201121405 六、發明說明： 【發明所屬之技術領域】 本發明係有關貼附於撓性印刷配線板（Flexible printed circuit)等之電磁波遮蔽性薄膜、以及具備電磁 波遮蔽性薄膜之配線板。 【先前技術】 從以往至今，電磁波遮蔽性薄膜係使用於撓性印刷配 線板（以下亦稱為FPC)。此等電磁波遮蔽性薄膜中，就用 以表現電磁波遮蔽性之導電性填料而言，係使用銀粉或銅 粉。然而，相較於薄膜中所使用之樹脂或其他原料，銀粉 之價格係較高價，故期望儘可能以較少量來表現電磁波遮 蔽性。 此外，由於近年之撓性印刷配線板在電子機器之狹小 空間中以彎曲方式使用之情形增加，故期望獲得彎曲性優 良之電磁波遮蔽性薄膜。 另一方面，至今為止之電磁波遮蔽性薄膜（參照專利文 獻1及2)因其厚度為數十/zm，故在貼附於彎曲使用之撓 性印刷配線板時，其彎曲性不充足。 此外，此等電磁波遮蔽性薄膜中，一般係在接著性樹 脂中混合有導電性填料，但導電性填料之含量愈高，接著 性即愈低，呈現相反之關係。因此，要維持對被黏體之接 著性且同時亦提升電磁波遮蔽性甚為困難。 [先前技術文獻] [專利文獻] 4 322295 201121405 . [專利文獻1] W02006-088127號公報 [專利文獻2]日本特開2004-095566號公報 【發明内容】 (發明欲解決之課題） 於是，本發明之目的係提供一種對被黏體具有比以往 更優異之接著性且彎曲性優異的電磁波遮蔽性薄膜。 (解決課題之方法） 本發明之電磁波遮蔽性薄膜係包含絕緣層及導電層， 且依KEC法於頻率1GHz之電磁波遮蔽性為40至90dB，前 述導電層含有依雷射繞射法所測定之50%粒徑為1 /zm以 上、20 // m 以下，且總體密度（bulk densi ty)為 0. 2g/cm3 以上、0. 7g/cm3以下的片（f lake)狀銀粉。 此外，如上述本發明之電磁波遮蔽性薄膜，其中，片 狀銀粉係在導電層之全重量中占有30重量％至70重量％ 之比例者。 此外，如上述任一項之本發明之電磁波遮蔽性薄膜， 其中，導電層之厚度為2/zm至10/im之範圍者。 另外，如上述任一項之本發明之電磁波遮蔽性薄膜， 其中，導電層之厚度為2/zm至8/zm之範圍者。 本發明之配線板係具備上述態樣之電磁波遮蔽性薄膜 者。 (發明之效果） 本發明之電磁波遮蔽性薄膜係因使用特定形狀之片狀 銀粉，而可提供減少導電性填料之量並提升對被黏體之接 5 322295 201121405 著力’同時具有良好之電磁波遮蔽性的電磁波遮蔽性薄 膜。此外，藉由減少導電性填料之量而可使導電層之厚度 變薄’因而可提供彎曲性優異之電磁波遮蔽性薄臈。 【實施方式】 以下，詳細說明本發明。又，在本案說明書中，「任意 數A以上、任意數b以下」及「任意數a至任意數B」之 記載係指在數A及大於數A之範圍、數B及小於數B之範 圍。此外，在本案說明書中，「KEC法」係指使用社團法人 關西電子工業振興中心（Kansai Electronic Industry Development Center，亦即KEC)開發之電磁波遮蔽效果測 定裝置測定電磁波遮蔽性者。 本發明之電磁波遮蔽性薄膜包含絕緣層、導電層。首 先，對於絕緣層進行說明。 本發明所使用之絕緣層係以使用絕緣性之樹脂為佳。 例如可使用由丙稀酸系樹脂、胺酯（urethane)樹脂、聚酯 樹脂、環氧樹脂、酚（phenol)樹脂、聚碳酸酯樹脂等所形 成之薄膜，或聚酯、聚碳酸酯、聚醯亞胺、聚苯硫醚 (polyphenylene sulfide)等塑膠薄膜。此外，電磁波遮蔽 性薄膜中亦可使用2層以上之絕緣層。 絕緣層之厚度可因應用途而適當設計，以0.5//m至 25#m之範圍為佳，以2"111至10#m為更佳。絕緣層之厚 度未達0. 5/zm時，由於絕緣層之強度不足，而在貼附於 FPC後有不对彎曲之虞。此外，比25 // m厚時，由於附有 電磁波遮蔽性薄膜之FPC之厚度會變厚，而有彎曲性變差 6 322295 201121405 : 之虞。 絕緣層中，亦可因應需要而添加矽烷偶合劑、抗氧化 劑、顏料、染料、賦予黏著之樹脂、塑化劑、紫外線吸收 劑、消泡劑、塗平調整劑、填充劑、阻燃劑等。 其次，對於本發明所使用之導電層進行說明。本發明 所使用之導電層，係以在導電層中含有30至70重量％的 依雷射繞射法所測定之50%粒徑為1 /zm至20# m且總體 密度為0. 2g/cm3至0. 7g/cm3的片狀銀粉為佳。 導電層由於是與被黏體接著而使用，故以使用具有接 著性之樹脂為佳。較佳例為丙婦酸系樹脂、胺酷樹脂、聚 酯樹脂、環氧樹脂、酚樹脂、聚碳酸酯樹脂等。 本發明所使用之片狀銀粉的依雷射繞射法所測定之 50%粒徑係以1 // m至20 // m為佳，以3 // m至15 // m為更 佳。當50%粒徑未達l//m時則難以表現導電性，當大於 20//m時則導電層本身之厚度變厚，在貼附於FPC時之彎 曲性會變差。再者，若使用50%粒徑大於導電層厚度之片 狀銀粉，即可更加提昇電磁波遮蔽性。又，本發明之雷射 繞射法係指以粒度分布計（島津製作所公司製之 「SALD-3100」）並使用水作為溶媒而測得之值。 又，片狀銀粉的總體密度係以0. 2至0. 7g/cm3為佳， 以0. 4至0. 6g/cm3為更佳。當總體密度超出0. 2g/cm3至 0. 7g/cm3之範圍時，會難以獲得導電性。又，本發明之總 體密度係依據以JIS-Z2504為基準之方法而測得之值。 本發明所使用之導電層中的片狀銀粉的重量係以30 7 322295 201121405 7至70重量％為佳，以4〇重量％至6〇重量％為更 I i f的片狀銀粉若未達3Q重找，則無法獲得導 電卜右多於70重量％，則有對被黏體之接著力變弱之虞。 本發明所使用之片狀銀粉，係指相對於丨個銀粉末之 扁平部長邊方向及扁平部短邊方向之長度，其厚度分別獨 立為〗〇分之1以下的葉狀銀粉。丨個銀粉末之 方向及扁平部短邊方向之長度係分別獨立地以 ㈣之範圍為佳，厚度係以G.G5/^1/Zm之範圍為佳。 本發明所使用之片狀銀粉，係以如上所述的】_至 2Μπι之5G%粒徑、〇. 2至G. 7g/⑽3之總體蚊為重要。 在導電層中係藉由重疊片狀銀粉而表現導電性，但入 於=而使用時，由於必須有f曲性，故以⑽至2〇二 之粒輕為重要。再者，由於在導電層中係以重疊更多 片狀銀粉而更加表現導電性，故以使用總體密度低之片狀 銀粉為重要。 導電層中之片狀銀粉雖然不一定需要配向，但較佳係 使片狀銀粉之扁平部配向成與塗膜面呈大致平行，且在導 電層之厚度方向於任意位置配置有複數個片狀銀粉。藉由 使片狀銀粉之扁平部配向成與塗膜面呈大致平行，而增加 片狀銀粉彼此之接觸點，使導電性提升。另—方面，當片 狀銀务為不規則配向時，#狀銀粉彼此之接觸點變少，若 要實現所期望之導電特性’則必須增加片狀銀粉之量。 就製造片狀銀粉之方法而言，可使用球磨機（baU mi 11)等以往$知之方法來生產。又，可藉由改變製造時間 8 322295 201121405 或球徑而製造5〇%粒徑、總體密度^之片狀銀粉。 ·· #狀銀粉中，亦可因應需要而含有界面活性劑或脂肪 酸等表面處理劑。 界面活性劑可列舉如非離子系界面活性劑，例如可舉 勤聚氧伸乙基絲㈣pQlyQxyethylene alkyl灿打） 聚氧伸乙基⑨基苯基崎、聚氧伸乙基脂肪義、聚氧伸乙 基山梨醇酐脂肪酸酯、山梨醇酐脂肪酸酯等。 脂肪酸可列舉如油酸、硬脂酸、肉豆蔻酸等。 界面活性劑、脂肪酸皆可單獨使用，亦可組合2種以 上使用。 本發明之導電層之厚度可依據用途而適當設計，以i _至^⑽之範圍為佳’以丨^至之範圍為更佳， 以3ym至6#m為特佳。導電層之厚度若未達1//m，則有 導電性不足之虞，若比1〇 Am厚，則貼附於F 性有惡化之虞。 3 當在電磁波遮蔽性薄膜中設置2層以上之導電層時， 亦"T積層不含有上述片狀銀粉之導電層。例如可使用銅、 鎳、金、鋁、此等之合金等之金屬粉或蒸鍍膜或濺鍍膜。 在導電層中，與絕緣層同樣地，亦可因應需要而添加 矽烷偶合劑、抗氧化劑、顏料、染料、賦予黏著之樹脂、 塑化劑、紫外線吸收劑、消泡劑、塗平調整劑、填充劑、 阻燃劑等。 形成上述絕緣層、導電層之方法’可藉由以往習知之 塗佈方法，例如凹版塗佈方式、接觸塗佈（kiss c〇ating) 322295 9 201121405 方式、模具（die)塗佈方式、唇式塗佈方式、逗號塗佈（comma coating)方式、刮刀（blade)塗佈方式、親式塗佈方式、刀 (knife)式塗佈方式、喷霧塗佈方式、棒式塗佈方式、旋轉 塗佈方式、浸泡塗佈方式等而進行。 依上述操作而製造之電磁波遮蔽性薄膜，係可貼附於 以撓性配線板為首之各種配線板而予以利用。此外，本發 明之電磁波遮蔽性薄膜除了可利用於配線板以外，亦可廣 範圍地適用於各種電子機器、裝置、器具等。本發明之電 磁波遮蔽性薄膜係因彎曲性優異，而在需要彎曲性之用途 上特別具有優點。 [實施例] 其次，表示實施例而更詳細說明本發明，但本發明不 受此等所限定。 (實施例1) 依據表1之50%粒徑、總體密度，使用以脂肪酸作為 表面處理劑之片狀銀粉與胺酯樹脂（東洋油墨製造股份有 限公司製：VA3020)製作塗液，塗佈並予以乾燥而製成厚度 5//m之導電層。其次，將作為絕緣層之12//m之聚醯亞胺 薄膜與前述導電層貼合而製作電磁波遮蔽性薄膜。對於所 得之電磁波遮蔽性薄膜，依下述方法測定電磁波遮蔽性、 接著力、财彎曲性。 (實施例2至8、比較例1及2) 與實施例1同樣地，使用表1所示之片狀銀粉製作電 磁波遮蔽性薄膜，測定電磁波遮蔽性、接著力、财彎曲性。 10 322295 201121405 (1) 電磁波遮蔽性 , 準備寬度20cm、長度20mm之電磁波遮蔽性薄獏，依 據KEC法進行電磁波遮蔽性（電場）之測定。評估基準係2 下述。 ^ ◎.頻率1 GHz之電磁波遮蔽性為6〇dB以上 〇：頻率1GHz之電磁波遮蔽性為5〇dB以上且未達[Technical Field] The present invention relates to an electromagnetic wave shielding film attached to a flexible printed circuit or the like, and a wiring board including an electromagnetic shielding film. [Prior Art] Electromagnetic wave shielding films have been used in flexible printed wiring boards (hereinafter also referred to as FPC). Among these electromagnetic shielding films, silver powder or copper powder is used for the conductive filler which exhibits electromagnetic shielding properties. However, the price of silver powder is higher than that of the resin or other materials used in the film, so it is desirable to exhibit electromagnetic wave shielding as much as possible in a small amount. Further, since the flexible printed wiring board has been used in a narrow manner in a narrow space of an electronic device in recent years, it has been desired to obtain an electromagnetic wave shielding film excellent in flexibility. On the other hand, the electromagnetic shielding film (see Patent Documents 1 and 2) has a thickness of several tens/zm, so that the flexibility is not sufficient when it is attached to a flexible printed wiring board for bending. Further, in such an electromagnetic wave shielding film, a conductive filler is generally mixed in the adhesive resin, but the higher the content of the conductive filler, the lower the adhesion, and the opposite relationship is exhibited. Therefore, it is difficult to maintain the adhesion to the adherend while also improving the shielding of electromagnetic waves. [Prior Art Document] [Patent Document] 4 322295 201121405 [Patent Document 1] WO02006-088127 (Patent Document 2) JP-A-2004-095566 (Summary of the Invention) An object of the invention is to provide an electromagnetic wave shielding film which is excellent in adhesion to an adherend and has excellent bendability. (Means for Solving the Problem) The electromagnetic wave shielding film of the present invention comprises an insulating layer and a conductive layer, and has an electromagnetic wave shielding property of 40 to 90 dB at a frequency of 1 GHz according to the KEC method, and the conductive layer is determined by a laser diffraction method. 50% particle size is 1 / zm or more, 20 / / m or less, and the bulk density (bulk densi ty) is 0. 2g / cm3 or more, 0. 7g / cm3 or less of the sheet (f lake) silver powder. Further, in the electromagnetic wave shielding film of the present invention, the sheet-like silver powder accounts for 30% by weight to 70% by weight based on the total weight of the conductive layer. Furthermore, the electromagnetic wave shielding film of the present invention according to any one of the preceding claims, wherein the thickness of the conductive layer is in the range of 2/zm to 10/im. Further, the electromagnetic wave shielding film of the present invention according to any one of the preceding claims, wherein the thickness of the conductive layer is in the range of 2/zm to 8/zm. The wiring board of the present invention includes the above-described electromagnetic wave shielding film. (Effect of the Invention) The electromagnetic wave shielding film of the present invention can provide a reduction in the amount of the conductive filler and enhance the adhesion to the adherend by using a sheet-like silver powder of a specific shape, and has good electromagnetic wave shielding. Sexual electromagnetic shielding film. Further, by reducing the amount of the conductive filler, the thickness of the conductive layer can be made thin, and thus an electromagnetic wave shielding thinness excellent in flexibility can be provided. [Embodiment] Hereinafter, the present invention will be described in detail. Further, in the present specification, the descriptions of "arbitrary number A or more, arbitrary number b or less" and "arbitrary number a to any number B" mean a range of number A and greater than number A, number B, and range less than number B. . In addition, in the present specification, the "KEC method" refers to the measurement of electromagnetic wave shielding by an electromagnetic wave shielding effect measuring device developed by the Kansai Electronic Industry Development Center (KEC). The electromagnetic wave shielding film of the present invention comprises an insulating layer and a conductive layer. First, the insulation layer will be described. The insulating layer used in the present invention is preferably an insulating resin. For example, a film formed of an acrylic resin, an urethane resin, a polyester resin, an epoxy resin, a phenol resin, a polycarbonate resin, or the like, or a polyester, a polycarbonate, or a poly Plastic film such as quinone imine or polyphenylene sulfide. Further, two or more insulating layers may be used for the electromagnetic wave shielding film. The thickness of the insulating layer can be appropriately designed depending on the application, preferably in the range of 0.5//m to 25#m, and more preferably in the range of 2"111 to 10#m. When the thickness of the insulating layer is less than 0.5/zm, the strength of the insulating layer is insufficient, and there is a problem that the bending is not performed after being attached to the FPC. In addition, when it is thicker than 25 // m, the thickness of the FPC with the electromagnetic shielding film becomes thicker, and the bending property is deteriorated 6 322295 201121405 : . In the insulating layer, a decane coupling agent, an antioxidant, a pigment, a dye, an adhesive resin, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, etc. may be added as needed. . Next, the conductive layer used in the present invention will be described. 2g/ The total density is 0. 2g / 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The flaky silver powder of cm3 to 0.7 g/cm3 is preferred. Since the conductive layer is used in conjunction with the adherend, it is preferred to use a resin having conductivity. Preferred examples are a bupropion acid resin, an amine resin, a polyester resin, an epoxy resin, a phenol resin, a polycarbonate resin and the like. The 50% particle diameter measured by the laser diffraction method of the flake silver powder used in the present invention is preferably from 1 // m to 20 // m, more preferably from 3 // m to 15 // m. When the 50% particle diameter is less than 1/m, it is difficult to express conductivity, and when it is more than 20/m, the thickness of the electroconductive layer itself becomes thick, and the bending property when attached to the FPC is deteriorated. Further, if 50% of the silver powder having a particle diameter larger than the thickness of the conductive layer is used, the electromagnetic wave shielding property can be further enhanced. Further, the laser diffraction method of the present invention is a value measured by a particle size distribution ("SALD-3100" manufactured by Shimadzu Corporation) and using water as a solvent. 6至0. 6g/厘米的优选。 Further, the total density of the flaky silver powder is preferably from 0.2 to 0. 7g / cm3, more preferably from 0.4 to 0.6g / cm3. When the overall density exceeds the range of from 0.2 g/cm 3 to 0.7 g/cm 3 , it is difficult to obtain conductivity. Further, the total density of the present invention is a value measured in accordance with the method based on JIS-Z2504. The weight of the flake silver powder in the conductive layer used in the present invention is preferably 30 7 322295 201121405 7 to 70 wt%, and 4 wt% to 6 wt% is more I if the flake silver powder is less than 3 Q. If you look for it again, you will not get more than 70% by weight of the conductive material, and there will be a weakening of the adhesion force to the adherend. The flaky silver powder used in the present invention refers to a leaf-shaped silver powder having a thickness of at least 1 part of the thickness of the flat side of the silver powder and the length of the short side of the flat portion. The direction of the silver powder and the length of the short side of the flat portion are preferably independently in the range of (4), and the thickness is preferably in the range of G.G5/^1/Zm. The flaky silver powder used in the present invention is important as the above-mentioned _ to 2 Μ π 5 G% particle size, 〇. 2 to G. 7 g / (10) 3 of the total mosquito. In the conductive layer, the conductivity is exhibited by laminating the silver flakes. However, when used in the case of =, it is necessary to have f-flexibility, so that it is important to light the particles of (10) to 2〇. Further, since the electroconductive layer is more likely to be superimposed in the conductive layer by overlapping more flake silver powder, it is important to use flake silver powder having a low overall density. Although the flake silver powder in the conductive layer does not necessarily need to be aligned, it is preferable that the flat portion of the flake silver powder is aligned substantially parallel to the surface of the coating film, and a plurality of sheets are disposed at any position in the thickness direction of the conductive layer. Silver powder. By arranging the flat portions of the flake silver powder substantially parallel to the surface of the coating film, the contact points of the flake silver powders are increased to improve the conductivity. On the other hand, when the sheet-like silver is irregularly aligned, the contact points of the #-like silver powders become less, and the amount of the sheet-like silver powder must be increased in order to achieve the desired conductive characteristics. The method for producing the flake silver powder can be produced by a conventional method such as a ball mill (baU mi 11). Further, it is possible to produce a flaky silver powder having a particle size of 5 〇% and an overall density by changing the manufacturing time of 8 322295 201121405 or the spherical diameter. ··# Silver powder may contain a surface treatment agent such as a surfactant or a fatty acid as needed. The surfactant may, for example, be a nonionic surfactant, for example, a polyoxyethylene extension ethyl ester (IV) pQlyQxyethylene alkyl can be used. Polyoxyethylene ethyl 9-phenyl phenyl group, polyoxyalkylene ether, polyoxygen extension Ethyl sorbitan fatty acid ester, sorbitan fatty acid ester, and the like. Examples of the fatty acid include oleic acid, stearic acid, myristic acid and the like. The surfactant and the fatty acid may be used singly or in combination of two or more. The thickness of the conductive layer of the present invention can be appropriately designed depending on the use, and it is preferable that the range of i _ to ^ (10) is more preferably in the range of 丨 ^ to more preferably from 3 ym to 6 # m. If the thickness of the conductive layer is less than 1/m, the conductivity is insufficient, and if it is thicker than 1 〇 Am, the F property is deteriorated. 3 When two or more conductive layers are provided in the electromagnetic shielding film, the <T laminate does not contain the conductive layer of the above-mentioned silver powder. For example, a metal powder such as copper, nickel, gold, aluminum, or the like, or a vapor deposited film or a sputtered film can be used. In the conductive layer, as in the case of the insulating layer, a decane coupling agent, an antioxidant, a pigment, a dye, an adhesive resin, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, or the like may be added as needed. Fillers, flame retardants, etc. The method of forming the above-mentioned insulating layer and conductive layer can be carried out by a conventional coating method such as gravure coating, contact coating, 322295 9 201121405, die coating, lip Coating method, comma coating method, blade coating method, pro-coating method, knife coating method, spray coating method, bar coating method, spin coating The cloth method, the immersion coating method, and the like are carried out. The electromagnetic wave shielding film produced by the above operation can be used by being attached to various wiring boards including flexible wiring boards. Further, the electromagnetic wave shielding film of the present invention can be applied to various electronic devices, devices, appliances, and the like in addition to the wiring board. The electromagnetic wave shielding film of the present invention is excellent in flexibility and is particularly advantageous in applications requiring flexibility. [Examples] Next, the present invention will be described in more detail with reference to examples but the present invention is not limited thereto. (Example 1) A coating liquid was prepared by using a flake silver powder having a fatty acid as a surface treatment agent and an amine ester resin (manufactured by Toyo Ink Co., Ltd.: VA3020), and coating it according to the 50% particle diameter and the overall density of Table 1. It was dried to form a conductive layer having a thickness of 5/m. Next, a 12/m polyimide film of the insulating layer was bonded to the conductive layer to prepare an electromagnetic wave shielding film. With respect to the obtained electromagnetic wave shielding film, electromagnetic wave shielding property, subsequent force, and financial flexibility were measured by the following methods. (Examples 2 to 8 and Comparative Examples 1 and 2) An electromagnetic wave shielding film was produced using the flake silver powder shown in Table 1 in the same manner as in Example 1, and the electromagnetic wave shielding property, the adhesion force, and the financial flexibility were measured. 10 322295 201121405 (1) Electromagnetic wave shielding property The electromagnetic wave shielding thinness of 20 cm in width and 20 mm in length is prepared, and the electromagnetic wave shielding property (electric field) is measured in accordance with the KEC method. The evaluation baseline 2 is as follows. ^ ◎. The shielding of electromagnetic waves at a frequency of 1 GHz is 6 〇 dB or more. 〇: The shielding of electromagnetic waves at a frequency of 1 GHz is 5 〇 dB or more and is not reached.
60dB △:頻率1GHz之電磁波遮蔽性為4〇dB以上且未達60dB △: The electromagnetic wave shielding of the frequency of 1GHz is 4〇dB or more and is not up to
50dB X ·頻率1 GHz之電磁波遮敝性未達4〇(化 (2) 接著力 準備寬度10mm、長度70mm之電磁波遮蔽性薄膜，將 電磁波遮蔽性薄膜之導電層顯厚度5〇/im之聚釀亞胺薄 膜貼合。然後，以15(TC、1. OMPa、1〇分鐘之條件進行壓 合後，以拉伸速度50mm/分鐘、剝離角度9〇。來測定電磁波 遮蔽性薄膜之導電層與聚醯亞胺薄祺間的接著力（N/cm): 評估基準係如下述。 〇：接著力在3N/cm以上 △:接著力在2N/cm以上而未達3N/cm X :接著力未達2N/cm (3) 耐弯曲性 將寬度6mm、長度120丽之電磁波遮蔽性薄膜之導電 層側，以15(TC、IMPa、30分鐘之條件壓合在另外製作之 撓!·生印刷配線板（在厚度25 // m之聚醯亞胺薄膜上形成由 322295 11 201121405 厚度12/iin之銅箔所構成之電路圖案，再於電路圖案上積 層附有接著劑之厚度40// m之覆蓋膜（cover film)而成的 配線板）之覆蓋膜面。 其次，以曲率半徑0. 38mm、荷重500g、速度180次/ 分鐘之條件運作MIT彎曲試驗機，以直到電路圖案斷線為 止之次數來評估耐彎曲性。評估基準係如下述。 〇：4000次以上 △ : 2000次以上而未達4000次 X :未達2000次 本發明案係以2009年9月18日申請之日本申請案特 願2009-216317為基礎而主張優先權，其揭示内容亦援用 於此。 12 322295 201121405 :[表 1 ] 比較例2 LO CNI CNI ◦· § CD X < X 比較例1 LT5 〇 LO 〇 Ο g m X <] 〇 實施例8 〇〇 LO 〇 0.09 ο ◎ 〇 <3 實施例7 0.48 Ο 卜 <1 〇 〇 實施例6 〇 〇〇 〇 ι«·Η Ο § CO ◎ 〇 〇 實施例5 〇 0.48 ο 卜 〇 〇 〇 實施例4 LO 0.32 Μ ο S L〇 ◎ 〇 〇 實施例3 CD CD C5 s 呀 ◎ 〇 〇 實施例2 卜 0. 48 g <=s 穿 CO 〇 〇 〇 實施例1 CO ΙΛ ο csa * ο LD 〇 〇 〇 50%粒徑（/zm) 總趙密度（g/αη3) 銀粉之厚度（"ra) 銀粉添加量（重量％) 導電層厚度（Wm) 電磁波遮蔽性 接著性 耐彎曲性 13 322295 201121405 【圖式簡單說明】 無。 【主要元件符號說明】50dB X · The electromagnetic wave concealing property of 1 GHz is less than 4 〇 (2) Next, prepare an electromagnetic wave shielding film with a width of 10 mm and a length of 70 mm, and the conductive layer of the electromagnetic shielding film has a thickness of 5 〇/im. The imide film was bonded, and then the conductive layer of the electromagnetic shielding film was measured at a tensile speed of 50 mm/min and a peeling angle of 9 Torr at 15 (TC, 1.0 MPa, 1 Torr). Adhesion (N/cm) between the polyimide and the polyimide: The evaluation criteria are as follows: 〇: The force is above 3 N/cm △: The force is above 2 N/cm and less than 3 N/cm X : The force is less than 2N/cm (3) The bending resistance is measured on the side of the conductive layer of the electromagnetic wave shielding film having a width of 6 mm and a length of 120 mils, and is pressed at 15 (TC, IMPa, and 30 minutes). Printed wiring board (a circuit pattern composed of 322295 11 201121405 thickness 12/iin copper foil is formed on a polyimide film having a thickness of 25 // m, and a thickness of an adhesive is laminated on the circuit pattern 40// The thickness of the film of the cover film of the cover film of the m. The MIT bending tester was operated under the conditions of a load of 500 g and a speed of 180 times/min, and the bending resistance was evaluated until the number of times the circuit pattern was broken. The evaluation criteria are as follows. 〇: 4000 times or more △ : 2000 times or more 4,000 times X: 2,000 times of the present invention claims priority based on Japanese Patent Application No. 2009-216317, filed on Sep. 18, 2009, the disclosure of which is hereby incorporated herein. 1] Comparative Example 2 LO CNI CNI ◦· § CD X < X Comparative Example 1 LT5 〇LO 〇Ο gm X <] 〇Example 8 〇〇LO 〇0.09 ο ◎ 〇<3 Example 7 0.48 Ο 卜<1 〇〇Example 6 〇〇〇〇ι«·Η Ο § CO ◎ 〇〇 Example 5 〇 0.48 ο 〇〇〇 〇〇〇 Example 4 LO 0.32 Μ ο SL 〇 ◎ Example 3 CD CD C5 s 呀 ◎ 〇〇 Example 2 Bu 0. 48 g <=s Wear CO 〇〇〇 Example 1 CO ΙΛ ο csa * ο LD 〇〇〇 50% particle size (/zm) Total Zhao density (g/αη3 Silver The thickness (" ra) adding an amount of silver powder (wt%) thickness of the conductive layer (Wm of) the electromagnetic wave shielding property and then flexing Past 13 [322,295,201,121,405 None drawings briefly described. [Main component symbol description]