JP2011003544A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2011003544A5 JP2011003544A5 JP2010158078A JP2010158078A JP2011003544A5 JP 2011003544 A5 JP2011003544 A5 JP 2011003544A5 JP 2010158078 A JP2010158078 A JP 2010158078A JP 2010158078 A JP2010158078 A JP 2010158078A JP 2011003544 A5 JP2011003544 A5 JP 2011003544A5
- Authority
- JP
- Japan
- Prior art keywords
- resin film
- film sheet
- thickness
- thickness direction
- conductive particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Claims (11)
該樹脂フィルムシートの両表面から等距離に位置する肉厚方向の中心面が前記絶縁性の樹脂フィルム層に含まれ、前記樹脂フィルムシートの肉厚が１０乃至１６μｍの範囲であることを特徴とする樹脂フィルムシート。 A resin film sheet in which two or more layers are laminated in the thickness direction so as to include at least one layer of each of a resin film layer containing conductive particles and an insulating resin film layer,
A center plane in the thickness direction located equidistant from both surfaces of the resin film sheet is included in the insulating resin film layer, and the thickness of the resin film sheet is in the range of 10 to 16 μm. Resin film sheet.
前記導電性粒子を内在させた樹脂フィルム層は前記導電性粒子を接着性組成物に分散させた混合液を支持基材上に塗布し溶剤を除去することにより得られることを特徴とする樹脂フィルムシート。 The resin film sheet according to claim 1,
The resin film layer in which the conductive particles are incorporated is obtained by applying a mixed liquid in which the conductive particles are dispersed in an adhesive composition onto a supporting substrate and removing the solvent. Sheet.
前記導電性粒子を内在させた樹脂フィルム層の肉厚方向の厚みが、前記導電性粒子の粒子径よりも大きく、且つ、前記導電性粒子の粒子径の２倍よりも小さく設定されていることを特徴とする樹脂フィルムシート。 The resin film sheet according to claim 1 or 2 ,
The thickness direction of the thickness of the resin film layer which has internalized the conductive particles is greater than the particle diameter of the conductive particles, and, it is smaller than 2 times the particle diameter of the conductive particles A resin film sheet characterized by
前記導電性粒子を内在させた樹脂フィルム層の肉厚方向の厚みが、前記導電性粒子の粒子径よりも大きく、且つ、前記導電性粒子の粒子径の１．５倍よりも小さく設定されていることを特徴とする樹脂フィルムシート。 The resin film sheet according to claim 1 or 2 ,
The thickness in the thickness direction of the resin film layer containing the conductive particles is set to be larger than the particle diameter of the conductive particles and smaller than 1.5 times the particle diameter of the conductive particles. A resin film sheet characterized by comprising:
前記導電性粒子を内在させた樹脂フィルム層の肉厚方向の厚みが、前記導電性粒子の粒子径よりも大きく、且つ、前記導電性粒子の粒子径の１．１倍よりも小さく設定されていることを特徴とする樹脂フィルムシート。 The resin film sheet according to claim 1 or 2 ,
The thickness in the thickness direction of the resin film layer containing the conductive particles is set to be larger than the particle diameter of the conductive particles and smaller than 1.1 times the particle diameter of the conductive particles. A resin film sheet characterized by comprising:
前記絶縁性の樹脂フィルム層の肉厚方向の厚みが、前記導電性粒子を内在させた樹脂フィルム層の肉厚方向の厚みの１．５倍以上に設定されていることを特徴とする樹脂フィルムシート。 A resin film sheet according to any one of claims 1 to 5 ,
A thickness of the insulating resin film layer in the thickness direction is set to be 1.5 times or more of a thickness in the thickness direction of the resin film layer containing the conductive particles. Sheet.
前記導電性粒子を内在させた樹脂フィルム層の肉厚方向の厚みが、前記導電性粒子を内在させた樹脂フィルム層の肉厚方向の厚みの２．５倍以上に設定されていることを特徴とする樹脂フィルムシート。 A resin film sheet according to any one of claims 1 to 5 ,
Characterized in that the thickness direction of the thickness of the conductive resin film layer particles internalized the is set to more than 2.5 times the thickness direction of the thickness of the conductive resin film layer particles are inherent Resin film sheet.
前記絶縁性の樹脂フィルム層の肉厚方向の厚みが、前記導電性粒子を内在させた樹脂フィルム層の肉厚方向の厚みの３倍以上に設定されていることを特徴とする樹脂フィルムシート。 A resin film sheet according to any one of claims 1 to 5 ,
The thickness direction of the thickness of the insulating resin film layer, a resin film sheet, characterized that you have been set to more than 3 times the thickness direction of the thickness of the conductive resin film layer particles are inherent.
前記導電性粒子を内在させた樹脂フィルム層の肉厚方向の厚みが４〜８μｍであることを特徴とする樹脂フィルムシート。 A resin film sheet according to any one of claims 1 to 8 ,
Resin film sheet thickness direction of the thickness of the conductive resin film layer particles are inherent to said 4~8μm der Rukoto.
導電性粒子を内在させた樹脂フィルム層及び絶縁性の樹脂フィルム層の各層を肉厚方向に２層積層した樹脂フィルムシートであることを特徴とする樹脂フィルムシート。 A resin film sheet according to any one of claims 1 to 9 ,
Resin film was internalized conductive particle layer and the resin film sheet each layer of insulating resin film layer and said resin film sheet der Rukoto a 2-layer laminate in the thickness direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010158078A JP4766185B2 (en) | 2008-06-26 | 2010-07-12 | Resin film sheet and electronic parts |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008167454 | 2008-06-26 | ||
| JP2008167454 | 2008-06-26 | ||
| JP2010158078A JP4766185B2 (en) | 2008-06-26 | 2010-07-12 | Resin film sheet and electronic parts |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009148551A Division JP4623224B2 (en) | 2008-06-26 | 2009-06-23 | Resin film sheet and electronic parts |
Related Child Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011127062A Division JP2011198767A (en) | 2008-06-26 | 2011-06-07 | Resin film sheet and electronic component |
| JP2011127070A Division JP2011233530A (en) | 2008-06-26 | 2011-06-07 | Resin film sheet and electronic component |
| JP2011127055A Division JP2011233528A (en) | 2008-06-26 | 2011-06-07 | Resin film sheet, and electronic component |
| JP2011127061A Division JP2011233529A (en) | 2008-06-26 | 2011-06-07 | Resin film sheet and electronic part |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011003544A JP2011003544A (en) | 2011-01-06 |
| JP2011003544A5 true JP2011003544A5 (en) | 2011-05-26 |
| JP4766185B2 JP4766185B2 (en) | 2011-09-07 |
Family
ID=41495036
Family Applications (9)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009148551A Expired - Fee Related JP4623224B2 (en) | 2008-06-26 | 2009-06-23 | Resin film sheet and electronic parts |
| JP2010157782A Expired - Fee Related JP4661985B2 (en) | 2008-06-26 | 2010-07-12 | Resin film sheet and electronic parts |
| JP2010158078A Expired - Fee Related JP4766185B2 (en) | 2008-06-26 | 2010-07-12 | Resin film sheet and electronic parts |
| JP2010157800A Expired - Fee Related JP4970574B2 (en) | 2008-06-26 | 2010-07-12 | Resin film sheet and electronic parts |
| JP2010158022A Expired - Fee Related JP4661986B2 (en) | 2008-06-26 | 2010-07-12 | Resin film sheet and electronic parts |
| JP2011127055A Withdrawn JP2011233528A (en) | 2008-06-26 | 2011-06-07 | Resin film sheet, and electronic component |
| JP2011127070A Pending JP2011233530A (en) | 2008-06-26 | 2011-06-07 | Resin film sheet and electronic component |
| JP2011127061A Withdrawn JP2011233529A (en) | 2008-06-26 | 2011-06-07 | Resin film sheet and electronic part |
| JP2011127062A Withdrawn JP2011198767A (en) | 2008-06-26 | 2011-06-07 | Resin film sheet and electronic component |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009148551A Expired - Fee Related JP4623224B2 (en) | 2008-06-26 | 2009-06-23 | Resin film sheet and electronic parts |
| JP2010157782A Expired - Fee Related JP4661985B2 (en) | 2008-06-26 | 2010-07-12 | Resin film sheet and electronic parts |
Family Applications After (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010157800A Expired - Fee Related JP4970574B2 (en) | 2008-06-26 | 2010-07-12 | Resin film sheet and electronic parts |
| JP2010158022A Expired - Fee Related JP4661986B2 (en) | 2008-06-26 | 2010-07-12 | Resin film sheet and electronic parts |
| JP2011127055A Withdrawn JP2011233528A (en) | 2008-06-26 | 2011-06-07 | Resin film sheet, and electronic component |
| JP2011127070A Pending JP2011233530A (en) | 2008-06-26 | 2011-06-07 | Resin film sheet and electronic component |
| JP2011127061A Withdrawn JP2011233529A (en) | 2008-06-26 | 2011-06-07 | Resin film sheet and electronic part |
| JP2011127062A Withdrawn JP2011198767A (en) | 2008-06-26 | 2011-06-07 | Resin film sheet and electronic component |
Country Status (4)
| Country | Link |
|---|---|
| JP (9) | JP4623224B2 (en) |
| KR (8) | KR101038614B1 (en) |
| CN (4) | CN102298988B (en) |
| TW (3) | TW201013710A (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4623224B2 (en) * | 2008-06-26 | 2011-02-02 | 日立化成工業株式会社 | Resin film sheet and electronic parts |
| JP6264731B2 (en) * | 2012-03-06 | 2018-01-24 | 東洋インキＳｃホールディングス株式会社 | Conductive resin composition, conductive sheet, electromagnetic wave shielding sheet, manufacturing method thereof, and manufacturing method of conductive fine particles |
| JP6221285B2 (en) * | 2013-03-21 | 2017-11-01 | 日立化成株式会社 | Circuit member connection method |
| JP6069153B2 (en) * | 2013-09-27 | 2017-02-01 | デクセリアルズ株式会社 | Underfill material and method for manufacturing semiconductor device using the same |
| JP6645730B2 (en) * | 2014-01-28 | 2020-02-14 | デクセリアルズ株式会社 | Connection body and method for manufacturing connection body |
| JP6307308B2 (en) * | 2014-03-06 | 2018-04-04 | デクセリアルズ株式会社 | Manufacturing method of connection structure and circuit connection material |
| TWI664783B (en) * | 2014-03-31 | 2019-07-01 | 日商迪睿合股份有限公司 | Anisotropic conductive film, method for manufacturing the same, connection structure, and method for manufacturing connection structure |
| KR101737173B1 (en) | 2014-07-24 | 2017-05-17 | 삼성에스디아이 주식회사 | Anisotropic conductive films, a method for preparing the same, and semiconductive devices comprising the same |
| TWI715542B (en) * | 2014-11-12 | 2021-01-11 | 日商迪睿合股份有限公司 | Light curing anisotropic conductive adhesive, method for producing connector and method for connecting electronic components |
| JP6661886B2 (en) * | 2015-03-11 | 2020-03-11 | 日立化成株式会社 | Method for producing film-like circuit connection material and circuit member connection structure |
| KR101684144B1 (en) | 2015-07-08 | 2016-12-07 | 울산대학교 산학협력단 | High efficiency wave energy converter using continuously variable transmission and control method thereof |
| JP6327630B1 (en) | 2017-04-28 | 2018-05-23 | リンテック株式会社 | Film-like fired material, film-like fired material with support sheet, method for producing film-like fired material, and method for producing film-like fired material with support sheet |
| KR102569980B1 (en) * | 2017-09-11 | 2023-08-24 | 가부시끼가이샤 레조낙 | Adhesive film for circuit connection and manufacturing method thereof, manufacturing method for circuit connection structure, and adhesive film accommodating set |
| JPWO2019050006A1 (en) * | 2017-09-11 | 2020-08-20 | 日立化成株式会社 | Adhesive film for circuit connection, manufacturing method thereof, manufacturing method of circuit connection structure, and adhesive film accommodating set |
| JP2020024937A (en) * | 2019-10-28 | 2020-02-13 | 日立化成株式会社 | Film-like circuit connection material and method for manufacturing connection structural body of circuit member |
| KR20210154293A (en) | 2020-06-11 | 2021-12-21 | 현대자동차주식회사 | Lithium ion secondary battery and manufacturing method of the same |
| KR20220019470A (en) | 2020-08-10 | 2022-02-17 | 현대자동차주식회사 | System and method for manufacturing lithium ion secondary battery |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63102110A (en) * | 1986-10-17 | 1988-05-07 | 富士ゼロックス株式会社 | Anisotropic conductor and making thereof |
| JPH03107888A (en) * | 1989-09-21 | 1991-05-08 | Sharp Corp | Connecting structure for circuit board |
| JPH0645204A (en) * | 1992-07-21 | 1994-02-18 | Nippon Chemicon Corp | Solid electrolytic capacitor |
| JPH0645024A (en) * | 1992-07-22 | 1994-02-18 | Hitachi Chem Co Ltd | Anisotropic conductive adhesive film |
| JPH08148213A (en) * | 1994-11-25 | 1996-06-07 | Hitachi Chem Co Ltd | Connection member and structure and method for connecting electrode using the same |
| GB2296845A (en) * | 1995-01-04 | 1996-07-10 | Plessey Semiconductors Ltd | Frequency shift keyed radio receivers |
| JP4032439B2 (en) * | 1996-05-23 | 2008-01-16 | 日立化成工業株式会社 | Connection member, electrode connection structure and connection method using the connection member |
| JP3656768B2 (en) * | 1995-02-07 | 2005-06-08 | 日立化成工業株式会社 | Connection member, electrode connection structure using the connection member, and connection method |
| TW392179B (en) * | 1996-02-08 | 2000-06-01 | Asahi Chemical Ind | Anisotropic conductive composition |
| JPH10200243A (en) * | 1997-01-13 | 1998-07-31 | Toshiba Chem Corp | Electrical connecting method using anisotropic conductive paste |
| JP2000182691A (en) * | 1998-12-17 | 2000-06-30 | Hitachi Chem Co Ltd | Circuit connecting member and connection method using therewith |
| WO2001071854A1 (en) * | 2000-03-23 | 2001-09-27 | Sony Corporation | Electrical connection material and electrical connection method |
| JP2004006417A (en) | 2003-08-22 | 2004-01-08 | Hitachi Chem Co Ltd | Connecting element and connection structure of electrode using this |
| JP2005146044A (en) * | 2003-11-12 | 2005-06-09 | Sumitomo Electric Ind Ltd | Anisotropic conductive adhesive |
| JP4728665B2 (en) * | 2004-07-15 | 2011-07-20 | 積水化学工業株式会社 | Conductive fine particles, method for producing conductive fine particles, and anisotropic conductive material |
| JP2006233202A (en) * | 2005-01-31 | 2006-09-07 | Asahi Kasei Electronics Co Ltd | Anisotropically electroconductive adhesive film for circuit connection |
| JP4877230B2 (en) * | 2005-11-18 | 2012-02-15 | 日立化成工業株式会社 | Adhesive composition, circuit connection material, connection structure, and circuit member connection method |
| JP4967482B2 (en) * | 2006-02-27 | 2012-07-04 | 日立化成工業株式会社 | Conductive particles, adhesive composition and circuit connecting material |
| WO2007116826A1 (en) * | 2006-04-11 | 2007-10-18 | Jsr Corporation | Anisotropic conductive connector and anisotropic conductive connector device |
| JP5388572B2 (en) * | 2006-04-27 | 2014-01-15 | デクセリアルズ株式会社 | Conductive particle arrangement sheet and anisotropic conductive film |
| JP2008112732A (en) * | 2007-11-19 | 2008-05-15 | Hitachi Chem Co Ltd | Connecting method of electrode |
| JP4623224B2 (en) * | 2008-06-26 | 2011-02-02 | 日立化成工業株式会社 | Resin film sheet and electronic parts |
-
2009
- 2009-06-23 JP JP2009148551A patent/JP4623224B2/en not_active Expired - Fee Related
- 2009-06-25 CN CN201110251065.XA patent/CN102298988B/en not_active Expired - Fee Related
- 2009-06-25 TW TW098121389A patent/TW201013710A/en unknown
- 2009-06-25 CN CN2011102510630A patent/CN102298987A/en active Pending
- 2009-06-25 TW TW100142306A patent/TWI396626B/en not_active IP Right Cessation
- 2009-06-25 CN CN2011102511046A patent/CN102298989A/en active Pending
- 2009-06-25 KR KR1020090057037A patent/KR101038614B1/en not_active IP Right Cessation
- 2009-06-25 TW TW099127941A patent/TWI415144B/en not_active IP Right Cessation
- 2009-06-25 CN CN2009101503914A patent/CN101615446B/en not_active Expired - Fee Related
-
2010
- 2010-07-12 JP JP2010157782A patent/JP4661985B2/en not_active Expired - Fee Related
- 2010-07-12 JP JP2010158078A patent/JP4766185B2/en not_active Expired - Fee Related
- 2010-07-12 JP JP2010157800A patent/JP4970574B2/en not_active Expired - Fee Related
- 2010-07-12 JP JP2010158022A patent/JP4661986B2/en not_active Expired - Fee Related
- 2010-09-01 KR KR1020100085249A patent/KR101120277B1/en active IP Right Grant
-
2011
- 2011-06-07 JP JP2011127055A patent/JP2011233528A/en not_active Withdrawn
- 2011-06-07 JP JP2011127070A patent/JP2011233530A/en active Pending
- 2011-06-07 JP JP2011127061A patent/JP2011233529A/en not_active Withdrawn
- 2011-06-07 JP JP2011127062A patent/JP2011198767A/en not_active Withdrawn
- 2011-07-08 KR KR1020110067974A patent/KR20110084488A/en not_active Application Discontinuation
- 2011-07-08 KR KR1020110067975A patent/KR20110084489A/en not_active Application Discontinuation
- 2011-07-08 KR KR1020110067981A patent/KR20110084491A/en not_active Application Discontinuation
- 2011-07-08 KR KR1020110067984A patent/KR101120253B1/en not_active IP Right Cessation
- 2011-07-08 KR KR1020110067977A patent/KR20110084490A/en not_active Application Discontinuation
- 2011-11-16 KR KR1020110119297A patent/KR101200148B1/en active IP Right Grant
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2011003544A5 (en) | ||
| JP2017022407A5 (en) | ||
| JP2013542548A5 (en) | ||
| JP2013105888A5 (en) | ||
| TW200727438A (en) | Multi-layered anisotropic conductive film | |
| JP2016189190A5 (en) | ||
| JP2008544551A5 (en) | ||
| JP2011029178A5 (en) | ||
| JP2013156655A5 (en) | ||
| JP2010086512A5 (en) | ||
| JP2010103502A5 (en) | Semiconductor device | |
| JP2013522874A5 (en) | ||
| JP2009096851A5 (en) | ||
| WO2015180221A1 (en) | Method of manufacturing nano silver wire transparent conductive film | |
| JP2016131245A5 (en) | ||
| JP2012525719A5 (en) | ||
| JP2015073105A5 (en) | ||
| CN104194664A (en) | Conductive tape | |
| WO2011140119A3 (en) | Flexible and moldable materials with bi-conductive surfaces | |
| CN202503862U (en) | Heat conduction aluminum film | |
| WO2014052162A3 (en) | Transparent multi-layer structure with transparent electrical routing | |
| JP2013118180A5 (en) | ||
| WO2014169728A8 (en) | Electrically conductive inks | |
| JP2015507560A5 (en) | ||
| JP2009191185A5 (en) |