TWI360386B - Electro-magnetic wave shielding adhesive sheet, pr - Google Patents

Electro-magnetic wave shielding adhesive sheet, pr Download PDF

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Publication number
TWI360386B
TWI360386B TW095105378A TW95105378A TWI360386B TW I360386 B TWI360386 B TW I360386B TW 095105378 A TW095105378 A TW 095105378A TW 95105378 A TW95105378 A TW 95105378A TW I360386 B TWI360386 B TW I360386B
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TW
Taiwan
Prior art keywords
film
layer
resin
acid
compound
Prior art date
Application number
TW095105378A
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Chinese (zh)
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TW200706106A (en
Inventor
Hidenobu Kobayashi
Yuji Nishiyama
Akifumi Kuwabara
Takahiro Matsuzawa
Mitsuo Umezawa
Shouhei Sakai
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Toyo Ink Mfg Co
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Publication of TW200706106A publication Critical patent/TW200706106A/en
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Publication of TWI360386B publication Critical patent/TWI360386B/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
    • C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
    • C08G18/0823—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
    • C08G18/4045—Mixtures of compounds of group C08G18/58 with other macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/6541—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen the low-molecular compounds being compounds of group C08G18/34
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/554—Wear resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C09J2463/006—Presence of epoxy resin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)

Description

丄：>OUJ8〇 •九、發明說明： .月所屬之技術領域】 體關於防電磁波性黏接膜及其製造方法、暨黏附 1¾至:二/遮蔽方法。本發明之防電磁波性黏接膜為於貼 路所發撓性印刷佈線板等’且遮蔽由電性電 土·磁雜訊之用途中可適於使用。 【先前技術】 • 0A可上性印刷佈線板由於具有f曲性，故符合近年來之 型化之信機器、行動電話等之更加高性能化、及小 裝入電4路且狹窄之複雜構造所構成的框體内部 包路’故夕被使用。隨著如此電子電路的 頻；r對於由此發生之不必要電磁雜訊的對策曰 避蔽；自以往進行對於可撓性印刷佈線板，貼黏 子電路所發生之電磁雜訊的防電磁波性黏接膜。 且防電磁波性黏接膜本身’除了要求防電磁波性， '要求不損害所貼合之可撓性印刷佈線板 優良之耐彎曲性。因此，作為防電磁： '接版，廣泛已知具有於厚度薄之基 所構成的基本構造者。 &置蛉电層 作為先前之防電磁纽黏接膜，已知為於保護膜 之遮劑層及視需要之金屬薄膜層所構成 ’、、、敝層’且於另—表面上依序層合黏接劑層和脫模 強膜所構成的補強遮蔽膜（參照專利文獻u。、 又，已知具有導電性黏接劑層及/或金屬薄膜之遮蔽 326傳利說明書(補件)\95-0S\95丨05378 5 1360386 層、和芳香族聚醯胺樹脂所構成之基底膜的遮蔽膜（參照 專利文獻2)。 又，已知於間隔膜之單面塗佈樹脂形成保護膜，並於前 W保4膜之表面设置以金屬薄膜層和黏接劑層所構成之 遮蔽層的遮蔽性黏接膜（專利文獻3)。 / ;.先4之防電磁波性黏接膜的黏接劑層，使用聚苯乙稀 公：乙酸乙烯酯系、聚酯系、聚乙烯系、聚丙烯系、聚醯 tί :橡膠系、或丙烯酸系等之熱可塑性樹脂、和酚系、 =、絲甲酸乙酷系、蜜胺系、或醇酸系等之熱硬化 :广月曰。但m前的接黏劑層中，並不兼具充分的耐 =曲!生及充刀的_熱性’特別使用於可撓性印刷佈線 途中，對於重複折彎的耐性並不完全。 [專利文獻1]日本專利特開2003-298285號公報 [專利文獻2]日本專利特開2〇〇4—2735n號公報 [專利文獻3]日本專利特開·4_95566號 【發明内容】 (發明·所欲解決之問題） 本發明係以提供且右#八> 捉仏具有充分之防電磁波性，加上呈 :::曲性且可承受無錯焊料迴流時之高溫的耐 使用於貼附至可撓性印刷佈線板 用途的防電磁波性黏接膜為其目的。 “雜戒之 又’本發明係以提供可廉價 ^ ^ 貝且女疋製造具有此類優丄:>OUJ8〇 • Nine, invention description: . The technical field of the month] The body about the electromagnetic wave protective film and its manufacturing method, and adhesion 13⁄4 to: two / shielding method. The electromagnetic wave preventing adhesive film of the present invention is suitable for use in applications in which a flexible printed wiring board or the like is attached and shielded by electrical electric and magnetic noise. [Prior Art] • Since the 0A splicable printed wiring board has f-flexibility, it is more compact and has a higher performance, such as a letter machine and a mobile phone, which have been shaped in recent years, and a complicated structure with a small size and a small size. The inside of the frame that is formed is used in the evening. With the frequency of such an electronic circuit; r, the countermeasure against the unnecessary electromagnetic noise generated thereby avoids the electromagnetic wave resistance of the electromagnetic noise generated in the adhesive printed circuit board. Adhesive film. Further, in addition to the electromagnetic wave resistance, the anti-electromagnetic wave-adhesive film itself is required to have excellent bending resistance without impairing the bonded flexible printed wiring board. Therefore, as an anti-electromagnetic method: a basic structure composed of a base having a small thickness is widely known. & the electrical layer is used as the previous anti-electromagnetic bonding film, which is known to form the ', , and 敝 layer' of the protective film and the optional metal film layer on the other surface. A reinforcing mask film composed of a laminated adhesive layer and a release film (refer to Patent Document U. Further, it is known that a conductive adhesive layer and/or a metal film is shielded 326. \95-0S\95丨05378 5 1360386 A masking film of a base film composed of a layer and an aromatic polyamide resin (see Patent Document 2). Further, it is known that a resin is formed on one side of the spacer film to form a protective film. And a shielding adhesive film which is provided with a shielding layer composed of a metal thin film layer and an adhesive layer on the surface of the front W protective film 4 (Patent Document 3). /; First anti-electromagnetic adhesive film As the adhesive layer, a polystyrene type: a vinyl acetate type, a polyester type, a polyethylene type, a polypropylene type, a poly 醯tί: a rubber type, or an acrylic type thermoplastic resin, and a phenol type, Thermal hardening of succinic acid, melamine, or alkyd: 广月曰. But the adhesive layer before m It does not have sufficient resistance to the songs. The heat of the raw and filled knives is particularly used in the flexible printed wiring, and the resistance to repeated bending is not complete. [Patent Document 1] Japanese Patent Laid-Open 2003- [Patent Document 2] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. 4-2735 No. [Patent Document 3] Japanese Patent Laid-Open No. Hei. And the right #8> has sufficient electromagnetic wave resistance, and is resistant to electromagnetic waves that are attached to flexible printed wiring boards. The adhesive film is the purpose of the "adhesive ring" and the present invention is provided to provide a cheaper ^ ^ shell and the virgin manufacturing has such excellent

-之防電磁波性黏接膜的方法為其目的。 4良H- The method of preventing electromagnetic wave bonding film is for its purpose. 4 good H

更且，本發明係以提供佶 A 使用則述之防電磁波性黏接膜， 326\專利說明書(補件)\9.5-08\95105378 1360386 遮蔽黏附體之電磁波的方法為其目的。 (解決問題之手段） 因此’本發明係關於 黏=基材膜和硬化性導電性黏接劑層⑴的防電磁波性 化導電性黏接劑層⑴為含有令具有«之二醇 =偏之多元醇⑻'和有機二異氰酸 異氛嶋之胺基甲酸乙酷預聚物⑷ (: 高)反應所調製之聚胺基曱酸醋聚服樹脂 具有二個以上環氧基之環氧樹脂（B)、及 導電性充填劑 之防電磁波性黏接膜。 述防電磁波性黏接膜之較佳的實施態樣中，前 樹脂（Α)100重旦& 1曰士 相對於聚胺基甲酸酿聚服 ,#. 里伤，3有環氧樹脂（Β)3〜200重量份，且 對於^安基甲酸„服樹脂⑴與環氧樹脂⑻之 重置伤，含有導電性充填劑10,〇重量份。 加熱、壓黏時發揮充分的緩衝性，且往接地電路上I:; 膜除去部分流入。又，姐由^「 电路上之絕緣 聚脲树知a)t之羧基與環氧樹脂（ -曰 得的導電性硬化黏接劑層π &乳基反應所 叫曰w υ，係對於無鉛焊料迴流亦具 326^νψΐΜΒ^9(ΜίΨ)\95-08\95105378 ? 有可充分承受的耐熱性。更且 為具有優 良的耐彎“ 性硬化點接劑層⑴） 會損害電路基板全脚/黏至可撓性印刷佈線板時’不 双王體的耐彎曲性。 於本發明之防當 令，針、+. I ’性黏接膜之其他較佳的者浐吨掸 γ，刖述基材膜為含 权乜的戶、苑態樣 個以上環氧Α之3ro h 一夂土之4酯樹脂（C)和具有二 cm)。之％㈣脂⑻的硬純膜狀樹脂组成物 基材膜為此類膜狀硬 脂（C)中之幾A、企 、曰、，成物（Πί)時，聚酯樹 麼黏而反應，難因無錯焊料迴流所乳土為，由加熱、 曲，取得且右供肖+ ▲ ° ‘、、、收縮而發生捲 八有k良之耐彎曲性、耐磨損性、 狀硬化樹脂組成物（IV)，且表現出作為防的膜 .之基材的較佳性能。 4防电磁波性黏接膜 二= 之防電磁波性黏接膜之再一較佳的實施態樣 二之聚㈣脂⑹的酸值為5^_々， 數千均刀子量為丨咖屬⑽，玻璃轉移溫度為1G〜5『C。 於士：：：防電磁波性黏接膜之再一較佳的實施態樣 ^則述，有羧基之聚醋樹脂（〇為令二醇（cl)與二元於 、或二兀酸酐（c2)或二元酸之二烷酯（c3)反應所得之含久 羥基之聚酯樹脂（c4)、與分子内具有三個以上 酸或其酐（C5)反應所調製。 土 ^ 此類含有羧基之聚酯樹脂（C)為經由與具有二個以上罈 ^基之環氧樹脂（D)的加熱硬化反應，構築良好的交聯^ 造，難因無鉛焊料迴流所造成之熱收縮而發生捲曲，取得 32&專利說明書(補件)\95-08\95】05378 8Furthermore, the present invention is directed to providing an electromagnetic wave preventing adhesive film as described in the use of 佶 A, 326\Patent Specification (Supplementary)\9.5-08\95105378 1360386 for shielding electromagnetic waves of an adherent body for the purpose thereof. (Means for Solving the Problem) Therefore, the present invention relates to an anti-electromagnetic wave-sensitive conductive adhesive layer (1) for a pressure-based substrate film and a curable conductive adhesive layer (1) which contains a diol having a « Polyol (8)' and organic diisocyanate isocarbohydrate urethane prepolymer (4) (: high) reaction prepared by polyamine phthalic acid vinegar poly resin having two or more epoxy groups Electromagnetic wave protective film of resin (B) and conductive filler. In a preferred embodiment of the electromagnetic wave preventing adhesive film, the front resin (Α) 100 heavy denier & 1 gentleman is compared with the polyaminocarboxylic acid brewing polycoat, #. 里伤, 3 has epoxy resin ( Β) 3 to 200 parts by weight, and for the replacement damage of the resin (1) and the epoxy resin (8), the conductive filler 10 is contained in an amount of 〇, and the cushioning property is sufficient when heated and pressed. And on the grounding circuit, I:; the film removes part of the inflow. In addition, the sister is called "the insulating polyurea tree on the circuit knows a) t of the carboxyl group and the epoxy resin (- 曰 的 conductive hardened adhesive layer π &amp The emulsion-based reaction is called 曰w υ, which is also 326^νψΐΜΒ^9(ΜίΨ)\95-08\95105378 for lead-free solder reflow. It has sufficient heat resistance, and it has excellent bending resistance. The hardened pointant layer (1)) can damage the bending resistance of the non-double body when the circuit board is fully covered/adhered to the flexible printed wiring board. In the anti-declaration of the present invention, the other preferred ones of the needle and the +. I 'adhesive film are 浐 掸 掸 γ, and the substrate film is a product containing the right 、, the 态 epoxy Α 3ro h A tercene 4 ester resin (C) and having two cm). The hard pure film-like resin composition of the (4) fat (8) substrate film is a few of the film-like hard fat (C), A, 曰, 、, ( Πί), the polyester tree is sticky and reacts It is difficult to return to the milk by the error-free solder. It is obtained by heating, bending, and the right supply is + ▲ ° ',, and shrinking, and the bending resistance, wear resistance, and hardening resin composition are formed. (IV), and exhibits preferred properties as a substrate for the film. 4 anti-electromagnetic wave bonding film 2 = anti-electromagnetic wave bonding film, another preferred embodiment of the second poly (four) grease (6) acid value of 5 ^ _ 々, thousands of knives are 丨 丨 (10) , glass transfer temperature is 1G ~ 5 "C. Yu Shi::: A further preferred embodiment of the anti-electromagnetic adhesive film, a carboxylic acid resin having a carboxyl group (〇 is a diol (cl) and a binary or phthalic anhydride (c2) Or a long-hydroxyl-containing polyester resin (c4) obtained by the reaction of a dibasic acid dialkyl ester (c3), which is prepared by reacting with three or more acids or an anhydride (C5) in the molecule. The polyester resin (C) is formed by a heat-hardening reaction with an epoxy resin (D) having two or more bases, and is excellent in cross-linking, which is hard to be curled by heat shrinkage caused by lead-free solder reflow. , obtained 32 & patent specification (supplement) \95-08\95] 05378 8

JOO 具有優良之耐彎曲性、耐磨損性 脂組成物（IV)。 、 σ工性的膜狀硬化樹 較佳的實施態樣 中、,月之防電磁波性黏接膜之再 中：：述基材膜為含有難燃劑⑻。 方；本發明之防带讲a Φ 於 '皮性黏接膜之再一較佳的在# & # 中，於珂述基材膜之未_ 土的，、細悲樣 表面上，透過動 接劑層（I)之 強膜。 *者蜊層、或未透過微黏著劑層，層合補 k由層合此類補強膜 之本發明防電磁 。専且木软者之刼作困難 路基板的I配容易。另外本錢，且對於電 劑芦，An* 另外#強減視需要設置之微黏著 片J增為將防電磁波性读i B替·Λ #两，& π 板等之後，被除去。 可撓性印刷佈線 :二月之防電磁波性黏接膜之再一較佳的實施態樣 則述硬化性導電性黏接劑層⑴上，層合保護膜。 又，本發明亦關於包含 材膜之表面上，透過微黏著劑層層合補強膜的步 驟、及、 於别述基材膜之另一表面上，將含有令具有羧基之二醇 化a物（a )、和含有叛基之二醇化合物以外之數平均分子 夏500〜8000之多元醇⑶）、和有機二異氰酸酯（c)反應所 知·、終端具有異氰酸酯基之胺基曱酸乙酯預聚物（们，與 聚胺基化合物（e)反應所調製之聚胺基曱酸酯聚脲樹脂 (A )、具有一個以上環氧基之環氧樹脂（b )、及導電性充填 9 32<5\專利說明書(補件)\95·08\95〗05378 1360386 ^之硬化性導電性黏接劑層（丨）予以層合之井 波性黏接膜之製造方法。 ^知之防電磁 更且，本發明亦關於包含 劑表面上設置微黏著劑層，並對前述微點著 月J層重$基材膜的步驟、 *有 化：m膜之另一表面上，將含有令具有叛基之二醇 。勿（a)、和含有羧基之二醇化合物以外之 之多元醇⑻、和有機二異氛酸二 2 而具有異氰酸酯基之胺基曱酸乙酯預聚物⑷，盥 =基化合物(e)反應所調製之聚胺基甲酸醋聚脲樹脂 ’具有二個以上環氧基之環氧樹脂⑻、及導電性充填 劑之硬化性導電性黏接劑組成物塗佈’乾燥形成硬化性導 電性黏接劑層（I)的步驟、及 於前述硬化性導電性黏接劑層⑴上重疊保 驟、 / ❿之防電磁波性黏接膜之製造方法。 更且’本發明亦關於包含 於補強膜之一表面上設置微黏著劑層的步驟、 於前述微黏著劑層上重疊基材膜的步驟、 於保護膜之一表面上，將含有令具有羧基之二醇化合物 (a) 和含有叛基^—醇化合物以外之數平均分子量 50 0〜80 00之多几醇（b)、和有機二異氰酸酯（c)反應所得、 終端具有異氰酸酯基之胺基甲酸乙酯預聚物，與聚胺 基化合物（e)反應所調製之聚胺基甲酸酯聚脲樹脂（A)、具 326\專利說明書(補件)\95-08\95!05378 10 f 一個u上環氧基之環氧樹脂（B)、及導電 性導電性黏接劑組成承制之硬 電性，劑層⑴的步驟、A “形成硬化性導 於别述硬化性導電性 ^ ^ ^ ^ ^ ^ 膜的基材膜，m 將層合前述補強 rT. 則述基材膜與前述硬化性導電性翔桩 (ί)接觸般重疊的步驟 电丨站接鈉層 防包磁波性黏接膜之製造方法。 更且，本發明亦關於包含 於補強膜之一表面上， 與具有二個以…甘 羧基之聚醋樹脂(c) 塗 、衣氧基之環氧樹脂（D)的樹脂組成物予以 亚η形成膜狀硬化性樹脂組成物⑴I)層的步驟、 有=膜It性樹脂組成物⑴1)層上，將含有令具 之童二 ' 予σ物（&) '和含有羧基之二醇化合物以外 西= 分子量州〜咖之多元醇㈦、和有機二異氰酸 取曰c反應所得、終端具有異氛酸酷基之胺基甲酸乙酉旨預 ^勿⑷，與聚胺基化合物⑷反應所調製之聚胺基甲酸酉旨 :树月曰（Α)、具有二個以上環氧基之環氧樹脂⑻、及導 y生充填劑之硬化性導電性黏接劑組成物予以塗佈，並乾 ’本形成硬化性導電性黏接劑層（1)的步驟、及 於則述硬化性導電性黏接劑層（I )上重保護膜 驟、 之防電磁波性黏接膜之製造方法。 更且’本發明亦關於包含 表補強膜之一表面上，將含有具有羧基之聚酯樹脂（C) 伽專利說明書(補件)\95_歸娜378 1360386 與具有二個以上環.氧基之環氧樹脂（D)的樹脂組成物予以 塗佈，亚乾炜形成膜狀硬化性樹脂組成物（π丨）層的步驟、JOO has excellent bending resistance and abrasion resistance. Fat composition (IV). Σ-shaped membranous hardening tree. In a preferred embodiment, the anti-electromagnetic wave bonding film of the month is: The substrate film contains a flame retardant (8). The anti-banding method of the present invention a Φ is further preferred in the 'pure adhesive film' in ######################################################################### A strong film of the kinetic agent layer (I). * The layer of germanium, or the layer of micro-adhesive is not permeable, and the layering complement k is electromagnetically shielded by the present invention in which such a reinforced film is laminated. It is difficult for the wood softer to make it. In addition, the cost, and for the electric reed, An* additional #strong reduction, the micro-adhesive sheet J to be added is added to prevent the electromagnetic wave reading i B Λ Λ #2, & π 板, etc., is removed. Flexible printed wiring: A further preferred embodiment of the anti-electromagnetic adhesive film of February. The protective film is laminated on the curable conductive adhesive layer (1). Further, the present invention relates to a step of laminating a reinforcing film through a microadhesive layer on a surface of a film comprising the film, and a glycolated a substance having a carboxyl group on the other surface of the other substrate film ( a), and a polyol having a number average molecular weight other than the diol compound of the base group of 500 to 8000 (3)), and an organic diisocyanate (c), and an amino acid ethyl citrate having an isocyanate group at the terminal Polyurethane (A), polyamine phthalate polyurea resin (A) prepared by reacting with polyamine compound (e), epoxy resin (b) having one or more epoxy groups, and conductive filling 9 32 <;5\Patent specification (supplement)\95·08\95〗 05378 1360386 ^The method of manufacturing a well-waved adhesive film by laminating a conductive adhesive layer (丨) The present invention also relates to the step of providing a micro-adhesive layer on the surface of the inclusion agent, and the step of adding a substrate film to the micro-pointing layer J, and the other surface of the m-film is contained. a diol (a), and a polyol other than a diol compound containing a carboxyl group (8), The organic diisocyanate di 2 and the aminocyanate ethyl ester prepolymer having an isocyanate group (4), the polyaminocarbamic acid polyurea resin prepared by the reaction of the oxime compound (e) has two or more epoxy groups. The epoxy resin (8) and the curable conductive adhesive composition of the conductive filler are coated with a step of drying the curable conductive adhesive layer (I), and the curable conductive adhesive A method for manufacturing an anti-electromagnetic wave-adhesive film on a layer (1), and a method of providing a micro-adhesive layer on one surface of a reinforcing film, on the micro-adhesive layer The step of overlapping the substrate film, on the surface of one of the protective films, containing a diol compound (a) having a carboxyl group and a number of alcohols having a number average molecular weight of 50 0 to 80 00 other than the compound containing the tetamine compound ( b), a polyurethane urethane prepolymer obtained by reacting with an organic diisocyanate (c), having an isocyanate group at the end, and a polyurethane polyurea resin prepared by reacting with the polyamine compound (e) (A) ), with 326\ patent specification (supplement)\95-08\95!0 5378 10 f An epoxy resin (B) with an epoxy group on the epoxy group and a conductive conductive adhesive. The step of forming the hard layer, the layer (1), and the step of forming the hardenability. Conductive ^ ^ ^ ^ ^ ^ The base film of the film, m will laminate the above-mentioned reinforcing rT. The substrate film is overlapped with the hardened conductive conductive pile (ί). The invention also relates to a method for producing a magnetic wave-bonding film. Further, the invention relates to an epoxy resin coated on the surface of one of the reinforcing films and coated with a polyester resin (c) having a glycocarboxy group The resin composition of (D) is a step of forming a film-like curable resin composition (1) I) layer by sub-n, and a layer of a film of the resin composition (1)1), which contains a device of a sigma (&;) 'With the carboxyl group-containing diol compound other than the west = molecular weight state ~ coffee polyol (seven), and the organic diisocyanate taken from the reaction of c, the terminal has an oleic acid for the base of the urethane (4) A polyaminocarbamic acid prepared by reacting with a polyamine compound (4): a tree 曰 (Α), having two or more The epoxy resin (8) and the curable conductive adhesive composition for guiding the y raw filler are coated, and the step of forming the curable conductive adhesive layer (1) is performed, and A method for producing an anti-electromagnetic wave-adhesive film by applying a heavy protective film on the curable conductive adhesive layer (I). Further, the present invention also relates to a polyester resin containing a carboxyl group (C), a polyester resin (C) having a carboxyl group, a patent specification (supplement), 95%, 378, 1360386, and having two or more cyclic oxy groups. a step of applying a resin composition of the epoxy resin (D) and forming a film-like curable resin composition (π丨) layer by sub-drying,

於保護膜之一表面上，將含有令具有羧基之二醇化合物 ()和έ有缓基之一醇化合物以外之數平均分子量 5〇〇山8GGG之多7C醇⑻、和有機：異氰酸自旨⑷反應所得、 終端具有異氰酸醋基之胺基甲酸乙醋預聚物⑷，與聚胺 基化合物（e)反應所調製之聚胺基甲酸酯聚脲樹脂（a)、具 有二個以上環氧基之環氧樹脂（B)、及導電性充填劑之硬 J·生‘電f生黏帛劑組成物予以塗佈，並乾燥形成硬化性導 電性黏接劑層（I )的步驟、及、 ’將層合前述補強 以前述膜狀硬化性 性黏接劑層（I)為 於前述硬化性導電性黏接劑層（I)上 膜的膜狀硬化性樹脂組成物（丨丨丨）層， 树脂組成物（111)層與前述硬化性導電 接觸般重疊的步驟、 之防電磁波性黏接膜之製造方法。 更且，本發明亦關於包含 由含有補強膜、 於前述補強膜之一表面上設置之微黏著劑層、 於前述微黏著劑層之表面上設置之基材膜、 於前述基材膜之表面上設置、含有令具有叛基之二醇化 合物（a)、和含有羧基之二醇化合物以 •，嶋之多元醇⑻、和有機二異氰酸心)=斤子得I * 、，’ς端具有異氰酸酯基之胺基甲酸乙酯預聚物（d)，與聚胺 基化α物（e)反應所調製之聚胺基曱酸酯聚脲樹脂Q)、具 326\專利說明書(補件)\95-08\95105378 12 ^00386 氧基之環氧樹腊⑻、及導電性… 性V电性黏接劑層（I )、及 充填劑之硬 於前述硬化性導電性黏接劑層⑴ 之防電磁波性黏接膜令， 、 °又置的保護膜 剝離前述保護膜’並將已On the surface of one of the protective films, a 7C alcohol (8) having a number average molecular weight of 5 GG 8GGG other than the diol compound having a carboxyl group and an alcohol compound having a buffer group, and an organic: isocyanic acid The polyurethane urethane prepolymer (4) obtained by the reaction of the reaction of (4), having an isocyanate-based hydroxyacetate prepolymer (4), and reacting with the polyamine compound (e), has a polyurethane polyurea resin (a) Two or more epoxy-based epoxy resins (B) and a hard filler of a conductive filler are applied and dried to form a curable conductive adhesive layer (I) And a film-like curable resin composition in which the film-like curable adhesive layer (I) is a film on the curable conductive adhesive layer (I) (丨丨丨) layer, a step in which the resin composition (111) layer is overlapped with the curable conductive contact, and a method for producing the electromagnetic wave preventing adhesive film. Furthermore, the present invention also relates to a substrate film comprising a micro-adhesive layer provided on a surface of one of the reinforcing film, a surface of the substrate, and a surface of the substrate film. Provided, containing a diol compound (a) having a rebel base, and a diol compound containing a carboxyl group, a polyhydric alcohol (8), and an organic diisocyanate) = I*,, 'ς a polyurethane urethane prepolymer (d) having an isocyanate group and a polyamine phthalate polyurea resin prepared by reacting with the polyaminolated α (e), having a 326\ patent specification (complement) ())\95-08\95105378 12 ^00386 Oxygen-based epoxy wax (8), and electrical conductivity... The V-electric adhesive layer (I) and the filler are harder than the above-mentioned hardenable conductive adhesive. The anti-electromagnetic adhesive film of the layer (1) causes the protective film to be peeled off and the protective film is peeled off

層⑴重疊至黏附體，加熱，令：二:：性導：性黏接劑 之黏附體的電磁波遮蔽方法。 有y層共问剝離 更且，本發明亦關於包含 由含有補強膜、 於前述補強膜之 表面上設置、含有具有 脂（C)與具有-個以# 土之♦ §日枒 峰鮮/ 基之環氧樹脂⑻的膜狀硬化 性樹脂組成物（π I)層、 匕 於前述膜狀硬化性樹脂組成物（Ιΐυ層之表面上設置、 含有令具有缓基之二醇化合物（a)、和含有幾基之二醇化 眷合物以外之數平均分子量500〜8_之多元醇⑻、和有機 二異氰酸醋（c)反應所得、終端具有異氰酸醋基之胺基甲 酸乙酯預聚物（d)’與聚胺基化合物（e)反應所調製之聚胺 基甲酸酯聚脲樹脂（A)、具有二個以上環氧基之環氧樹脂 (B)、及導電性充填劑之硬化性導電性黏接劑層（1)、及 於前述硬化性導電性黏接劑層（丨）之表面上設置的保護 膜 之防電磁波性黏接膜中， 剝離前述保濩膜’並將已露出的硬化性導電性黏接劑層（I) 326\專利說明書(補件)\95-08\951〇5378 13 工360386 重叠至黏附體，加埶，今前 層及前述硬化性導樹脂組成物⑴1) t _離之黏附體的電磁波遮蔽方法。 κ補強 (發明效果） ^月之防包磁波性黏接膜為具有僅以含有特定之聚 月女基曱酸酯聚脲樹脂和琿氧 人 ，層’因為未層合金屬膜層等，故厚度薄且耐彎曲性優 ^且可表現能承受無鉛焊料迴流的耐熱性。 1又’本發明之防電磁波性輯膜之製造方法巾，將且有 ^具耐熱性和再剝離性之黏接劑層的補強膜，於防電磁波 製造步驟的早期階段層合至基材膜，則可作成 、土才膜的支撐材，且導電性黏接劑層的層合變 易0 硬基材膜為含有特定之^旨樹脂和環氧樹脂之膜狀 2化性樹脂組絲⑴D時，所得之防電磁波性黏接膜不 .曰因無料料迴^發生捲曲，可表現優良之耐彎曲性、 耐磨損性、及加工性。 又’將前述膜狀硬化性樹脂組成物⑴υ使用作為基材 版之情形中’於補強膜上’將含有聚酿樹脂和環氧樹脂之 膜狀硬化性樹脂組成物⑴1)層、硬化性導電性黏接劑層 (I )、及保護膜依序層合的方法、 或者，於補強膜上形成膜狀硬化性樹脂組成物πιι) 層’並於保護膜上形成硬化性導電性黏接劑層⑴，並於 該硬化性導電性黏接劑層⑴上’將層合前述補強膜的膜 326\專利說明書(補件)\95-〇8\95105378 14 ^60386 之方法，則可製造 不必要設置微黏著 狀硬化性樹脂組成物⑴I)層予以重聶 防電磁波性黏接膜，且於此等方法中： 劑層’故可令製造方法簡略化。 【實施方式】 首先’說明關於本發明 ,^ Q 4知月之防電磁波性黏接 本發明之防電磁波性黏接膜為於基材膜、 持硬化性導電性邦桩％ M ^ 表面上，載 ㈣接心⑽ ⑴，不具有成為财防電磁波The layer (1) is superposed on the adherend and heated, so that: 2:: Sexual conductivity: electromagnetic wave shielding method of the adherent of the adhesive. There is a y-layer co-extraction, and the present invention also relates to the inclusion of a reinforced film on the surface of the aforementioned reinforced film, containing a fat (C) and having a _ _ _ _ _ _ _ _ _ _ The film-like curable resin composition (π I) layer of the epoxy resin (8) and the film-like curable resin composition (the surface of the ruthenium layer is provided, and the diol compound (a) having a slow base is contained, And an amino urethane having an isocyanate group obtained by reacting a polyhydric alcohol (8) having a number average molecular weight of 500 to 8 _ in addition to a diolated chelate compound having a few groups, and an organic diisocyanate (c) Polyurethane polyurea resin (A) prepared by reacting prepolymer (d)' with polyamine compound (e), epoxy resin (B) having two or more epoxy groups, and conductivity The hardenable conductive adhesive layer (1) of the filler and the electromagnetic wave protective film of the protective film provided on the surface of the curable conductive adhesive layer (丨) are peeled off from the protective film 'will expose the layer of hardened conductive adhesive (I) 326\patent specification (supplement)\95-08 \951〇5378 13 Work 360386 Overlap to the adherend, twist, the current layer and the aforementioned hardenable conductive resin composition (1) 1) t _ away from the electromagnetic wave shielding method. κ Reinforcement (Invention Effect) ^The anti-magnetic wave-adhesive film of the month has a polyurea resin containing only a specific polyglycolate and a ruthenium oxide layer, because the layer is not laminated, etc. It has a thin thickness and excellent bending resistance, and can exhibit heat resistance that can withstand the reflow of lead-free solder. Further, in the method for producing an electromagnetic wave preventing film of the present invention, a reinforcing film having a heat-resistant and re-peelable adhesive layer is laminated to a base film in an early stage of an electromagnetic wave preventing manufacturing step. , it can be used as a support material for the soil film, and the lamination of the conductive adhesive layer becomes easy. 0 The hard substrate film is a film-like 2-chemical resin assembly wire (1)D containing a specific resin and epoxy resin. The obtained anti-electromagnetic wave adhesive film does not cause curling due to no material return, and can exhibit excellent bending resistance, abrasion resistance, and workability. In the case where the film-like curable resin composition (1) is used as a substrate plate, a layer of a film-like curable resin composition (1) 1) containing a polymer resin and an epoxy resin is used, and a curable conductive material is used. The adhesive layer (I) and the protective film are sequentially laminated, or a film-like curable resin composition πιι layer is formed on the reinforcing film, and a curable conductive adhesive is formed on the protective film. Layer (1), and on the curable conductive adhesive layer (1), a method of laminating the above-mentioned reinforcing film film 326\patent specification (supplement)\95-〇8\95105378 14^60386 can be manufactured It is necessary to provide a layer of the micro-adhesive hardenable resin composition (1)I) to impart an anti-electromagnetic wave-adhesive film, and in such a method: the agent layer' can simplify the manufacturing method. [Embodiment] First, the electromagnetic wave-proof adhesive film of the present invention is applied to a substrate film and a curable conductive state group % M ^ surface. (4) Heart (10) (1), does not have to become financial waves

I·生黏接版全體之耐f曲性 ：波 黏接劑層⑴硬化所?硬化性導電性 斤开/成的‘電性硬化黏接劑声 擔任遮蔽電磁波的機能，並且、= ，… 固定至黏附體的機能，更且於貼:磁波性黏接膜 用日 冑且於職至可撓性㈣佈線板使 τ，人该印刷佈線板之電性電路的接地電路安定接續， 且有效遮蔽所發生的電磁雜訊往外部釋出。更且，可遮蔽 外。卩所鲞生的電磁雜訊侵入前述印刷佈線板。 ’·' 構成本發明之防電磁波性黏接膜之硬化性導電性黏接 劑層（I)的硬化性導電性黏接劑組成物’為含有聚胺基曱 酸酯聚脲樹脂（A)、和具有二個以上環氧基之環氧樹脂 (B)、和導電性充填劑。前述聚胺基曱酸酯聚脲樹脂（八） 為令終端具有異氰酸酯基之胺基曱酸乙酯預聚物（d)、與 聚胺基化合物（e)反應調製。更且，前述胺基曱酸乙酯預 聚物（d)為令具有羧基之二醇化合物（a)、和 數平均分子量為500〜8000，含有羧基之二醇化合物以外 之多元醇（b)、和 有機二異氰酸酯（c) 15 326、專利說明書(補件)\95-08\95105378 反應而調製。 3有刖述聚胺基甲酸酯聚脲樹脂（Α)及前述環氧樹脂⑻ 、硬化性黏接樹脂組成物，可令導電性充填劑良好地分 月，’且:使含有導電性充填劑亦可發揮充分的黏接力。 ^ 含有來胺基甲酸酯聚服樹脂（A)、環氧樹脂（β)及導 ,Η，曾2真^之硬化性導電性黏接劑組成物所構成的硬化 小¥电]生點接劑層⑴’於熱歷黏時之黏接劑層的參出 〉、’具村承受無錯焊料迴流的優㈣熱性，更且可取得 /、有俊良之耐，考、曲性的導電性硬化黏接劑層（11)。 取硬化性導電性黏接劑組成物中所含有的聚胺基甲酸醋 ^樹脂（Α)為如前述’令終端具有異氛酸醋基之胺基甲 -夂乙酉曰預小物⑷、與聚胺基化合物⑷反應取得。又，前 '胺基甲酸乙酿預聚物⑷為令含有幾基之二醇化合物 a、=數平均分子量刷〜副0之含有㈣之二醇化合物 卜的夕元醇⑻、與有機二異氰㈣⑷反應取得。 丨作為3有羧基之二醇化合物（a)，可列舉例如二羥曱美 :酸：二經甲基丙酸、二經甲基丁酸、或二經甲基戊酸； ‘ Γί甲基鍵烧酸（此處，鏈烧酸為碳數2〜8個者為佳）、 口一經基琥賴等之二經基脂肪族二缓酸（此處，脂肪族 二竣酸為碳數4〜8個者為佳）、或二經基苯甲酸等之二_ =香族讓此處，芳香族㈣為碳數7〜u個者為 土）°特別由反應性、及溶解性方面而言，以二經甲基丙 ::或二經甲基丁酸為佳。前述含有叛基之二醇化合物⑷ 可早獨使用，且亦可併用二種以上。 326、專利說明書(補件)\95-08\95105378 ir 1360386 數:均分子量為·咖、含錢基之二醇化合物以 ▲、夕元酉予（b)，一般為以構成聚胺基曱酸酯樹脂的多元 :f 2、式已知的多兀醇(但，含有羧基之二醇化合物除 月'J边夕元醇（b)的數平均分子量（Mn)為考慮所得之聚 絲甲酸Μ脲樹脂（A)的耐熱性、黏接強度、或溶解性 寺而適田决疋，較佳為1〇〇〇〜5〇〇〇。數平均分子量（)若 未滿500，則所得之聚胺基曱酸酿聚服樹脂⑴中之胺基 曱酸乙醋鍵變得過多’聚合物骨架的柔軟性降低且對於可 ，性印刷佈線板之黏接性有降低之傾向，χ，數平均分子 里（Μη)右超過8000，則聚胺基曱酸酯聚脲樹脂中來自 二醇化合物(a)之羧基數減少。其結果，與環氧樹脂之反 應點減），故所得之導電性硬化黏接劑層的耐焊料迴流性 有降低之傾向。 作為數平均分子i 5GG，〇()、含有叛基之二醇化合物 以外之多元醇⑻’可使用例如各種之聚醚多元醇類、聚 >酯多元醇類、聚碳酸酯多元醇類、或聚丁二烯二元醇類等。 作為聚醚多元醇類可列舉例如氧Γ去 、 千丨u虱乙烯、氧丙烯、或四氫 呋喃等之聚合物或共聚物等。 作為聚醋多元醇類可列舉例如，乙二醇、丄2—丙二醇、 1’ 3-丙二醇、1，3-丁二醇、1，4-丁二醇、新戊二醇、戊二 醇、3-曱基-1，5-戊二醇、己二醇、辛二醇、1>4一丁二醇、 二乙二醇、三乙二醇、二丙二醇、或二聚物二醇等之飽和 或不飽和之低分子二醇類、與己二酸、苯二甲酸、門苯二 酸、對苯二酸、順丁烯二酸、反丁烯二酸、琥拍酸、^酸二 32价專利說明書(補件)\95-08\951〇5378 17 •:戊二酸、庚二酸、辛二酸、壬二酸、或癸二I. The adhesion resistance of the whole adhesive-bonded plate: the wave-adhesive layer (1) hardened? The hardened conductive jin opened/formed the 'electric hardening adhesive sound as the function of shielding electromagnetic waves, and, =,... The function of fixing to the adhesive body is more suitable for: the magnetic wave adhesive film is used for the purpose of the flexible circuit (four) wiring board, and the ground circuit of the electrical circuit of the printed wiring board is stable and continuous, and effective The electromagnetic noise generated by the shielding is released to the outside. Moreover, it can be shielded from the outside. The electromagnetic noise generated by the sputum invades the aforementioned printed wiring board. '·' The curable conductive adhesive composition constituting the curable conductive adhesive layer (I) of the electromagnetic wave protective film of the present invention is a polyamine phthalate-containing polyurea resin (A) And an epoxy resin (B) having two or more epoxy groups, and a conductive filler. The polyamino phthalate polyurea resin (8) is prepared by reacting an amino phthalate prepolymer (d) having an isocyanate group at the terminal with a polyamine compound (e). Further, the aforementioned amino decanoic acid ethyl ester prepolymer (d) is a polyol (b) having a carboxyl group and a polyol having a number average molecular weight of 500 to 8,000 and a carboxyl group-containing diol compound (b) And prepared by reacting with organic diisocyanate (c) 15 326, patent specification (supplement)\95-08\95105378. 3 There is a description of the polyurethane polyurea resin (Α) and the above epoxy resin (8), the curable adhesive resin composition, so that the conductive filler can be well divided into months, and: and contain conductive filling The agent also exerts sufficient adhesion. ^ Hardened small electric charge consisting of a urethane-based resin (A), an epoxy resin (β), and a conductive, electrically conductive adhesive composition The adhesion layer of the adhesive layer (1)' in the heat-adhesive bonding layer>, the superior (four) heat of the village with the error-free solder reflow, and the ability to obtain / have a good resistance, test, curved conductivity Sexually hardened adhesive layer (11). The polyamino acetal resin (Α) contained in the composition of the curable conductive adhesive is an amine-methyl hydrazine pre-form (4) having an oleic acid acetate group as described above, and a poly The amine compound (4) is obtained by a reaction. Further, the former 'amino ethanedicarboxylate prepolymer (4) is a diol compound (8) which contains a diol compound a having several groups, = a number average molecular weight brush, and a diol compound containing (4) The cyanide (iv) (4) reaction was obtained.丨 as the diol compound (a) having 3 carboxyl groups, for example, dihydroxy oxime: acid: di-methylpropionic acid, di-methylbutyric acid, or di-methylvaleric acid; 'Γί methyl bond Sour burning acid (here, the chain burning acid is preferably 2 to 8 carbon atoms), and the oral transesterification of the dibasic aliphatic acid (here, the aliphatic diterpene acid is carbon number 4~) 8 is better), or di-perylene benzoic acid, etc. _ = fragrance is given here, aromatic (four) is carbon number 7~u is soil) ° in terms of reactivity, and solubility It is preferred to use methyl propyl group:: or dimethyl butyl acid. The diol-containing diol compound (4) may be used alone or in combination of two or more. 326, patent specification (supplement)\95-08\95105378 ir 1360386 number: diol compound with average molecular weight of gamma and money base, ▲, 夕元酉, (b), generally to form a polyamine hydrazine Dimer of the acid ester resin: f 2, a known polyhydric alcohol (however, the number average molecular weight (Mn) of the diol compound containing a carboxyl group except the moon 'J divalent alcohol (b) is a polysilicic acid which is considered to be obtained. The heat resistance, the bonding strength, or the solubility of the uret urea resin (A) is preferably 1 to 5 Torr. If the number average molecular weight () is less than 500, the obtained In the polyamino phthalic acid styrofoaming resin (1), the amino ruthenium citrate bond is too much. The softness of the polymer skeleton is lowered, and the adhesion to the printed wiring board tends to decrease. When the average molecular weight (Μη) is more than 8000, the number of carboxyl groups derived from the diol compound (a) in the polyamine phthalate polyurea resin is decreased. As a result, the reaction point with the epoxy resin is decreased, so that the obtained conductive layer is obtained. The solder reflow resistance of the hardenable adhesive layer tends to decrease. As the number average molecule i 5GG, 多元(), the polyol (8) other than the diol-containing diol compound, for example, various polyether polyols, poly> ester polyols, polycarbonate polyols, Or polybutadiene diols and the like. The polyether polyol may, for example, be a polymer or a copolymer of oxonium, hydrazine, propylene oxide or tetrahydrofuran. Examples of the polyhydric alcohol polyol include ethylene glycol, hydrazine 2-propanediol, 1' 3-propanediol, 1,3-butylene glycol, 1,4-butanediol, neopentyl glycol, and pentanediol. 3-mercapto-1,5-pentanediol, hexanediol, octanediol, 1>4-butanediol, diethylene glycol, triethylene glycol, dipropylene glycol, or dimer diol Saturated or unsaturated low molecular weight diols, with adipic acid, phthalic acid, terephthalic acid, terephthalic acid, maleic acid, fumaric acid, succinic acid, succinic acid Price patent specification (supplement)\95-08\951〇5378 17 •: glutaric acid, pimelic acid, suberic acid, azelaic acid, or bismuth

-耗類'或令此等之無水酸類反應所得之聚能多元: 丁基縮水甘油越、或2—乙基己基縮水甘油4 酯；：、::水甘1醚類、柯赫酸(Versatlc Acid)縮水甘油 類曰等之：Ϊ酸縮水甘油酯類與上述二羧酸類之酐類於醇 =、3有羥基之化合物存在下反應所得的聚酯多元妒 ;員。或將環狀酯化合物予以開環聚合所得的聚酯多元J 鲁作為聚碳酸酿多元醇類可使用例如， )元醇或雙驗與碳酸g旨之反應產物、或 等令。二元醇或雙酚於鹼存在下以光氣反應所得之反應產 作為上述1)或2)之反應產物調製中所用的二元醇可列 牛例如乙—醇、丙二醇、二丙二醇、二乙二醇、三乙二醇、 丁二醇、3~曱基―1，5_戊二醇、2-曱基-18-辛二醇、3 3，— -羥^基庚烷、聚氧乙二醇、聚氧丙二醇、丙二醇、丨，^ 一醇、L 4_ 丁 二醇、L 5-戊二醇、1，6-己二醇、1，9- 壬:醇、新戊二醇、辛二醇、丁基乙基戊二醇、2_乙基—丨，3_ 己二醇、環己二醇、3, 9—雙(1，卜二甲基_2_羥乙基 '’或 A 2, 8, 10-四螺[5. 5]十一烷。 又，作為上述1)或2)之反應產物調製中所用的雙酚， 可列舉例如雙酚A和雙酚F等之雙酚類、和於此等雙酚類 加成環氧乙烷或環氧丙烷等之加成氧化伸烷基的化合物 等。 皿專利說明書(補件)\95-08\95105378 18 1360386 . 又’作為上述1)之反應產物調製中所用的碳酸酯可列 .舉例如碳酸二曱酯 '碳酸二乙酯、碳酸二苯酯、碳酸乙烯 •.雖、碳酸丙烯酯等。 作為數平均分子量500〜8000、含有羧基之二醇化合物 乂外之多元醇（b)所例示之前述各種多元醇，可單獨使 用’且亦可併用二種以上。 一更且，在所得之聚胺基甲酸酯聚脲樹脂（A)的柔軟性不 會喪失之範圍内，令含有羧基之二醇化合物（a)、與含有 •羧基之二醇化合物以外之數平均分子量5〇〇〜8〇〇〇的多元 醇（b)、及有機二異氰酸酯（c)反應時，除了此等成分、 成分（b)及成分（c)以外，加上併用含有羧基之二醇化合物 以外之低分子二醇類亦可。作為可併用之低分子二醇類， 可列舉例如，含有羧基之二醇化合物以外之數平均分子量 50 0〜8000之多元醇（b)製造中所用的各種低分子二醇等 (例如，碳數4〜12個之二醇）。 #合成胺基曱酸乙酯預聚物（d)時，令含有羧基之二醇化 5物（a)、與含有叛基之二醇化合物以外之數平均分子量 500〜8000之多元醇（b) ’相對於前述多元醇（b)1莫耳，使 用前述二醇化合物（a)0·〗莫耳〜4 〇莫耳之比率為佳，且 以使用0.2莫耳〜3.0莫耳之比率為更佳。前述二醇化合 物（a)相對於前述多元醇（b)i莫耳之使用量若少於〇工莫 *耳，則可與環氧樹脂（B)交聯之羧基變少，導電性硬化黏 •接劑層（11)的耐焊料迴流性有降低之傾向。又" 人 右多於 4.0莫耳，則導電性硬化黏接劑層（⑴的黏接性有降低之 326\專利說明書(補件)\95_〇8\95105378 ίο ^60386 傾向。 作為有機二異氰酸SI (c )，可使用例如，芳香族二異氰 酸能、脂肪族二異氰酸酯、脂環式異氰酸酯、或其混合物， 特別以異佛爾酮二異氰酸酯為佳。 作為芳香族二異氰酸酯可使用例如，碳數6〜2〇個之芳 曰知化合物的二異氰酸g旨，具體而言，可列舉1 5 _亞萘 基二異氰酸酯、4, 4，-二苯曱烷二異氰酸酯、4, 4，-二苯基 —甲基曱烷二異氰酸酯、4, 4，-苄基異氰酸酯、二烷基二 本基甲燒一異氰酸S旨、四烧基二苯基曱烧二異氰酸醋、 L 3-伸笨基二異氰酸酯、丨，4_伸苯基二異氰酸酯、伸曱苯 —異氰酸酯、或伸二曱苯二異氰酸酯等。 作為脂肪族二異氰酸酯可使用例如，碳數4〜2〇個之脂 肪族化合物的二異氰酸酯，具體而言，可列舉丁烷_1，4一 =異氰酸酯、己二異氰酸酯、2, 2, 4-三曱基六亞甲基二異 氰酸酯、或離胺酸二異氰酸酯等。 / 班作為脂環式二異氰酸酯可使用例如，碳數6〜2〇個之脂 裱式族化合物的二異氰酸酯，具體而言，可列舉環己烷 -1，私二異氰酸酯、異佛爾酮二異氰酸酯、二環己基曱= '4, 4’-二異氰酸_、雙（異氰酸醋曱基）環已烧、或^ 基環己烷二異氰酸酯等。 八異讓基之胺基甲酸乙醋預聚物⑷為經由 二：Γ 酵化合物(a)、與含有緩基之二醇化合物 j之數平均分子量5QG〜8_之多謂⑻、與有機二里 认酿⑷反應料取得。合成終端具有異氰_基之胺 326\4 利說明書(補件)\95-08\95105378 20 基曱酸乙酯預聚物（d)時的/夂^ 千丨加、，从匕枯， 條件，除了令異氰酸酯基為過 .剩般以外，無特別限定，伯 、 ^ , 0/1 0 異氰酸S旨基/羥基之當量比 為1. 2/1〜3/1範圍内之比々 , ’令含有缓基之二醇化合物 (a)、與含有羧基之二醇 匕5物以外之數平均分子吾 500〜8000的多元醇（b)、蛊 田 十Q刀千里 ^ c ^ 也上 ”有機二異氰酸酯（c)反應為佳。 又，反應溫度通常為常溫〜丨 $ C；广aw C，更且由製造時間、或副- consumption of ' or the amount of polyhydric acid obtained by reacting these anhydrous acids: butyl glycidol, or 2-ethylhexyl glycidyl 4 ester;:,:: water glycine ether, koch acid (Versatlc Acid) A glycidyl hydrazine or the like: a polyester polyhydric hydrazine obtained by reacting a glycidyl phthalate ester with an anhydride of the above dicarboxylic acid in the presence of an alcohol=3 compound having a hydroxyl group; Alternatively, the polyester polyol obtained by subjecting the cyclic ester compound to ring-opening polymerization can be used, for example, as a polycarbonate or a polyhydric alcohol, for example, a reaction product of a monohydric alcohol or a double test with a carbonic acid, or the like. The reaction of the diol or bisphenol in the presence of a base by phosgene reaction produces the diol used in the preparation of the reaction product of the above 1) or 2), such as ethyl alcohol, propylene glycol, dipropylene glycol, diethyl Glycol, triethylene glycol, butanediol, 3~ mercapto-1,5-pentanediol, 2-mercapto-18-octanediol, 3 3 -hydroxyl-heptane, polyoxyethylene Glycol, polyoxypropylene glycol, propylene glycol, hydrazine, monohydric alcohol, L 4 - butanediol, L 5-pentanediol, 1,6-hexanediol, 1,9-fluorene: alcohol, neopentyl glycol, octane Glycol, butyl ethyl pentanediol, 2-ethyl-hydrazine, 3-hexanediol, cyclohexanediol, 3,9-bis(1,b-dimethyl-2-hydroxyethyl'' or A 2, 8, 10-tetraspiro[5. 5]undecane. Further, as the bisphenol used in the preparation of the reaction product of the above 1) or 2), bisphenols such as bisphenol A and bisphenol F may be mentioned. The bisphenols are added to the oxidized alkylene group such as ethylene oxide or propylene oxide. PCT patent specification (supplement) \95-08\95105378 18 1360386. Also, as the carbonate used in the preparation of the reaction product of the above 1), for example, dinonyl carbonate 'diethyl carbonate, diphenyl carbonate , ethylene carbonate • although, propylene carbonate and so on. The various polyols exemplified as the polyol (b) having a number average molecular weight of 500 to 8,000 and a diol compound having a carboxyl group may be used singly or in combination of two or more. Further, in the range where the flexibility of the obtained polyurethane polyurea resin (A) is not lost, the diol compound (a) having a carboxyl group and the diol compound containing a carboxyl group are not used. When the polyol (b) having a number average molecular weight of 5 Å to 8 Å and the organic diisocyanate (c) are reacted, in addition to the components, the component (b) and the component (c), a carboxyl group is used in combination. Low molecular weight diols other than the diol compound may also be used. The low molecular weight diol which can be used together, for example, various low molecular diols used for the production of the polyol (b) having a number average molecular weight of 50 to 8,000 other than the diol compound containing a carboxyl group (for example, carbon number) 4 to 12 diols). #synthetic amino decanoic acid ethyl ester prepolymer (d), the diol-containing 5 (a) containing a carboxyl group, and a polyhydric alcohol having an average molecular weight of 500 to 8000 other than the diol-containing diol compound (b) 'Compared to the aforementioned polyol (b) 1 mole, it is preferred to use the ratio of the aforementioned diol compound (a) 0·Mole to 4 〇 Mo, and to use a ratio of 0.2 mol to 3.0 mol. good. When the amount of the diol compound (a) is less than that of the above-mentioned polyol (b) i mole, the carboxyl group which can be crosslinked with the epoxy resin (B) is less, and the conductive hardening is sticky. • The solder reflow resistance of the adhesive layer (11) tends to decrease. Also " people right more than 4.0 moles, the conductive hardening adhesive layer ((1) the adhesion is reduced 326\patent specification (supplement)\95_〇8\95105378 ίο ^60386 tendency. As organic As the diisocyanate SI (c ), for example, an aromatic diisocyanate, an aliphatic diisocyanate, an alicyclic isocyanate, or a mixture thereof may be used, and particularly, isophorone diisocyanate is preferred. For the isocyanate, for example, a diisocyanate g of a 6 to 2 ring carbon compound can be used, and specific examples thereof include 1 5 -naphthyl diisocyanate and 4,4,-diphenylnonane. Isocyanate, 4, 4,-diphenyl-methyl decane diisocyanate, 4, 4,-benzyl isocyanate, dialkyl di-carbazyl mono-isocyanate, tetra-alkyl diphenyl oxime Diisocyanate vinegar, L 3-extended diisocyanate, hydrazine, 4-phenylene diisocyanate, hydrazine-isocyanate, or diphenylene diisocyanate, etc. As the aliphatic diisocyanate, for example, carbon number can be used. 4 to 2 parts of the diisocyanate of the aliphatic compound, specifically, butane _1, 4 - isocyanate, hexamethylene diisocyanate, 2, 2, 4-trimethyl hexamethylene diisocyanate, or diazonic acid diisocyanate, etc. / as an alicyclic diisocyanate, for example, carbon number 6 can be used. The diisocyanate of the bismuth compound of the bismuth compound is specifically exemplified by cyclohexane-1, diacetyl isocyanate, isophorone diisocyanate, dicyclohexyl hydrazine = '4, 4'-diiso Cyanic acid _, bis(isocyanatosyl) ring calcined, or cyclohexane diisocyanate, etc. octadecyl hydroxyacetate prepolymer (4) is a second: lysate compound (a And the number average molecular weight of the diol compound j containing a slow base is 5QG~8_ (8), and the organic second liqueur (4) reaction material is obtained. The synthesis terminal has an isocyanide-based amine 326\4. ))))))))) The ratio of the ratio of the isocyanate S to the hydroxyl group is 1. 2 / 1 to 3 / 1 ratio 々, 'the diol containing a slow base The compound (a), the number average molecular molecule other than the diol oxime 5 containing a carboxyl group, 500-8000 polyol (b), 蛊田十Q刀千里^ c ^ also "organic diisocyanate (c) reaction Further, the reaction temperature is usually normal temperature ~ 丨 $ C; wide aw C, and more by manufacturing time, or vice

反應之控制面而言較佳為的〜丨⑽它。 乂田J 聚胺基甲酸酯聚脲樹脂（A、 θ U)為令終端具有異氰酸酯基之 胺基甲酸乙酯預聚物（d)、鱼 之 得。 ”永胺基化合物（e)反應而取 作為聚胺基化合物（e)W舉例如碳數 族化合物、碳數6〜20個之人& 们之如肪 夕芸承##人& 们之知％式化合物、或碳數6〜20個 之方香族化合物的二胺或胺 具肢而吕，除了乙二胺、 丙一胺、己二胺、二伸乙基二 酮一胺、-I 二伸乙基四胺、異佛爾 阳一月女、一每己基甲烧-4,4、二胺以外，亦可使用 胺乙胺基）乙醇、2-經乙基乙二胺、2_經乙基丙二胺、二 d乙中基：二胺、二―2’丙基乙二胺等之具有羥基的胺 大負/、中亦以異佛爾酮二胺為適於使用。 胺广f氰酸醋基之胺基甲酸乙醋聚合物⑷與聚 曰反應’合成聚胺基甲酸I㈣脂⑴時， 為了魏刀子$可併用反應停止劑。作為反應停止劑 使用一正丁胺等之二烷胺類、二 .^ ^ 吁收寻之一烷醇胺類、 和乙醉、異丙醇等之醇類。 、 令終端具有異氰酸S旨基之胺基甲酸乙g|預聚物.⑷、聚 32以專利說明書(補件)\S>5-08\95 ] 05378 21 1360386 胺基化合物（e)及視需要之反應停止劑反應時的條件並無 特別限定’但相對於胺基曱酸乙酯預聚物（d)所具有之異 氰酸醋基’聚胺基化合物（e )及反應停止劑中之胺基合計 當I比（胺基/異氰酸酯基）為0.5〜1.3之範圍内為佳。於 當量比為未滿〇. 5之情形中，導電性硬化黏接劑層〇工） 的耐焊料迴流性易不夠充分，於多於13之情形中，聚胺 基化合物（e)及/或反應停止劑為就其未反應原樣殘存，且 易殘留臭氣。 作為合成聚胺基甲酸酯聚脲樹脂（A)時所用之溶劑，可 列舉笨、甲苯、或二甲苯等之芳香族系溶劑、甲醇、乙醇、 異丙醇、或正丁醇等之醇系溶劑、丙嗣、甲基乙基嗣、或 甲士異丁基酮等之酮系溶劑、乙酸乙酯或乙酸丁酯等之酯 °此等溶劑可單獨―種，或者混合使用二種以上。 所得之聚胺基甲酸酯聚脲樹脂（4)的重量平 1性有月^中’導電性硬化黏接劑層⑴）之耐焊料迴流 職 ’於超過⑽咖之情形中，導電性硬化 黏接劑層（11)之黏接性有降低之傾向。 為二硬二？二性/接劑組成物中所含有之環氧樹謂 作為"料” ％氧基之樹脂，可為液狀或固形狀。又， 作為環氧樹脂（B)，可丨與 雒略I? 1 牛例如，雙紛A型環氧谢月匕, 又酚F型環氧樹脂、雙酚s型 衣氧樹月日 酝氧樹脂、螺環型環氧樹脂 ____ 326傳利_書(補件)他_测378 22 ^00386 7型環氧樹脂、聯苯型環氧樹脂、結烯型 水甘油氧1其） 虱知知、二（縮 水甘、4 (縮水甘油氧苯基)乙烷等之r 縮水甘油胺胺基二苯基甲烧等之 醛清洗型广^ 、四漠雙紛乂型環氧樹月旨、甲酉分酉分 酚西[1史衣 、苯_路清漆型環氧樹脂、α-关西八 泰型環氧樹脂、或漠化苯她清漆型”二: 其中由高黏接性、或耐敎性方 ▲ 用-種以上。 蔔抖万面而έ，以使用雙酚A创产 氧封知和甲酚酚醛清漆 A生％ 基）乙炫型環氧樹脂為：；圭心、或四（縮水甘油氧苯 於本發明所用之硬化带 脂⑻盘带胺美甲… 劑組成物中，環氧樹 胺A甲、： 聚服樹脂⑴的配合比率，相對於聚 月女基甲酸酯聚脲樹脂（A)1〇量 ' ^ 3〜20。重量份為佳， 重V…氧樹脂⑻以Preferably, the control surface of the reaction is ~丨(10). Putian J Polyurethane Polyurea Resin (A, θ U) is a urethane prepolymer (d) having an isocyanate group at the end and a fish. The reaction of the permanent amino group compound (e) is taken as the polyamine compound (e), for example, a carbon number compound, a carbon number of 6 to 20, and a person such as a fat 芸 芸 承##人& It is known that the diamine or amine of the compound of the formula or the aromatic compound having a carbon number of 6 to 20 is exfoliated, except for ethylenediamine, propanamine, hexamethylenediamine, diethylenedione-amine, -I diethylidene tetraamine, isophorar January female, one per carbyl-methyl-4,4,diamine, amine ethylamine)ethanol, 2-ethylethyldiamine, 2_Ethyl propylene diamine, di- ethane intermediate: diamine, bis-2' propyldiamine, etc. The amine having a hydroxyl group is large negative/, and isophorone diamine is also suitable for use. When the amine-polyf-cyanate-based hydroxyacetic acid ethyl acetonate polymer (4) reacts with polyfluorene to synthesize polyaminocarbamic acid I(tetra)carboxylate (1), a reaction stop agent can be used in combination with Wei Knife. Dialkylamines such as amines, II. anthracene amines, and alcohols such as acetyl alcohol, isopropanol, etc. |Prepolymer. (4), Poly 32 Patent specification (supplement)\S>5-08\95] 05378 21 1360386 The conditions for the reaction of the amine compound (e) and the reaction stopper as needed are not particularly limited, but are relative to the amine ethyl citrate. The total amount of the amine groups in the isocyanate-polyamine compound (e) and the reaction stopper in the prepolymer (d) is preferably in the range of 0.5 to 1.3 in terms of I ratio (amino group/isocyanate group). In the case where the equivalent ratio is less than 〇. 5, the solder reflow resistance of the conductive hardened adhesive layer is not sufficient, and in the case of more than 13, the polyamine compound (e) and / Or the reaction-stopping agent remains in the unreacted state, and it is easy to remain an odor. As a solvent used for synthesizing the polyurethane polyurea resin (A), aromatics such as stupid, toluene, or xylene may be mentioned. An alcohol solvent such as a solvent, methanol, ethanol, isopropanol or n-butanol; a ketone solvent such as acetamidine, methyl ethyl hydrazine or acetoisobutyl ketone; ethyl acetate or butyl acetate; Ester. These solvents may be used singly or in combination of two or more. The resulting polyurethane polyphosphate The weight of the resin (4) is flat. The solder resists in the month of the 'conductive hardenable adhesive layer (1)). In the case of more than (10) coffee, the adhesion of the conductive hardened adhesive layer (11) There is a tendency to reduce the properties. The epoxy resin contained in the composition of the di-harder/bi-dimer/adhesive agent is referred to as a resin of the "oxygen" which may be in a liquid or solid form. In addition, as the epoxy resin (B), it can be used for the first time, for example, a double-type A-type epoxy Xieyue, a phenol F-type epoxy resin, a bisphenol s-type oxy-alkali resin, Spiro-type epoxy resin ____ 326 Chuanli _ book (supplement) he _ test 378 22 ^ 00386 type 7 epoxy resin, biphenyl type epoxy resin, olefinic glycerol oxygen 1) 虱 know, II (glycidyl, 4 (glycidyloxyphenyl) ethane, etc., glycerol, amine, diphenyl ketone, etc., aldehyde cleaning type, ^4, 漠 双 环氧 环氧 环氧 、 、 、 Divided into phenolic [1 history clothing, benzene _ varnish type epoxy resin, α-Kanxi Batai type epoxy resin, or desertified benzene her varnish type" 2: which is made of high adhesion, or sputum resistance Sexual side ▲ Use - more than one kind. 卜 万 万 万 έ 以 έ έ έ έ έ έ έ έ έ έ έ έ έ έ έ έ έ έ έ έ έ 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用Glycidyloxybenzene is used in the hardened fat carrier (8) of the present invention, and the compounding ratio of the epoxy resin A, the poly resin (1) is compared with the polyurethral polyurea. Resin (A) 1 Amount '^ 3~20. Preferably parts by weight, a weight epoxy resin ⑻ to V ...

述聚胺基甲_聚脲樹脂（A)1G (B)為少於3重量份，則道便以 里知右則述裱氧樹脂 料迴流性有變低之傾向。 公:層(⑴的耐焊 為多於2〇〇重量份，列導雷“方面’右别述環氧樹脂⑻ 有降低之傾向。]¥電性硬化黏接劑層⑴）的黏接性 於前述硬化性導電性黏接劑組成物中，在不損 :耐彎曲性等性能之範圍下，可含有I系樹脂、、；石夕 樹脂、脲系樹脂、丙烯酸糸 隶夕氧系 Λ V, / Λ' s 二树月曰、斌酯樹脂、聚醒胺系樹 曰、及/或聚酸亞胺系樹脂等。 ’、、 326\專利說明書(補件)\95-〇8\95105378 又，前述硬化性導L接劑組成物所含有的導電性充 23 填劑為對於導電性硬化立 性充填劑，可使用^層賦予㈣性者，作為導電 作為金屬充填劑，可列::填：、碳充填劑及其混合物。 料等之合金粉、鍍銀之鋼二：全屬金屬粉、焊 劑等。其中，以導兩左古从鍍孟屬之破璃纖维和碳充填 彼此易接觸之比表二:為佳’特別以充填劑 又，導電性充填二:·==編。 狀、塊狀、樹枝狀、或纖維狀等。、疋列如，可為球 硬化性導電性a接劑組成物中 為根據所必要之带成、由、广― 充真诏的含量 _. 屯逢波遮敝效果的程度而显，但相斟热取 份，以導電性充填劑二 ^ iυ 700重i伤之比例為佳。導電性 八背彳之含量若低於} 〇重量 + 未充分接觸，無法取得高導電性填劑彼此間 门导电性电磁波遮蔽效果易變得 °刀▲又:即使導電性充填劑之含量為超過700重量 、不能令導電性硬化黏接劑層之表面電阻值下降，導 2為達到飽和狀態，加上導電性黏接劑中之導電性充填 f置變得過多，導電性硬化黏接劑層對於基材膜的密黏性 和黏接力降低。 取於硬化性導電性黏接劑組成物中，在促進聚胺基甲酸酯 聚脲樹脂（A)與環氧樹脂（B)之反應、和促進環氧樹脂（B) 早獨反應之目的下，可含有硬化促進劑及/或硬化劑。作 為環氧樹脂（B)之硬化促進劑，可使用例如三級胺化合 物、膦化合物、或咪唑化合物等，作為硬化劑，可使用例 326\專利說明書(補件)\95-08\95】05378 24 如一氰胺二醯胺'碳酸肼、或酸酐等。 硬化促進劑中，作氣-你ηΛ> 剎γ作為二級胺，可列舉例如三乙胺、苄美 一曱胺、1，8-二吖雙環（5 4 〇) 土 雙環(4.3.0)壬烯m : “~7、或u…丫 _ 5寺。又’作為膦化合物，可列舉例如 二本膦、或三丁膦等。 乙基-4-曱基咪唑、2_苯基_4_甲基咪哇 2-曱基咪唑、…i 作為咪唑化合物可列舉例如 9 A- - m ^ ., 一个/土、吁 Τ签不口生、 可5丨與八t ; ^、或苯基咪唑等之咪唑化合物，更且 二/牛唑化合物與環氧樹脂反應且於溶劑中不溶化 =、或將味哇化合物封入微勝囊之類型等之改 ^性的潛在性硬化促進劑，其中亦以潛在性硬化促進劑 作為硬化劑之碳酸拼可列舉例如破王白酸胖、或己二酸耕 酸酐；。作為酸酐可列舉例如六氫苯二?酸酐、或偏苯三 3硬化促進劑或硬化劑可分別併用二種以上，且其使 Γΐΐ以合計（亦包含僅使用硬化促進劑或硬化劑之任一 曰〔兄相對於被氧樹脂（B) 100重量份’以〇.卜30 重置份之範圍為佳。 接制μ硬化性導電性黏接劑組成物在不會令導電性硬化黏 之^ 11：>之‘電性、黏接性、及/或耐焊料迴流性惡化 下士可3有石夕燒偶合劑、抗氧化劑、顏料、染料、 予树知可塑劑、紫外線吸收劑、消泡劑、勻塗調 正劑、充填劑、及/或難燃劑等。 .本發明之防電磁波性黏接膜為具有於基材膜之一表面 326\專利說明書(補件)\95挪51〇5378 25 1360386 具；硬化性導電性黏接劑層⑴作為基本構成。 擔電磁波性黏接膜賦予機械強度，並且亦 緣層的職務。作為基材膜，可 .也駚胺醯亞胺、聚 兑方女 等之夂插拥挪“ ♦乙烯硫、聚砜、或聚硫苯 ° 土胗臊。若考慮耐熱性、難姆·性、吱眷gI 聚硫苯為適於使用。 說，、丨生或費用’則以 基材膜之厚度為3〜5Mm為佳，且以5〜3〇" 於基材膜之厚戶為去、戈 ’’’、更4土 且M 又,為未滿3# m之情形中，薄膜強度降低， 矛欠。' S壬作為導電性黏接劑層之絕緣性支撐體的職 膜對於力面’於超過5G㈣之情形中，防電磁波性黏接 效果'“占附體面的凹凸追隨性降低’難以取得充分的遮蔽 又，本發明之防電磁波㈣㈣係基材 樹糊與具有二個以上環氧基之環氧樹脂⑻： 2狀硬化性樹脂組成物（ΙΠ)，即，未硬化狀態。基材膜 為此類膜狀硬化性樹脂組成物（III)時，可取得不僅呈有 =受無料料迴流的耐熱性，且不會發生因㈣焊料迴 k成…'收縮而發生捲曲的膜狀硬化樹脂組成物（IV)，故 適合作為防電磁波性黏接膜的基材。 前述膜狀硬化性樹脂組成物⑴υ所含有之含幾基聚醋 樹脂（C)為酸償為5〜4〇mgK〇H/g為佳’且以i〇〜3〇m姊诎“ 為更佳二酸價為未滿5mg_/g時，可與環氧樹脂⑻交聯 之羧基罝變少，膜狀硬化樹脂組成物（ίν)的耐焊料迴流性 有降低之傾向。另一方面，酸價為超過4〇mgK〇H/g時，膜 32价專利說明書(補件)\95-〇8\95丨05378 26 1360386 生硬化樹脂組成物（ΐγ)的柔軟性有降低之傾向。 又’聚賴脂（c)的數平均分子量（Μη)為1()_〜4咖 ，佳，且以15_〜测〇為更佳。若數平均分子量 為未滿10000’則膜狀硬化樹脂組成物（ίν)的耐埶性、 柔軟性有降低的傾向，另一方面，若超過彻⑽，於 溶劑的溶解性、或塗佈性為顯著降低，且操作困難、。、 、又，聚酯樹脂（C)的玻璃轉移溫度為1〇〜5(rc為佳，且 二:5:45。(：為更佳。若玻璃轉移溫度未滿i〇t，則膜狀硬 =月曰組成物⑽的耐熱性、或❹損性有降低之傾向， 方面’若超過5Gt，則餘硬化㈣組成物（⑺之 木軟性有降低之傾向。 如上，之聚醋樹脂⑹較佳為令含有經 =、與分子内具有三細域基之多，域或 =财取得，且前述含有料之聚_1旨（⑷可令二醇 應而取得。 （c2)或一疋駄之二烷酿（c3)反 ^二醇（cl)，可列舉例如碳數Η〗個之直鏈狀或分 支狀之脂肪族化合物的二醇’具體而言，為乙二醇、二乙 二醇、丙三醇、新戍二醇、1>2_丙二醇3 — :二醇、^戊二醇、Ut醇切基_2二，_ 丙二醇、2, 2, 4-三曱其^ q ^ 土 L 1~戊二醇、2-乙基_1, 3-己- Γ 基—1,3-丙二醇、U-壬二醇、2-甲基 辛一醇、1,4-¾己烷二甲醇、或3一 ， 碳數6〜15個之芳香族化一 土，5戊—醇、或、 化δ物的二醇，具體而言，於雙酚 27 1 2(5\專利說明書(補件)\95·〇8\95105378 ^60386 兄又鉍F加成環氧乙烷和環氧丙烷者，己二醇、氡化 脂肪族二元醇等，可考慮塗膜的硬度和可挽性而 由其中適當選擇使用。 醇（⑴反應之二元酸或二元酸酐⑽，可 么：方香族二叛酸、脂環式二㈣、脂肪族二缓酸、 双具肝。 酸 作為，香族二賴或其酐可料例如料U苯二 2,6m 二甲酸(酐）等。另外，於本說明 二納一戍本 (酐)」气气合性意指苯二甲酸和苯二甲酸酐。本-甲魷 ⑽作)為:旨二式二幾酸或其軒可列舉例如四氫苯二甲酸 匕 本二甲酸⑽)、]，4~環己烧二幾酸等。作為r 酸、：:：或酐；可列舉例如琥㈣酐 酸⑽mic Ac—ld;等一酸、癸二酸、壬二酸、海密克 作為與前述二醇（cl)反應之_ 酉子的S日化物。作為碳數卜18個之 _ 彳之垸 可列舉甲醇、乙醇、正丙醇、異丙醇、正或刀支狀的炫醇 第三丁醇、正戍醇、乙醯異丙醇、；二；丁醇、 醇、庚醇、辛醇、癸醇、十二燒醇 -/予、正己 作為二元酸之二烷酯（C3)的較佳化5入八坑醇。 甲酸、二甲基間苯二酸。“化合物為二甲基苯二 或7〇西夂酐（C2)及—疋酸之二垸酉旨⑽為考慮 遍專利說明書(補件)\95-08\95105378 28 ==,樹脂紐成物(IV)之硬度和可棱性由其中適 含有羧基之聚酯樹脂（c)可八 (c4)、與分子内且古r伽、 v具有經基之聚酯樹脂 ^ - 八一以上（較佳為3個或4個）羧美之 夕兀酸或其酐⑹反應則可取得。 W竣基之 作為分子内具有三個以上 列Λ心# _ 一 久基之夕兀酸或其酐（c5)，可 偏;例t偏本三酸(針)、均苯四甲酸⑷、或乙二醇雙(-偏本二酸酯）二酐等。 吁又I — ，，之聚S|_(c4)、與分子内具有三個以上幾基 夕兀g夂或其酐（C5)的比例，為考 土 笙而 '吞a、丄— 巧您、们者之为子置和酸價 ' 乙备決疋，以兩者反應所得之兮铲料炉wa λ 、 5~40ma^nw/ - τ 于灸水酉日樹月日（C)的酸價為 、m存去g、數平均分子量為10040000及 溫度為I0〜5rc之比例反應為佳。 破离轉私 以魏性樹脂組成物⑴。中所含有之具有二個 rnd:的％氧樹脂(D) ’可使用與前述環氧樹脂⑻ ， 質。其中’由耐熱性之觀點而言，以使用雙紛A 5•環氧樹脂和甲盼齡酸清漆型 " # — 月冰^衣乳树月日、或四（縮水甘油 .乳本基）乙烷型環氧樹脂為佳。 3有岫述水酯樹脂（c)和前述環氧樹脂（〇之膜狀硬 钱樹脂組成物（111)，在不會損害硬化所得之膜狀硬化 Μ脂組成物（IV)的耐熱性和耐彎曲性等性能之範圍下，可 3有酪二树月曰、聚石夕氧系樹脂、脲系樹脂、丙烯酸系樹脂、 聚醯胺系樹脂、或聚醯亞胺系樹脂等。 本發明之防電磁波性黏接膜所用之基材膜，含有難燃劑 29 326傳利說明書(補件)\95·08\95105378 1360386 ⑻為佳。因此’令含有聚醋樹脂(c)和環氧樹脂⑻的膜 狀硬化讎組成物(111)中含有難燃劑⑻化 為佳。 7 /、叉 難燃劑：！而言可大致分成漠系、氯系、録系、或含函 素磷酸酯糸寻之齒素系難燃劑’與氫氧化鋁、氫氧化鎂、 璃化合物、或氮化合物等之㈣素系，於本發明中可用八 知之任意的難燃劑’但近年考慮電子材料領域之㈣素： 的傾向’以使用非齒素系難燃劑作為難燃劑⑻為佳。特 佳為磷化合物系難燃劑、或氮化合物系難燃劑。 作為磷化合物系難燃劑之具體例’可列舉異丙基磷酸三 烯丙酯、三（3-羥丙基）氧化膦、伸苯基—雙（二伸二^ 苯基）磷酸酯、或2,2-雙（對-羥苯基）丙烷·三氯美^化 膦聚合物(聚合度卜3)之酚縮合物、磷酸鹽複合物； 族縮合礙酸S旨等之填酸S旨系化合物、或多碟酸錄、多^ 銨酸、，酸式碟酸丁西旨、酸式鱗酸丁氧乙酿、蜜胺碟酸鹽、 或紅填等。 又，作為氮化合物系難燃劑之具體例可列舉蜜胺、蜜 胺•氰脲酸酯、蜜白胺、蜜勒胺、或三聚二氰亞胺等之 胺衍生物。 ^ 此等難燃劑可單獨一種、或組合使用二種以上。 含有聚酯樹脂（C)和環氧樹脂的膜狀硬化性樹脂組 成物（111)及膜狀硬化樹脂組成物（IV )，因可不損宝薄膜 特性而難燃化，故以多磷酸銨與氮化合物系難燃劑^混合 物、或其複合物為更佳。 & σ 326傳利說明書(補件)\95-08\95105378 30 難燃劑（E)之含量，相對於聚醋樹脂（c)i〇〇重量份，以 5’0重曰量份為佳，且以5(M5〇重量份為更佳。含量未 滿5重量份時，難令膜狀硬化性樹脂組成物（III)及膜狀 脂組，v)難燃化。另一方面，含量多於2〇〇重 =k ’杨害作為防電磁波性黏接膜之必要膜特性的傾 向 ° ' ^，含有聚S旨樹脂（〇和環氧樹脂⑻的膜狀硬化性樹脂 :成物ini)，在不㈣膜狀硬化樹脂組成物（IV)之耐熱 ^耐弓曲性等性能之範圍下’可含有石找偶合劑、抗氧 2劑二顏料、染料、黏著料樹脂、可塑劑、紫外線吸收 V、消泡劑、勻塗調整劑、及/或充填劑等。 t ,化性導電性黏接劑組成物、及含有聚㈣脂⑹與環 乳樹脂（D)的樹脂組成物，由操作容易之觀點而言，以分 別為含有有機溶劑之液狀組成物之形態為適當，塗佈後、 ，燥刀別㈣硬化性導電性黏接劑層⑴及膜狀硬化 树脂組成物（π I)。 導電性黏接劑層⑴的形成、及含有聚酯樹脂⑹ 人壞乳㈣〇))之膜狀硬化性樹脂組成物（ιπ)的形成，可 使用通常所用之塗佈裂置進行。塗佈裳置可列舉例如，輥 2層器、模具塗層器、親塗層器、棒塗層器、照相凹版 塗層器、逆相輥塗層器、浸塗器、或刮刀塗層器等。 .作為已塗佈之塗膜的乾燥條件，以令所含溶劑充分揮 發，且硬化性導電性黏接㈣⑴及膜狀硬化 物。⑴不會硬化的條件，即，，8。〜則。…。秒鐘成5 326\專利說明書(補件)\95_〇8\95丨〇5378 3】 1360386 分鐘的條件為佳β 以 硬化性導電性點接劑層⑴的厚 8〜為更佳 ：5〜25㈣為佳，且 未滿5㈣之情形中，難令黏接劑層⑴的厚度為 力兩相成立。又#4 敝性與黏附體的密黏 接膣”私 超過25㈣之情形中，防電磁波性界 接之柔軟性降低，且有時 电磁波1·生黏 性。 、取仔7人滿足的耐彎曲When the polyaminomethyl-polyurea resin (A) 1G (B) is less than 3 parts by weight, the reflow property of the oxime resin tends to be low. Male: (1) The resistance to soldering is more than 2 parts by weight, and the column guide "there is a tendency to lower the epoxy resin (8).] The adhesion of the electrically hardened adhesive layer (1)) The curable conductive adhesive composition may contain an I-based resin, a stone resin, a urea resin, or an acrylic acid ΛV in a range that does not impair the performance such as bending resistance. , / Λ' s Ershuyue, Bin ester resin, polyamine amine tree, and / or polyimide resin, etc. ',, 326\ patent specification (supplement)\95-〇8\95105378 Further, the conductive filler 23 contained in the curable conductive adhesive composition is a conductive hardening vertical filler, and may be used as a metal filler as a conductive filler. Filling:, carbon filling agent and its mixture. Alloy powder and silver-plated steel 2: all metal powder, flux, etc. Among them, the two left-handed ancient glass fiber and carbon filled with each other are easy to fill each other. The ratio of contact is shown in Table 2: It is good, especially with filler and conductive filling: 2. ===. Shape, block, dendritic, or fibrous For example, the composition of the ball-curable conductive a-bonding agent may be based on the degree of the effect of the banding, the filming, and the broadening of the true enthalpy. The ratio of the conductive filler to the weight of the conductive filler is better than that of the 700. The content of the conductive eight-backed sputum is less than 〇 〇 weight + insufficient contact, and high-conductivity fillers cannot be obtained from each other. The door conductive electromagnetic wave shielding effect is easy to become a knife ▲ and: even if the content of the conductive filler is more than 700 weight, the surface resistance value of the conductive hardening adhesive layer cannot be lowered, and the conduction 2 is saturated, plus The conductive filler f in the conductive adhesive is excessively formed, and the adhesion and adhesion of the conductively-hardened adhesive layer to the substrate film are lowered. In the composition of the curable conductive adhesive, A curing accelerator and/or a curing agent may be contained for the purpose of promoting the reaction of the polyurethane polyurea resin (A) with the epoxy resin (B) and promoting the early reaction of the epoxy resin (B). A hardening accelerator for epoxy resin (B), for example, tertiary amination can be used. As a curing agent, a compound, a phosphine compound, or an imidazole compound, etc., can be used as an example 326\patent specification (supplement)\95-08\95]05378 24 such as cyanoamine diamine, cesium carbonate, or an acid anhydride. In the accelerator, the gas is used as a secondary amine, and examples thereof include triethylamine, benzalkoniumamine, and 1,8-dioxinbicyclo(5 4 fluorene) soil bicyclo (4.3.0). Aene m: "~7, or u...丫_ 5 temple. Further, the phosphine compound may, for example, be diphosphine or tributylphosphine. Ethyl-4-mercaptoimidazole, 2-phenyl-4-methylmorpho-2-mercaptoimidazole, ... i as an imidazole compound, for example, 9 A- - m ^ ., a / soil, Oral, 5 or 8 t; ^, or an imidazole compound such as phenylimidazole, and the di/oxazole compound reacts with the epoxy resin and is insoluble in the solvent = or encapsulates the taste compound into the microcapsule A latent hardening accelerator of a type or the like, wherein the latent hardening accelerator is also used as a hardening agent, for example, a broken white acid or adipic acid anhydride; The acid anhydride may, for example, be a hexahydrobenzene phthalic acid anhydride or a benzotriene 3 hardening accelerator or a curing agent, or two or more of them may be used in combination, and the cerium may be used in combination (including only one of a hardening accelerator or a hardening agent).曰 [Brothers relative to the oxygen resin (B) 100 parts by weight of the 〇. 卜 30 replacement parts of the range is preferred. The connection of the μ hardenable conductive adhesive composition will not make the conductive hardening ^ 11:>'s 'Electrical, Adhesive, and/or Solder Reflow Resistance Deterioration. Sergeant 3 has Shixi Burning Coupler, Antioxidant, Pigment, Dyestuff, Yushuzhi Plasticizer, UV Absorber, Defoaming Agent, leveling agent, filler, and/or flame retardant, etc. The anti-electromagnetic adhesive film of the present invention has a surface 326 on the substrate film\patent specification (supplement)\95 move 51 〇5378 25 1360386; a layer of a curable conductive adhesive layer (1) as a basic structure. The electromagnetic wave-bonding film imparts mechanical strength and is also a member of the edge layer. As a substrate film, it can also be amidoxime, The confession of the women of the redemption party, such as ethylene sulfur, polysulfone, or polythiobenzene胗臊 If considering heat resistance, refractory properties, 吱眷gI polythiobenzene is suitable for use. Said, axillary or cost 'the thickness of the substrate film is preferably 3~5Mm, and 5~ 3〇" In the case of thick film of the base film, go to 'go', more 4 soil and M, in the case of less than 3# m, the film strength is reduced, and the spear is owed. 'S壬 as a conductive adhesive In the case of the insulating surface of the insulating layer of the adhesive layer, in the case where the force surface is more than 5G (four), the anti-electromagnetic wave-adhesive effect 'the concave-convex followability of the occupied body surface is reduced', it is difficult to obtain sufficient shielding, and the prevention of the present invention Electromagnetic wave (4) (4) is a base resin paste and an epoxy resin (8) having two or more epoxy groups: a 2-shaped curable resin composition (ΙΠ), that is, an uncured state. The base film is composed of such a film-like curable resin. In the case of the material (III), it is possible to obtain a film-like cured resin composition (IV) which is not only resistant to reflow by a material, but which does not cause curling due to (4) shrinkage of the solder. A substrate for an electromagnetic wave preventing adhesive film. The film-like curable resin composition (1) contains a few The polyacetate resin (C) is preferably 5~4〇mgK〇H/g for acid and 'i〇~3〇m姊诎'. When the price of the diacid is less than 5mg_/g, it can be combined with the ring. The carboxyl group entangled by the oxygen resin (8) is less, and the solder reflow resistance of the film-like hardening resin composition (ίν) tends to be lowered. On the other hand, when the acid value is more than 4 〇 mg K 〇 H / g, the film 32 is priced. Patent Specification (Supplement)\95-〇8\95丨05378 26 1360386 The softening property of the raw resin composition (ΐγ) tends to decrease. The number average molecular weight (Μη) of the 'polylysate (c) is 1 () _ 〜 4 咖 咖 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , On the other hand, when it exceeds (10), the solubility in a solvent or a coating property is remarkably lowered, and handling is difficult. Further, the glass transition temperature of the polyester resin (C) is 1 〇 5 5 (rc is preferred, and 2: 5: 45. (: is more preferable. If the glass transition temperature is less than i 〇 t, the film is The heat resistance or the damage resistance of the hard 曰 曰 composition (10) tends to decrease, and if it exceeds 5 Gt, the composition of the after-hardening (four) composition ((7) tends to decrease the softness of the wood. As above, the polyester resin (6) is more preferable. It is preferable to have a medium, or a molecule with three fine domains, a domain or a financial asset, and the above-mentioned material contains a poly(1) ((4) can make the diol should be obtained. (c2) or a glimpse The dialkyl-grown (c3) anti-diol (cl) may, for example, be a diol having a linear or branched aliphatic compound of a carbon number, specifically, ethylene glycol or diethylene glycol. , glycerol, neodecanediol, 1 > 2 - propanediol 3 - : diol, pentanediol, Ut alcohol cleavage 2 bis, propylene glycol, 2, 2, 4-trimium L 1 ~ pentanediol, 2-ethyl_1, 3-hexyl-mercapto-1,3-propanediol, U-decanediol, 2-methyloctyl alcohol, 1,4-3⁄4 hexane dimethanol Or 3, a carbon number of 6 to 15 aromatics, 5 pentyl alcohol, or The diol of the δ substance, specifically, the bisphenol 27 1 2 (5\ patent specification (supplement)\95·〇8\95105378 ^60386 brother and 铋F addition of ethylene oxide and propylene oxide, Hexanediol, deuterated aliphatic diol, etc., can be appropriately selected and used in consideration of the hardness and the drawability of the coating film. Alcohol ((1) Reaction of dibasic acid or dibasic acid anhydride (10), can be: Fangxiang 2. Resorcinic acid, alicyclic di(tetra), aliphatic dibasic acid, double liver. Acid as, aromatic or its anhydride can be, for example, U benzene 2,6m dicarboxylic acid (anhydride), etc. The description of the two gas (anhydride) gas gasification means phthalic acid and phthalic anhydride. Ben-methyl hydrazine (10) is: the purpose of the di-di-acid or its Xuan can be cited, for example, tetrahydrobenzene Dicarboxylic acid bismuth dicarboxylic acid (10)),], 4 to cyclohexane succinic acid, etc. as r acid, ::: or anhydride; for example, succinic acid (10) mic Ac-ld; And azelaic acid and seamilk are used as the S-salt of the scorpion which reacts with the diol (cl). As a carbon number, the hydrazine is exemplified by methanol, ethanol, n-propanol and isopropanol. Hyun, knives or knives Alcohol tert-butanol, n-nonanol, ethyl isopropyl alcohol, bis; butanol, alcohol, heptanol, octanol, decyl alcohol, dodecanol-/pre, n-hexyl dialkyl ester (C3) is preferred as 5 octa alcohol. Formic acid, dimethyl isophthalic acid. "The compound is dimethyl benzene or 7 oxime oxime (C2) and - bismuth (2) In order to consider the patent specification (supplement)\95-08\95105378 28 ==, the hardness and the rigidity of the resin composite (IV) are determined by the polyester resin (c) which is suitable for the carboxyl group (c4), It can be obtained by reacting with a polyester resin in the interior of the group and having a transesterified polyester resin, a succinic acid or a phthalic acid (6). W 竣 之 具有 具有 具有 具有 具有 具有 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 分子 一 一 一 一 一 一 一 一 一 一 一 一A diol bis(-bias diester) dianhydride or the like. The ratio of S|_(c4) and the ratio of three or more bases in the molecule to its anhydride (C5) is the result of the examination of the soil. The ones are the ones and the acid price's B. The shovel wa λ, 5~40ma^nw/ - τ obtained from the reaction of the two are used in the moxibustion of the water. The ratio is preferably a ratio of m, g, number average molecular weight of 100,400,000, and temperature of I0 to 5 rc. Breaking away from the private to the Wei resin composition (1). The % oxygen resin (D)' having two rnd: contained in the material may be used in combination with the above epoxy resin (8). Among them, 'from the viewpoint of heat resistance, to use double A 5• epoxy resin and yoghurt acid varnish type"# — 月冰^衣乳树月日,或四((水糖.乳本基) An ethane type epoxy resin is preferred. 3 There is a description of the water-ester resin (c) and the aforementioned epoxy resin (the film-like hard-money resin composition (111), which does not impair the heat resistance of the film-like hardening resin composition (IV) obtained by hardening and In the range of performance such as bending resistance, the present invention may be a tyrosine, a polysulfide resin, a urea resin, an acrylic resin, a polyamine resin, or a polyimine resin. The base film used for the electromagnetic wave-proof adhesive film contains a flame retardant. 29 326. The specification (supplement)\95·08\95105378 1360386 (8) is preferred. Therefore, the polyester resin (c) and epoxy are contained. The film-like hardening enthalpy composition (111) of the resin (8) preferably contains a flame retardant (8). 7 /, a cross-linking flame retardant: can be roughly classified into a desert, a chlorine system, a recorded system, or a phosphorus-containing phosphoric acid. The ester refractory refractory agent is a refractory agent with aluminum hydroxide, magnesium hydroxide, a glass compound, or a nitrogen compound. The (4) element of the field: the tendency to use a non-dentate flame retardant as a flame retardant (8) is preferred. A flame retardant or a nitrogen compound-based flame retardant. Specific examples of the phosphorus compound-based flame retardant include triallyl isopropyl phosphate, tris(3-hydroxypropyl)phosphine oxide, and a phenyl group. a phenol condensate or a phosphate complex of bis(di-extended diphenyl)phosphate or 2,2-bis(p-hydroxyphenyl)propane·trichloromethane phosphine polymer (polymerization degree 3); a group of compounds, or a multi-disc acid record, a poly-ammonic acid, an acid-type succinic acid, an acid butyl sulphate, a melamine dish, Further, as a specific example of the nitrogen compound-based flame retardant, an amine derivative such as melamine, melamine cyanurate, melam, melem, or trimeric dicyandiamide may be mentioned. ^ These flame retardants may be used singly or in combination of two or more. The film-like curable resin composition (111) containing a polyester resin (C) and an epoxy resin, and a film-like hardening resin composition (IV) Because it can be flammable without damaging the properties of the film, it is better to use a mixture of ammonium polyphosphate and a nitrogen compound flame retardant, or a composite thereof. & σ 326 Book (supplement)\95-08\95105378 30 The content of the flame retardant (E) is preferably 5'0 by weight relative to the weight of the polyester resin (c)i, and is 5 ( It is more preferable that the content of M5 is more than 5 parts by weight, and it is difficult to make the film-like curable resin composition (III) and the film-form grease group, v) difficult to ignite. Weight = k 'Yang harm as a necessary film property of the anti-electromagnetic adhesive film ° ' ^, containing a poly-S resin (a film-like curable resin of bismuth and epoxy resin (8): the product ini), not (4) The film-like hardening resin composition (IV) can be contained in the range of heat resistance, bow resistance, etc., and can contain a stone-seeking coupler, an antioxidant 2 agent, two pigments, a dye, an adhesive resin, a plasticizer, an ultraviolet absorption V, and a consumer. A foaming agent, a leveling agent, and/or a filler. t, a chemically conductive adhesive composition, and a resin composition containing the poly(tetra)lipid (6) and the cyclic latex resin (D), each of which is a liquid composition containing an organic solvent from the viewpoint of easy handling The form is appropriate, and after application, the (4) curable conductive adhesive layer (1) and the film-like cured resin composition (π I) are dried. The formation of the conductive adhesive layer (1) and the formation of the film-like curable resin composition (ιπ) containing the polyester resin (6) human bad emulsion (4) can be carried out by using a coating crack which is usually used. The coating skirt may, for example, be a roller layerer, a die coater, a pro-coater, a bar coater, a gravure coater, a reverse phase roll coater, a dip coater, or a knife coater. Wait. The drying conditions of the applied coating film are such that the solvent contained therein is sufficiently volatilized, and the curable conductive bonding (4) (1) and the film-like cured product are obtained. (1) Conditions that do not harden, ie, 8. ~then. .... Seconds into 5 326\patent specification (supplement)\95_〇8\95丨〇5378 3] 1360386 minutes condition is better β with hardening conductive layer (1) thickness 8~ is better: 5 ～25(四) is better, and in the case of less than 5 (4), it is difficult to make the thickness of the adhesive layer (1) be two phases of force. #4 敝 与 与 黏 黏 黏 黏 膣 膣 膣 膣 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私 私

Mafiπt)t^ tf ^#m^ 的厚:為與其他素材所構成之基材成:(： "為佳，且以5為“更佳。 n以3, 導之防電磁波性黏接膜，在未設置基材膜之硬化性Mafiπt)t^ tf ^#m^ Thickness: For the substrate composed of other materials: (: " is better, and 5 is "better. n to 3, anti-electromagnetic wave bonding film , without setting the hardenability of the substrate film

二電二 =劑層⑴的面上，透過或者未透過 層，層合補強膜為佳。 有月J 二=要設置之微黏著劑層為在將防電磁波性 ㈣版_至黏附體之後，可由基材 且，重要為不污染基材膜表面。 雖為佳 有時透過硬化性導電性純㈣⑴，將防電 接膜貼附至黏附體後，對此防電磁波性黏接膜的基材： 上，再層合黏接劑層，並且實施印刷步驟。於此類情形中， 基^膜表面若被污染’則對黏接劑層的層合和印刷步驟造 成障礙’故為不佳。因此，將補強膜或附有微黏著劑層2 補強膜剝離後的基材膜表面，其重要為未經由來自補強膜 和微黏著劑之殘渣所污染。 、 326\專利說明書(補件)\95-〇8\95105378 32 1360386 另外，作為補強膜，可使用< 廉價之聚酯薄膜為適當。 一知的塑膠製膜，但以 補強膜為具有微黏著劑層時，作 著劑，可列舉含有丙烯酸系樹脂 ^微黏著層之黏 樹月旨與交聯劑的微黏著劑。將防電磁波旨或橡膠系 •情形中’使用耐熱性微黏著二於尚溫下 量45萬〜150萬之高分子量之:例如重量平均分子 為佳。 之3有丙烯酸系樹脂的黏接劑 >微黏著劑層的形成可使用盥 之情7 Ρ1样ΑΑ么Α 〃、史化f生導電性黏接劑層（I ) ==靖置進行’但並非必要令硬化性導電性 同。 々者y層之情況的塗佈方法為相 於本發明之防電磁波 層⑴，為了伴丄 膑之硬化性導電性黏接劑 取"為 而設置保護膜為佳。保護膜可使用 黏接劑層⑴之褒黏性上與硬化性導電性 1貼附亦可。。 透匕具有再剝離性之黏接劑層 j次’根據圖式’說明本發明之防電磁波性黏接膜 造方法的具體態樣。 衣 本發明之防電磁波性黏接膜為如圖}所示般， 根據包含於基材膜[2]之一表面上，透過 層合補強膜[1]的步驟、及 層u] 性黏.接劑層（I)的步驟 於前述基材膜[2]之另-表面上，層合前述硬化 i* ^t.l & 1 \ J.L· .μ τ % 326\專利說明書(補件)V95_〇8V951〇5378 33 丄 之方法則可製造。 為如圖2所 又，本發明之防電磁油H 一 艰/皮性黏接膜係詳言之 不般， 根據包含於補強膜「n [4]，並對該微黏著劑 面上設置微黏著劑層 於基材膜⑴之另；[面]上重，膜[2]的步驟、 接劑組成物，乾燥形成:料：X佈前述硬化性導電性黏 驟、及 —形成硬化性導電性黏接劑層（1)的步 丨於前述硬化性導電性斑 步驟 U生黏接劑層⑴上重疊保護膜[3]的 之方法則可製造。 更^ ’本發明之防電磁波性黏接膜為如圖3所 「艮據包含於補強膜⑴之一表面上設置微黏著劑層 ’亚㈣微黏者劑層[4]重疊基材膜[2]的步驟、 於保護膜[3]之-表面上，塗佈前述硬化性導電 组成物，乾㈣成硬純導電性黏接劑層⑴的步驟、 及 於前述硬化性導電性黏垃 电改黏接劑層⑴上，將層合前述補強 :[1]的基材膜⑴，以前述基材膜⑵與前述硬化性導電 性黏接劑層⑴接觸般重疊的步驟 ^ 之方法則可製造。 ⑹本二明,防電磁波性黏接膜’於基材膜為含有聚繼 (C)人每㈣脂⑻之膜狀硬化性樹脂組成物⑴丨）之情形 中’係如圖4所示般， 326、專利說明書(補件)\95-08\95105；378 34 根據包含於補強膜[丨] 聚醋樹脂（C)與具有二個二’將含有具有叛基之 (I⑴層的步驟、 ^成㈣硬化性樹脂組成物 化樹^成物（ΠΙ)層上，塗佈前述硬 層⑴的=，乾崎卿導獅 於前述硬化性導電性对3 步驟 4接釗層（I)上重疊保護膜[3]的 之方法則可製造。 或者，如圖5所示般， 根據包含於補強膜⑴之—表面上，將含有具有叛基之 攻酯樹脂（C)與具有-個以μ 〆 ,u ^ , 頁一個以上裱氧基之環氧樹脂（D)的硬 ⑴^脂組成物塗伟’乾燥形成膜狀硬化性樹脂組成物 (111)層的步驟、 於保護膜[3]之-表面上，塗佈前述硬化性導電性黏接 劑組成物，乾燥形成硬化性導電性黏接劑層⑴的步驟、 及 於前述硬化性導電性黏接劑層⑴上，將層合前述補強 膜[1]的膜狀硬化性樹脂組成物（1⑴層，以前述膜狀硬化 性樹脂組成物（ΠΙ)層與前述硬化性導電性黏接劑 接觸般重疊的步驟 之方法則可製造。 硬化性導電性黏接劑層（I)及膜狀硬化性樹脂組成物 326\專利說明書(補件)\95-08\95〗05378 35It is preferable to laminate the reinforced film on the surface of the second layer of the agent layer (1) with or without the transmission layer. There is a month J = the micro-adhesive layer to be set is after the anti-electromagnetic (4) version _ to the adherend, the substrate can be used, and it is important not to contaminate the surface of the substrate film. Although it is preferable to adhere the anti-electrode film to the adherend through the curable conductive pure (4) (1), the substrate of the anti-electromagnetic adhesive film is laminated, and the adhesive layer is laminated, and printing is performed. step. In such a case, if the surface of the film is contaminated, the lamination of the adhesive layer and the printing step are hindered, which is not preferable. Therefore, it is important that the surface of the base film after the reinforcing film or the reinforcing film with the microadhesive layer 2 is peeled off is not contaminated by the residue from the reinforcing film and the micro-adhesive. 326\Patent specification (supplement)\95-〇8\95105378 32 1360386 In addition, as the reinforced film, an inexpensive polyester film can be used as appropriate. A plastic film is known, but when the reinforcing film is a micro-adhesive layer, a micro-adhesive containing a viscous layer of an acrylic resin and a cross-linking agent may be mentioned. In the case of anti-electromagnetic wave or rubber system, it is preferable to use a heat-resistant micro-adhesive to a high molecular weight of 450,000 to 1.5 million at a temperature of, for example, a weight average molecule. 3 Adhesives with Acrylic Resin> The formation of a micro-adhesive layer can be used. 7 Ρ 1 ΑΑ ΑΑ 〃 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史 史However, it is not necessary to make the hardening conductivity the same. The coating method in the case of the y layer is the anti-electromagnetic wave layer (1) of the present invention, and it is preferable to provide a protective film for the sclerosing conductive adhesive. The protective film may be adhered to the curable conductive layer 1 by using the adhesive layer (1). . A specific aspect of the method for producing an electromagnetic wave preventing adhesive film of the present invention will be described by referring to the adhesive layer having re-peelability j times 'according to the drawing'. The anti-electromagnetic adhesive film of the present invention is as shown in FIG. The step of the adhesive layer (I) is performed on the other surface of the substrate film [2], and the aforementioned hardening i*^tl & 1 \ JL· .μ τ % 326\patent specification (supplement) V95_ 〇8V951〇5378 33 丄The method can be manufactured. As shown in Fig. 2, the anti-electromagnetic oil H of the present invention is inferior to the hard-adhesive film, according to the reinforcing film "n [4], and the micro-adhesive surface is provided. The adhesive layer is on the other side of the base film (1); the [surface] is heavy, the step of the film [2], the composition of the adhesive, and drying are formed: the material: the X-ray hardenable conductive adhesive, and the formation of the hardened conductive The method of the adhesive layer (1) can be manufactured by the method of superposing the protective film [3] on the U-adhesive layer (1) in the step of the curable conductive spot. Further, the anti-electromagnetic viscosity of the present invention The film is as shown in Fig. 3, "the micro-adhesive layer is provided on one surface of the reinforcing film (1), and the sub-layer (4) micro-adhesive layer [4] is superposed on the substrate film [2], and the protective film is [3]. On the surface, the step of applying the curable conductive composition, dry (iv) into a hard pure conductive adhesive layer (1), and the layer of the curable conductive adhesive layer (1) The reinforcing film: [1] the base film (1) can be formed by a method in which the base film (2) is overlapped with the curable conductive adhesive layer (1). (6) The present invention, in the case where the base film is a film-like curable resin composition (1) which contains a poly(C) human per (iv) grease (8), is shown in Fig. 4 General, 326, patent specification (supplement) \95-08\95105; 378 34 according to the step of containing the reinforcing film [丨] polyester resin (C) and having two two's will contain the rebel (I (1) layer , (4) a hardened resin composition on the layer of the chemical layer (ΠΙ), coated with the hard layer (1) =, the dry squid guide lion overlaps the aforementioned hardenable conductivity on the 3 step 4 interface layer (I) The method of the protective film [3] can be manufactured. Or, as shown in Fig. 5, according to the surface contained on the surface of the reinforcing film (1), the ester-containing resin (C) having a rebel base and the 〆, u ^ , page of more than one oxime epoxy resin (D) hard (1) ^ grease composition Tu Wei 'dry to form a film-like curable resin composition (111) layer, in the protective film [3] a step of applying the curable conductive adhesive composition on the surface, drying the curable conductive adhesive layer (1), and the hardenability guide In the electroconductive adhesive layer (1), a film-like curable resin composition (1 (1) layer of the above-mentioned reinforcing film [1] is laminated, and the film-like curable resin composition (ΠΙ) layer and the curable conductive adhesive are adhered The method of the step of overlapping the contact of the contact agent can be manufactured. The curable conductive adhesive layer (I) and the film-like curable resin composition 326\patent specification (supplement)\95-08\95〗 05378 35

丄JUUJOU Π⑴的硬化條件為貼附至黏 力，並於12(M7(TC下in 外加卜3MPa的壓 u卜10〜50分鐘為佳。 本發明之防電磁波性黏 的早如邮讲 ，接版之製造方法為於萝笋牛驟 的早期階段，經㈣基㈣ :以步驟 得耐彎曲性優良之薄的 保士則亦可輕易取 之防電磁波性黏接膜。 …·Ό-、有優良性能 使用本發明之防電磁 般，侧 m占接膜之情況為如圖6所示 由依序層合含有補強膜[1]、 微黏著劑層[4]、 基材膜[2 ]、 硬化性導電性黏接劑層（I)、及 保護膜[3 ] =電磁波性黏接膜中，剝離出保護膜⑶，並將已露出 上硬化性導電性黏接劑層⑴重疊至黏附體[5 ]之表面且 =黏’加熱壓黏，令前述硬化性導電性黏接劑層⑴硬化 作成導電性硬化黏接劑層⑴)後， 劑層[4]共同剝離之態樣。 」/、祕黏者 或者，例如圖7所示般，可採用 由依序層合含有補強膜[1 ]、 含有具㈣之聚g旨樹脂⑹與環氧樹脂⑼ 性樹脂組成物（111)層、 更化 前述硬化性導電性黏接劑層（I)、 及保護膜[3 ] 326\專利說明書(補件)\95_〇8\95105378 36 之防電磁波性黏接 的硬化性導電性為 相出保護膜[3] ’並將已露出 貼黏，加熱厂« ίΓ、層⑴重叠至黏附體⑸之表面且 及前述硬化性導電：：：= 大硬化性樹脂組成物⑴I)層 強膜⑴V電性硬化純劑層（⑴後，將補 作為可貼黏本發明之防電磁 表例可列舉例如，承总舌> ^ . 按胰之黏附肢，其代 為其他之黏附體，s=nr挽性印刷佈線板。作 [實施例] w舉例如硬式印刷佈線板。 但本發明並 及「％」為分 其次，示出實施例進一步詳細說明本發明 非被其所限定。於實施例及比較例中，「份 別意指「重量份」及「重量 另卜曰貝靶例中δ己載之聚胺基甲酸醋聚脲樹脂的重量平 f分子i L樹脂的數平均分子量，為以哪測定所 ·:出之換算成聚笨乙烯的重量平均分子量、及數平均分子 ! ’ GPC測定之條件為如下。 衣置.Shodex GPC System-21(昭和電工製） 笞柱.Shodex KF-802、KF-803L、 溶劑 (昭和電工製）之合計3根連結使用。 四氫呋喃丄JUUJOU Π(1) The hardening condition is attached to the adhesive force, and is preferably 12 (M7 (TC) in addition to the pressure of 3 MPa, 10 to 50 minutes. The anti-electromagnetic adhesive of the present invention is as early as the postal address. The manufacturing method of the version is in the early stage of the roasting of the radish, and the (four) base (four): the thin-layered baker with excellent bending resistance can also easily take the anti-electromagnetic adhesive film. ...·Ό-, Excellent performance using the anti-electromagnetic method of the present invention, the side m occupies the film as shown in Fig. 6 by sequential lamination containing the reinforced film [1], the micro-adhesive layer [4], the substrate film [2], hardening Conductive adhesive layer (I), and protective film [3] = electromagnetic wave adhesive film, peeling off protective film (3), and overlapping exposed hardenable conductive adhesive layer (1) to adherend [ 5] The surface of the surface of the surface layer is viscous and the pressure-sensitive adhesive layer (1) is hardened to form the conductively-curable adhesive layer (1), and the layer [4] is peeled off together. For example, as shown in Fig. 7, it is possible to use a reinforced film [1], a polyg resin (6) containing a (4) layer, and an epoxy tree. (9) Resin composition (111) layer, the above-mentioned curable conductive adhesive layer (I), and protective film [3] 326\patent specification (supplement)\95_〇8\95105378 36 The hardenable conductivity of the adhesive bond is the phase-out protective film [3] 'and will be exposed and adhered, the heating plant « Γ , the layer ( 1 ) overlaps the surface of the adherend ( 5 ) and the aforementioned hardenable conductive :::= Resin composition (1) I) layer strength film (1) V electric hardening pure agent layer ((1), after supplementation as an anti-electromagnetic case of the present invention, for example, a fulcrum tongue> ^. According to the adhesion of the pancreas, The invention is another adhesive body, s=nr pull-up printed wiring board. [Examples] For example, a hard printed wiring board is used. However, the present invention and "%" are second, and the embodiment is shown in further detail to explain the present invention. It is not limited by them. In the examples and comparative examples, "parts means "parts by weight" and "the weight of the y-loaded polyurethane urethane polyurea resin in the target of the mussel target. The number average molecular weight of the i L resin, which is measured by the weight of the polystyrene The average molecular weight and the number average molecular weight are as follows: 'The conditions of the GPC measurement are as follows. Clothing set. Shodex GPC System-21 (made by Showa Denko). Shodex KF-802, KF-803L, solvent (made by Showa Denko) Root link use. Tetrahydrofuran

流速：1. 0亳升/分鐘 溫度：40°C 試料濃度：0. 3重量％ 326\專利說明書(補件)\95-08\95105378 37 j36〇386 試料注入量：1 〇 〇微升 [聚胺基曱酸S旨聚腺樹脂（a )之合成] 《合成例1》 於具備攪拌機、溫度計 '迴流冷卻器、滴 氣導入管的反應容器中，裝入由己二酸盥裳置、及氮 甲基—U5-戊二醇所得之數平均分子量二酸與 .「Mn」）1 006之二醇414份、二羥甲基丁^ ^下，稱為 酮二異氰酸酯145份、及曱苯4。份 ；:二佛爾 -C反應3小時。於所得之產物中，加入甲下: 扮終端具有異她旨基之胺基甲酸乙酿預聚物的溶液。1 次，於㈣爾_二胺27份、二正丁胺3份、2_丙醇如 份、及"576份之混合物中，添加所得之 預聚物溶液816份，並於7(rc反應3小時，取得重旦： 均分子量(以下，稱為「Mw」）為54，_之聚胺基甲：醋 聚脲樹脂的溶液。於此樹脂溶液中’加入曱苯144份、及 2-:醇72份’取得固形成,分3〇%之聚胺基曱酸酯聚脲樹 脂溶液（A -1)。 《合成例2》 於具備攪拌機、溫度計、迴流冷卻器、滴下裝置、及氮 氣導入管的反應容器中’裝入由己二酸與3_甲基]，5 —戊 二醇及，1，6-己烷碳酸酯二醇所得之二醇（Mn=98i )39〇 份、一經曱基丁酸i 6份、異佛爾嗣二異氮酸酿】58份、 及甲苯40份，並於氮氣環境下以9〇。。反應3小時。於所 付之產物中，加入甲苯3〇〇份，取得終端具有異氰酸酯基 32(3\專利說明書(補件)\95-08\95105378 38 1360386 ψ 之胺基甲酸乙酿預聚物溶液。其次，於異佛爾嗣二胺Μ 份、一正丁胺3份、2-丙醇342份、及甲苯576份之混合 物中，添加所得之胺基甲酸乙酯預聚物溶液814份，並於 70 C反應3 j ，取得聚胺基甲酸酯聚脲樹脂〇〇〇) 溶液。於此樹脂溶液中，加入甲苯144份、及2-丙醇72 份，取得固形成分30%之聚胺基曱酸酯 (A-2)。 +腺樹脂溶液 《合成例3》 ♦於具備授拌機、溫度計'迴流冷卻器、滴下裝置、及氮 氣導入管的反應容器t，裝入由己二酸與3_甲基—丨，5_^ 二醇所得之二醇（Mn = l〇〇2)352份、二羥曱基丁酸32份、 異佛爾酮二異氰酸酯176份、及甲苯4〇份，並於氮氣環 境下以90 C反應3小時。於所得之產物中，加入甲苯3〇〇 份，取得終端具有異氰酸酯基之胺基曱酸乙酯預聚物的溶 液。其次，於異佛爾酮二胺32份、二正丁胺4份、2一丙 籲醇342份、及甲苯576份之混合物中，添加所得之胺基曱 酸乙酯預聚物溶液810份，並於7〇r反應3小時，取得 聚胺基曱酸酯聚脲樹脂（Mw=35,〇〇〇)的溶液。 液中，加入甲苯⑷份、及2-丙醇72份，取得固 30%之聚胺基甲酸酯聚脲樹脂溶液（A一3)。 《合成例4》 於具備稅拌機、溫度計、迴流冷卻器、滴下裝置、及氮 氣導入管的反應容器中’裝入由己二酸與3_曱基_丨5一戊 一醇及1,6-己院碳酸酯二醇所得之二醇（Mn=9gi )432 326\專利說明書(補件)\95-〇8\951〇5378 39 丄360386 .份、異佛爾酮二異氰酸酯137份、及甲苯4〇份，並於氮 .，環境下以9(TC反應3小時。於所得之產物中’加入^ 笨300份’取得終端具有異氰酸酯基之胺基曱酸乙酷預聚 物溶液。其次’於異佛爾酮二胺25份、二正丁胺3份、 2—丙醇342份、及曱苯576份之混合物中，添加所得:胺 基甲酸乙酯預聚物溶液818份，並於70°C反應3小時， 取得聚胺基甲酸酯聚脲樹脂（Mw=48, 〇〇〇)溶液。於此樹脂 =液中，加人曱苯144份、及2_丙醇72份，取得固二二 分30%之聚胺基曱酸酯聚脲樹脂溶液（A_4)。 [聚S旨樹脂（c )的合成] 《合成例5》 於具備攪拌機、溫度計、氮氣導入管及迴流脫水裝置之 乂瓶中裂入對本一酸二曱醋184.4份、新戊二醇μ 8 1刀、乙二醇94· 2份、2-曱基-1，3-丙二醇54. 7份及乙酸 辞0.035份。將原料加熱熔融且若可攪拌則開始攪拌，並Flow rate: 1.0 liters per minute Temperature: 40 ° C Sample concentration: 0.3% by weight 326\Patent specification (supplement)\95-08\95105378 37 j36〇386 Sample injection amount: 1 〇〇 microliter [ "Synthesis Example 1" is a synthetic reaction container containing a stirrer, a thermometer 'reflux cooler, and a drip gas introduction tube, and is placed in a reaction container filled with adipic acid adipate, and The number average molecular weight diacid obtained from nitrogen methyl-U5-pentanediol is 414 parts of the diol of "Mn") 006, and dimethylol butyl group is called ketone diisocyanate 145 parts, and benzene. 4. Parts;: Two-Four-C reaction for 3 hours. To the obtained product, a solution of a urethane prepolymer having a different base was added. 1 time, adding 816 parts of the obtained prepolymer solution to a mixture of 27 parts of (tetra)-diamine, 3 parts of di-n-butylamine, 2 parts of 2-propanol, and "576 parts, and 7 (rc) After reacting for 3 hours, a solution having a weight average molecular weight (hereinafter referred to as "Mw") of 54, a polyaminomethyl group: acetal polyurea resin was added, and 144 parts of toluene were added to the resin solution, and 2 -: 72 parts of alcohol - a solid amino acid phthalate polyurea resin solution (A -1) having a solid content of 3 % by weight. "Synthesis Example 2" is provided with a stirrer, a thermometer, a reflux cooler, a dropping device, and In the reaction vessel of the nitrogen gas introduction tube, 'the diol (Mn=98i) obtained by adipic acid and 3-methylidene, 5-pentanediol and 1,6-hexane carbonate diol was charged 39 parts, After 6 parts of thioglycolic acid i, 7 parts of isophora diisoxamic acid, and 40 parts of toluene, and 9 Torr under nitrogen atmosphere, the reaction was carried out for 3 hours. Toluene was added to the product. 3 parts, obtain the terminal amino acid prepolymer solution with isocyanate group 32 (3\patent specification (supplement)\95-08\95105378 38 1360386 。. Secondly, in the same place 814 parts of the obtained urethane prepolymer solution were added to a mixture of an amine oxime, 3 parts of n-butylamine, 342 parts of 2-propanol, and 576 parts of toluene, and reacted at 70 C for 3 j. Polyurethane polyurea resin 〇〇〇) solution. In this resin solution, 144 parts of toluene and 72 parts of 2-propanol were added to obtain a polyamino phthalate (A-2) having a solid content of 30%. + gland resin solution "Synthesis Example 3" ♦ In a reaction vessel t equipped with a mixer, a thermometer 'reflux cooler, a dropping device, and a nitrogen introduction tube, charged with adipic acid and 3-methyl-hydrazine, 5_ ^ diol diol (Mn = l 〇〇 2) 352 parts, dihydroxy fluorenyl butyric acid 32 parts, isophorone diisocyanate 176 parts, and toluene 4 〇, and under nitrogen atmosphere at 90 C The reaction was carried out for 3 hours. To the obtained product, 3 parts of toluene was added to obtain a solution of an amino-based decanoic acid ethyl ester prepolymer having an isocyanate group. Secondly, 32 parts of isophorone diamine and di-n-butyl 810 parts of a mixture of 4 parts of amine, 342 parts of 2-propenyl alcohol, and 576 parts of toluene were added, and 810 parts of the obtained amino phthalate prepolymer solution was added, and 7 〇r was added. A solution of polyamino phthalate polyurea resin (Mw = 35, hydrazine) was obtained in 3 hours. To the solution, toluene (4) parts and 72 parts of 2-propanol were added to obtain a 30% solid polyamine group. Formate polyurea resin solution (A-3). "Synthesis Example 4" was charged with adipic acid and 3_ in a reaction vessel equipped with a tax mixer, a thermometer, a reflux cooler, a dropping device, and a nitrogen introduction tube. Glycols derived from thiol_丨5-pentanol and 1,6-hexyl carbonate diol (Mn=9gi) 432 326\patent specification (supplement)\95-〇8\951〇5378 39 丄360386 Parts, 137 parts of isophorone diisocyanate, and 4 parts of toluene, and reacted with 9 (TC) for 3 hours under nitrogen. To the obtained product, 'addition of 300 parts' was carried out to obtain a solution of an amino phthalic acid prepolymer having an isocyanate group at the terminal. Next, in a mixture of 25 parts of isophorone diamine, 3 parts of di-n-butylamine, 342 parts of 2-propanol, and 576 parts of toluene, 818 parts of the obtained: ethyl urethane prepolymer solution was added. The mixture was reacted at 70 ° C for 3 hours to obtain a solution of a polyurethane polyurea resin (Mw = 48, hydrazine). In the resin = liquid, 144 parts of toluene and 72 parts of 2-propanol were added to obtain a 30% solid polyamine phthalate polyurea resin solution (A_4). [Synthesis of Poly S-Resin (c)] [Synthesis Example 5] In a crucible equipped with a stirrer, a thermometer, a nitrogen gas introduction tube, and a reflux dehydration device, 184.4 parts of the original acid diterpenoid vinegar and a neopentyl glycol μ 8 were cleaved. 1 part, ethylene glycol 94·2 parts, 2-mercapto-1,3-propanediol 54.7 parts and acetic acid words 0.035 parts. The raw material is heated and melted, and if it can be stirred, stirring is started, and

鳙將餾出之甲醇於常壓下排出反應系統外且歷3小時由HQ C慢慢升溫至220T：為止，並於220X：保持1小時。將内 溫暫時冷卻至17〇°C為止，加入己二酸92. 6份、間苯二 酸65. 8份、及1，4-環己烷二羧酸113. 6份，並將餾出之 水於常壓下排出反應系統外且歷3小時升溫至2401為 止’再於240 °C保持’並繼續反應直到產物的酸價為 15mgKOH/g 為止。 其次’將裝置更換成真空減壓裝置，加入鈦酸四丁酿 〇. 06份，並於24(TC之溫度2 Torr之減壓下繼續反應6 326\專利說明書(補件)\95-〇8\95105378 40 1360386 小時後’於聚氟乙烯樹脂製之容器中取出。 度聚她旨的數平均分子量為18刚，玻璃轉移溫 接著將所侍之聚酯樹脂各1 〇〇份放入三個燒瓶中， 別加入曱¥ 1GG份溶解。其次於各個燒瓶中分別 轉=苯三酸二肝5份（C-U、1〇_ - 2)、及15份（(：一3—) 之^里’且於1 〇(TC之溫度反應5小時。反應終了後’以 釋，仔固形成分為4〇%之含有羧基之聚酯樹脂溶 液（C-l)、（C-2)、及（c-3)。 旦树月曰令液（c-i)之樹脂酸價為14mgK〇H/g，數平均分子 置為24000，玻璃轉移溫度為29。〇。 樹脂溶液α-2)之樹脂酸價為3_斷，數 置為22000，玻璃轉移溫度為28。〇。 旦樹脂溶液（C-3)之樹脂酸價為41mgK〇H/g，數平均分子 1為20000，玻璃轉移溫度為。 《合成例6》 於具備攪拌機、溫度計、氮氣導入管及迴流脫水裝置之 燒瓶中，裝入對笨二酸二曱酯238 6份、新戊二萨“ 9 份、乙二醇91.4份、2—甲基_U_丙二醇53〇份子及乙酸 鋅0.035份。將原料加熱熔融且若可攪拌則開始攪拌，並 將鶴出之曱醇於常壓下排出反應系統外且歷3小時由17〇 C慢慢升溫至22(TC為止，並於22(rc保持丨小時將内 =暫時冷卻至170°C為止，加入間苯二酸114.8份^/，4_ %己烷二羧酸11 〇. 2份，並將餾出之水於常壓下排出反應 326\專利說明書(補件)\95-08\95105378 41 1^60386 系統^卜且歷3小時升溫至24(TC為止，再於24(TC保持， 並繼續反應直到產物的酸價為15n]gK〇H/g為止。 其次，將裝置更換成真空減壓裝i，加人欽酸四丁酿 〇. 06伤並灰240 c之溫度2 Torr之減壓下繼續反應e 小日才後，於聚氟乙烯樹脂製之容器中取出。 1 9000 ’玻璃轉移溫 所付之♦ g旨樹脂的數平均分子量為 度為45°C。 接者，將所得之聚酯樹脂各1〇〇份放入三個燒瓶中，分 別加入曱本1GG份溶解4次於各個燒瓶中分別添加偏苯 二酸二酐2份(C-4)、4份(C-5)、及12份(&quot;)之份量， 且於1 00 C之溫度反應5小時。反應終了後，以曱苯稀釋， 取得固形成分為4G%之含有㈣之聚S旨樹脂溶液（C-4) ' (C-5)、及（C-6) 〇 數平均分子 數平均分子 曰樹脂溶液（C-4)之樹脂酸價為llmgK〇H/g， 量為1 9000，玻璃轉移溫度為47t：。 _树脂溶液（C—5)之樹脂酸價為25mgK0H/g， 置為1 9000，玻璃轉移溫度為46。〇。 曰对如洛液（C-6)之樹脂酸價為68mgK〇H/g，數平均分子 量為1 8000，玻璃轉移溫度為仙它。 《合成例7》 於具備攪拌機、溫度計、氮氣導入管及迴流脫水裝置之 燒瓶中’裝人對苯：酸二甲§旨238 6份、新戊二醇Μ 9 ::乙二醇91.4份、2-甲基-1，3-丙二醇53.0份及乙酸 •辛0.035伤。將原枓加熱炫融且若可㈣則開始授掉，並 326\專利說明書(補件)\95-08\95105378 42 1360386 將鶴出之曱醇於常壓下排出反應系統外且歷3小時由l7〇 C慢慢升溫至220°C為止’並於22(TC保持1小時。將内 溫暫時冷卻至17(TC為止，加入間苯二酸丨丨4. 8份及丨，4_ %己烷二羧酸Π 0. 2份，並將餾出之水於常壓下排出反應 系統外且歷3小時升溫至24(TC為止，再於24(TC保持， 並繼縯反應直到產物的酸價為15mgK〇H/g為止。 其次’將裝置更換成真空減壓裝置，加入鈦酸四丁酉旨 〇. 06伤，並於240 C之溫度2 Torr之減壓下繼續反應6 =時後，加入甲苯300份，取得固形成分為4〇%之聚酯樹 脂的溶液（c_7)。樹脂溶液（c-υ之樹脂酸價為2mgK0H/g， 數平均分子1為1 9000，玻璃轉移溫度為45。〇。 《實施例1》 相對於聚胺基曱酸醋聚脲樹脂溶液（A_1 )333份，加入 =酚A型裱氧樹脂（JapanEp〇xyResin製「邱1⑶奴828」、 環氧當量=189g/eQ)20份，取得黏接樹脂組成物。 ^ =樹脂組成物353份，加入片狀銀粉（福田金屬落粉 卜AgXF-301」）18〇份並且擾摔混合，取得硬化性 V電性黏接劑組成物。 j次對作為補強膜之厚丨125&quot;的聚對苯 二 酉曰膜（Unichica 製「SA-125PPT \ ro 一 哭，脾i 士 4 &amp; 」），使用微照相凹版塗佈 。。將具有耐熱性之微黏著劑（東洋油黑制 「βρςππ 、、Λ 果手油墨製造公司製 &amp; 」以# m之厚度（乾燥膜厚）塗佈，y，形士 微黏著劑層〇針料·斑装节丨Μ 專乙Jh形成 耆剐層對❹耆劑層，將作為基 的聚硫苯膜（東麗萝「丁㈦。· 0 &lt;与度 專利說明書(補件)\95·_5】〇5378 本m果^ ToIerina 3〇3〇」）層合，取得厚度 43 1360386 .l36±5# m之補強膜與基材膜的層合體。 .^於所侍之則述層合體的基材膜（聚硫苯膜）面，將先前所 /于之更化/ 生$电性黏接劑組成物，使用科馬塗佈器塗佈成 1 之厚度（乾燥膜厚），乾燥，製作防電磁波性黏接膜。 《實施例2》 相對於聚胺基甲酸醋聚服樹脂溶液（a_2)333份，加入 雙齡A型環氧樹脂（JapanEp〇xy 製「邮⑽⑽」、 ，氧當量，g/eq)1()份、微粉碎二氣胺二醯胺⑴卿 poxy ReSln 製「Epicure DICY7」）〇 7 份、及味嗤系硬 化促進副（味之素Flne Techno製「⑼一⑼」）0 1份，取 得黏接樹脂組成物。相對於此黏接樹脂組成物343.8份， 加入片狀銀粉（福田金制粉工業製 卜 並授掉混合，取得硬化” t性純賴成物。 其，’對作為補強膜之厚度的聚對苯二酸乙二 〇=製「SA_125PET」），使用微照相凹版塗佈 ^BPS552'5 ^ ^ ^ #J ^ ^ ^ 11 1 ^ ^ 51 ^ ㈣英卞1 2㈣之厚度（乾燥膜厚）塗佈，乾燥形成 ㈣者韻。對微”劑層，將作為 的聚硫笨膜（東麗製「了—綱」層合，子取； 136±5/zmi補強膜與基材膜的層合體。 予又 ，所得之前述層合體的基材膜(聚硫苯膜)面，將先前所 Γ硬Γ广二電性點接劑組成物，使用科馬塗佈器塗佈成 ;==Γ膜厚)，乾燥，製作防電磁波性黏接膜 326傳利說明書(補件)\95-〇8\95】〇5378 44 1360386 .⑪除了使用表1及表2所示之種類及份量之聚胺基曱酸酯 .二脲樹脂溶液、環氧樹脂及片狀銀粉以外，重複實施例！ .記載之操作，調製各種之硬化性導電性點接劑組成物，製 作防電磁波性黏接膜。 、 《實施例12》 相對於聚酯樹脂溶液（C_1)25〇重量份，將加入四〔縮水 =油氧苯基）乙烷型環氧樹脂（Japan Ep〇xy Resm製 「Epic〇at 1〇31」、環氧當量19〇g/eq)1〇重量份、及多二 隹酉夂叙系難燃劑（Cl ient Japan製「Exol i t AP422」）50重 1份之樹脂組成物溶液，於作為補強膜之一表面上經脫模 處理之厚度50/ζιη之聚對苯二酸乙二酯膜的脫模處理面 上，以科馬塗佈器，塗佈成厚度2〇//m(乾燥膜厚），乾燥， 形成膜狀硬化性樹脂組成物層，取得補強膜與膜狀硬化性 樹脂組成物的層合體。 於所得之前述層合體之膜狀硬化性樹腊組成物層上，同 鲁實施例1處理，將使用表2所示種類及份量之聚胺基甲酸 酯聚脲樹脂溶液、環氧樹脂及片狀銀粉所調製之硬化性導 電性黏接劑，使用科馬塗佈器塗佈成13//m之厚度（乾燥 膜厚），乾燥’製作防電磁波性黏接膜。 《實施例13》 除了相對於聚酯樹脂溶液（C-2)250重量份，加入四（縮 水甘油氧苯基）乙烧型環氧樹脂（japan Ep〇xy Resin製 「Epicoat 1031」、環氧當量190g/eq)2()重量份、及多磷 酸銨系難燃劑（Client Japan製「Exolit AP423」）50重 326傳利說明書(補件)\95-〇8\95105378 45 丄柳386 里伤取付硬化性樹脂組成物之溶液以外m复實施例 κ記載之操作，製作防電磁波性黏接膜。 《實施例14》 除了相對於聚酯樹脂溶液（C-3)250重量份，加入四（縮 f甘油氧苯基）乙烷型環氧樹脂〇apan Ep〇xy Resin製The distilled methanol was discharged from the reaction system under normal pressure and slowly heated from HQ C to 220 T: for 3 hours, and held at 220 X: for 1 hour. 6份, and distilling off the internal temperature, the internal temperature is temporarily cooled to 17 ° C, adding adipic acid 92.6 parts, 66.3 parts of isophthalic acid, and 11. 6 parts of 1,4-cyclohexanedicarboxylic acid. The water was discharged from the reaction system under normal pressure and heated to 2,401 over 3 hours to 'remain at 240 ° C' and the reaction was continued until the acid value of the product was 15 mgKOH/g. Next, 'replace the device into a vacuum decompression device, add tetrabutyl titanate. 06 parts, and continue the reaction at 24 (TC temperature 2 Torr decompression 6 326\patent specification (supplement)\95-〇 8\95105378 40 1360386 After the hour, take it out in a container made of polyvinyl fluoride resin. The number average molecular weight of the polymer is 18, and the glass transfer temperature is then placed in the third of the polyester resin. In the flasks, do not add 曱¥1GG parts to dissolve. Secondly, in each flask, respectively, 5 parts of glycerol trimellia (CU, 1〇_-2), and 15 parts ((:1-3)) 'And at 1 〇 (TC temperature reaction for 5 hours. After the end of the reaction) to release, the solids formed into 4% by weight of the carboxyl group-containing polyester resin solution (Cl), (C-2), and (c-3 The acid value of the resin of Danshu Yueling Liquid (ci) is 14mgK〇H/g, the number average molecular weight is set to 24000, and the glass transition temperature is 29. 〇. The resin acid price of resin solution α-2) is 3_ The number of breaks was set to 22,000, and the glass transition temperature was 28. 〇 The resin acid value of the resin solution (C-3) was 41 mg K 〇 H / g, the number average molecule 1 was 20,000, and the glass transition temperature was . <<Synthesis Example 6>> In a flask equipped with a stirrer, a thermometer, a nitrogen introduction tube, and a reflux dehydration device, 2286 parts of diammonium benzoate, 9 parts of neopentazone, 91.4 parts of ethylene glycol, and 2 were charged. - Methyl _U_propylene glycol 53 oxime and 0.035 parts of zinc acetate. The raw material is heated and melted, and if it can be stirred, stirring is started, and the cuminol is discharged from the reaction system under normal pressure for 3 hours from 17 〇. C slowly warmed up to 22 (TC), and at 22 (rc kept 丨 hours, inside = temporarily cooled to 170 ° C, added isophthalic acid 114.8 parts ^ /, 4_% hexane dicarboxylic acid 11 〇. 2 And distill the distilled water under normal pressure to discharge the reaction 326\patent specification (supplement)\95-08\95105378 41 1^60386 system ^ b and heat up to 24 (TC until 3, then 24 ( The TC is kept, and the reaction is continued until the acid value of the product is 15n]gK〇H/g. Next, the device is replaced with a vacuum decompression device i, and the human acid is tetrazed. The temperature of the wound and the gray 240 c After the reaction was continued under a reduced pressure of 2 Torr, e was taken out in a container made of polyvinyl fluoride resin. 1 9000 'The temperature of the glass transfer was ♦ g for the resin The average molecular weight is 45 ° C. Next, one part of the obtained polyester resin is placed in three flasks, and 1 GG portion of sputum is added and dissolved four times in each flask to separately add terephthalic acid. An amount of 2 parts (C-4), 4 parts (C-5), and 12 parts (&quot;) of the anhydride, and reacted at a temperature of 100 C for 5 hours. After the reaction is finished, it is diluted with benzene to obtain a solid component. The resin acid value of 4% by weight of the poly(S) resin solution (C-4) '(C-5), and (C-6) number average molecular number average molecular oxime resin solution (C-4) llmgK〇H/g, the amount is 1 9000, and the glass transition temperature is 47t:. The resin acid value of the resin solution (C-5) was 25 mg K0H/g, set to 1 9000, and the glass transition temperature was 46. Hey. The acid value of the resin of the ruthenium (C-6) is 68 mg K 〇 H / g, the number average molecular weight is 1 8000, and the glass transition temperature is sen. <<Synthesis Example 7>> In a flask equipped with a stirrer, a thermometer, a nitrogen gas introduction tube, and a reflux dehydration device, 'p-benzoic acid: 238 parts of dimethyl sulphate, 91.4 parts of neopentyl glycol Μ 9 :: ethylene glycol, 53.0 parts of 2-methyl-1,3-propanediol and 0.035 of acetic acid. The original sputum is heated and smelted and if it can be (4), it is started to be given, and 326\patent specification (supplement)\95-08\95105378 42 1360386 The saponin of the crane is discharged from the reaction system under normal pressure for 3 hours. Slowly raise the temperature from l7〇C to 220°C' and keep it at 22°C for 1 hour. Temporarily cool the internal temperature to 17 (TC, add bismuth isophthalate 4. 8 parts and 丨, 4_% 2 parts of alkanedicarboxylic acid hydrazine, and the distilled water is discharged from the reaction system under normal pressure and heated to 24 (TC until 3 hours), and then maintained at 24 (TC, and the reaction is continued until the acid of the product The price is 15mgK〇H/g. Next, replace the device with a vacuum decompression device, add tetrabutyl strontium titanate. 06 injury, and continue the reaction at a temperature of 240 C at a pressure of 2 Torr. 300 parts of toluene was added to obtain a solution (c_7) of a polyester resin having a solid content of 4% by weight. The resin solution (c-υ resin acid value was 2 mg K0H/g, the number average molecule 1 was 1 9000, and the glass transition temperature was 45. [Example 1] With respect to 333 parts of the polyamine phthalic acid acetal polyurea resin solution (A_1), phenol type A oxime resin ("Eg xyxy" made by Japan Ep〇xyResin (Qi 1 (3)) 828", epoxy equivalent = 189g / eQ) 20 parts, the composition of the adhesive resin was obtained. ^ = 353 parts of the resin composition, adding flake silver powder (Fukuda metal powder powder AgXF-301)) 18 parts and disturbed Mixing and obtaining a composition of a sclerosing V-electrode adhesive. j-times as a reinforced film of a thick 丨125&quot; poly-p-benzoquinone film (Unichica "SA-125PPT \ ro a cry, spleen i 4 &amp ;"), using micro-gravure gravure coating. The heat-resistant micro-adhesive ("Tony Oil Black" "βρςππ, Λ 手 手 油墨 制造 & 涂 涂 涂 涂 # # # # # # # # # # # # # # # # # # Cloth, y, shape, micro-adhesive layer, 〇 料 · 斑 斑 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ 丨Μ &lt;and patent specification (supplement)\95·_5】〇5378 this m fruit ^ ToIerina 3〇3〇") lamination, to obtain a thickness of 43 1360386 .l36 ± 5 # m reinforced film and substrate film layer In the case of the base film (polythiobenzene film) surface of the laminated body, the composition of the substrate is modified or previously made. The Koma applicator was applied to a thickness of 1 (dry film thickness) and dried to prepare an electromagnetic wave preventing adhesive film. [Example 2] 333 parts of the polyurethane resin solution (a_2) was added. Two-year-old type A epoxy resin ("Email (10) (10)", Japan Ep〇xy, oxygen equivalent, g/eq) 1 () parts, finely pulverized diamine, acetaminophen (1), poxy ReSln "Epicure DICY7") 〇7 In part, and the miso-promoting-promoting side ("(9)-(9)") made by Ajinomoto Flne Techno, 0 parts were obtained, and the adhesive resin composition was obtained. With respect to 343.8 parts of the adhesive resin composition, flake silver powder was added (the Fukuda gold powder industry was prepared and the mixture was mixed and hardened). The t-pure pure lysate was formed, which was a pair of the thickness of the reinforced film. Ethylene phthalate = "SA_125PET"), coated with micro-gravure coating ^BPS552'5 ^ ^ ^ #J ^ ^ ^ 11 1 ^ ^ 51 ^ (4) inch 1 2 (four) thickness (dry film thickness) coated Cloth, dry to form (four) rhyme. For the micro-agent layer, a polysulfide-based film will be used as a polysulfide film (a combination of Toray's "Oss", a sub-layer; a laminate of a 136±5/zmi reinforced film and a substrate film. The base film (polythiobenzene film) surface of the composite body is coated with a composition of the previously used hard and wide electric double-pointing agent, coated with a Koma applicator; == Γ film thickness), dried, and made to prevent Electromagnetic wave adhesive film 326 Chuanli Manual (supplement)\95-〇8\95]〇5378 44 1360386 .11 In addition to the types and amounts of polyamine phthalate esters and diureas shown in Tables 1 and 2 Repeat the examples except for the resin solution, epoxy resin and flake silver powder! In the operation described, various curable conductive dot compositions are prepared to form an electromagnetic wave preventing adhesive film. [Example 12] Four (shrinkage = oil oxyphenyl) ethane type epoxy resin ("Epic〇at 1" manufactured by Japan Ep〇xy Resm) was added to 25 parts by weight of the polyester resin solution (C_1). 31", epoxy equivalent 19 〇g/eq) 1 〇 by weight, and a bismuth-based flame retardant ("Exol it AP422" manufactured by Client Japan) 50 parts by weight of a resin composition solution, The release surface of the polyethylene terephthalate film having a thickness of 50/ζηη which was subjected to release treatment on one surface of the reinforced film was coated to a thickness of 2 Å/m by a Koma applicator. The film thickness was dried and dried to form a film-like curable resin composition layer, and a laminate of a reinforcing film and a film-like curable resin composition was obtained. On the obtained film-like curable resin wax layer of the above-mentioned laminate, the same as the treatment of Example 1, the type and amount of the polyurethane polyurea resin solution shown in Table 2, epoxy resin and The curable conductive adhesive prepared by the flaky silver powder was applied to a thickness of 13/m (dry film thickness) using a Koma applicator, and dried to prepare an electromagnetic wave preventing adhesive film. [Example 13] In addition to 250 parts by weight of the polyester resin solution (C-2), tetrakis(glycidoxyphenyl)-ethylenic epoxy resin (Epicoat 1031, manufactured by japan Ep〇xy Resin) was added. Equivalent 190 g/eq) 2 () parts by weight, and ammonium polyphosphate-based flame retardant (Exolit AP423, manufactured by Client Japan) 50 326 transcript (supplement)\95-〇8\95105378 45 丄柳386 The electromagnetic wave-proof adhesive film was produced by the operation described in Example κ except for the solution of the curable resin composition. [Example 14] In addition to 250 parts by weight of the polyester resin solution (C-3), a tetrakis (triglyceride oxyphenyl) ethane type epoxy resin 〇apan Ep〇xy Resin was added.

Epicoat 1 031」、環氧當量j 9〇g/eq) 1 5重量份、及多石舞 馱銨系難燃劑（CBC製「C-30」）1〇〇重量份取得硬化性樹 脂組成物之溶液以外，為重複實施例12記載之操作，製 _作防電磁波性黏接膜。 《貫施例15》 除了相對於聚酯樹脂溶液（c_4 )250重量份，加入四（縮 水甘油氧苯基）乙烷型環氧樹脂（Japan Ep〇xy Resin製 「Epicoat 1031」、環氧當量i90g/eq)10重量份、及多磷 酸錢系難燃劑（CBC製「060」）70重量份取得硬化性樹脂 經成物之溶液以外，為重複實施例12記載之操作，製作Epicoat 1 031", epoxy equivalent j 9 〇g/eq) 15 parts by weight, and a multi-stone ammonium-based flame retardant (C-30 "C-30") 1 part by weight to obtain a curable resin composition In addition to the solution, the operation described in Example 12 was repeated to prepare an electromagnetic wave preventing adhesive film. <<Example 15>> In addition to 250 parts by weight of the polyester resin solution (c_4), a tetrakis(glycidoxyphenyl)ethane type epoxy resin (Epicoat 1031, Japan Ep〇xy Resin, epoxy equivalent) was added. I90 g/eq) 10 parts by weight and 70 parts by weight of a polyphosphoric acid-based flame retardant ("GC", "060") were obtained by repeating the operation described in Example 12 except that a solution of the curable resin was obtained.

防電磁波性黏接膜 《實施例16》 除了相對於聚酯樹脂溶液（C-5)250重量份，加入雙酚A 型環氧樹脂（Japan Epoxy Resin 製「Epicoat 828」、環 氡當量=189g/eq)10重量份取得硬化性樹脂組成物之溶液 以外’為重複實施例12記載之操作，製作防電磁波性黏 Λ 接膜。 《實施例17》Anti-electromagnetic wave-adhesive film "Example 16" In addition to 250 parts by weight of the polyester resin solution (C-5), a bisphenol A type epoxy resin ("Epicoat 828" manufactured by Japan Epoxy Resin, 氡 氡 equivalent = 189 g) was added. /eq) 10 parts by weight of the solution of the curable resin composition was obtained. In the operation described in the repeated Example 12, an electromagnetic wave preventing adhesive film was produced. Example 17

除了相對於聚g旨樹脂溶液（C-1)250重量份，加入雙酌· A 326傳利說明書(補件)\95-08\95105378 46 1360386 •型環氧樹脂（Japan Ep0xy Resin 製「Epic〇at 1〇〇2」、環 氧當量=65〇g/eQ)20重量份取得硬化性樹脂組成物之溶液 、卜為重複只施例12記載之操作，製作防電磁波性黏 • 接膜。 — 《實施例18》 除了相對於聚酯樹脂溶液（(&gt;1 )25〇重量份，加入甲酚 酚醛清漆型環氧樹脂（大曰本油墨化學工業製此 ^695」、環氧當量=218g/eq)1()重量份取得硬化性樹脂組 籲成物之溶液以外，為重複實施例12記載之操作，製作防 電磁波性黏接膜。 《比較例1》 除了使用表3所示種類及份量之聚胺基曱酸酯聚脲樹 月曰/谷液環氧树脂及片狀銀粉以外，為重複實施例1記載 之操作，調製硬化性導電性黏接劑組成物，製作防電磁波 性黏接膜。 《比較例2》 除了使用表3所示種類及份量之聚胺基曱酸酯聚服樹 脂溶液、環氧樹脂、片狀銀粉、微粉碎二氰胺二醯胺、及 咪唑系硬化促進劑以外，為重複實施例2記載之操作，調 製各種硬化性導電性黏接劑組成物，製作防電磁波性黏接 膜。 '《比較例3》 將含有羧基之腈丁二烯橡膠（日本Zeon製「Nip〇le 1 072J」、結合丙烯腈量27. 0%、門尼黏度48)100份、雙 326傳利說明書(補件)\95-08\95105378 47 •私=型壞氧樹脂rEpic〇at 828」2〇〇份、微粉碎二氛胺 .―®监胺 Uapan Epoxy Resin 製 rEpicure DICY7」）14 份 ^咪唑系硬化促進劑(味之素Fine Techno t「Amicure '制N 40」）2份混合，並於曱苯中以固形成分3⑽般溶解， 4作黏接樹脂組成物。相對於此接黏樹脂組成物333份， 加入片狀銀粉「AgXF_3G1」15〇份並攪拌混合，取得硬化 性導電性黏接劑組成物。 使用所得之硬化性導電性黏接劑組成物，同實施例i處 理製作防電磁波性黏接膜。 《比較例4》 广於具備攪拌機、溫度計、迴流冷卻器、滴下裝置、及氮 氣導入管之反應容器中，裝入丙烯酸丁酿95〇份、丙烯 份、乙酸乙酷163·〇份、及2,2，一偶氮雙異丁腈。〇6 知，並將此反應容器内之空氣以氮氣更換。 、，一邊攪拌此反應溶液，一邊於氮氣環境下升溫至8〇艽， 籲並反應9小時。反應終了後，添加曱苯”份，取得固形 成分30%之丙烯酸樹脂溶液。In addition to 250 parts by weight of the poly-resin resin solution (C-1), a double-prepared A 326 patent specification (supplement)\95-08\95105378 46 1360386 • Epoxy resin ("Epic made by Japan Ep0xy Resin") 〇 at 1 〇〇 2", epoxy equivalent = 65 〇 g / eQ) 20 parts by weight of a solution of the curable resin composition, and the operation described in the same manner as in Example 12 was repeated to prepare an electromagnetic wave preventing adhesive film. - "Example 18" A cresol novolac type epoxy resin (manufactured by Otsuka Ink Chemical Industry Co., Ltd.) was added in addition to 25 parts by weight of the polyester resin solution ((&gt;1), epoxy equivalent = An electromagnetic shielding adhesive film was prepared by repeating the operation described in Example 12 except that a solution of the curable resin group was obtained in an amount of 1 part by weight of 218 g/eq). Comparative Example 1 In addition to the types shown in Table 3 In addition to the amount of the polyamino phthalate polyurea polystyrene tree/gluten epoxy resin and the flake silver powder, the composition described in Example 1 was repeated to prepare a composition of the curable conductive adhesive to prepare electromagnetic wave resistance. Adhesive film. Comparative Example 2 In addition to the types and amounts of polyamine phthalate coating resin solution shown in Table 3, epoxy resin, flake silver powder, finely pulverized dicyanamide diamide, and imidazole In addition to the hardening accelerator, various curable conductive adhesive compositions were prepared by repeating the operation described in Example 2 to prepare an electromagnetic wave preventing adhesive film. "Comparative Example 3" A nitrile butadiene rubber containing a carboxyl group ( Japan's Zeon "Nip〇le 1 072J", combined The amount of acrylonitrile is 27.0%, the Mooney viscosity is 48), 100 parts, and the double 326 is approved (repair)\95-08\95105378 47 • Private = type of oxy-resin resin rEpic〇at 828" 2 parts, micro 2 parts of the imidazole-based hardening accelerator (Ajinomoto Fine Techno t "Amicure 'N 40") was mixed in two parts, and was smashed with sulphuric acid amine, "U-pan Epoxy Resin". The solid component was dissolved as 3 (10), and 4 was used as a binder resin composition. To the 333 parts of the adhesive resin composition, 15 parts of the flake silver powder "AgXF_3G1" was added and stirred and mixed to obtain a curable conductive adhesive composition. Using the obtained curable conductive adhesive composition, an electromagnetic wave preventing adhesive film was produced in the same manner as in Example i. "Comparative Example 4" is widely used in a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser, a dropping device, and a nitrogen gas introduction tube, and is filled with 95 parts of acrylic acid, propylene, ethyl acetate 163, and 2 , 2, an azobisisobutyronitrile. 〇6 know and replace the air in the reaction vessel with nitrogen. While stirring the reaction solution, the temperature was raised to 8 Torr under a nitrogen atmosphere, and the reaction was allowed to react for 9 hours. After the completion of the reaction, a portion of toluene was added to obtain an acrylic resin solution having a solid content of 30%.

於此丙烯酸樹脂溶液333份中，加入雙酚A (㈣。at 82、微粉碎二氰胺二醯胺‘二To 333 parts of the acrylic resin solution, bisphenol A ((iv). at 82, finely pulverized dicyanamide diamine)

DjCY7)〇.7份、及咪唑系硬化促進劑（Ainicure 份，取得黏接樹脂組成物。相對於此黏接樹脂組成物 份，加入片狀銀粉「AgXF-301」166份並攪拌混合，取得 硬化性導電性黏接劑組成物。 使用所得之硬化性導電性黏接劑組成物，重複實施例！ -32&lt;Λ 專利說明書(補件)\95-08\95105378 4〇DjCY7) 7.7 parts, and an imidazole-based hardening accelerator (Ainicure part, obtained as a binder resin composition. 166 parts of flake silver powder "AgXF-301" was added to the adhesive resin composition, and the mixture was stirred and mixed. The composition of the curable conductive adhesive. The obtained hardenable conductive adhesive composition is used, and the embodiment is repeated! -32&lt;Λ Patent Specification (Replenishment)\95-08\95105378 4〇

記裁之操作， 《比較例5》 製作防電磁波性黏接膜。 除了使用聚醋樹脂 施例12記載之操作， 《比較例6》 浴液（C-6)250重量份以外 製作防電磁波性黏接膜。 除了使用聚酯樹脂溶液（c〜7)25〇 施例12記載之操作’製作防電磁兑 重量份以外， 性黏接膜。 重複實 重複實 326\專利說明書(補件)\95-08\95105378 49 1360386 〔！&lt;〕 CD At) 厂-i -i CO CO CO 1 EP828 I § &gt; Η g 1—^ 實施例8 1 &lt; CO CO CO EP828 § 實施例7 CO 4： CO CO CO I EP828 g m &lt;3) 〇〇 &lt;ο LO 實施例6 1 ( CO CO CO EP1031 C5 r—i LO ζ〇 1 &lt; 1 1 λ 實施例5 〇〇 CO CO CO N695 CZ&gt; i 1 LO ς〇 S Η s 實施例4 1 &lt; CO CO CO EP1002 S § τ &lt; s 實施例3 CO &lt; CO CO CO EP828 瑞 S F« 1 Η &lt;3&gt; LO t—H 實施例2 CNI CO CO CO EP828 〇 C— CZ3 r~H d CO CO ， 4 g 實施例1 CO CO CO | EP828 | 媸 § s τ—H 種類 重量份| 種類 重量扮 重量份| 重量份I 重量份 /-~N 1—^ ¥r 聚胺基曱酸酯聚脲樹脂溶液 環氧樹脂 DICY PN-40 |AgXF-301 相對於黏接樹脂100份之比例 010 ooz.£sollo6\so-s\fffii)_KJ 縮 π«Γ»\9ζε 1360386Recording operation, "Comparative Example 5" An anti-electromagnetic wave bonding film was produced. An electromagnetic shielding adhesive film was produced in addition to 250 parts by weight of the bath (C-6) of Comparative Example 6 except that the operation described in the Example 12 was used. The adhesive film was prepared in addition to the operation described in Example 12 using a polyester resin solution (c to 7) 25 to prepare an electromagnetic shielding weight. Repeat the actual repeat 326\patent specification (supplement)\95-08\95105378 49 1360386 〔! &lt;] CD At) Plant-i -i CO CO CO 1 EP828 I § &gt; Η g 1 -^ Example 8 1 &lt; CO CO CO EP828 § Example 7 CO 4: CO CO CO I EP828 gm &lt; 3) 〇〇 &lt;ο LO Example 6 1 (CO CO CO EP1031 C5 r-i LO ζ〇1 &lt; 1 1 λ Example 5 〇〇CO CO CO N695 CZ&gt; i 1 LO ς〇S Η s Implementation Example 4 1 &lt; CO CO CO EP1002 S § τ &lt; s Example 3 CO &lt; CO CO CO EP828 SF « 1 Η &lt;3&gt; LO t-H Example 2 CNI CO CO CO EP828 〇C—CZ3 r~H d CO CO , 4 g Example 1 CO CO CO | EP828 | 媸§ s τ—H Type of parts by weight | Type of weight allowance | Parts by weight I Parts by weight /-~N 1—^ ¥r Polyamine Base phthalate polyurea resin solution epoxy resin DICY PN-40 | AgXF-301 relative to 100 parts of adhesive resin 010 ooz. £sollo6\so-s\fffii)_KJ ππΓ»\9ζε 1360386

〔z&lt;〕 實施例18 CO CO CO I ΕΡ828 I § CZ? 〇〇 τ—1 CD L〇 實施例17 1—^ -i CO CO CO 1 ΕΡ828 I § S ι 1 實施例16 1 ( CO CO CO ΕΡ828 | S Τ—^ s ι l 實施例15 » 1 CO CO CO ΕΡ828 CZ5 〇〇 s T—H 實施例14 1— ^ CO CO CO | ΕΡ1031 | 〇 Τ'·Η § Τ—1 s T—( 實施例13 CO CO CO Ν695 〇 τ—^ § t—^ s l—H 實施例12 1 i Jc CO CO CO ΕΡ1001 碟 〇 〇〇 s ι 1 實施例11 1 1 CO CO CO ΕΡ828 CZ3 CO cz? s 實施例10 i Η CO CO CO | ΕΡ828 | 碟 CD to CO cz&gt; 另 1種類ι 1重量份| 1種類| 重量份1 |重量 重量份 |重量份ι y—i 聚胺基甲酸酯聚脲樹脂溶液 環氧樹脂 DICY ΡΝ-40 |AgXF-301 黏接樹脂10 0份之比例 。52忘甶001犮^“迴萆碱聆铼袈苺鋈鉍IS智»-硇绪£4衾寂羿长&lt; (* isooz-esl S6\ooo-S6\ip}紫)»K:a^Dwr#\9(Ne i36〇386 [表3][z&lt;] Example 18 CO CO CO I ΕΡ 828 I § CZ? 〇〇τ-1 CD L〇 Example 17 1—^ -i CO CO CO 1 ΕΡ828 I § S ι 1 Example 16 1 (CO CO CO ΕΡ828 | S Τ—^ s ι l Example 15 » 1 CO CO CO ΕΡ 828 CZ5 〇〇s T—H Example 14 1— ^ CO CO CO | ΕΡ1031 | 〇Τ'·Η § Τ—1 s T—( Example 13 CO CO CO Ν695 〇τ—^ § t—^ sl—H Example 12 1 i Jc CO CO CO ΕΡ1001 Disc s ι 1 Example 11 1 1 CO CO CO ΕΡ828 CZ3 CO cz? s Implementation Example 10 i Η CO CO CO | ΕΡ 828 | Disc CD to CO cz&gt; Another type 1 ι 1 parts by weight | 1 type | Parts by weight 1 | Weight by weight | Parts by weight y y-i Polyurethane polyurea resin Solution epoxy resin DICY ΡΝ-40 | AgXF-301 bonding resin 10 parts ratio. 52 forget 甶 犮 犮 “ “ “ “ “ “ “ “ “ “ “ 鋈铋 鋈铋 硇 硇 硇 硇 £ £ £ £ £ £ £ £ £ £ £ £ £ £ £ £ £ £ ; (* isooz-esl S6\ooo-S6\ip}紫)»K:a^Dwr#\9(Ne i36〇386 [Table 3]

聚胺基甲酸酯聚脲樹脂溶液 %乳樹脂 種類 比較例1 比較例 比較例 比較例 種類 333 333 333 333 EP828 EP828 EP828 EP828Polyurethane Polyurea Resin Solution % Latex Resin Type Comparative Example 1 Comparative Example Comparative Example Comparative Example Type 333 333 333 333 EP828 EP828 EP828 EP828

100份的比例。 ♦以下示出表1〜表3中的簡號。 EP828又紛A型環氧樹脂（】叩抓Ep0Xy Resin製「Epicoat 828」、環氧當量=189§/叫） EP1 002 ’雙酷A型環氧樹脂（Japan Epoxy Resin製 「Ep1Coat 1〇〇2」、環氧當量=65〇g/eQ) EP1031 ·四（縮水甘油氧笨基）乙烷型環氧樹脂（Japan100 copies. ♦ The short numbers in Tables 1 to 3 are shown below. EP828 has a type A epoxy resin (] 叩Ep0Xy Resin made "Epicoat 828", epoxy equivalent = 189§ / call) EP1 002 'Double cool A type epoxy resin (Japan Epoxy Resin made "Ep1Coat 1〇〇2" "Epoxy equivalent = 65 〇g / eQ) EP1031 · Four (glycidyloxy phenyl) ethane type epoxy resin (Japan)

Epoxy Resin 製「Epicoat 1〇31」、環氧當量 190g/eq) N695 :甲紛g分酸清漆型環氧樹脂（大日本油墨化學工業製 「Epiclone N-695」、環氧當量=2i8g/eq) DICY .彳放粉碎一氰胺二酿胺（】叩抓Ep〇Xy Resjn製 厂 Epicure DICY7」） PN-40 :。米唾系硬化促進劑（味之素以⑽Techn〇製 「PN-40」）Epoxy Resin "Epicoat 1〇31", epoxy equivalent 190g/eq) N695: A gel acid varnish type epoxy resin (Epiclone N-695, manufactured by Dainippon Ink Chemical Industry Co., Ltd., epoxy equivalent = 2i8g/eq DICY. 粉碎 粉碎 一 一 一 一 二 ( ( ( ( ( E E E E E E E E E E E E E E E E E E E E E E E E E E E Rice saliva hardening accelerator (Ajinomoto is made by (10) Techn〇 "PN-40")

AgXF-301 :片狀銀粉（福田金屬箔粉工業製「AgXF_3〇1」） [物性評估] 對於實施例及比較例所得之附有補強膜之防電磁波性 326傳利說明書(補件)\95-08\95105378 52 1360386 黏接膜， 彎曲性、 表4〜6。 以下列方法評估聚醯亞胺膜黏接性、 及導電性硬化黏接劑層的表面電阻率 耐熱性、耐 。結杲示於 (1)聚醯亞胺膜黏接性之評估 準備見10咖及長度7〇_之防電磁 硬化性導電性黏接5()/接&amp;並於其 (東麗·紅扣為心之聚酿亞胺膜 么 5 4「Capt〇n 200EN」）以 150〇C、l.〇MPa、 癱條件下壓黏，令硬純導電性黏接劑層、及 ^使用作為基材之硬化性膜狀樹脂組成物層硬化。 C去補強膜或附有微黏著劑層之補強膜，並於 對濕度50%之環境下，以拉伸速度5Wmin進 =剝㈣驗。測定導電性硬化黏接劑層與㈣亞胺膜之 (:::接力’並將其中心值視為聚醯亞胺膜黏接強度 (2 )耐熱性之評估AgXF-301: flake silver powder ("AgXF_3〇1" manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.) [Physical property evaluation] Anti-electromagnetic wave with reinforced film obtained in Examples and Comparative Examples 326 Chuanli Manual (supplement)\95 -08\95105378 52 1360386 Adhesive film, bendability, Tables 4 to 6. The adhesion of the polyimide film and the surface resistivity of the conductively hardened adhesive layer were evaluated by the following methods. The knot is shown in (1) The evaluation of the adhesion of the polyimide film is shown in 10 coffee and the length of 7 〇 _ anti-electromagnetic hardening conductive bonding 5 () / pick &amp; and in it (Dong Lihong The crucible imide film 5 4 "Capt〇n 200EN" is pressed at 150 ° C, l. 〇 MPa, 瘫, so that the hard pure conductive adhesive layer, and ^ use as a base The hardenable film-like resin composition layer of the material is hardened. C to reinforced film or a reinforced film with a micro-adhesive layer, and in the environment of 50% humidity, at a tensile speed of 5Wmin into the stripping test. Determination of the conductivity hardening adhesive layer and (4) imine film (::: Relay' and its center value as the adhesion strength of the polyimide film (2) Evaluation of heat resistance

(2-1)外觀變化 準備寬10mm及長度60mm之防電磁波性黏接膜，並於其 硬化性導電性黏接劑層’將厚度為5〇# m之聚醯亞胺膜 (東麗•杜邦公司製「Capt〇n2〇〇EN」）以15〇t、i〇Mpa、 及3 0刀釦之條件下壓黏，令導電性黏接劑層及視需要使 用作為基材之硬化性膜狀樹脂組成物層硬化。 G 4後，除去補強膜或附有微黏著劑層之補強膜，並以 180°C之電爐加熱處理3分鐘，其次以28〇τ：之電爐加熱 處理90秒鐘。以目視觀察加熱處理後之試料外觀，評估 326\專利說明書(補件)\95-08\95105378 53 八2、汙起、及剝離等之外觀不良。 c次試驗’以發生外觀不良 U.未發生外觀不良 Λ:發生外觀不良為2次以内 χ .發生外觀不良為3次以上 (2~2)彎曲率 為轉膜之硬Μ導電性黏接劑層，將厚度 # m之聚酿亞胺膜（東麗 以 15〇〇C、1 MPa、及训八於邦 A 口1 衣 CaPt〇n 200EN」） 電性越桩1·丨β 刀”里之條件下壓黏’令硬化性導 級成物層硬化。 吏用作為基材之硬化性膜狀樹脂 ，黏，，除去補強膜或附有微黏著劑層之補強膜， 复，四邊為lGGmm ’並以l8(rc之電爐加熱處理3分鐘， ’、-人以280 C之電爐加熱處理9〇 里 將力物後之試料，即，加熱處理後之圖^ 膜m及聚酿亞胺膜[7]之試料，放置H纽黏接 圖8中之長度[’並由下式⑴計算彎曲率。 弓曲率=[(lO〇-L)/l〇〇]xi〇〇(%) 式 Q) 又，關於使用厚度為75_之聚酿亞㈣ = =„」)作為聚酿亞胺膜之情況亦進： 評估基準為如下所示。 〇：彎曲率為未滿5% △:彎曲率為5%以上、未滿20% 326\專利說明書(補件)\95-08\95〗05378 54 1360386 X :彎曲率為2〇%以上 (3)耐彎曲性之評估 ^寬6顧及長度120_之防電磁波性黏接膜 电性黏接劑層，於另外製作之可撓性 化導 ^之聚酿亞胺膜上，形成厚度12J:二板(於厚度 電路圖型，再於電路H创上/入12_之銅㈣構成的 i料②路圖型上，層合时黏接劑之厚 ㈣之保護膜所構成的佈線板)之保護膜面上 二 MPa、及3G分鐘之條件壓黏，令硬化 、 及:=使用作為基材之硬化性膜狀樹脂組:=層 率=3Γ補強膜或附有微黏著劑層之補強膜，以曲 ；：t 3 4重5〇0克、及速度⑽次/分鐘之條杜 =ΜΠ彎曲試驗機’並且根據電路 ： 數評估耐彎曲性。 ~正I -人 評估基準為如下。 〇：1 0 0 0次以上 △ . 5 0 0次以上、未滿1 〇 〇 〇次 .X ·未滿5 0 0次 ⑷導電性硬化黏接劑層之表面電阻率的評估 準備寬50麵及長度80_之防電磁波性黏接膜， :=導剝離處理之耐熱性聚酯膜； a，分鐘之條編，令 電性黏接劑層及視f要使用作為基材之硬化性 膜狀樹脂組成物層硬化。 326、專利說明書(補件)\95-08\95】05378 壓黏後’除去經剝離處理之耐熱性以旨膜，令導電性硬 55 1360386 化黏接劑層露出。使用三菱化學製「Rorester GP」之 探針探測器’測定此導電性硬化黏接劑層的表面電 评估基準為如下。 年 〇：未滿ΙΟΟιηΩ/口 △ · lOOmQ/□以上、未滿 2〇〇πιΩ/π χ : 200πιΩ/□以上(2-1) Appearance change An anti-electromagnetic adhesive film with a width of 10 mm and a length of 60 mm is prepared, and a poly-imide film having a thickness of 5 μm is formed in the layer of the curable conductive adhesive layer (Toray • DuPont's "Capt〇n2〇〇EN" is pressed at 15 〇t, i〇Mpa, and 30 knives to make the conductive adhesive layer and, if necessary, a hardened film as a substrate. The resin composition layer is hardened. After G 4 , the reinforcing film or the reinforcing film with the microadhesive layer was removed, and heat-treated in an electric furnace at 180 ° C for 3 minutes, and then heated in an electric furnace at 28 ° C for 90 seconds. The appearance of the sample after the heat treatment was visually observed, and the appearance of the 326\patent specification (supplement)\95-08\95105378 53 8.2, the stain, and the peeling were evaluated. In the c-tests, the appearance was poor. U. No appearance defects occurred. The appearance defects were less than 2 times. The appearance defects were 3 times or more (2~2). The bending rate was the hard conductive conductive adhesive. Layer, the thickness of # m of the polyimide film (Toray to 15 〇〇 C, 1 MPa, and training eight in the A mouth 1 clothing CaPt〇n 200EN)) Electrically more piled 1·丨β knife Under the condition of pressure-bonding, the hardenable conductive layer is hardened. The sturdy film-like resin used as the substrate is adhered, and the reinforcing film or the reinforcing film with the micro-adhesive layer is removed, and the four sides are lGGmm. 'And the l8 (rc electric furnace heat treatment for 3 minutes, ', - people in a 280 C electric furnace heat treatment 9 〇 Li will be the sample after the heat, that is, after the heat treatment ^ film m and polyimine film [7] The sample is placed, and the H-bond is placed in the length of Figure 8 [' and the bending rate is calculated by the following formula (1). Bow curvature = [(lO〇-L) / l〇〇] xi〇〇 (%) Formula Q In addition, as for the use of a polyaniline film having a thickness of 75 Å (=) (=), the evaluation criteria are as follows. 〇: Bending rate is less than 5% △: Bending rate is 5% or more, less than 20% 326\Patent specification (supplement)\95-08\95〗 05378 54 1360386 X: Bending rate is 2% or more ( 3) Evaluation of bending resistance ^ Width 6 with a length of 120_ anti-electromagnetic adhesive film electrical adhesive layer, formed on the flexible conductive polyimide film formed separately, to a thickness of 12J: The second board (in the thickness circuit diagram type, and then the circuit H is created/into 12_ copper (four) composed of the i-material 2-way pattern, the thickness of the bonding agent when laminated (4) the wiring board formed by the protective film) The protective film has a pressure of 2 MPa and 3 G minutes to make the hardening, and: = use of a hardened film-like resin group as a substrate: = layer rate = 3 Γ reinforced film or reinforced film with a micro-adhesive layer , to 曲;:t 3 4 weight 5 〇 0 gram, and speed (10) times / minute of the Du = ΜΠ bending test machine 'and according to the circuit: number to evaluate the bending resistance. ~正I - person The evaluation criteria are as follows. 〇: 1 0 0 or more times △ . 5 0 0 or more, less than 1 〇〇〇 times. X · less than 50,000 times (4) Evaluation of the surface resistivity of the conductively hardened adhesive layer is prepared to be 50 wide And anti-electromagnetic adhesive film of length 80_, := heat-resistant polyester film with peeling treatment; a, minute strip, make electrical adhesive layer and view to use as hardening film of substrate The resin composition layer is hardened. 326, patent specification (supplement) \95-08\95] 05378 After pressure bonding, the heat resistance of the peeling treatment is removed to make the conductive film 55 1360386. The surface electrical evaluation standard of this conductive hardened adhesive layer was measured using a probe detector of "Rorester GP" manufactured by Mitsubishi Chemical Corporation as follows. Year 〇: Not full ΙΟΟιηΩ/口 △ · lOOmQ/□ or more, less than 2〇〇πιΩ/π χ : 200πιΩ/□ or more

326\專利說明書(補件)\95-08\95105378 56 1360386 !&gt;&lt;〕 實施例9 CO 一 〇 &lt;] 〇 〇 〇 實施例8 CO CO 〇 &lt;3 〇 〇 &lt;3 實施例7 〇〇 oi 〇 &lt;3 〇 〇 〇 實施例6 寸 CO 〇 &lt; 〇 〇 〇 實施例5 LO CO 〇 &lt;] 〇 〇 〇 實施例4 〇〇 CO 〇 〇 〇 〇 實施例3 CD CO 〇 &lt;] 〇 〇 〇 實施例2 〇〇 csi 〇 &lt; 〇 〇 〇 實施例1 CO CO 〇 &lt; 〇 〇 〇 對於聚醯亞胺膜之黏接力（N/cm) 外觀變化 50仁m聚醯亞胺使用時之彎曲率 75/zm聚醯亞胺使用時之彎曲率 耐彎曲性 表面電阻率 对熱性326\Patent Specification (Supplement)\95-08\95105378 56 1360386 !&gt;&lt;〕 Example 9 CO 〇&lt;] 〇〇〇Example 8 CO CO 〇&lt;3 〇〇&lt;3 Example 7 〇〇 oi 〇 &lt; 3 〇〇〇 Example 6 inch CO 〇 &lt; 〇〇〇 Example 5 LO CO 〇 &lt;] 〇〇〇 Example 4 〇〇CO 〇〇〇〇 Example 3 CD CO 〇 &lt;] 〇〇〇Example 2 〇〇csi 〇&lt; 〇〇〇Example 1 CO CO 〇&lt; 黏 adhesion to polyimine film (N/cm) Appearance change 50 仁Bending rate when imine is used 75/zm, bending rate when using polyimide, bending resistance, surface resistivity, heat

IS S卜 es 156\80-6\(迕-)_盔盔-鲰\93 1360386IS S Bu es 156\80-6\(迕-)_Helmet-鲰\93 1360386

5J 實施例18 CO 0 〇 〇 〇 〇 實施例17 CO CO 〇 〇 〇 〇 實施例16 LO CO &lt; 〇 〇. 〇 〇 實施例15 CO CO 〇 〇 〇 〇 〇 實施例14 οα CO 〇 〇 〇 〇 〇 實施例13 CO 〇 〇 〇 〇 〇 實施例12 CO CO 〇 〇 〇 〇 〇 實施例11 CI5 〇 &lt;1 〇 &lt;] 〇 實施例10 οο CNl 〇 &lt;] 〇 &lt; 〇 對於聚醯亞胺膜之黏接力（N/cm) 外觀變化 50 y m聚醯亞胺使用時之彎曲率 75 //m聚醯亞胺使用時之彎曲率 耐彎曲性 表面電阻率 而十熱性 oos 8z.rogIS6\oo0-s6\ff}ii)*6&amp;縮忘鲰\93£ 1360386 [表6]5J Example 18 CO 0 〇〇〇〇 Example 17 CO CO 〇〇〇〇 Example 16 LO CO &lt; 〇〇. 〇〇 Example 15 CO CO 〇〇〇〇〇 Example 14 οα CO 〇〇〇〇 〇 Example 13 CO 〇〇〇〇〇 Example 12 CO CO 〇〇〇〇〇 Example 11 CI5 〇 &lt;1 〇&lt;] 〇Example 10 οο CNl 〇&lt;] 〇&lt; 〇 for Jujua Amine film adhesion (N/cm) Appearance change 50 ym Polyimide when used Bending rate 75 //m Polyimide when used Bending rate Bending resistance Surface resistivity and ten heat oos 8z.rogIS6\ Oo0-s6\ff}ii)*6&amp;Forget 鲰\93£1360386 [Table 6]

(產業上之可利用性） '。壬•康Ϊ ^月之防兒磁波性黏接膜’適合使用於貼黏至接 =複U之可撓性印刷佈線板等，且輕由電性電路所 啦生之電磁雜訊的用途。 2 ’根據特定態樣說明本發明，但業者所知曉之變形 和改良為包含於本發明之範圍。 【圖式簡單說明】 方、1夕本為不思故不出本發明之防電磁波性黏接膜之製造 方法之步驟的概略說明圖。 =2為示意性示出本發明之防電磁波性黏接膜之製造 万法之—實施態樣之步驟的說明圖。 方、意性示出本發明之防電磁波性黏接膜之製造 '、同貫施態樣之步驟的說明圖。 為用膜狀硬化性樹脂組成物⑴。作 實施^防電磁波性純収製造方法之一 貝轭恶樣之步驟的說明圖。 圖5為示意性示出❹膜狀硬化性樹脂組成物⑴I)作 现專利6兌明鼙贿牛)\95-卿5 ] 053 78 59 1360386 為基材時之本發明$ P帝 同每祐能详止 电磁波性黏接膜之製造方法之不 具也‘占‘之步驟的說明圖。 圖6為示意性示出本 方孕夕 —A ^月之防-电磁波性黏接膜之使用 方法之一貫施態樣之步驟的說明圖。 圖7為示意性示出倭用胺处成儿 為其材0士夕h 吏用M狀硬化性樹脂組成物(III)作 马基材％之本發明之防電 ^ ^ Λ Η 还及注黏接版之使用方法之一 貝轭恶樣之步驟的說明圖。 々 圖8為示出本發明之防電磁波 估方法圖。 ^接Μ之耐熱性之評 【主要元件符號說明】 補強膜 基材臈 保護膜 微黏著劑層 黏附體(industrial availability) '.壬•康Ϊ ^The anti-magnetic wave adhesive film of the month ′ is suitable for use in flexible printed wiring boards such as adhesive-bonded to complex U, and is used for electromagnetic noise generated by electrical circuits. 2 </ RTI> The present invention is described in terms of specific aspects, and variations and modifications which are known to those skilled in the art are included in the scope of the present invention. [Simplified description of the drawings] A schematic diagram of the steps of the method for manufacturing the electromagnetic wave preventing adhesive film of the present invention is not considered. =2 is a schematic view showing the manufacture of the electromagnetic wave preventing adhesive film of the present invention. The illustration of the steps of the manufacture of the anti-electromagnetic wave-adhesive film of the present invention and the same manner is shown. A film-like curable resin composition (1) is used. It is an explanation of the steps of the anti-electromagnetic wave pure harvesting method. Fig. 5 is a view schematically showing a ruthenium-like curable resin composition (1) I) as a patent 6 鼙 鼙 鼙 ) \ 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 95 The detailed description of the steps of the manufacturing method of the electromagnetic wave adhesive film can be omitted. Fig. 6 is an explanatory view schematically showing the steps of the conventional method of using the anti-electromagnetic wave-adhesive film of the anti-electromagnetic wave film of the present invention. Fig. 7 is a view schematically showing the anti-electricity of the present invention for the use of an amine-containing amine as a material of the material (III) as a horse base material. An illustration of the steps in the use of the version of the yoke. Fig. 8 is a view showing the electromagnetic wave estimation method of the present invention. ^Review of heat resistance of joints [Description of main components] Reinforced film Substrate 臈 Protective film Micro-adhesive layer Adhesive body

加熱處理後之防電磁波性黏接膜 聚醯亞胺膜 8 水平台 Π ) 硬化性導電性黏接劑層 (II) 導電性硬化黏接劑層 (Π I) 膜狀硬化性樹脂組成物 (IV) 膜狀硬化樹脂組成物 326傳利說明書(補件)\95-〇8\9510537S 60Anti-electromagnetic wave-adhesive film after heat treatment, Polyimide film 8 Water platform Π ) Curable conductive adhesive layer (II) Conductive hardening adhesive layer (Π I) Film-like curable resin composition ( IV) Membrane hardening resin composition 326 pass instructions (supplement)\95-〇8\9510537S 60

Claims (1)

十、申請專利範圍： .性黏接劑】Γ： #〇 ^ 'b ^ - 上述硬化性導電性黏接劑層⑴含有： 調甲乙:，物⑷與聚胺基化合物咖 物⑷係令=^^ 合物以外之數平均分子合8^(a)、含有幾基之二醇化 •mc)反應而得，且於終端具有異氰酸酷基； 有二個以上環氧基之環氧樹脂⑻；及 導電性充填劑。 上利範圍第1項之防電磁波性黏接膜，其中， 又，相對於聚胺基甲=份： 計100重量份，係人右道()與％氧樹脂（β)之合 •…：： 導電性充填劑10,〇重量份。 上述二圍第1項之防電磁波性黏接膜，其中， 上述基材膜為含有具有羧 上環氧基之環氧樹脂⑻的硬化生m(c)與具有二個以 4.如申請專利範圍第3項之^組成卿)。 上述含有版聚繼(c)的為皮二接：，其中， 千句刀’麵轉移溫度為心 上5::公專利範圍第3項之防電磁波性黏接膜， 述“㈣之聚㈣脂(C)為令二醇⑻與二元酸或二 32仍專利說明書(補件)\95-〇8\95105378 61 1360386 元1針（〇2)或一元酸之二烧 之聚酯樹脂（c4)，鱼分子内 α所得之含有羥基 其酐（c5)反應而調製。 竣基之多元酸或 6. 如申請專利範圍第丨項之防 上述基材膜含有難燃劑（E)。 /站接膜，其中， 7. 如申請專利範圍第丨項 於卜诚其姑+ 丨方电磁波性黏接膜’复中， 了上述基㈣之未設置硬化性導電性黏 ;、中 上，透過微黏著劑層、或未透過微 ^白表面 二如申請專利範圍第1項之防電磁波性黏；：補：二。 \述硬化性導電性黏接劑層⑴上，層合保護膜 電磁波性黏接膜之製造方法，其特徵為包含， 半之一表面上’透過微黏著劑層而層合補強膜的 步驟；以及 a α领強Μ的 於上述基材膜之另一矣而 rT w a Λ 表面上，將硬化性導電性黏接劑芦 予以層S的步驟’該硬化性導電性 ： 具有幾基之二醇化合物(小含有絲之二= 以外之數平均分子量5〇〇〜8_之多元醇㈦ 氮酸酉旨（C)反應而得且於終端具有異氮酸醋基之胺基^ 乙酉曰預聚物⑷’與聚胺基化合物（e)反應所 胺 f酸醋聚脲樹脂⑷；具有二個以上環氧基之縣= (B)，及導電性充填劑。 I/O.、一種防電磁波性黏揍膜之製造方法，其特徵為包含·· ^補強膜之-表面上設置微黏著劑層，對該微黏著劑層 童疊基材膜的步驟； 326\專利說明書(補件)\95-08\95105378 62 於上述基材膜之另_表面上 成物塗佈’較燥形成硬化性導電性黏接劑導二=組 電性黏接劑組成物係含有-化合物（a)、今右获、另硬I之—醇 _〜_之多元二：化合物以外之數平均分子量 之夕兀S子（b)、有機二異氰酸 於終端具有異氰酸醋基之胺基甲酸反U仔且 胺基化合物（e)及旛祕Μ刮 預♦物（d) ’與聚 ⑷;具有…胺基甲酸醋聚服樹脂 劑，·以及以均乳基之環氧樹脂⑻；及導電性充填 驟於上述硬化性導電性勸接劑層⑴上重叠保護膜的步 、 表面上设置微黏著劑層的步驟； 於上述微黏著劑層重疊基材臈的步驟； 以：：護：Γ表面上，將硬化性導電性黏接劑組成物予 丨=、:w爾硬化性導電性黏接劑層⑴的步驟，該 a 3有羧基之二醇化合物以外之數平均八子θ MO〜8000之多元醇（幻、 數千均刀子置 於级π 1 士田&quot; 百栻一 /、虱@夂酉曰（C)反應而得且 r其：二，、虱酸酯基之胺基甲酸乙酯預聚物⑷，與聚 (1)土呈i物（e)反應所調製之聚胺基曱酸si聚服樹脂 劑；，以、及有—個以上環氧基之環氧樹脂⑻；及導電性充..填 於上述硬化性導電性黏接劑層⑴上，將層合有上述補 326\專利說明書(補件)\95-08\95〗05378 63 丄JOUJSb 材膜以上述基材膜與上述硬化性導電性黏接劑 接觸之方式重疊的步驟。 =·—種防電磁波性黏接膜之製造方法，其特徵為包含. 呈=:之—表面上，將含有具有缓基之㈣ = 個以上環氧基之環氧樹脂⑻的樹脂組成物予以 土 乾燥形成膜狀硬化性樹脂組成物（111)層的步驟； 於上述膜狀硬化性樹脂組成物（1⑴層上，將硬化性導 物予以塗佈，乾燥形成硬化性導電性黏接 的步驟，該硬化性導電性黏接劑組成物係含有： =金竣基之二醇化合物（a)、含有減之二醇化合物以 Hcf反^均分子量剛〜咖之多元醇㈤、有機二異氰酸 ^曰I c )反應而得且於玖山 π糕具有異氰酸酯基之胺基甲酸乙酷 與聚胺基化合物(灿 個以上環氧基之環氧樹脂⑻;及 於上述硬化性導電性黏接劑層⑴上重疊保護膜 驟。 13· 一種防電磁波性轉膜之製造方法，其特徵為包含： 於補強膜之-表面上’將含有具有減之聚@旨樹脂（〇 Μ具有二個以上環氧基之環氧樹脂⑻的樹脂組成物予以 塗佈’乾燥形成膜狀硬化性樹脂組成物⑴η層的步驟； 、於保護膜之-表面上，將硬化性導電性黏接劑組成物予 以塗佈，錢形成硬化性㈣㈣接顧⑴的步驟，該 硬化性導電性黏接劑组成物係含有：令具錢基之二醇化 326\專利說明書(補件)\95-〇8\95105378 1360386 合物⑷、含有缓基之二醇化合物以外之數平均分子旦 =_之多元醇⑻、有機二異氰酸酿⑷反應而得： = : = =基之胺基甲酸乙酿預聚物⑷，與聚 」上：物⑷反應所調製之聚胺基甲酸醋聚服樹脂 以及固以上環氧基之環氧樹脂⑻;及導電性充填 於上述硬化性導電性黏接劑層⑴上，將層合有上述補 強版的版狀硬化性樹脂組成物（⑴）層以上述膜狀硬化性 =且⑴層與上述硬化性導電性黏接劑層⑴接 觸之方式重疊的步驟。 14. -種黏附體之電磁波遮蔽方法’其特徵為包含： =含有補強膜、於上述補強膜之一表面上設置之微黏著 刟層、於上述微黏著劑層之表面上設置之基材膜、於上述 基材膜之表面上設置之硬化性導電性黏接劑層⑴、及於 上述硬化性導電性黏接劑層⑴之表面上設置的保護膜之 防電磁波性黏接膜’剝離上述保護膜’將露出的上述硬化 性導電性黏接劑層⑴重量至黏附體，進行加献，令上述 魏料電性黏接劑層⑴硬化後’將上述補強膜與上述 微黏著劑層共同剝離； 該硬化性導電性黏接劑層（1)係含有：令具有羧基之二 =化合物（a)、含有羧基之二醇化合物以外之數平均分子 量500〜8000之多元醇⑻、有機二異氰酸酯⑷反應而得 且於終端具有異氰酸酉旨基之胺基甲酸乙醋預聚物⑷，盘 聚胺基化合物（e)反應所調製之聚胺基曱酸酿聚脲樹脂 规專利說明書(補件)\95-08\95105378 65 具有二個以上環氧基之環氧樹脂⑻；及導電性充填 種站附肢之電磁波遮蔽方法，苴 自含有補強膜、於上述補強膜為包含： 有羧基之聚酯樹&amp; °又置且含有具 日w乃日與具有二個以上環氧 ;D);⑽硬化性樹脂组成物(⑴)層、於上; 樹脂組成物(I⑴層之表面上設置之硬化性導== 層（I)、及於上述硬化性導+ w針拉十， 導電陡黏接劑 的保護膜之防===層⑴之表面上設置 的硬化性導丄:===述，，將露出 々接月j層u)重豐至黏附體，進行加熱， 々上述膜狀硬化性樹脂組成物⑴υ層及上述硬化性^ 性黏接劑層⑴硬化後，將上述補強膜剝離； t述硬化性導電性黏接劑層（ί)係含有：令具有羧基之 一醇化合物（a)、含有羧基之二醇化合物以外之數平均分 =量500〜8000之多元醇（b)、有機二異氰酸酯（c)反應而 鲁仔且於終端具有異氰酸酯基之胺基曱酸乙酯預聚物（d) ’ 與聚胺基化合物（e)反應所調製之聚胺基曱酸酯聚脲樹脂 (A);具有二個以上環氧基之環氧樹脂（B);及導電性充填 劑。 32价專利說明書(補件)\95_〇8\951〇5378 66X. Patent application scope: .Adhesive adhesive】Γ: #〇^ 'b ^ - The above-mentioned hardening conductive adhesive layer (1) contains: 调甲乙:, (4) and polyamine compound coffee (4) The compound having an average molecular weight of 8^(a), containing a few groups of diols/mc), and having an isocyanate group at the terminal; an epoxy resin having two or more epoxy groups (8); and conductive filler. The anti-electromagnetic wave-adhesive film of the first item of the above-mentioned range, wherein, in addition, 100 parts by weight of the polyamino group: 100 parts by weight, the combination of the right side () and the % oxygen resin (β) •... : Conductive filler 10, 〇 by weight. The above-mentioned substrate film is a hardening m(c) containing an epoxy resin (8) having an carboxy-based epoxy group and having two to 4. The third item of the scope is composed of ^). The above-mentioned plate-containing polymer (c) is a skin-two connection: wherein, the thousand-knife's surface transfer temperature is the core 5:: the anti-electromagnetic wave-adhesive film of the third item of the public patent range, the "(4) gathering (four) The fat (C) is a polyester resin which makes the diol (8) and the dibasic acid or the two 32 still patent specifications (supplement)\95-〇8\95105378 61 1360386 yuan 1 needle (〇2) or monobasic acid ( C4), which is prepared by reacting a hydroxyl group obtained by α in a fish molecule with an anhydride (c5). A polybasic acid of a mercapto group or 6. The above-mentioned base film of the above-mentioned base material contains a flame retardant (E). Station film, in which, 7. If the scope of the patent application is in the 卜 其 其 + + + 电磁 电磁 电磁 电磁 电磁 电磁 电磁 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The micro-adhesive layer or the non-transparent micro-white surface is as in the electromagnetic wave-resistant adhesive of the first application of the patent scope: 1: supplement: 2. The hardening conductive adhesive layer (1), the laminated protective film electromagnetic wave A method for producing an adhesive film, comprising the step of laminating a reinforcing film through a microadhesive layer on one of the surfaces And the step of applying a layer of S to the surface of the substrate film and the layer of S on the surface of the rT wa Μ on the other surface of the substrate film, the hardening conductivity: a diol having several groups Compound (small containing silky wire = other than the average molecular weight of 5〇〇~8_ polyol (7) Nitraic acid is obtained by reacting (C) and having an isocyanate group at the terminal amine group The compound (4)' reacts with the polyamine compound (e) to form an amine f-acid acetal polyurea resin (4); a county having two or more epoxy groups = (B), and a conductive filler. I/O., an electromagnetic wave prevention A method for producing a viscous adhesive film, which comprises the steps of: providing a micro-adhesive layer on the surface of the reinforced film, and stacking the base film on the micro-adhesive layer; 326\patent specification (supplement)\ 95-08\95105378 62 Applying on the other surface of the above substrate film, 'drying to form a hardenable conductive adhesive agent>> the group of electrical adhesive composition containing - compound (a), Right now, another hard I--alcohol_~_multiple two: the number average molecular weight other than the compound 兀 兀 S (b), organic two Cyanic acid at the end of the isocyanate-based aminocarboxylic acid anti-U and amine compound (e) and 幡 Μ 预 预 pre- (d) ' and poly (4); with ... amino formate vinegar poly resin resin And a step of depositing a micro-adhesive layer on the surface of the hardening-based epoxy resin (8); and electrically filling the step of superposing the protective film on the curable conductive interposer layer (1); a step of overlapping the substrate layer with the agent layer; a step of: protecting the composition of the curable conductive adhesive composition on the surface of the crucible, and the layer of the curable conductive adhesive layer (1) Polyol having an average number of eight θ MO~8000 other than the diol compound of the carboxyl group (magic, thousands of knives are placed in the grade π 1 Shi Tian &quot; Bai Yiyi /, 虱@夂酉曰(C) reaction And r: a urethane-based urethane prepolymer (4), and a polyamine citric acid si-polymer resin prepared by reacting the poly(1) soil with the substance (e); An epoxy resin (8) having more than one epoxy group; and a conductive charge filling the layer of the curable conductive adhesive layer (1) The above-mentioned supplementary 326\patent specification (supplement)\95-08\95〗 05378 63 丄JOUJSb material film is laminated so that the base material film is in contact with the above-mentioned curable conductive adhesive. A method for producing an anti-electromagnetic wave-adhesive film, comprising: a resin composition comprising: an epoxy resin (8) having a (4) or more epoxy group having a retarding group; a step of drying the film to form a film-like curable resin composition (111) layer; and applying the curable conductive material to the film-like curable resin composition (1 (1) layer, and drying to form a curable conductive adhesive bond The curable conductive adhesive composition comprises: a ruthenium-based diol compound (a), a reduced diol compound, a Hcf anti-average molecular weight, a poly-alcohol (V), an organic diisocyanate^曰I c ) obtained from the reaction of 玖 π π 具有 具有 具有 具有 具有 具有 具有 具有 异 与 与 与 与 π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π π A layer (1) is overlaid with a protective film. 13. A method for producing an electromagnetic wave-proof film, comprising: on the surface of the reinforcing film, 'containing a reduced poly@ resin (〇Μ has two or more rings) Oxygen epoxy resin (8) resin group The product is coated with a step of 'drying to form a film-like curable resin composition (1) η layer; and the curable conductive adhesive composition is coated on the surface of the protective film to form a hardenability (4) (4) (1) The step of the curable conductive adhesive composition comprising: a glycolated diol PEG\patent specification (supplement)\95-〇8\95105378 1360386 compound (4), a diol containing a slow base The reaction of the number average molecular weight = _ of the polyol (8) and the organic diisocyanate (4): =: = = the base of the amino carboxylic acid prepolymer (4), and the reaction of the polymer (4) a polyurethane resin coated with a polyurethane resin and an epoxy resin (8) having a higher epoxy group; and a conductive filling layer (1) on the curable conductive adhesive layer (1), which is laminated with the above-mentioned reinforcing plate The resin composition ((1)) layer has a step of superimposing the film-like hardenability = (1) layer in contact with the curable conductive adhesive layer (1). 14. The electromagnetic wave shielding method of the type of adherend is characterized by Contains: = contains a reinforcing film, above the reinforced film a micro-adhesive layer provided on a surface, a base film provided on a surface of the micro-adhesive layer, a curable conductive adhesive layer (1) provided on a surface of the base film, and the hardenability The anti-electromagnetic adhesive film of the protective film provided on the surface of the conductive adhesive layer (1) is peeled off from the protective film to expose the exposed curable conductive adhesive layer (1) to the adherend, and is added. After the hardener electrical adhesive layer (1) is cured, the reinforcing film is peeled off together with the microadhesive layer; the curable conductive adhesive layer (1) contains: a compound having a carboxyl group = compound (a) a urethane prepolymer (4) obtained by reacting a polyol (8) having an average molecular weight of 500 to 8,000 and an organic diisocyanate (4) other than a diol compound having a carboxyl group, and having an isocyanate group at the terminal. Polyamine phthalic acid-based polyurea resin prepared by the reaction of polyamine compound (e) Patent specification (supplement)\95-08\95105378 65 Epoxy resin having two or more epoxy groups (8); and conductivity Filling the station The magnetic wave shielding method comprises: a reinforcing film comprising: a carboxyl group-containing polyester tree &amp; ° and further comprising a day w and having two or more epoxy; D); (10) a curable resin Composition ((1)) layer, on top; resin composition (hardenable guide layer on the surface of layer I(1) == layer (I), and above-mentioned hardenability guide + w pin pull ten, protection of conductive steep adhesion agent Film prevention ===The hardening guide provided on the surface of the layer (1): ===, will expose the j 月 j j layer u) heavy to the adherend, heating, 々 the above film-like curable resin composition After the (1) ruthenium layer and the sclerosing adhesive layer (1) are cured, the reinforced film is peeled off; and the sclerosing conductive adhesive layer ( )) contains: an alcohol compound (a) having one carboxyl group, An amino-based decanoic acid prepolymer having an average number of points other than the diol compound containing a carboxyl group, a polyol (b) having an amount of 500 to 8,000, an organic diisocyanate (c), and an isocyanate group at the terminal ( d) 'polyamine phthalate polyurea resin (A) prepared by reacting with polyamine compound (e); The epoxy resin (B) or more epoxy groups; and the conductive filler. 32 price patent specification (supplement)\95_〇8\951〇5378 66
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