JP2015073105A - Electromagnetic wave shielding film, and wiring board - Google Patents
Electromagnetic wave shielding film, and wiring board Download PDFInfo
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
Abstract
Description
本発明は，フレキシブルプリント配線板などに貼付される電磁波シールド性フィルム、及び電磁波シールド性フィルムを具備する配線板に関する。 The present invention relates to an electromagnetic wave shielding film attached to a flexible printed wiring board and the like, and a wiring board provided with the electromagnetic wave shielding film.
従来より電磁波シールド性フィルムは、フレキシブルプリント配線板（以下、ＦＰＣともいう）に用いられている。これらの電磁波シールド性フィルムには、電磁波シールド性を発現させるための導電性フィラーとして、銀粉や銅粉が用いられている。しかし銀粉の価格は、フィルム中に使用される樹脂や他の原料と比較して高価であることから、できるだけ少ない量で電磁波シールド性を発現する事が望ましい。
また、近年のフレキシブルプリント配線板は、電子機器の狭い空間に屈曲されて使用される場合が増加しているため、より屈曲性に優れる電磁波シールド性フィルムが望まれている。
Conventionally, electromagnetic wave shielding films have been used for flexible printed wiring boards (hereinafter also referred to as FPC). In these electromagnetic wave shielding films, silver powder or copper powder is used as a conductive filler for exhibiting electromagnetic wave shielding properties. However, since the price of silver powder is expensive compared to the resin and other raw materials used in the film, it is desirable that the electromagnetic shielding properties be manifested in as small an amount as possible.
In recent years, flexible printed wiring boards have been increasingly used by being bent in a narrow space of an electronic device, and thus an electromagnetic wave shielding film having better flexibility is desired.
一方、これまでの電磁波シールド性フィルム（特許文献１及び２）は、厚みが、数十μｍの厚みであった為、屈曲して使用されるフレキシブルプリント配線板に貼付される場合には、屈曲性が不十分であった。 On the other hand, since the conventional electromagnetic wave shielding films (Patent Documents 1 and 2) have a thickness of several tens of μm, they are bent when attached to a flexible printed wiring board to be bent. Sex was insufficient.
また、これら電磁波シールド性フィルムは、接着性樹脂に導電性フィラーを混合させるのが一般的であるが、導電性フィラーの含有量を高くするほど接着性が低くなるという相反する関係がある。このため、被着体に対する接着性を維持しつつ電磁波シールド性を向上させることは、困難であった。 These electromagnetic wave shielding films generally have a conductive filler mixed with an adhesive resin, but there is a conflicting relationship that the adhesiveness decreases as the content of the conductive filler increases. For this reason, it has been difficult to improve the electromagnetic shielding properties while maintaining the adhesion to the adherend.
そこで、本発明では、従来よりも被着体に対して優れた接着性を有し、且つ屈曲性に優れる電磁波シールド性フィルムを提供することを目的とする。 Accordingly, an object of the present invention is to provide an electromagnetic wave shielding film that has better adhesion to an adherend than the conventional one and is excellent in flexibility.
本発明に係る電磁波シールド性フィルムは、絶縁層と、導電層とを含む、ＫＥＣ法における周波数１ＧＨｚでの電磁波シールド性が４０〜９０ｄＢである電磁波シールド性フィルムであって、
前記導電層の厚みが２μｍ以上、１０μｍ以下であり、
前記導電層が、レーザー回折法により測定した５０％粒子径が１μｍ以上、２０μｍ以下であり、かさ密度が０．２ｇ／ｃｍ3以上、０．７ｇ／ｃｍ3以下であるフレーク状銀粉を含む。
The electromagnetic wave shielding film according to the present invention includes an insulating layer and a conductive layer, and is an electromagnetic wave shielding film having an electromagnetic wave shielding property at a frequency of 1 GHz in the KEC method of 40 to 90 dB,
The conductive layer has a thickness of 2 μm or more and 10 μm or less,
The conductive layer contains flaky silver powder having a 50% particle diameter of 1 μm or more and 20 μm or less measured by a laser diffraction method and a bulk density of 0.2 g / cm 3 or more and 0.7 g / cm 3 or less.
さらに本発明は、導電層の膜厚が２μｍ〜８μｍの範囲にある上記いずれかの発明の電
磁波シールド性フィルムである。
Furthermore, the present invention is the electromagnetic wave shielding film according to any one of the above inventions, wherein the thickness of the conductive layer is in the range of 2 μm to 8 μm.
本発明に係る配線板は、上記態様の電磁波シールド性フィルムを備えるものである。 The wiring board which concerns on this invention is equipped with the electromagnetic wave shielding film of the said aspect.
本発明の電磁波シールド性フィルムは、特定の形状のフレーク状銀粉を用いたことで、導電性フィラーの量を減らして被着体に対する接着力を向上させつつ、良好な電磁波シールド性を有する電磁波シールド性フィルムを提供することができる。また、導電性フィラーの量を減らすことにより導電層の厚みを薄くすることが可能となるので、屈曲性に優れ電磁波シールド性フィルムを提供することができる。 The electromagnetic wave shielding film of the present invention uses a flaky silver powder having a specific shape, thereby reducing the amount of the conductive filler and improving the adhesion to the adherend, while also having an excellent electromagnetic wave shielding property. A protective film can be provided. In addition, since the thickness of the conductive layer can be reduced by reducing the amount of the conductive filler, an electromagnetic wave shielding film having excellent flexibility can be provided.
以下、本発明を詳細に説明する。なお、本明細書において「任意の数Ａ以上、任意の数Ｂ以下」及び「任意の数Ａ〜任意の数Ｂ」なる記載は、数Ａ及び数Ａより大きい範囲であって、数Ｂ及び数Ｂより小さい範囲を意味する。また、本明細書において「ＫＥＣ法」とは、社団法人関西電子工業振興センター（ＫＥＣ）開発の電磁波シールド効果測定装置を用い、電磁波シールド性を測定したものを言う。 Hereinafter, the present invention will be described in detail. In the present specification, the descriptions “any number A or more and any number B or less” and “any number A to any number B” are ranges larger than the numbers A and A, and the numbers B and It means a range smaller than the number B. Further, in this specification, the “KEC method” refers to an electromagnetic shielding effect measured using an electromagnetic shielding effect measuring device developed by Kansai Electronics Industry Promotion Center (KEC).
本発明の電磁波シールド性フィルムは、絶縁層と導電層とを含む。まず、絶縁層に関して説明する。
本発明で用いる絶縁層は、絶縁性の樹脂を用いることが好ましい。例えば、アクリル樹脂、ウレタン樹脂、ポリエステル樹脂、エポキシ樹脂、フェノール樹脂、ポリカーボネート樹脂などから形成したフィルムや、ポリエステル、ポリカーボネート、ポリイミド、ポリフェニレンサルファイドなどのプラスチックフィルムを使用することができる。また、電磁波シールド性フィルムに、絶縁層を２層以上使用していても良い。
The electromagnetic wave shielding film of the present invention includes an insulating layer and a conductive layer. First, the insulating layer will be described.
The insulating layer used in the present invention preferably uses an insulating resin. For example, a film formed from an acrylic resin, a urethane resin, a polyester resin, an epoxy resin, a phenol resin, a polycarbonate resin, or a plastic film such as polyester, polycarbonate, polyimide, or polyphenylene sulfide can be used. Two or more insulating layers may be used for the electromagnetic wave shielding film.
絶縁層の厚みは、用途に応じて適宜設計可能であるが、０．５μｍ〜２５μｍの範囲である事が好ましく、より好ましくは、２μｍ〜１０μｍである。絶縁層の厚みが、０．５μｍ未満の場合、絶縁層の強度が不十分である為、ＦＰＣ回路に貼付後の屈曲に耐えられない恐れがある。また、２５μｍよりも厚い場合、電磁波シールドフィルム付きＦＰＣの厚みが厚くなる為、屈曲性が悪くなる恐れがある。 Although the thickness of an insulating layer can be designed suitably according to a use, it is preferable that it is the range of 0.5 micrometer-25 micrometers, More preferably, it is 2 micrometers-10 micrometers. When the thickness of the insulating layer is less than 0.5 μm, the strength of the insulating layer is insufficient, so that it may not be able to withstand bending after being attached to the FPC circuit. Moreover, when thicker than 25 micrometers, since the thickness of FPC with an electromagnetic wave shielding film becomes thick, there exists a possibility that a flexibility may worsen.
絶縁層中には、必要に応じてシランカップリング剤、酸化防止剤、顔料、染料、粘着付与樹脂、可塑剤、紫外線吸収剤、消泡剤、レベリング調整剤，充填剤，難燃剤等を添加しても良い。 Add silane coupling agent, antioxidant, pigment, dye, tackifying resin, plasticizer, UV absorber, antifoaming agent, leveling regulator, filler, flame retardant, etc. as necessary in the insulating layer You may do it.
次に、本発明で用いる導電層に関して説明する。本発明で用いる導電層は、レーザー回折法により測定した５０％粒子径が１μｍ〜２０μｍ、かさ密度が０．２ｇ／ｃｍ3〜０
．７ｇ／ｃｍ3のフレーク状銀粉を導電層中に３０〜７０重量％含むことが好ましい。
導電層は、被着体と接着させて使用する為、接着性を有する樹脂を使用する事が好ましい。好適な例は、アクリル樹脂、ウレタン樹脂、ポリエステル樹脂、エポキシ樹脂、フェノール樹脂、ポリカーボネート樹脂等である。
Next, the conductive layer used in the present invention will be described. The conductive layer used in the present invention has a 50% particle diameter of 1 μm to 20 μm and a bulk density of 0.2 g / cm 3 to 0 as measured by a laser diffraction method.
. It is preferable to contain 30 to 70% by weight of 7 g / cm 3 of flaky silver powder in the conductive layer.
Since the conductive layer is used by being adhered to an adherend, it is preferable to use a resin having adhesiveness. Suitable examples are acrylic resin, urethane resin, polyester resin, epoxy resin, phenol resin, polycarbonate resin and the like.
本発明で用いるフレーク状銀粉のレーザー回折法により測定した５０％粒子径は、１μｍ〜２０μｍであることが好ましく、より好ましくは、３μｍ〜１５μｍである。５０％粒子径が１μｍ未満であると導電性が発現しにくく、２０μｍよりも大きいと導電層自体の膜厚が厚くなり、ＦＰＣに貼付した際の屈曲性が悪くなる。さらに導電層の厚さより５０％粒子径が大きいフレーク状銀粉を用いることで、電磁波シールド性をより向上できる。なお、本発明のレーザー回折法とは、粒度分布計（島津製作所社製「ＳＡＬＤ−３１００」）にて溶媒として水を用いて測定した値である。 The 50% particle diameter of the flaky silver powder used in the present invention measured by a laser diffraction method is preferably 1 μm to 20 μm, more preferably 3 μm to 15 μm. When the 50% particle diameter is less than 1 μm, the conductivity is hardly expressed, and when it is larger than 20 μm, the film thickness of the conductive layer itself becomes thick and the flexibility when pasted on the FPC is deteriorated. Furthermore, electromagnetic wave shielding properties can be further improved by using flaky silver powder having a particle diameter 50% larger than the thickness of the conductive layer. The laser diffraction method of the present invention is a value measured using water as a solvent with a particle size distribution meter (“SALD-3100” manufactured by Shimadzu Corporation).
またフレーク状銀粉のかさ密度は、０．２〜０．７ｇ／ｃｍ3であることが好ましく、
より好ましくは、０．４〜０．６ｇ／ｃｍ3である。かさ密度が０．２ｇ／ｃｍ3〜０．７ｇ／ｃｍ3の範囲を外れると導電性が得られにくくなる。なお、本発明のかさ密度とは、
ＪＩＳ−Ｚ２５０４に則った方法で測定した値である。
The bulk density of the flaky silver powder is preferably 0.2 to 0.7 g / cm 3 ,
More preferably, it is 0.4 to 0.6 g / cm 3 . Conductive when the bulk density is out of the range of 0.2g / cm 3 ~0.7g / cm 3 is difficult to obtain. The bulk density of the present invention is
It is the value measured by the method according to JIS-Z2504.
本発明で用いる導電層中のフレーク状銀粉の重量は、３０重量％〜７０重量％であるであることが好ましく、より好ましくは４０重量％〜６０重量％である。導電層中のフレーク状銀粉が３０重量％未満であると、導電性が得られず、７０重量％よりも多いと被着体に対する接着力が弱くなる恐れがある。 The weight of the flaky silver powder in the conductive layer used in the present invention is preferably 30% by weight to 70% by weight, and more preferably 40% by weight to 60% by weight. If the flaky silver powder in the conductive layer is less than 30% by weight, conductivity cannot be obtained, and if it is more than 70% by weight, the adhesion to the adherend may be weakened.
本発明で用いるフレーク状銀粉とは、銀粉末１つの扁平部長手方向及び扁平部短手方向の長さに対する厚みがそれぞれ独立に１０分の１以下である葉状の銀粉のことを言う。銀粉末１つの扁平部長手方向及び扁平部短手方向の長さは、それぞれ独立して１μｍ〜１００μｍの範囲にあることが好ましく、厚みは０．０５μｍ〜１μｍの範囲のものが好ましい。 The flaky silver powder used in the present invention refers to a leaf-shaped silver powder whose thickness with respect to the length of one flat part in the flat part longitudinal direction and the flat part short direction is independently 1/10 or less. The lengths of the flat part longitudinal direction and the flat part short direction of one silver powder are preferably independently in the range of 1 μm to 100 μm, and the thickness is preferably in the range of 0.05 μm to 1 μm.
本発明で用いるフレーク状銀粉は、上記の通り１μｍ〜２０μｍの５０％粒子径、かつ０．２ｇ／ｃｍ3〜０．７ｇ／ｃｍ3かさ密度であることが重要である。導電層中でフレーク状銀粉が重なり合う事で導電性を発現するが、ＦＰＣに貼り合せて使用する場合には屈曲性が必要な事から、１μｍ〜２０μｍの５０％粒子径であることが重要である。さらに、導電層中で、フレーク状銀粉がより多く重なりあった方が電磁波シールド性を発現することから、かさ密度の低いフレーク状銀粉を使用する事が重要である。 Flaky silver powder used in the present invention, it is important that the 50% particle diameter and 0.2g / cm 3 ~0.7g / cm 3 bulk density of the street 1 m to 20 m. Conductivity is manifested by the flaky silver powder overlapping in the conductive layer, but it is important to have a 50% particle diameter of 1 μm to 20 μm because it needs to be flexible when used by being attached to FPC. is there. Furthermore, it is important to use a flaky silver powder having a low bulk density because the more the flaky silver powder overlaps in the conductive layer, the better the electromagnetic shielding properties.
導電層中におけるフレーク状銀粉は、必ずしも配向している必要はないが、フレーク状銀粉の扁平部を塗膜面と概ね平行に配向する事で、フレーク状銀粉
同士の接点が増えて導電性が向上する。一方、フレーク状銀粉が不規則な配向の場合、フレーク状銀粉同士の接触点が少なくなり、所望の導電特性を実現するためのフレーク状銀粉の量を多くする必要が生じる。
The flaky silver powder in the conductive layer does not necessarily have to be oriented, but by aligning the flat part of the flaky silver powder almost parallel to the coating surface, the contact between the flaky silver powders increases and the conductivity is increased. improves. On the other hand, when the flaky silver powder is irregularly oriented, the number of contact points between the flaky silver powders is reduced, and it is necessary to increase the amount of the flaky silver powder for realizing desired conductive properties.
フレーク状銀粉を製造する方法としては、ボールミルなどの従来公知の方法で生産する事ができる。また、製造時間やビーズ径を変えることで５０％粒子径、かさ密度の違うフレーク状銀粉を作製することができる。 As a method for producing the flaky silver powder, it can be produced by a conventionally known method such as a ball mill. In addition, flaky silver powder having a 50% particle diameter and a different bulk density can be produced by changing the production time and the bead diameter.
フレーク状銀粉には、必要に応じて界面活性剤や脂肪酸などの表面処理剤が含まれていても良い。
界面活性剤としては、非イオン系界面活性剤が挙げられ、ポリオキシエチレンアルキルエーテル、ポリオキシエチレンアルキルフェニルエーテル、ポリオキシエチレン脂肪酸エステル、ポリオキシエチレンソルビタン脂肪酸エステル、ソルビタン脂肪酸エステルなどが挙げられる。
脂肪酸としては、オレイン酸、ステアリン酸、ミリスチン酸等が挙げられる。
界面活性剤、脂肪酸共に単独で使用しても構わないし、２種類以上組み合わせても構わない。
The flaky silver powder may contain a surface treatment agent such as a surfactant or a fatty acid, if necessary.
Examples of the surfactant include nonionic surfactants such as polyoxyethylene alkyl ether, polyoxyethylene alkyl phenyl ether, polyoxyethylene fatty acid ester, polyoxyethylene sorbitan fatty acid ester, and sorbitan fatty acid ester.
Examples of fatty acids include oleic acid, stearic acid, myristic acid and the like.
Both the surfactant and the fatty acid may be used alone or in combination of two or more.
本発明の導電層の厚みは、用途により適宜設計可能であるが、１μｍ〜１０μｍの範囲であることが好ましく、１μｍ〜８μｍの範囲であることがより好ましく、さらに好ましくは、３μｍ〜６μｍである。導電層の厚みが、１μｍ未満の場合、導電性が不足する恐れがあり、１０μｍよりも厚い場合、ＦＰＣ回路に貼付した場合の屈曲性が悪化する恐れがある。 The thickness of the conductive layer of the present invention can be appropriately designed depending on the use, but is preferably in the range of 1 μm to 10 μm, more preferably in the range of 1 μm to 8 μm, and still more preferably in the range of 3 μm to 6 μm. . When the thickness of the conductive layer is less than 1 μm, the conductivity may be insufficient, and when it is thicker than 10 μm, the flexibility when attached to the FPC circuit may be deteriorated.
電磁波シールド性フィルムに２層以上導電層を設ける場合には、上述したフレーク状銀粉が含まれていない導電層が積層されていてもよい。例えば、銅、ニッケル、金、アルミ、合金等の金属粉や蒸着膜やスパッタ膜を使用することができる。
また、導電層中には、上記フレーク状銀粉以外にも、導電性を向上させる目的で、例えば、銅、ニッケル、金、アルミ、これらの合金等の金属粉を添加しても構わない。
When two or more conductive layers are provided on the electromagnetic wave shielding film, a conductive layer that does not contain the flaky silver powder described above may be laminated. For example, metal powder such as copper, nickel, gold, aluminum, and alloy, a deposited film, or a sputtered film can be used.
In addition to the flaky silver powder, for example, metal powder such as copper, nickel, gold, aluminum, and alloys thereof may be added to the conductive layer for the purpose of improving conductivity.
導電層中にも絶縁層同様、必要に応じてシランカップリング剤、酸化防止剤、顔料、染料、粘着付与樹脂、可塑剤、紫外線吸収剤、消泡剤、レベリング調整剤，充填剤，難燃剤等を添加してもよい。 In the conductive layer as well as the insulating layer, silane coupling agents, antioxidants, pigments, dyes, tackifying resins, plasticizers, UV absorbers, antifoaming agents, leveling regulators, fillers, flame retardants as necessary Etc. may be added.
上記絶縁層、導電層を形成する方法としては、従来公知の塗布方法、例えば、グラビアコート方式、キスコート方式、ダイコート方式、リップコート方式、コンマコート方式、ブレードコート方式、ロールコート方式、ナイフコート方式、スプレーコート方式、バーコート方式、スピンコート方式、ディップコート方式等により行うことができる。 As a method for forming the insulating layer and the conductive layer, conventionally known coating methods such as gravure coating method, kiss coating method, die coating method, lip coating method, comma coating method, blade coating method, roll coating method, knife coating method, etc. , Spray coating, bar coating, spin coating, dip coating and the like.
上記のようにして製造された電磁波シールド性フィルムは、フレキシブル配線板をはじめとする各種の配線板に貼着せしめられて利用することができる。また、本発明に係る電磁波シールド性フィルムは、配線板の他、各種電子機器、装置、器具等において広範に適用可能である。本発明に係る電磁波シールド性フィルムは、屈曲性に優れるので、屈曲性が必要とされる用途において特にメリットが大きい。 The electromagnetic shielding film produced as described above can be used by being stuck to various wiring boards including a flexible wiring board. Moreover, the electromagnetic wave shielding film according to the present invention can be widely applied to various electronic devices, apparatuses, appliances and the like in addition to the wiring board. Since the electromagnetic wave shielding film according to the present invention is excellent in flexibility, it is particularly advantageous in applications where flexibility is required.
次に、実施例を示して本発明を更に詳細に説明するが、本発明はこれらによって限定されるものではない。 Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited thereto.
（実施例１）
表１の５０％粒子径、かさ密度で、表面処理剤として脂肪酸を用いたフレーク状銀粉とウレタン樹脂（東洋インキ製造株式会社製：ＶＡ３０２０）とを用いて塗液を作製し、膜厚５μｍの導電層を塗工・乾燥した。次いで絶縁層としてポリイミドフィルム１２μｍを、前記導電層を貼り合せて電磁波シールド性フィルムを作製した。得られた電磁波シールド性フィルムについて、電磁波シールド性、接着力、耐屈曲性を下記の方法で測定した。
(Example 1)
A coating solution was prepared using a flaky silver powder and a urethane resin (VA 3020 manufactured by Toyo Ink Manufacturing Co., Ltd.) using a fatty acid as a surface treatment agent with a 50% particle size and bulk density in Table 1, and a film thickness of 5 μm. The conductive layer was applied and dried. Next, an electromagnetic wave shielding film was prepared by bonding 12 μm of polyimide film as an insulating layer and the conductive layer. About the obtained electromagnetic wave shielding film, electromagnetic wave shielding property, adhesive force, and bending resistance were measured by the following method.
（実施例２〜８、比較例１、２）
実施例１と同様に、表１に示すフレーク状銀粉を用いて電磁波シールド性フィルムを作製し、電磁波シールド性、接着力、耐屈曲性を測定した。
(Examples 2 to 8, Comparative Examples 1 and 2)
In the same manner as in Example 1, an electromagnetic wave shielding film was produced using the flaky silver powder shown in Table 1, and the electromagnetic wave shielding property, adhesive force, and bending resistance were measured.
（１）電磁波シールド性
幅２０ｃｍ、長さ２０ｍｍの電磁波シールド性フィルムを用意し、ＫＥＣ法により電磁波シールド性（電界）測定を行った。評価基準は以下の通りである。
◎：周波数１ＧＨｚにおける電磁波シールド性が６０ｄＢ以上
○：周波数１ＧＨｚにおける電磁波シールド性が５０ｄＢ以上６０ｄＢ未満
△：周波数１ＧＨｚにおける電磁波シールド性が４０ｄＢ以上５０ｄＢ未満
×：周波数１ＧＨｚにおける電磁波シールド性が４０ｄＢ未満
(1) Electromagnetic shielding properties An electromagnetic shielding film having a width of 20 cm and a length of 20 mm was prepared, and electromagnetic shielding properties (electric field) were measured by the KEC method. The evaluation criteria are as follows.
A: Electromagnetic wave shielding property at a frequency of 1 GHz is 60 dB or more. O: Electromagnetic wave shielding property at a frequency of 1 GHz is 50 dB or more and less than 60 dB.
（２）接着力
幅１０ｍｍ、長さ７０ｍｍの電磁波シールド性フィルムを用意し、電磁波シールド性フィルムの導電層側と厚さが５０μｍのポリイミドフィルムとを貼り合せた。そして、１５０℃、１．０ＭＰａ、１０ｍｉｎの条件で圧着し、引っ張り速度５０ｍｍ／ｍｉｎ、剥離角度９０°で、電磁波シールド性フィルムの導電層とポリイミドフィルム間の接着力（Ｎ／ｃｍ）を測定した。評価基準は以下の通りである。
○：接着力が３Ｎ／ｃｍ以上
△：接着力が２Ｎ／ｃｍ以上３Ｎ／ｃｍ未満
×：接着力が２Ｎ／ｃｍ未満
(2) Adhesive force An electromagnetic shielding film having a width of 10 mm and a length of 70 mm was prepared, and the conductive layer side of the electromagnetic shielding film and a polyimide film having a thickness of 50 μm were bonded together. Then, pressure bonding was performed under conditions of 150 ° C., 1.0 MPa, and 10 min, and the adhesive force (N / cm) between the conductive layer of the electromagnetic wave shielding film and the polyimide film was measured at a pulling speed of 50 mm / min and a peeling angle of 90 °. . The evaluation criteria are as follows.
○: Adhesive strength of 3 N / cm or more Δ: Adhesive force of 2 N / cm or more and less than 3 N / cm ×: Adhesion force of less than 2 N / cm
（３）耐屈曲性
幅６ｍｍ、長さ１２０ｍｍの電磁波シールド性フィルムの導電層側を、別に作製したフレキシブルプリント配線板（厚み２５μｍのポリイミドフィルム上に、厚み１２μｍの銅箔からなる回路パターンが形成されており、さらに回路パターン上に、接着剤付きの、厚み４０μｍのカバーフィルムが積層されてなる配線板）のカバーフィルム面に１５０℃、１ＭＰａ、３０ｍｉｎの条件で圧着させた。
次いで、曲率半径０．３８ｍｍ、荷重５００ｇ、速度１８０回／ｍｉｎの条件でＭＩＴ屈曲試験機にかけ、回路パターンが断線するまでの回数により耐屈曲性を評価した。評価基準は以下の通りである。
○：４０００回以上
△：２０００回以上４０００回未満
×：２０００回未満
(3) Bending resistance A flexible printed wiring board prepared separately on the conductive layer side of the electromagnetic shielding film having a width of 6 mm and a length of 120 mm (a circuit pattern made of a copper foil having a thickness of 12 μm is formed on a polyimide film having a thickness of 25 μm. Furthermore, it was pressure-bonded to the cover film surface of a circuit board (wiring board in which a cover film with a thickness of 40 μm with an adhesive was laminated) on a circuit pattern under the conditions of 150 ° C., 1 MPa, and 30 min.
Subsequently, the bending resistance was evaluated by the number of times until the circuit pattern was disconnected by applying the MIT bending tester under conditions of a curvature radius of 0.38 mm, a load of 500 g, and a speed of 180 times / min. The evaluation criteria are as follows.
○: 4000 times or more Δ: 2000 times or more and less than 4000 times ×: less than 2000 times
Claims (3)
前記導電層の厚みが２μｍ以上、１０μｍ以下であり、
前記導電層が、レーザー回折法により測定した５０％粒子径が１μｍ以上、２０μｍ以下であり、かさ密度が０．２ｇ／ｃｍ3以上、０．７ｇ／ｃｍ3以下であるフレーク状銀粉を含む電磁波シールド性フィルム。 An electromagnetic wave shielding film having an insulating layer and a conductive layer and having an electromagnetic wave shielding property at a frequency of 1 GHz in the KEC method of 40 to 90 dB,
The conductive layer has a thickness of 2 μm or more and 10 μm or less,
Electromagnetic wave containing flaky silver powder in which the conductive layer has a 50% particle diameter of 1 μm or more and 20 μm or less measured by a laser diffraction method and a bulk density of 0.2 g / cm 3 or more and 0.7 g / cm 3 or less. Shielding film.
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| JP5726048B2 (en) * | 2011-11-14 | 2015-05-27 | 藤森工業株式会社 | Electromagnetic wave shielding material for FPC |
| KR102017121B1 (en) | 2012-03-06 | 2019-09-02 | 토요잉크Sc홀딩스주식회사 | Conductive fine particles, method for manufacturing same, conductive resin composition, conductive sheet, and electromagnetic shielding sheet |
| CN105744818A (en) * | 2016-02-03 | 2016-07-06 | 中电海康集团有限公司 | Flexible magnetic shielding and anti-irradiation film |
| CN107787111A (en) * | 2016-08-25 | 2018-03-09 | 上海逻骅投资管理合伙企业（有限合伙） | Substrate for printed circuit board and its manufacture method |
| JP2021061365A (en) * | 2019-10-09 | 2021-04-15 | 信越ポリマー株式会社 | Electromagnetic wave shield film, circuit board, and manufacturing method thereof |
| WO2022009960A1 (en) | 2020-07-08 | 2022-01-13 | 株式会社ダイセル | Resin molded body, and method for manufacturing same |
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| JP2003055701A (en) * | 2001-08-10 | 2003-02-26 | Fukuda Metal Foil & Powder Co Ltd | Silver powder for conductive paste and its manufacturing method and conductive paste using the silver powder |
| JP2004022568A (en) * | 2002-06-12 | 2004-01-22 | Nishizaki:Kk | Electromagnetic wave shielding member having negative ion effect |
| JP2006007589A (en) * | 2004-06-25 | 2006-01-12 | Sumitomo Electric Printed Circuit Inc | Laminated film with metallic film and adhesive layer and method for manufacturing laminated film |
| JP2007207567A (en) * | 2006-02-01 | 2007-08-16 | Fujikura Kasei Co Ltd | Conductive paste and method of manufacturing conductive circuit |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019065379A1 (en) | 2017-09-27 | 2019-04-04 | Ｄｏｗａエレクトロニクス株式会社 | Silver powder mixture, method for producing same, and conductive paste |
| KR20200061387A (en) | 2017-09-27 | 2020-06-02 | 도와 일렉트로닉스 가부시키가이샤 | Silver powder compound and its manufacturing method and conductive paste |
| US11413685B2 (en) | 2017-09-27 | 2022-08-16 | Dowa Electronics Materials Co., Ltd. | Silver powder mixture, method for producing same, and conductive paste |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110031100A (en) | 2011-03-24 |
| JP2011086930A (en) | 2011-04-28 |
| TW201121405A (en) | 2011-06-16 |
| CN102026530A (en) | 2011-04-20 |
| CN102026530B (en) | 2015-09-30 |
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