CN104883865A - High-efficient low-cost electromagnetic shielding film and manufacturing method thereof - Google Patents
High-efficient low-cost electromagnetic shielding film and manufacturing method thereof Download PDFInfo
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- CN104883865A CN104883865A CN201510237273.2A CN201510237273A CN104883865A CN 104883865 A CN104883865 A CN 104883865A CN 201510237273 A CN201510237273 A CN 201510237273A CN 104883865 A CN104883865 A CN 104883865A
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Abstract
The invention discloses a high-efficient low-cost electromagnetic shielding film and a manufacturing method thereof. The electromagnetic shielding film comprises: a support film layer, an ink layer coating the support film layer, and an electrical conductive adhesive layer coating the ink layer. The electromagnetic shielding film allows a simple and easy manufacture process, and can be directly produced through a conventional FPC manufacturing procedure, such as drilling and punching. The manufacturing procedure is greatly shortened; the production efficiency is improved; and the production cost is reduced. The electrical conductive adhesive layer permits the electromagnetic shielding film of excellent conductive performance, and the conductive resistance may reach 0.3 omega in an electrode of 1 cm and a bore with a diameter of 0.5 mm. The ink layer possesses excellent insulativity and frame resistance and can reach the UL94VTM-0 effect. Furthermore, rubber elastomer can be added in each layer and enables the whole electromagnetic shielding film to possess relatively high flexibility, and a special use requirement of a flexible circuit board material is satisfied.
Description
Technical field
The present invention relates to a kind of high-effect Low-cost electric magnetic shield film, and the manufacture method of this electromagnetic shielding film, belong to electromangnetic spectrum field.
Background technology
In order to avoid electromagnetic radiation is to the threat of health, avoid the signal disturbing that electromagnetic radiation causes, the requirement for electromagnetic shielding in electronic product is more and more higher simultaneously, therefore, the circuit of flexible circuit board can use electromagnetic shielding membrane material in a large number.And electromagnetic shielding film material fabrication process of the prior art is complicated, and noble silver can be used in a large number, cause the cost of electromagnetic shielding film to remain high, finally have impact on the price of electronic product, make the competitiveness of product in market not enough.
Summary of the invention
For solving the deficiencies in the prior art, the object of the present invention is to provide a kind of electromagnetic shielding film and manufacture method thereof of high-effect low cost, this electromagnetic shielding film can directly be produced by the FPC manufacturing procedure that boring, stamp etc. are conventional.
In order to realize above-mentioned target, the present invention adopts following technical scheme:
A kind of high-effect Low-cost electric magnetic shield film, comprising: carrier film layer, coat the ink layer on carrier film layer and coat the conductive adhesive layer on ink layer, constitutes " three layers of electromagnetic shielding film " of low cost.
Further, on aforesaid conductive adhesive layer, also hot pressing is fitted with one deck release film layer, is " four layers of electromagnetic shielding film ".
Preferably, aforementioned bearer thin layer is the modified film of one or more of PET, PEN, PI, PBT and PPS film, and thickness is 25-200 μm.
More preferably, aforementioned ink layer is the mixture of one or more in epoxy resin, polyacrylic resin, rubber elastomer, phenolic resins, mylar and polyurethane resin, and thickness is 5-50 μm.
Further, also fire retardant, colorant, inorganic filler and dispersant is contained in aforementioned ink layer.Fire retardant can be the organic compound of phosphorous, nitrogenous class, colorant can be one or more mixtures in carbon black, graphite, titanium dioxide, inorganic filler can be one or more mixtures in silicon dioxide, calcium carbonate, talcum powder, kaolin, dispersant is the auxiliary agent improving dispersive property, can be one or more mixtures in polyester-type, polyether-type, polyacrylate, TPO.
Preferably, aforesaid conductive adhesive layer thickness is 3-15 μm, is mixed and forms, optimize the conduction property of electromagnetic shielding film further by resin binder and conductive filler; Described resin binder is the mixture of one or more in modified epoxy, polyacrylic resin, polyimide resin, rubber elastomer, phenolic resins, mylar, polyurethane resin; Described conductive filler is the mixture of one or more in silver powder, silver-coated copper powder, copper powder and nickel powder, and the particle diameter of conductive filler is 1-15 μm, and shape is sheet shape, spherical, oval or dendriform.
Preferably, aforementioned release film layer is the one in PET release film, PP release film, PBT release film or release liners, and thickness is 25-200 μm.
The invention also discloses the manufacture method of aforesaid " four layers of electromagnetic shielding film ", comprise the steps:
A-1, use micro-sticky take turns remove carrier thin film volume inner face foreign particles;
A-2, the ink layer prepared in the coating of carrier thin film volume inner face;
A-3, ink layer carry out drying through coater oven, and coater oven set temperature is 80-180 DEG C, and linear velocity is set to 5-30m/min;
A-4, be then coated with one deck conductive adhesive layer at ink layer surface, and dry through coater oven, and coater oven set temperature is 30-80 DEG C, and linear velocity is set to 5-30m/min;
A-5, on conductive adhesive layer hot pressing to fit one deck release film layer;
A-6, harvest volume.
Except adopting aforesaid manufacture method, " four layers of electromagnetic shielding film " of the present invention also can adopt following steps manufacture:
B-1, use micro-sticky take turns remove carrier thin film volume inner face foreign particles;
B-2, the ink layer prepared in the coating of carrier thin film volume inner face;
B-3, ink layer carry out drying through coater oven, and coater oven set temperature is 80-180 DEG C, and linear velocity is set to 5-30m/min;
B-4, by the carrier film layer rolling of coated ink layer;
B-5, on release film layer, be coated with one deck conductive adhesive layer, and dry through coater oven, and coater oven set temperature is 30-80 DEG C, and linear velocity is set to 5-30m/min;
B-6, the ink layer on carrier thin film and the conductive adhesive layer on release film layer are carried out hot pressing laminating;
B-7, harvest volume.
In addition, the cost of " three layers of electromagnetic shielding film " of the present invention is lower, and its manufacture method is as follows:
C-1, use micro-sticky take turns remove carrier thin film volume inner face foreign particles;
C-2, the ink layer prepared in the coating of carrier thin film volume inner face;
C-3, ink layer carry out drying through coater oven, and coater oven set temperature is 80-180 DEG C, and linear velocity is set to 5-30m/min;
C-4, be then coated with one deck conductive adhesive layer at ink layer surface, and dry through coater oven, and coater oven set temperature is 30-100 DEG C, and linear velocity is set to 5-30m/min;
C-5, harvest volume.
Usefulness of the present invention is: electromagnetic shielding film of the present invention can complete manufacture by the mode of twice coating, substantially reduces manufacturing procedure, improves production efficiency, reduce production cost; Conductive adhesive layer gives the conduction property of electromagnetic shielding film excellence, and conducting resistance, between 1cm electrode, can reach 0.3 Ω during perforate 0.5mm diameter; Ink layer has good insulating properties and excellent flame resistance, can reach UL94VTM-0 effect; In addition, also by adding rubber elastomer in layers, whole electromagnetic shielding film being had higher flexible, meeting the Special use requirement of flexible circuitry plate material.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiments of the invention 1 " four layers of electromagnetic shielding film ";
Fig. 2 is the structural representation of embodiments of the invention 2 " three layers of electromagnetic shielding film ".
The implication of Reference numeral in figure: 1, carrier film layer, 2, ink layer, 3, conductive adhesive layer, 4, release film layer.
Embodiment
Below in conjunction with the drawings and specific embodiments, concrete introduction is done to the present invention.
Embodiment 1
" four layers of electromagnetic shielding film " of the present embodiment has low cost, dynamical feature, its structure as shown in Figure 1, comprise: carrier film layer 1, the conductive adhesive layer 3 coated the ink layer 2 on carrier film layer 1 and coat on ink layer 2, on conductive adhesive layer 3, also hot pressing is fitted with one deck release film layer 4.
Carrier film layer 1 is high-temperature resistant carrier, is high molecular polymer film, and mainly to ink layer 2 lamination protections and carrier function, be specifically as follows the modified film of one or more of PET, PEN, PI, PBT and PPS film, thickness is 25-200 μm.
Ink layer 2 can be the mixture of one or more in epoxy resin, polyacrylic resin, rubber elastomer, phenolic resins, mylar and polyurethane resin, and thickness is 5-50 μm.Also contain the functional materials such as fire retardant, colorant, inorganic filler and dispersant in ink layer 2 simultaneously, fire retardant can be the organic compound of phosphorous, nitrogenous class, colorant can be one or more mixtures in carbon black, graphite, titanium dioxide, inorganic filler can be one or more mixtures in silicon dioxide, calcium carbonate, talcum powder, kaolin, dispersant is the auxiliary agent improving dispersive property, can be one or more mixtures in polyester-type, polyether-type, polyacrylate, TPO.This ink layer 2 has rapid curing, softness and good insulated type, and flame resistance is also very excellent.
Conductive adhesive layer 3 thickness is 3-15 μm, is mixed and forms, optimize the conduction property of electromagnetic shielding film further by resin binder and conductive filler.Wherein, resin binder is the mixture of one or more in modified epoxy, polyacrylic resin, polyimide resin, rubber elastomer, phenolic resins, mylar, polyurethane resin; Conductive filler is the mixture of one or more in silver powder, silver-coated copper powder, copper powder and nickel powder, and the particle diameter of conductive filler is 1-15 μm, various shapes, can be sheet shape, spherical, oval or dendriform.
Release film layer 4 gives the characteristic that electromagnetic shielding film is easily peeled off, and adopt the rationality protective material being coated with silicone oil or non-silicone oil mould release, specifically can be the one in PET release film, PP release film, PBT release film or release liners, thickness is 25-200 μm.
The manufacture method of being somebody's turn to do " four layers of electromagnetic shielding film " has two kinds, and first method step is:
A-1, use micro-sticky take turns remove carrier thin film volume inner face foreign particles;
A-2, the ink layer 2 prepared in the coating of carrier thin film volume inner face;
A-3, ink layer 2 carry out drying through coater oven, and coater oven set temperature is 80-180 DEG C, and linear velocity is set to 5-30m/min;
A-4, be then coated with one deck conductive adhesive layer 3 on ink layer 2 surface, and dry through coater oven, and coater oven set temperature is 30-80 DEG C, and linear velocity is set to 5-30m/min;
A-5, on conductive adhesive layer 3 hot pressing to fit one deck release film layer 4;
A-6, harvest volume.
Except adopting aforesaid manufacture method, also can adopt following steps manufacture:
B-1, use micro-sticky take turns remove carrier thin film volume inner face foreign particles;
B-2, the ink layer 2 prepared in the coating of carrier thin film volume inner face;
B-3, ink layer 2 carry out drying through coater oven, and coater oven set temperature is 80-180 DEG C, and linear velocity is set to 5-30m/min;
B-4, by carrier film layer 1 rolling of coated ink layer 2;
B-5, on release film layer 4, be coated with one deck conductive adhesive layer 3, and dry through coater oven, and coater oven set temperature is 30-80 DEG C, and linear velocity is set to 5-30m/min;
B-6, the ink layer 2 on carrier thin film and the conductive adhesive layer 3 on release film layer 4 are carried out hot pressing laminating;
B-7, harvest volume.
Embodiment 2
The electromagnetic shielding film of the present embodiment is three-decker, and compared to embodiment 1, difference part is to eliminate release film layer 4, and under the prerequisite not affecting properties of product, can reduce product cost further, its manufacture method comprises the steps:
C-1, use micro-sticky take turns remove carrier thin film volume inner face foreign particles;
C-2, the ink layer 2 prepared in the coating of carrier thin film volume inner face;
C-3, ink layer 2 carry out drying through coater oven, and coater oven set temperature is 80-180 DEG C, and linear velocity is set to 5-30m/min;
C-4, be then coated with one deck conductive adhesive layer 3 on ink layer 2 surface, and dry through coater oven, and coater oven set temperature is 30-100 DEG C, and linear velocity is set to 5-30m/min;
C-5, harvest volume.
To sum up, electromagnetic shielding film processing step of the present invention is simple and easy to realize, and processing cost is low, has the good prospect industrially applied; Obtained electromagnetic shielding film has excellent conduction property, and conducting resistance, between 1cm electrode, can reach 0.3 Ω during perforate 0.5mm diameter; And ink layer 2 has good insulating properties and excellent flame resistance, can reach UL94VTM-0 effect.
More than show and describe general principle of the present invention, principal character and advantage.The technical staff of the industry should understand, and above-described embodiment does not limit the present invention in any form, the technical scheme that the mode that all employings are equal to replacement or equivalent transformation obtains, and all drops in protection scope of the present invention.
Claims (10)
1. a high-effect Low-cost electric magnetic shield film, is characterized in that, comprising: carrier film layer, coat the ink layer on carrier film layer and coat the conductive adhesive layer on ink layer.
2. the high-effect Low-cost electric magnetic shield film of one according to claim 1, is characterized in that, on described conductive adhesive layer, also hot pressing is fitted with one deck release film layer.
3. the high-effect Low-cost electric magnetic shield film of one according to claim 1, is characterized in that, described carrier film layer is the modified film of one or more of PET, PEN, PI, PBT and PPS film, and thickness is 25-200 μm.
4. the high-effect Low-cost electric magnetic shield film of one according to claim 1, it is characterized in that, described ink layer is the mixture of one or more in epoxy resin, polyacrylic resin, rubber elastomer, phenolic resins, mylar and polyurethane resin, and thickness is 5-50 μm.
5. the high-effect Low-cost electric magnetic shield film of one according to claim 4, is characterized in that, also containing fire retardant, colorant, inorganic filler and dispersant in described ink layer; Described fire retardant is the organic compound flame retardant of phosphorous, nitrogenous class, described colorant is one or more mixtures in carbon black, graphite, titanium dioxide, described inorganic filler is one or more mixtures in silicon dioxide, calcium carbonate, talcum powder, kaolin, and described dispersant is one or more mixtures in polyester-type, polyether-type, polyacrylate, TPO dispersant.
6. the high-effect Low-cost electric magnetic shield film of one according to claim 1, is characterized in that, described conductive adhesive layer thickness is 3-15 μm, is mixed form by resin binder and conductive filler; Described resin binder is the mixture of one or more in modified epoxy, polyacrylic resin, polyimide resin, rubber elastomer, phenolic resins, mylar, polyurethane resin; Described conductive filler is the mixture of one or more in silver powder, silver-coated copper powder, copper powder and nickel powder, and the particle diameter of conductive filler is 1-15 μm, and shape is sheet shape, spherical, oval or dendriform.
7. the high-effect Low-cost electric magnetic shield film of one according to claim 2, is characterized in that, described release film layer is the one in PET release film, PP release film, PBT release film or release liners, and thickness is 25-200 μm.
8. the manufacture method of a kind of high-effect Low-cost electric magnetic shield film as claimed in claim 2, is characterized in that, comprise the steps:
A-1, use micro-sticky take turns remove carrier thin film volume inner face foreign particles;
A-2, the ink layer prepared in the coating of carrier thin film volume inner face;
A-3, ink layer carry out drying through coater oven, and coater oven set temperature is 80-180 DEG C, and linear velocity is set to 5-30m/min;
A-4, be then coated with one deck conductive adhesive layer at ink layer surface, and dry through coater oven, and coater oven set temperature is 30-80 DEG C, and linear velocity is set to 5-30m/min;
A-5, on conductive adhesive layer hot pressing to fit one deck release film layer;
A-6, harvest volume.
9. the manufacture method of a kind of high-effect Low-cost electric magnetic shield film as claimed in claim 2, is characterized in that, comprise the steps:
B-1, use micro-sticky take turns remove carrier thin film volume inner face foreign particles;
B-2, the ink layer prepared in the coating of carrier thin film volume inner face;
B-3, ink layer carry out drying through coater oven, and coater oven set temperature is 80-180 DEG C, and linear velocity is set to 5-30m/min;
B-4, by the carrier film layer rolling of coated ink layer;
B-5, on release film layer, be coated with one deck conductive adhesive layer, and dry through coater oven, and coater oven set temperature is 30-80 DEG C, and linear velocity is set to 5-30m/min;
B-6, the ink layer on carrier thin film and the conductive adhesive layer on release film layer are carried out hot pressing laminating;
B-7, harvest volume.
10. the manufacture method of a kind of high-effect Low-cost electric magnetic shield film as claimed in claim 1, is characterized in that, comprise the steps:
C-1, use micro-sticky take turns remove carrier thin film volume inner face foreign particles;
C-2, the ink layer prepared in the coating of carrier thin film volume inner face;
C-3, ink layer carry out drying through coater oven, and coater oven set temperature is 80-180 DEG C, and linear velocity is set to 5-30m/min;
C-4, be then coated with one deck conductive adhesive layer at ink layer surface, and dry through coater oven, and coater oven set temperature is 30-100 DEG C, and linear velocity is set to 5-30m/min;
C-5, harvest volume.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510237273.2A CN104883865A (en) | 2015-05-12 | 2015-05-12 | High-efficient low-cost electromagnetic shielding film and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510237273.2A CN104883865A (en) | 2015-05-12 | 2015-05-12 | High-efficient low-cost electromagnetic shielding film and manufacturing method thereof |
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| CN104883865A true CN104883865A (en) | 2015-09-02 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106916558A (en) * | 2015-11-27 | 2017-07-04 | 日东电工株式会社 | The manufacture method of adhesive sheet, dicing tape integrated adhesive sheet and semiconductor device |
| CN107187145A (en) * | 2017-06-14 | 2017-09-22 | 深圳市西陆光电技术有限公司 | The anti-electromagnetic wave interference shielding film and preparation method of a kind of multilayer alloy-layer for FPC |
| CN109161350A (en) * | 2018-09-18 | 2019-01-08 | 江西华莲欣科技有限公司 | A kind of highly-breathable is suitable for the electromagnetic shielding film and preparation method thereof of 5G |
| WO2019033723A1 (en) * | 2017-08-16 | 2019-02-21 | 苏州城邦达力材料科技有限公司 | Electromagnetic interference shielding film |
| WO2022178390A1 (en) * | 2021-02-22 | 2022-08-25 | The Cube 5 Inc. | Electromagnetic radiation shielding receptacle assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130206315A1 (en) * | 2010-06-23 | 2013-08-15 | Inktec Co., Ltd. | Method for Manufacturing Electromagnetic Interference Shielding Film |
| CN103619121A (en) * | 2013-11-26 | 2014-03-05 | 苏州城邦达力材料科技有限公司 | Laminating protective ink for circuit board |
| CN104507301A (en) * | 2014-12-16 | 2015-04-08 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film with metal coating and manufacturing technique of electromagnetic shielding film |
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2015
- 2015-05-12 CN CN201510237273.2A patent/CN104883865A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130206315A1 (en) * | 2010-06-23 | 2013-08-15 | Inktec Co., Ltd. | Method for Manufacturing Electromagnetic Interference Shielding Film |
| CN103619121A (en) * | 2013-11-26 | 2014-03-05 | 苏州城邦达力材料科技有限公司 | Laminating protective ink for circuit board |
| CN104507301A (en) * | 2014-12-16 | 2015-04-08 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film with metal coating and manufacturing technique of electromagnetic shielding film |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106916558A (en) * | 2015-11-27 | 2017-07-04 | 日东电工株式会社 | The manufacture method of adhesive sheet, dicing tape integrated adhesive sheet and semiconductor device |
| CN107187145A (en) * | 2017-06-14 | 2017-09-22 | 深圳市西陆光电技术有限公司 | The anti-electromagnetic wave interference shielding film and preparation method of a kind of multilayer alloy-layer for FPC |
| WO2019033723A1 (en) * | 2017-08-16 | 2019-02-21 | 苏州城邦达力材料科技有限公司 | Electromagnetic interference shielding film |
| CN109161350A (en) * | 2018-09-18 | 2019-01-08 | 江西华莲欣科技有限公司 | A kind of highly-breathable is suitable for the electromagnetic shielding film and preparation method thereof of 5G |
| WO2022178390A1 (en) * | 2021-02-22 | 2022-08-25 | The Cube 5 Inc. | Electromagnetic radiation shielding receptacle assembly |
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Application publication date: 20150902 |