CN107787119A - Cover film for circuit board stamping process and manufacturing method of circuit board - Google Patents
Cover film for circuit board stamping process and manufacturing method of circuit board Download PDFInfo
- Publication number
- CN107787119A CN107787119A CN201610827149.6A CN201610827149A CN107787119A CN 107787119 A CN107787119 A CN 107787119A CN 201610827149 A CN201610827149 A CN 201610827149A CN 107787119 A CN107787119 A CN 107787119A
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- China
- Prior art keywords
- layer
- circuit board
- processing procedure
- punching press
- press processing
- Prior art date
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Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 6
- 239000013039 cover film Substances 0.000 title 1
- 238000003672 processing method Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 49
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 58
- 238000004080 punching Methods 0.000 claims description 47
- 238000002360 preparation method Methods 0.000 claims description 18
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 11
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 11
- 229920000728 polyester Polymers 0.000 claims description 10
- 239000004814 polyurethane Substances 0.000 claims description 9
- -1 acryl Chemical group 0.000 claims description 8
- 229920002635 polyurethane Polymers 0.000 claims description 7
- 230000004224 protection Effects 0.000 claims description 6
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 5
- 229920006026 co-polymeric resin Polymers 0.000 claims description 5
- 229920002530 polyetherether ketone Polymers 0.000 claims description 5
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 5
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 2
- 239000011112 polyethylene naphthalate Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 5
- 230000001681 protective effect Effects 0.000 abstract description 4
- 238000009413 insulation Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 abstract 8
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
- 238000012797 qualification Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000002310 reflectometry Methods 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 241001232787 Epiphragma Species 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a covering film for a circuit board stamping process and a manufacturing method of the circuit board. The first side of the first adhesion layer is connected to a first surface of the insulation film, and the second side of the first adhesion layer is used for adhering to at least one metal conductor of a circuit board. The colored ink layer is formed on a second surface of the insulating film. The protective film comprises a high-temperature resistant substrate and a second adhesion layer. The first side of the second adhesion layer is connected to the high temperature resistant substrate, and the second side of the second adhesion layer is removably adhered to the colored ink layer. The second adhesive layer of the protective film is used for stripping from the colored ink layer after the stamping process of the circuit board.
Description
Technical field
The present invention is relevant to a kind of preparation method of cover layer and circuit board for circuit board punching press processing procedure, espespecially a kind of
The preparation method that the cover layer and circuit board of pigmented ink layer can be avoided damage in circuit board punching press processing procedure.
Background technology
Electronic installation generally there is flexible printed wiring board to be electrically connected to different electronic building bricks to provide signal transmission.One
As for, flexible printed wiring board is that dielectric film is attached on metallic circuit, then by a punching press processing procedure with formed tool it is specific
The flexible printed wiring board of shape.When flexible printed wiring board is applied on lighting device, the insulation of flexible printed wiring board
A pigmented ink layer (such as white) can be formed on film to increase the reflectivity of flexible printed wiring board.However, when dielectric film passes through
During overshoot compacting journey, pigmented ink layer easily cracking or peeling, and then reduce the production of flexible printed wiring board on dielectric film
Efficiency and qualification rate.
The content of the invention
It is an object of the invention to provide a kind of covering that pigmented ink layer can be avoided damage in circuit board punching press processing procedure
The preparation method of film and circuit board, to solve problem of the prior art.
The cover layer that the present invention is used for circuit board punching press processing procedure includes a dielectric film, one first following layer, a colored ink
Layer and a diaphragm.First side of first following layer is connected to a first surface of the dielectric film, first following layer
One second side is to then in an at least metallic conductor for a circuit board.The pigmented ink layer is formed at the one second of the dielectric film
Surface.The diaphragm includes a high temperature resistant base material and one second following layer.It is resistance to that first side of second following layer is connected to this
High temperature substrate, the second side of second following layer is removably then in the pigmented ink layer.The wherein diaphragm
Second following layer to after the punching press processing procedure of the circuit board from the pigmented ink layer peel off.
In an embodiment of cover layer of the present invention, the thickness of the high temperature resistant base material is between 17 microns and 100 microns.
In an embodiment of cover layer of the present invention, the thickness of second following layer is between 8 microns and 25 microns.
In an embodiment of cover layer of the present invention, the thickness of the dielectric film is between 7.5 microns and 25 microns.
In an embodiment of cover layer of the present invention, the thickness of first following layer is between 10 microns and 50 microns.
In an embodiment of cover layer of the present invention, the thickness of the pigmented ink layer is between 12 microns and 25 microns.
In an embodiment of cover layer of the present invention, the cover layer is also comprising second side for being covered in first following layer
A fractal film.
In an embodiment of cover layer of the present invention, 200 degrees Celsius of the heat resisting temperature of the high temperature resistant base material.
In an embodiment of cover layer of the present invention, the light shielding rate of the pigmented ink layer is between 70% and 90%.
In an embodiment of cover layer of the present invention, the high temperature resistant base material is by PET (PET), poly-
Acid imide (PI), polyphenylene sulfide (PPS), PEN (PEN), polyether-ether-ketone (PEEK) are formed.
In an embodiment of cover layer of the present invention, then material, acryl system be then by rubber series for second following layer
Then then material is formed for material, polyurethane (polyurethane, PU) system for material, silica gel system.
In an embodiment of cover layer of the present invention, the diaphragm also includes an increasing stick layer, is formed at the high temperature resistant base material
And between second following layer, the increasing stick layer by polyester series identical with second following layer polyester organosilicon copolymer resins institute
Formed.
In an embodiment of cover layer of the present invention, the thickness of the increasing stick layer is between 1 micron and 3 microns.
In an embodiment of cover layer of the present invention, the peeling force between the high temperature resistant base material and second following layer is
80-200gf/cm。
In an embodiment of cover layer of the present invention, the adhesion between second following layer and the pigmented ink layer is 5-
15gf/25mm。
The preparation method of circuit board of the present invention includes providing a cover layer, and the wherein cover layer includes a dielectric film, and one the
One following layer, a pigmented ink layer and a diaphragm, the first side of first following layer are connected to the one first of the dielectric film
Surface, the pigmented ink layer are formed at a second surface of the dielectric film, and the diaphragm includes a high temperature resistant base material and one the
Two following layers, the first side of second following layer are connected to the high temperature resistant base material, and the second side of second following layer is with removable
Mode then in the pigmented ink layer；Second side joint of first following layer in an at least metallic conductor；To the covering
Film carries out a punching press processing procedure；And the second following layer of the diaphragm is peeled off from the pigmented ink layer after the punching press processing procedure.
In an embodiment of the preparation method of circuit board of the present invention, the cover layer also includes a fractal film, is covered in this
Second side of the first following layer, the second side joint that the preparation method is also included in first following layer reach in the circuit board
Except the fractal film.
In an embodiment of the preparation method of circuit board of the present invention, it is resistance to that the diaphragm is also formed at this including an increasing stick layer
Between high temperature substrate and second following layer, the increasing stick layer is total to by the polyester organosilicon of polyester series identical with second following layer
Poly resin is formed.
Compared to prior art, the cover layer that the present invention is used for circuit board punching press processing procedure can be used to protect having on dielectric film
Color ink layer, to avoid pigmented ink layer from being cracked or peel off after circuit board punching press processing procedure.Therefore, the present invention is used for circuit board punching
The cover layer of compacting journey can improve the production efficiency and qualification rate of circuit board.
Brief description of the drawings
Fig. 1 is the schematic diagram for the cover layer that the present invention is used for circuit board punching press processing procedure.
Fig. 2 is the schematic diagram of the preparation method for the cover layer that the present invention is used for circuit board punching press processing procedure.
Fig. 3 is the schematic diagram of another embodiment of cover layer of the present invention.
Fig. 4 is the schematic diagram of the preparation method of circuit board of the present invention.
Fig. 5 is the flow chart of the preparation method of circuit board of the present invention.
In figure：
100th, 100 ' cover layer；
110 dielectric films；
120 first following layers；
130 pigmented ink layers；
140th, 140 ' diaphragm；
142 high temperature resistant base materials；
144 second following layers；
146 increasing stick layers；
150 fractal films；
200 circuit boards；
500 flow charts；
510 to 540 steps.
Embodiment
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings, so that those skilled in the art can be with
It is better understood from the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
It refer to Fig. 1.Fig. 1 is the schematic diagram for the cover layer that the present invention is used for circuit board punching press processing procedure.As shown in figure 1, this
Invent includes a dielectric film 110, one first following layer 120, a pigmented ink layer for the cover layer 100 of circuit board punching press processing procedure
130 and a diaphragm 140.Dielectric film 110 can be by polyimide resin (polyimide resin), polyester resin
(polyester resin), pet resin (polyethylene terephthalate resin),
Polyvinyl resin (polyethylene resin), acrylic resin (polypropylene resin), Corvic
(polyvinyl chloride resin), polystyrene resin (polystyrene resin) or polycarbonate resin
(polycarbonate resin) forms invention.The first side (upside) of first following layer 120 is connected to dielectric film 110
One first surface (lower surface), and the second side (downside) of the first following layer 120 is to then in a circuit board, (such as one is soft
Printed circuit board (PCB)) an at least metallic conductor.First following layer 120 can be by acrylic resin (acrylic acid
Resin), epoxy resin (epoxy resin), phenolic resin (Phenol Formaldehyde resin) or polyester resin apply
It is distributed on the first surface of dielectric film 110 and is formed.Adhesion between first following layer 120 and dielectric film 110 is 0.4-
2kgf/mm.Pigmented ink layer 130 is formed at a second surface (upper surface) for dielectric film 110.The light of pigmented ink layer 130 hides
Rate is covered between 70%-90%.Diaphragm 140 includes a high temperature resistant base material 142 and one second following layer 144.High temperature resistant base
Material 142 can be by PET (PET), polyimides (PI), polyphenylene sulfide (PPS), poly- naphthalenedicarboxylic acid second two
Alcohol ester (PEN), polyether-ether-ketone (PEEK) are formed.The heat resisting temperature of high temperature resistant base material 142 is up to 200 degree Celsius.Second then
The first side (upside) of layer 144 is connected to high temperature resistant base material 142, and the second side (downside) of the second following layer 144 is with removable
Mode then in pigmented ink layer 130.Second following layer 144 can by rubber series then material, acryl system then material,
Then then material is formed for material, polyurethane (polyurethane, PU) system for silica gel system.
In addition, cover layer 100 can also include a fractal film 150, the second side of the first following layer 120 is covered in, to avoid
Second side of the first following layer 120 is attached to foreign matter before the then at least metallic conductor in circuit board.
In embodiments of the present invention, the thickness of high temperature resistant base material is between 17 microns -100 microns；Second following layer
Thickness is between 8 microns -25 microns；The thickness of dielectric film is between 7.5 microns -25 microns；The thickness of first following layer
Degree is between 10 microns -50 microns；The thickness of pigmented ink layer is between 12 microns -25 microns.
Fig. 2 is refer to, and with reference to Fig. 1.Fig. 2 is the making side for the cover layer that the present invention is used for circuit board punching press processing procedure
The schematic diagram of method.As shown in Fig. 2 can be coated with the first surface of dielectric film 110 then material to form the first following layer 120,
And colored ink can be coated with the second surface of dielectric film 110 to form pigmented ink layer 130.Afterwards, fractal film 150 can enter one
Step is attached at the first following layer 120.In addition, can be coated with high temperature resistant base material 142 then material to form the second following layer 144.
Second following layer 144 is further attached on pigmented ink layer 130, is used for covering for circuit board punching press processing procedure to form the present invention
Epiphragma 100.When being coated with that then material is to form the second following layer 144 on high temperature resistant base material 142, high temperature resistant base material 142 and
2 days can be placed 7 days or be placed in 40 degree Celsius of environment to second following layer 144 to make the second following layer 144 solid in room temperature
Change, and then ensure that 142 and second following layer of high temperature resistant base material 144 can be closely coupled.Furthermore the second following layer 144 after solidification
Stickiness can reduce, therefore do not have cull when the second following layer 144 is peeled off from pigmented ink layer.In the embodiment of the present invention
In, the peeling force between the following layer 144 of high temperature resistant base material 142 and second is 80-100gf/cm, and the second following layer 144 and is had
Adhesion between color ink layer 130 is 5-15gf/25mm.
On the other hand, as shown in figure 3, in another embodiment 100 ' of cover layer of the present invention, diaphragm 140 ' can also include
One increasing stick layer 146 is formed between the following layer 144 of high temperature resistant base material 142 and second.The thickness of increasing stick layer 146 is between 1 micron -3
Between micron, and increasing stick layer 146 can be by the polyester organosilicon copolymer resins institute with 144 identical polyester series of the second following layer
Formed.For example, when the second following layer 144 by polyurethane series then material is formed when, increasing stick layer 146 can be by polyurethane
Organosilicon copolymer resins is formed.Increasing stick layer 146 can be used to increase the stripping between high temperature resistant base material 142 and the second following layer 144
From power to 160-200gf/cm.
Fig. 4 is refer to, Fig. 4 is the schematic diagram of the preparation method of circuit board of the present invention.As shown in figure 4, when making circuit board
When (such as flexible printed wiring board), the fractal film 150 of cover layer 100 can be first removed.Afterwards, the of the first following layer 120
Two sides can be then in the metallic conductor 200 (such as metallic circuit) of circuit board.Afterwards, cover layer 100 can pass through a punching press processing procedure.
After punching press processing procedure, the second following layer 144 of diaphragm 140 can be peeled off from pigmented ink layer 130.Furthermore metallic conductor 200
Opposite side can separately attach a dielectric film further to form a single or multiple lift circuit board.The preparation method of circuit board of the present invention is also
Circuit board can be formed using cover layer 100 '.
According to above-mentioned configuration, when carrying out punching press processing procedure, pigmented ink layer 130 can be by the high temperature resistant base material of diaphragm 140
142 protections are without being destroyed, to avoid cracking or peeling after the punching press processing procedure of pigmented ink layer 130.Therefore cover layer of the present invention
100 can improve the production efficiency and qualification rate of circuit board.On the other hand, because the second following layer 144 of diaphragm 140 is rushing
It can be peeled off after compacting journey from pigmented ink layer 130 and without cull, therefore, diaphragm 140 not interfere with colored ink after removing
The function of layer 130.
For example, in the first embodiment of the present invention, the high temperature resistant base material 142 of diaphragm 140 is to benzene two by poly-
Formic acid second diester (PET) forms the film of 100 microns of thickness, and the pressure of 20 microns of thickness is coated on high temperature resistant base material 142
Gram force system then material to form the second following layer 134.In the second embodiment of the present invention, the high temperature resistant base of diaphragm 140
Material 142 is the film that 75 microns of thickness is formed by PET (PET), and is applied again on high temperature resistant base material 142
The acryl system of 25 microns of cloth thickness then material to form the second following layer 134.In the third embodiment of the present invention, protection
The high temperature resistant base material 142 of film 140 is the film that 125 microns of thickness is formed by PET (PET), and resistance to
Be coated on high temperature substrate 142 the acryl system of 15 microns of thickness then material to form the second following layer 134.When comprising above-mentioned
The cover layer of diaphragm is after punching press processing procedure removes diaphragm again, and pigmented ink layer 130 is all without cracking, peeling or cull
Situation, in other words, circuit board in punching press processing procedure qualification rate close to 100%.In addition, remove the pigmented ink layer after diaphragm
The reflectivity of the pigmented ink layer 130 of 130 reflectivity and non-pasting protective film is fairly close, in other words, diaphragm not shadow
Ring the reflectivity of pigmented ink layer 130.Furthermore remove the value of chromatism of the pigmented ink layer 130 after diaphragm and non-pasting protective film
Pigmented ink layer 130 value of chromatism it is fairly close, in other words, diaphragm does not influence the color of pigmented ink layer 130.
Fig. 5 is refer to, Fig. 5 is the flow chart 500 of the preparation method of circuit board of the present invention.The making side of circuit board of the present invention
The flow of method such as the following steps：
Step 510：One cover layer is provided, the wherein cover layer includes a dielectric film, one first following layer, a pigmented ink layer with
And a diaphragm, the first side of first following layer are connected to a first surface of the dielectric film, the pigmented ink layer is to be formed
In a second surface of the dielectric film, the diaphragm includes a high temperature resistant base material and one second following layer, second following layer
The first side be connected to the high temperature resistant base material, the second side of second following layer is removably then in the colored ink
Layer；
Step 520：Second side joint of first following layer in an at least metallic conductor；
Step 530：One punching press processing procedure is carried out to the cover layer；And
Step 540：The second following layer of the diaphragm is peeled off from the pigmented ink layer after the punching press processing procedure.
Compared to prior art, the cover layer that the present invention is used for circuit board punching press processing procedure can be used to protect having on dielectric film
Color ink layer, to avoid pigmented ink layer from being cracked or peel off after circuit board punching press processing procedure.Therefore, the present invention is used for circuit board punching
The cover layer of compacting journey can improve the production efficiency and qualification rate of circuit board.
Embodiment described above is only to absolutely prove preferred embodiment that is of the invention and being lifted, protection model of the invention
Enclose not limited to this.The equivalent substitute or conversion that those skilled in the art are made on the basis of the present invention, in the present invention
Protection domain within.Protection scope of the present invention is defined by claims.
Claims (18)
- A kind of 1. cover layer for circuit board punching press processing procedure, it is characterised in that including：One dielectric film；One first following layer, the first side of first following layer are connected to a first surface of the dielectric film, first following layer One second side to then in an at least metallic conductor for a circuit board；One pigmented ink layer, it is formed at a second surface of the dielectric film；AndOne diaphragm, including：One high temperature resistant base material；AndOne second following layer, the first side of second following layer are connected to the high temperature resistant base material, the second side of second following layer Removably then in the pigmented ink layer；Wherein the second following layer of the diaphragm to after the punching press processing procedure of the circuit board from the pigmented ink layer peel off.
- 2. the cover layer according to claim 1 for circuit board punching press processing procedure, it is characterised in that the wherein high temperature resistant base The thickness of material is between 17 microns and 100 microns.
- 3. the cover layer according to claim 1 for circuit board punching press processing procedure, it is characterised in that wherein this is second then The thickness of layer is between 8 microns and 25 microns.
- 4. the cover layer according to claim 1 for circuit board punching press processing procedure, it is characterised in that the wherein dielectric film Thickness is between 7.5 microns and 25 microns.
- 5. the cover layer according to claim 1 for circuit board punching press processing procedure, it is characterised in that wherein this is first then The thickness of layer is between 10 microns and 50 microns.
- 6. the cover layer according to claim 1 for circuit board punching press processing procedure, it is characterised in that the wherein colored ink The thickness of layer is between 12 microns and 25 microns.
- 7. the cover layer according to claim 1 for circuit board punching press processing procedure, it is characterised in that also include being covered in this One fractal film of second side of the first following layer.
- 8. the cover layer according to claim 1 for circuit board punching press processing procedure, it is characterised in that the wherein high temperature resistant base The heat resisting temperature of material is 200 degrees Celsius.
- 9. the cover layer according to claim 1 for circuit board punching press processing procedure, it is characterised in that the wherein colored ink The light shielding rate of layer is between 70% and 90%.
- 10. the cover layer according to claim 1 for circuit board punching press processing procedure, it is characterised in that the wherein high temperature resistant Base material is formed by PET, polyimides, polyphenylene sulfide, PEN, polyether-ether-ketone.
- 11. the cover layer according to claim 1 for circuit board punching press processing procedure, it is characterised in that wherein this second connects Layer, then then then then material is formed for material, polyurethane series for material, silica gel system for material, acryl system by rubber series.
- 12. the cover layer according to claim 11 for circuit board punching press processing procedure, it is characterised in that the wherein diaphragm Also include being formed at an increasing stick layer between the high temperature resistant base material and second following layer, the increasing stick layer by with second following layer The polyester organosilicon copolymer resins of identical polyester series is formed.
- 13. the cover layer according to claim 1 for circuit board punching press processing procedure, it is characterised in that the wherein increasing stick layer Thickness between 1 micron and 3 microns.
- 14. the cover layer according to claim 1 for circuit board punching press processing procedure, it is characterised in that the wherein high temperature resistant Peeling force between base material and second following layer is 80-200gf/cm.
- 15. the cover layer according to claim 1 for circuit board punching press processing procedure, it is characterised in that wherein this second connects It is 5-15gf/25mm the adhesion between layer and the pigmented ink layer.
- A kind of 16. preparation method of circuit board, it is characterised in that including：A cover layer is provided, wherein the cover layer includes a dielectric film, one first following layer, a pigmented ink layer and a protection Film, the first side of first following layer are connected to a first surface of the dielectric film, and the pigmented ink layer is formed at the dielectric film A second surface, the diaphragm includes a high temperature resistant base material and one second following layer, and the first side of second following layer connects The high temperature resistant base material is connected to, the second side of second following layer is removably then in the pigmented ink layer；Second side joint of first following layer in an at least metallic conductor；One punching press processing procedure is carried out to the cover layer；AndThe second following layer of the diaphragm is peeled off from the pigmented ink layer after the punching press processing procedure.
- 17. the preparation method of circuit board according to claim 16, it is characterised in that wherein the cover layer also includes covering A fractal film in the second side of first following layer, the preparation method also include：In the second side joint of first following layer and remove the fractal film before the circuit board.
- 18. the preparation method of circuit board according to claim 16, it is characterised in that wherein the diaphragm also includes being formed An increasing stick layer between the high temperature resistant base material and second following layer, the increasing stick layer is by Polyester identical with second following layer The polyester organosilicon copolymer resins of row is formed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105127777 | 2016-08-30 | ||
| TW105127777A TWI634817B (en) | 2016-08-30 | 2016-08-30 | Cover film for circuit board punching process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107787119A true CN107787119A (en) | 2018-03-09 |
Family
ID=60040398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610827149.6A Withdrawn CN107787119A (en) | 2016-08-30 | 2016-09-18 | Cover film for circuit board stamping process and manufacturing method of circuit board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6212193B1 (en) |
| CN (1) | CN107787119A (en) |
| TW (1) | TWI634817B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112702848A (en) * | 2021-03-24 | 2021-04-23 | 成都市克莱微波科技有限公司 | Method for cleaning high-frequency flexible microwave printed circuit board |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6212193B1 (en) | 2017-10-11 |
| TWI634817B (en) | 2018-09-01 |
| TW201808060A (en) | 2018-03-01 |
| JP2018037627A (en) | 2018-03-08 |
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Application publication date: 20180309 |