KR101892341B1 - Anisotropic conductive film - Google Patents

Abstract

In the present invention, the length of the anisotropic conductive film in the Z axis direction at 20 ° C is measured by a thermo mechanical analyzer at T ₀ , the temperature is raised from 20 ° C to 220 ° C at a heating rate of 10 ° C / min at 20 ° C, And the length in the Z-axis direction measured at 20 캜 is T ₁ , the dimensional change represented by the following formula 1 is 0% to 10%, the temperature is 50 ° C to 80 ° C for 1 to 3 seconds Pressed under the conditions of a pressure of 1.0 MPa to 3.0 MPa and subjected to pressure bonding at 120 to 160 DEG C for 1 to 5 seconds under a pressure of 60 to 90 MPa and then left for 500 hours under the conditions of 85 DEG C and 85% And an anisotropic conductive film using an inorganic filler surface-treated so as to contain a functional group of the same kind as any one or more selected from the group consisting of a binder resin and a curing agent, I will.
<Formula 1>
┃ T _{0 -} T ₁ ┃ / T ₀ × 100

Description

ANISOTROPIC CONDUCTIVE FILM [0002]

The present invention relates to an anisotropic conductive film. More specifically, the present invention uses an inorganic filler surface-treated so as to include a functional group of the same kind as any one or more selected from the group consisting of a binder resin and a curing agent, which are components of the anisotropic conductive film, A dimensional change, a reliable bubble area, and a modulus of the anisotropic conductive film.

The pitch between the electrode and the circuit is gradually becoming finer according to the tendency of the display industry in the trend of becoming larger and thinner in recent years. Anisotropic conductive films play a very important role as one of the wiring mechanisms for connecting these fine circuit terminals. As a result, the anisotropic conductive film has received much attention as an electrically connecting material.

The anisotropic conductive film is a material in which fine conductive ball particles are uniformly dispersed in an adhesive component and adhered to each other by heat and pressure, and has insulation in the XY axis direction and conductivity in the Z axis direction. The anisotropic conductive film is used for electrically connecting small electrical components such as semiconductor elements to a substrate or electrically connecting the substrates when manufacturing electronic products such as liquid crystal displays, personal computers, and portable communication devices.

The binder portion used in the conventional anisotropic conductive film plays a role as a film forming agent and does not greatly contribute to the connection reliability and is repeatedly shrunk and expanded in the connection structure due to the polymer resin having a low glass transition temperature, And adhesion reliability can not be assured.

Conventionally known methods for solving such problems include a method of using a binder resin having a high glass transition temperature (Tg) (Japanese Laid-Open Patent Publication No. 2011-0159486). However, when a binder resin having a high glass transition temperature is used, the flowability of the resin is lowered and the indentation is weakened even though there is no change in the physical properties to shrinkage and expansion due to the high modulus. As a result, There has been a problem in that a decrease in connection resistance can not be prevented when the device is left at a high temperature for a long period of time.

Japanese Laid-Open Patent Publication No. 2011-0159486 (Published August 8, 2011)

It is an object of the present invention to improve adhesion and resistance characteristics by improving the adhesion by uniformly adhering to the member to be connected by suppressing the extent of expansion of the volume, reducing the bubble area, and improving the modulus And to provide an anisotropic conductive film which can be improved.

It is still another object of the present invention to provide an anisotropic conductive film excellent in connection reliability and long-term reliability.

In one aspect of the invention,

Thermomechanical analyzer (Thermo Mechanical Analyzer) from the temperature sensing with the length of the Z-axis direction of the anisotropic conductive film T _0, then heated at 20 ℃ to 10 ℃ / min rate of temperature rise up to 220 ℃ 10 ℃ / min heat-sensing rate in 20 ℃ And a length in the Z-axis direction measured at 20 캜 is T ₁ , the dimensional change represented by the following formula (1) is 0% to 10%

Pressed at a temperature of 50 to 80 ° C for 1 to 3 seconds and at a pressure of 1.0 to 3.0 MPa and pressure-bonded at 120 to 160 ° C for 1 to 5 seconds under a pressure of 60 to 90 MPa, And a reliability bubble area after standing for 500 hours under a condition of 85% is 10% or less.

<Formula 1>

┃ T _{0 -} T ₁ ┃ / T ₀ × 100

In this embodiment of the present invention, the binder resin; Curing agent; Inorganic filler; And an inorganic filler, wherein the inorganic filler is surface-treated to include at least one functional group of the same kind as any one or more selected from the group consisting of the binder resin and the curing agent.

In another embodiment of the present invention, the binder resin; Curing agent; Inorganic filler; And the inorganic filler is surface-treated so as to include at least one functional group of the same kind as any one or more selected from the group consisting of the binder resin and the curing agent, and the inorganic filler is an anisotropic conductive film solid And 10 parts by weight to 30 parts by weight based on 100 parts by weight of the anisotropic conductive film.

In the embodiment of the present invention, the binder resin is contained in an amount of 10 to 65 parts by weight, the curing agent is 5 to 20 parts by weight, the inorganic filler is contained in an amount of 10 to 30 parts by weight based on 100 parts by weight of the anisotropic conductive film solid, By weight, and the conductive particles are 1 to 15 parts by weight.

In this embodiment of the present invention, press-bonding is carried out under the conditions of 50 ° C to 80 ° C for 1 to 3 seconds and 1.0 MPa to 3.0 MPa and compression bonding is carried out under pressure conditions of 120 ° C to 160 ° C for 1 to 5 seconds and 60 MPa to 90 MPa The adhesive strength of the anisotropic conductive film after being left for 500 hours at a temperature of 85 캜 and a relative humidity of 85% is 1,100 gf / cm or more.

In this embodiment of the present invention, press-bonding is carried out under the conditions of 50 ° C to 80 ° C for 1 to 3 seconds and 1.0 MPa to 3.0 MPa and compression bonding is carried out under pressure conditions of 120 ° C to 160 ° C for 1 to 5 seconds and 60 MPa to 90 MPa The connection resistance of the anisotropic conductive film after being left for 500 hours at a temperature of 85 캜 and a relative humidity of 85% is 1.0 Ω or less.

Since the anisotropic conductive film according to an embodiment of the present invention includes the inorganic filler surface-treated so as to include at least one functional group of the same kind as any one or more selected from the group consisting of a binder and a curing agent, The structure can be guided to be very firm to suppress the high-temperature expansion phenomenon, and the uniform adhesion to the adherend can be induced, thereby improving the initial adhesion, the connection resistance, the adhesive strength after the reliability evaluation, and the connection resistance characteristic.

1 shows a first embodiment of the present invention in which a first connected member 50 including a first electrode 70, a second connected member 60 including a second electrode 80, 2 is a cross-sectional view of the semiconductor device 30 including an anisotropic conductive film according to an aspect of the present invention, which is located between the connected members and connects the first electrode and the second electrode.
2 is a graph showing the lengths T ₀ to T ₁ in the Z axis direction of the anisotropic conductive film according to heating and cooling in the thermomechanical analyzer of the anisotropic conductive film according to an embodiment of the present invention.

Hereinafter, the present invention will be described in more detail. Those skilled in the art will appreciate that various modifications, additions, and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.

The invention thermomechanical analyzer (Thermo Mechanical Analyzer) 10 ℃ / min and then heating at up to 220 ℃ the length of the Z-axis direction of the anisotropic conductive film at 20 ℃ to 10 ℃ / min rate of temperature rise at T _0, 20 ℃ temperature thermosensitive And the length in the Z-axis direction measured at 20 캜 at a temperature of 20 캜 is T ₁ , the dimensional change represented by the following formula (1) is 0% to 10% Sec. And a pressure of 1.0 MPa to 3.0 MPa. After compression bonding at 120 to 160 DEG C for 1 to 5 seconds and under a pressure of 60 to 90 MPa, it is left for 500 hours under the conditions of 85 DEG C and 85% And a reliability bubble area after the step of forming the conductive film is 10% or less.

<Formula 1>

┃ T _{0 -} T ₁ ┃ / T ₀ × 100

The anisotropic conductive film comprises a binder resin; Curing agent; Inorganic filler; And the conductive particles; and the inorganic filler may be surface-treated to include at least one functional group of the same kind as any one or more selected from the group consisting of the binder resin and the curing agent.

That is, the present inventors have found that when the inorganic filler of the anisotropic conductive film is surface-treated so as to include at least one functional group of the same kind as that of the binder and / or the curing agent, And to suppress the high temperature expansion phenomenon. The anisotropic conductive film thus produced exhibited excellent initial adhesion and low connection resistance, and connection and adhesion reliability were maintained even under high temperature / high humidity and thermal shock conditions, and the long term reliability could be greatly improved.

The term in the Z axis direction of the anisotropic conductive film, which is the term used in the present invention, refers to the thickness of the film in the direction in which it is pressed between the electrode and the electrode.

The dimensional change rate is a measure of the degree of expansion in the thickness direction different from the conventional method of measuring the physical properties of the anisotropic conductive film with the thermal expansion coefficient corresponding to the expanded length per unit length. Poor or long-term reliability.

Referring to FIG. 2, the rate of dimensional change is measured by using a film thickness T ₀ measured in a Z axis direction at 20 ° C. and a film thickness of 10 μm under a pressure of 0.05 N in a film / fiber mode using a TA Instrument Q 400 TMA (manufactured by TA Corporation) ℃ / at a rate of min and then heated at 20 ℃ to 220 ℃ and then again measuring the thickness T ₁ of the Z of the axial film measured in after 20 ℃ temperature sensing at the same speed, respectively, at T ₀ according to the formula 1 By measuring the degree of change (%) to T ₁ and calculating the average value.

By controlling the dimensional change ratio of the anisotropic conductive film according to an embodiment of the present invention to be 0% to 10%, it is possible to sufficiently fill the anisotropic conductive film between the electrode and the electrode to suppress bubble generation after compression or after reliability evaluation And when the anisotropic conductive film is cured, the conductive particles are not sufficiently brought into contact with the electrode and the electrode due to swelling in the Z-axis direction, thereby suppressing the problem of increase in connection resistance. Specifically, the dimensional change rate may be within 9%, more specifically, within 8%.

The bubble area was measured with respect to the specimen of the anisotropic conductive film by using a microscope (BX51TRF, Olympus) after 10 photographs were taken, and the image analyzer was used to measure the bubble area of the bubble area Can be measured by comparing the area size with a magnification of 200 times. By controlling the bubble area of the anisotropic conductive film according to an embodiment of the present invention to 10% or less, it is possible to improve the adhesion with the adherend.

As the functional group, any one selected from the group consisting of an epoxy group, a phenylamine group, a vinyl group, a phenyl group, an acryl group, a methacrylic group, and a dimethyl group, or a combination thereof may be used.

The inorganic filler may be included in an amount of 10 to 30 parts by weight, for example, 15 to 25 parts by weight based on 100 parts by weight of the anisotropic conductive film solid. When the content of the inorganic filler is 10 parts by weight to 30 parts by weight, the hardening structure of the anisotropic conductive film is firmly induced, thereby improving the strength, rigidity and abrasion resistance of the polymer resin or suppressing the high temperature expansion phenomenon, It is possible to develop an initial adhesive force and a low connection resistance, and to maintain connection and adhesion reliability under high temperature / high humidity and thermal shock conditions, thereby improving long term reliability.

Wherein the anisotropic conductive film comprises 10 to 65 parts by weight of the binder resin, 5 to 20 parts by weight of the curing agent, 10 to 30 parts by weight of the inorganic filler based on 100 parts by weight of the anisotropic conductive film solid, , And the conductive particles may be 1 part by weight to 15 parts by weight.

If the content of the binder resin is less than 10 parts by weight, it may not be possible to perform a film forming matrix during the production of the anisotropic conductive film, and it may be difficult to control the excessive flowability of the cured portion under high temperature / If it is used in excess of 65 parts by weight, the flowability at the time of connection under high temperature / high pressure conditions may be very low, and conductive particles may not be sufficiently contacted.

Further, by controlling the content of the curing agent to be 5 parts by weight to 20 parts by weight, it becomes easy to control flow characteristics under high temperature / high pressure according to processing conditions at the time of mounting a display panel, thereby exhibiting excellent initial adhesion and low connection resistance , High reliability can be achieved by maintaining connection and adhesion reliability under high temperature / high humidity and thermal shock conditions.

The content of the inorganic filler can be controlled to be 10 parts by weight to 30 parts by weight as described above, and the content of the conductive particles can be controlled according to the pitch of the applied circuit and the content of the inorganic filler 1 to 15 parts by weight can be controlled.

The anisotropic conductive film according to an embodiment of the present invention includes an inorganic filler surface-treated as described above. Specifically, the inorganic filler is the same as any one or more selected from the group consisting of the binder resin and the curing agent , The cured structure of the cured anisotropic conductive film is induced to be very rigid so that the high temperature expansion phenomenon is suppressed. Thus, the initial adhesion force, the connection resistance, the adhesion force after reliability evaluation, Can be improved.

When the anisotropic conductive film of the present invention is formed of the above composition, the modulus at 30 ° C after curing is preferably 100 to 400 MPa, and the elasticity of the film is increased in the above range, thereby uniformly distributing the pressure during pressure application to improve the wettability and pressure- And reliability can be improved.

The modulus measurement method is a method in which the sample is cured using a hot press and the sample is confirmed to have hardened by 90% or more using differential scanning calorimetry (DSC). The measurement can be performed using DMA (Dynamic Mechanical Analyzer, TA) while raising the temperature to 200 ° C.

Hereinafter, each component of the anisotropic conductive film of the present invention will be described in detail.

Wherein the anisotropic conductive film comprises a binder resin; Curing agent; Inorganic filler; And conductive particles.

Non-limiting examples of the binder resin include polyimide resin, polyamide resin, phenoxy resin, polymethacrylate resin, polyacrylate resin, polyurethane resin, polyester resin, polyester urethane resin, polyvinyl butyral (SBS) resin, an epoxy modified product, a styrene-ethylene-butylene-styrene (SEBS) resin and its modified product, an acrylic acid ester copolymer, a styrene acrylonitrile resin, an acryl Rhenitrile butadiene rubber, urethane resin, urethane acrylate resin and hydrogenated product thereof, or a combination thereof. In the present invention, the binder resin can be used as long as it has a functional group of the same kind as the functional group of the inorganic filler in its terminal or structure. The functional group may be any one selected from the group consisting of epoxy, phenylamine, vinyl, phenyl, methacryl, and dimethyl groups, or a combination thereof.

Specifically, when acrylonitrile butadiene rubber is used as the binder resin, it can be produced by emulsion polymerization of acrylonitrile and butadiene. The content of each of acrylonitrile and butadiene in the copolymer is not particularly limited, The method is not particularly limited. The acrylonitrile butadiene rubber may be a resin having a weight average molecular weight of 50,000 g / mol to 2,000,000 g / mol.

In the present invention, a carboxyl group-modified acrylonitrile butadiene rubber can be preferably used. Since the presence of the carboxyl group increases the stability of the resin mixture, it is possible to improve the miscibility with other resins and additives, It is possible to facilitate the operation. In addition, it is possible to improve the adhesive force by increasing the polarity and to improve the physical properties such as moisture resistance and heat resistance.

Wherein the carboxyl group-modified acrylonitrile butadiene rubber has a weight average molecular weight of 2,000 g / mol to 270,000 g / mol, and the acrylonitrile content per 100 parts by weight of the carboxyl group-modified acrylonitrile butadiene rubber is 10 parts by weight to 60 parts by weight, The carboxyl group content is preferably 1 part by weight to 20 parts by weight. In particular, the carboxyl group-modified acrylonitrile butadiene rubber preferably has a weight average molecular weight of 3,000 g / mol to 250,000 g / mol and an acrylonitrile content of 20 to 50 parts by weight.

When the weight average molecular weight of the carboxyl group-modified acrylonitrile butadiene rubber is less than 2,000 g / mol, the thermal stability is poor. When the weight average molecular weight is more than 270,000 g / mol, the solubility in solvents is poor, The workability may be poor and the adhesive strength may be lowered. If the acrylonitrile content is less than 10 parts by weight, solvent solubility may be lowered. If the acrylonitrile content exceeds 60 parts by weight, electrical insulation may be poor.

Vamac MR, Vamac Ultra IP, VMX30380 from Du Pont, N34, Nipol NBR from Zeon Co., Ltd., Nipol NBR, and Nipol NBR are commercially available products as long as the carboxyl group modified acrylonitrile butadiene rubber can be used without limitation, 1072J, 1072CGX, etc. Specifically, carboxyl group-modified acrylonitrile butadiene rubber dissolved in ethyl acetate at 20% by volume can be used.

The acrylonitrile butadiene rubber may be used as a component of the binder resin, and 1 part by weight to 10 parts by weight, preferably 3 parts by weight to 8 parts by weight, based on 100 parts by weight of the anisotropic conductive film solid. When the amount of the acrylonitrile butadiene rubber is less than 1 part by weight, the adhesive strength with the adherend may be poor. When the amount exceeds 10 parts by weight, the molecular weight of the binder part becomes excessively high, Uniform adhesion with the ash may not be achieved.

In the present invention, urethane acrylate resin can be preferably used. Since the urethane acrylate resin has a glass transition temperature of 100 캜 or less, the flowability in the thermocompression bonding step can be improved, and the urethane acrylate resin having a high The adhesive force can be developed, and the curing performance can be improved and the temperature of the connecting step can be lowered.

The urethane acrylate resin may include, but is not limited to, components of diisocyanate, polyol, diol, and acrylate.

The diisocyanate may be an aromatic, aliphatic, alicyclic diisocyanate, or a combination thereof. Specifically, the diisocyanate may be tetramethylene-1,4-diisocyanate, hexamethylene-1,6-diisocyanate, cyclo Hexylene 1,4-diisocyanate, methylene bis (4-cyclohexyl diisocyanate), isophorone diisocyanate, and 4-4 methylene bis (cyclohexyl diisocyanate). These may be used singly or in combination.

The polyol may be polyester polyol, polyether polyol, polycarbonate polyol or the like having two or more hydroxyl groups in the molecular chain. The polyester polyol is preferably obtained by a condensation reaction of a dicarboxylic acid compound and a diol compound. Examples of the dicarboxylic acid compound include succinic acid, glutaric acid, isophthalic acid, adipic acid, suberic acid, azelanic acid, sebacic acid, dodecanedicarboxylic acid, hexahydrophthalic acid, isophthalic acid, terephthalic acid, ortho-phthalic acid , Diacrylate, tetrachlorophthalic acid, 1,5-naphthalene dicarboxylic acid, fumaric acid, maleic acid, itaconic acid, citraconic acid, mesaconic acid and tetrahydrophthalic acid. Examples of the diol compound include ethylene glycol, propylene glycol, Propane diol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, neopentyl glycol, diethyleneglycol, dipropyleneglycol, triethyleneglycol, tetraethyleneglycol, di Butylene glycol, 2-methyl-1,3-pentanediol, 2,2,4-trimethyl-1,3-pentanediol, 1,4-cyclohexanedimethanol and the like. As the polyether polyol, polyethylene glycol, polypropylene glycol, polytetraethylene glycol and the like can be used. In the case of the polyether polyol, the weight average molecular weight of the polyol is preferably 400 to 10,000 g / mol, more preferably 400 to 3,000 g / mol. As the polycarbonate polyol, a polyalkylene carbonate and a polycarbonate polyol derived from a silicone can be used.

The diol may be selected from the group consisting of 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, neopentyl glycol, diethylene glycol, dipropylene glycol, Ethylene glycol, tetraethylene glycol, dibutylene glycol, 2-methyl-1,3-pentanediol, 2,2,4-trimethyl-1,3-pentanediol, 1,4-cyclohexanedimethanol, have.

The acrylate may include hydroxy acrylate or amine acrylate.

The urethane acrylate resin formed by the four components composed of the diisocyanate, polyol, diol and acrylate has a diisocyanate group (NCO) / hydroxyl group (OH) of 1.04 To 1.6, and the content of the polyol in the three components other than acrylate is 70% or less; and a step of reacting a hydroxy acrylate or a diacrylate with a diisocyanate group, which is a terminal functional group of urethane synthesized by the polymerization reaction, Or amine acrylate at a molar ratio of 0.1 to 2.1. Further, the residual isocyanate group can be reacted with an alcohol to prepare a final urethane acrylate resin. At this time, as the middle polymerization step, a known polymerization method may be used. In the above step, the reaction temperature may be 90 ° C, the reaction pressure may be 1 atm, the time may be 5 hours, and the catalyst may be prepared using a tin-based catalyst.

The urethane acrylate resin may have a weight average molecular weight of 1,000 g / mol to 500,000 g / mol, preferably 20,000 g / mol to 100,000 g / mol, for example 20,000 to 40,000 g / mol, One or more of the functional groups may be composed of acrylate.

The urethane acrylate resin may be used in an amount of 30 to 60 parts by weight based on 100 parts by weight of the anisotropic conductive film solid, and may be used as a binder resin together with the acrylonitrile butadiene rubber.

The curing agent may be a radical polymerizable compound, specifically, a radical polymerization type reactive acrylic monomer, or a cationic polymerizable compound.

Non-limiting examples of the radically polymerizable compound include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, , 2-ethylhexyl (meth) acrylate, isodecyl (meth) acrylate, n- lauryl (meth) acrylates, C ₁₂ -C ₁₅ alkyl (meth) acrylate, n- stearyl (meth) acrylate (meth) acrylate, n-butoxy ethyl (meth) acrylate, butoxy ethyleneglycol (meth) acrylate, methoxy triethylene glycol (meth) acrylate, cyclohexyl (meth) acrylate, tetrahydrofurfuryl Hydroxypropyl (meth) acrylate, benzyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, isobonyl Acrylate, 2-hydroxybutyl (meth) (Meth) acrylate, (meth) acrylic acid, 2- (meth) acryloyloxyethyl succinic acid, diethylaminoethyl (meth) acrylate, Acrylate, 2- (meth) acryloyloxyethyl hexahydrophthalate, 2- (meth) acryloyloxyethyl-2-hydroxypropyl phthalate, glycidyl (meth) (Meth) acrylate, ethyleneglycol di (meth) acrylate, diethyleneglycol di (meth) acrylate, triethyleneglycol di (Meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, Hydroxy-3-acryloyloxypropyl (meth) acrylate, (Meth) acrylate, perfluorooctylethyl (meth) acrylate, isoamyl acrylate, lauroyl acrylate, bisphenol A ethylene (meth) acrylate, (Meth) acrylate, pentaerythritol tri (meth) acrylate and the like, which can be used singly or in combination of two or more selected from the group consisting of di (meth) acrylate of bisphenol A Or a mixture of two or more thereof.

The compound having a (meth) acrylate group is preferably a compound having a (meth) acrylate group. The compound having a (meth) acrylate group is a radically polymerizable substance, and a radical hardening reaction proceeds, &Lt; / RTI &gt;

Examples of the compound having a (meth) acrylate group include (meth) acrylate oligomer and (meth) acrylate monomer. (Meth) acrylate oligomer may be used. For example, urethane (meth) acrylate having an average molecular weight of about 1,000 to 100,000 g / mol, epoxy (meth) acrylate, (Meth) acrylate, maleimide-modified (meth) acrylate, acryl-based (meth) acrylate, (Methacrylate) and the like can be used.

The urethane-based (meth) acrylate is a compound in which the intermediate structure of the molecule is a polyester polyol, a polyether polyol, a polycarbonate polyol, a polycaprolactone polyol, a ring-opening tetrahydrofuran propylene oxide copolymer, a polybutadiene diol, a polydimethylsiloxane diol, , Propylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, neopentyl glycol, 1,4-cyclohexanedimethanol, bisphenol-A, hydrogenated bisphenol- But are not limited to, toluene diisocyanate, 1,3-xylene diisocyanate, 1,4-xylene diisocyanate, 1,5-naphthalene diisocyanate, 1,6-hexane diisocyanate, isophorone diisocyanate, bisphenolpropylene oxide- Acrylate and the like can be used. Examples of the epoxy (meth) acrylate resin include bisphenols such as bisphenol A, bisphenol F, bisphenol AD, bisphenol S, and the like, 4,4'-dihydroxybenzene derivatives having an intermediate molecular structure of 2-bromohydroquinone, resorcinol, catechol, (Tetrabromobisphenol A), a nitro group, and the like which are constituted of a skeleton such as phenyl, bis (4-hydroxyphenyl) ether or the like and an alkyl group, aryl group, methylol group, allyl group, cyclic aliphatic group, halogen ) Acrylate oligomer group can be used. Other examples of the (meth) acrylate oligomer of the present invention include at least two maleimide groups in the molecule such as 1-methyl-2,4-bismaleimide benzene, N, N'-m- Maleimide, N, N'-p-phenylene bismaleimide, N, N'-m-tolylenbismaleimide, N, N'- N, N'-4,4- (3,3'-dimethyldiphenylmethane) bismaleimide, N, N'- N, N'-4,4-diphenylmethane bismaleimide, N, N'-4,4-diphenylpropane bismaleimide, N, N, N'-4,4-diphenyl ether bismaleimide, N, N'-3,3'-diphenylsulfonylbismaleimide, 2,2-bis (4- (4-maleimidophenoxy) phenyl Propane, 1,1-bis (4- (4-maleimidophenoxy) phenyl) propane, 2,2- Phenyl) decane, 4,4'-cyclohexylidene bis (1- (4-maleimidophenoxy) -2-cyclohexylbenzene, 2,2-bis (4- (4-maleimidophenoxy) Hexafluoropropane and the like can be used.

As the (meth) acrylate, a typical (meth) acrylate monomer may be used as the monomer. Examples thereof include 1,6-hexanediol mono (meth) acrylate, 2-hydroxyethyl (meth) (Meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 2- (Meth) acrylate, trimethylolpropane di (meth) acrylate, trimethylolpropane di (meth) acrylate, 2-hydroxyalkyl (Meth) acrylate, dipentaerythritol penta (meth) acrylate, pentaerythritol hexa (meth) acrylate, dipentaerythritol hexa (metha) acrylate, (Meth) acrylate, stearyl (meth) acrylate, isophorone di (meth) acrylate, isophorone diisocyanate, Acrylate, lauryl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, isobonyl (meth) acrylate, tridecyl (meth) acrylate, ethoxy addition type nonylphenol Ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, t-ethylene glycol di (Meth) acrylate, cyclohexanedimethanol di (meth) acrylate, phenoxy-t-butyl (meth) acrylate, tripropylene glycol di - Glycol (meth) acrylate Acrylate, trimethylolpropane benzoate acrylate, fluorene-based (meth) acrylate, acid phosphoxyethyl (meth) acrylate, 2-methacryloyloxyethyl phosphate, dimethyloltricyclodecane di Acrylate and the like can be used.

The (meth) acrylate-containing compound may be contained in an amount of 1 to 10 parts by weight, preferably 1 to 5 parts by weight based on 100 parts by weight of the solid of the anisotropic conductive film. Within this range, even if the compression temperature is elevated, the adhesive strength is not reduced, and even if the compression temperature is lowered, uncalibration is not caused and the connection reliability is not deteriorated.

The curing agent may be used together with a curing initiator, and the curing initiator may be a radical polymerization initiator. Specifically, a radical polymerization type reactive acrylic monomer may be used, or may be a cation polymerization initiator.

The radical polymerization initiator is not particularly limited and a radical polymerization initiator commonly used in the art can be used. The radical polymerization initiator used in the present invention acts as a curing agent that generates free radicals by heating or light, and organic peroxides can be preferably applied.

The organic peroxide functions as a curing agent which generates organic radicals by heating or light. Organic peroxides include peroxydicarbonate, lauroyl peroxide, t-butyl peroxylaurate, 1,1,3,3-t-methylbutylperoxy-2-ethylhexanoate, 2,5- Ethylhexanoylperoxy) hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-di (m- Butyl peroxy isopropyl monocarbonate, t-butyl peroxy-2-ethylhexyl monocarbonate, t-hexyl peroxybenzoate, t-butyl peroxyacetate, dicumyl peroxide, 2,5 T-butyl peroxyneodecanoate, t-hexyl peroxy-2-ethylhexanoate, t-butyl peroxyneodecanoate, t- T-butylperoxyisobutylate, 1,1-bis (t-butylperoxy) cyclohexane, t-hexylperoxyisopropylmonocarbonate, t-butyl Peroxy-3,5,5-trimethylhexa Nonanoate, t-butyl peroxypivalate, cumyl peroxyneodecanoate, di-isopropylbenzene hydroperoxide, cumene hydroperoxide, isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5 , 5-trimethylhexanoyl peroxide, octanoyl peroxide, stearoyl peroxide, succin peroxide, benzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, benzoyl peroxytoluene, 1,1,3 , 3-tetramethylbutyl peroxyneodecanoate, 1-cyclohexyl-1-methylethyl peroxynoedecanoate, di-n-propyl peroxydicarbonate, di-isopropyl peroxycarbonate, bis Di (2-ethylhexyl peroxy) dicarbonate, dimethoxybutyl peroxy dicarbonate, di (3-t-butylcyclohexyl) peroxydicarbonate, Methyl-3-methoxybutylperoxy) (Tert-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1- Oxy) -3,3,5-trimethylcyclohexane, 1,1- (t-butylperoxy) cyclododecane, 2,2-bis (t-butylperoxy) decane, t- butyltrimethylsilyl peroxide, (T-butyl) dimethylsilyl peroxide, t-butyltriallylsilyl peroxide, bis (t-butyl) diallylsilyl peroxide, tris Sodicarbonate, and lauroyl peroxide can be used, and a plurality of peroxides can be used in combination in a selection from the viewpoint of connection temperature and time, and storage stability of the product.

It is preferable that the organic peroxide has a half-life temperature of from 5 to 15 hours at 40 to 100 캜. If the half-life temperature of the organic peroxide is too low, the decomposition rate of the organic peroxide is too fast to cause a problem in room temperature storage. If the half-life temperature is too high, the polymerization reaction rate becomes too slow.

The organic peroxide may be included in an amount of 1 to 10 parts by weight based on 100 parts by weight of the anisotropic conductive film solid. Within the above range, the curing reaction rate is not lowered and the original squeezing property is not lowered. Since the anisotropic conductive film is not cured after the film is cured by heating, the anisotropic conductive film is not completely removed during reworking No problem can arise.

As the cationic polymerizable compound, an epoxy resin, specifically, a thermosetting epoxy resin can be used. For example, an epoxy resin having an epoxy equivalent of 90 g / eq to 5000 g / eq and having two or more epoxy groups in the molecule Can be used. More specifically, it may include at least one epoxy resin selected from the group consisting of hydrogenated, bisphenol-type, novolak-type, glycidyl-type, aliphatic and alicyclic epoxy resins. As an example, a naphthalene-based epoxy resin can be used. More specifically, a hydrogenated epoxy resin or a propylene oxide-based epoxy resin can be used. Use of a hydrogenated epoxy resin or a propylene oxide-based epoxy resin enables rapid curing at a low temperature and secures good stability.

Specifically, the hydrogenated epoxy resin may be an alicyclic hydrogenated epoxy resin such as a hydrogenated bisphenol A type epoxy resin or a cycloaliphatic system. As the cycloaliphatic epoxy resin, resins having a structure such as alicyclic diepoxyacetal, alicyclic diepoxy adipate, alicyclic diepoxy carboxyate, or vinylcyclohexene dioxide may be used. The hydrogenated bisphenol A type epoxy resin is generally obtained by using a hydrogenated bisphenol A derivative and epichlorohydrin, and may be a structure in which the double bond in the bisphenol A molecular structure is substituted with a hydrogen molecule.

Specifically, the hydrogenated epoxy resin may have an epoxy equivalent of 150 g / eq to 1,200 g / eq and a viscosity of 900 cps / 25 ° C to 12,000 cps / 25 ° C.

The cationic polymerization initiator is not limited as long as it can catalyze the curing of the epoxy resin, and for example, a sulfone, imidazole, isocyanate, amine, amide, phenol or acid anhydride curing agent These may be used singly or in combination of two or more.

The inorganic filler may be selected from the group consisting of silica (SiO ₂ ), Al ₂ O ₃ , TiO ₂ , ZnO, MgO, ZrO ₂ , PbO, Bi ₂ O ₃ , MoO ₃ , V ₂ O ₅ , Nb ₂ O ₅ , Ta ₂ O ₅ , WO ₃ , and In ₂ O ₃ , or a combination thereof, and silica can be preferably used. The silica may be a silica produced by a vapor phase method such as a silica or flame oxidation method by a liquid phase method such as a sol-gel method or a precipitation method. Non-powder silica in which silica gel is pulverized may be used, or fumed silica ), Fused silica may be used, and the shape thereof may be spherical, crushed, edgeless, and the like, but is not limited thereto.

When the size of the inorganic filler (average particle diameter) is larger than that of the conductive particles, there is a problem in conduction, and thus the average particle diameter of the inorganic filler may be smaller than the average particle diameter of the conductive particles. More specifically, the average particle diameter of the inorganic filler used in this embodiment may be 10 nm to 500 nm, for example, 40 nm to 100 nm, and the specific surface area may be 50 to 100 m 2 / g. The inorganic filler may be included in an amount of 10 to 30 parts by weight based on 100 parts by weight of the anisotropic conductive film solid. The anisotropic conductive film may contain an inorganic filler having an average particle size and a content, have.

Preferably, the inorganic filler according to an embodiment of the present invention may use silica particles. The silica particles may be used alone or in combination of two or more selected from the group consisting of Aerosil R-972, Aerosil R-202, Aerosil R-805, Aerosil R-812 and Aerosil R-8200 , But is not limited thereto.

The inorganic filler according to an embodiment of the present invention may be a silica particle surface-treated to include a functional group of the same kind as any one or more selected from the group consisting of the binder resin and the curing agent. The functional group may be any one selected from the group consisting of an epoxy group, a phenylamine group, a vinyl group, a phenyl group, an acryl group, a methacrylic group, and a dimethyl group, or a combination thereof.

Accordingly, the inorganic filler has a strong bonding force with the binder resin and the curing agent, so that the cured structure of the cured anisotropic conductive film is guided to be very firm so that expansion does not occur at a high temperature, It is possible to provide an anisotropic conductive film having a remarkably improved long-term reliability by exhibiting connection resistance and maintaining connection and adhesion reliability even under high temperature / high humidity and thermal shock conditions.

The surface-treated silica particles may be included in an amount of 10 to 30 parts by weight, for example, 15 to 25 parts by weight based on 100 parts by weight of the anisotropic conductive film solid.

When the content of the surface-treated silica particles is 10 parts by weight to 30 parts by weight, the hardening structure of the anisotropic conductive film is firmly induced, thereby improving the strength, rigidity and abrasion resistance of the polymer resin, As a result, excellent initial adhesion and low connection resistance can be exhibited, and connection and adhesion reliability can be maintained even under high temperature / high humidity and thermal shock conditions, thereby improving long-term reliability.

Wherein the conductive particles are particles of at least one metal selected from the group consisting of gold, silver, copper, nickel, aluminum, palladium, and solder, or an alloy of the metals; Metal particles plated with at least one selected from the group consisting of gold, palladium, and silver on the metal surface; Or a resin core ball in which at least one selected from nickel, gold, palladium, and silver is plated on the resin ball. In addition, the conductive particles may be particles in which a resin containing at least one selected from the group consisting of polyethylene, polypropylene, polyester, polystyrene, and polyvinyl alcohol is coated with the metal or an alloy of the metals. Also, the average particle diameter of the conductive particles may be 2 탆 to 10 탆, depending on the pitch of the applied circuit.

The anisotropic conductive film may further include organic particles in addition to the binder resin, the curing agent, the inorganic filler, and the conductive particles.

The organic particles may serve to compensate for the excessive flow of the composition due to the ethylene-vinyl acetate copolymer. In addition, stress can be relaxed under heat shrinkage accompanied by curing by the organic particles, thermal deformation due to shrinkage and expansion can be lowered, and adhesion reliability can be imparted to the film under high temperature and high humidity conditions.

The organic particles may be selected from the group consisting of styrene-divinyl benzene, chlorinated polyethylene, dimethyl polysiloxane, methyl methacrylate-butyl acrylate-dimethylsiloxane copolymer (Methylmethacrylate-Butylacrylate-Dimethylsiloxane copolymer Butadiene-styrene block copolymers, styrene-butadiene thermoplastic elastomers, butadiene rubbers, styrene-butadiene rubbers (styrene-butadiene-styrene block copolymers) ), And ethylene glycidyl methacrylate. [0033] The term &quot; anionic surfactant &quot;

The diameter of the organic particles is not particularly limited and may be 0.1 탆 to 10 탆, preferably 0.3 탆 to 5 탆. When the size of the organic particles is within the above range, dispersion of the organic particles is favorable and the conductive properties of the conductive particles are not hindered by the organic particles.

The anisotropic conductive film may further contain additives such as a polymerization inhibitor, an antioxidant, and a heat stabilizer in addition to a binder resin, a curing agent, an inorganic filler, conductive particles, and organic particles to provide additional properties have. The additive is not particularly limited but may be included in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the anisotropic conductive film solid.

The composition for an anisotropic conductive film of the present invention may further contain a coloring pigment, a dye, a polymerization inhibitor, a silane coupling agent and the like in consideration of properties and workability at the time of commercialization in order to obtain desired cured characteristics. Can be controlled within a range that does not impair the object of the present invention.

The present invention can provide a display device including the anisotropic conductive film. Wherein the display device comprises: a wiring board including a metal in an outermost layer; An anisotropic conductive film attached to the chip mounting surface of the wiring board; And a chip mounted on the anisotropic conductive film.

The anisotropic conductive film according to the present invention may have a single-layer structure or a multi-layer structure, and may be used for a multilayered conductive layer in terms of improving connection reliability of the microcircuit terminals.

The anisotropic conductive film included in the display device is pressurized at a temperature of 50 to 80 DEG C for 1 to 3 seconds and at a pressure of 1.0 to 3.0 MPa and pressurized at 120 to 160 DEG C for 1 to 5 seconds and at a pressure of 60 to 90 MPa , The adhesive strength after being left for 500 hours at a temperature of 85 캜 and a relative humidity of 85% may be 1,100 gf / cm or more. In the same reliability evaluation condition after pressurization and main compression conditions same as the above adhesive force measurement The measured connection resistance may be 1.0 Ω or less.

Specifically, the adhesive force was measured by peel strength meter (H5KT, manufactured by Tinius Olsen Co., Ltd., Japan) with respect to the main compression bonded specimen at 150 deg. C for 4 seconds and 4.0 MPa after pressurization at 1 deg. ) Under the conditions of a fill angle of 90 ° and a fill speed of 50 mm / min. The initial adhesion strength was measured and allowed to stand at a temperature of 85 ° C and a relative humidity of 85% for 500 hours to evaluate a high temperature and high humidity reliability. The reliability adhesive force can be measured by the same method as the adhesive force measuring method.

The connection resistance was measured by using two probes connected to the device for the main compression bonded specimen of 150 DEG C, 4 second, and 4.0 MPa after pressurization under the conditions of 1 second and 1 MPa at an actual temperature of 70 DEG C, (2000 Multimeter, Keithley) using a 2-point probe method, which is a method for measuring the resistance between the electrodes, and allowed to stand at a temperature of 85 ° C and a relative humidity of 85% for 500 hours, After the evaluation, the reliability connection resistance can be measured in the same manner as the initial connection resistance measurement method. Meanwhile, 1 mA is applied to the resistance measuring device, and the resistance can be calculated by the measured voltage.

Hereinafter, the configuration and operation of the present invention will be described in more detail with reference to preferred embodiments of the present invention. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.

The contents not described here are sufficiently technically inferior to those skilled in the art, and a description thereof will be omitted.

Example

Example  1: Preparation of anisotropic conductive film

(1) Preparation of anisotropic conductive film composition

6% by weight of acrylonitrile butadiene rubber (weight average molecular weight: 230000, 1072J, Zeon Chemical) dissolved in 20% by volume of ethyl acetate, 50% by weight of urethane acrylate resin (NPC7001H, 5% by weight of peroxide, 20% by weight of silica particles having an average particle diameter of 40 to 100 nm surface-treated with a methacrylic group, 7% by weight of nickel conductive particles having an average particle diameter of 4 to 6 탆 and 12% by weight of a curing agent, A composition for an anisotropic conductive film was obtained such that the content of the silica particles surface-treated with the methacryl group was 20 parts by weight based on 100 parts by weight.

(2) Production of anisotropic conductive film

The anisotropic conductive film composition was agitated at room temperature (25 캜) for 60 minutes in a speed range in which conductive particles were not pulverized.

Thereafter, the anisotropic conductive film composition was formed into a film having a thickness of 35 mu m by using a casting knife in a polyethylene naphthalate film having a silicone-modified surface treated, and dried at 70 DEG C for 5 minutes to volatilize the organic solvent An anisotropic conductive film was produced.

Example  2

8% by weight of acrylonitrile butadiene rubber (weight average molecular weight: 230000, 1072J, Zeon Chemical) dissolved in 20% by volume of ethyl acetate, 53% by weight of urethane acrylate resin (NPC7001H, 10% by weight of silica particles having an average particle diameter of 40 to 100 nm, 6% by weight of peroxide, 8% by weight of nickel conductive particles having an average particle diameter of 4 to 6 탆 and 15% by weight of a curing agent, A composition for an anisotropic conductive film was obtained such that the content of the silica particles surface-treated with the methacryl group was 10 parts by weight.

Comparative Example  One

The procedure of Example 1 was repeated, except that 20 wt% of silica particles having an average particle diameter of 50 to 100 nm, which had not been surface-treated, were used in place of the silica particles surface-treated with the methacryl group, A composition for an anisotropic conductive film was obtained such that the amount of the non-surface-treated silica particles was 20 parts by weight based on 100 parts by weight of solid.

Comparative Example  2

8% by weight of acrylonitrile butadiene rubber (weight average molecular weight: 230000, 1072J, Zeon Chemical) dissolved in ethyl acetate at 20% by volume, 56% by weight of urethane acrylate resin (NPC7001H, 6% by weight of peroxide, 5% by weight of silica particles having an average particle diameter of 40 to 100 nm surface-treated with a methacrylic group, 9% by weight of nickel conductive particles having an average particle diameter of 4 to 6 占 퐉 and 16% by weight of a curing agent, A composition for an anisotropic conductive film was obtained such that the content of the silica particles surface-treated with the methacrylic group was 5 parts by weight based on the weight parts.

(Unit:% by weight) Example 1 Example 2 Comparative Example 1 Comparative Example 2 (A) a butadiene resin 6 8 6 8 (B) Binder 50 53 50 56 (C) Curing initiator 5 6 5 6 (D) Silica Particles 1 20 10 5 (E) Silica Particles 2 20 (F) conductive particles 7 8 7 9 (G) Curing agent 12 15 12 16

(A) Butadiene resin: Acrylonitrile butadiene rubber (weight average molecular weight: 230000, 1072J, Zeon Chemical) dissolved in ethyl acetate at 20 vol%

(B) Binder: NPC7001H (NaNux)

(C) Curing initiator: Lauroyl peroxide (organic peroxide)

(D) Silica Particles 1: Silica particles having an average particle diameter of 40 to 100 nm surface-treated with a methacryl group

(E) Silica Particles 2: Silica particles having an average particle size of 50 to 100 nm

(F) Conductive particles: Nickel-conductive balls having an average particle diameter of 4 to 6 탆

(G) Curing agent: DSC An isocyanuric acid ethylene oxide-modified diacrylate having an exothermic peak of 92 to 95 ° C

Experimental Example  1 - Dimensional Change of Anisotropic Conductive Film ( % ) Measure

After preparing five specimens of the anisotropic conductive film prepared according to Examples 1 and 2 and Comparative Examples 1 and 2, the thickness T ₀ of the film in the Z-axis direction measured at 20 ° C and the TA Instrument After heating from 20 ° C to 220 ° C at a rate of 10 ° C / min under a pressure of 0.05N in a film / fiber mode using a Q400 TMA equipment (manufactured by TA Corporation), the resultant was again heated at the same rate and then measured at 20 ° C After measuring the thickness T ₁ of the film in the Z-axis direction, the degree of change (%) from T ₀ to T ₁ according to the following equation 1 was measured and the average value was calculated.

<Formula 1>

┃ T _{0 -} T ₁ ┃ / T ₀ × 100

Experimental Example  2-anisotropic conductive film bubble  Area measurement

(Pitch: 200 占 퐉, terminal width 100 占 퐉, terminal-to-terminal distance 100 占 퐉, terminal height 35 占 퐉, Samsung Electronics Co., Ltd.) and COF (Pitch: 200 占 퐉, terminal width 100 占 퐉, distance between terminals 100 占 퐉, terminal height 8 占 퐉, Samsung Electronics Co., Ltd.) at 150 占 폚 for 4 seconds, 4.0 MPa And 5 pieces of each of the above specimens are prepared.

Each of the prepared specimens was photographed at 10 positions using a microscope (BX51TRF, Olympus), and then the size of the bubble generated in the space portion relative to the electrode area of the adherend at the time of bonding was 200 times , And expressed as a ratio of the bubble area to the electrode area.

Experimental Example  3 - Initial and Reliability of Anisotropic Conductive Film

For each of the anisotropic conductive films produced according to Examples 1 and 2 and Comparative Examples 1 and 2, five specimens were prepared after pressurization and final compression under the same conditions as Experimental Example 2.

Initial peel strengths were measured at 90 degrees of fill angle and 50 mm / min of peel strength using a peel strength meter (H5KT, Tinius Olsen), and the average values were calculated.

Then, each of the five specimens was allowed to stand for 500 hours at a temperature of 85 ° C and a relative humidity of 85% to conduct a high-temperature / high-humidity reliability evaluation, and then the reliability adhesive strength of each of the five specimens was measured in the same manner as described above The mean value was calculated

Experimental Example  4 - Initial and Reliable Connection Resistance Measurement of Anisotropic Conductive Film

Each of the anisotropic conductive films produced according to Examples 1 to 2 and Comparative Examples 1 and 2 was subjected to pressure bonding and final compression bonding under the same conditions as in Experimental Example 2 and then stored under constant temperature and humidity conditions for reliability evaluation. . The 2-point probe method can use a resistance measuring device. The resistance between two points is measured using two probes connected to the device. A resistance measuring instrument (2000 Multimeter, Keithley) is applied with 1 mA and the resistance is calculated by the measured voltage.

Example 1 Example 2 Comparative Example 1 Comparative Example 2 Dimensional change ratio (%) 6 9 16 22 Bubble area (%) X (not observed) 8 15 30 Initial adhesion
(gf / cm) 1,387 1,256 1056 938 Reliable adhesion
(gf / cm) 1,238 1,220 1008 832 Initial connection resistance (Ω) 0.38 0.40 0.42 0.47 Reliable connection resistance
(Ω) 0.52 0.59 0.78 1.45

As can be seen from the results of the above Table 2, the anisotropic conductive films of Examples 1 and 2 containing 10 to 30 parts by weight of an inorganic filler surface-treated to contain at least one functional group of the same kind as the binder resin or curing agent (Comparative Example 1) in which the dimensional change is 10% or less and the reliability bubble area is 10% or less while the reliability connection resistance is extremely low, while the inorganic filler which is not surface-treated is used (Comparative Example 1) When the content was less than 10 parts by weight (Comparative Example 2), the change in dimensional change was large, and the bubble area was large, resulting in a large increase in the reliability connection resistance.

Claims (14)

delete delete delete delete delete delete delete Binder resin;
Curing agent;
Inorganic filler; And
Conductive particles;
Wherein the anisotropic conductive film comprises:
Wherein the inorganic filler is a silica surface-treated with an acrylic group or a methacrylic group so as to contain at least one functional group of the same kind as any one or more selected from the group consisting of the binder resin and the curing agent,
Wherein the inorganic filler is 10 to 30 parts by weight based on 100 parts by weight of the anisotropic conductive film solid,
The anisotropic conductive film is a thermo-mechanical analyzer (Thermo Mechanical Analyzer) the length of the Z-axis direction of the anisotropic conductive film at 20 ℃ at T _0, 10 ℃ / min and then heated at 20 ℃ to 10 ℃ / min rate of temperature rise up to 220 ℃ when the temperature sensing by the temperature sensing speed to as the length in the Z-axis direction measured at 20 ℃ T _1, dimensional change (dimensional change) of 0% to 10% represented by the following formula 1 and, 50 ℃ to 80 ℃, 1 to For 3 seconds and at a pressure of 1.0 MPa to 3.0 MPa and press-contacted under 120 to 160 deg. C for 1 to 5 seconds under a pressure of 60 to 90 MPa and then subjected to compression under conditions of 85 deg. C and 85% relative humidity for 500 hours And an anisotropic conductive film having a reliability bubble area of 10% or less after standing.
<Formula 1>
┃ T _{0 -} T ₁ ┃ / T ₀ × 100
9. The method of claim 8,
The inorganic filler has an average particle diameter of 10 nm to 500 nm and a specific surface area of 50 to 100 m 2 / g.
9. The method of claim 8,
Wherein the binder resin is 10 to 65 parts by weight, the curing agent is 5 to 20 parts by weight, and the conductive particles are 1 to 15 parts by weight based on 100 parts by weight of the anisotropic conductive film solid, .
9. The method of claim 8,
Anisotropic conductive film having a modulus of 100 to 400 MPa measured at 30 캜 after curing.
A display device comprising an anisotropic conductive film according to any one of claims 8 to 11.
13. The method of claim 12,
Pressed under the conditions of 50 to 80 ° C for 1 to 3 seconds and at a pressure of 1.0 to 3.0 MPa and press-bonded under pressure conditions of 120 to 160 ° C for 1 to 5 seconds and 60 to 90 MPa, Wherein the adhesive force of the anisotropic conductive film after leaving for 500 hours under a humidity of 85% is 1,100 gf / cm or more.
13. The method of claim 12,
Pressed under the conditions of 50 to 80 ° C for 1 to 3 seconds and at a pressure of 1.0 to 3.0 MPa and press-bonded under pressure conditions of 120 to 160 ° C for 1 to 5 seconds and 60 to 90 MPa, And the connection resistance of the anisotropic conductive film after being left for 500 hours under a humidity of 85% is 1.0 Ω or less.

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