TWI605749B - Electromagnetic interference shielding film - Google Patents

Description

Electromagnetic interference shielding film

The invention relates to an electromagnetic interference shielding film, and particularly relates to a thinning type electromagnetic interference shielding film, which has better electromagnetic wave shielding effect, more high thermal conductivity and high ductility.

Printed circuit board (PCB) is an indispensable material in electronic products and is widely used in computers and peripherals, communication products and consumer electronics. As the demand for various electronic products continues to grow, so does the demand for printed circuit boards. In the case of flexible circuit boards, with the replacement of portable devices such as notebook personal computers or mobile phones, the shielding requirements for electromagnetic waves are becoming higher and higher.

In general, in order to shield electromagnetic waves, in the prior art, an electromagnetic interference (EMI) shielding layer is mostly manufactured by using a resin as a main body and adding metal particles. However, in the above process, if a metal particle having a large particle diameter is used to secure an electromagnetic wave shielding effect, the formed electromagnetic wave shielding layer is made to have an excessive thickness. Alternatively, if a metal particle having a small particle diameter is used to obtain a thickness of a thin electromagnetic wave shielding layer, the formed electromagnetic wave shielding layer has a poor electromagnetic wave shielding effect. Therefore, how to improve the above problems to meet the requirements of the current industry is a problem that technicians in the field are currently trying to solve.

The invention relates to an electromagnetic interference shielding film, and particularly relates to a thinning type electromagnetic interference shielding film, which has better electromagnetic wave shielding effect, more high thermal conductivity and high ductility.

The invention provides an electromagnetic interference shielding film comprising an insulating layer and a conductive layer. The insulating layer has a first surface and a second surface opposite to each other, wherein the insulating layer is composed of a first resin and graphene distributed in the first resin. The conductive layer is disposed on the first surface of the insulating layer.

In one embodiment of the invention, the insulating layer has a thickness of between about 5 microns and 100 microns.

In one embodiment of the invention, the insulating layer has 50% by weight to 90% by weight of the first resin and 10% by weight to 50% by weight of graphene.

In one embodiment of the invention, the first resin comprises a polyurethane resin, an epoxy resin, an acrylic resin, a polyimide resin, a polyethylene terephthalate resin, or a combination thereof.

In one embodiment of the invention, the conductive layer has a thickness of between about 10 microns and 100 microns.

In one embodiment of the invention, the conductive layer is composed of the second resin and the plurality of conductive particles, and the plurality of conductive particles are distributed in the second resin and connected to each other.

In one embodiment of the invention, the conductive particles comprise gold, silver, copper, aluminum, nickel, iron or tin metal particles, copper or aluminum metal particles coated with silver, and the surface is coated with gold, silver, copper, a resin particle or glass particle of aluminum, nickel, iron or tin, and the second resin comprises a polyurethane resin, an epoxy resin, an acrylic resin, a polyimide resin, a polyethylene terephthalate resin or combination.

In one embodiment of the invention, the conductive layer has 50% by weight to 90% by weight of the second resin and 10% by weight to 50% by weight of the plurality of conductive particles.

In one embodiment of the present invention, wherein the conductive layer further comprises graphene, and the plurality of conductive particles and graphene are distributed in the second resin and connected to each other, wherein the conductive layer has 50% by weight to 80% by weight of the second resin 10% by weight to 20% by weight of the plurality of conductive particles and 10% by weight to 30% by weight of graphene.

In an embodiment of the invention, the electromagnetic interference shielding film further includes a first release layer and a second release layer, the first release layer being located on the second surface of the insulation layer, wherein the thickness of the first release layer is about Between 25 microns and 125 microns, and the second release layer is on the first surface of the insulating layer, wherein the conductive layer is between the insulating layer and the second release layer, and the thickness of the second release layer is about 25 microns Up to 125 microns.

Based on the above, since the insulating layer in the electromagnetic interference shielding film of the present invention is composed of the first resin and graphene, the electromagnetic interference shielding film can improve the electromagnetic wave shielding effect in addition to the better thermal conductivity and ductility. Further, even if the overall thickness of the electromagnetic interference shielding film of the present invention is thinned, the electromagnetic interference shielding film of the present invention can exhibit a good electromagnetic wave shielding effect, thermal conductivity, and ductility. Further, by adding graphene to the conductive layer of the electromagnetic interference shielding film of the present invention, the electromagnetic wave shielding effect is further improved.

The above described features and advantages of the present invention will be more apparent from the following description.

In the present specification, the range represented by "a value to another value" is a schematic representation that avoids enumerating all the values in the range in the specification. Therefore, the recitation of a particular range of values is intended to include any value in the range of values and the range of values defined by any value in the range of values, as in the specification. The scope is the same.

1 is a schematic cross-sectional view showing an electromagnetic interference shielding film according to an embodiment of the present invention. Referring to FIG. 1, the electromagnetic interference shielding film 10A of the present invention includes an insulating layer 110 and a conductive layer 120. As shown in FIG. 1, the insulating layer 110 has a first surface S1 and a second surface S2 opposed to each other, and the insulating layer 110 is composed of a first resin and graphene distributed in the first resin. In one embodiment, the first resin comprises from about 50% to about 90% by weight of the insulating layer 110, and the graphene comprises from about 10% to about 50% by weight of the insulating layer 110. In one embodiment, the material of the first resin includes a polyurethane (PU) resin, an epoxy resin, an acrylic resin, a polyimide (PI) resin, and a poly pair. Polyethylene terephthalate (PET) resin or a combination thereof. In one embodiment, the graphene is, for example, in the form of a granule, a sheet, a powder, or a combination thereof. In an embodiment, the thickness of the insulating layer 110 is, for example, 5 micrometers (μm) to 100 micrometers.

Referring to FIG. 1 , the conductive layer 120 is disposed on the first surface S1 of the insulating layer 110 , wherein the conductive layer 120 is composed of a second resin and a plurality of conductive particles, and the plurality of conductive particles are distributed in the second resin and mutually connection. In one embodiment, the second resin comprises about 50% to 90% by weight of the conductive layer 120, and the plurality of conductive particles comprise about 10% to 50% by weight of the conductive layer 120. In one embodiment, the second resin comprises a polyurethane resin, an epoxy resin, an acrylic resin, a polyimide resin, a polyethylene terephthalate resin, or a combination thereof. In one embodiment, the material of the second resin is, for example, the same as that of the first resin, but the invention is not limited thereto. In another embodiment, the material of the second resin is different from the material of the first resin. In one embodiment, the conductive particles comprise gold, silver, copper, aluminum, nickel, iron or tin metal particles, copper or aluminum metal particles coated with silver, and the surface is coated with gold, silver, copper, aluminum, nickel. Resin particles or glass particles of iron or tin. In an embodiment, the thickness of the conductive layer 120 is, for example, 10 micrometers to 100 micrometers.

Based on the above, since the insulating layer in the electromagnetic interference shielding film of the present invention is composed of the first resin and graphene, the electromagnetic interference shielding film can improve the electromagnetic wave shielding effect in addition to the better thermal conductivity and ductility.

2 is a schematic cross-sectional view showing an electromagnetic interference shielding film according to another embodiment of the present invention. The electromagnetic interference shielding film 10B of the present embodiment is similar to the above-described electromagnetic interference shielding film 10A of FIG. 1, and therefore the same or similar elements are denoted by the same or similar symbols, and the description thereof will not be repeated. Specifically, the main difference between the electromagnetic interference shielding film 10B and the electromagnetic interference shielding film 10A is that the electromagnetic interference shielding film 10B further includes a first release layer 130 and a second release layer 140.

As shown in FIG. 2, the first release layer 130 is located on the second surface S2 of the insulation layer 110, and the second release layer 140 is located on the first surface S1 of the insulation layer 110, wherein the conductive layer 120 is located on the insulation layer 110. Between the second release layers 140. In other words, the insulating layer 110 is located between the conductive layer 120 and the first release layer 130. In one embodiment, the material of the first release layer 130 and the material of the second release layer 140 include polyethylene terephthalate (PET), polyethylene (PE), polypropylene (polypropylene, PP). ). In an embodiment, the material of the first release layer 130 and the material of the second release layer 140 may be the same or different, and the invention is not limited thereto. In one embodiment, the first release layer 130 has a thickness between about 25 microns and 125 microns, and the second release layer 140 has a thickness between about 25 microns and 125 microns. In an embodiment, the first release layer 130 may serve as a carrier of the electromagnetic interference shielding film 10B, and the second release layer 140 may serve as a protective layer of the electromagnetic interference shielding film 10B, but the invention is not limited thereto. The first release layer 130 and the second release layer 140 can be easily peeled off from the insulating layer 110 and the conductive layer 120, thereby transmitting the electromagnetic interference shielding film through the first release layer 130 and the second release layer 140. 10B can be stored more easily and is less susceptible to damage by external forces.

3 is a schematic cross-sectional view showing an electromagnetic interference shielding film according to another embodiment of the present invention. The electromagnetic interference shielding film 20A of the present embodiment is similar to the electromagnetic interference shielding film 10A of the above-described FIG. 1, and therefore the same or similar elements are denoted by the same or similar symbols, and the description thereof will not be repeated. Referring to Fig. 3, the main difference between the electromagnetic interference shielding film 20A and the electromagnetic interference shielding film 10A is that the electromagnetic interference shielding film 20A replaces the conductive layer 120 of the electromagnetic interference shielding film 10A with the conductive layer 120'.

Specifically, as shown in FIG. 3, the conductive layer 120' of the electromagnetic interference shielding film 20A further includes graphene in which a plurality of conductive particles and graphene are distributed in the second resin and connected to each other. In one embodiment, the second resin accounts for about 50% to 80% by weight of the conductive layer 120', the plurality of conductive particles accounts for about 10% to 20% by weight of the conductive layer 120', and the graphene accounts for conductive The weight percentage of layer 120' is about 10% to 30%. In one embodiment, the graphene is, for example, in the form of a granule, a sheet, a powder, or a combination thereof. As described above, since the insulating layer in the electromagnetic interference shielding film of the present invention is composed of the first resin and graphene, the electromagnetic interference shielding film can improve the electromagnetic wave shielding effect in addition to the better thermal conductivity and ductility. Further, by adding graphene to the conductive layer of the electromagnetic interference shielding film of the present invention, the electromagnetic wave shielding effect is further improved.

4 is a schematic cross-sectional view showing an electromagnetic interference shielding film according to another embodiment of the present invention. The electromagnetic interference shielding film 20B of the present embodiment is similar to the above-described electromagnetic interference shielding film 20A of FIG. 3, and therefore the same or similar elements are denoted by the same or similar symbols, and the description thereof will not be repeated. Referring to FIG. 4 , the main difference between the electromagnetic interference shielding film 20B and the electromagnetic interference shielding film 20A is that the electromagnetic interference shielding film 20B further includes a first release layer 130 and a second release layer 140 .

As shown in FIG. 4, the first release layer 130 is on the second surface S2 of the insulating layer 110, and the second release layer 140 is on the first surface S1 of the insulating layer 110. The conductive layer 120' is located between the insulating layer 110 and the second release layer 140, and the insulating layer 110 is located between the conductive layer 120' and the first release layer 130. In one embodiment, the first release layer 130 has a thickness between about 25 microns and 125 microns, and the second release layer 140 has a thickness between about 25 microns and 125 microns. In an embodiment, the first release layer 130 may serve as a carrier of the electromagnetic interference shielding film 20B, and the second release layer 140 may serve as a protective layer of the electromagnetic interference shielding film 20B, but the invention is not limited thereto. The first release layer 130 and the second release layer 140 can be easily peeled off from the insulating layer 110 and the conductive layer 120 ′, thus passing through the first release layer 130 and the second release layer 140 , and the electromagnetic interference shielding film 20B It can be stored more easily and is not easily damaged by external forces.

Hereinafter, a method of producing the electromagnetic interference shielding film of the present invention will be described in detail. 5A to 5C are schematic cross-sectional views showing a flow of a method of fabricating an electromagnetic interference shielding film according to an embodiment of the present invention.

First, referring to FIG. 5A, a first release layer 130 is provided, and an insulating layer 110 is coated over the first release layer 130. As shown in FIG. 5A, the insulating layer 110 has a first surface S1 and a second surface S2 opposite to each other, wherein the insulating layer 110 is adhered to the first release layer 130 through the second surface S2. Specifically, in one embodiment, the first resin and the graphene are first mixed to form an insulating material; and an insulating material is coated on the first release layer 130 to form an insulation by a coating process. Layer 110. In an embodiment, the thickness of the insulating layer 110 is, for example, 5 micrometers to 100 micrometers. In one embodiment, the first release layer 130 has a thickness of between about 25 microns and 125 microns.

In one embodiment, the first resin comprises from about 50% to about 90% by weight of the insulating layer 110, and the graphene comprises from about 10% to about 50% by weight of the insulating layer 110. In one embodiment, the material of the first resin includes a polyurethane resin, an epoxy resin, an acrylic resin, a polyimide resin, a polyethylene terephthalate resin, or a combination thereof. In one embodiment, the graphene has, for example, in the form of particles, flakes, powders, or a combination thereof. The coating process includes roll coating, blade coating, slide coating, slot-die or bar coating. cloth.

Referring to FIG. 5B, a conductive layer 120 is formed on the insulating layer 110. As shown in FIG. 5B, the insulating layer 110 is bonded to the first release layer 130 through the first surface S1. Specifically, in one embodiment, the second resin and the plurality of conductive particles are first mixed to form a conductive material; and the conductive material is coated on the first surface S1 of the insulating layer 110 by a coating process. The conductive layer 120 (ie, the conductive layer 120 shown in FIGS. 1 and 2), wherein the plurality of conductive particles in the insulating layer 110 are uniformly distributed in the second resin and connected to each other, but the present invention does not limit. In addition, in other embodiments, the second resin, the plurality of conductive particles, and the graphene may be mixed, and the plurality of conductive particles and the graphene are uniformly mixed to form a conductive material; and the conductive material is further coated by a coating process. Coated on the first surface S1 of the insulating layer 110 to form a conductive layer 120', wherein the conductive layer 120' (ie, the conductive layer 120' shown in FIG. 3 and FIG. 4) and a plurality of conductive particles and graphite The olefins are uniformly distributed in the second resin and connected to each other. In one embodiment, the graphene has, for example, in the form of particles, flakes, powders, or a combination thereof. In an embodiment, the thickness of the conductive layer 120 is, for example, 10 micrometers to 100 micrometers.

In one embodiment, the second resin comprises about 50% to 90% by weight of the conductive layer 120, and the plurality of conductive particles comprise about 10% to 50% by weight of the conductive layer 120. In one embodiment, the second resin comprises a polyurethane resin, an epoxy resin, an acrylic resin, a polyimide resin, a polyethylene terephthalate resin, or a combination thereof. In one embodiment, the conductive particles comprise gold, silver, copper, aluminum, nickel, iron or tin metal particles, copper or aluminum metal particles coated with silver, and the surface is coated with gold, silver, copper, aluminum, nickel. Resin particles or glass particles of iron or tin. In one embodiment, the coating process includes roll coating, doctor blade coating, slant coating, extrusion coating or wire bar coating.

Referring to FIG. 5C, finally, a second release layer 140 is provided, and the stack of the first release layer 130, the insulating layer 110, and the conductive layer 120 (shown in FIG. 5B) is flipped over and then pressed. Above the two release layer 140, an electromagnetic interference shielding film having a stacking order of the first release layer 130, the insulation layer 110, the conductive layer 120, and the second release layer 140 is formed. Up to this step, the electromagnetic interference shielding film of the present invention has been completed.

However, in other embodiments, the electromagnetic interference shielding film of the present invention may be formed by sequentially coating the conductive layer 120 and the insulating layer 110 on the second release layer 140, and then pressing the first release layer. Above the 130, an electromagnetic interference shielding film having a stacking order of the second release layer 140, the conductive layer 120, the insulating layer 110, and the first release layer 130 is formed, and the invention is not limited thereto.

Hereinafter, Examples 1 to 4 and Comparative Examples including the electromagnetic interference shielding film of the present invention will be described.

Table 1 shows the composition and amount of the insulating layer and the conductive layer in the electromagnetic interference shielding film. Table 1 <TABLE border="1"borderColor="#000000"width="85%"><TBODY><tr><td><b>ingredient</b></td><td><b>sample</b><b>1</b></td><td><b>sample</b><b>2</b></td><td><b>sample</b><b>3</b></td><td><b>Sample</b><b>4</b></td><td><b>Sample</b><b>5</b></td></tr><tr><td> Insulation Material</td><td> First Resin</td><td> Epoxy Resin 90 wt% </td><td> Epoxy resin 50 wt% </td><td> epoxy resin 90 wt% </td><td> epoxy resin 90 wt% </td><td> epoxy resin 100 wt% </td></tr><tr><td>Graphene</td><td> 10 wt% </td><td> 50 wt% </td><td> 10 wt% </td><td> 10 wt % </td><td> 0 wt% </td></tr><tr><td> Conductive Material</td><td> Second Resin</td><td> Epoxy Resin 85 wt% </td><td> Epoxy resin 85 wt% </td><td> Epoxy resin 70 wt% </td><td> Epoxy resin 70 wt% </td><td> Epoxy resin 80 Wt% </td></tr><tr><td> Conductive particles ¹</td><td> 15 wt% </td><td> 15 wt% </td><td> 15 wt% </td><td> 15 wt% </td><td> 20 wt% </td></tr><tr><td>Graphene</td><td> 0 Wt% </td><td> 0 wt% </td><td> 15 wt% </td><td> 15 wt% </td><td> 0 wt% </td></tr></TBODY></TABLE>1: a mixture of silver metal particles and copper metal particles, the weight ratio of silver metal particles to copper metal particles is 2:1. < Example >

Please refer to the structure and manufacturing method of the electromagnetic interference shielding film. Features of the present invention will be described more specifically below with reference to Examples 1-4. Although the following Examples 1-4 are described, the materials used, the film thickness, the processing details, the processing flow, and the like can be appropriately changed without exceeding the scope of the present invention. Therefore, the invention should not be construed restrictively by the examples described below. < Example 1>

The insulating material of the sample 1 in Table 1 was applied to a PET film having a film thickness of about 50 μm as a carrier at room temperature by a roll coating method to form an insulating layer. The conductive material of the sample 1 in Table 1 was applied to the insulating layer to form a conductive layer. Next, the laminate having the PET film, the insulating layer and the conductive layer described above is inverted, and then the conductive film is laminated to a PET film having a film thickness of about 75 μm as a protective layer to complete the electromagnetic interference of the present invention. Shielding film. The insulating layer has a thickness of about 5 microns and the conductive layer has a thickness of about 10 microns. < Example 2 to Example 4 >

The electromagnetic interference shielding films of Examples 2 to 4 were prepared in the same manner as in Example 1. However, the difference is that the second embodiment, the third embodiment and the fourth embodiment are respectively formed of the insulating material and the conductive material of the sample 2, the sample 3 and the sample 4 in Table 1, and the conductive layer, wherein the phase The film thicknesses of the insulating layer and the conductive layer of Example 3 and Example 4 were also changed as compared with Example 1. < Comparative example >

The structure of the electromagnetic interference shielding film of the comparative example is similar to the structure of the electromagnetic interference shielding film illustrated in FIG. 3 or FIG. However, in the electromagnetic interference shielding film of the comparative example, there is an additional adhesive layer between the insulating layer and the conductive layer, and the comparative example is an insulating material and a conductive material of the sample 5 in Table 1 to form an insulating layer and a conductive layer. . The preparation of the comparative examples is as follows.

Specifically, the insulating material of the sample 5 in Table 1 is applied to the PET film having a film thickness of about 50 μm as a carrier to form an insulating layer at room temperature by using a roll coating method, and then insulated. An adhesive layer is applied to the surface of the layer. Next, the conductive material of the sample 1 in Table 1 was applied to the insulating layer to form a conductive layer to adhere the insulating layer and the conductive layer through the adhesive layer. Next, the above-mentioned laminate having a PET film, an insulating layer, an adhesive layer, and a conductive layer was inverted, and then electrically laminated to a PET film having a film thickness of about 75 μm as a protective layer, and the comparative example was completed. Electromagnetic interference shielding film. The insulating layer has a thickness of about 7 μm, the adhesive layer has a thickness of about 5 μm, and the conductive layer has a thickness of about 10 μm.

Table 2 shows the material layers and film thicknesses of the respective layers of the electromagnetic interference shielding films in Examples 1-4 and Comparative Examples. Table 2 <TABLE border="1"borderColor="#000000"width="85%"><TBODY><tr><td></td><td><b>Example</b><b>1</b></td><td><b>Examples</b><b>2</b></td><td><b>Examples</b><b>3</b></td><td><b>Examples</b><b>4</b></td><td><b>ComparativeExamples</b></td></tr><tr><td><b>Carrier</b></td><td> Material </td><td> PET </td><td> PET </td><td> PET </td ><td> PET </td><td> PET </td></tr><tr><td> film thickness</td><td> 50μm </td><td> 50μm </td><Td> 50μm </td><td> 50μm </td><td> 50μm </td></tr><tr><td><b>insulation layer</b></td><td> material </td><td> Sample 1^A</td><td> Sample 2^A</td><td> Sample 3<sup>A</sup ></td><td> Sample 4^A</td><td> Sample 5^A</td></tr><tr><td> Membrane Thickness </td><td> 5μm </td><td> 5μm </td><td> 5μm </td><td> 100μm </td><td> 7μm </td></tr><Tr><td><b>Adhesivelayer</b></td><td>Material</td><td></td><td></td><td></td><td></td><td> epoxy adhesive</td></tr><tr><td> film thickness</td><td></td><td></td><td></Td><td></td><td> 5μm </td></tr><tr><td><b>conductive layer</b></td><td> material </td><td > Sample 1^B</td><td> Sample 2^B</td><td> Sample 3^B</td><td > Sample 4^B</td><td> Sample 5^B</td></tr><tr><td> Film thickness</td><td > 10μm </td><td> 10μm </td><td> 100μm </td><td> 10μm </td><td> 10μm </td></tr><tr><td><b >Protective layer</b></td><td> Material </td><td> PET </td><td> PET </td><td> PET </td><td> PET </td ><td> PET </td></tr><tr><td> film thickness</td><td> 75μm </td><td> 75μm </td><td> 75μm </td><Td> 75 μm </td><td> 75 μm </td></tr></TBODY></TABLE> A: Please refer to the insulating material in Table 1. B: Please refer to the conductive materials in Table 1.

Table 3 shows the evaluation results of the electromagnetic interference shielding films of Examples 1-4 and Comparative Examples. Specifically, the carrier and the protective layer in the electromagnetic interference shielding film of the embodiment 1-4 and the comparative example are respectively peeled off from the surface of the insulating layer and the conductive layer, and then cut into test samples having a uniform length and width; Next, thermal conductivity and ductility were performed on the respective test samples with the same test condition parameters (using an extension tester, the device name was IPC TM 650 2.4.18) and electromagnetic interference shielding effect (using a test machine, the device name was ASTM D4935- 89) For other tests, please refer to Table 3 below for test results. Table 3 <TABLE border="1"borderColor="#000000"width="85%"><TBODY><tr><td></td><td><b>Example</b></td><td><b>Comparativeexample</b></td></tr><tr><td><b>1</b></td><td><b>2</b></td><td><b>3</b></td><td><b>4</b></td></tr><tr><td><b>thermalconductivity</b><b>(W(m*k))</b></td><td> 1.5 </td><td> 2.1 </td><td> 5.0 </td><td> 3.0 </td><td> 0.86 </td></tr><tr><td><b>Extensibility</b><b>(%)</b></td><td> 70 </td><td> 75 </td><td> 80 </td><td> 85 </td><td> 51 </td></tr><tr><td><b>electromagnetic interference Shading effect</b><b>²</b><b>(dB)</b></td><td> 61 </td><td> 63 </td ><td> 70 </td><td> 65 </td><td> 50 </td></tr></TBODY></TABLE>

As is clear from the results of Table 3, the insulating layer in the electromagnetic interference shielding film of Examples 1-4 uses graphene, which not only improves the thermal conductivity and ductility of the electromagnetic interference shielding film of the present invention, but also improves the electromagnetic wave shielding effect. . Further, even if the overall thickness of the electromagnetic interference shielding film of Example 1-2 is thinned, it still has a good performance in terms of thermal conductivity, ductility, and electromagnetic wave shielding effect. Specifically, the electromagnetic wave shielding effect of the thinned electromagnetic interference shielding film of the present invention (i.e., the thickness of the insulating layer and the conductive layer and about 15 μm or less) is at least 60 dB.

Further, in the embodiment 3-4, the conductive layer in the electromagnetic interference shielding film is made of graphene, and the thermal conductivity, the ductility and the electromagnetic wave shielding effect of the electromagnetic interference shielding film of the present invention can be further enhanced. More specifically, as shown in Table 3, the electromagnetic wave shielding effect of the electromagnetic interference shielding film of the present invention is about 60 dB to 70 dB. In other words, compared with the comparative example, the electromagnetic interference shielding film of Examples 1-4 has a good performance in terms of thermal conductivity, ductility, and electromagnetic wave shielding effect.

In summary, since the insulating layer in the electromagnetic interference shielding film of the present invention is composed of the first resin and the graphene, the electromagnetic interference shielding film can improve the electromagnetic wave shielding effect in addition to the better thermal conductivity and ductility. . Further, the overall thickness of the electromagnetic interference shielding film of the present invention is thinned, and the electromagnetic interference shielding film of the present invention still exhibits a good electromagnetic wave shielding effect, thermal conductivity, and ductility. Further, by adding graphene to the conductive layer of the electromagnetic interference shielding film of the present invention, the electromagnetic wave shielding effect can be further improved.

The present invention has been disclosed in the above embodiments, but it is not intended to limit the invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

10A, 10B, 20A, 20B‧‧‧ electromagnetic interference shielding film

110‧‧‧Insulation

120, 120'‧‧‧ conductive layer

130‧‧‧First release layer

140‧‧‧Second release layer

S1‧‧‧ first surface

S2‧‧‧ second surface

1 is a schematic cross-sectional view showing an electromagnetic interference shielding film according to an embodiment of the present invention. 2 is a schematic cross-sectional view showing an electromagnetic interference shielding film according to another embodiment of the present invention. 3 is a schematic cross-sectional view showing an electromagnetic interference shielding film according to another embodiment of the present invention. 4 is a schematic cross-sectional view showing an electromagnetic interference shielding film according to another embodiment of the present invention. 5A to 5C are schematic views showing a flow of a method of fabricating an electromagnetic interference shielding film according to an embodiment of the present invention.

10A‧‧‧Electromagnetic interference shielding film

110‧‧‧Insulation

120‧‧‧ Conductive layer

S1‧‧‧ first surface

S2‧‧‧ second surface

Claims (10)

An electromagnetic interference shielding film comprising: an insulating layer having first and second surfaces opposite to each other, wherein the insulating layer is composed of a first resin and graphene distributed in the first resin; and a conductive layer Provided on the first surface of the insulating layer, wherein the conductive layer is composed of a second resin, a plurality of conductive particles, and graphene, and the plurality of conductive particles and the graphene are distributed in the In the second resin and connected to each other, wherein the conductive layer has 50% by weight to 80% by weight of the second resin, 10% by weight to 20% by weight of the plurality of conductive particles, and 10% by weight to 30% by weight Percent of the graphene. The electromagnetic interference shielding film according to claim 1, wherein the insulating layer has a thickness of about 5 to 100 μm. The electromagnetic interference shielding film according to claim 1, wherein the insulating layer has 50% by weight to 90% by weight of the first resin and 10% by weight to 50% by weight of the graphene. The electromagnetic interference shielding film according to claim 1, wherein the first resin comprises a polyurethane resin, an epoxy resin, an acrylic resin, a polyimide resin, and polyethylene terephthalate. Resin or a combination thereof. The electromagnetic interference shielding film according to claim 1, wherein the conductive layer has a thickness of about 10 μm to 100 μm. The electromagnetic interference shielding film according to claim 1, wherein the plurality of conductive particles are distributed in the second resin and connected to each other. The electromagnetic interference shielding film according to claim 6, wherein the conductive particles comprise gold, silver, copper, aluminum, nickel, iron or tin metal particles, copper or aluminum metal particles coated with silver, surface a resin particle or glass particle coated with gold, silver, copper, aluminum, nickel, iron or tin, and the second resin comprises a polyurethane resin, an epoxy resin, an acrylic resin, a polyimide resin, Polyethylene terephthalate resin or a combination thereof. The electromagnetic interference shielding film according to claim 1, wherein the electromagnetic interference shielding film has an electromagnetic wave shielding effect of about 60 dB to 70 dB. The electromagnetic interference shielding film according to claim 1, wherein a sum of a thickness of the insulating layer and a thickness of the conductive layer is equal to or smaller than 15 μm. The electromagnetic interference shielding film according to claim 1, further comprising: a first release layer on the second surface of the insulating layer, wherein a thickness of the first release layer is approximately 25 microns to 125 microns; and a second release layer on the first surface of the insulating layer, wherein the conductive layer is between the insulating layer and the second release layer, the The thickness of the two release layers is between about 25 microns and 125 microns.