JP2015073105A5 - - Google Patents

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Publication number
JP2015073105A5
JP2015073105A5 JP2014222568A JP2014222568A JP2015073105A5 JP 2015073105 A5 JP2015073105 A5 JP 2015073105A5 JP 2014222568 A JP2014222568 A JP 2014222568A JP 2014222568 A JP2014222568 A JP 2014222568A JP 2015073105 A5 JP2015073105 A5 JP 2015073105A5
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JP
Japan
Prior art keywords
electromagnetic wave
wave shielding
shielding film
conductive layer
particle diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014222568A
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Japanese (ja)
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JP2015073105A (en
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Publication date
Application filed filed Critical
Priority to JP2014222568A priority Critical patent/JP2015073105A/en
Priority claimed from JP2014222568A external-priority patent/JP2015073105A/en
Publication of JP2015073105A publication Critical patent/JP2015073105A/en
Publication of JP2015073105A5 publication Critical patent/JP2015073105A5/ja
Pending legal-status Critical Current

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Claims (3)

絶縁層と、導電層とを含む、ＫＥＣ法における周波数１ＧＨｚでの電磁波シールド性が４０〜９０ｄＢである電磁波シールド性フィルムであって、
ポリイミドフィルムに対する接着力が２Ｎ／ｃｍ以上であり、かつ
前記導電層が、レーザー回折法により測定した５０％粒子径が１μｍ以上、２０μｍ以下であり、かさ密度が０．２ｇ／ｃｍ3以上、０．７ｇ／ｃｍ3以下であるフレーク状銀粉を含む電磁波シールド性フィルム。 An electromagnetic wave shielding film having an insulating layer and a conductive layer and having an electromagnetic wave shielding property at a frequency of 1 GHz in the KEC method of 40 to 90 dB,
The adhesive force to the polyimide film is 2 N / cm or more, and the conductive layer has a 50% particle diameter of 1 μm or more and 20 μm or less as measured by a laser diffraction method, and a bulk density of 0.2 g / cm 3 or more, 0 Electromagnetic wave shielding film containing flaky silver powder of 0.7 g / cm 3 or less. フレーク状銀粉のレーザー回折法により測定した５０％粒子径が、導電層の厚さより大きいことを特徴とする請求項１記載の電磁波シールドフィルム。2. The electromagnetic wave shielding film according to claim 1, wherein the 50% particle diameter of the flaky silver powder measured by a laser diffraction method is larger than the thickness of the conductive layer. 請求項１または２に記載された電磁波シールド性フィルムを備える配線板。   A wiring board provided with the electromagnetic wave shielding film according to claim 1.
JP2014222568A 2009-09-18 2014-10-31 Electromagnetic wave shielding film, and wiring board Pending JP2015073105A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014222568A JP2015073105A (en) 2009-09-18 2014-10-31 Electromagnetic wave shielding film, and wiring board

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009216317 2009-09-18
JP2009216317 2009-09-18
JP2014222568A JP2015073105A (en) 2009-09-18 2014-10-31 Electromagnetic wave shielding film, and wiring board

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2010208686A Division JP2011086930A (en) 2009-09-18 2010-09-17 Electromagnetic wave shielding film and wiring board

Publications (2)

Publication Number Publication Date
JP2015073105A JP2015073105A (en) 2015-04-16
JP2015073105A5 true JP2015073105A5 (en) 2015-10-01

Family

ID=43867163

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010208686A Pending JP2011086930A (en) 2009-09-18 2010-09-17 Electromagnetic wave shielding film and wiring board
JP2014222568A Pending JP2015073105A (en) 2009-09-18 2014-10-31 Electromagnetic wave shielding film, and wiring board

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2010208686A Pending JP2011086930A (en) 2009-09-18 2010-09-17 Electromagnetic wave shielding film and wiring board

Country Status (4)

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JP (2) JP2011086930A (en)
KR (1) KR20110031100A (en)
CN (1) CN102026530B (en)
TW (1) TW201121405A (en)

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JP5726048B2 (en) * 2011-11-14 2015-05-27 藤森工業株式会社 Electromagnetic wave shielding material for FPC
CN104170023B (en) 2012-03-06 2016-12-28 东洋油墨Sc控股株式会社 Electrically conductive microparticle and manufacture method, electroconductive resin constituent, conductive sheet and electromagnetic shielding sheet
CN105744818A (en) * 2016-02-03 2016-07-06 中电海康集团有限公司 Flexible magnetic shielding and anti-irradiation film
CN107787111A (en) * 2016-08-25 2018-03-09 上海逻骅投资管理合伙企业（有限合伙） Substrate for printed circuit board and its manufacture method
CN111148586B (en) 2017-09-27 2022-12-02 同和电子科技有限公司 Silver powder mixture, method for producing same, and conductive paste
JP2021061365A (en) * 2019-10-09 2021-04-15 信越ポリマー株式会社 Electromagnetic wave shield film, circuit board, and manufacturing method thereof
WO2022009960A1 (en) 2020-07-08 2022-01-13 株式会社ダイセル Resin molded body, and method for manufacturing same
JPWO2023127873A1 (en) 2021-12-27 2023-07-06

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JP3510834B2 (en) * 2000-01-28 2004-03-29 株式会社巴川製紙所 Conductive adhesive composition, conductive adhesive sheet, electromagnetic wave shielding material, and flexible printed circuit board using the same
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