KR101737173B1 - Anisotropic conductive films, a method for preparing the same, and semiconductive devices comprising the same - Google Patents

Abstract

The present invention has a multilayer structure in which a conductive layer containing conductive particles and an insulating resin layer are laminated,
Wherein the conductive layer comprises a (meth) acrylate-based polymerizable material and a radical polymerization initiator,
An anisotropic conductive film having a peak height ratio of the formula 1 in an infrared spectrophotometer of the conductive layer of 0.15 or less, a process for producing the anisotropic conductive film, and a semiconductor device connected by the film.
[Formula 1]
Peak height ratio = A ₁ / A ₂
In the above formula 1, A ₁ is the peak height at 810 cm ^-1 of the infrared spectrophotometer, and A ₂ is the peak height at 2930 cm ^-1 .

Description

TECHNICAL FIELD The present invention relates to an anisotropic conductive film, an anisotropic conductive film, a method for manufacturing the same, and a semiconductor device including the same.

The present invention relates to an anisotropic conductive film, a method for producing the same, and a semiconductor device including the same.

The anisotropic conductive film is a film in which conductive particles such as metal particles such as nickel or gold or polymer particles coated with such metals are dispersed. The anisotropic conductive film has conductivity in the z-axis and electrical conductivity in the xy plane direction Refers to a film exhibiting insulation.

When the anisotropic conductive film is placed between the circuits to be connected and subjected to a heating and pressing process under a certain condition, the circuit terminals are electrically connected by the conductive particles, and the space between the circuit terminals is connected with the insulating adhesive resin So that the conductive particles exist independently of each other, thereby giving a high insulating property.

In recent years, the pitch between the display electrodes and the circuits has become finer in order to cope with the realization of high image quality of the display media, and the risk of short circuit between electrodes or increase of connection resistance is increasing. This is believed to be due to the fact that when the adhesive layer containing conductive particles is compressed, the conductive particles can not be positioned between the circuit terminals and flow into the adjacent space portions to cause shorting or increase the connection resistance.

Therefore, it is possible to prevent the risk of short-circuiting between the electrodes by controlling the flow of the adhesive layer including the conductive particles, and also to improve the particle trapping rate between the electrodes after connection (the number of particles existing between the electrodes before connection and the number of particles Of the anisotropically conductive film is increased to lower the connection resistance.

Japanese Laid-Open Patent Application No. 2013-125598 Korean Patent Application Publication No. 2011-0130376

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It is an object of the present invention to provide an anisotropic conductive film which can prevent short-circuit between electrodes and has a low connection resistance.

Another object of the present invention is to provide an anisotropic conductive film which can improve the connection reliability by increasing the number of effective particles located between electrodes and electrodes after connection, and a method for manufacturing the same.

One example of the present invention has a multilayer structure in which a conductive layer containing conductive particles and an insulating resin layer are laminated,

Wherein the conductive layer comprises a (meth) acrylate-based polymerizable material and a radical polymerization initiator,

Wherein the peak height ratio of the formula 1 in the infrared spectrophotometer of the conductive layer is 0.15 or less.

[Formula 1]

Peak height ratio = A ₁ / A ₂

In the above formula 1, A ₁ is the peak height at 810 cm ^-1 of the infrared spectrophotometer, and A ₂ is the peak height at 2930 cm ^-1 .

Another example of the present invention is a multilayer structure having a multilayer structure in which a conductive layer containing conductive particles and an insulating resin layer are laminated,

Wherein the conductive layer comprises a (meth) acrylate-based polymerizable material and a radical polymerization initiator,

Wherein the conductive layer has an indentation elastic modulus of 50 to 250 MPa.

Another example of the present invention is a method of forming a conductive layer on a base film by applying a conductive layer composition comprising conductive particles, a (meth) acrylate-based polymerizable substance and a radical polymerization initiator,

The base film coated with the conductive layer composition is partially or fully polymerized at 90 to 200 캜 for 1 to 10 minutes,

And a multilayer structure in which a conductive layer and an insulating resin layer are laminated, which comprises laminating the pre-polymerized conductive layer and an insulating resin layer.

Another example of the present invention relates to a semiconductor device connected by the anisotropic conductive film.

The anisotropic conductive film according to an exemplary embodiment of the present invention minimizes the fluidity of the conductive particles by partially polymerizing or completely polymerizing the conductive layer, thereby preventing shorting between the electrodes and lowering the connection resistance.

The anisotropic conductive film according to an example of the present invention is characterized in that the adhesion ratio of the conductive particles is as high as 40% or more, so that the connection reliability is excellent and the pressing property at the time of pressing is also good.

1 is a cross-sectional view of a semiconductor device connected by an anisotropic conductive film according to an example of the present invention.

Hereinafter, the present invention will be described in more detail. Those skilled in the art will appreciate that various modifications, additions, and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. &Quot; comprises, " and / or "comprising" when used in this specification do not exclude the presence of stated elements or steps.

It will be understood that when an element or layer is referred to as being "on" or " on "of another configuration or layer, All included.

One example of the present invention,

A conductive layer containing conductive particles, and an insulating resin layer,

Wherein the conductive layer comprises a (meth) acrylate-based polymerizable material and a radical polymerization initiator,

Wherein the peak height ratio of the formula 1 in the infrared spectrophotometer of the conductive layer is 0.15 or less.

[Formula 1]

Peak height ratio = A ₁ / A ₂

In the above formula 1, A ₁ is the peak height at 810 cm ^-1 of the infrared spectrophotometer, and A ₂ is the peak height at 2930 cm ^-1 . Here, A _{2, which} is the peak height at 2930 cm ^-1 , represents the degree of CH of the methyl group in the conductive layer and is a reference peak independent of the curing reaction. A _{1, which} is the peak height at 810 cm ^-1 , C = CH bonds, and when the double bonds are broken during curing, the peak height is reduced because the structure is CCH. Accordingly, the peak height ratio of the formula 1 is 0.15 or less, which is related to the fact that the double bonds in the acrylate-based polymerizable material in the conductive layer are converted into a single bond and partially or fully polymerized as the curing proceeds. When the conductive layer is in the above range, the fluidity is controlled by partially polymerizing or completely polymerizing the conductive layer, thereby increasing the coverage of the conductive particles and reducing the rate of occurrence of short-circuiting between electrodes. The peak height ratio may be specifically 0.10 or less, more specifically 0.05 to 0.10, and more specifically 0.06 to 0.09 or less.

In the present specification, the term 'height of peak' means that when the transmittance is converted into absorbance in the infrared spectrum graph result in which the x-axis is the wavenumber (cm ^-1 ) and the y-axis is the transmittance (% Means the height from the baseline to the maximum absorbance in the wave number at which the absorbance appears

Another example of the present invention is a multilayer structure having a multilayer structure in which a conductive layer containing conductive particles and an insulating resin layer are laminated,

Wherein the conductive layer comprises a (meth) acrylate-based polymerizable material and a radical polymerization initiator,

Wherein the conductive layer has an indentation elastic modulus of 50 to 250 MPa.

The reason why the stiffness of the indentation is in the above-mentioned range is that the conductive layer is partially polymerized or completely polymerized, but the conductive layer can be sufficiently pressed so that connection reliability can be exhibited. In the case of the thermosetting resin composition, if the conductive layer is linearly cured for the purpose of reducing the fluidity of the conductive layer and improving the trapping rate of the particles, the viscosity of the conductive layer after curing becomes high, so that the conductive layer is not sufficiently pressed during compression. In the present invention, even when the conductive layer is preliminarily polymerized using the (meth) acrylate-based polymerizable substance and the radical polymerization initiator as the thermoplastic composition, its viscosity is kept relatively low, and the compressibility of the conductive layer after compression can be improved.

In the present application, the indentation modulus may be in the range of 50 to 250 MPa, more specifically, 80 to 200 MPa.

In the present invention, the elastic modulus can be measured by, for example, a nano hardness meter (nanoindenter). Specifically, the conductive layer is set to an Indentation mode using a Hysitron TI750 Ubi device, the feedback mode is set to Displacement control, and the tip is set to Berkovitz tip, Max. Displacement can be measured at 1000 nm to measure the value of the indentation elastic modulus.

The pre-polymerization, partial polymerization, or complete polymerization of the conductive layer in the present invention means that after the conductive layer composition containing the conductive particles, the (meth) acrylate-based polymerizable substance and the radical polymerization initiator is applied onto the base film and the insulating resin layer Quot; means curing at 90 to 200 DEG C for 1 minute to 10 minutes before lamination. More specifically, it may be cured at 90 to 180 ° C for 1 minute to 10 minutes, more specifically at 90 ° C to 170 ° C for 1 to 10 minutes, but the present invention is not limited thereto, provided that the conductive layer can be linearly polymerized. This is distinguished from a drying process in which a conductive layer composition is usually applied on a base film and then the solvent in the conductive layer composition is volatilized. Conventional drying processes are generally carried out at low temperatures of about 50 ° C to about 80 ° C, while curing is carried out under the above pre-polymerization conditions until the conductive layer is totally or partially polymerized here. In one example, the conductive layer in the present invention is a partially polymerized state, which refers to 20 to 80% of the pre-cured calorific value of the conductive layer as measured by DSC, which is 20 to 80% cured. In the present invention, the calorific value of the whole surface can be defined as the DSC curve area (A ₀ ) of the conductive layer measured after volatilizing the solvent in a hot air circulating oven at 70 ° C for 5 minutes. Therefore, in one example, the calorific value is determined by measuring the DSC curve area (A ₀ ) of the conductive layer after the solvent is volatilized in a hot air circulating oven at 70 ° C for 5 minutes, and calculating the DSC curve area (A ₁ ) can be measured and found by the following equation (2).

[Formula 2]

Curing rate (%) = [(A ₀ - A ₁ ) / A ₀ ] X 100

Specifically, the area (A ₀ ) is the sum of the temperature at which the reaction of the conductive layer roughening the solvent is started and the temperature at the end of the reaction, on the x-axis and the heat flow curve on the x- It refers to the area within the closed space created by

 In another example, the conductive layer may be in a fully polymerized state when measured by DSC, which refers to a state in which 80% to 100% of the calorific value of the conductive layer is exothermic.

By lowering the fluidity of the conductive layer by the pre-polymerization process as described herein, the trapping rate at which the conductive particles are trapped between the electrodes when pressed between the electrodes can be increased.

Herein, the anisotropic conductive film may be a multilayer structure in which an insulating resin layer is laminated on the conductive layer. For example, it may be a two-layer structure in which a conductive layer and an insulating resin layer are laminated, or a three-layer structure in which a first insulating resin layer and a second insulating resin layer are laminated on both surfaces of a conductive layer, 1 structure in which one insulating resin layer and a second insulating resin layer are laminated and a third insulating resin layer is laminated on any one of the insulating resin layers.

In the case of a two-layer structure, the thickness of the insulating resin layer may be larger than the thickness of the conductive layer, and specifically, the thickness of the insulating resin layer may be in the range of one to four times the thickness of the conductive layer. In this range, the insulating resin is sufficiently filled between adjacent circuits, so that good insulation and adhesion can be exhibited. The thickness of the conductive layer may be in the range of 0.5 to 2 times the particle diameter of the conductive particles.

In the case of a three-layer structure, the thickness of the first insulating resin layer may be 2 占 퐉 or less, the thickness of the second insulating resin layer may be in a range of 7 to 18 占 퐉, and the thickness of the conductive layer may be 0.5 to Can be doubled. More specifically, the thickness of the first insulating resin layer is 1? And the thickness of the second insulating resin layer may be in the range of 7 to 15 mu m and the thickness of the conductive layer may be 0.5 to 1.5 times the particle diameter of the conductive particles.

By pre-polymerizing the conductive layer in the present invention, the coverage of the conductive particles can be 40% or more, specifically 45% or more, more specifically 50% or more, and more particularly 55% or more. In a particularly preferred example, the coverage of the conductive particles may be at least 60%.

In the present invention, a curing system including a (meth) acrylate-based polymerizable material and a radical polymerization initiator may be used so that the conductive layer is linearly polymerized to increase the coverage of the conductive particles and to exhibit sufficient compressibility upon compression. The (meth) acrylate-based polymerizable material can be used without particular limitation as long as it has a (meth) acrylate polymerized by a radical. For example, a (meth) acrylate oligomer or a (meth) have. Generally, when the conductive layer is linearly polymerized for the purpose of improving the trapping rate of the particles by lowering the fluidity, the viscosity of the conductive layer after curing is increased, so that the conductive layer is not sufficiently pressed at the time of compression, thereby deteriorating the connection reliability. In the present invention, by using the curing system, the viscosity of the conductive layer is kept relatively low even when the conductive layer is preliminarily polymerized, so that not only the compressibility of the conductive layer after compression but also the trapping rate of the particles can be improved.

As the (meth) acrylate oligomer, one or more kinds of oligomers selected from the group of (meth) acrylate oligomers known in the prior art may be used without limitation, preferably urethane (meth) acrylate, epoxy (Meth) acrylate, maleimide-modified (meth) acrylate, maleimide-modified (meth) acrylate, fluorine-based (meth) (Methacrylate) may be used alone or in combination of two or more.

Specifically, the urethane-based (meth) acrylates have a structure in which the intermediate structures of the molecules are composed of a polyester polyol, a polyether polyol, a polycarbonate polyol, a polycarprolactone polyol, Polybutadiene diol, polydimethylsiloxane diol, ethylene glycol, propyleneglycol, 1,4-butanediol, and the like. Butanediol, 1,5-pentanediol, 1,6-hexanediol, neopentyl glycol, 1,4-cyclohexanediol, But are not limited to, 1,4-cyclohexane dimethanol, bisphenol A, hydrogenated bisphenol A, 2,4-toluenediisocyanate, 1,3-xylene diisocyanate, 1,4-xylene diisocyanate, 1,5-naphthalene diisocyanate, 1,6-hexane diisocyanate, Diisocyanate, 1,6-hexan diisocyanate, and isophorone diisocyanate can be used.

Examples of the epoxy (meth) acrylate-based resin include bisphenols such as 2-bromohydroquinone, resorcinol, catechol, bisphenol A, bisphenol F, bisphenol AD and bisphenol S, (Tetrabromobisphenol A), a nitro group, and the like, which are constituted of a skeleton such as an alkyl group, a cyclohexylphenyl group, a cyclohexylphenyl group, (Meth) acrylate oligomer. In addition, the (meth) acrylate oligomer of the present invention may contain at least two maleimide groups in the molecule, for example, 1-methyl-2,4- N, N'-m-tolylene bismaleimide, N, N'-m-phenylene bismaleimide, N, , 4-biphenylene bismaleimide, N, N'-4,4- (3,3'-dimethylbiphe N, N'-4,4- (3,3'-dimethyldiphenylmethane) bismaleimide, N, N'- ) Bismaleimide, N, N'-4,4-diphenylmethane bismaleimide, N, N'-4,4-diphenylpropanebismaleimide, N, N'- Maleimide, N, N'-3,3'-diphenylsulfonylbismaleimide, 2,2-bis (4- (4-maleimidophenoxy) phenyl) propane, 2,2- (4-methylphenoxy) phenyl) decane, 4,4'-cyclohexylidenebis (1 Bis (4- (4-maleimidophenoxy) phenyl) hexafluoropropane, etc. may be used alone or in combination of two or more.

As the (meth) acrylate monomers that can be used herein, at least one monomer selected from the (meth) acrylate monomer group known in the prior art can be used without limitation. (Meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, (Meth) acrylate, 2-hydroxyalkyl (meth) acryloylphosphate, 4-hydroxycyclohexyl (meth) acrylate, , Neopentyl glycol mono (meth) acrylate, trimethylol propanedi (meth) acrylate, trimethylol propane di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) (Meth) acrylate, pentaerythritol hexa (meth) acrylate, dipentaerythritol hexa (metha) acrylate, glycerin di (meth) acrylate, t- (Meth) acrylate, stearyl (meth) acrylate, lauryl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, isobonyl Acrylate, triethylene glycol di (meth) acrylate, tridecyl (meth) acrylate, ethoxy adduct nonylphenol (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (Meth) acrylate, triethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, ethoxy addition type bisphenol (Meth) acrylate, cyclohexanedimethanol di (meth) acrylate, phenoxy-t-glycol (meth) acrylate, 2-methacryloyloxyethyl phosphate, tricyclodecanedimethanol di )Ah Relate, trimethylol may be propane benzoate acrylate, fluorene-based (meth) acrylate and at least one selected from the group consisting of a mixture thereof.

The (meth) acrylate-based polymeric material may be used in an amount of about 10 to about 40 wt%, for example, about 15 to about 35 wt%, or about 15 to about 30 wt%, based on the total weight of the conductive layer % ≪ / RTI >

As the radical polymerization initiator that can be used in the present invention, for example, peroxide type or azo type can be used. Specific examples of the peroxide initiator include t-butyl peroxylaurate, 1,1,3,3-t-methylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl- (2-ethylhexanoylperoxy) hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanoate, 2,5-dimethyl- butyl peroxyisopropyl monocarbonate, t-butyl peroxy-2-ethylhexyl monocarbonate, t-hexyl peroxybenzoate, t-butyl peroxyacetate, dicumyl peroxide, 2,5-dimethyl T-butyl peroxyneodecanoate, t-hexyl peroxy-2-ethylhexanoate, t-butyl peroxy (t-butylperoxy) T-butylperoxyisobutyrate, 1,1-bis (t-butylperoxy) cyclohexane, t-hexylperoxyisopropylmonocarbonate, t-butylperoxy- 3,5,5-trimethylhexanonate, t- Butyl peroxypivalate, cumyl peroxyneodecanoate, di-isopropylbenzene hydroperoxide, cumene hydroperoxide, isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexa Butanol peroxide, octanolate peroxide, lauryl peroxide, stearoyl peroxide, succin peroxide, benzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, benzoyl peroxytoluene, 1,1,3 , 3-tetramethylbutyl peroxyneodecanoate, 1-cyclohexyl-1-methylethyl peroxynoedecanoate, di-n-propyl peroxydicarbonate, di-isopropyl peroxycarbonate, bis Di (2-ethylhexyl peroxy) dicarbonate, dimethoxybutyl peroxy dicarbonate, di (3-t-butylcyclohexyl) peroxydicarbonate, Methyl-3-methoxybu Peroxy) dicarbonate, 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, t-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1- (t-butylperoxy) cyclododecane, 2,2- (T-butyl) dimethylsilyl peroxide, t-butyltriallylsilyl peroxide, bis (t-butyl) diallylsilyl peroxide, tris (t-butyl) arylsilyl peroxide and the like.

Specific examples of the azo-based initiator include 2,2'-azobis (4-methoxy-2,4-dimethylvaleronitrile), dimethyl 2,2'-azobis (2-methylpropionate) Azobis (N-cyclohexyl-2-methylpropionimide), 2,2-azobis (2,4-dimethylvaleronitrile), 2,2'-azobis Azobis [N-butyl-2-methylpropionimide], 2,2'-azobis [N- (2-propenyl) Azobis [cyclohexane-1-carbonitrile], 1 - [(cyano-1-methylethyl) ) ≪ / RTI > azo] formamide, and the like.

The radical polymerization initiator may be used in an amount of about 0.5 to about 10 wt% based on the total weight of the conductive layer, and may be used in the range of about 1 to about 8 wt%, or about 1 to about 6 wt%, for example. have.

The conductive particles that can be used in the present invention include, for example, metal particles including Au, Ag, Ni, Cu, and Pb, carbon particles, particles coated with a metal on a polymer resin, or particles coated with a metal on a polymer resin Insulated particles or the like can be used. As the polymer resin, polyethylene, polypropylene, polyester, polystyrene, polyvinyl alcohol and the like can be used, but the present invention is not limited thereto. Examples of the metal coating the polymer resin include, but are not limited to, Au, Ag, Ni, Cu, and Pb. Specifically, in the case of OLB (Outer Lead Bonding), since the adherend is an ITO (Indium Tin Oxide) glass surface, the core portion is made of a plastic material so that the ITO is not damaged by the pressure generated in the connection process of the anisotropic conductive film Metal particles such as Ni can be used to connect a PCB substrate. In the case of a PDP (Plasma Display Panel), a voltage applied to a circuit is very high, so that gold (Au) ). In the case of COG (Chip On Glass) or COF (Chip On Film) having a narrow pitch, insulated conductive particles coated with a thermoplastic resin on the surface of the conductive particles can be used. The size of the conductive particles may be selected depending on the application in the range of 1 to 30 μm, preferably 1 to 10 μm, depending on the pitch of the applied circuit.

The conductive particles may be contained in an amount of 1 to 40% by weight, more specifically 15 to 40% by weight, based on the total weight of the conductive layer of the anisotropic conductive film. Stable connection reliability can be ensured within the above range, and electrical short-circuiting caused by the accumulation of conductive particles in the pitch during the thermocompression bonding can be prevented.

Herein, the conductive layer includes a binder resin in addition to the above components. The binder resin serves as a matrix of the film, and a thermoplastic resin can be used. The thermoplastic resin may include at least one selected from the group consisting of a polyurethane resin, an acrylonitrile resin, an acrylic resin, a butadiene resin, a polyamide resin, an olefin resin, and a silicone resin. The thermoplastic resin may more preferably contain at least one of a polyurethane resin, an acrylic resin and a butadiene resin. More particularly, at least one of an acrylate modified urethane resin, an ethylene-vinyl acetate copolymer, an acrylonitrile-butadiene copolymer and an acrylic copolymer may be selected and used.

In particular, the conductive layer of the present invention is a thermoplastic resin component and may include an acrylate modified urethane resin in terms of flowability and adhesion. The acrylate modified urethane resin may have at least one of the two glass transition temperatures (Tg) represented by the acrylate modified urethane resin of 0 캜 or higher. That is, the acrylate-modified urethane resin has a single glass transition temperature of 0 ° C or higher or a glass transition temperature of 0 ° C or higher due to phase mixing of a soft segment polyol and a hard segment diisocyanate, The curing reaction proceeds together with the acrylates in the cured portion through the acrylate group present in the terminal functional group, thereby performing a function as a curing portion, thereby exhibiting excellent adhesion and high connection reliability do. The weight average molecular weight of the acrylate modified urethane resin may be 1000 to 100000 g / mol, preferably 10000 to 50000 g / mol.

In the present invention, the binder resin may be contained in an amount of 10 to 60% by weight based on the total weight of the conductive layer. Specifically, it may be contained in an amount of 15 to 50% by weight.

Herein, the conductive layer may or may not further include insulating particles. The insulating particles may be inorganic particles, organic particles or organic / inorganic hybrid particles, the inorganic particles include silica _{(SiO 2), Al 2 O} 3, TiO 2, ZnO, MgO, ZrO 2, PbO, Bi 2 O 3 , MoO ₃ , V ₂ O ₅ , Nb ₂ O ₅ , Ta ₂ O ₅ , WO ₃ Or In ₂ O ₃ , and the organic particles may be a resin containing at least one of acrylic copolymer, benzoguanamine, polyethylene, polyester, polystyrene, polyvinyl alcohol and polyurethane, It may be an organic particle made of a modified resin. The insulating particles may be contained in an amount of 0.1 to 25% by weight based on the total solid weight of the conductive layer composition. It is possible to improve the reliability by adjusting the resin rejection ratio within the above content range and raising the elastic modulus to a certain level or more. In addition, the initial indentation is good and electrical characteristics can be expressed. When the size of the insulating particles is in the range of 1 nm to 30 nm in diameter, the film is given ricketts and the fluidity can be controlled during the pressure-bonding and main-pressing. Preferably, fumed silica or polystyrene divinylbenzene copolymer particles may be used as the insulating particles.

In addition, the conductive layer composition of the present invention may further include additives such as a polymerization inhibitor, an antioxidant, and a heat stabilizer in order to provide additional physical properties without impairing the basic physical properties. The additive is not particularly limited, but may be contained in an amount of 0.01 to 10% by weight based on the solid content of the conductive layer.

The polymerization inhibitor may be selected from the group consisting of hydroquinone, hydroquinone monomethyl ether, p-benzoquinone, phenothiazine, and mixtures thereof. As the antioxidant, a phenolic or hydroxycinnamate-based material can be used. For example, tetrakis- (methylene- (3,5-di-t-butyl-4-hydoxinnamate) methane, 3,5-bis (1,1-dimethylethyl) -4- -2,1-ethanediyl ester and the like can be used.

In the present invention, the insulating resin layer, specifically, the first insulating resin layer or the second insulating resin layer may be the same as or different from the remaining composition except for the conductive particles in the conductive layer. In one example, the insulating resin layer may use a curing system including a (meth) acrylate-based radical polymerizable material and a radical polymerization initiator in the same manner as the conductive layer. Therefore, the description of the composition and the content of the conductive layer can be applied to the insulating resin layer. For example, a (meth) acrylate-based radical polymerizable material, a radical polymerization initiator, a binder resin, insulating particles and additives which can be used for the conductive layer can be used for the insulating resin layer. In another example, the insulating resin layer may use a curing system different from the conductive layer. Examples of the other curing system include a curing system comprising a curing agent of an epoxy resin and an epoxy resin. Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F Novolak type epoxy resins, alicyclic epoxy resins, glycidyl ester type epoxy resins, glycidylamine type epoxy resins, hydantoin type epoxy resins, isocyanurate type epoxy resins and aliphatic chain epoxy resins. . These epoxy resins may be halogenated or hydrogenated.

Specifically, a hydrogenated epoxy resin can be used. For example, a hydrogenated bisphenol A type epoxy monomer of the following formula (1) or a hydrogenated bisphenol A type epoxy oligomer of the following formula (2) can be used.

 [Chemical Formula 1]

(2)

In Formula 2,

n is from 1 to 50;

The hydrogenated bisphenol A-type epoxy monomer of Formula 1 or the hydrogenated bisphenol A-type epoxy oligomer of Formula 2 is more densely structured than the bisphenol A-type epoxy, so that the anisotropic conductive film composition having improved moisture resistance and heat resistance and improved connection reliability Can be provided.

Further, an acryloyl group or a methacryloyl group may be added to the side chain of the epoxy resin. These may be used alone or in combination of two or more. The curing agent of the epoxy resin is not particularly limited as long as it can cure the epoxy resin, and examples thereof include an anion polymerizable catalyst type curing agent, a cationic polymerizable catalyst type curing agent and a middle type curing agent . Of these, anionic or cationic polymerizable catalyst type curing agents are preferable in that they are excellent in fast curability and do not require chemical equivalent considerations. Examples of the anionic or cationic polymerizable catalyst type curing agent include imidazole type, hydrazide type, boron trifluoride-amine complex, sulfonium salt, amine imide, diaminomalonitrile, melamine and derivatives thereof, salts of polyamines , Dicyandiamide, and the like, and modified products thereof can also be used. In particular, examples of the cationic polymerization catalyst include a sulfonium-based, isocyanate-based, amine-based, amide-based, phenol-based or acid anhydride-based curing agent, and these may be used singly or in combination.

Examples of the above-mentioned middle part type curing agent include polyamines, polymercaptans, polyphenols, acid anhydrides and the like.

When an anionic polymerization type catalyst-type curing agent, for example, tertiary amines or imidazoles, is blended, the epoxy resin is cured by heating at a middle temperature of about 160 ° C to 200 ° C for several seconds to several hours . This is preferable because the pot life is relatively long.

Another example of the present invention relates to a method for producing a conductive film, which comprises applying a conductive layer composition comprising conductive particles, a (meth) acrylate-based polymerizable substance and a radical polymerization initiator on a base film,

The base film coated with the conductive layer composition is pre-polymerized at 90 to 200 DEG C for 1 to 10 minutes,

And a multilayer structure in which a conductive layer and an insulating resin layer are laminated, which comprises laminating the pre-polymerized conductive layer and an insulating resin layer.

The pre-polymerization process is for partially or completely polymerizing the conductive layer and means curing in an oven at 90 to 200 ° C for 1 minute to 10 minutes, for example, curing in a hot air circulating oven. Specifically, the pre-polymerization may be performed at 90 to 180 ° C for 1 to 10 minutes, more specifically at 90 ° C to 170 ° C for 1 to 10 minutes.

The peak height ratio of the formula 1 in the infrared spectrophotometer of the pre-polymerized conductive layer under the above conditions may be 0.15 or less.

[Formula 1]

Peak height ratio = A ₁ / A ₂

In the above formula 1, A ₁ is the peak height at 810 cm ^-1 of the infrared spectrophotometer, and A ₂ is the peak height at 2930 cm ^-1 .

According to still another embodiment of the present invention, there is provided a semiconductor device connected with the above-described anisotropic conductive film of the present invention.

The semiconductor device includes: a first connected member containing a first electrode; A second connected member containing a second electrode; And an anisotropic conductive film according to the present invention, which is located between the first connected member and the second connected member and connects the first electrode and the second electrode. In one aspect, the first and second connected members may be structurally similar in terms of material, thickness, dimension, and physical interconnectivity. The thickness of the first and second connected members is about 20 to 100 탆. In another aspect, the first connected member and the second connected member may not be structurally and functionally similar in terms of material, thickness, dimension, and physical interconnectivity. Examples of the first member to be connected and the second member to be connected include glass, printed circuit board (PCB), fPCB, COF, TCP, ITO glass, and the like. The first electrode or the second electrode may be in the form of a protruding electrode or a planar electrode. In the case of the protruding electrode, the height H of the electrode, the width W, and the gap G between the electrode and the electrode exist, the height H of the electrode is about 2.50 μm to 10 μm, About 5 to 90 占 퐉, and the gap G between the electrode and the electrode may be in a range of about 5 to 90 占 퐉. Preferably, the height H of the electrode is about 2.50 to 9 占 퐉, the width W of the electrode is about 5 to 80 占 퐉, and the gap G between the electrode and the electrode is about 5 to 80 占 퐉.

For planar electrodes, the thickness may range from 500 to 1200 angstroms.

As the first electrode or the second electrode, ITO, copper, silicon, IZO, or the like may be used, but the present invention is not limited thereto.

Preferably, the thickness of the planar electrode is 800 to 1200 ANGSTROM, and the height of the protruding electrode is 6 to 10 mu m. At this time, if the thickness of the insulating layer is 4 to 12 占 퐉, sufficient adhesion can be exhibited. More preferably, the height of the planar electrode is 1000 占 and the height of the protruding electrode is 8 占 퐉, wherein the thickness of the insulating layer is 6-12 占 퐉.

1, first and second connected members 50 and 60 including a first electrode 70 and a second electrode 80 connected to each other with an anisotropic conductive film according to an exemplary embodiment of the present invention, ). ≪ / RTI > The anisotropic conductive film is composed of the conductive layer 10 including the conductive particles 40 and the insulating resin layer 20. When the anisotropic conductive film is placed between the first and second connected members 50 and 60 where the first electrode 70 is formed and the second connected member 60 is formed and the first electrode 70 and the second electrode 80 are formed, And the second electrodes 80 are connected to each other through the conductive particles 40. [

Hereinafter, the configuration and operation of the present invention will be described in more detail with reference to preferred embodiments of the present invention. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.

Example  1: Preparation of anisotropic conductive film

(1) Production of urethane resin

60 wt% of polyol (polytetramethylene glycol), 13.53 wt% of 1,4-butanediol, 26.14 wt% of toluene diisocyanate, 0.3 wt% of hydroxyethyl methacrylate and 0.03 wt% of dibutyltin dilaurate used as a catalyst, Lt; / RTI > First, a polyol, 1,4-butadiol, and toluene diisocyanate are reacted to synthesize a prepolymer at the isocyanate end. The thus synthesized isocyanate-terminated prepolymer was further reacted with hydroxyethyl methacrylate to prepare a polyurethane acrylate resin, wherein the molar ratio of the hydroxyethyl methacrylate / prepolymer terminal isocyanate was 0.5. A polyurethane acrylate having a weight average molecular weight of 25,000, which was synthesized by a polymerization reaction at a temperature of 90 ° C, a pressure of 1 atm, and a reaction time of 5 hours using dibutyl tin dilaurate as a catalyst, was prepared.

(2) Production of organic particles

In a three-neck round flask reactor equipped with a condenser, 100 ml of acetonitrile as a solvent was placed in a nitrogen atmosphere, and methyl methacrylate, styrene monomer, and divinylbenzene were fixed so as to be 2% by weight based on the solvent. The concentration of the crosslinking agent divinylbenzene was adjusted to 50 wt% based on the styrene monomer concentration, and the reactor of the mixture was kept at 70 캜. To the mixture was added 0.04 g of 2,2'-azobisisobutyronitrile as an initiator, followed by precipitation with stirring at 30 rpm for 24 hours to obtain a polystyrene divinylbenzene copolymer having an average particle size of 3 to 4 탆.

(3) Production of conductive layer

A solution prepared by dissolving 35% by weight of the urethane resin, 11% by weight of the organic particles, and 80% by weight of an ethylene-vinyl acetate copolymer (the EVA copolymer having a vinyl acetate content of 33% by weight) in a mixed solvent of toluene / methyl ethyl ketone 2: 8% by weight of tricyclodecane dimethanol diacrylate (TCDDMA) (KARAYAD R-684, Japanese explosive) as a solution having a solid content of 35% (Ebafurex EV180 manufactured by Mitsubishi DuPont Polychemical Co., 14% by weight of benzoyl peroxide, 2% by weight of benzoyl peroxide (Hansol) and 30% by weight of conductive particles (particle diameter 3 占 퐉, manufactured by Sekisui Chemical Co., Ltd.) were dissolved and dispersed in an organic solvent using a rotary- Lt; 0 > C for 5 minutes in a hot-air circulating oven to prepare a conductive layer. The conductive layer has a calorific value of 75% as calculated by the above-described formula 2, which means that the conductive layer is cured by 75%.

(4) Production of first insulating resin layer

, 15 wt% of a first epoxy resin (Mitsubishi, product name: JER-8404), 35 wt% of a binder resin (manufactured by Osaka gas, product name: EG200) The mixture was stirred for 5 minutes using a C-mixer, and then 5 wt% of a cationic curing agent (manufactured by Samsin Chemical Co., Ltd., product name: SI-60L) was added thereto and stirred for 1 minute using a C-mixer (Provided that the temperature in the solution was not more than 60 占 폚) to form a first insulating layer composition. The composition with stirring was coated on a polyethylene terephthalate film as a release film and hot-air dried at 70 캜 for 5 minutes to prepare a first insulating resin layer having a thickness of 12 탆.

[Chemical Formula 1]

(5) Production of two-layered anisotropic conductive film

The conductive layer and the first insulating resin layer were laminated together to produce an anisotropic conductive film having a two-layer structure.

Example  2: Preparation of anisotropic conductive film

(1) Fabrication of Second Insulating Layer

40 weight% of a binder resin (Osaka gas, product name: EG200) and 23 weight% of a first epoxy resin (manufactured by Mitsubishi, product name: JER-8404) in the production of the first insulating layer of Example 1 , 35 wt% of a second epoxy resin (hydrogenated epoxy resin of the following formula 1) and 2 wt% of a cation curing agent (manufactured by Samsin Chemical Co., Ltd., product name: SI-60L) The second insulating layer was formed in the same manner as in the first insulating layer.

[Chemical Formula 1]

(2) Production of anisotropically conductive film having a three-layer structure

In the production of the (5) anisotropic conductive film of Example 1, an anisotropic conductive film having a three-layer structure was prepared by positioning the conductive layer between the first insulating resin layer and the second insulating layer and laminating them.

Example  3: Preparation of anisotropic conductive film

An anisotropic conductive film having a two-layer structure was produced in the same manner as in Example 1, except that the linear polymerization temperature and time of the conductive layer in Example 1 were changed to 110 占 폚 for 1 minute.

Example  4: Preparation of anisotropic conductive film

An anisotropic conductive film having a two-layer structure was prepared in the same manner as in Example 1 except that the linear polymerization temperature and time of the conductive layer in Example 2 were changed to 110 캜 and 5 minutes.

Example  5: Preparation of anisotropic conductive film

An anisotropic conductive film having a two-layer structure was produced in the same manner as in Example 1, except that the linear polymerization temperature and time of the conductive layer in Example 1 were changed to 170 占 폚 for 3 minutes.

Example  6: Preparation of anisotropic conductive film

An anisotropic conductive film having a two-layer structure was produced in the same manner as in Example 1 except that an epoxy acrylate polymer (SP1509, Showa Polymer) was used as a radical polymerizing material for the conductive layer.

Example  7: Preparation of anisotropic conductive film

An anisotropic conductive film having a three-layer structure was produced in the same manner as in Example 2, except that an acrylate monomer (4-HBA, OSAKA) was used as a radically polymerizable substance in the conductive layer in Example 2.

Example  8: Preparation of anisotropic conductive film

Except that the acrylate monomer (4-HBA, OSAKA) was used as the radical polymerizing material of the conductive layer in Example 2 and lauroyl peroxide (Peroyl-L, Nippon Kayaku) was used as the radical curing initiator The anisotropic conductive film having a three-layer structure was produced in the same manner as in Example 2.

Comparative Example  1: Preparation of anisotropic conductive film

A conductive layer composition was coated on a polyethylene terephthalate film in Example 1, and a conductive layer was produced by volatilizing the solvent in a hot-air circulating oven at 70 ° C for 5 minutes, to obtain a two-layer structure To prepare an anisotropic conductive film.

Comparative Example  2: Preparation of anisotropic conductive film

(1) Preparation of conductive layer composition

, 40 wt% of a binder resin (manufactured by Osaka Gas Co., Ltd., product name: EG200), 13 wt% of a first epoxy resin (Mitsubishi, product name: JER-8404) (AUL704, manufactured by Sekisui Chemical Co., Ltd.) was adjusted to 30% by weight, and the amount of the cationic curing agent (product name: SI-60L) By weight, and the conductive layer pre-curing temperature and time were dried at 150 캜 for 5 minutes to prepare a conductive layer. The conductive layer had a calorific value of 68% as calculated by the above-described Formula 2, which means that the cured state was 68%.

 [Chemical Formula 1]

(2) Preparation of anisotropic conductive film

An anisotropic conductive film was produced in the same manner as in Example 1 except that the epoxy-based conductive layer composition prepared above was used as the conductive layer composition.

The structures, layer thicknesses, and pre-polymerization conditions of the anisotropic conductive films of the prepared examples and comparative examples can be summarized as shown in Table 1 below.

Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Comparative Example 1 Comparative Example 2 rescue Second floor 3rd Floor Second floor Second floor Second floor Second floor 3rd Floor 3rd Floor Second floor Second floor Conductive layer thickness 4 4 4 4 4 4 4 4 4 4 The thickness of the first insulating layer 12 12 12 12 12 12 12 12 12 12 The thickness of the second insulating layer - 0.5 - - - - 0.5 0.5 - - Pre-polymerization temperature and time 150 ° C, 5 minutes 150 ° C, 5 minutes 110 ° C, 1 minute 110 ° C, 5 minutes 170 ° C, 3 minutes 150 ° C, 5 minutes 150 ° C, 5 minutes 150 ° C, 5 minutes 70 ° C, 5 minutes 150 ° C, 5 minutes

Experimental Example : Evaluation of Physical Properties of Anisotropically Conductive Film

The peak height, the connection resistance, the insulation resistance, the particle trapping rate and the indentation elastic modulus of the conductive layer infrared spectrophotometer were measured for the anisotropic conductive films prepared in Examples 1-8 and Comparative Example 1-2 by the following method, The results are shown in Table 2 below.

Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Comparative Example 1 Comparative Example 2 IR 810 cm ^-1
Peak height (A ₁ ) 0.0014 0.0020 0.0017 0.0046 0.0025 0.0015 0.0009 0.0035 0.0059 - IR 2930 cm ^-1
Peak height (A ₂ ) 0.0195 0.0291 0.0186 0.066 0.041 0.0249 0.0151 0.058 0.0346 - Peak height ratio
(A ₁ / A ₂ ) 0.07 0.07 0.09 0.07 0.06 0.06 0.06 0.06 0.17 - Connection resistance (Ω) 1.34 1.25 1.41 1.37 1.44 1.43 1.39 1.51 4.12 102.3 Insulation Resistance
(Short shot occurrence point) 0/38 0/38 0/38 0/38 0/38 0/38 0/38 0/38 21/38 0/38 Particle picking rate (%) 75 78 66 68 82 73 78 77 12 85 Elasticity of indentation
(MPa) 175 178 151 149 181 169 183 175 1.43 550.1

As can be seen from the results of the above Table 2, the conductive layer composition contains the (meth) acrylate-based polymerizable material and the radical polymerization initiator and is preliminarily polymerized at 90 to 200 ° C for 1 minute to 10 minutes The anisotropic conductive films of Examples 1 to 8 had a conductive particle capture ratio in the range of 70 to 90%, a connection resistance as low as 2 Ω or less and no electrical short-circuit, while the composition was the same as in Example 1, In Comparative Example 1 in which Comparative Example 1 was used, not only the particle capture rate was extremely low due to the flow propensity of the conductive layer, but also the connection resistance was high and electrical short was generated. In the case of Comparative Example 2, in which the conductive layer composition was not a radical polymerization reaction system, the particle capture ratio was good due to the pre-curing, but the viscosity of the conductive layer was too high and the indentation elastic modulus exceeded 250 MPa. The press resistance of the conductive layer was insufficient during the pressing, and the connection resistance was greatly increased.

1) Infrared spectrophotometer peak height

The prepared ACF film was scanned 32 times with ATR (with Diamond) using FT-IR equipment, and the spectrum obtained after measurement was measured at 2930 cm-1 peak and 810 cm-1 peak using an IR peak analysis program . Depending on the composition, the peak position may differ by ± 5 cm ^-1 .

2) Connection resistance

The prepared anisotropic conductive film was connected to ITO glass (indium tin oxide glass), COF and TCP (Tape Carrier Package) under the conditions of pressurization at 70 ° C for 1 second and final compression at 150 ° C for 5 seconds and 70 MPa . Each of the ten specimens was prepared, and the connection resistance was measured (according to ASTM F43-64T method) using the 4-point probe method using the thus-prepared specimen. If the resistance is 5? Or more in the initial connection resistance measurement, it is determined as NG. After conducting a high-temperature and high-humidity reliability evaluation under the conditions of a temperature of 85 ° C and a relative humidity of 85% for 500 hours, each of the reliability-after-connection resistances was measured (according to ASTM D177).

3) Insulation resistance

The formed anisotropic conductive film was cut into 2 mm x 25 mm and bonded to each of the insulation resistance evaluation materials for evaluation. At this time, the anisotropic conductive film was heated / pressured on a glass substrate having a thickness of 0.5 mm at 70 DEG C for 1 MPa for 1 sec, peeling the PET film, and placing the ACF on the glass substrate. Next, chips (chip length 19.5 mm, chip width 1.5 mm, bump spacing 8 탆) were aligned and then subjected to final compression at 150 캜, 70 MPa, and 5 sec. 50V was applied thereto, and the occurrence of a short circuit was checked at a total of 38 points by the two-terminal method. If a short shot occurs, it is judged as NG.

4) Measurement of particle capture rate

The following methods were performed to measure the particle capture rate of the anisotropic conductive film produced in the Examples and Comparative Examples.

The number of conductive particles (number of particles before pressing) on the pressing and adhering terminals and the number of conductive particles (number of particles after pressing) on the terminal after the main pressing were counted by a metallurgical microscope and measured, Thereby calculating the particle capture rate of the conductive particles.

[Formula 3]

(%) = (Number of conductive particles per unit height (mm ² ) of connecting portion after main compression) / (per unit height of anisotropically conductive film before pressing) (mm ² ) Number of conductive particles x 100

The conditions of pressurization and final pressing are as follows.

1) Pressure-bonding condition: 70 DEG C, 1 MPa, 1 sec

2) Conditions of this pressing: 150 DEG C, 70 MPa, 5 sec

5) Indentation modulus

The conductive layers of Examples 1 to 8 or Comparative Examples 1 and 2 were subjected to an Hensitron TI750 Ubi apparatus in an Experiment mode as Indentation mode and a Feedback mode as Displacement control, and the tip was a Berkovitz type, Max. Displacement was measured for the value of the indentation elastic modulus at 1000 nm.

Experiments were performed by focusing the conductive layer samples in Examples 1 to 8 and Comparative Examples 1 and 2 through a PC, a Hysitron TI750 Ubi device, power on of a light source, and tranducer calibration, scanning the surface to set measurement positions, Max force loading for 5 seconds → holding for 2 seconds → unloading for 5 seconds and scanning the sample surface to confirm indentation marks. The elastic modulus was calculated using load and displacement.

50 first connected member
60 second connected member
70 first electrode
80 second electrode
40 conductive particles
10 conductive layer
20 insulating resin layer

Claims (20)

A conductive layer containing conductive particles, and an insulating resin layer,
Wherein the conductive layer comprises a thermoplastic resin, a conductive particle, a (meth) acrylate-based polymerizable substance, and a radical polymerization initiator,
The peak height ratio of the formula 1 in the infrared spectrophotometer of the conductive layer is 0.15 or less,
An anisotropic conductive film having an indentation elastic modulus of 50 to 250 MPa of the conductive layer;
[Formula 1]
Peak height ratio = A ₁ / A ₂
In the above formula 1, A ₁ is the peak height at 810 cm ^-1 of the infrared spectrophotometer, and A ₂ is the peak height at 2930 cm ^-1 . The anisotropic conductive film according to claim 1, wherein the conductive layer is pre-polymerized at 90 to 200 DEG C for 1 to 10 minutes. The anisotropic conductive film according to claim 1, wherein the curing rate of the conductive layer of the following formula (2) is 20% to 100%.
[Formula 2]
Curing rate (%) = [(A ₀ - A ₁ ) / A ₀ ] X 100
A ₀ represents the curve area of the DSC phase after the solvent is volatilized in a hot-air circulating oven at 70 ° C for 5 minutes before linearly polymerizing the conductive layer, A ₁ represents the DSC phase of the pre-polymerized conductive layer Curve area. delete The anisotropic conductive film according to claim 1, wherein the conductive layer and the insulating resin layer have a two-layer structure or a three-layer structure. The anisotropic conductive film according to claim 1, wherein the (meth) acrylate-based polymerizable substance is at least one of a (meth) acrylate oligomer or a (meth) acrylate monomer. The anisotropic conductive film according to claim 1, wherein the insulating resin layer comprises a (meth) acrylate-based polymerizable substance and a radical polymerization initiator. The anisotropic conductive film according to claim 1, wherein the insulating resin layer comprises an epoxy resin and a curing agent of the epoxy resin. The anisotropic conductive film according to claim 1, wherein the anisotropic conductive film has a conductive particle capture ratio of 40% or more. delete delete delete delete delete delete delete A conductive layer composition comprising conductive particles, a (meth) acrylate-based polymerizable substance and a radical polymerization initiator is applied on a substrate film,
The base film coated with the conductive layer composition is pre-polymerized at 90 to 200 DEG C for 1 to 10 minutes,
Layered structure in which the pre-polymerized conductive layer and the insulating resin layer are laminated and laminated, the method comprising:
Wherein the pre-polymerized conductive layer has an indentation elastic modulus of 50 to 250 MPa. The method for producing an anisotropic conductive film according to claim 17, wherein the pre-polymerized conductive layer has a curing rate of 20% to 100% in the following formula (2).
[Formula 2]
Curing rate (%) = [(A ₀ - A ₁ ) / A ₀ ] X 100
A ₀ represents the curve area of the DSC phase after the solvent is volatilized in a hot-air circulating oven at 70 ° C for 5 minutes before linearly polymerizing the conductive layer, A ₁ represents the DSC phase of the pre-polymerized conductive layer Curve area. The method for producing an anisotropic conductive film according to claim 17, wherein the multilayer structure is a two-layer or three-layer structure. A first connected member containing a first electrode;
A second connected member containing a second electrode; And
The method according to any one of claims 1 to 3, 5 to 9, wherein the first electrode and the second electrode are located between the first connected member and the second connected member And an anisotropic conductive film according to the present invention.

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