JP6327630B1 - Film-like fired material, film-like fired material with support sheet, method for producing film-like fired material, and method for producing film-like fired material with support sheet - Google Patents

Abstract

Disclosed is a film-like fired material that is excellent in thickness stability and thermal conductivity, and hardly breaks the fired material during use. A film-like fired material 1a containing a sinterable metal particle 10 and a binder component 20, wherein an average thickness of an end A of the film-like fired material 1a is equal to an edge A of the film-like fired material 1a. A film-like fired material that is thicker than the average thickness of portion B excluding. A film-like fired material containing the sinterable metal particles 10 and the binder component 20, wherein the average thickness of the end of the film-like fired material is larger than the average thickness of the portion excluding the edge of the film-like fired material Thin, film-like fired material. [Selection] Figure 1

Description

  The present invention relates to a film-like fired material, a film-like fired material with a support sheet, a method for producing a film-like fired material, and a method for producing a film-like fired material with a support sheet.

In recent years, with the increase in voltage and current of automobiles, air conditioners, personal computers, etc., the demand for power semiconductor elements (power devices) mounted on them has increased. Since power semiconductor elements are used under high voltage and high current, heat generation from the semiconductor elements tends to be a problem.
Conventionally, in order to dissipate heat generated from a semiconductor element, a heat sink may be attached around the semiconductor element. However, if the thermal conductivity at the junction between the heat sink and the semiconductor element is not good, efficient heat dissipation is hindered.

  As a bonding material excellent in thermal conductivity, for example, Patent Document 1 discloses paste-like metal fine particles in which specific heat-sinterable metal particles, a specific polymer dispersant, and a specific volatile dispersion medium are mixed. A composition is disclosed. When the composition is sintered, the solid metal is excellent in thermal conductivity.

JP 2014-111800 A

However, when the fired material is in a paste form as in Patent Document 1, it is difficult to make the thickness of the applied paste uniform, and the thickness stability tends to be poor. Therefore, the present inventors have come up with the idea of providing a fired material, which has been conventionally provided as a paste-like composition, as a film in order to solve the problem of thickness stability.
In a film-like fired material, a release film is usually laminated for the purpose of protecting the surface. If it is pasty, there was no particular problem because it was applied directly to the target of sintering joining, but when peeling the release film from the film-like fired material, damage such as cohesive failure to the fired material May occur.
This invention is made | formed in view of the above actual conditions, and it aims at providing the film-form baking material which is excellent in thickness stability and heat conductivity, and does not produce a breakage of a baking material at the time of use. .
Moreover, an object of this invention is to provide the film-like baking material with a support sheet provided with the said film-like baking material.
Moreover, an object of this invention is to provide the manufacturing method of a film-form baking material.
Moreover, an object of this invention is to provide the manufacturing method of the film-form baking material with a support sheet.

That is, the present invention includes the following aspects.
[1] A film-like fired material containing sinterable metal particles and a binder component, a support sheet temporarily attached to one side of the film-like fired material so as to be peelable, and a peel provided on the other side A film-like fired material with a support sheet provided with a film, wherein the support sheet is provided with an adhesive layer on the entire surface or outer periphery of the base film, and the end of the film-like fired material The average thickness of the part is thicker than the average thickness of the part excluding the end of the film-like fired material, the release film has a larger area than the film-like fired material, and the end of the film-like fired material A film-like fired material with a support sheet, in which the release film in contact with the part is not cut.
[2] A film-like fired material containing sinterable metal particles and a binder component, a support sheet temporarily attached to one side of the film-like fired material so as to be peelable, and a peel provided on the other side A film-like fired material with a support sheet provided with a film, wherein the support sheet is provided with an adhesive layer on the entire surface or outer periphery of the base film, and the end of the film-like fired material The average thickness of the portion is thinner than the average thickness of the portion excluding the end of the film-like fired material, the release film has a larger area than the film-like fired material, and the end of the film-like fired material A film-like fired material with a support sheet, in which the release film in contact with the part is not cut.
[3] After a composition containing sinterable metal particles and a binder component is printed on a release film to obtain a film-like fired material, the film-like fired material laminated with the release film is used as a base material. The manufacturing method of the film-form baking material with a support sheet which has the process of temporarily attaching | detaching temporarily on the support sheet in which the adhesive layer was provided in the whole surface or outer peripheral part on the film .

ADVANTAGE OF THE INVENTION According to this invention, it is excellent in thickness stability and heat conductivity, and can provide the film-form baking material which a damage of a baking material does not arise easily at the time of use.
Moreover, according to this invention, the film-form baking material provided with the said film-form baking material and used for the sintering joining of a semiconductor element can be provided.
Moreover, according to this invention, the manufacturing method of a film-form baking material can be provided.
Moreover, according to this invention, the manufacturing method of the film-form baking material with a support sheet can be provided.

It is sectional drawing which shows typically the film-form baking material based on one Embodiment of this invention. It is sectional drawing which shows typically the film-form baking material based on one Embodiment of this invention. It is sectional drawing which shows typically the film-form baking material with a support sheet based on one Embodiment of this invention. It is sectional drawing which shows typically the film-form baking material with a support sheet based on one Embodiment of this invention. It is a figure which shows typically the state by which the film-form baking material with a support sheet based on one Embodiment of this invention was affixed on the ring frame. It is sectional drawing which shows typically the film-form baking material with a support sheet based on one Embodiment of this invention. It is sectional drawing which shows typically an example of the film-form baking material with a support sheet by the conventional processing method.

Embodiments of the present invention will be described below with reference to the drawings as appropriate.
In addition, in order to make the features of the present invention easier to understand, the drawings used in the following description may show the main portions in an enlarged manner for convenience, and the dimensional ratios of the respective components are the same as the actual ones. Not necessarily.

≪Film-like firing material≫
The film-like fired material of the embodiment is a film-like fired material containing sinterable metal particles and a binder component, and the average thickness of the edge of the film-like fired material is the edge of the film-like fired material. It is thicker than the average thickness of the portion excluding.

  In the present specification, the “thickness” can be obtained by using a constant pressure thickness measuring instrument in accordance with JIS K7130 as a value represented by an average of thicknesses measured at five arbitrary locations.

Fig.1 (a) is sectional drawing which shows typically the film-form baking material of embodiment. The film-like fired material 1 a contains sinterable metal particles 10 and a binder component 20.
In the film-like fired material 1a, the average thickness of the end portion A is formed to be thicker than the average thickness of the portion B excluding the end portion A of the film-like fired material 1a. The end A is the peripheral edge of the film-like fired material 1a. The part B excluding the end part is the central part of the film-like fired material 1a. In the film-like fired material 1a, the end A on one surface of the film-like fired material is raised in a convex shape. The whole end portion A may be thicker than the average thickness of the portion B excluding the end portion, or a part of the end portion A may be thicker than the average thickness of the portion B excluding the end portion A.

  The film-like fired material of the embodiment is a film-like fired material containing sinterable metal particles and a binder component, and the average thickness of the edge of the film-like fired material is the edge of the film-like fired material. It is thinner than the average thickness of the part excluding.

Fig.2 (a) is sectional drawing which shows typically the film-form baking material of embodiment. The film-like fired material 1 b contains sinterable metal particles 10 and a binder component 20.
In the film-like fired material 1b, the average thickness of the end portion A ′ is thinner than the average thickness of the portion B ′ excluding the end portion A ′ of the film-like fired material 1b. The end A ′ is the peripheral edge of the film-like fired material 1b. A portion B ′ excluding the end portion is a central portion of the film-like fired material 1b. In the film-like fired material 1b, the end A ′ on one surface of the film-like fired material has a shape without a sharp corner. The entire end A ′ may be thinner than the average thickness of the part B ′ excluding the end, and a part of the end A ′ may be thinner than the average thickness of the part B ′ excluding the end A ′. Also good.

  The widths of the end portions A and A ′ can be, for example, in the range of about 1 to 5 mm along the center direction from the outermost end of the surface of the film-like fired material, and in the range of about 2 to 3 mm. be able to.

The film-like fired material may be composed of one layer (single layer) or may be composed of two or more layers. When the film-like fired material comprises a plurality of layers, these layers may be the same as or different from each other, and the combination of these layers is not particularly limited as long as the effects of the present invention are not impaired.
In the present specification, not only in the case of a film-like fired material, but “a plurality of layers may be the same or different from each other” means “all layers may be the same or all layers. May be different, and only some of the layers may be the same, ”and“ multiple layers are different from each other ”means“ the constituent materials of each layer, the blending ratio of the constituent materials, and the thickness. At least one of them is different from each other ”.

Although the thickness before baking of a film-form baking material is not restrict | limited in particular, 10-200 micrometers is preferable, 20-150 micrometers is preferable, and 30-90 micrometers is more preferable.
Here, the “thickness of the film-like fired material” means the thickness of the entire film-like fired material. For example, the thickness of the film-like fired material consisting of a plurality of layers means all of the film-like fired material Means the total thickness of the layers.

  In the present specification, “thickness” can be acquired as a value represented by an average of thicknesses measured at arbitrary five locations.

(Peeling film)
A film-form baking material can be provided in the state laminated | stacked on the peeling film. Release films 30 and 31 are laminated on one or both sides of the film-like fired materials 1a and 1b. In use, the release film may be peeled off and placed on the object to be sintered and bonded to the film-like fired material. The release film also has a function as a protective film for preventing damage to the film-like fired material. The release film may be provided on at least one side of the film-like fired material, or may be provided on both sides of the film-like fired material.

  When laminating release films on both sides of the film-like fired material, the film-like fired material is formed on the release film whose surface has been peeled off as a heavy release film, and then the surface is peeled off as a light release film. The release treatment surface of the treated release film is attached. At this time, it is preferable to make a difference in the peeling force at the interface between each release film and the film-like fired material. Hereinafter, a release film having a smaller peel force is sometimes referred to as a light release film, and a release film having a greater peel force is sometimes referred to as a heavy release film. If the peeling force is differentiated, it is possible to prevent the film-like fired material from floating from the heavy release film side when only the light release film side is peeled off.

  As the release film, for example, polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, Polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene / (meth) acrylic acid copolymer film, ethylene / (meth) acrylic acid ester copolymer film, polystyrene film, polycarbonate film, polyimide film, fluorine A transparent film such as a resin film is used. These crosslinked films are also used. Furthermore, these laminated films may be sufficient. Moreover, the film which colored these, an opaque film, etc. can be used. Examples of the release agent include release agents such as silicone-based, fluorine-based, and long-chain alkyl group-containing carbamates.

  The thickness of the release film is usually about 10 to 500 μm, preferably about 15 to 300 μm, and particularly preferably about 20 to 250 μm.

As in the film-like fired material of the embodiment, the fired material containing metal particles tends to have a weak cohesive force of the material main body, and tends to cause breakage such as cohesive failure when force is applied.
In FIG. 1, since the film-like fired material 1a is formed such that the average thickness of the end portion A is larger than the average thickness of the portion B excluding the edge portion A of the film-like fired material 1a, the release film 30 is formed. Curves and follows the shape of the film-like fired material 1a. For this reason, stress is generated at the interface between the release film 30 and the film-like fired material 1a, and the release film 30 is easily peeled from the film-like fired material 1a by an external force, and the film-like fired material 1a is hardly damaged (FIG. 1). (B)).
In FIG. 2, the film-like fired material 1b is formed such that the average thickness of the end portion A ′ is thinner than the average thickness of the portion B ′ excluding the end portion A ′ of the film-like fired material 1b. Even when the release film 30 is not able to follow the shape of the film-like fired material 1b, an air layer is present in the gap, so that the contact area at the end A ′ is reduced, and the film-like fired material is also caused by external force. The release film 30 is easily peeled off from 1b, and the film-like fired material is hardly damaged (FIG. 2B).

<Sintering metal particles>
Sinterable metal particles are metal particles that can form a sintered body by bonding particles by heat treatment as firing of a film-like fired material. By forming a sintered body, it is possible to sinter-bond the film-like fired material and the article fired in contact therewith.

  Examples of the metal species of the sinterable metal particles include silver, gold, copper, iron, nickel, aluminum, silicon, palladium, platinum, titanium, barium titanate, oxides or alloys thereof, and silver and silver oxide. Is preferred. Only one kind of the sinterable metal particles may be blended, or two or more kinds may be blended.

  The sinterable metal particles are preferably silver nanoparticles that are nano-sized silver particles.

The particle diameter of the sinterable metal particles contained in the film-like fired material is not particularly limited as long as it can exhibit the sinterability, but may be 100 nm or less, and 50 nm or less. It may be 30 nm or less. The particle diameter of the metal particles contained in the film-like fired material is a projected area equivalent circle diameter of the particle diameter of the metal particles observed with an electron microscope.
Metal particles belonging to the above particle diameter range are preferable because of excellent sinterability.
The particle diameter of the sinterable metal particles contained in the film-like fired material is the number average of the particle diameters obtained for the particles having a projected area equivalent circle diameter of 100 nm or less of the particle diameter of the metal particles observed with an electron microscope. 0.1 to 95 nm, 0.3 to 50 nm, and 0.5 to 30 nm. The number of metal particles to be measured is 100 or more randomly selected per one film-like fired material.

  Before mixing the sinterable metal particles with the binder component and other additive components, disperse them beforehand in a high-boiling solvent with a high boiling point such as isobornyl hexanol or decyl alcohol in order to make the aggregate free of aggregates. May be. The boiling point of the high boiling point solvent may be, for example, 200 to 350 ° C. At this time, when a high-boiling solvent is used, since it hardly volatilizes at room temperature, the concentration of the sinterable metal particles is prevented from increasing, and workability is improved. Reagglomeration and the like are also prevented, and the quality may be improved. Examples of the dispersion method include kneader, three-roll, bead mill, and ultrasonic waves.

  In the film-like fired material of the embodiment, in addition to metal particles having a particle diameter of 100 nm or less (sinterable metal particles), non-sinterable metal particles having a particle diameter not exceeding 100 nm are further blended. Also good. The particle diameter of non-sinterable metal particles having a particle diameter exceeding 100 nm is the number of particle diameters obtained for particles having a projected area equivalent circle diameter exceeding 100 nm of the particle diameter of the metal particles observed with an electron microscope. The average may be greater than 150 nm and less than or equal to 50000 nm, may be 150 to 10,000 nm, and may be 180 to 5000 nm.

Examples of the metal species of the non-sinterable metal particles having a particle diameter exceeding 100 nm include those exemplified above, and silver, copper, and oxides thereof are preferable.
The metal particles having a particle diameter of 100 nm or less and the non-sinterable metal particles having a particle diameter exceeding 100 nm may be the same metal species or different metal species. For example, the metal particles having a particle diameter of 100 nm or less may be silver particles, and the non-sinterable metal particles having a particle diameter exceeding 100 nm may be silver or silver oxide particles. For example, the metal particles having a particle diameter of 100 nm or less may be silver or silver oxide particles, and the non-sinterable metal particles having a particle diameter exceeding 100 nm may be copper or copper oxide particles.

  In the film-like fired material of the embodiment, the content of the metal particles having a particle diameter of 100 nm or less is preferably 20 to 100 parts by mass, more preferably 25 to 99 parts by mass with respect to 100 parts by mass of the total mass of the metal particles. More preferred is 95 parts by mass.

The surface of the sinterable metal particles and / or non-sinterable metal particles may be coated with an organic substance. By having an organic coating, compatibility with the binder component is improved, particles can be prevented from agglomerating, and can be uniformly dispersed.
When the surface of the sinterable metal particles and / or non-sinterable metal particles is coated with an organic substance, the mass of the sinterable metal particles and non-sinterable metal particles is the value including the coating. To do.

<Binder component>
By blending the binder component, the fired material can be formed into a film shape, and tackiness can be imparted to the film-like fired material before firing. The binder component may be thermally decomposable that is thermally decomposed by heat treatment as firing of the film-like fired material.
Although a binder component is not specifically limited, Resin is mentioned as a suitable example of a binder component. Examples of the resin include acrylic resins, polycarbonate resins, polylactic acid, and polymerized cellulose derivatives, and acrylic resins are preferred. Acrylic resins include homopolymers of (meth) acrylate compounds, copolymers of two or more (meth) acrylate compounds, and copolymers of (meth) acrylate compounds and other copolymerizable monomers. included.

In the resin constituting the binder component, the content of the structural unit derived from the (meth) acrylate compound is preferably 50 to 100% by mass, and preferably 80 to 100% by mass with respect to the total amount of the structural unit. More preferably, it is 90-100 mass%.
Here, “derived” means that the monomer has undergone a structural change necessary for polymerization.

Specific examples of the (meth) acrylate compound include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, and t-butyl. (Meth) acrylate, pentyl (meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (Meth) acrylate, ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, Decyl (meth) acrylate, alkyl (meth) acrylates such as lauryl (meth) acrylate, stearyl (meth) acrylate, isostearyl (meth) acrylate;
Hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) Hydroxyalkyl (meth) acrylates such as acrylates;
Phenoxyalkyl (meth) acrylates such as phenoxyethyl (meth) acrylate and 2-hydroxy-3-phenoxypropyl (meth) acrylate; 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-propoxyethyl Alkoxyalkyl (meth) acrylates such as (meth) acrylate, 2-butoxyethyl (meth) acrylate, 2-methoxybutyl (meth) acrylate;
Polyethylene glycol mono (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, phenoxypolyethylene glycol (meth) acrylate, nonylphenoxypolyethylene glycol (meth) acrylate, polypropylene glycol mono (meth) acrylate, methoxypolypropylene Polyalkylene glycol (meth) acrylates such as glycol (meth) acrylate, ethoxy polypropylene glycol (meth) acrylate, nonylphenoxy polypropylene glycol (meth) acrylate;
Cyclohexyl (meth) acrylate, 4-butylcyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentadienyl (meth) acrylate, bornyl (meth) acrylate, isobornyl ( Cycloalkyl (meth) acrylates such as (meth) acrylate and tricyclodecanyl (meth) acrylate;
Examples thereof include benzyl (meth) acrylate and tetrahydrofurfuryl (meth) acrylate. Alkyl (meth) acrylate or alkoxyalkyl (meth) acrylate is preferred, and particularly preferred (meth) acrylate compounds include butyl (meth) acrylate, ethylhexyl (meth) acrylate, lauryl (meth) acrylate, isodecyl (meth) acrylate, 2- Mention may be made of ethylhexyl (meth) acrylate and 2-ethoxyethyl (meth) acrylate.

In this specification, “(meth) acrylate” is a concept including both “acrylate” and “methacrylate”.
As the acrylic resin, methacrylate is preferable. When the binder component contains a structural unit derived from methacrylate, it can be fired at a relatively low temperature, and the conditions for obtaining sufficient adhesive strength after sintering can be satisfied.

In the resin constituting the binder component, the content of the structural unit derived from methacrylate is preferably 50 to 100% by mass, more preferably 80 to 100% by mass, based on the total amount of the structural unit, 90 More preferably, it is -100 mass%.
Here, “derived” means that the monomer has undergone a structural change necessary for polymerization.

  The other copolymerizable monomer is not particularly limited as long as it is a compound copolymerizable with the above (meth) acrylate compound. For example, (meth) acrylic acid, vinylbenzoic acid, maleic acid, vinylphthalic acid, etc. Unsaturated carboxylic acids; vinyl group-containing radical polymerizable compounds such as vinyl benzyl methyl ether, vinyl glycidyl ether, styrene, α-methyl styrene, butadiene, and isoprene.

The resin constituting the binder component preferably has a weight average molecular weight (Mw) of 1,000 to 1,000,000, more preferably 10,000 to 800,000. When the weight average molecular weight of the resin is within the above range, it becomes easy to develop sufficient film strength and impart flexibility as a film.
In the present specification, “weight average molecular weight” is a polystyrene equivalent value measured by gel permeation chromatography (GPC) method unless otherwise specified.

  The glass transition temperature (Tg) of the resin constituting the binder component is preferably −60 to 50 ° C., more preferably −30 to 10 ° C., and still more preferably −20 to less than 0 ° C. . When the Tg of the resin is not more than the above upper limit, the adhesive force between the film-like fired material and the semiconductor element is improved, and when the Tg of the resin is not less than the above lower limit, the film from a support sheet or the like to be described later It becomes easier to separate the shaped fired material.

The binder component may be thermally decomposable that is thermally decomposed by heat treatment as firing of the film-like fired material. The thermal decomposition of the binder component can be confirmed by a decrease in the mass of the binder component due to firing. In addition, although the component mix | blended as a binder component may be substantially thermally decomposed by baking, the total mass of the component mix | blended as a binder component does not need to be thermally decomposed by baking.
The binder component may have a mass after firing of 10% by mass or less, or 5% by mass or less, and 3% by mass or less with respect to 100% by mass of the binder component before firing. It may be.

  In addition to the above sinterable metal particles, non-sinterable metal particles and binder component, the film-like fired material of the embodiment includes sinterable metal particles, non-sintered materials within the range not impairing the effects of the present invention. Other additives that do not correspond to the binder metal particles and the binder component may be contained.

  Examples of other additives that may be contained in the film-like fired material of the embodiment include a solvent, a dispersant, a plasticizer, a tackifier, a storage stabilizer, an antifoaming agent, a thermal decomposition accelerator, and an antioxidant. Is mentioned. Only 1 type may be contained and 2 or more types of additives may be contained. These additives are not particularly limited, and those commonly used in this field can be appropriately selected.

<Composition>
The film-like fired material of the embodiment may be composed of sinterable metal particles, a binder component, and other additives, and the sum of these contents (mass%) may be 100 mass%. .
When the film-like fired material of the embodiment includes non-sinterable metal particles, the film-like fired material is made of sinterable metal particles, non-sinterable metal particles, a binder component, and other additives. The sum of these contents (mass%) may be 100 mass%.

In the film-like fired material, the content of the sinterable metal particles is preferably 10 to 98% by mass with respect to the total content of 100% by mass of all components other than the solvent (hereinafter referred to as “solid content”). 15-90 mass% is more preferable, and 20-80 mass% is further more preferable.
When the film-like fired material contains non-sinterable metal particles, the total content of the sinterable metal particles and the non-sinterable metal particles with respect to 100% by mass of the total solid content in the film-like fired material is 50-98 mass% is preferable, 70-95 mass% is more preferable, 80-90 mass% is further more preferable.

  In the film-like fired material, the content of the binder component with respect to the total content of 100% by mass of all components other than the solvent is preferably 2 to 50% by mass, more preferably 5 to 30% by mass, and 10 to 20% by mass. Further preferred.

  In the film-like fired material, the mass ratio of the sinterable metal particles to the binder component (sinterable metal particles: binder component) is preferably 50: 1 to 1: 5, and more preferably 20: 1 to 1: 2. 10: 1 to 1: 1 is more preferable. When the film-like fired material contains non-sinterable metal particles, the mass ratio of the sinterable metal particles and non-sinterable metal particles to the binder component ((sinterable metal particles + non-sinterable The metal particles): binder component) is preferably 50: 1 to 1: 1, more preferably 20: 1 to 2: 1, and even more preferably 9: 1 to 4: 1.

  The film-like fired material may contain a high boiling point solvent used when mixing the sinterable metal particles, the binder component, and other additive components. The content of the high boiling point solvent is preferably 20% by mass or less, more preferably 15% by mass or less, and further preferably 10% by mass or less with respect to 100% by mass of the total mass of the film-like fired material.

  According to the film-like fired material of the above embodiment, the film-like fired material is excellent in thickness stability. Moreover, since the film-form baking material of embodiment contains a sinterable metal particle, it is excellent in thermal conductivity. Furthermore, the film-like fired material of the embodiment is fired at the time of use because the average thickness of the end of the film-like fired material is thicker or thinner than the average thickness of the portion excluding the edge of the film-like fired material. The material is not easily damaged.

≪Method for producing film-like fired material≫
The film-like fired material can be formed using a fired material composition containing the constituent materials.
The manufacturing method of the film-form baking material of embodiment has the process of printing the baking material composition containing a sinterable metal particle and a binder component.
For example, a film-like adhesive can be formed at a target site by printing the firing material composition on the surface on which the film-like fired material is to be formed and drying it as necessary to volatilize the solvent.
Any solvent may be used as long as it can be evaporated and dried after printing, and the boiling point is preferably from 65 ° C to 350 ° C. For example, n-hexane (boiling point: 68 ° C), ethyl acetate (boiling point: 77 ° C), 2-butanone (boiling point: 80 ° C), n-heptane (boiling point: 98 ° C), methylcyclohexane (boiling point: 101 ° C), toluene (Boiling point: 111 ° C.), acetylacetone (boiling point: 138 ° C.), n-xylene (boiling point: 139 ° C.), dimethylformamide (boiling point: 153 ° C.) and the like.

In order to suppress the increase in viscosity due to solvent volatilization during printing, those having a boiling point of 200 ° C. or higher may be used. For example, isophorone (boiling point: 215 ° C.), butyl carbitol (boiling point: 230 ° C.), 1-decanol ( Boiling point: 233 ° C.), butyl carbitol acetate (boiling point: 247 ° C.), isobornylcyclohexanol (boiling point: 318 ° C.), and the like.
These may be used alone or in combination.
When the boiling point exceeds 350 ° C., it remains in the film at the time of firing and there is a possibility of deteriorating the bonding adhesiveness. If the boiling point is lower than 65 ° C., it volatilizes during printing and there is a risk that the stability of the thickness is impaired.
Examples of the print target surface of the fired material composition include the surface of a release film.

  The firing material composition can be printed by a known printing method, such as relief printing such as flexographic printing, intaglio printing such as gravure printing, flat printing such as offset printing, silk screen printing, rotary screen printing, etc. Examples thereof include screen printing and printing by various printers such as an ink jet printer.

  What is necessary is just to set suitably the printing shape of a calcination material composition according to the shape of the object of sintering joining, and circular or a rectangle is preferable. The circle is a shape corresponding to the shape of the semiconductor wafer. The rectangle is a shape corresponding to the shape of the semiconductor element. The corresponding shape may be the same shape or substantially the same shape as the target shape of the sintered joint.

When the firing material composition to be printed is circular, the area of the circle may be 3.5～1,600Cm ^2, may be 85~1,400cm ^2. When the firing material composition to be printed is rectangular, rectangular area may be a 0.01～25Cm ^2, it may be 0.25~9cm ^2.

  Although the drying conditions of a calcination material composition are not specifically limited, When the calcination material composition contains a solvent, it is preferable to heat-dry, and in this case, for example, at 70 to 250 ° C. for 10 seconds to 10 minutes. It is preferable to dry under conditions.

  According to the method for producing a film-like fired material of the embodiment, the film-like fired material of the present invention can be produced. The produced film-like fired material can take the form of the above-mentioned film-like fired material 1a or film-like fired material 1b depending on properties such as viscosity and surface tension of the fired material composition used. If the viscosity of the baking material composition to be used is high, the average thickness of the edge part of a film-like baking material is more than the average thickness of the part except the edge part of the said film-like baking material like the film-like baking material 1a. If the viscosity of the fired material composition used is low, the average thickness of the end of the film-like fired material is the end of the film-like fired material as in the film-like fired material 1b. It tends to be thinner than the average thickness of the portion excluding the portion. The viscosity of the fired material composition is appropriately set.

Similarly, if the surface tension of the baking material composition used is high, the contact angle with the surface of the release film that is the printing surface increases, and the average thickness of the end of the film-like baking material as in the film-like baking material 1a. However, if the surface tension of the baking material composition used is low, the contact angle with the surface of the release film becomes small. As in the film-like fired material 1b, the average thickness of the end of the film-like fired material tends to be thinner than the average thickness of the portion excluding the end of the film-like fired material. The surface tension of the fired material composition is appropriately set.
In addition, the film-form baking material of this invention is not limited to what was manufactured by the manufacturing method of the film-form baking material of embodiment.

Conventional paste-like fired materials are not particularly problematic because they are applied directly to the object of sintering joining, but let's match the shape of the film-like fired material with the object of sintering joining. In this case, it is usual to first produce a large-area film and then cut it into a desired shape.
However, depending on the shape of the cut, a lot of cut ends are generated, and the cut ends are to be disposed of, so that the yield with respect to the raw material is lowered. At the same time, the price of the product will rise.

  On the other hand, according to the method for producing a film-like fired material of the embodiment, a desired shape can be formed from the beginning by printing. For this reason, a cut end portion is not generated, and the yield with respect to the raw material is improved. In particular, since the sinterable metal particles contained in the film-like fired material are relatively expensive materials, the ability to reduce the waste loss of raw materials leads to a significant reduction in product price, which is very beneficial.

≪Film-like fired material with support sheet≫
The film-like fired material with a support sheet of the embodiment comprises the film-like fired material of the embodiment, a support sheet provided on one side of the film-like fired material, and a release film provided on the other side. Prepare. The support sheet is provided with a pressure-sensitive adhesive layer on the entire surface or on the outer periphery of the base film, and the film-like fired material is provided on the pressure-sensitive adhesive layer in direct contact with the base film. It is preferable to be provided in direct contact with the material film. By taking this form, it can be used as a dicing sheet used when a semiconductor wafer is divided into elements, and by using a blade or the like to separate into a wafer, the film shape is the same as the element. It can be processed as a fired material, and a semiconductor element with a film-like fired material can be manufactured.

  Hereinafter, embodiments of the film-like fired material with a support sheet will be described. The schematic sectional drawing of the film-form baking material with a support sheet of embodiment is shown in FIG. 3 and FIG. As shown in FIG. 3 and FIG. 4, the film-like fired material 100 a, 100 b with the support sheet of the embodiment allows the film-like fired material 1 to be peeled on the inner peripheral part of the support sheet 2 having the adhesive part on the outer peripheral part. Temporarily worn. As shown in FIG. 3, the support sheet 2 is a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer 4 on the upper surface of the base film 3, and the inner peripheral surface of the pressure-sensitive adhesive layer 4 is covered with a film-like fired material. The adhesive portion is exposed on the outer peripheral portion. As shown in FIGS. 4 and 5, the support sheet 2 may be configured to have a ring-shaped pressure-sensitive adhesive layer 4 on the outer periphery of the base film 3.

  The film-like fired material 1 is formed on the inner peripheral portion of the support sheet 2 in substantially the same shape as a workpiece (semiconductor wafer or the like) to be stuck. The support sheet 2 has an adhesive portion on the outer peripheral portion. In a preferred embodiment, the film-like fired material 1 having a smaller diameter than the support sheet 2 is concentrically laminated on the circular support sheet 2. The adhesive portion on the outer peripheral portion is used for fixing the ring frame 5 as illustrated.

  Fig.6 (a) is sectional drawing which shows typically the film-form baking material with a support sheet of this embodiment. The release film 31 of the film-like fired material 100c with a support sheet has a larger area than the film-like fired material 1 and extends from the end of the film-like fired material 1. Furthermore, the film-like baking material 100c with a support sheet shown in FIG. 6 has no cut in the release film 31 in contact with the end portion.

  Fig.7 (a) is sectional drawing which shows typically an example of the film-form baking material with a support sheet by the conventional processing method. The film-like fired material 100c with a support sheet and the film-like fired material 100d with a support sheet have the same configuration, but in the film-like fired material 100d with a support sheet, the release film 31 in contact with the end of the film-like fired material 1 is used. There is a notch I.

  The release film 31 of the film-like fired material 100c with support sheet shown in FIG. 6 has a larger area than the film-like fired material 1 and extends from the end of the film-like fired material 1, and the release film 31 is not cut. Therefore, when the peeling film 31 is peeled from the film-like fired material 1, the film-like fired material 1 is hardly damaged (FIG. 6B).

  7A, when the release film 31 in contact with the end portion has a cut I, the film-like fired material 1 is partially formed in the cut I in the process of forming the cut I. When the release film 31 is peeled from the film-like fired material 1, the film-like fired material 1 may be peeled off from the support sheet 2 (FIG. 7B), and the film-like fired material 1 is aggregated. There is a risk of damage such as destruction (FIG. 7B).

  As in the film-like fired material shown in FIGS. 1 and 2, there is no cut in the release film 31 in contact with the end, and the average thickness of the end of the film-like fired material 1a is the end of the film-like fired material 1a. When the film-like fired material 1a is peeled from the release film 30, it can be peeled off stably at the interface between the target film-like fired material and the peelable film because it is thicker or thinner than the average thickness of the part excluding the part. The film-like fired material is hardly damaged.

The cut into the release film 31 can occur when the film-like fired material 1 provided on the release film 31 is punched.
However, if the film-like fired material 1 is provided on the support sheet 2 by the method for producing a film-like fired material with a support sheet described later, the film-like fired material can be formed into a desired shape without performing cutting, A film-like fired material with a support sheet in which the release film 31 is not cut can be easily obtained.

(Base film)
The base film 3 that is a constituent material of the support sheet 2 is not particularly limited. For example, low density polyethylene (LDPE), linear low density polyethylene (LLDPE), ethylene / propylene copolymer, polypropylene, polybutene, polybutadiene, Polymethylpentene, ethylene / vinyl acetate copolymer, ethylene / (meth) acrylic acid copolymer, ethylene / (meth) acrylic acid methyl copolymer, ethylene / (meth) acrylic acid ethyl copolymer, polyvinyl chloride Films made of vinyl chloride / vinyl acetate copolymer, polyurethane film, ionomer, etc. are used. In the present specification, “(meth) acryl” is used to mean both acrylic and methacrylic.

  In addition, polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate having heat resistance, polyolefin films such as polypropylene and polymethylpentene, and the like can be given. In addition, these cross-linked films and modified films by radiation and discharge can also be used. The base film may be a laminate of the above films.

  Moreover, these films can also be laminated | stacked or used in combination of 2 or more types. Furthermore, the thing which colored these films, or what gave printing etc. can be used. In addition, the film may be a sheet obtained by extrusion forming a thermoplastic resin, or may be a stretched film. A film obtained by thinning and curing a curable resin by a predetermined means is used. It may be broken.

  The thickness of a base film is not specifically limited, Preferably it is 30-300 micrometers, More preferably, it is 50-200 micrometers. By making the thickness of the base film within the above range, the base film is hardly broken even if cutting is performed by dicing. In addition, since sufficient flexibility is imparted to the film-like fired material with a support sheet, good sticking property to a workpiece (for example, a semiconductor wafer) is exhibited.

  The base film can also be obtained by applying a release agent to the surface and performing a release treatment. As the release agent used for the release treatment, alkyd, silicone, fluorine, unsaturated polyester, polyolefin, wax, and the like are used. In particular, alkyd, silicone, and fluorine release agents are heat resistant. This is preferable.

  In order to release the surface of the substrate film using the above release agent, the release agent is used without a solvent, or diluted or emulsified with a solvent, and a gravure coater, a Mayer bar coater, an air knife coater, a roll coater, etc. The substrate film on which the release agent is applied is applied at room temperature or under heating, or cured by electron beam, wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, etc. The laminate may be formed with

(Adhesive layer)
The support sheet 2 is provided with an adhesive layer 4 on the entire surface or the outer peripheral portion of the base film 3, and the support sheet 2 has an adhesive portion at least on the outer peripheral portion thereof. The adhesive portion has a function of temporarily fixing the ring frame 5 at the outer peripheral portions of the film-like fired materials 100a and 100b with a support sheet, and it is preferable that the ring frame 5 can be peeled off after a required process. Accordingly, the pressure-sensitive adhesive layer 4 may be weakly adhesive, or may be energy-ray curable, whose adhesive strength is reduced by irradiation with energy rays. The re-peelable pressure-sensitive adhesive layer is made of various conventionally known pressure-sensitive adhesives (for example, rubber-based, acrylic-based, silicone-based, urethane-based, vinyl ether-based general-purpose pressure-sensitive adhesives, pressure-sensitive adhesives, energy ray curable type) Adhesive, thermal expansion component-containing adhesive, etc.).

  In the configuration shown in FIG. 4, a ring-shaped adhesive layer 4 is formed on the outer peripheral portion of the base film 3 to form an adhesive portion. At this time, the pressure-sensitive adhesive layer 4 may be a single-layer pressure-sensitive adhesive layer made of the above-mentioned pressure-sensitive adhesive, or may be one obtained by circularly cutting a double-sided pressure-sensitive adhesive tape including a pressure-sensitive adhesive layer made of the above-mentioned pressure-sensitive adhesive.

  Further, as shown in FIG. 3, the support sheet 2 is a pressure-sensitive adhesive sheet having a normal structure having a pressure-sensitive adhesive layer 4 on the entire upper surface of the base film 3, and the surface of the inner peripheral portion of the pressure-sensitive adhesive layer 4 is a film. The adhesion part may be the structure which was covered with the shape baking material and was exposed to the outer peripheral part. In this case, the outer peripheral portion of the pressure-sensitive adhesive layer 4 is used for fixing the ring frame 5 described above, and a film-like fired material is laminated on the inner peripheral portion in a peelable manner. As the pressure-sensitive adhesive layer 4, a weakly-adhesive layer may be used as described above, or an energy ray-curable pressure-sensitive adhesive may be used.

  As the weak pressure-sensitive adhesive, an acrylic type or a silicone type is preferably used. In consideration of the peelability of the film-like fired material, the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer 4 to the SUS plate at 23 ° C. is preferably 30 to 120 mN / 25 mm, and preferably 50 to 100 mN / 25 mm. Is more preferable, and 60 to 90 mN / 25 mm is more preferable. If the adhesive strength is too low, the adhesiveness between the film-like fired material 1 and the pressure-sensitive adhesive layer 4 becomes insufficient, and the film-like fired material and the pressure-sensitive adhesive layer are peeled off during the dicing process, or the ring frame falls off. There are things to do. On the other hand, if the adhesive strength is too high, the film-like fired material and the pressure-sensitive adhesive layer are excessively adhered to each other, which causes a pickup failure.

  In the support sheet having the configuration shown in FIG. 3, when an energy ray-curable removable pressure-sensitive adhesive layer is used, the region where the film-like fired material is laminated is irradiated with energy rays in advance to reduce the adhesiveness. Good. At this time, the other regions may not be irradiated with energy rays, and may be maintained with a high adhesive force for the purpose of adhesion to the ring frame 5, for example. In order not to irradiate energy rays only to other regions, for example, an energy ray shielding layer is provided by printing or the like in regions corresponding to other regions of the substrate film, and energy rays are irradiated from the substrate film side. Just do it. Moreover, in the support sheet of the structure of FIG. 3, in order to strengthen the adhesion | attachment with the base film 3 and the adhesive layer 4, the surface in which the adhesive layer 4 of the base film 3 is provided may be sandblasted, if desired. Irregularizing treatment such as solvent treatment, or corona discharge treatment, electron beam irradiation, plasma treatment, ozone / ultraviolet irradiation treatment, flame treatment, chromic acid treatment, hot air treatment, or other oxidation treatment can be performed. Moreover, primer treatment can also be performed.

  Although the thickness of the adhesive layer 4 is not specifically limited, Preferably it is 1-100 micrometers, More preferably, it is 2-80 micrometers, Most preferably, it is 3-50 micrometers.

(Film-like fired material with support sheet)
The film-like fired material with a support sheet is formed by temporarily attaching the film-like fired material to the inner periphery of a support sheet having an adhesive part on the outer periphery. In the configuration example shown in FIG. 3, the film-like fired material 100 a with a support sheet is laminated such that the film-like fired material 1 can be peeled on the inner peripheral portion of the support sheet 2 composed of the base film 3 and the pressure-sensitive adhesive layer 4. The pressure-sensitive adhesive layer 4 is exposed on the outer periphery of the support sheet 2. In this configuration example, it is preferable that the film-like fired material 1 having a smaller diameter than the support sheet 2 is laminated on the pressure-sensitive adhesive layer 4 of the support sheet 2 so as to be peeled in a concentric manner.

  The film-like fired material 100a with a support sheet having the above configuration is attached to the ring frame 5 in the pressure-sensitive adhesive layer 4 exposed on the outer periphery of the support sheet 2.

  Further, an annular double-sided tape or a pressure-sensitive adhesive layer may be separately provided on the margin for the ring frame (exposed pressure-sensitive adhesive layer in the outer peripheral portion of the pressure-sensitive adhesive sheet). The double-sided tape has a configuration of pressure-sensitive adhesive layer / core material / pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer in the double-sided tape is not particularly limited. For example, rubber-based, acrylic-based, silicone-based, polyvinyl ether, or the like is used. . The adhesive layer is affixed to the ring frame at the outer periphery when an element described later is manufactured. As the core material of the double-sided tape, for example, a polyester film, a polypropylene film, a polycarbonate film, a polyimide film, a fluororesin film, a liquid crystal polymer film and the like are preferably used.

  In the configuration example shown in FIG. 4, a ring-shaped adhesive layer 4 is formed on the outer peripheral portion of the base film 3 to form an adhesive portion. At this time, the pressure-sensitive adhesive layer 4 may be a single-layer pressure-sensitive adhesive layer made of the above-mentioned pressure-sensitive adhesive, or may be one obtained by circularly cutting a double-sided pressure-sensitive adhesive tape including a pressure-sensitive adhesive layer made of the above-mentioned pressure-sensitive adhesive. The film-like fired material 1 is detachably laminated on the inner peripheral part of the base film 3 surrounded by the adhesive part. In this configuration example, it is preferable that the film-shaped fired material 1 having a smaller diameter than the support sheet 2 is laminated on the base film 3 of the support sheet 2 so as to be concentrically peelable.

  The film-like fired material with a support sheet is a release film for the purpose of protecting the surface of either the film-like fired material and / or the adhesive part, or both, until they are used. May be provided.

  The release film can also be obtained by applying a release agent to the surface of the base film such as polyethylene, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and polypropylene mentioned above and performing a release treatment. As the release agent used for the release treatment, alkyd, silicone, fluorine, unsaturated polyester, polyolefin, wax, and the like are used. In particular, alkyd, silicone, and fluorine release agents are heat resistant. This is preferable.

  In order to release the surface of the substrate film using the above release agent, the release agent is used without a solvent, or diluted or emulsified with a solvent, and a gravure coater, a Mayer bar coater, an air knife coater, a roll coater, etc. The substrate film on which the release agent is applied is applied at room temperature or under heating, or cured by electron beam, wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, etc. The laminate may be formed with

  The thickness of the film-like fired material with a support sheet is usually about 25 to 1000 μm, preferably about 45 to 800 μm, and particularly preferably about 100 to 500 μm.

≪Method for producing film-like fired material with support sheet≫
The method for producing a film-like fired material with a support sheet is obtained by printing a composition containing sinterable metal particles and a binder component on a release film to obtain a film-like fired material, and then supporting the film-like fired material. Providing on a sheet.

  For example, a composition containing sinterable metal particles and a binder component is printed on a release film, dried as necessary to volatilize the solvent to form a film, thereby forming a film-like fired material on the release film. Then, another release film is laminated on the film-like fired material, and a laminate having a structure of release film / film-like fired material / release film in this order is prepared in advance. Then, while peeling the release film from the film-like fired material, by laminating the support sheet on the film-like fired material, the support sheet / film-like fired material / release film-attached film-like fired in this order The material can be manufactured. The release film on the film-like fired material may be removed as necessary after forming the laminated structure.

  In addition, the composition containing the sinterable metal particles and the binder component is printed on the release film, and if necessary, dried to volatilize the solvent to form a film, thereby forming a film-like fired material on the release film. Then, another release film is laminated on the film-like fired material, and a laminate having a structure of release film / film-like fired material / release film in this order is prepared in advance. On the release film different from these, the pressure-sensitive adhesive composition is applied, and if necessary, it is dried and the solvent is volatilized to form a film, thereby forming a pressure-sensitive adhesive layer on the release film, A base film is laminated | stacked on an adhesive layer, and the laminated body which has the structure of a base film / adhesive layer / release film in this order is prepared. Then, by peeling the release film from the film-like fired material and the pressure-sensitive adhesive layer, respectively, the film-like fired material is laminated on the exposed surface of the pressure-sensitive adhesive layer that has been laminated on the base material film, whereby the base film / pressure-sensitive adhesive A film-like fired material with a supporting sheet having the structure of layer / film-like fired material / release film in this order can also be produced. The release film on the film-like fired material may be removed as necessary after forming the laminated structure.

  As described above, since the pressure-sensitive adhesive layer or the film-like fired material constituting the film-like fired material with a support sheet can be laminated by a method in which it is formed in advance on the release film and bonded to the surface of the target layer. If necessary, a layer that employs such a step may be appropriately selected to produce a film-like fired material with a support sheet.

  In addition, after providing all the necessary layers, the film-like fired material with a support sheet is stored in a state where the release film is bonded to the surface of the outermost layer opposite to the support sheet.

  In addition, as exemplified in the method for producing a film-like fired material, instead of coating the fired material composition, a composition containing sinterable metal particles and a binder component is formed on the release film. A film-like fired material can be obtained by printing. Then, the said film-like baking material is provided on a support sheet, and the film-like baking material with a support sheet is obtained.

≪Element manufacturing method≫
Next, a method for using the film-like fired material with a support sheet according to the present invention will be described taking as an example the case where the fired material is applied to the production of an element (for example, a semiconductor element).

  As one embodiment of the present invention, a method for producing a semiconductor element using a film-like fired material with a support sheet comprises a semiconductor wafer (workpiece) having a circuit formed on the surface by peeling off the release film of the film-like fired material with a support sheet. ) Is attached to the back surface of the support sheet, and the following steps (1) to (2) may be performed in the order of (1) and (2). (4) may be performed in the order of (1), (2), (3), and (4).

Step (1): a step of dicing the semiconductor wafer (work) and the film-like fired material of the laminate in which the support sheet, the film-like fired material, and the semiconductor wafer (work) are laminated in this order,
Step (2): A step of peeling the film-like fired material and the support sheet to obtain an element with the film-like fired material,
Step (3): A step of attaching an element with a film-like fired material to the surface of the adherend,
Step (4): A step of firing the film-like fired material and joining the semiconductor element and the adherend.

Hereinafter, the case where the said process (1)-(4) is performed is demonstrated.
The semiconductor wafer may be a silicon wafer or a compound semiconductor wafer such as gallium / arsenic. Formation of a circuit on the wafer surface can be performed by various methods including conventionally used methods such as an etching method and a lift-off method. Next, the opposite surface (back surface) of the circuit surface of the semiconductor wafer is ground. The grinding method is not particularly limited, and grinding may be performed by a known means using a grinder or the like. At the time of back surface grinding, an adhesive sheet called a surface protection sheet is attached to the circuit surface in order to protect the circuit on the surface. In the back surface grinding, the circuit surface side (that is, the surface protection sheet side) of the wafer is fixed by a chuck table or the like, and the back surface side on which no circuit is formed is ground by a grinder. The thickness of the wafer after grinding is not particularly limited, but is usually about 20 to 500 μm. Thereafter, if necessary, the crushed layer generated during back grinding is removed. The crushed layer is removed by chemical etching, plasma etching, or the like.

  Next, the film-like fired material of the film-like fired material with the support sheet is pasted on the back surface of the semiconductor wafer. Then, process (1)-(4) is performed in order of (1), (2), (3), (4).

  The semiconductor wafer / film-like fired material / support sheet laminate is diced for each circuit formed on the wafer surface to obtain a semiconductor element / film-like fired material / support sheet laminate. Dicing is performed so as to cut both the wafer and the film-like fired material. According to the film-like fired material with a support sheet of the embodiment, since the adhesive force is exhibited between the film-like fired material and the support sheet at the time of dicing, chipping and element jumping can be prevented, and the dicing suitability is excellent. . The dicing is not particularly limited. For example, after dicing the wafer, the periphery of the support sheet (the outer periphery of the support) is fixed by a ring frame, and then a known method such as using a rotating round blade such as a dicing blade is used. For example, a method for dividing a wafer into individual pieces may be used. The cutting depth into the support sheet by dicing may be obtained by completely cutting the film-like fired material, and is preferably 0 to 30 μm from the interface between the film-like fired material and the support sheet. By reducing the amount of cut into the support sheet, melting of the pressure-sensitive adhesive layer and the base film constituting the support sheet due to friction of the dicing blade, generation of burrs, and the like can be suppressed.

  Thereafter, the support sheet may be expanded. When a film having excellent extensibility is selected as the base film of the support sheet, the support sheet has excellent expandability. The film-like fired material and the support sheet are peeled off by picking up the diced semiconductor element with the film-like fired material by a general-purpose means such as a collet. As a result, a semiconductor element having a film-like fired material on the back surface (semiconductor element with a film-like fired material) is obtained.

Subsequently, an element for film-like fired material is attached to the surface of an adherend such as a substrate, a lead frame, or a heat sink.
Next, the film-like fired material is fired, and a substrate, a lead frame, an adherend such as a heat sink, and the element are sintered and joined. At this time, if the exposed surface of the film-like fired material of the semiconductor element with the film-like fired material is attached to an adherend such as a substrate, a lead frame, or a heat sink, the semiconductor element and the adherend are placed via the film-like fired material. The body can be sintered and joined.

  The heating temperature for firing the film-like fired material may be appropriately determined in consideration of the type of the film-like fired material, etc., but is preferably 100 to 600 ° C, more preferably 150 to 550 ° C, and further preferably 250 to 500 ° C. preferable. The heating time may be appropriately determined in consideration of the type of film-like fired material and the like, but is preferably 1 to 60 minutes, more preferably 1 to 30 minutes, and further preferably 1 to 10 minutes.

  The firing of the film-like fired material may be performed by pressure firing in which the film-like fired material is fired under pressure. As an example, the pressurizing condition may be about 1 to 50 MPa.

  According to the element manufacturing method of the embodiment, a film-like fired material with high uniformity in thickness can be easily formed on the back surface of the element, and cracks after the dicing process and packaging are less likely to occur. In addition, according to the element manufacturing method of the embodiment, a semiconductor element with a film-like fired material can be obtained without individually attaching the film-like fired material to the back surface of the individualized semiconductor element, thereby simplifying the production process. Can be achieved. Then, the semiconductor element with the film-like fired material is placed on a desired adherend such as a device substrate and fired to sinter-bond the semiconductor element and the adherend via the film-like fired material. A semiconductor device can be manufactured.

  As one embodiment, a semiconductor element with a film-like fired material comprising a semiconductor element and the film-like fired material of the embodiment is obtained. As an example, the semiconductor element with a film-like fired material can be manufactured by the above-described element manufacturing method.

  In the above-described embodiment, the sintered joining with the semiconductor element and the sintered joining between the semiconductor element and the adherend are exemplified, but the sintered joining target of the film-like fired material is limited to those exemplified above. First, it is possible to sinter and bond to various articles sintered in contact with the film-like fired material.

  EXAMPLES Hereinafter, although an Example etc. demonstrate this invention further more concretely, the scope of the present invention is not limited to these Examples etc.

<Manufacture of firing material composition>
The components used for the production of the fired material composition are shown below. Here, metal particles having a particle diameter of 100 nm or less are expressed as “sinterable metal particles”, and metal particles having a particle diameter exceeding 100 nm are expressed as “non-sinterable metal particles”.

(Sintering metal particle-containing paste material)
・ Arconano silver paste ANP-1 (Organic coated composite silver nanopaste, Applied Nanoparticles Laboratory Co., Ltd .: Alcohol derivative-coated silver particles, metal content 70 wt% or more, silver particles 60 wt% or more with an average particle size of 100 nm or less)
・ Arconano silver paste ANP-4 (Organic coated composite silver nanopaste, Applied Nanoparticles Laboratory Co., Ltd .: Alcohol derivative-coated silver particles, metal content of 80 wt% or more, average particle size of 100 nm or less of silver particles of 25 wt% or more)

(Binder component)
-A commercially available acrylic polymer (2-ethylhexyl methacrylate polymer, average molecular weight 28,000, L-0818, manufactured by Nippon Gosei Kagaku Co., Ltd., MEK diluted product, solid content 54 under the conditions of 60 ° C. and 200 hPa using an evaporator. .5 mass%), MEK was volatilized. To this, the same amount of butyl carbitol (boiling point: 230 ° C.) as the volatilized MEK was added and dispersed and diluted again to prepare a binder component (solid content 54.5% by mass).

(High boiling point solvent)
・ Butyl carbitol (boiling point: 230 ° C)

  In the formulation shown in Table 1, each component was mixed to obtain a fired material composition corresponding to Examples 1-2 and Comparative Examples 1-2. The value of each component of the fired material composition in Table 1 represents parts by mass. Since the sinterable metal particle encapsulating paste material is sold containing a high boiling point solvent, and this greatly affects the average thickness of the end of the film-like fired material after printing and drying, the sinterable metal particle encapsulating paste material These components are described including these. Similarly, in consideration of the fact that the amount of the solvent component in the binder component greatly affects the average thickness of the end of the film-like fired material after printing and drying, the mass part including the solvent component is expressed.

  Hereinafter, a liquid material for screen printing or coating is referred to as a “firing material composition”, and a dried product after printing or coating is referred to as a “film-like calcining material”. Further, evaporation of butyl carbitol described in Examples and Comparative Examples is referred to as “drying”, and the form of the fired material changes from a liquid to a film during the drying.

<Manufacture of the film-like baking material of an Example>
On one side of the release film 31 (SP-PET 382150 manufactured by Lintec Corporation, thickness 38 μm), the fired material composition obtained above was screen-printed using a circular mesh plate having a diameter of 15 cm and a metal squeegee, and 150 ° C. for 10 minutes. By drying and attaching a release film 30 (thickness 38 μm, SP-PET 381031, manufactured by Lintec Corporation) having an area sufficiently larger than a circle having a diameter of 15 cm on the surface opposite to the release film 31, one side is attached to the release film 31. A film-like fired material 1 having a thickness shown in Table 1 which was protected and the opposite surface was protected by a release film 30 was obtained.

<Manufacture of film-like fired material with support sheet of Example>
As a support sheet in which the release film 30 of the film-like fired material obtained above is peeled off and a 10 μm-thick adhesive layer is laminated on a 70 μm-thick base film on the surface where the film-like fired material is exposed The dicing sheet Adwill G-11 (manufactured by Lintec Co., Ltd.) was attached to the adhesive layer surface and laminated. Thereby, the film-like fired material with support sheet 100c in which the circular film-like fired material and the release film 31 having a sufficiently large area are laminated on the dicing sheet (support sheet 2) having the adhesive layer on the base film. Obtained.

<Production of film-like fired material of comparative example>
The fired material composition obtained above is applied to one side of a release film 31 (SP-PET 382150, Lintec Corporation, thickness 38 μm), dried at 150 ° C. for 10 minutes, and the release film 31 is opposite to the release film 31. By sticking 30, a film-like fired material 1 having a thickness shown in Table 1 with both surfaces protected by release films 30 and 31 was obtained.

<Manufacture of film-like fired material with support sheet of comparative example>
The release film 30 of the film-like fired material obtained above is peeled off, and the release film 31 is sufficiently cut using a circular blade having a diameter of 15 cm from the surface where the film-like fired material is exposed. A 15 cm diameter circular film shape in which a release film 31 having an area sufficiently larger than the diameter of 15 cm is laminated by making a cut of 3 μm or more in the thickness direction and peeling off the film-like fired material other than the circular portion. A fired material was obtained. On the other hand, it stuck and laminated | stacked on the adhesive layer surface of the dicing sheet Adwill G-11 by which an adhesive layer was laminated | stacked on a base film. With this, with a support sheet in which a dicing sheet (support sheet 2) having a pressure-sensitive adhesive layer on a base film is laminated with a circular film-like fired material and a release film 31 having a cut in the same shape as the film-like fired material. A film-like fired material 100d was obtained.

<Evaluation method for peelable film release material>
From the production of the film-like fired material 100c, 100d with support sheet, the release film 31 laminated on the surface opposite to the dicing sheet (support sheet 2) of the film-like fired material with support sheet 100c, 100d obtained above. After elapse of more than a day, the release film 31 on the surface is peeled off, and the presence or absence of peeling at the interface between the film-like fired material 1 and the adhesive layer of the dicing sheet (support sheet 2) and the presence or absence of damage to the film-like fired material 1 are checked. It was confirmed visually.

(Measurement of thickness)
According to JIS K7130, it measured using the constant-pressure thickness measuring device (The product name "PG-02" by the teclock company).

  Each configuration in each embodiment, a combination thereof, and the like are examples, and the addition, omission, replacement, and other changes of the configuration can be made without departing from the spirit of the present invention. Further, the present invention is not limited by each embodiment, and is limited only by the scope of the claims.

  DESCRIPTION OF SYMBOLS 1, 1a, 1b ... Film-like baking material, 1c ... Baking material, 2 ... Support sheet, 3 ... Base film, 4 ... Adhesive layer, 5 ... Ring frame, 10, 11 ... Sinterable metal particle, 20, 21 ... Binder component, 30, 31 ... Release film, A, A '... End, B ... Part excluding end A, B' ... Part excluding end A ', 100a, 100b, 100c, 100d ... Firing material with support sheet, I ... cut

Claims (3)

A film-like fired material containing a sinterable metal particle and a binder component, a support sheet temporarily attached to one side of the film-like fired material so as to be peelable, a release film provided on the other side, A film-like fired material with a support sheet,
The support sheet is one in which an adhesive layer is provided on the entire surface or the outer peripheral portion of the base film,
The average thickness of the end of the film-like fired material is thicker than the average thickness of the portion excluding the end of the film-like fired material,
The release film has a larger area than the film-like fired material,
A film-like fired material with a support sheet, wherein the release film in contact with the end of the film-like fired material is not cut. A film-like fired material containing a sinterable metal particle and a binder component, a support sheet temporarily attached to one side of the film-like fired material so as to be peelable, a release film provided on the other side, A film-like fired material with a support sheet,
The support sheet is one in which an adhesive layer is provided on the entire surface or the outer peripheral portion of the base film,
The average thickness of the end of the film-like fired material is thinner than the average thickness of the portion excluding the end of the film-like fired material,
The release film has a larger area than the film-like fired material,
A film-like fired material with a support sheet, wherein the release film in contact with the end of the film-like fired material is not cut. A composition containing sinterable metal particles and a binder component is printed on a release film to obtain a film-like fired material, and then the film-like fired material laminated with the release film is placed on a base film. A method for producing a film-like fired material with a support sheet, comprising a step of detachably attaching to a support sheet provided with an adhesive layer on the entire surface or the outer periphery .

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