252U CN 2012203777102 U CN2012203777102 U CN 2012203777102U CN 201220377710 U CN201220377710 U CN 201220377710U CN 202738252 U CN202738252 U CN 202738252U
Authority
CN
China
Prior art keywords
base material
double
polyimide
circuit board
copper layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012203777102U
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Chinese (zh)
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHANGHAI FPC ELECTRONIC CO Ltd
Original Assignee
SHANGHAI FPC ELECTRONIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHANGHAI FPC ELECTRONIC CO Ltd filed Critical SHANGHAI FPC ELECTRONIC CO Ltd
Priority to CN2012203777102U priority Critical patent/CN202738252U/en
Application granted granted Critical
Publication of CN202738252U publication Critical patent/CN202738252U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

A double-faced flexible circuit board with asymmetric copper thicknesses on two faces relates to the technical field of printed circuits. The double-faced flexible circuit board comprises a first polyimide cover film, a polyimide base material and a second polyimide cover film. The first polyimide cover film is adhered to the upper surface of the polyimide base material through an epoxy glue; the second polyimide cover film is adhered to the lower surface of the polyimide base material through the epoxy glue; and the upper surface of the polyimide base material is pressed with a first pure copper layer, the lower surface of the polyimide base material is pressed with a second pure copper layer, and the first pure copper layer is thicker than the second pure copper layer. The double-faced flexible circuit board is used to gather different applications on the same piece of product and can meet requirements of a user for different thicknesses on the same piece of product.

Description

The thick asymmetric double-faced flexible wiring board of a kind of two sides copper
Technical field
The utility model relates to the printed circuit technique field, is specifically related to the thick asymmetric double-faced flexible wiring board of a kind of two sides copper.
Background technology
Flexible PCB is that make take polyimides or polyester film as base material a kind of has height reliability, excellent flexual printed circuit board (PCB), the main use in a lot of products such as mobile phone, notebook computer, digital camera.Double-faced flexible wiring board product positive and negative circuit general in the prior art all is same thickness.But in some special application, the client needs the positive and negative circuit that different thickness is arranged.
Summary of the invention
The purpose of this utility model provides the thick asymmetric double-faced flexible wiring board of a kind of two sides copper, and it can be used in different application is collected in the same flake products, and can satisfy the client on the same flake products to the demand of different-thickness.
In order to solve the existing problem of background technology, the utility model is by the following technical solutions: it comprises the first polyimides coverlay 1, polyimide base material 2, the second polyimides coverlay 3; The first polyimides coverlay 1 is bonded in the upper surface of polyimide base material 2 by epoxy glue 4, and the second polyimides coverlay 3 is bonded in the lower surface of polyimide base material 2 by epoxy glue 4.
The upper surface pressing of described polyimide base material 2 has the first pure copper layer 5, and the lower surface pressing has the second pure copper layer 6.
Described the first pure copper layer 5 thickness are greater than the second pure copper layer 6.
The utlity model has following beneficial effect: can be used in different application is collected in the same flake products, and can satisfy the client on the same flake products to the demand of different-thickness.
Description of drawings:
Fig. 1 is structural representation of the present utility model.
Embodiment:
Referring to Fig. 1, this embodiment by the following technical solutions: it comprises the first polyimides coverlay 1, polyimide base material 2, the second polyimides coverlay 3; The first polyimides coverlay 1 is bonded in the upper surface of polyimide base material 2 by epoxy glue 4, and the second polyimides coverlay 3 is bonded in the lower surface of polyimide base material 2 by epoxy glue 4.
The upper surface pressing of described polyimide base material 2 has the first pure copper layer 5, and the lower surface pressing has the second pure copper layer 6.
Described the first pure copper layer 5 thickness are greater than the second pure copper layer 6.
This embodiment is aspect production technology, and is different from general double sided board, when producing a Copper Foil thickeied by copper plating process, and an other Copper Foil is not thickeied when electroplating via.
This embodiment can be used in different application is collected in the same flake products, and can satisfy the client on the same flake products to the demand of different-thickness.

Claims (2)

1. the thick asymmetric double-faced flexible wiring board of two sides copper is characterized in that it comprises the first polyimides coverlay (1), polyimide base material (2), the second polyimides coverlay (3); The first polyimides coverlay (1) is bonded in the upper surface of polyimide base material (2) by epoxy glue (4), and the second polyimides coverlay (3) is bonded in the lower surface of polyimide base material (2) by epoxy glue (4).
2. the thick asymmetric double-faced flexible wiring board of a kind of two sides copper according to claim 1 is characterized in that the upper surface pressing of described polyimide base material (2) has the first pure copper layer (5), and the lower surface pressing has the second pure copper layer (6).
CN2012203777102U 2012-08-01 2012-08-01 Double-faced flexible circuit board with asymmetric copper thicknesses on two faces Expired - Fee Related CN202738252U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012203777102U CN202738252U (en) 2012-08-01 2012-08-01 Double-faced flexible circuit board with asymmetric copper thicknesses on two faces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012203777102U CN202738252U (en) 2012-08-01 2012-08-01 Double-faced flexible circuit board with asymmetric copper thicknesses on two faces

Publications (1)

Publication Number Publication Date
CN202738252U true CN202738252U (en) 2013-02-13

Family

ID=47663898

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012203777102U Expired - Fee Related CN202738252U (en) 2012-08-01 2012-08-01 Double-faced flexible circuit board with asymmetric copper thicknesses on two faces

Country Status (1)

Country Link
CN (1) CN202738252U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104254196A (en) * 2014-09-19 2014-12-31 江西景旺精密电路有限公司 Asymmetric copper thickness double-sided aluminum substrate and processing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104254196A (en) * 2014-09-19 2014-12-31 江西景旺精密电路有限公司 Asymmetric copper thickness double-sided aluminum substrate and processing method thereof

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130213

Termination date: 20160801