TW201013710A - Resin film sheet having conductive particles and electronic component electrically connected by the same - Google Patents

Abstract

The subject of the present invention is to increase the rate of capture of particles on a conductive resin film sheet to thereby achieve cost reduction and enhance conductivity. To solve the problem, the conductive resin film sheet includes two or more of resin film layers having conductive particles therein or of resin film layers having no conductive particles therein, which are laminated in the through-wall direction in order to increase the particle capture rate, which is represented by the ratio of the number of particles included in the resin film existing between pre-shaped electrodes and the number of particles sandwiched between post-shaped electrodes, wherein the resin film layer which includes therein a through-wall center plane located at an equidistance from both surfaces of the resin film sheet or at least one resin film layer adjacent to the through-wall center plane is formed by an insulating resin film layer having no conductive particles therein.

Description

[Technical Field] The present invention relates to a resin film containing conductive particles and an electronic component electrically connected by a resin film containing conductive particles. In the state in which the resin film material having the conductive particles is formed to form the resin film between the electrodes, the interval between the electrodes is separated by more than the thickness of the film while the resin film material containing the particles is sandwiched. When the φ pole or the lower electrode heats the resin film material, the resin film material is connected by compression to shorten the electrode gap, and the resin film material containing the conductive particles is flowed, and the step of sandwiching the particles between the electrodes after the connection molding is performed The present invention relates to a resin containing conductive particles in order to increase the particle capture ratio between the electrodes after the connection molding (the ratio of the number of particles existing between the electrodes before the connection and the number of particles sandwiched between the electrodes after the formation) A diaphragm and an electronic component electrically connected by the above resin film. [Prior Art] Patent Literature 1, Patent Document 2, and Patent Document 3 are known, for example, in the patent document of the material composition of the anisotropic conductive film. Patent Document 1 discloses a technique for determining the ratio of the thickness dimension to the particle diameter of a resin film containing conductive particles, and shows that the entire thickness of the isotropic conductive film is equal to or less than twice the particle diameter. However, in the actual connection, the thickness of each of the opposite-direction conductive films necessary for connecting and bonding the electrodes is different. Further, Patent Document 2 discloses that the technique of changing the density of the -5 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - In the state in which the conductive particles are provided in the insulating resin and the conductive paste is applied onto the electrode, a method of connecting the particles by heating at 40 ° C or more for 2 hours or longer is used. However, the actual connection must be carried out in a short period of time. An anisotropic conductive film in which a solid film state must be used. Further, in order to have a particle distribution in the thickness direction, it is effective to have a film structure having two or more layers and to be divided into a conductive layer in which particles are disposed, and an insulating layer in which particles are not provided. @ Further, Patent Document 3 is a material structure in which the conductive layer and the insulating layer are different in the minimum enthalpy of the melt viscosity. However, in the connection molding using the actual resin film, since the conditions of high temperature rise rate (17 〇 ° C / l 〇 s, etc.) are used, the initial state of connection is selected from the lowest viscosity until the electrode interval is equal to the particle diameter. The viscosity change is important. [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. JP-A No. SHO-A No. Hei. SUMMARY OF THE INVENTION [Problem to be Solved by the Invention] A resin film material containing conductivity is provided between electrodes to be connected, and the resin film material is shortened by shortening the distance between electrodes. The resin film material containing the conductive particles flows, and after the connection is formed, the particles are sandwiched between the electrodes in the joining forming step, so that the particles contained in the resin film material existing between the electrodes before the joining are formed The increase in the particle capture ratio, as indicated by the ratio of the number of particles sandwiched between the electrodes after the connection is formed, is a problem of reducing the cost and improving the conductivity. In other words, when the particle trapping rate is low, the number of particles sandwiched between the electrodes is reduced, so that the electrical conductivity between the electrodes is lowered. Therefore, it is necessary to contain a large amount of conductive particles having a high cost in the initial state. Therefore, by arranging the arrangement of the particles contained in the Φ resin film material, the particle capture rate can be improved, but it is necessary to reduce the cost and improve the conductivity. Further, when a resin film material composed of two layers in the thickness direction is used, and only one layer of the resin film contains particles, the resin film layer containing the particles is contacted with the upper electrode or the lower electrode depending on the shape of the electrode. In the state of one, the particle capture rate is different. Therefore, it is necessary to review whether the resin film layer containing the resin film material particles according to the shape of the electrode is placed in contact with either the upper electrode or the lower electrode in the stage before the joining, and it is φ whether the particle capturing ratio can be improved. Further, when a resin film material composed of two layers in the thickness direction is used, and only one layer of the resin film contains particles, the physical properties such as viscosity, thermal conductivity, and heat generation rate of the insulating layer and the conductive layer constituting the two layers are used. The difference in ' makes the particle capture rate different. Therefore, it is necessary to draw the difference in physical properties of the material constituting the two layers of the insulating layer and the conductive layer to map the particle capture rate. (Means for Solving the Problem) 201013710 In order to solve the above problem, in the present invention, the number of particles contained in the resin film existing between the electrodes before molding is calculated by using a commonly used fluid analysis program (FLOW-3D FLOW SCIENCE) The particle capture ratio indicated by the ratio of the number of particles sandwiched between the electrodes after molding, and the particle arrangement contained in the resin film material, the viscosity of the resin film material, the heat generation reaction rate, and the thermal conductivity are appropriately adjusted. For example, in the case where the resin film material composed of two layers is laminated, in the case where only one resin film contains particles in the two layers, the thickness and the thickness of the entire resin film material for improving the particle trapping rate are selected. The thickness of the resin film layer containing particles. The resin film containing conductive particles in the present invention is characterized in that the resin film layer containing the conductive particles or the resin film layer containing the conductive particles is laminated in two or more layers in the thickness direction, and the inside contains the above-mentioned The resin film layer on the center surface in the thickness direction of the equidistant position of the two surfaces of the resin film or at least one resin film layer adjacent to the center surface in the thickness direction is an insulating resin film layer not containing the conductive particles. form. Further, when the resin film layer containing the resin film material particles is placed in contact with either the upper electrode or the lower electrode in the stage before the connection molding, whether or not the particle capturing ratio can be increased can be selected depending on the shape of the electrode. In addition, in the case where the resin film material which is laminated in two layers in the thickness direction is contained in the resin film of only one layer, the viscosity and thermal conductivity of the insulating layer and the conductive layer which constitute the two layers are characterized. There is a difference in physical properties such as the rate of heat generation. The adhesive composition for dispersing the conductive particles in the present invention may, for example, be a thermosetting adhesive composition or a photocurable adhesive composition -8-201013710. Specifically, for example, an adhesive composition containing (1) an epoxy resin and (2) an epoxy resin hardener, a (3) radical polymerizable substance, and (4) heating or light generation may be used. Adhesive composition of a free radical hardener, a mixture composition containing the above (1) and (2) components, and a mixture composition containing the adhesive composition of the above (3) and (4) components Wait. Examples of the epoxy resin of the component (1) include bisphenol A type φ epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolak type epoxy resin, and cresol novolac. Varnish type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F novolak type epoxy resin, alicyclic epoxy resin, epoxy propyl ester type epoxy resin, epoxy propyl amine type ring Oxygen resin, intramethylene urea resin, isocyanurate epoxy resin, aliphatic chain epoxy resin, and the like. These epoxy resins can also be halogenated and can also be hydrogenated. Further, an acrylonitrile group or a methyl acrylonitrile group may be added to the side chain of the epoxy resin. These may be used alone or in combination of two or more. Φ The curing agent of the component (2) is not particularly limited as long as it can cure the epoxy resin, and examples thereof include an anionic polymerizable catalyst hardener, a cationic polymerizable catalyst hardener, and a polyaddition type. Hardener and the like. Among them, an anion or a cationic polymerizable catalyst hardener is preferred because it is excellent in rapid hardenability and does not require chemical equivalents. Examples of the anionic or cationically polymerizable catalyst-type curing agent include an imidazole-based, an anthraquinone-based, a boron trifluoride-amine complex, a phosphonium salt, an amine imide, and a diamine maleimonitrile. Melamine and its derivatives, salts of polyamines, dicyandiamide, etc., and denatured substances thereof and the like can also be used. -9 - 201013710 The polyaddition-type hardener may, for example, be a polyamine, a polythiol, a polyphenol or an acid anhydride. An anionic polymerization type catalyst hardener, for example, when a tertiary amine and an imidazole are blended, the epoxy resin is hardened by heating at a temperature of about 160 ° C to 200 ° C for 1 〇 sec. to several hours. . Therefore, it is preferable because the usable time (life) becomes longer. Further, a photosensitive key salt (mainly using an aromatic diazonium salt or an aromatic onium salt) which cures an epoxy resin by energy ray irradiation can also be suitably used as a cationic polymerization type catalyst type hardener. In addition, as the cationic polymerization type catalyst-type curing agent which cures the epoxy resin by heat activation, for example, an aliphatic sulfonium salt or the like is used. Such a hardener is preferred because of its characteristics of rapid hardenability. These epoxy resin hardeners are coated with a polymer material such as a polyurethane or a polyester, a metal film such as nickel or copper, or an inorganic substance such as calcium silicate. Sex hardeners are preferred because of their prolonged use. φ When the amount of the curing agent of the epoxy resin is 25 seconds or less, in order to obtain a sufficient reaction rate, 100 parts by mass of the epoxy resin and the film forming material to be blended as needed are used in a total amount of 1 ~50 parts by mass is preferred. These hardeners may be used alone or in combination of two or more. The radically polymerizable substance of the component (3) is not particularly limited as long as it has a functional group which is polymerized by a radical. Specific examples thereof include a compound of acrylate (corresponding to the corresponding methyl-10-201013710 acrylate, the same applies hereinafter), a compound of propylene oxime (including the corresponding methacryloxy group, the same hereinafter), Maleic imine compound, citrate imine resin, naphthol quinone imine resin, and the like. These radical polymerizable substances can be used in the form of monomers or oligomers, and monomers and oligomers can also be used. Examples of the acrylate compound include methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol dipropylene φ acid ester, diethylene glycol diacrylate, and trimethylolpropane three. Acrylate, tetramethylol methane tetraacrylate, 2-hydroxy-1,3-dipropenyloxypropane, 2,2-bis[4-(acrylomethoxymethoxy)phenyl]propane, 2, 2-bis[4-(acryloxypolyethoxy)phenyl]propane, dicyclopentenyl acrylate, tricyclodecyl acrylate, tris(propylene oxyethyl) isocyanurate, amine Carbamate acrylate and the like. Further, a polymerization inhibitor such as hydroquinone or methyl ether hydroquinone may be suitably used as needed. Further, from the viewpoint of improving heat resistance, a radically polymerizable material such as an acrylate compound is preferably a substituent having at least one type of φ dicyclopentenyl group, tricyclodecanyl group, triterpene ring or the like. The radically polymerizable substance is preferably a radically polymerizable substance having a phosphate structure represented by the following chemical formula (I). At this time, in order to increase the bonding strength to the surface of the inorganic material such as metal, it is appropriate to indirectly bond the circuit electrodes to each other. -11 - 201013710 1 0 0 ch3 1 i

OCH2CH2, 〇-CC=CH2 (wherein n is an integer of 1 to 3) a radically polymerizable substance having the phosphate structure, for example, by reacting phosphoric anhydride with 2-hydroxyethyl (meth)acrylate Specific examples thereof include mono(2-methylpropenyloxyethyl) acid phosphate, bis(2-methylpropoxy oxyethyl) acid phosphate, and the like. The amount of the radically polymerizable substance of the phosphate structure shown in the above is 1 part by mass of the total amount of the radically polymerizable material and the film forming material to be blended as needed, and 1 to 50 parts by mass of 〇·〇 In addition, the above-mentioned radically polymerizable substance may be an allyl acrylate. In this case, the total amount of the acrylic acid acrylate is 100 masses with respect to the radical polymerizable substance and the film forming material to be blended as necessary. The radically polymerizable substance may be used singly or in combination of two or more kinds. The curing agent which generates free radicals by heating or light in the above component (4), for example, may be used. Electromagnetic wave irradiation such as heating or ultraviolet light The curing agent of the free radical can be used without particular limitation. Specific examples thereof include a peroxy compound, an azo compound, etc. Such a -12-201013710 hardener can be connected depending on the purpose, connection time, It is appropriately selected from the viewpoints of service life, etc. From the viewpoint of high reactivity and improvement in service life, the temperature at which the half-life is 1 〇 hour is 40 ° C or higher and the temperature at which the half-life is 1 minute is 18 (the organic peroxide below TC) Preferably, the organic peroxide having a half-life of 1 hour is 60 ° C or higher, and a half-life of 1 minute is 170 ° C or less. The hardener which generates free radicals by heating is more specific. In addition, examples thereof include a dinonyl peroxide group, a peroxydicarbonate: a peroxy ester, a peroxy ketal, a dialkyl peroxide, a hydroperoxide, a methyromethyl peroxide, and the like. Also preferred are peroxy esters, dialkyl peroxides, hydroperoxides, methyrosine peroxides, etc., and it is more preferred to obtain a highly reactive peroxyester. Hard of free radicals For example, a decomposition accelerator, an inhibitor, or the like may be used, and these curing agents may be microencapsulated by coating with a polyurethane or a polyester-based polymer material to impart potential properties. The microencapsulated hardener is preferably used for a prolonged period of use. The amount of the curing agent that generates free radicals by heating or light is 25 seconds or less in order to obtain a sufficient reaction. The ratio is preferably from 2 to 10 parts by mass based on the total amount of the free radical polymer material and the film forming material to be blended as needed. The hardeners which generate free radicals by heating or light may be used alone or Two or more types may be used in combination. In the circuit connecting material, a film forming material may be added as needed. From -13 to 201013710, a film forming material, for example, solidifies a liquid material, and forms a composition into a film shape. In this case, the operation of the film can be easily performed, and the mechanical properties such as cracking, cutting, and sticking are not easily caused, and the film type can be operated in a normal state (at normal temperature and normal pressure). Examples of the film forming material include a phenoxy resin, a polyvinyl acetal resin, a polystyrene resin, a polyvinyl butyral resin, a polyester resin, a polyamide resin, a xylene resin, and a polyamine. Carbamate resin and the like. Among them, the phenoxy resin is preferably excellent in adhesion, compatibility, heat resistance, mechanical strength, and the like. _ When the compounding amount of the film forming material is blended in the adhesive composition containing the curing agent of (1) epoxy resin and (2) epoxy resin, from the viewpoint of resin fluidity at the time of circuit connection, It is preferably 5 to 80 parts by mass based on 100 parts by mass of the total of the epoxy resin and the film forming material. Further, when the amount of the film forming material is blended in an adhesive composition containing (3) a radically polymerizable substance and (3) a curing agent which generates free radicals by heating or light, when it is connected by a circuit From the viewpoint of the fluidity of the resin, it is preferably 5 to 80 parts by mass based on 100 parts by mass of the total of the radical polymerizable material and the film formed material. These film forming materials may be used alone or in combination of two or more. The circuit connecting material may further contain a polymer or copolymer of at least one of acrylic acid, acrylate, methacrylate and acrylonitrile as a monomer component. From the viewpoint of relaxation stress, a copolymer of a propylene-based rubber containing a glycidyl acrylate group or a propylene methacrylate having a glycidyl acrylate group as a monomer component is preferred. The weight average molecular weight of the propylene-based rubber is preferably 200,000 or more from the viewpoint of improving the cohesive force of the adhesive. -14- 201013710 The blending amount of the anisotropic conductive particles is matched with the epoxy resin and the film forming material when blended in the adhesive composition containing the hardener of (1) epoxy resin and (2) epoxy resin The total amount is 100 parts by volume, preferably 0.1 to 100 parts by volume. Further, when the amount of the isotropic conductive particles is blended in the adhesive composition containing (3) a radically polymerizable substance and (3) a curing agent which generates free radicals by heating or light, it is relative to a radical. The total amount of the polymerizable material and the enamel film forming material is preferably from 1 to 100 parts by volume per 100 parts by volume. Further, in the circuit connecting material, rubber microparticles, sputum, softener, accelerator, antioxidant, colorant, flame retardant, thixotropic agent, coupling agent, phenol resin, melamine resin, isocyanate may be contained as needed. Classes, etc. Further, the conductive particles of the present invention are not particularly limited as long as they have electrical conductivity capable of obtaining electrical connection. Examples of the conductive particles include metal particles such as Au, Ag, Ni, Cu, and solder, and carbon. Further, the conductive particles Φ sub-system may be coated with one or two or more layers as particles of the core, and the outermost layer may be electrically conductive. Further, the conductive particles may be coated with insulating particles such as plastic as a core, and may be coated on the surface of the core with the metal or carbon as a main component. Alternatively, it may be subjected to an insulation coating treatment. These may be used alone or in combination of two or more. Further, in the resin film layer of the present invention, a mixture of the conductive particles dispersed as needed in the adhesive composition is applied onto a support substrate, or the substrate is impregnated with a non-woven fabric or the like. The liquid is placed on a support substrate, and the solvent or the like is removed. -15-201013710 When the insulating resin film layer thus obtained and the resin film layer containing the conductive particles are bonded together, the multilayering can be easily carried out.

The resin sheet can be produced as described above by appropriately adjusting the material and blending amount according to the desired properties, but it is also commercially available. For example, Hitachi Chemical Co., Ltd. product name ANISOLM AC-200, AC-2000, AC-4000, AC-7000, AC-8000, AC-9000 , Sony Chemical & Information Device product name CP901AH-35AC, CP1220IS, CP1720ISV, CP5720GT, CP5720ISV, CP5920IKS, CP6920F, CP6920F3, CP6930IFN, CP6930JV3, CP8016K-35AC, CP9042KSV, CP9731SB, CP9742KS, CP9842KS, CP9920ISV, CP2053 1 -3 5AG, CP3 094 1-20 AB, DP3232S9, DP3342MS, FP1708E, EP1726Y, FP1830VS, FP2322D, FP2622A, FP5530DF, (EX) EXAX product name EX-G192, EX-G193 'EX-P6906 ' EX-P6907 Wait. When the resin film sheet is a single-layer resin film containing conductive particles, it is easy to obtain an insulating resin film sheet by removing it. By laminating the insulating resin film sheet thus obtained and the resin film sheet containing the conductive particles, it is possible to multilayer (the effect of the invention). According to the present invention, the particles are connected and formed by compression between electrodes to contain the particles. The resin film material flows, and the particles are sandwiched between the electrodes after the forming, and the thickness of the appropriate resin film material, the thickness of the resin film layer containing the particles, is selected by increasing the particle capture rate. Or, the method of arranging the film in which the resin film layer containing the particles is in contact with each of the upper electrode or the lower electrode is appropriate, the viscosity of the conductive layer and the insulating layer of the resin film are poor, the thermal conductivity is poor, and the heat is poor. The speed difference' can achieve cost reduction and improved conductivity. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, the forming step of the analysis target will be described using FIG. Fig. 1 (a) is a pair of electrodes to be electrically connected in a structure in which electrodes are arranged in a symmetrical shape on the positive and negative sides in the X direction of the XZ section. Further, Fig. 1(b) is a pair of electrodes which are extended and electrically connected in the Y direction of the vertical YZ section of Fig. 1(a). In the initial state of the connection molding, the resin material 2 containing the conductive particles 1 is provided between the upper electrode 4 φ of the semiconductor integrated circuit (1C) 3 and the lower electrode 6 of the substrate 5. Here, the height of the upper electrode 4 is represented by the HU table τρ: 'the electrode quotient of the lower electrode 6 is represented by Hs, and the pair of electrode barrels to be electrically connected is represented by HI (=HU + Hs), and the electrodes 4, 6 The width is represented by W1, and the distance between the positive and negative electrodes 4 in the X direction (pitch) is represented by W2. The length of the electrode in the Y direction is represented by L1. The connection forming step is such that the heated semiconductor integrated circuit (IC) 3 is moved in the direction of the substrate 5 to compress the resin material 2 containing the particles 1 to flow the resin material 2 containing the particles 1. At this time, the temperature of the resin material -17-201013710 2 is changed by the contact of the electrode 4 of the semiconductor integrated circuit UC) 3 with the resin material 2, and the viscosity changes due to the temperature change, and the resin material 2 is compressed together with the particles. And flowing. The resin material 2 is used in an adhesive composition containing a latent hardener of an epoxy resin or an epoxy resin and a phenoxy resin, and is used to disperse conductive particles as needed. Further, the distance between the electrode 4 of the semiconductor integrated circuit (1C) 3 and the electrode 6 of the substrate 5 is smaller than the diameter of the particle 1, and the particles sandwiched between the electrodes 4 are deformed and compressed. When the movement of the semiconductor integrated circuit (1C) 3 is completed, the electrical signal between the semiconductor integrated circuit (1C) 3 and the substrate 5 can be transmitted by the conductivity of the particles 1 sandwiched between the electrodes 4 and 6. Here, the conductivity between the semiconductor integrated circuit (1C) 3 and the substrate 5 is determined based on the number of particles 1 sandwiched between the upper electrode 4 and the lower electrode 6 after molding and the contact area between the particles 1 and the electrodes 4 and 6. Further, the conductivity is evaluated based on the current flowing when a certain voltage is applied between the electrodes 4 and 6. Therefore, in order to improve the electrical conductivity, it is necessary to increase the number of particles sandwiched between the upper electrode 4 and the lower electrode 6 after molding. In the following review, the particle capture ratio defined by the ratio of the number of particles 1 in the resin film existing between the pre-formed electrodes 4 and 6 to the number of particles 1 sandwiched between the formed electrodes 4 and 6 is shown. Improved resin film material construction. In the resin film material which is formed by laminating two layers in the thickness direction, the resin film material in which the particles 1 are provided in the resin film layer of only one of the two layers is examined by flow analysis. The dimensions of the electrodes 4, 6 and the resin film are shown in Fig. 2. Thus, using five different electrode shapes 4, the positive and negative directions of the X direction -18-201013710 are symmetric, and an analytical model is set. Here, in the resin film of two layers, the resin film layer which is connected to the upper electrode 4 is defined as the first layer, and the resin film layer which is connected to the lower electrode 6 is defined as the second layer, and is in the first layer or In the second layer, a particle-setting layer (conductive layer) containing the particles 1 is disposed. Further, Fig. 2 shows a case where the installation layer (conductive layer) is the second layer, and only the layer (insulating layer) containing no particles is provided in the first layer, and the height of the lower electrode 6 is Η3 = 0.5 μm. φ Here, the diameter of the particle 1 is 4 μm, and the thickness of the particle-providing layer is three levels of 4, 6, and 8 μm, and the thickness of the entire resin film is always 16 μm. Further, for comparison, a review was also made on the case where the thickness of the particle-setting layer was 16 μm (particles were provided in the entire thickness of the resin film). Further, the number of particles contained therein is 200 in the case where the thickness of the particle-setting layer is 4 μm, 300 in the case of 6 μm, 400 in the case of 8 μm, and 800 in the case of 16 μπι. . Further, the temperature of the upper electrode 4 rises from 25 ° C to φ 200 ° C in 10 seconds, and the upper electrode 4 moves in the direction of the lower electrode 6. The moving speed of the initial upper electrode 4 is lxl0_3 m/s. In addition, a commonly used fluid analysis software is used for flow analysis. In the analysis, the moving speed of the initial upper electrode 4 and the viscosity change of the resin 2 are considered, and the moving speed of the upper electrode 4 is calculated, and the particles 1 are placed in the resin 2 in a hypothetical labeled particle pattern. Further, the physical properties of the first layer and the second layer of the resin 2 are the same, and the heat generation reaction formula for analysis is shown in the formulas (1) to (5), and the viscosity type is shown in (6) to (8). Further, the resin 2 is an epoxy resin using a thermosetting resin, and the physical properties of the resin (the coefficient of the viscosity type -19 - 201013710, the coefficient of the heat generation reaction formula) are shown in the resin of Table 1. (The heat conductivity is 0.2 W/ (m · Κ), specific heat is 1700J/(kg.K), density is 1 00kg/m3. ◎Fever reaction formula da/dt= ( Kl+K2aM) ( 1-a) N ...(1 )

Kl=Ka exp ( -Ea/T ) (2) K2 = Kb exp ( -Eb/T ) ..· ( 3 ) a = Q/Q0 ··· ( 4 ) dQ/dt = Q0 ( K1 +K2aM ( 1 - a ) N ... ( 5) where a: reaction rate, t: time, T: temperature, dA/dt: reaction rate, ΚΙ, K2: coefficient which becomes a function of temperature, Q: until arbitrarily The calorific value at the moment, Q0: the total calorific value until the end of the reaction, N, Μ, Ka, Ea, Kb, Eb: the inherent coefficient of the material, dQ/dt: the heating rate. ◎ viscosity η - η 0 ( (1+a/agel) /(1 -a/agel ) ) Η ...(6) 7? 0 = a · exp ( b/T ) ··· ( 7 ) H = f /Tg (8) Here, n: viscosity 'a: reaction rate, τ: resin temperature, agel: gelation reaction rate 'a, b, f, g: a material inherent constant. The capture rate of the particles 1 was calculated using this analysis method. Further, the capturing ratio ε (%) of the particles 1 is a ratio of the number of particles Ν1 in the resin film material existing between the electrodes 4 and 6 before the forming, and the number of particles Ν2 sandwiched between the electrodes 4 and 6 after the forming ( 9) Calculate. (9) ε = Ν 2 / Ν 1 χ 100 201013710 The analysis results of the capture rate of the particle 1 are shown in Figs. 3, 4, 5, and 6. 3 is a graph showing the capture ratio of the particles 1 when the particles 1 are provided over the entire thickness of the resin film for each electrode shape, and FIG. 4 is a graph showing the capture ratio of the particles 1 when the thickness of the particle-providing layer is 4 μm for each electrode shape. 5 is a capture ratio of the particles 1 when the thickness of the particle-providing layer is 6 μϊη for each electrode shape, and FIG. 6 is a capture ratio of the particles 1 when the thickness of the particle-providing layer is 8 μm for each electrode shape. Thus, the particle trapping rate is different depending on the shape of each electrode φ, but the smaller the thickness of the particle-setting layer, the higher the trapping rate of the particle 1. The resin material of the resin film can be used for the adhesive composition containing an epoxy resin, a latent curing agent for an epoxy resin, and a phenoxy resin, and if necessary, the conductive particles are dispersed. 7 is a resin flow velocity distribution in the X direction in which the distance between the upper electrode 4 and the lower electrode 6 is 14 μm in the case where the particle layer thickness of the second layer is set to 8 μm for the shape (1), and the ratio is represented by a line. ( Ο ΧΖ plane). The ratio of the velocity distribution is plotted as the ratio of the maximum velocity 値 in the X direction to 1. The resin material of the resin film can be used for the adhesive composition containing an epoxy resin, a latent curing agent for an epoxy resin, and a phenoxy resin, and if necessary, the conductive particles are dispersed. Thus, the speed distribution ratio in the X direction is the largest, which is in the vicinity of the center portion of the thickness dimension between the upper electrode 4 and the lower electrode 6. Therefore, the flow velocity of the resin in the 'X direction is the largest, and the conductive layer containing the particles 1 is not disposed in the center portion of the thickness direction in which the particles 1 are easily discharged from the positive direction of the X between the electrodes 4'6, and is set. The structure in which the insulating layer of the particles 1 is not contained can increase the capturing ratio of the particles 1. That is, as shown in FIG. 12, the resin film sheet of the two-layer structure has a portion or thickness of the insulating layer which does not contain the particles 1 at any plural position of the resin film at the center point of the thickness dimension. The structure provided by the adjacent layer of the surface 7 formed by the center point of the dimension is effective for increasing the capture rate of the particle 1. The resin material of the resin film can be used as an adhesive composition for a latent curing agent containing an epoxy resin or an epoxy resin and a phenoxy resin, and if necessary, the conductive particles are separated. Further, as shown in FIG. 13, in the case of using a resin film having a three-layer structure, in any of a plurality of places of the resin film, an insulating layer containing no particles 1 is provided in a portion of the surface 7 formed by the center point of the thickness dimension. The structure of the layer increases the particle capture rate. The resin material of the resin film can be used for the adhesive composition containing an epoxy resin, a latent curing agent for an epoxy resin, and a phenoxy resin, and if necessary, the conductive particles are dispersed. Further, as shown in FIG. 14, in the case of using a resin film having a four-layer structure, in any of a plurality of places of the resin film, an insulating layer containing no particles 1 is provided in a portion of the surface 7 formed by the center point of the thickness dimension. The structure of the layer increases the particle capture rate. Further, the same applies to the case of using a resin film having a multilayer resin film layer structure. The resin material of the resin film can be used as an adhesive composition for a latent curing agent containing an epoxy resin or an epoxy resin and a phenoxy resin, and it is necessary to disperse conductive particles as required by -22-201013710. Further, the resin film containing the particles which are formed by laminating two or more layers in the thickness direction may have a variation in the interlayer thickness ratio at the time of production. Therefore, the resin film sheet containing the particles contained in two or more layers in the thickness direction is within a range of ±5% of the thickness of the surface 7 of the thickness of the resin film at any of the plurality of positions of the resin film. In addition, the insulating layer structure in which the particles are not disposed may be provided. Therefore, the resin film layer adjacent to the surface 7 formed by the center point of the thickness dimension is formed as an insulating layer not containing the particles 1 at any of the plurality of resin film sheets. can. Here, as shown in FIGS. 3 to 6, by thinning the thickness of the film layer of the particles 1, it is possible to provide particles at a center portion in the thickness direction between the upper electrode 4 and the lower electrode 6 at the highest speed, so that the particles are disposed away from each other. The capture rate of particles becomes high. In this analysis, the thickness of the resin film layer containing the particles 1 is set to 4, 6, and 8 μm. However, in order to increase the capture ratio of the particles 1, it is necessary to reduce the thickness of the particle-setting layer as shown in FIGS. 3 to 6 φ. It is desirable to reduce the thickness until it is equal to the diameter of the particle 1. However, in the case of producing a resin film having a thickness equal to the diameter of the particles 1, since the particles 1 are exposed from the resin film material, the film thickness of the set particles 1 is made larger than the diameter of the particles 1 by the setting error of the apparatus for manufacturing the apparatus. Smaller, there is a problem in manufacturing such as the problem of deformation of the particles 1. Therefore, in the two-layer resin film in which only one resin film layer of the two layers is provided with the particles 1, the thickness of the particle-setting layer is desirably +10% or less of the diameter of the particle 1. As described above, the results of the inspection of the resin film material composed of the two-layer laminate are shown in -23-201013710, but the present invention is not limited thereto, and the resin film of 3, 4 or more layers may be applied. . The resin material of the resin film can be used for the adhesive composition containing an epoxy resin, a latent curing agent for an epoxy resin, and a phenoxy resin, and if necessary, the conductive particles are dispersed. In one example, the resin film material composed of three layers is laminated and analyzed in the case where the particles 1 are provided in the resin film of the connection layer between the upper electrode 4 and the lower electrode 6 in three layers. The shape used for the analysis was the same as that of the electrode shape (1) shown in Fig. 2, and the thickness of the particle-setting layer was 4 μm above and below. The number of particles set is 400. Further, the physical properties of the resin film layer were the same as those in Table 1 in the three layers. As a result of the analysis, the ratio of the velocity distribution (ΧΖ plane) in the X direction in which the distance between the upper and lower electrodes 4 and 6 is 14 μm is indicated by a line, and the calculation result of the particle capturing ratio is shown in Fig. 9 . Thus, the velocity in the X direction in the pupil plane is approximately the center portion (the portion where the particle 1 is not provided) in the thickness direction between the upper and lower electrodes, and the resin film in the layer connecting the upper electrode 4 and the lower electrode 6 in the three resin films. The particle capture ratio when the particle 1 is set may be higher than the case where the particle thickness of the shape (1) shown in Fig. 3 is set as a whole. Further, in the case where the thickness of the particle-setting layer is thin, since the particle 1 can be provided away from the center portion in the thickness direction between the electrodes having the largest X-direction velocity, the particle capturing ratio can be improved. Therefore, in the case of using a three-layer resin film material, it is also desirable that the thickness of the uppermost and lowermost particles of the film thickness direction is the same as that of the two-layer film, and the particle diameter is +1% or less. -24- 201013710 The resin film structure of the position where the conductive layer containing the particles is provided is shown, but it can also be applied to an electronic component which is electrically connected by using the resin film. In the above, a two-layer or three-layer laminated structure in the thickness direction is shown. However, the present invention is not limited thereto, and a resin film for laminating two or more layers of a laminated structure can be used. The resin material of the resin film can be used in an adhesive composition containing a latent curing agent for an epoxy resin or an epoxy resin and a phenoxy resin, and the conductive particles are dispersed as needed. As shown in Figs. 4, 5, and 6, when the particles 1 are provided in either the first layer or the second layer of Fig. 2, the particle capturing ratio can be increased, but it varies depending on the shape of the electrode. Here, the results of the treatment of each electrode shape (the particle trapping rate when the particles 1 are placed in the first layer) / (the particle capturing ratio when the particles are set in the second layer) are plotted on the vertical axis are shown in Fig. 9 . In addition, in the case where (the particle capture ratio when the particle 1 is set in the first layer) / (the particle capture rate when the particle 2 is set in the second layer) is greater than 1, the particle capture rate is increased when the particle 1 is set in the first Φ layer. In the case where the shape (the particle capturing ratio when the particle 1 is set in the first layer) / (the particle capturing ratio when the particle 2 is set in the second layer) is less than 1, the shape of the second layer is set to increase the particle capturing rate. . Here, as shown in FIG. 1, the height of the pair of electrodes to be connected is regarded as HI (=HU + Hs), and the average 値 of the widths of the electrodes 4 and 6 is regarded as W1, and the electrodes of the positive and negative sides of the X direction are disposed. The interval (pitch) of 4 is regarded as W2, and in the case where the particle diameter is regarded as H2, ((W2-W1) X ( H1+H2 ) 3 ) / ( W1 xH23 ) is taken as the horizontal -25-201013710 axis, and The capture rate at the time of setting the particles in the first layer) / (the capture rate when the particles are set in the second layer) is shown as the vertical axis and the result of the finishing is shown in Fig. 1G°. In the case of using a two-layer resin film, 'according to the shape of the electrode Decide, for example, that after ((W2_W1) X ( H1+H2 ) 3 ) / ( WlxH23 ), if particles are placed on either layer 1 or layer 2, the particle capture rate can be improved.

In other words, for example, in the case where ((W2-W1) X ( H1+H2 ) 3 ) / ( X H23) is less than 50, the film on the electrode 6 side of the electrode 4 on the reverse side of the electrode height is high. In the case where the layer is set to the particle 1' and ((W2-W1) X ( H1+H2 ) 3) / ( WlxH23 ) is 90 or more, the particle 1 is provided by the film layer on the side of the electrode 4 having a high electrode height. 'A resin film suitable for the electrode shape or electrode structure of an electronic member is used in order to improve the capture rate of the particle 1. The resin material of the resin film may be used to disperse conductive particles in an adhesive composition containing a latent curing agent for epoxy resin or epoxy resin and a phenoxy resin. @Electrode shape, for example, in the case where ((W2-W1) χ(Η1+Η2) 3) / (W 1 xH2 3 ) is 90 or more, in the pre-stage of joining formation using a 2-layer resin film In the film layer on the side of the electrode 4 having a high electrode height, the particle 1 is provided and the formed electronic component is connected to improve the particle trapping rate. The (electrode pitch) / (electrode height) of each electrode shape is plotted on the horizontal axis, and the (capture rate set by the first layer) / (the capture rate of the second layer is set) is vertical and horizontal, and the result of the alignment is shown in FIG. When the (electrode pitch) / (electrode height) is 0.7 or more, the particles 1 are provided on the electrode layer side of the electrode 4 having a high electrode height in the pre-stage of the connection molding using the two-layer resin film at -26-201013710. Connect the formed electronic parts to increase the particle capture rate. Here, in the case of using the electrode shape (1) of Fig. 2, the thickness of the entire two resin films was changed to 10, 12, 14, and 16 μm. Further, the layer thickness of the particles 1 is changed to 4, 6, and 8 μm, and for all the layers, the physical properties of the resin material are in the form of a heat generating reaction type and a viscosity type φ according to the formulas (1) to (8), and the respective parameters are Use Table 1 for details. The results of the particle capture rate are shown in Fig. 11. Similarly to the results shown in Figs. 3 to 6, in the case where the thickness of the layer 1 of the particles 1 is small, the particle trapping rate can be improved. Further, if the thickness of the entire resin film is small, the trapping rate of the particles 1 can be improved. When the thickness of the entire resin film is large and the particle trapping rate is low, the amount of discharge of the resin and the particles in the Υ direction shown in FIG. 1 increases. In the above paragraph [0180], it is described that the thickness of the particle-setting layer is desirably +10% or less of the diameter of the particle 1, but the particle is approximately equal to the film thickness, and it is necessary to suppress variations in film thickness and prevent the particles from being coated by the film. In the middle, the film manufacturing cost has become higher. Therefore, as shown in FIG. 11, the capture ratio of the desired particles can be as high as 30% or more, and the maximum desired thickness of the entire film is the diameter of the above-mentioned particles 1 due to an increase in the number of particles captured by the electrode gate. 10% or less, the film thickness is preferably 6/4 = 1.5 times or less of the particles, and the thickness is desirably 8/4 = 2 times or less. As described above, the results of the review of the resin film material composed of the two-layer laminate are shown. However, the present invention is not limited thereto, and a multilayer resin film of 3 layers, 4 layers or -27-201013710 may be applied. Further, the ratio of the thickness of the particle-setting layer to the thickness of the particle layer is not required, and as shown in Fig. 11, the particle capture rate can be as high as 48% or more of the NCF layer thickness / ACF layer thickness = 6/4 = 1.5 times or less. . Further, in the case where the height of the electrode to which the film is connected is high, it is necessary to increase the thickness of the entire film. In this case, the ratio of the thickness of the NCF layer/the thickness of the ACF layer which is expected next is such that the NCF layer thickness / ACF layer thickness = 10/4 = 2.5 times or less of the particle capturing ratio of 45 % or more. It is again expected that the NCF layer thickness/ACF layer thickness of the particle capturing ratio of 40% or more = 12/4 = 3 times or less. As described above, the results of the review of the resin film material composed of the two-layer laminate are shown. However, the present invention is not limited thereto, and a resin film of three, four or more layers may be applied. Therefore, in order to increase the particle trapping rate, it is necessary to reduce the thickness of the entire resin film. However, considering the bonding strength between the resin film and the electrode 4, the portion of the XZ plane shown in Fig. 1 must be filled with the resin material. At the lowest point, according to the movement of the upper electrode 4, the minimum thickness Hmin of the resin film filled with the resin material in the XZ plane shown in Fig. 1 is as shown in Fig. 1, and the height of the pair of electrodes to be connected is H1 (=HU + Hs), the average 値 of the width of the electrodes 4, 6 is W1, and the interval (pitch) of the electrode 4 provided on the positive and negative sides in the x direction is W2, and is represented by the formula (9).

Hmin= ( ( W2 - W1 ) / W2 ) χΗΙ ··· (9) However, since it is necessary to provide particles in the resin film, the thickness of the entire resin film which can increase the particle capture rate is desirably "Hmin= ( ( W2 -W1 ) 201013710 /W2) χΗ1+ particle size" or less. Therefore, in the electronic component in which the resin film material containing the particles composed of one or more layers is electrically connected, the entire thickness of the resin film material containing the particles 1 composed of one or more layers between the electrodes is formed in the stage before the connection molding. For example, in the case of "((W2-W1) /W2) χΗ1 + particle size" or less, an electronic component electrically connected to a resin film containing particles can increase the particle capture rate. φ or more, although the particle-providing layer of the resin film material of two or more layers and the layer in which the particle is not provided are shown as an example in which several layers are not divided, the present invention is not limited thereto, and the particles may be provided with layers and Set the layer of particles into two or more layers. Further, although the particle-setting layer of the resin film material of two or more layers and the physical properties of the layer in which the particles are not provided are completely the same as in Table 1, the present invention is not limited thereto, and different physical properties of each layer may be used. A resin film of ruthenium. Further, although the results of analysis using an epoxy resin have been described above, the present invention is not limited thereto, and any resin material can be used. In the following review, the particle capture ratio defined by the ratio of the number of particles in the resin film existing between the electrodes 4 and 6 before forming and the number of particles 1 sandwiched between the electrodes 4 and 6 after molding can be improved. The physical properties of the resin film material. The resin material of the resin film can be used for the adhesive composition containing an epoxy resin, a latent curing agent for an epoxy resin, and a phenoxy resin, and if necessary, the conductive particles are dispersed. In the resin film material which is formed by the two-layer lamination in the thickness direction, the resin film material having the conductive layer in which the particles 1 are provided in the resin film layer of only one of the two layers of -29-201013710 is examined by flow analysis. The dimensions of the electrodes 4, 6 and the resin film material are shown in Fig. 15. In addition, an analytical model in which both the positive and negative directions in the X direction are symmetric is set. Here, in the two-layer resin film, the resin film layer in which the upper electrode 4 is connected is defined as the first layer, the resin film layer which is disposed in connection with the lower electrode 6 is defined as the second layer, and the particle-setting layer (conductive layer) is provided. In the second layer, the layer (insulating layer) not containing the particles 1 is provided on the first layer, and the height Hs of the lower electrode 6 is 0.5 pm. Here, the particle diameter is 4 μm, the thickness of the particle-setting layer is 8 μm, and the thickness of the entire resin film is always 16 μm. In addition, the number of grains contained therein is 400. Further, the temperature of the upper electrode 4 is raised from 25 °C to 2 °C for 10 seconds, and the resin film is heated by the temperature rise of the upper electrode 4. Further, the upper electrode 4 is moved in the direction of the lower electrode 6, and the moving speed of the upper electrode 4 at the initial stage is lxl 〇 -3 m/s. In addition, a commonly used fluid analysis software is used for flow analysis. In the analysis, in consideration of the initial moving speed of the electrode 4 and the change in the viscosity of the resin 2 and calculating the moving speed of the upper electrode 4, the particles 1 are provided in the resin 2 in a virtual mark particle pattern. Further, the heat generation reaction equation used for the analysis is the use of the formulae (1) to (5), and the viscosity formula is (6) to (8). Here, regarding the viscosity coefficient shown in the formulas (6) to (8), a resin material is used for the conductive layer of the second layer (after D, the resin material (1) is used for the insulating layer of the first layer (2) (3) Three resin materials 値. On the other hand, regarding the coefficient of the heat generation reaction formula represented by the formulas (1) to (5), -30-201013710 is the same as the resin layer of the first layer and the second layer. Further, 'resin 2 is an epoxy resin using a thermosetting resin, and the physical properties (coefficient of viscosity, coefficient of heat generation, density, thermal conductivity, specific heat) of (Ϊ) to (3) are shown in Table i. [1) After that. And about the resin reaction speed

-31 - 201013710 Resin (14) 1.0x10« 1200000 15450 5800 in I 1J6X10» 0.98 t^uxur2 "82X10» 3.3X1CP Ν 3 Resin (13) 0^8 1J8X10-* 4.82 X1(P x Iff· rw 0.02 Resin ( 12) 0.95 J 1^8x1 (Tz 4.B2X103 3^X10* eg 0.40 Resin (11) 098 iMxttr1 4.8ZX101 3*3 x 10* 0.10 Resin (10) 0.98 1M8X Ut* 4.82x10s 3*3X10» 0.13 Resin (9) 0.98 1J8X10*2 4Λ2Χ103 X3X10* CM an Resin (8) i 0.1» x to4 j 4.82X101 3JX101 CM s S 3 Resin (7) 1.0X10" 68000 15450 7000 s 136 x t0* αββ ojaxitr2 4.82X103 3>3X1 Furnace C4 N Resin (6) 0.98 Os4xurz 4,82 x 103 3·3Χ1(Ρ C4 3 Resin (5) |.(10) U5XI0-* 4,82 x10s 13X103 Ol 3 |Resin 1(4) 0.98 j 3.7ixKrJ 4.82 x10s 3·3Χ10> C4 3 Resin (3) α9β iMxur2 4.82 x 103 6.0X10» CM 3 Resin (2) 0.96 1 jjaxio-1 4.82 X10> 2.〇χΐσ* CM 3 Resin (1) a98 i^sxur2 (82X103 3.3X10» CX 3 jD iS ίδ ZSC? creel Curved «f- Density (ke/m3) specific heat (J /(kg*K)) mm conductivity (W/(mK)) -32- 201013710 Calculate the capture rate of particle 1 using this analysis method. The result obtained by analyzing the time change of the set viscosity is shown in Fig. 16. Thus, in addition, the minimum viscosity of the material (1) is set to be 1.3 times higher than the material (2) and 1.3 times lower than the material (3). Further, the material (3) has a lower viscosity than the lowest viscosity of (1), and thus, for example, the weight average molecular weight ratio (丨) is smaller. The analysis results of the capture ratio of the particles 1 are shown in Fig. 17, and the time variation between the substrates 4 and 6 is shown in Fig. 18. As shown in Fig. 17, the difference in the viscosity of the insulating layer of the first insulating layer and the second conductive layer does not cause a difference in the particle capturing ratio. The reason why the particle capture rate does not differ is examined using the results of Fig. 18. Fig. 18 is a graph showing the temporal change of the substrate interval. When the checkerboard spacing is 4 μm equal to the particle diameter, the number of particles sandwiched between the substrates and the capture ratio of the particles are determined. As shown in Fig. 18, the checkerboard spacing is equal to the particle size for about 1.5 s. However, as shown in Fig. 16, the viscosity of the resin materials (1) to (φ 3) set this time is equal to the time change of the viscosity up to 1 · 5 s and the difference is set only with the lowest viscosity. Therefore, since there is no difference in viscosity change up to 1.5 s in determining the particle trapping rate, as shown in FIG. 16, it is considered that even if there is a difference in the viscosity between the insulating layer of the first insulating layer and the second conductive layer, There is no difference in the particle capture rate. Thus, even if there is a difference in the lowest viscosity between the first insulating layer and the second conductive layer, the particle capturing ratio cannot be improved. Therefore, in the initial stage of joining formation up to 1.5 s, the material which differs in the viscosity of the first insulating layer and the second conductive layer is used for review. -33 - 201013710 The shape of Fig. 15 is used in the analysis. The diameter of the particle layer (the conductive layer) of the second layer is 4, 6, and 8 μm, and the thickness of the entire resin film is 16 μm. Here, regarding the viscosity type shown by the formulas (6) to (8), the resin material (1) is used for the second conductive layer, and the resin materials (1), (4) to (8) are used for the first insulating layer. ). On the other hand, regarding the heat generation reaction formula represented by the formulas (1) to (5), the resin material (1) is used in the same manner as the physical properties of the first layer and the second layer. Further, the resin 2 is an epoxy resin using a thermosetting resin, and the physical properties (viscosity, density, thermal conductivity, ratio, and exothermic reaction) of the resins (1) and (4) to (8) are shown in Table 1. Here, the resin (4) is set to 2 times the pre-bonding viscosity at 25 °C compared to the resin (1), and the resin (5) is a pre-bonding viscosity of 25 ° C compared to the resin (1). The ratio is set to 1/1.2 times, the resin (6) is set to 1/2 times the pre-bonding viscosity at 25 ° C compared to the resin (1 ), and the resin (7) is 25 compared to the resin (1). The viscosity before the connection of °C was set to 1/5 times, and the resin (8) was set to be 1/10 times the pre-bonding viscosity at 25 °C compared to the resin (1). The resin material of the resin film can be used to disperse conductive particles in an adhesive composition containing a latent curing agent for an epoxy resin or an epoxy resin and a phenoxy resin. Further, the temperature of the upper electrode 4 is raised from 25 ° C to 200 ° C for 10 seconds, and the upper electrode 4 is moved in the direction of the lower electrode 6. The moving speed of the initial upper electrode 4 is lx10_3 m/s. Further, the material (4) has a higher viscosity than (1), and thus has a weight average molecular weight ratio (1 - 34 - 201013710), for example. The calculation results of the time change of the viscosity of the resin used for the analysis are shown in Fig. 19. Here, the viscosity changes with respect to the resins (1), (4), (6), and (8) are shown, and the viscosity at the time Os of 25 t before the connection molding is shown. By using the resins (5) to (8)' in the first insulating layer, the viscosity difference from the initial state of the resin (1) used for the second conductive layer can be imparted. The analysis result of the φ particle capture rate is shown in Fig. 20. When the resin (4) is used for the first insulating layer, the viscosity of the insulating layer is higher than that of the conductive layer. Therefore, the resin material of the conductive layer having a low viscosity flows by compression between the substrates, and the resin material of the conductive layer is hard to remain. The particle capture rate is low between the substrates. On the other hand, when the resins (5) to (8) are used for the first insulating layer, the viscosity of the insulating layer is lower than that of the conductive layer, so that the resin material of the insulating layer having a low viscosity flows by compression between the substrates, and is electrically conductive. The resin material of the layer is liable to remain between the substrates, and the larger the difference in viscosity between the insulating layer and the conductive layer, the higher the particle capture rate is. Further, the smaller the thickness of the conductive layer of the particles is, the higher the particle trapping rate is. As described above, the viscosity of the resin used for the first insulating layer and the second conductive layer at 25 ° C can increase the particle trapping rate if the first insulating layer is lower than the second conductive layer. In particular, the viscosity at 25 ° C can increase the particle capture rate if the first insulating layer is 0.5 times lower than the second conductive layer. In addition, in the measurement of the viscosity, a rotary viscometer using a parallel plate or a cone/plate is used, and the film layer containing the particles is in the state of containing particles at a shear rate 〇.l (l/s), 25 Film measurement before joining and forming in °C - 35 - 201013710 The results of the two-layer resin film are shown. However, the present invention is not limited thereto, and any resin sheet of two or more layers may be used. Moreover, although the evaluation of the difference in viscosity between the two layers is performed as described above, the present invention is not limited to this, and the maximum enthalpy of the heat generation reaction rate measured by the differential scanning calorimeter of the insulating resin film layer is made by the ratio The structure of the resin film layer of the conductive particles on the lower temperature side can increase the particle trapping rate. For example, regarding the resin (14) and the resin (1) shown in Table 1, the pyrolysis reaction of the resin (14) used for the second layer (conductive layer) and the resin (1) used for the first layer (insulating layer) The speed (dQ/dt), the measurement result of the differential scanning calorimeter regarding the relationship between the heat generation reaction rate and the resin temperature at a temperature increase rate of 5 ° C /min is shown in Fig. 21 . Thus, the reaction speed of the resin (14) at a low resin temperature is the maximum enthalpy. Further, the viscosity of the first layer and the second layer was equal to that shown in Table 1. Therefore, if the exothermic reaction rate at the low resin temperature is the maximum, the viscosity of the α (reaction rate) function represented by the formulas (6) to (8) becomes high at a low temperature. Therefore, if the maximum thermal reaction rate of the first insulating layer is lower than that of the second conductive layer, the viscosity of the first insulating layer is higher than that of the second conductive layer, even if the substrate is compressed. It is difficult to flow, so the particle capture rate can be increased. In addition, in the measurement of the rate of reaction of the exothermic reaction, as shown in FIG. 8, in the relationship between the reaction rate of the exothermic reaction and the temperature of the resin, the rate of the exothermic reaction is maximized to be the resin located on the low temperature side, and is used for the conductive layer. . Next, the particle trapping rate was evaluated based on the analysis when the thermal conductivity of the first insulating layer and the second conductive layer were different. In the analysis, -36-201013710 is used in the shape of Fig. 12, the particle size is 4 μηη, and the thickness of the second layer particle-setting layer (conductive layer) is two levels of 4, 8 μm, and the thickness of the entire resin film is constant. 16μιη. With respect to the heat generating reaction formulas represented by the formulae (1) to (5), the viscosity formulas represented by the formulae (6) to (8) are used for the second layer conductive layer using the resin (1) shown in Table 1. The heat generation reaction formulas shown in the formulas (1) to (5) are used in the first insulating layer, and the viscosity formulas represented by the formulas (6) to (8) are the same as the resin (1) φ, but only the thermal conductivity. Resin (9)~(13) which is lower than resin (1). The physical properties of the resins (9) to (13) are shown in Table 1. Further, since the materials (9) to (13) have a lower thermal conductivity than (1), they are blended with a low heat conduction filler such as mica. Further, the temperature of the upper electrode 4 rises from 25 ° C to 200 ° C for 10 seconds, and the upper electrode 4 moves in the direction of the lower electrode 6. The moving speed of the electrode 10 at the initial stage is lxl 〇 '3 m/s. In addition, a commonly used fluid analysis software is used for flow analysis. The analysis result of the φ particle capture rate is shown in Fig. 22. Fig. 22 (a) is a view showing a case where the thickness of the conductive layer of the particles is set to 8 μm. Fig. 22 (b) is a result showing a case where the thickness of the conductive layer of the particle 1 is set to 4 μ?. Thus, in the case where the thermal conductivity of the first insulating layer is lower than the thermal conductivity of the second conductive layer, the particle trapping rate can be improved. At this time, heat is transferred from the upper electrode 4 to the resin film. If the thermal conductivity of the first insulating layer is low, it is difficult to transfer heat to the second conductive layer, so that the conductive layer has a higher viscosity than the insulating layer. Therefore, since the resin which is compressed between the electrodes is difficult to flow, the particle trapping rate can be improved. In particular, as shown in Fig. 22, if the thermal conductivity of the insulating layer of the first layer without the conductive layer of -37-201013710 is 0.7 times or less smaller than the conductive layer containing the conductive particles in the second layer, it can be improved. Particle capture rate. Further, in the case where the thickness of the conductive layer of the particles is set to 4 μm, since the thickness of the insulating layer having a low thermal conductivity of the first layer is large, it is difficult to transfer heat to the second conductive layer even when the thickness of the conductive layer is 8 μm. The particle trapping rate 〇 is described below as a resin film sheet which is laminated in two layers. However, the present invention is not limited thereto, and can be used for a resin film sheet in which two or more layers are laminated. An example of this is a three-layer laminated resin film, which is shown in FIG. Here, an insulating layer is provided on the uppermost side in the thickness direction of the outermost surface of the resin film, and a conductive layer is provided on the lowermost layer, and the thermal conductivity of the insulating layer 8 provided between the uppermost insulating layer and the lowermost conductive layer is sandwiched. The feature is lower than the uppermost insulating layer and the lowermost conductive layer. Since the thermal conductivity of the insulating layer 8 sandwiched between the uppermost insulating layer and the lowermost conductive layer is low, it is difficult to transfer heat to the conductive layer of the lowermost layer, the viscosity of the conductive layer is not lowered, and the conduction between the electrodes is conducted. Since the layer resin is difficult to flow, the particle trapping rate can be improved. Further, the measurement of the thermal conductivity is carried out by using a resin film in the state of containing particles in a state in which particles are contained, and measuring at a temperature of 25 ° C or lower. In the above, the particle-providing layer of the resin film material of two or more layers and the layer in which the particles are not provided are not divided into the plurality of layers. However, the present invention is not limited thereto, and the particle-setting layer is not provided. The layer of particles can be divided into two or more layers. Further, although the results of the analysis using the epoxy resin have been described above, the invention is not limited thereto, and any resin material can be used. Further, although the above describes the difference in physical properties between the particle placement position and the conductive layer and the insulating layer, the present invention is not limited thereto, and the conductive particles are laminated in the resin film layer of two or more layers in the thickness direction. In the resin film, at least one resin film layer including the resin film layer or the thickness direction center surface is adjacent to the center surface of the resin film sheet in the thickness direction of the equidistant distance, so as not to contain the above-mentioned conductive particles. The resin film formed of the insulating resin film φ layer has a lower viscosity of the insulating layer before joining and forming at 25 ° C than the conductive layer, and the insulating layer has the largest heat generating reaction rate measured by a differential scanning calorimeter. A resin film having a lower temperature side than the conductive layer and a lower thermal conductivity than the conductive layer may also be used. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a step of forming a connection between a semiconductor integrated circuit (1C) and a substrate using a resin material containing conductive particles; Figure 2 shows the shape of the electrode used in the analysis. Fig. 3 is a calculation result of the particle 1 capture ratio when the particles 1 are provided over the entire thickness of the resin film. Fig. 4 is a graph showing the calculation results of the particle capturing ratio when the particle layer thickness is 4 μ?. Fig. 5 is a graph showing the calculation results of the particle capturing ratio when the particle layer thickness is 6 μm. Fig. 6 is a graph showing the calculation of the particle capture ratio when the particle layer thickness is 8 μm -39 - 201013710. Fig. 7 is a view showing the resin flow velocity distribution and the particle position in the X direction in the connection molding using the two-layer resin film in the shape (1). Fig. 8 is a view showing the resin flow velocity distribution and the particle position in the X direction in the connection molding using the three-layer resin film in the shape (1). Fig. 9 shows the calculation results of the shape of each electrode (the particle trapping rate when the particle 1 is placed in the first layer) / (the particle capturing ratio when the particle 1 is placed in the second layer). Fig. 10 is a calculation result of the capture rate when the particles are set in the first layer and the capture rate when the particles are set in the second layer. Fig. 11 shows the calculation results of the particle trapping ratio when the thickness of the entire two resin sheets was changed by 10, 12, 14, and 16 μm. Fig. 12 shows a structure in which a resin film having a two-layer structure is provided with an insulating layer not containing particles in a central portion of the thickness direction. Fig. 13 is a view showing a structure in which a resin film having a three-layer structure is provided with an insulating layer not containing particles in a central portion of the thickness direction. @ Fig. 14 is a structure in which a resin film having a four-layer structure is provided with an insulating layer not containing particles in a central portion of the thickness direction. Figure 15 shows the shape of the electrode used in the analysis. Fig. 16 shows the calculation results of the temporal change in the viscosity of the resin (1) (2) (3). Fig. 17 shows the calculation results of the particle trapping ratio when the resin (1) is used for the conductive layer and the resins (1), (2) and (3) are used for the insulating layer. Fig. 18 is a calculation result of the time change of the checkerboard interval when the resin (1) is used for the conductive layer and the resin is used for the insulating layer -40-201013710 (1) (2) (3). Fig. 19 shows the calculation results of the temporal changes in the viscosity of the resins (1) (4) (6) (7) and (8). Figure 20 is a calculation result of the particle capture ratio when the resin (1) is used for the conductive layer and the resin (1) (4) (6) (7) (8) is used for the insulating layer. Fig. 21 is for the resin (1) (计算) The calculation result of the relationship between the heat reaction rate and the resin φ speed. Fig. 22 shows the calculation results of the particle trapping ratio when the resin (1) is used for the conductor and the resin (9) (10) (11) (12) (13) is used for the insulating layer. Fig. 23 shows a structure in which a resin film having a three-layer structure is provided with an intermediate layer sandwiched between the uppermost insulating layer and the lowermost conductive layer, and an insulating layer not containing particles having low thermal conductivity is provided. Fig. 24 is a view showing the (electrode pitch) / (electrode height φ degree) of each electrode shape as the horizontal axis, (the complement ratio of the first layer setting) / (the complement ratio of the second layer setting) as the vertical axis Results map. [Description of main component symbols] 1 : Conductive particles 2 · Resin material 3 : Semiconductor integrated circuit (1C) 4 : Upper electrode 5 : Substrate - 41 - 201013710 6 : Lower electrode 7 : Center point in the thickness direction of the resin film The surface 8 of the composition: the insulating layer of the uppermost insulating layer and the lowermost conductive layer

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Claims (1)

201013710 VII. Patent application scope 1. A resin film containing conductive particles, which comprises a conductive resin film layer containing an electroconductive particle or an insulating resin film layer laminated in two or more layers in the thickness direction. The resin film of the particles is characterized in that a resin film layer having a center surface in the thickness direction of the equidistant position of both surfaces of the resin film or at least one resin film layer adjacent to the center surface in the thickness direction is contained therein. The insulator is formed of the above-mentioned insulating resin film layer. 2. The resin film containing conductive particles in the first aspect of the patent application, wherein the thickness of the resin film layer containing the conductive particles in the thickness direction is set to be larger than the particle diameter of the conductive particles. Further, it is smaller than 1.1 times the particle diameter of the above conductive particles. 3. The resin film containing conductive particles in the first aspect of the patent application, wherein the thickness of the resin film layer containing the conductive particles in the thickness direction is set to be larger than the particle diameter of the conductive particles. And it is smaller than 1.5 times the particle diameter of the above-mentioned φ electrically conductive particles. 4. The resin film containing conductive particles in the first aspect of the patent application, wherein the thickness of the resin film layer containing the conductive particles in the thickness direction is set to be larger than the particle diameter of the conductive particles. Further, it is smaller than twice the particle diameter of the above conductive particles. 5. The resin film containing conductive particles in the first aspect of the patent application, wherein the thickness of the resin film layer containing the conductive particles in the thickness direction is set to be larger than the resin film not containing the conductive particles The thickness in the thickness direction of the layer is 1.5 times smaller. -43-201013710 6. The resin film containing conductive particles in the first aspect of the patent application, wherein the thickness of the resin film layer containing the conductive particles in the thickness direction is set to be higher than the above-mentioned non-inclusive conductivity The thickness of the resin film layer of the particles in the thickness direction is 2.5 times smaller. 7. The resin film containing conductive particles in the first aspect of the patent application, wherein the thickness of the resin film layer containing the conductive particles in the thickness direction is set to be larger than the resin film not containing the conductive particles. The thickness in the thickness direction of the layer is 3.5 times smaller. 8. A resin film containing a conductive particle in which a resin film layer containing an electroconductive particle or an insulating resin film layer is laminated in three or more layers in the thickness direction, and the feature is internally contained a resin film layer on the center surface in the thickness direction of the equidistant position of both surfaces of the resin film or at least one resin film layer adjacent to the center surface in the thickness direction is formed of the insulating resin film layer on the resin film Both of the resin film layers in the uppermost and lowermost ends in the thickness direction adjacent to both surfaces of the sheet are formed of a resin film layer containing conductive particles. 9. The resin film containing conductive particles in the eighth aspect of the patent application, wherein the thickness of the resin film layer containing the conductive particles in the thickness direction is set to be at the uppermost and lowermost ends Both of the resin film layers are larger than the particle diameter of the above-mentioned conductive particles, and are smaller than 1.1 times the particle diameter of the above-mentioned conductive particles. 10. The resin 201013710 film containing conductive particles in the eighth aspect of the patent application, wherein the thickness of the resin film layer containing the conductive particles in the thickness direction is set to be larger than the particle diameter of the conductive particles. It is larger and smaller than 1.5 times the particle diameter of the above-mentioned conductive particles. The resin film containing conductive particles in the eighth aspect of the patent application, wherein the thickness of the resin film layer containing the conductive particles in the thickness direction is set to be larger than the particle diameter of the conductive particles. Moreover, it is smaller than twice the particle diameter of the above-mentioned conductive particles. 12. The resin film containing conductive particles in the eighth aspect of the patent application, wherein the thickness of the resin film layer containing the conductive particles in the thickness direction is set to be larger than the resin film not containing the conductive particles The thickness of the layer in the thickness direction is 1.5 times smaller. 13. The resin film containing conductive particles in the eighth aspect of the patent application, wherein the thickness of the resin film layer containing the conductive particles in the thickness direction is set to be larger than the resin film not containing the conductive particles The thickness of the layer in the thickness direction is 2.5 times smaller. 14. The resin film containing conductive particles in the eighth aspect of the patent application, wherein the thickness of the resin film layer containing the conductive particles in the thickness direction is set to be larger than the resin containing no conductivity or particles. The thickness of the film layer in the thickness direction is 3.5 times smaller. 15. An electronic component in which a resin film containing conductive particles is electrically connected, and a resin film layer containing an electroconductive particle or an insulating resin film layer is laminated in two or more layers in the thickness direction. An electronic component in which a resin film containing conductive particles is electrically connected is characterized in that, in a stage before joining and forming, a center surface of a thickness direction equidistant from a surface of the resin film-45-201013710 is contained inside. The resin film layer or at least one resin film layer adjacent to the center surface in the thickness direction is disposed between the electrodes of the electronic component by the resin film containing the conductive particles formed of the insulating resin film layer. The resin of the resin film layer is heated and flowed, and the electrodes are compressed to shorten the interval between the electrodes to form a connection, thereby electrically connecting the resin film containing the conductive particles. 16 An electronic component in which a resin film containing conductive particles is electrically connected, wherein the above-mentioned resin film containing conductive particles is the above Thickness direction of the resin film layer containing the conductive particles, the particle diameter is set to be larger than that of the conductive particles, and smaller than 1.1 times the above-described particle diameter of the conductive particles. 17. An electronic component in which a resin film containing conductive particles is electrically connected as in the fifteenth aspect of the patent application, wherein the sum of the heights of the pair of electrodes to be connected to the electronic component is regarded as the average of the width of the electrode and the width of the electrode. In the case where the electrode spacing is W2 and the particle diameter is regarded as H2, in the case where ((W2-W1) X ( H1+H2 ) 3 ) / ( W1 xH23 ) is 9〇 or more, Among the two electrodes to be connected, the outermost layer in the thickness direction of the electrode side having a high electrode height is provided with a film layer containing particles to perform connection molding. 1 8 . The electronic component in which the resin film containing the conductive particles is electrically connected as in the fifteenth aspect of the patent application, in the case where the (electrode pitch W2 ) / (electrode height H1 ) is 0.7 or more The outermost layer in the thickness direction of the electrode side having the high electrode height among the two electrodes connected, -46-201013710, the film layer containing the particles is provided for connection molding. 19. An electronic component in which a resin film containing conductive particles is electrically connected as in claim 15 of the patent application, wherein a sum of heights of a pair of electrodes to be connected to the electronic component is regarded as an average of H1 and electrode widths. In the case where W1 and the electrode pitch are regarded as W2, the thickness of the entire resin film material provided between the electrodes is "((W2-W1) / W2) χΗ1 + particle diameter" or less. Φ 20. The electronic component in which the resin film containing the conductive particles is electrically connected as in the fifteenth item of the patent application, wherein the sum of the heights of the pair of electrodes to be connected to the electronic component is regarded as H1, the average of the electrode widths In the case where W is regarded as W1 and the electrode pitch is regarded as W2, the thickness of the entire resin film material provided between the electrodes is "((W2-W1) / W2) χΗ1 + particle diameter x0_25" or less). 2 1. An electronic component in which a resin film containing conductive particles is electrically connected as in the fifteenth aspect of the patent application, wherein the sum of the heights of the pair of electrodes to be connected to the electronic component is regarded as Η1, and the electrode width is In the case where the average 値 is regarded as W1 and the electrode pitch is regarded as W2, the thickness of the entire resin film material provided between the electrodes is "((W2-W1) / W2) χΗ1 + particle diameter χ0·5" or less). 22. The electronic component in which the resin film containing the conductive particles is electrically connected as in the fifteenth aspect of the patent application, wherein the sum of the heights of the pair of electrodes to be connected to the electronic component is regarded as Η1, and the average of the electrode widths. In the case where W1 and the electrode pitch are regarded as W2, the thickness of the entire resin film material provided between the electrodes is -47 - 201013710 "((W2-W1) /W2) χΗ1 + particle diameter χ0·75" or less. A resin film containing conductive particles in a resin film layer containing an electroconductive particle or an insulating resin film layer, and laminating two or more layers of resin containing conductive particles in the thickness direction The film is characterized in that the viscosity of the insulating resin film layer is lower than that of the resin film layer containing the conductive particles. 24. The resin film containing conductive particles in the 23rd aspect of the patent application, wherein the viscosity of the insulating resin film layer is set to be 0.5 times or less lower than the viscosity of the resin film layer containing the conductive particles. 25. A resin film containing conductive particles in a resin film layer containing an electroconductive particle or an insulating resin film layer, and laminating two or more layers of a resin containing conductive particles in a thickness direction The film is characterized in that the resin film layer containing the conductive particles has a maximum heat generation reaction rate measured by a differential scanning calorimeter, and is located on the lower temperature side than the insulating resin film layer. 2 6. A resin film containing conductive particles, which is a resin film layer containing an electroconductive particle or an insulating resin film layer, and laminates two or more layers of conductive particles in a thickness direction. The resin film is characterized in that the thermal conductivity of the insulating resin film layer is lower than the thermal conductivity of the resin film layer containing the conductive particles. 27. The resin film containing conductive particles in the scope of claim 26, wherein the thermal conductivity of the insulating resin film layer is set to be 0.7 times lower than the thermal conductivity of the resin film layer containing the conductive particles. the following. 28. A resin film containing conductive particles, which is a resin film layer containing an electric particle of -48-201013710 or an insulating resin film layer, and is laminated in three or more layers in the thickness direction. The resin film of the conductive particles is characterized in that an insulating resin film layer is provided on the uppermost surface in the thickness direction of the outermost surface of the resin film, and a resin film layer containing conductive particles is provided at the bottom. The thermal conductivity of the insulating resin film layer provided between the uppermost insulating resin film layer and the resin film layer containing the conductive particles in the lowermost layer is higher than the uppermost insulating resin film layer and the lowermost layer. φ The resin film layer containing conductive particles has a lower thermal conductivity. 29. A resin film comprising conductive particles in claim 23, wherein the insulating resin film layer has a thermal conductivity lower than a thermal conductivity of the resin film layer containing the conductive particles. 30. A resin film containing conductive particles in claim 23, wherein the resin film layer containing the conductive particles has a maximum heat generation reaction rate measured by a differential scanning calorimeter, and is more insulating than the insulating film. The resin film layer is located on the lower temperature side. Φ 31. The resin film containing conductive particles in the 23rd aspect of the patent application, wherein the insulating resin film layer has a thermal conductivity lower than that of the resin film layer containing the conductive particles, and contains The resin film layer of the conductive particles has a maximum heat generation reaction rate measured by a differential scanning calorimeter, and is located on the lower temperature side than the insulating resin film layer. 32. A resin film comprising conductive particles in the first aspect of the patent application, wherein the insulating resin film layer has a viscosity lower than that of the resin film layer containing the conductive particles. 3 3. Resin containing conductive particles in the eighth aspect of the patent application -49- 201013710 Membrane The viscosity of the insulating resin film layer is lower than that of the resin film layer containing the conductive particles. 34. A resin film comprising conductive particles in the first aspect of the patent application, wherein the insulating resin film layer has a thermal conductivity lower than a thermal conductivity of the resin film layer containing the conductive particles. 35. A resin film comprising conductive particles in the eighth aspect of the patent application, wherein the insulating resin film layer has a thermal conductivity lower than a thermal conductivity of the resin film layer containing the conductive particles. 3. 6. An electronic component characterized in that a resin film containing conductive particles as set forth in any one of claims 23 to 35 is disposed between electrodes of an electronic component to be joined to form the electrode Electrically connected. -50-