CN107333462A - The processing method of conductive layer, electromagnetic shielding film and electromagnetic shielding film - Google Patents
The processing method of conductive layer, electromagnetic shielding film and electromagnetic shielding film Download PDFInfo
- Publication number
- CN107333462A CN107333462A CN201710699948.4A CN201710699948A CN107333462A CN 107333462 A CN107333462 A CN 107333462A CN 201710699948 A CN201710699948 A CN 201710699948A CN 107333462 A CN107333462 A CN 107333462A
- Authority
- CN
- China
- Prior art keywords
- conductive layer
- electromagnetic shielding
- shielding film
- powder
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Abstract
The invention provides the processing method of a kind of conductive layer, electromagnetic shielding film and electromagnetic shielding film, it is related to electromangnetic spectrum field.The conductive layer of electromagnetic shielding film includes the first conductive layer and is coated on the second conductive layer of the side of the first conductive layer；The conducting powder of first conductive layer includes dendritic conducting powder, and the particle diameter of the conducting particles of dendritic conducting powder is 5 20um；The conducting powder of second conductive layer includes sheets of conductive powder or spherical conducting powder, the particle diameter of sheets of conductive powder or the conducting particles of spherical conducting powder is identical with the thickness of the second conductive layer, solve present in prior art for improve electromagnetic shielding film conductive layer outward appearance is coarse, out-of-flatness phenomenon, easily cause the technical problem of the increase of cost or the reduction of electric conductivity and shield effectiveness, by set the second conductive layer compensate for the first conductive layer outward appearance is coarse, out-of-flatness, while making the shield effectiveness of the conductive layer of whole electromagnetic shielding film more excellent.
Description
Technical field
The present invention relates to electromangnetic spectrum field, more particularly, to a kind of conductive layer, electromagnetic shielding film and electromagnetic shielding
The processing method of film.
Background technology
Electromagnetic shielding is widely used in the fields such as communication, electronic product, the network hardware, Medical Instruments, space flight and national defence,
Communication aspects, electromagnetic shielding is exactly the isolation to entering row metal between two spaces region, to control electric field, magnetic field and electromagnetic wave
Sensing and radiation by a region to another region.Specifically, it is exactly by component, circuit, sub-assembly, electricity with shield
Cable or the interference source of whole system are surrounded, and prevent interference electromagnetic field to external diffusion, with shield by receiving circuit, equipment or
System is surrounded, and prevents them from being influenceed by external electromagnetic field, and electromagnetic shielding film is a kind of conventional shield.
Coating machine is mainly used in the surface coating process production of film, paper etc., and it is that coiled base material is applied into last layer
Glue, coating or ink of specific function etc., and the machinery equipment of rolling and storage is carried out after the drying.Coating machine is using special
Multi-functional coating head, can realize the surface coating production of diversified forms, and coating machine is developed so far, and radium-shine transfer can have been realized, has been scalded
The coating process of gold, optical film, diaphragm, electric thin and Medium Exchange film etc..
The coating production procedure of existing electromagnetic shielding film mainly applies layer of cloth on a carrier film, by the table of insulating barrier
After face drying is to be hardened, select the outside processing metal level in insulating barrier that semi-finished product are made according to actual needs, and in semi-finished product
Outside conducting layer coated glue, the thickness of usual conductive layer is 5-15um, finally fitted in the outside of conductive layer diaphragm from
And electromagnetic shielding film is made.To make electromagnetic shielding film result in more excellent electric conductivity and shield effectiveness, conductive layer
Conducting particles selection particle diameter larger dendritic, sheet or spherical conducting powder, the particle diameter of usual conducting powder is in 5-20um, due to particle diameter
More greatly increase the adherence between conducting particles, so that the electric conductivity and shield effectiveness of electromagnetic shielding film are good, but due to
The particle diameter of conducting particles is larger in itself when conductive layer is coated with, and when conductive layer is coated with 5-15um thickness, larger particle diameter to lead
The outward appearance of electric layer is rougher, out-of-flatness.
To improve the coarse and out-of-flatness phenomenon of conductive layer outward appearance, generally changed using the method for improving conductive layer thickness
Kind, still, the raising of conductive layer thickness can cause the increase of cost, if improving conductive layer by reducing the particle diameter of conducting particles
Coarse, the out-of-flatness of outward appearance, because the particle diameter of conducting particles is reduced, its mutual adherence reduction can influence conductive layer on the contrary
Electric conductivity and shield effectiveness.
The content of the invention
It is an object of the invention to provide the processing method of a kind of conductive layer, electromagnetic shielding film and electromagnetic shielding film, to solve
Certainly present in prior art for improve electromagnetic shielding film conductive layer outward appearance is coarse, out-of-flatness phenomenon, easily cause cost
Increase or electric conductivity and shield effectiveness reduction technical problem.
The conductive layer for the electromagnetic shielding film that the present invention is provided includes the first conductive layer and is coated on first conductive layer
Side the second conductive layer；
The conducting powder of first conductive layer includes dendritic conducting powder, and the particle diameter of the conducting particles of the dendritic conducting powder is
5-20um；
The conducting powder of second conductive layer includes sheets of conductive powder or spherical conducting powder, the sheets of conductive powder or described
The particle diameter of the conducting particles of spherical conducting powder is identical with the thickness of second conductive layer.
Further, the thickness of first conductive layer is 5-10um；
The particle diameter of the sheets of conductive powder or the conducting particles of the spherical conducting powder is 1-3um, second conductive layer
Thickness be 1-3um.
Further, powder content of the dendritic conducting powder in first conductive layer is 30-40%.
Further, the conducting particles of first conductive layer and second conductive layer include silver, copper, iron, nickel, zinc,
One or more in silver alloy, copper alloy, ferroalloy, nickel alloy, kirsite.
Further, the material of first conductive layer and second conductive layer includes thermosetting epoxy resin, propylene
Acid resin or polyurethane.
The electromagnetic shielding film that the present invention is provided, including electromagnetic shielding film as any one of above-mentioned technical scheme are led
Electric layer, in addition to carrier film, insulating barrier and diaphragm；
The insulating barrier is coated on the side of the carrier film, and first conductive layer is coated on the insulating barrier away from institute
The side of carrier film is stated, the diaphragm laminating second conductive layer is set away from the side of first conductive layer.
Further, the material of the insulating barrier includes thermosetting epoxy resin, acrylic resin or polyurethane glue.
Further, the material of the diaphragm includes mould release membrance or release liners.
Further, metal level or graphene are additionally provided between the conductive layer of the insulating barrier and the electromagnetic shielding film
Layer.
Provided by the present invention for the processing method of electromagnetic shielding film of the processing as described in above-mentioned technical scheme, including：
The insulating barrier is coated with the side of the carrier film；
In the insulating barrier first conductive layer is coated with away from the side of the carrier film；
In first conductive layer second conductive layer is coated with away from the side of the insulating barrier；
Deviate from the side laminating diaphragm of first conductive layer in second conductive layer.
The conductive layer for the electromagnetic shielding film that the present invention is provided includes the first conductive layer and the second conductive layer, and the second conductive layer is applied
The side of the first conductive layer is distributed in, the outward appearance for improving the conductive layer of electromagnetic shielding film by using two conductive layers is coarse, no
Smooth phenomenon, while enabling electromagnetic shielding film to possess preferable electric conductivity and shield effectiveness.Specifically, the first conductive layer
Conducting powder include dendritic conducting powder, dendritic conducting powder due to similar dendritic form, its each other adherence it is excellent, energy
It is enough both horizontally and vertically to realize conducting, also, the particle diameter of the conducting particles of dendritic conducting powder is 5-20um, lead due to first
The particle diameter of the conducting particles of electric layer is larger, more increases the adherence between conducting particles, so that the first conductive layer possesses
Good electric conductivity and shield effectiveness.
The particle diameter of conducting particles to avoid the first conductive layer is excessive, and coating thickness is smaller causes leading for electromagnetic shielding film
Electric layer outward appearance is coarse, out-of-flatness, the second conductive layer is coated with the side of the first conductive layer, due to that will not increase overall electromagnetic shielding
The thickness of the conductive layer of film, thus will not cause the increase of cost, simultaneously because the particle diameter of the conducting particles of the first conductive layer compared with
Greatly, the electric conductivity and shield effectiveness of the conductive layer of electromagnetic shielding film will not be reduced.
Specifically, the conducting powder of the second conductive layer includes sheets of conductive powder or spherical conducting powder, sheets of conductive powder or spherical
Conducting powder makes the second conductive layer possess good electric conductivity, so that the second conductive layer can be turned on the first conductive layer, by
It is identical with the thickness of the second conductive layer in the particle diameter of sheets of conductive powder or the conducting particles of spherical conducting powder, meet second conductive
Vertical conducting between layer and the first conductive layer, makes the second conductive layer mainly play vertical conducting, and the first conductive layer rises
Main shielding action, so that the shield effectiveness of the conductive layer of whole electromagnetic shielding film is more excellent, while the second conductive layer
Conducting particles particle diameter it is identical with the thickness of the second conductive layer, the flat appearance of the second conductive layer can be made, so as to compensate for
Because the particle diameter of the conducting particles of the first conductive layer is excessive and the relatively low conductive layer outward appearance caused of coating thickness is coarse, out-of-flatness.
Brief description of the drawings
, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical scheme of the prior art
The accompanying drawing used required in embodiment or description of the prior art is briefly described, it should be apparent that, in describing below
Accompanying drawing is some embodiments of the present invention, for those of ordinary skill in the art, before creative work is not paid
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of electromagnetic shielding film in the prior art；
Fig. 2 is the structural representation of the first embodiment of electromagnetic shielding film provided in an embodiment of the present invention；
Fig. 3 is the structural representation of second of embodiment of electromagnetic shielding film provided in an embodiment of the present invention；
Fig. 4 is the structural representation of the third embodiment of electromagnetic shielding film provided in an embodiment of the present invention.
Icon：The conductive layers of 100- first；The conductive layers of 200- second；300- carrier films；400- insulating barriers；500- diaphragms；
600- metal levels；700- graphene layers.
Embodiment
Technical scheme is clearly and completely described below in conjunction with accompanying drawing, it is clear that described implementation
Example is a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
In the description of the invention, it is necessary to explanation, such as occur term " " center ", " on ", " under ", "left", "right",
" vertical ", " level ", " interior ", " outer " etc., orientation or position relationship indicated by it are based on orientation shown in the drawings or position
Relation, is for only for ease of the description present invention and simplifies description, rather than indicate or imply that the device or element of meaning must have
There is specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, as occurred
Term " first ", " second ", " the 3rd " are only used for describing purpose, and it is not intended that indicating or implying relative importance.
In the description of the invention, it is necessary to which explanation, unless otherwise clearly defined and limited, term " peace such as occurs
Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integratedly
Connection；Can be mechanical connection or electrical connection；Can be joined directly together, can also be indirectly connected to by intermediary,
It can be the connection of two element internals.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
The concrete meaning of language in the present invention.
Embodiment 1, embodiment 2 and embodiment 3 are described in detail below in conjunction with the accompanying drawings：
Fig. 1 is the structural representation of electromagnetic shielding film in the prior art；Fig. 2 is electromagnetic shielding provided in an embodiment of the present invention
The structural representation of the first embodiment of film；Fig. 3 is second of implementation of electromagnetic shielding film provided in an embodiment of the present invention
The structural representation of mode；Fig. 4 is the structural representation of the third embodiment of electromagnetic shielding film provided in an embodiment of the present invention
Figure.
Embodiment 1
It is as shown in Figure 1 the structural representation of electromagnetic shielding film in the prior art, prior art please with reference to Fig. 1-4
The conductive layer of middle electromagnetic shielding film only with individual layer the first conductive layer 100, when the particle diameter of the conducting particles of the first conductive layer 100
It is excessive, and coating thickness it is smaller when be easily caused electromagnetic shielding film conductive layer outward appearance is coarse, out-of-flatness.To improve outside conductive layer
The coarse and out-of-flatness phenomenon seen, is generally improved, still, first leads using the method for improving the thickness of the first conductive layer 100
The raising of the thickness of electric layer 100 can cause the increase of cost, if improving conductive layer outward appearance by reducing the particle diameter of conducting particles
Coarse, out-of-flatness, because the particle diameter of conducting particles is reduced, its mutual adherence reduction can influence the electric conductivity of conductive layer on the contrary
And shield effectiveness.
The structural representation for the electromagnetic shielding film that Fig. 2-4 provides for the present embodiment, present embodiments provides a kind of electromagnetic screen
Cover the conductive layer of film, including the first conductive layer 100 and be coated on the first conductive layer 100 side the second conductive layer 200, tool
For body：
The conducting powder of first conductive layer 100 includes dendritic conducting powder, and the particle diameter of the conducting particles of dendritic conducting powder is 5-
20um；
The conducting powder of second conductive layer 200 includes sheets of conductive powder or spherical conducting powder, sheets of conductive powder or spherical conduction
The particle diameter of the conducting particles of powder is identical with the thickness of the second conductive layer 200.
As shown in Fig. 2 the conductive layer of electromagnetic shielding film includes the first conductive layer 100 and the second conductive layer 200, second is conductive
The side that layer 200 is coated on the first conductive layer 100, improve by using two conductive layers electromagnetic shielding film conductive layer it is outer
Coarse, out-of-flatness phenomenon is seen, while enabling electromagnetic shielding film to possess preferable electric conductivity and shield effectiveness.Specifically,
The conducting powder of first conductive layer 100 includes dendritic conducting powder, and dendritic conducting powder is due to similar dendritic form, and it is each other
Adherence is excellent, can both horizontally and vertically realize conducting, also, the particle diameter of the conducting particles of dendritic conducting powder is 5-
20um, because the particle diameter of the conducting particles of the first conductive layer 100 is larger, more increases the adherence between conducting particles, from
And the first conductive layer 100 is possessed good electric conductivity and shield effectiveness.
The particle diameter of conducting particles to avoid the first conductive layer 100 is excessive, and coating thickness is smaller causes electromagnetic shielding film
Conductive layer outward appearance is coarse, out-of-flatness, the second conductive layer 200 is coated with the side of the first conductive layer 100, it is whole due to that will not increase
The thickness of the conductive layer of body electromagnetic shielding film, thus the increase of cost will not be caused, simultaneously because the conduction of the first conductive layer 100
The particle diameter of particle is larger, will not reduce the electric conductivity and shield effectiveness of the conductive layer of electromagnetic shielding film.
Specifically, the conducting powder of the second conductive layer 200 includes sheets of conductive powder or spherical conducting powder, sheets of conductive powder or ball
Shape conducting powder makes the second conductive layer 200 possess good electric conductivity, so that the second conductive layer 200 can be with the first conductive layer
100 conductings, because the particle diameter of sheets of conductive powder or the conducting particles of spherical conducting powder is identical with the thickness of the second conductive layer 200,
The vertical conducting between the second conductive layer 200 and the first conductive layer 100 is met, the second conductive layer 200 is mainly risen vertical
Conducting is acted on, and the 100 main shielding actions of the first conductive layer, so that the shielding effect of the conductive layer of whole electromagnetic shielding film
Fruit is more excellent, while the particle diameter of the conducting particles of the second conductive layer 200 is identical with the thickness of the second conductive layer 200, can make
The flat appearance of second conductive layer 200, so as to compensate for being coated with because the particle diameter of the conducting particles of the first conductive layer 100 is excessive
The relatively low conductive layer outward appearance caused of thickness is coarse, out-of-flatness.
In a kind of specific embodiment, the thickness of the first conductive layer 100 is 5-10um, due to the conduction of electromagnetic shielding film
Thickness degree is universal in 5-15um, and the thickness of the first conductive layer 100 is set into 5-10um, the first conductive layer 100 is played
Main shielding action, simultaneously as the particle diameter of the conducting particles of the first conductive layer 100 is larger, and the thickness of the first conductive layer 100
Degree is relatively low so that the outward appearance of the first conductive layer 100 is more coarse, out-of-flatness, by the sheets of conductive powder or ball of the second conductive layer 200
The particle diameter of the conducting particles of shape conducting powder is set to 1-3um, while the thickness of the second conductive layer 200 is 1-3um, makes the second conduction
The particle diameter of the thickness and the conducting particles of the second conductive layer 200 of layer 200 is same or like, meets the second conductive layer 200 and the
Vertical conducting between one conductive layer 100, so that the shield effectiveness of the conductive layer of whole electromagnetic shielding film is more excellent, together
When can make the flat appearance of the second conductive layer 200, make up and applied because the particle diameter of the conducting particles of the first conductive layer 100 is excessive
The relatively low conductive layer outward appearance caused of cloth thickness is coarse, out-of-flatness.Because the thickness of the first conductive layer 100 is 5-10um, second leads
The thickness of electric layer 200 is 1-3um, thus will not increase the thickness of the conductive layer of overall electromagnetic shielding film, so as to will not cause into
This increase.
In the alternative of the present embodiment, powder content of the dendritic conducting powder in the first conductive layer 100 is 30-40%,
Make powder content of the dendritic conducting powder in the first conductive layer 100 smaller, it is thus possible to processing cost to be reduced, simultaneously because dendritic
The similar dendritic form of conducting powder, conductive layer powder content reduce in the case of, its then density it is also larger so that
The cost of electromagnetic shielding film is reduced and shield effectiveness is unaffected.Through experimental study, by the electromagnetic shielding on compacting soft board, hardboard
First conductive layer 100 of film is connected with soft board, hardboard, test result indicates that, the shielding for the electromagnetic shielding film that the present embodiment is provided
Efficiency reaches more than 50dB, and shield effectiveness is excellent, and the powder content due to dendritic conducting powder in the first conductive layer 100 is smaller
Reduce the cost of electromagnetic shielding film.
Specifically, the conducting particles of the first conductive layer 100 and the second conductive layer 200 includes silver, copper, iron, nickel, zinc, silver conjunction
One or more in gold, copper alloy, ferroalloy, nickel alloy, kirsite, conducting particles using the silver of easy conductive, copper, iron, nickel,
Zinc, silver alloy, copper alloy, ferroalloy, nickel alloy, kirsite, ensure that electromagnetic shielding film possess excellent electric conductivity and
Shield effectiveness.
The material of first conductive layer 100 and the second conductive layer 200 may include thermosetting epoxy resin, acrylic resin or poly-
Urethane, thermosetting epoxy resin, acrylic resin or polyurethane possess good physics, chemical property, and it is to metal and Fei Jin
The surface of category material has excellent adhesive strength, and dielectric properties are good, and deformation retract rate is small, and product size stability is good, firmly
Degree is high, and pliability is preferable, it is thus possible to ensure the function of the first conductive layer 100 and the second conductive layer 200.
Embodiment 2
Present embodiments provide a kind of conductive layer of the electromagnetic shielding film in electromagnetic shielding film, including embodiment 1.Due to leading
Electric layer uses two conductive layers, to avoid the particle diameter of conducting particles of the first conductive layer 100 excessive, and coating thickness is smaller causes
The conductive layer outward appearance of electromagnetic shielding film is coarse, out-of-flatness, and the second conductive layer 200 is coated with the side of the first conductive layer 100, due to
The thickness of the conductive layer of overall electromagnetic shielding film will not be increased, thus the increase of cost will not be caused, simultaneously because first is conductive
The particle diameter of the conducting particles of layer 100 is larger, will not reduce the electric conductivity and shield effectiveness of the conductive layer of electromagnetic shielding film.
In a kind of specific embodiment, as shown in Fig. 2 electromagnetic shielding film may also include carrier film 300, insulating barrier 400
And diaphragm 500.Specifically, insulating barrier 400 is coated on the side of carrier film 300, and the first conductive layer 100 is coated on insulating barrier
400 deviate from the side of carrier film 300, and the second conductive layer 200 of laminating of diaphragm 500 is set away from the side of the first conductive layer 100,
So as to obtain complete electromagnetic shielding film, the security and service life of electromagnetic shielding film are improved.
Specifically, the material of insulating barrier 400 includes thermosetting epoxy resin, acrylic resin or polyurethane glue.Thermosetting
Type epoxy resin, acrylic resin or polyurethane glue possess good physics, chemical property, and it is to metal and nonmetallic materials
Surface there is excellent adhesive strength, dielectric properties are good, and deformation retract rate is small, and product size stability is good, and hardness is high, soft
Toughness is preferable, it is thus possible to ensure the function of insulating barrier 400.
The material of diaphragm 500 includes mould release membrance or release liners.Under normal circumstances in order to increase the off-type force of plastic sheeting,
Plastic sheeting can be done plasma treatment, allow it for a variety of organic pressure sensitive adhesives can show it is extremely light and stable from
Type power.It is extremely light and stabilization release that diaphragm 500 can be such that diaphragm 500 is reached in stripping using mould release membrance or release liners
Power.
In the alternative of the present embodiment, as shown in figure 3, also being set between insulating barrier 400 and the conductive layer of electromagnetic shielding film
It is equipped with metal level 600.Metal level 600 can select to set according to actual needs, and the setting of metal level 600 can make electromagnetic shielding film
Obtain more preferable electric conductivity and shielding properties.
In another alternative of the present embodiment, as shown in figure 4, between insulating barrier 400 and the conductive layer of electromagnetic shielding film
It is additionally provided with graphene layer 700.Graphene layer 700 can select according to actual needs set, graphene be have now been found that it is most thin,
Maximum intensity, electrical and thermal conductivity performance a kind of most strong novel nano-material, the setting of graphene layer 700 can make electromagnetic shielding film
Obtain more preferable electric conductivity and shielding properties.
Embodiment 3
Present embodiments provide a kind of processing method for the electromagnetic shielding film being used in process embodiment 2, including following step
Suddenly：
Layer of cloth 400 is applied in the side of carrier film 300, insulating barrier 400 is dried；
After after the Surface hardened layer of insulating barrier 400, the first conductive layer is coated with away from the side of carrier film 300 in insulating barrier 400
100；
In the first conductive layer 100 the second conductive layer 200 is coated with away from the side of insulating barrier 400；
Deviate from the side laminating diaphragm 500 of the first conductive layer 100 in the second conductive layer 200.
The processing method of electromagnetic shielding film can also include the steps of：
Metal level 600 or graphene layer 700 are processed between insulating barrier 400 and the conductive layer of electromagnetic shielding film.
The process steps for the electromagnetic shielding film that the present embodiment is provided are simple, the conductive layer of obtained electromagnetic shielding film
Flat appearance, and electric conductivity and shielding properties are good.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
The present invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that：Its according to
The technical scheme described in foregoing embodiments can so be modified, or which part or all technical characteristic are entered
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (10)
1. a kind of conductive layer of electromagnetic shielding film, it is characterised in that including the first conductive layer (100) and be coated on described first
The second conductive layer (200) of the side of conductive layer (100)；
The conducting powder of first conductive layer (100) includes dendritic conducting powder, the particle diameter of the conducting particles of the dendritic conducting powder
For 5-20um；
The conducting powder of second conductive layer (200) includes sheets of conductive powder or spherical conducting powder, the sheets of conductive powder or institute
The particle diameter for stating the conducting particles of spherical conducting powder is identical with the thickness of second conductive layer (200).
2. the conductive layer of electromagnetic shielding film according to claim 1, it is characterised in that first conductive layer (100)
Thickness is 5-10um；
The particle diameter of the sheets of conductive powder or the conducting particles of the spherical conducting powder is 1-3um, second conductive layer (200)
Thickness be 1-3um.
3. the conductive layer of electromagnetic shielding film according to claim 1 or 2, it is characterised in that the dendritic conducting powder is in institute
It is 30-40% to state the powder content in the first conductive layer (100).
4. the conductive layer of electromagnetic shielding film according to claim 1, it is characterised in that first conductive layer (100) and
The conducting particles of second conductive layer (200) include silver, copper, iron, nickel, zinc, silver alloy, copper alloy, ferroalloy, nickel alloy,
One or more in kirsite.
5. the conductive layer of electromagnetic shielding film according to claim 1, it is characterised in that first conductive layer (100) and
The material of second conductive layer (200) includes thermosetting epoxy resin, acrylic resin or polyurethane.
6. a kind of electromagnetic shielding film, includes the conductive layer of the electromagnetic shielding film as any one of claim 1-5, its feature
It is, in addition to carrier film (300), insulating barrier (400) and diaphragm (500)；
The insulating barrier (400) is coated on the side of the carrier film (300), and first conductive layer (100) is coated on described
Insulating barrier (400) deviates from the side of the carrier film (300), diaphragm (500) laminating the second conductive layer (200) back of the body
Side from first conductive layer (100) is set.
7. electromagnetic shielding film according to claim 6, it is characterised in that the material of the insulating barrier (400) includes thermosetting
Type epoxy resin, acrylic resin or polyurethane glue.
8. electromagnetic shielding film according to claim 6, it is characterised in that the material of the diaphragm (500) includes release
Film or release liners.
9. the electromagnetic shielding film according to any one of claim 6-8, it is characterised in that the insulating barrier (400) and institute
Metal level (600) or graphene layer (700) are additionally provided between the conductive layer for stating electromagnetic shielding film.
10. a kind of processing method for processing electromagnetic shielding film as claimed in claim 6, it is characterised in that including：
The insulating barrier (400) is coated with the side of the carrier film (300)；
In the insulating barrier (400) first conductive layer (100) is coated with away from the side of the carrier film (300)；
In first conductive layer (100) second conductive layer (200) is coated with away from the side of the insulating barrier (400)；
Deviate from the side laminating diaphragm (500) of first conductive layer (100) in second conductive layer (200).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710699948.4A CN107333462B (en) | 2017-08-16 | 2017-08-16 | Conductive layer, electromagnetic shielding film and processing method of electromagnetic shielding film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710699948.4A CN107333462B (en) | 2017-08-16 | 2017-08-16 | Conductive layer, electromagnetic shielding film and processing method of electromagnetic shielding film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107333462A true CN107333462A (en) | 2017-11-07 |
| CN107333462B CN107333462B (en) | 2020-06-23 |
Family
ID=60200985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710699948.4A Active CN107333462B (en) | 2017-08-16 | 2017-08-16 | Conductive layer, electromagnetic shielding film and processing method of electromagnetic shielding film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107333462B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019033722A1 (en) * | 2017-08-16 | 2019-02-21 | 苏州城邦达力材料科技有限公司 | Conductive layer of electromagnetic shielding coating, electromagnetic shielding coating and preparation method therefor |
| TWI764350B (en) * | 2020-10-30 | 2022-05-11 | 臻鼎科技股份有限公司 | Electromagnetic shielding film and manufacturing method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102286254A (en) * | 2011-05-06 | 2011-12-21 | 广州方邦电子有限公司 | High-peeling-strength conductive adhesive film with through holes and preparation method thereof |
| CN103468159A (en) * | 2013-03-11 | 2013-12-25 | 苏州牛剑新材料有限公司 | Silver coated nickel powder conductive adhesive and preparation method thereof |
| US20150009637A1 (en) * | 2013-07-03 | 2015-01-08 | Shin-Etsu Polymer Co., Ltd. | Electromagnetic shielding film, flexible printed wiring board with electromagnetic shielding film, electronic device and method for forming the same |
| CN104853576A (en) * | 2015-05-13 | 2015-08-19 | 东莞市万丰纳米材料有限公司 | Electromagnetic shielding membrane with excellent shielding performance and production technology thereof |
| CN105283056A (en) * | 2014-07-15 | 2016-01-27 | 联茂电子股份有限公司 | Electromagnetic wave interference shielding film |
| CN106061103A (en) * | 2016-07-21 | 2016-10-26 | 东莞市航晨纳米材料有限公司 | High flexible electromagnetic shielding film and manufacturing method thereof |
| CN106952678A (en) * | 2017-04-28 | 2017-07-14 | 南昌联能科技有限公司 | A kind of electromagnetic shielding film for cable |
| CN207070595U (en) * | 2017-08-16 | 2018-03-02 | 苏州城邦达力材料科技有限公司 | The conductive layer and electromagnetic shielding film of electromagnetic shielding film |
-
2017
- 2017-08-16 CN CN201710699948.4A patent/CN107333462B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102286254A (en) * | 2011-05-06 | 2011-12-21 | 广州方邦电子有限公司 | High-peeling-strength conductive adhesive film with through holes and preparation method thereof |
| CN103468159A (en) * | 2013-03-11 | 2013-12-25 | 苏州牛剑新材料有限公司 | Silver coated nickel powder conductive adhesive and preparation method thereof |
| US20150009637A1 (en) * | 2013-07-03 | 2015-01-08 | Shin-Etsu Polymer Co., Ltd. | Electromagnetic shielding film, flexible printed wiring board with electromagnetic shielding film, electronic device and method for forming the same |
| CN105283056A (en) * | 2014-07-15 | 2016-01-27 | 联茂电子股份有限公司 | Electromagnetic wave interference shielding film |
| CN104853576A (en) * | 2015-05-13 | 2015-08-19 | 东莞市万丰纳米材料有限公司 | Electromagnetic shielding membrane with excellent shielding performance and production technology thereof |
| CN106061103A (en) * | 2016-07-21 | 2016-10-26 | 东莞市航晨纳米材料有限公司 | High flexible electromagnetic shielding film and manufacturing method thereof |
| CN106952678A (en) * | 2017-04-28 | 2017-07-14 | 南昌联能科技有限公司 | A kind of electromagnetic shielding film for cable |
| CN207070595U (en) * | 2017-08-16 | 2018-03-02 | 苏州城邦达力材料科技有限公司 | The conductive layer and electromagnetic shielding film of electromagnetic shielding film |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019033722A1 (en) * | 2017-08-16 | 2019-02-21 | 苏州城邦达力材料科技有限公司 | Conductive layer of electromagnetic shielding coating, electromagnetic shielding coating and preparation method therefor |
| TWI764350B (en) * | 2020-10-30 | 2022-05-11 | 臻鼎科技股份有限公司 | Electromagnetic shielding film and manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107333462B (en) | 2020-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6923644B2 (en) | Electromagnetic wave shield film and its manufacturing method | |
| CN107426957B (en) | Conductive adhesive film layer, preparation method and electromagnetic shielding film | |
| JP2019083205A (en) | Shield film, shielded printed wiring board, and method for manufacturing shield film | |
| CN103535123B (en) | Electromagnetic shielding gasket and manufacture method thereof | |
| US20210212243A1 (en) | Electromagnetic shielding film and method for making same | |
| KR20100028365A (en) | Electromagnetic interference suppressing hybrid sheet | |
| TW200912964A (en) | Conductor connection member, connection structure, and solar cell module | |
| JPH1041682A (en) | Adhesive film having shielding effect and transparency for electromagnetic wave, and display and electromagnetic wave shielding configuration using the film | |
| CN103929933B (en) | Structure for inhibition of electromagnetic wave interference and flexible printed circuit comprising same | |
| CN207070595U (en) | The conductive layer and electromagnetic shielding film of electromagnetic shielding film | |
| CN104219873B (en) | Shape-retaining film and shape-retaining flexible circuit board provided with same | |
| CN107333462A (en) | The processing method of conductive layer, electromagnetic shielding film and electromagnetic shielding film | |
| JP6690752B1 (en) | Electronic component mounting board and electronic device | |
| CN207885103U (en) | A kind of electromagnetic shielding film | |
| JP2018041998A (en) | Antenna and electronic device including the same | |
| KR20180062790A (en) | Composition for complex sheet with emi shields and absorbing and thermal dissipation, and complex sheet comprising the same | |
| CN204335282U (en) | There is the protective tapes inhaling wave energy | |
| JP2018060990A (en) | Sealing film, method for sealing electronic component-mounted substrate, and electronic component-mounted substrate covered with sealing film | |
| KR102006344B1 (en) | Composite sheet, antenna module and preparation thereof | |
| CN206318932U (en) | High conductivity adhesive tape | |
| CN211607245U (en) | Low-frequency shielding heat-conducting composite structure | |
| CN206561661U (en) | A kind of plastic structure with ESD protection layer | |
| KR101699952B1 (en) | Electromagnetic wave shielding and absorber composite film, and method of fabricating of the same | |
| JP3234956B2 (en) | Printed circuit board and method of manufacturing the same | |
| JP2019161101A (en) | Electromagnetic wave shield film and shield printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: No. 399 Dongping Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215000 Applicant after: Suzhou Chengbang Dayi Material Technology Co.,Ltd. Address before: 215300 Dongping Road, Bacheng Town, Suzhou City, Jiangsu Province, 399 Applicant before: SUZHOU CHENGBANGDALI MATERIAL TECHNOLOGY Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230321 Address after: 215300 room 2, No. 399, Dongping Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: KUNSHAN ZHUOYUE LANTIAN ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: No. 399 Dongping Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215000 Patentee before: Suzhou Chengbang Dayi Material Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |