CN107787111A - Substrate for printed circuit board and its manufacture method - Google Patents
Substrate for printed circuit board and its manufacture method Download PDFInfo
- Publication number
- CN107787111A CN107787111A CN201610728395.6A CN201610728395A CN107787111A CN 107787111 A CN107787111 A CN 107787111A CN 201610728395 A CN201610728395 A CN 201610728395A CN 107787111 A CN107787111 A CN 107787111A
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- Prior art keywords
- substrate
- circuit board
- printed circuit
- layer
- electro
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention provides a kind of substrate for printed circuit board and its manufacture method, and substrate for printed circuit board includes at least two layer structures, and at least two layer structures include metal foil layer and the electro-magnetic screen layer being arranged on metal foil layer.The present invention sets electro-magnetic screen layer on substrate for printed circuit board, compared with prior art, eliminates on future printed circuit board (PCB) the process of additional electromagnetic shield layer in addition so that the thickness of printed circuit board (PCB) is thinning, simplifies production process again, reduces production cost.
Description
Technical field
The present invention relates to printed circuit board material field, more particularly to a kind of substrate for printed circuit board and its manufacturer
Method.
Background technology
Between the power equipment of various operations in a manner of three kinds of electromagnetic conductive, electromagnetic induction and electromagnetic radiation it is associated with each other simultaneously
Influence each other, the equipment of operation and personnel can be interfered, influenceed and endangered under certain conditions.Internet appliance product is all
Noise can be produced because of high-frequency electromagnetic wave interference, influence communication quality., may be easily if human body is exposed to powerful electromagnetic off field for a long time
Cancer stricken lesion.Therefore anti-electromagnetic interference has been indispensable and imperative processing procedure.
Printed circuit board (PCB) is the supplier of electronic component electrical connection, and substrate for printed circuit board comprises at least substrate and gold
Belong to layers of foil.Major advantage using circuit board is to greatly reduce the mistake of wiring and assembling, improves the gentle production of Automated water
Work rate.In order to meet the requirement of Electro Magnetic Compatibility, it usually needs additional layer electro-magnetic screen layer on a printed circuit, protection
Circuit is not by external interference in wiring board.Which not only improves manufacturing cost, also add the thickness of final finished.
The content of the invention
In view of the above the shortcomings that prior art, it is an object of the invention to provide a kind of substrate for printed circuit board and its
Manufacture method, for solving the above-mentioned problems in the prior art.
In order to solve the above-mentioned technical problem, the present invention provides a kind of substrate for printed circuit board, including at least two stratiform knots
Structure, at least two layer structure include metal foil layer and the electro-magnetic screen layer being arranged on the metal foil layer.
The present invention regard electro-magnetic screen layer as substrate, while electro-magnetic screen layer is again with the function being electromagnetically shielded, and existing
Structure is compared, and the present invention sets electro-magnetic screen layer on substrate for printed circuit board, is eliminated and is added on a printed circuit in the future
The process of electro-magnetic screen layer so that the thickness of printed circuit board (PCB) is thinning, simplifies production process again, reduces production cost.
Preferably, the electro-magnetic screen layer is magnetic glue-line；The magnetic glue-line includes multiple magnetic particles and polymeric material.
Further, the magnetic particle is comprising in Fe, Si, B, Cu, Nb, Mo, Cr, Co, Ni, Mg, Zn, K, Ca, Al
Element binary or ternary non-retentive alloy particle.
Further, the magnetic particle is soft magnetic ferrite particle, in each soft magnetic ferrite particle comprising Mn,
At least one of Zn, Ni, Mg, Ba, Co, Y, Al, Zr, Si, Ca, Bi, Ti element.
Further, the relative permeability of the magnetic glue-line is 20-220.
Preferably, the thickness of the electro-magnetic screen layer is 20-500 μm.
Preferably, the substrate for printed circuit board also includes the insulated substrate being arranged on the electro-magnetic screen layer.Insulation
The setting of basic unit can increase the intensity of printed circuit board (PCB).
Further, the insulated substrate is epoxy glass-fiber-fabric substrate, polyester film, Kapton, polymerizable mesogenic
Thing film, polyphenylene oxide film, polyesterimide film, fluorine carbon vinyl film, sub- nylon paper, polyvinyl chloride film, poly- four
Fluoroethylene film, polyvinyl chloride film or polybutylene terephthalate film.
Further, the substrate for printed circuit board also includes tack coat, and the tack coat is arranged at the metal foil layer
Between the electro-magnetic screen layer, and/or the tack coat is arranged between the metal foil layer and the insulated substrate, and/
Or the tack coat is arranged between the electro-magnetic screen layer and the insulated substrate.The setting of tack coat can make adjacent layer
Shape construction bonds obtain more firm.
Further, the tack coat is polyester-class adhesive, acrylic tackifier, epoxies adhesive, modification
Epoxies adhesive, polyimide adhesive or phenolic aldehyde-butyral class adhesive.
The invention further relates to a kind of manufacture method of substrate for printed circuit board, by least two described layer structures successively
After superposition, by lamination process into substrate for printed circuit board.
The substrate for printed circuit board of the present invention can be machined by lamination, use printed circuit made from this base material
Plate had both had the use function of traditional printed circuit board (PCB), carried electro-magnetic screen function again, the electromagnetism for solving electronic equipment is done
Problem is disturbed, simplifies production process, reduces production cost, and be thinned the thickness of printed circuit board (PCB).
Brief description of the drawings
Fig. 1 is shown as the structural representation of the substrate for printed circuit board of embodiment 1.
Fig. 2 is shown as the structural representation of the substrate for printed circuit board of embodiment 2.
Fig. 3 is shown as the structural representation of the substrate for printed circuit board of embodiment 3.
Fig. 4 is shown as the structural representation of the substrate for printed circuit board of embodiment 4.
Fig. 5 is shown as the structural representation of the substrate for printed circuit board of embodiment 5.
Fig. 6 is shown as the structural representation of the substrate for printed circuit board of embodiment 6.
Fig. 7 is shown as the structural representation of the substrate for printed circuit board of embodiment 7.
Fig. 8 is shown as the structural representation of the substrate for printed circuit board of embodiment 8.
Fig. 9 is shown as the structural representation of the substrate for printed circuit board of embodiment 9.
Drawing reference numeral explanation
100 metal foil layers
200 electro-magnetic screen layers
300 insulated substrates
400 tack coats
Embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this explanation
Content disclosed by book understands other advantages and effect of the present invention easily.
Refer to accompanying drawing.It should be clear that structure, ratio, size depicted in this specification institute accompanying drawings etc., only coordinating
Content disclosed in specification, so that those skilled in the art understands and reads, it is enforceable to be not limited to the present invention
Qualifications, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size,
Do not influence under the effect of present invention can be generated and the purpose that can reach, all should still fall in disclosed technology contents
Obtain in the range of covering.Meanwhile cited such as " on ", " under ", "left", "right", " centre " and " one " in this specification
Term, be merely convenient to understanding for narration, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or
Adjustment, in the case where changing technology contents without essence, when being also considered as the enforceable category of the present invention.
As shown in Figures 1 to 9, the substrate for printed circuit board of the present embodiment, including at least two layer structures, at least two
Layer structure includes metal foil layer 100 and the electro-magnetic screen layer 200 being arranged on metal foil layer 100.
The present invention is using electro-magnetic screen layer 200 as substrate, while electro-magnetic screen layer 200 has the function of electromagnetic shielding again,
Compared with existing structure, the present invention sets electro-magnetic screen layer 200 on substrate for printed circuit board, eliminates in the future in printed circuit
The process of additional electromagnetic shield layer 200 on plate so that the thickness of printed circuit board (PCB) is thinning, simplifies production process again, reduces production
Cost.
Electro-magnetic screen layer 200 is magnetic glue-line；Magnetic glue-line includes multiple magnetic particles and polymeric material.Magnetic in magnetic glue-line
Property particle there is high relative permeability low loss characteristic, can effectively suppress electronic equipment electromagnetic interference, eliminate electromagnetic noise.
Magnetic particle be the binary comprising the element in Fe, Si, B, Cu, Nb, Mo, Cr, Co, Ni, Mg, Zn, K, Ca, Al or
Ternary non-retentive alloy particle；Or magnetic particle is soft magnetic ferrite particle, is included in each soft magnetic ferrite particle
At least one of Mn, Zn, Ni, Mg, Ba, Co, Y, Al, Zr, Si, Ca, Bi, Ti element.
Polymeric material is used to bond multiple magnetic particles, forms magnetic glue-line, and polymeric material is epoxy resin, epoxy
Resin mold plastics or polyurethane.
The relative permeability of electro-magnetic screen layer is 20-220, and substrate for printed circuit board can be made to meet printed circuit board (PCB) suppression
The requirement of electronic equipment electromagnetic interference；Electro-magnetic screen layer 200 can use the magnetic glue bought on the market, such as the electricity of former nation science and technology
Magnetic noise suppresses piece series magnetic glue, and its relative permeability is 20-220 (being 3MHz measurements in frequency).
Substrate for printed circuit board also includes the insulated substrate 300 being arranged on electro-magnetic screen layer 200.Insulated substrate 300
The intensity of printed circuit board (PCB) can be increased by setting.
Insulated substrate 300 is epoxy glass-fiber-fabric substrate, polyester film, Kapton, liquid crystal polymer film, polyphenyl
Ether film, polyesterimide film, fluorine carbon vinyl film, sub- nylon paper, polyvinyl chloride film, polytetrafluoroethylene film,
Polyvinyl chloride film or polybutylene terephthalate film.
Printed circuit board (PCB) also includes tack coat 400, tack coat 400 be arranged at metal foil layer 100 and electro-magnetic screen layer 200 it
Between, and/or tack coat 400 is arranged between metal foil layer 100 and insulated substrate 300, and/or tack coat 400 is arranged at electromagnetism
Between screen layer 200 and insulated substrate 300.The setting of tack coat 400 can make adjacent layer structure more firmly cohesive.
Tack coat is polyester-class adhesive, acrylic tackifier, epoxies adhesive, modified epoxy class adhesive, poly-
Acid imide adhesive or phenolic aldehyde-butyral class adhesive.
The thickness of magnetic glue-line is 20-500 μm；The thickness of copper foil is 8-105um, and the thickness of tack coat 400 is 5-50um, absolutely
The thickness of edge basic unit 300 is 5-500 μm；Different thickness is used according to each layer structure is actually needed, can be manufactured into
Different substrate for printed circuit board.
The invention further relates to a kind of manufacture method of substrate for printed circuit board, by least two layer structures be successively superimposed
Afterwards, by lamination process into substrate for printed circuit board.
By at least two layer structures be successively superimposed before, first the surface of each layer structure is cleaned；
The step of lamination：
After at least two layer structures are successively superimposed, first preheat, and precompressed is carried out by laminating machine, then heat up, afterwards,
Laminator pressures are raised, after completing the lamination boosted at least two layer structures, carry out heat-insulation pressure keeping；Finally, cool
Molded after to room temperature.
When printed circuit board (PCB) also includes tack coat 400, the pre-heat treatment need to meet the use rule of the material of tack coat 400
Model.
The substrate for printed circuit board of the present invention can be machined by being simply laminated, and use print made from this base material
Printed circuit board had both had the use function of traditional printed circuit board (PCB), carries electro-magnetic screen function again, solves electronic equipment
Electromagnetic interference problem, production process is simplified, reduce production cost, and be thinned the thickness of printed circuit board (PCB).
Embodiment 1
As shown in figure 1, in the present embodiment, substrate for printed circuit board includes two Rotating fields, and two Rotating fields are metal foil
Layer 100 and the electro-magnetic screen layer 200 being arranged on metal foil layer 100.Metal foil layer 100 is electrolytic copper foil, metal foil layer 100
Thickness 12um, the thickness of electro-magnetic screen layer 200 is 100 μm, and electro-magnetic screen layer 200 is that relative permeability is 40 (to be in frequency
3MHz measure) magnetic glue；
The manufacture method of the substrate for printed circuit board of the present embodiment, comprises the following steps：
1) after the surface cleaning of electro-magnetic screen layer 200, electro-magnetic screen layer 200 and metal foil layer 100 are stacked together, gold
The mat surface of category layers of foil 100 contacts with electro-magnetic screen layer 200；
2) polyethylene terephthalate is padded successively in the side of the remote electro-magnetic screen layer 200 of metal foil layer 100
Film and brown paper, polyethylene terephthalate is padded successively in the side of the remote metal foil layer 100 of electro-magnetic screen layer 200
Ester film and brown paper；Then two Rotating fields are loaded between two pressing plates of laminating machine；
3) when two pressing plates are suppressed, preload pressure 0.7Mpa, 5 DEG C/min of programming rate, when being warming up to 150 DEG C
Afterwards, 2Mpa, heat-insulation pressure keeping 30min are boosted to；Then, after being cooled to room temperature with 5 DEG C/min speed, die sinking.
What the present embodiment manufactured is the substrate for printed circuit board with electro-magnetic screen function that one side covers copper.
Embodiment 2
As shown in Fig. 2 the substrate for printed circuit board of the present embodiment and the difference of embodiment 1 are that the present embodiment is in electromagnetism
The side of the remote metal foil layer 100 of screen layer 200 is additionally provided with another metal foil layer 100, forms three Rotating fields, another
The material of metal foil layer 100 is electrolytic copper foil.The outermost layer of the present embodiment substrate for printed circuit board is metal foil layer 100, is
Double-sided printed-circuit board base material.
Embodiment 3
As shown in figure 3, the substrate for printed circuit board of the present embodiment and the difference of embodiment 2 are, electro-magnetic screen layer 200 with
Tack coat 400 is equipped between the metal foil layer 100 of both sides, forms five Rotating fields.The material of tack coat 400 is polyurethane.
The outermost layer of the present embodiment substrate for printed circuit board is metal foil layer 100, is double-sided printed-circuit board base material.
Embodiment 4
As shown in figure 4, the substrate for printed circuit board of the present embodiment and the difference of embodiment 3 are, one of tack coat
Insulated substrate 300 is provided between 400 and metal foil layer 100, forms six Rotating fields, the material of insulated substrate 300 is sub- for polyamides
Amine film.The outermost layer of the present embodiment substrate for printed circuit board is metal foil layer 100, is double-sided printed-circuit board base material.
Embodiment 5
As shown in figure 5, in the present embodiment, substrate for printed circuit board includes three Rotating fields, three Rotating fields be respectively according to
Metal foil layer 100, tack coat 400 and the electro-magnetic screen layer 200 of secondary setting, wherein, metal foil layer 100 is electrolytic copper foil, thickness
For 18um；The thickness of electro-magnetic screen layer 200 is 30 μm, and electro-magnetic screen layer 200 (is in frequency for 200 from relative permeability
3MHz test) magnetic glue；Tack coat 400 is epoxy resin prepreg, and the thickness of tack coat 400 is 20um.
The manufacture method of the substrate for printed circuit board of the present embodiment, comprises the following steps：
1) after the surface cleaning of electro-magnetic screen layer 200, tack coat 400 is stacked successively in the upper surface of electro-magnetic screen layer 200
With metal foil layer 100, the mat surface of metal foil layer 100 contacts with tack coat 400；
2) Kapton and brown paper are padded successively in the side of the remote tack coat 400 of metal foil layer 100, in electricity
Kapton and brown paper are padded successively in the side of the remote tack coat 400 of magnetic masking layer 200；Then by three Rotating fields
It is loaded between two pressing plates of laminating machine；
3) when two pressing plates are suppressed, preload pressure 0.7Mpa, 5 DEG C/min of programming rate, when being warming up to 180 DEG C
Afterwards, 7-8min is kept, then carries out squish 1min, then boosts to 2Mpa, heat-insulation pressure keeping 60min；Then, with 5 DEG C/min speed
After degree is cooled to room temperature, die sinking.
The present embodiment manufacture is the substrate for printed circuit board with electro-magnetic screen function that one side covers copper, saturation induction
Intensity is 1.2T, and shielding attenuation value is 70dB (being 3MHz tests in frequency).
Embodiment 6
As shown in fig. 6, the substrate for printed circuit board of the present embodiment and the difference of embodiment 5 are, electro-magnetic screen layer 200
Side away from tack coat 400 is sequentially provided with another tack coat 400 and insulated substrate 300, forms five Rotating fields；Another
Tack coat 400 and the material of insulated substrate 300 are respectively epoxy resin prepreg and polyimide film.
Embodiment 7
As shown in fig. 7, in the present embodiment, substrate for printed circuit board includes five Rotating fields, five Rotating fields be respectively according to
Metal foil layer 100, tack coat 400, insulated substrate 300, tack coat 400 and the electro-magnetic screen layer 200 of secondary setting, wherein, metal
Layers of foil 100 is electrolytic copper foil, thickness 18um；The thickness of electro-magnetic screen layer 200 is 30 μm of magnetic glue, electro-magnetic screen layer 200
Relative permeability is the magnetic glue of 200 (being 3MHz tests in frequency)；The material of tack coat 400 is acrylic tackifier, is bonded
The thickness of layer 400 is 10m；Insulated substrate 300 is Kapton, and the thickness of insulated substrate 300 is 10um.
The manufacture method of the substrate for printed circuit board of the present embodiment, comprises the following steps：
1) after the surface cleaning of electro-magnetic screen layer 200, stacked successively in the upper surface of electro-magnetic screen layer 200 tack coat 400,
Insulated substrate 300, tack coat 400 and metal foil layer 100, the mat surface of metal foil layer 100 contact with tack coat 400；
2) pet film is padded successively in the side of the remote tack coat 400 of metal foil layer 100
And brown paper, pet film is padded successively in the side of the remote tack coat 400 of electro-magnetic screen layer 200
And brown paper；Then five Rotating fields are loaded between two pressing plates of laminating machine；
3) when two pressing plates are suppressed, preload pressure 0.7Mpa, 5 DEG C/min of programming rate, when being warming up to 150 DEG C
Afterwards, 7-8min is kept, then carries out squish 1min, then boosts to 2Mpa, heat-insulation pressure keeping 30min；Then, with 5 DEG C/min speed
After degree is cooled to room temperature, die sinking.
What the present embodiment manufactured is the substrate for printed circuit board saturation induction with electro-magnetic screen function that one side covers copper
Intensity is 1.2T, and shielding attenuation value is 70dB (being 3MHz tests in frequency).
Embodiment 8
As shown in figure 8, in the present embodiment, substrate for printed circuit board includes seven Rotating fields, seven Rotating fields be respectively according to
Metal foil layer 100, tack coat 400, insulated substrate 300, tack coat 400, electro-magnetic screen layer 200, the and of tack coat 400 of secondary setting
Metal foil layer 100, wherein, the metal foil layer 100 close to insulated substrate 300 is electrolytic copper foil, thickness 18um；Close to electromagnetic screen
The metal foil layer 100 for covering layer 200 is electrolytic copper foil, thickness 35um；The outermost layer of the present embodiment printed circuit board (PCB) is metal
Layers of foil 100, it is double-sided printed-circuit board.
The thickness of electro-magnetic screen layer 200 is 30 μm of magnetic glue, and the relative permeability of electro-magnetic screen layer 200 is for 200 (in frequency
For 3MHz test) magnetic glue.
The material of tack coat 400 between metal foil layer 100 thick 18um and insulated substrate 300 is gluing for acrylic compounds
Agent, the thickness of the tack coat 400 between metal foil layer 100 and insulated substrate 300 is 10m；Metal foil layer 100 thick 35um and electricity
The material of tack coat 400 between magnetic masking layer 200 is acrylic tackifier, between metal foil layer 100 and insulated substrate 300
The thickness of tack coat 400 be 10m；
Insulated substrate 300 is Kapton, and the thickness of insulated substrate 300 is 10um；
Volume tack coat 400 is epoxy resin prepreg between insulated substrate 300 and electro-magnetic screen layer 200, prepreg
Thickness be 20um.
The manufacture method of the substrate for printed circuit board of the present embodiment, comprises the following steps：
1) it is after the surface cleaning of electro-magnetic screen layer 200, the metal foil layer 100 after 18um is coarse upwardly, after 18um
The upper surface of metal foil layer 100 stack tack coat 400, insulated substrate 300, tack coat 400, electro-magnetic screen layer 200, viscous successively
Tie layer 400 and the metal foil layer 100 of 35um thickness；
2) poly terephthalic acid second two is padded in the side of the remote tack coat 400 of the metal foil layer 100 after 18um successively
Alcohol ester film and brown paper, poly- terephthaldehyde is padded successively in the side of the remote tack coat 400 of metal foil layer 100 thick 35um
Sour glycol ester film and brown paper；Then seven Rotating fields are loaded between two pressing plates of laminating machine；
3) when two pressing plates are suppressed, precompressed temperature is 150 DEG C, preload pressure 0.7Mpa, squeeze time 7-
8min, squish 1min after precompressed, then boost to 2Mpa, heat-insulation pressure keeping 60min；Finally, room is cooled to 5 DEG C/min speed
Wen Hou, die sinking.
The present embodiment manufacture is the substrate for printed circuit board with electro-magnetic screen function that one side covers copper, saturation induction
Intensity is 1.2T, and shielding attenuation value is 70dB (being 3MHz tests in frequency).
Embodiment 9
As shown in figure 9, the substrate for printed circuit board of the present embodiment and the difference of embodiment 9 are that electro-magnetic screen layer 200 is remote
From being provided with another tack coat 400 and another insulated substrate 300 between the side of insulated substrate 300 and tack coat 400, wherein
Another insulated substrate 300 compared with another tack coat 400 closer to metal foil layer 100.The material of another tack coat 400 is
Acrylic tackifier；The material of another insulated substrate 300 is Kapton.The present embodiment substrate for printed circuit board
Outermost layer is metal foil layer 100, is double-sided printed-circuit board base material.
To sum up, the present invention effectively overcomes various shortcoming of the prior art and has high industrial utilization.
The above-described embodiments merely illustrate the principles and effects of the present invention, not for the limitation present invention.It is any ripe
Know the personage of this technology all can carry out modifications and changes under the spirit and scope without prejudice to the present invention to above-described embodiment.Cause
This, those of ordinary skill in the art is complete without departing from disclosed spirit and institute under technological thought such as
Into all equivalent modifications or change, should by the present invention claim be covered.
Claims (11)
- A kind of 1. substrate for printed circuit board, it is characterised in that：Including at least two layer structures, at least two layer structure Including metal foil layer and the electro-magnetic screen layer being arranged on the metal foil layer.
- 2. substrate for printed circuit board according to claim 1, it is characterised in that：The electro-magnetic screen layer is magnetic glue-line；Institute State magnetic glue-line and include multiple magnetic particles and polymeric material.
- 3. substrate for printed circuit board according to claim 2, it is characterised in that：The magnetic particle be comprising Fe, Si, B, The binary or ternary non-retentive alloy particle of element in Cu, Nb, Mo, Cr, Co, Ni, Mg, Zn, K, Ca, Al.
- 4. substrate for printed circuit board according to claim 2, it is characterised in that：The magnetic particle is soft magnetic ferrite Particle, include in Mn, Zn, Ni, Mg, Ba, Co, Y, Al, Zr, Si, Ca, Bi, Ti at least in each soft magnetic ferrite particle A kind of element.
- 5. substrate for printed circuit board according to claim 2, it is characterised in that：The relative permeability of the magnetic glue-line is 20-220。
- 6. substrate for printed circuit board according to claim 1, it is characterised in that：The thickness of the electro-magnetic screen layer is 20- 500μm。
- 7. substrate for printed circuit board according to claim 1, it is characterised in that：Also include being arranged at the electro-magnetic screen layer On insulated substrate.
- 8. substrate for printed circuit board according to claim 7, it is characterised in that：The insulated substrate is epoxy glass fiber fabric base Plate, polyester film, Kapton, liquid crystal polymer film, polyphenylene oxide film, polyesterimide film, fluorine carbon ethene are thin Film, sub- nylon paper, polyvinyl chloride film, polytetrafluoroethylene film, polyvinyl chloride film or polybutylene terephthalate are thin Film.
- 9. substrate for printed circuit board according to claim 7, it is characterised in that：Also include tack coat, the tack coat is set Be placed between the metal foil layer and the electro-magnetic screen layer, and/or the tack coat be arranged at the metal foil layer with it is described Between insulated substrate, and/or the tack coat is arranged between the electro-magnetic screen layer and the insulated substrate.
- 10. substrate for printed circuit board according to claim 9, it is characterised in that：The tack coat be polyester-class adhesive, Acrylic tackifier, epoxies adhesive, modified epoxy class adhesive, polyimide adhesive or phenolic aldehyde-butyral Class adhesive.
- A kind of 11. manufacture method of substrate for printed circuit board, it is characterised in that：By at least two stratiforms described in claim 1 After structure is successively superimposed, by lamination process into substrate for printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610728395.6A CN107787111A (en) | 2016-08-25 | 2016-08-25 | Substrate for printed circuit board and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610728395.6A CN107787111A (en) | 2016-08-25 | 2016-08-25 | Substrate for printed circuit board and its manufacture method |
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| Publication Number | Publication Date |
|---|---|
| CN107787111A true CN107787111A (en) | 2018-03-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610728395.6A Pending CN107787111A (en) | 2016-08-25 | 2016-08-25 | Substrate for printed circuit board and its manufacture method |
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| CN111902036B (en) * | 2020-08-12 | 2023-09-22 | 宁波磁性材料应用技术创新中心有限公司 | Electromagnetic wave noise suppression sheet and high-frequency electronic equipment |
| CN114300232A (en) * | 2021-12-30 | 2022-04-08 | Oppo广东移动通信有限公司 | Inductor, circuit board integrated inductor, power management chip and electronic equipment |
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