JP2018037627A - Coating film used for punching process of circuit board - Google Patents

Coating film used for punching process of circuit board Download PDF

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JP2018037627A
JP2018037627A JP2016198672A JP2016198672A JP2018037627A JP 2018037627 A JP2018037627 A JP 2018037627A JP 2016198672 A JP2016198672 A JP 2016198672A JP 2016198672 A JP2016198672 A JP 2016198672A JP 2018037627 A JP2018037627 A JP 2018037627A
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adhesive layer
coating film
layer
color ink
circuit board
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JP6212193B1 (en
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振國 盧
Chen-Kuo Lu
振國 盧
修竹 ▲呉▼
修竹 ▲呉▼
Hsiu-Chu Wu
孟成 蔡
Meng-Cheng Tsai
孟成 蔡
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Taiflex Scientific Co Ltd
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Taiflex Scientific Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a coating film used for a punching process of a circuit board.SOLUTION: A coating film includes an insulation film, a first adhesion layer, a color ink layer, and a protection film. A first side of the first adhesion layer is connected to a first surface of the insulation film, and a second side of the first adhesion layer is connected to at least one metal conductor of the circuit board. The color ink layer is formed on a second surface of the insulation film. The protection film includes a high temperature-resistant base material and a second adhesion layer. A first side of the second adhesion layer is connected to the high temperature-resistant base material, and a second side of the second adhesion layer is removably connected to the color ink layer. The second adhesion layer of the protection film is peeled from the color ink layer after the punching process of the circuit board.SELECTED DRAWING: Figure 1

Description

本発明は被覆膜に関し、特に回路板のパンチングプロセスにおいてカラーインク層の破壊を防止できる被覆膜に関する。   The present invention relates to a coating film, and more particularly to a coating film that can prevent a color ink layer from being destroyed in a circuit board punching process.

電子装置は通常フレキシブルプリント回路板を有し、異なる電子素子に電気的に接続されて信号伝達を行う。一般的に、フレキシブルプリント回路板は、金属回線上に絶縁膜を貼り付けたうえ、パンチングプロセスによって特定の形状を有するフレキシブルプリント回路板が形成される。フレキシブルプリント回路板を照明装置に応用する場合、フレキシブルプリント回路板の反射率を高めるよう、フレキシブルプリント回路板の絶縁膜上にカラーインク層（例えば、白色）を形成する。しかし、絶縁膜はパンチングプロセスを経てから、絶縁膜上のカラーインク層が亀裂又は剥落しやすくなり、さらにフレキシブルプリント回路板の生産効率及び歩留まりが低下する。   An electronic device usually has a flexible printed circuit board and is electrically connected to different electronic elements for signal transmission. Generally, a flexible printed circuit board is formed by attaching an insulating film on a metal line and then forming a flexible printed circuit board having a specific shape by a punching process. When the flexible printed circuit board is applied to a lighting device, a color ink layer (for example, white) is formed on the insulating film of the flexible printed circuit board so as to increase the reflectance of the flexible printed circuit board. However, after the insulating film undergoes a punching process, the color ink layer on the insulating film is easily cracked or peeled off, and the production efficiency and yield of the flexible printed circuit board are lowered.

中国特許第１０２８４８６５７号Chinese Patent No. 10284857 中国特許第１０３００９７３４号Chinese Patent No. 103009734

本発明の目的は、従来技術の課題を解決すべく、回路板のパンチングプロセスにおいてカラーインク層の破壊を防止できる被覆膜及び回路板の製造方法を提供することにある。   SUMMARY OF THE INVENTION An object of the present invention is to provide a coating film and a circuit board manufacturing method capable of preventing the destruction of a color ink layer in a circuit board punching process in order to solve the problems of the prior art.

本発明の回路板のパンチングプロセスに用いられる被覆膜は、絶縁膜、第一接着層、カラーインク層及び保護膜を含む。前記第一接着層の第一側が前記絶縁膜の第一表面に接続され、前記第一接着層の第二側が回路板の少なくとも一つの金属導体に接続される。前記カラーインク層は前記絶縁膜の第二表面に形成される。前記保護膜は耐高温基材及び第二接着層を含む。前記第二接着層の第一側が前記耐高温基材に接続され、前記第二接着層の第二側が除去可能に前記カラーインク層に接着される。前記保護膜の第二接着層は、前記回路板のパンチングプロセス後に前記カラーインク層から剥離される。   The coating film used in the circuit board punching process of the present invention includes an insulating film, a first adhesive layer, a color ink layer, and a protective film. The first side of the first adhesive layer is connected to the first surface of the insulating film, and the second side of the first adhesive layer is connected to at least one metal conductor of the circuit board. The color ink layer is formed on the second surface of the insulating film. The protective film includes a high temperature resistant substrate and a second adhesive layer. The first side of the second adhesive layer is connected to the high temperature resistant substrate, and the second side of the second adhesive layer is removably adhered to the color ink layer. The second adhesive layer of the protective film is peeled off from the color ink layer after the punching process of the circuit board.

本発明の被覆膜の一実施例において、前記耐高温基材の厚さは１７μｍから１００μｍの間にある。   In one embodiment of the coating film of the present invention, the thickness of the high temperature resistant substrate is between 17 μm and 100 μm.

本発明の被覆膜の一実施例において、前記第二接着層の厚さは８μｍから２５μｍの間にある。   In one embodiment of the coating film of the present invention, the thickness of the second adhesive layer is between 8 μm and 25 μm.

本発明の被覆膜の一実施例において、前記絶縁膜の厚さは７．５μｍから２５μｍの間にある。   In one embodiment of the coating film of the present invention, the thickness of the insulating film is between 7.5 μm and 25 μm.

本発明の被覆膜の一実施例において、前記第一接着層の厚さは１０μｍから５０μｍの間にある。   In one embodiment of the coating film of the present invention, the thickness of the first adhesive layer is between 10 μm and 50 μm.

本発明の被覆膜の一実施例において、前記カラーインク層の厚さは１２μｍから２５μｍの間にある。   In one embodiment of the coating film of the present invention, the color ink layer has a thickness between 12 μm and 25 μm.

本発明の被覆膜の一実施例において、前記被覆膜は、前記第一接着層の前記第二側を被覆する離型膜をさらに含む。   In one embodiment of the coating film of the present invention, the coating film further includes a release film that covers the second side of the first adhesive layer.

本発明の被覆膜の一実施例において、前記耐高温基材の耐熱温度は摂氏２００度である。   In one embodiment of the coating film of the present invention, the heat resistant temperature of the high temperature resistant substrate is 200 degrees Celsius.

本発明の被覆膜の一実施例において、前記カラーインク層の光遮蔽率は７０％から９０％の間にある。   In one embodiment of the coating film of the present invention, the light shielding rate of the color ink layer is between 70% and 90%.

本発明の被覆膜の一実施例において、前記耐高温基材はポリエチレンテレフタレート（ＰＥＴ）、ポリイミド（ＰＩ）、ポリフェニレスルファイト（ＰＰＳ）、ポリエチレンナフタレート（ＰＥＮ）、ポリエーテルエーテルケトン（ＰＥＥＫ）によって形成される。   In one embodiment of the coating film of the present invention, the high temperature resistant base material is polyethylene terephthalate (PET), polyimide (PI), polyphenylesulphite (PPS), polyethylene naphthalate (PEN), polyether ether ketone ( PEEK).

本発明の被覆膜の一実施例において、前記第二接着層は樹脂系の接着材料、アクリル系の接着材料、シリコーン系の接着材料、ポリウレタン（ｐｏｌｙｕｒｅｔｈａｎｅ、ＰＵ）系の接着材料によって形成される。   In one embodiment of the coating film of the present invention, the second adhesive layer is formed of a resin adhesive material, an acrylic adhesive material, a silicone adhesive material, or a polyurethane (PU) adhesive material. .

本発明の被覆膜の一実施例において、前記保護膜は接着促進層をさらに含み、前記接着促進層は前記耐高温基材と前記第二接着層との間に形成され、前記接着促進層は、前記第二接着層と同じポリエステル系のポリエステル有機ケイ素共重合体樹脂によって形成される。   In one embodiment of the coating film of the present invention, the protective film further includes an adhesion promoting layer, and the adhesion promoting layer is formed between the high temperature resistant substrate and the second adhesive layer, and the adhesion promoting layer. Is formed of the same polyester-based polyester organosilicon copolymer resin as that of the second adhesive layer.

本発明の被覆膜の一実施例において、前記接着促進層の厚さは１μｍから３μｍの間にある。   In one embodiment of the coating film of the present invention, the thickness of the adhesion promoting layer is between 1 μm and 3 μm.

本発明の被覆膜の一実施例において、前記耐高温基材と前記第二接着層との間の剥離力は８０〜２００ｇｆ／ｃｍである。   In one embodiment of the coating film of the present invention, the peel force between the high temperature resistant substrate and the second adhesive layer is 80 to 200 gf / cm.

本発明の被覆膜の一実施例において、第二接着層と前記カラーインク層との間の接着力は５〜１５ｇｆ／２５ｍｍである。   In one embodiment of the coating film of the present invention, the adhesive force between the second adhesive layer and the color ink layer is 5 to 15 gf / 25 mm.

本発明の回路板の製造方法は、絶縁膜、第一接着層、カラーインク層及び保護膜を含む被覆膜において、前記第一接着層の第一側が前記絶縁膜の第一表面に接続され、前記カラーインク層が前記絶縁膜の第二表面に形成され、前記保護膜が耐高温基材及び第二接着層を含み、前記第二接着層の第一側が前記耐高温基材に接続され、前記第二接着層の第二側が除去可能に前記カラーインク層に接続された被覆膜を提供するステップと、前記第一接着層の第二側を少なくとも一つの金属導体に接着させるステップと、前記被覆膜に対しパンチングプロセスを行うステップと、前記パンチングプロセスの後に前記保護膜の第二接着層を前記カラーインク層から剥離させるステップとを含む。   The method for manufacturing a circuit board according to the present invention includes a coating film including an insulating film, a first adhesive layer, a color ink layer, and a protective film, wherein a first side of the first adhesive layer is connected to a first surface of the insulating film. The color ink layer is formed on the second surface of the insulating film, the protective film includes a high temperature resistant substrate and a second adhesive layer, and the first side of the second adhesive layer is connected to the high temperature resistant substrate. Providing a coating film removably connected to the color ink layer on the second side of the second adhesive layer; and adhering the second side of the first adhesive layer to at least one metal conductor; Performing a punching process on the coating film, and peeling a second adhesive layer of the protective film from the color ink layer after the punching process.

本発明の回路板の製造方法の一実施例において、前記被覆膜は、前記第一接着層の第二側を被覆する離型膜をさらに含み、前記製造方法は、前記第一接着層の第二側が前記回路板に接着する前に前記離型膜を除去するステップをさらに含む。   In one embodiment of the circuit board manufacturing method of the present invention, the coating film further includes a release film that covers the second side of the first adhesive layer, and the manufacturing method includes: The method further includes removing the release film before the second side adheres to the circuit board.

本発明の回路板の製造方法の一実施例において、前記保護膜は、前記耐高温基材と前記第二接着層との間に形成された接着促進層をさらに含み、前記接着促進層は、前記第二接着層と同じポリエステル系のポリエステル有機ケイ素共重合体樹脂によって形成される。   In one embodiment of the method for producing a circuit board according to the present invention, the protective film further includes an adhesion promoting layer formed between the high temperature resistant substrate and the second adhesive layer, It is formed of the same polyester-based polyester organosilicon copolymer resin as the second adhesive layer.

従来技術に比べて、本発明の回路板のパンチングプロセスに用いられる被覆膜は、絶縁膜上のカラーインク層を保護し、カラーインク層が回路板のパンチングプロセスの後に亀裂又は剥落することを防止することができる。従って、本発明の回路板のパンチングプロセスに用いられる被覆膜は、回路板の生産効率及び歩留まりを高めることができる。   Compared to the prior art, the coating film used in the circuit board punching process of the present invention protects the color ink layer on the insulating film and prevents the color ink layer from cracking or peeling off after the circuit board punching process. Can be prevented. Therefore, the coating film used in the circuit board punching process of the present invention can improve the production efficiency and yield of the circuit board.

本発明の回路板のパンチングプロセスに用いられる被覆膜の概略図である。It is the schematic of the coating film used for the punching process of the circuit board of this invention. 本発明の回路板のパンチングプロセスに用いられる被覆膜の製造方法の概略図である。It is the schematic of the manufacturing method of the coating film used for the punching process of the circuit board of this invention. 本発明の被覆膜の別の実施例の概略図である。It is the schematic of another Example of the coating film of this invention. 本発明の回路板の製造方法の概略図である。It is the schematic of the manufacturing method of the circuit board of this invention. 本発明の回路板の製造方法のフローチャートである。It is a flowchart of the manufacturing method of the circuit board of this invention.

図１を参照する。図１は本発明の回路板のパンチングプロセスに用いられる被覆膜の概略図である。図１が示すように、本発明の回路板のパンチングプロセスに用いられる被覆膜１００は、絶縁膜１１０、第一接着層１２０、カラーインク層１３０及び保護膜１４０を含む。絶縁膜１１０は、ポリイミド樹脂（ｐｏｌｙｉｍｉｄｅ ｒｅｓｉｎ）、ポリエステル樹脂（ｐｏｌｙｅｓｔｅｒ ｒｅｓｉｎ）、ポリエチレンテレフタラート樹脂（ｐｏｌｙｅｔｈｙｌｅｎｅ ｔｅｒｅｐｈｔｈａｌａｔｅ ｒｅｓｉｎ）、ポリエチレン樹脂（ｐｏｌｙｅｔｈｙｌｅｎｅ ｒｅｓｉｎ）、ポリプロピレン樹脂（ｐｏｌｙｐｒｏｐｙｌｅｎｅ ｒｅｓｉｎ）、ポリ塩化ビニル樹脂（ｐｏｌｙｖｉｎｙｌ ｃｈｌｏｒｉｄｅ ｒｅｓｉｎ）、ポリスチレン樹脂（ｐｏｌｙｓｔｙｒｅｎｅ ｒｅｓｉｎ）又はポリカーボネート樹脂（ｐｏｌｙｃａｒｂｏｎａｔｅ ｒｅｓｉｎ）によって形成することができる。第一接着層１２０の第一側（上側）が絶縁膜１１０の第一表面（下表面）に接続され、第一接着層１２０の第二側（下側）が回路板（例えば、フレキシブルプリント回路板）の少なくとも一つ金属導体に接着される。第一接着層１２０は、アクリル酸樹脂（ａｃｒｙｌｉｃ ａｃｉｄ ｒｅｓｉｎ）、エポキシ樹脂（ｅｐｏｘｙ ｒｅｓｉｎ）、フェノール‐ホルムアルデヒド樹脂（Ｐｈｅｎｏｌ Ｆｏｒｍａｌｄｅｈｙｄｅ ｒｅｓｉｎ）又はポリエステル樹脂を絶縁膜１１０の第一表面上に塗布して形成することができる。第一接着層１２０と絶縁膜１１０との間の接着力は０．４〜２ｋｇｆ／ｍｍである。カラーインク層１３０は絶縁膜１１０の第二表面（上表面）に形成されている。カラーインク層１３０の光遮蔽率は７０％〜９０％の間にある。保護膜１４０は耐高温基材１４２及び第二接着層１４４を含む。耐高温基材１４２はポリエチレンテレフタレート（ＰＥＴ）、ポリイミド（ＰＩ）、ポリフェニレスルファイト（ＰＰＳ）、ポリエチレンナフタレート（ＰＥＮ）、ポリエーテルエーテルケトン（ＰＥＥＫ）によって形成されてもよい。耐高温基材１４２の耐熱温度は摂氏２００度に達する。第二接着層１４４の第一側（上側）は耐高温基材１４２に接続され、第二接着層１４４の第二側（下側）は除去可能にカラーインク層１３０に接着される。第二接着層１４４は樹脂系の接着材料、アクリル系の接着材料、シリコーン系の接着材料、ポリウレタン（ｐｏｌｙｕｒｅｔｈａｎｅ，ＰＵ）系の接着材料によって形成されてもよい。   Please refer to FIG. FIG. 1 is a schematic view of a coating film used in the circuit board punching process of the present invention. As shown in FIG. 1, the coating film 100 used in the circuit board punching process of the present invention includes an insulating film 110, a first adhesive layer 120, a color ink layer 130, and a protective film 140. The insulating film 110 includes a polyimide resin, a polyester resin, a polyethylene terephthalate resin, a polyethylene resin, a polypropylene resin, and a polypropylene resin. The insulating film 110 includes, for example, a polyimide resin, a polyester resin, a polyethylene terephthalate resin, a polyethylene resin, and a polypropylene resin. resin, a polystyrene resin, or a polycarbonate resin. The first side (upper side) of the first adhesive layer 120 is connected to the first surface (lower surface) of the insulating film 110, and the second side (lower side) of the first adhesive layer 120 is a circuit board (for example, a flexible printed circuit). A plate). The first adhesive layer 120 is formed by applying an acrylic acid resin, an epoxy resin, a phenol-formaldehyde resin, or a polyester resin on the first surface of the insulating film 110. be able to. The adhesive force between the first adhesive layer 120 and the insulating film 110 is 0.4 to 2 kgf / mm. The color ink layer 130 is formed on the second surface (upper surface) of the insulating film 110. The light shielding rate of the color ink layer 130 is between 70% and 90%. The protective film 140 includes a high temperature resistant substrate 142 and a second adhesive layer 144. The high temperature resistant substrate 142 may be formed of polyethylene terephthalate (PET), polyimide (PI), polyphenylesulphite (PPS), polyethylene naphthalate (PEN), or polyetheretherketone (PEEK). The heat resistant temperature of the high temperature resistant substrate 142 reaches 200 degrees Celsius. The first side (upper side) of the second adhesive layer 144 is connected to the high temperature resistant substrate 142, and the second side (lower side) of the second adhesive layer 144 is detachably bonded to the color ink layer 130. The second adhesive layer 144 may be formed of a resin adhesive material, an acrylic adhesive material, a silicone adhesive material, or a polyurethane (PU) adhesive material.

また、被覆膜１００はさらに、第一接着層１２０の第二側を被覆する離型膜１５０を含むことにより、第一接着層１２０の第二側が回路板の少なくとも一つの金属導体に接着される前に異物が付着することを防止する。   Further, the coating film 100 further includes a release film 150 that covers the second side of the first adhesive layer 120, whereby the second side of the first adhesive layer 120 is bonded to at least one metal conductor of the circuit board. To prevent foreign matter from adhering to the surface.

本発明の実施例において、耐高温基材の厚さは１７μｍから１００μｍの間にあり、第二接着層の厚さは８μｍから２５μｍの間にあり、絶縁膜の厚さは７．５μｍから２５μｍの間にあり、第一接着層の厚さは１０μｍから５０μｍの間にあり、カラーインク層の厚さは１２μｍから２５μｍの間にある。   In an embodiment of the present invention, the high temperature resistant substrate has a thickness of 17 μm to 100 μm, the second adhesive layer has a thickness of 8 μm to 25 μm, and the insulating film has a thickness of 7.5 μm to 25 μm. The thickness of the first adhesive layer is between 10 μm and 50 μm, and the thickness of the color ink layer is between 12 μm and 25 μm.

図２と図１を同時に参照する。図２は本発明の回路板のパンチングプロセスに用いられる被覆膜の製造方法の概略図である。図２が示すように、絶縁膜１１０の第一表面上に接着材料を塗布して第一接着層１２０を形成し、絶縁膜１１０の第二表面上にカラーインクを塗布してカラーインク層１３０を形成することができる。そして、さらに離型膜１５０を第一接着層１２０に貼り付けることができる。また、耐高温基材１４２上に接着材料を塗布して第二接着層１４４を形成することができる。さらに第二接着層１４４をカラーインク層１３０上に貼り付けて、本発明の回路板のパンチングプロセスに用いられる被覆膜１００を形成する。耐高温基材１４２上に接着材料を塗布して第二接着層１４４を形成する際、耐高温基材１４２及び第二接着層１４４を室温に７日間放置するか、又は摂氏４０度の環境に２日間放置することによって、第二接着層１４４を固化させ、耐高温基材１４２と第二接着層１４４を確実かつ緊密に接続させる。また、固化後の第二接着層１４４の粘着性が低下するため、第二接着層１４４をカラーインク層から剥離させる時に接着材が残留することない。本発明の実施例において、耐高温基材１４２と第二接着層１４４の間の剥離力は８０〜１００ｇｆ／ｃｍであり、第二接着層１４４とカラーインク層１３０の間の接着力は５〜１５ｇｆ／２５ｍｍである。   Please refer to FIG. 2 and FIG. 1 simultaneously. FIG. 2 is a schematic view of a coating film manufacturing method used in the circuit board punching process of the present invention. As shown in FIG. 2, an adhesive material is applied on the first surface of the insulating film 110 to form the first adhesive layer 120, and color ink is applied on the second surface of the insulating film 110 to form the color ink layer 130. Can be formed. Further, the release film 150 can be attached to the first adhesive layer 120. Further, the second adhesive layer 144 can be formed by applying an adhesive material on the high temperature resistant substrate 142. Further, the second adhesive layer 144 is stuck on the color ink layer 130 to form the coating film 100 used in the circuit board punching process of the present invention. When the adhesive material is applied on the high temperature resistant substrate 142 to form the second adhesive layer 144, the high temperature resistant substrate 142 and the second adhesive layer 144 are left at room temperature for 7 days or in an environment of 40 degrees Celsius. By leaving for two days, the second adhesive layer 144 is solidified, and the high temperature resistant substrate 142 and the second adhesive layer 144 are securely and tightly connected. Further, since the adhesiveness of the second adhesive layer 144 after solidification is lowered, the adhesive does not remain when the second adhesive layer 144 is peeled from the color ink layer. In the embodiment of the present invention, the peel strength between the high temperature resistant substrate 142 and the second adhesive layer 144 is 80-100 gf / cm, and the adhesive strength between the second adhesive layer 144 and the color ink layer 130 is 5-5. 15 gf / 25 mm.

一方、図３が示すように、本発明の被覆膜の別の実施例１００’において、保護膜１４０’はさらに、耐高温基材１４２と第二接着層１４４との間に形成される接着促進層１４６を含む。接着促進層１４６の厚さは１μｍから３μｍの間にあり、かつ接着促進層１４６は、第二接着層１４４と同じポリエステル系のポリエステル有機ケイ素共重合体樹脂によって形成されてもよい。例を挙げると、第二接着層１４４がポリウレタン系の接着材料によって形成された場合、接着促進層１４６はポリウレタン有機ケイ素共重合体樹脂によって形成されてもよい。接着促進層１４６は、耐高温基材１４２及び第二接着層１４４の間の剥離力を１６０〜２００ｇｆ／ｃｍまで増加させることができる。   On the other hand, as FIG. 3 shows, in another embodiment 100 ′ of the coating film of the present invention, the protective film 140 ′ is further bonded to the high temperature resistant substrate 142 and the second adhesive layer 144. Acceleration layer 146 is included. The adhesion promoting layer 146 may have a thickness between 1 μm and 3 μm, and the adhesion promoting layer 146 may be formed of the same polyester-based polyester organosilicon copolymer resin as the second adhesive layer 144. For example, when the second adhesive layer 144 is formed of a polyurethane-based adhesive material, the adhesion promoting layer 146 may be formed of a polyurethane organosilicon copolymer resin. The adhesion promoting layer 146 can increase the peel force between the high temperature resistant substrate 142 and the second adhesive layer 144 to 160 to 200 gf / cm.

図４を参照すると、図４は本発明の回路板の製造方法の概略図である。図４が示すように、回路板（例えば、フレキシブルプリント回路板）を製造する際、まず被覆膜１００の離型膜１５０が取り外される。次に、第一接着層１２０の第二側が回路板の金属導体２００（例えば、金属線路）に接着される。その後、被覆膜１００はパンチングプロセスを経る。パンチングプロセスの後、保護膜１４０の第二接着層１４４はカラーインク層１３０から剥離される。また、金属導体２００の他方側を絶縁膜に貼り付けて、さらに単層又は多層回路板を形成する。本発明の回路板の製造方法は被覆膜１００’を用いて回路板を形成してもよい。   Referring to FIG. 4, FIG. 4 is a schematic view of a method for manufacturing a circuit board according to the present invention. As shown in FIG. 4, when manufacturing a circuit board (for example, a flexible printed circuit board), the release film 150 of the coating film 100 is first removed. Next, the second side of the first adhesive layer 120 is bonded to a metal conductor 200 (for example, a metal line) of the circuit board. Thereafter, the coating film 100 undergoes a punching process. After the punching process, the second adhesive layer 144 of the protective film 140 is peeled from the color ink layer 130. In addition, the other side of the metal conductor 200 is attached to an insulating film to further form a single layer or multilayer circuit board. In the circuit board manufacturing method of the present invention, the circuit board may be formed using the coating film 100 ′.

以上の配置により、パンチングプロセスを行う際にカラーインク層１３０は保護膜１４０の耐高温基材１４２によって保護され、破壊されることないため、カラーインク層１３０がパンチングプロセス後に亀裂又は剥落することを防止できる。従って、本発明の被覆膜１００は回路板の生産効率及び歩留まりを改善することができる。さらに、保護膜１４０の第二接着層１４４はパンチングプロセス後にカラーインク層１３０から剥離され、かつ残留接着材がないため、保護膜１４０を除去した後、カラーインク層１３０の機能を影響することない。   With the above arrangement, the color ink layer 130 is protected by the high temperature resistant substrate 142 of the protective film 140 and is not destroyed during the punching process, so that the color ink layer 130 is cracked or peeled off after the punching process. Can be prevented. Therefore, the coating film 100 of the present invention can improve circuit board production efficiency and yield. Further, since the second adhesive layer 144 of the protective film 140 is peeled off from the color ink layer 130 after the punching process and there is no residual adhesive, the function of the color ink layer 130 is not affected after the protective film 140 is removed. .

例を挙げると、本発明の第一実施例において、保護膜１４０の耐高温基材１４２はポリエチレンテレフタレート（ＰＥＴ）によって形成された厚さ１００μｍの薄膜であり、耐高温基材１４２上にさらに厚さ２０μｍのアクリル系の接着材料を塗布して第二接着層１３４を形成する。本発明の第二実施例において、保護膜１４０の耐高温基材１４２はポリエチレンテレフタレート（ＰＥＴ）によって形成された厚さ７５μｍの薄膜であり、耐高温基材１４２上にさらに厚さ２５μｍのアクリル系の接着材料を塗布して第二接着層１３４を形成する。本発明の第三実施例において、保護膜１４０の耐高温基材１４２はポリエチレンテレフタレート（ＰＥＴ）によって形成された厚さ１２５μｍの薄膜であり、耐高温基材１４２上にさらに厚さ１５μｍのアクリル系の接着材料を塗布して第二接着層１３４を形成する。上記保護膜を含む被覆膜がパンチングプロセスを経て、さらに保護膜を除去した後、カラーインク層１３０のいずれにも亀裂、剥落又は接着材残留がなく、言い換えれば、パンチングプロセスにおける回路板の歩留まりは１００％に近い。また、保護膜を除去した後のカラーインク層１３０の反射率と保護膜を貼り付けていないカラーインク層１３０の反射率はかなり近く、言い換えれば、保護膜はカラーインク層１３０の反射率に影響ない。そのほか、保護膜を除去した後のカラーインク層１３０の色収差値と保護膜を貼り付けていないカラーインク層１３０の色収差値がかなり近く、言い換えれば、保護膜はカラーインク層１３０の色に影響ない。   For example, in the first embodiment of the present invention, the high temperature resistant base material 142 of the protective film 140 is a thin film having a thickness of 100 μm formed of polyethylene terephthalate (PET). A second adhesive layer 134 is formed by applying an acrylic adhesive material having a thickness of 20 μm. In the second embodiment of the present invention, the high temperature resistant base material 142 of the protective film 140 is a 75 μm thick thin film formed of polyethylene terephthalate (PET), and the acrylic high temperature material of 25 μm is further formed on the high temperature resistant base material 142. The second adhesive layer 134 is formed by applying the adhesive material. In the third embodiment of the present invention, the high temperature resistant substrate 142 of the protective film 140 is a 125 μm-thick thin film formed of polyethylene terephthalate (PET), and the 15 μm thick acrylic type is further formed on the high temperature resistant substrate 142. The second adhesive layer 134 is formed by applying the adhesive material. After the coating film including the protective film is subjected to a punching process, and after the protective film is further removed, none of the color ink layer 130 is cracked, peeled off, or remains of the adhesive, in other words, the yield of the circuit board in the punching process. Is close to 100%. Further, the reflectance of the color ink layer 130 after removing the protective film is quite close to the reflectance of the color ink layer 130 without the protective film, in other words, the protective film affects the reflectance of the color ink layer 130. Absent. In addition, the chromatic aberration value of the color ink layer 130 after removing the protective film and the chromatic aberration value of the color ink layer 130 to which the protective film is not attached are quite close. In other words, the protective film does not affect the color of the color ink layer 130. .

図５を参照すると、図５は本発明の回路板の製造方法のフローチャート５００である。本発明の回路板の製造方法の流れは以下のステップを含む。   Referring to FIG. 5, FIG. 5 is a flowchart 500 of the circuit board manufacturing method of the present invention. The flow of the circuit board manufacturing method of the present invention includes the following steps.

ステップ５１０：被覆膜を提供し、前記被覆膜は絶縁膜、第一接着層、カラーインク層及び保護膜を含み、前記第一接着層の第一側は前記絶縁膜の第一表面に接続され、前記カラーインク層は前記絶縁膜の第二表面に形成され、前記保護膜は耐高温基材及び第二接着層を含み、前記第二接着層の第一側は前記耐高温基材に接続され、前記第二接着層の第二側は除去可能に前記カラーインク層に接着される。   Step 510: Providing a coating film, the coating film including an insulating film, a first adhesive layer, a color ink layer, and a protective film, wherein the first side of the first adhesive layer is on the first surface of the insulating film. Connected, the color ink layer is formed on a second surface of the insulating film, the protective film includes a high temperature resistant substrate and a second adhesive layer, and the first side of the second adhesive layer is the high temperature resistant substrate. And the second side of the second adhesive layer is removably adhered to the color ink layer.

ステップ５２０：前記第一接着層の第二側を少なくとも一つの金属導体に接着させる。   Step 520: Adhere the second side of the first adhesive layer to at least one metal conductor.

ステップ５３０：前記被覆膜に対しパンチングプロセスを行う。   Step 530: A punching process is performed on the coating film.

ステップ５４０：前記パンチングプロセスの後、前記保護膜の第二接着層を前記カラーインク層から剥離させる。   Step 540: After the punching process, the second adhesive layer of the protective film is peeled off from the color ink layer.

従来の技術に比べて、本発明の回路板のパンチングプロセスに用いられる被覆膜は、絶縁膜上のカラーインク層を保護し、回路板のパンチングプロセス後にカラーインク層に亀裂又は剥落が生じることを防止できる。従って、本発明の回路板のパンチングプロセスに用いらえる被覆膜は、回路板の生産効率及び歩留まりを高めることができる。
以上は本発明の好ましい実施例のみであり、本発明の請求の範囲において施された同等な変更又は修正も本発明の範囲に属する。 Compared to the prior art, the coating film used in the circuit board punching process of the present invention protects the color ink layer on the insulating film, and the color ink layer is cracked or peeled off after the circuit board punching process. Can be prevented. Therefore, the coating film used in the circuit board punching process of the present invention can increase the production efficiency and yield of the circuit board.
The above are only preferred embodiments of the present invention, and equivalent changes or modifications made in the scope of the claims of the present invention also belong to the scope of the present invention.

１００ 、１００’ 被覆膜
１１０ 絶縁膜
１２０ 第一接着層
１３０ カラーインク層
１４０、１４０’ 保護膜
１４２ 耐高温基材
１４４ 第二接着層
１４６ 接着促進層
１５０ 離型膜
２００ 回路板
５００ フローチャート
５１０〜５４０ ステップ 100, 100 ′ coating film 110 insulating film 120 first adhesive layer 130 color ink layer 140, 140 ′ protective film 142 high temperature resistant substrate 144 second adhesive layer 146 adhesion promoting layer 150 release film 200 circuit board 500 flowchart 510 540 steps

Claims (18)

回路板のパンチングプロセスに用いられる被覆膜であって、
絶縁膜と、
第一側が前記絶縁膜の第一表面に接続され、第二側が回路板の少なくとも一つの金属導体に接続される第一接着層と、
前記絶縁膜の第二表面に形成されるカラーインク層と、
耐高温基材及び第二接着層を有する保護膜とを含み、
前記第二接着層の第一側が前記耐高温基材に接続され、前記第二接着層の第二側が除去可能に前記カラーインク層に接着され、
前記保護膜の第二接着層は、前記回路板のパンチングプロセス後に前記カラーインク層から剥離される、被覆膜。 A coating film used in a circuit board punching process,
An insulating film;
A first adhesive layer having a first side connected to the first surface of the insulating film and a second side connected to at least one metal conductor of the circuit board;
A color ink layer formed on the second surface of the insulating film;
A protective film having a high temperature resistant substrate and a second adhesive layer,
The first side of the second adhesive layer is connected to the high temperature resistant substrate, the second side of the second adhesive layer is removably adhered to the color ink layer,
The second adhesive layer of the protective film is a coating film that is peeled off from the color ink layer after a punching process of the circuit board. 前記耐高温基材の厚さは１７μｍから１００μｍの間にある、請求項１に記載の被覆膜。   The coating film according to claim 1, wherein the high-temperature resistant substrate has a thickness between 17 μm and 100 μm. 前記第二接着層の厚さは８μｍから２５μｍの間にある、請求項１に記載の被覆膜。   The coating film according to claim 1, wherein the thickness of the second adhesive layer is between 8 μm and 25 μm. 前記絶縁膜の厚さは７．５μｍから２５μｍの間にある、請求項１に記載の被覆膜。   The coating film according to claim 1, wherein a thickness of the insulating film is between 7.5 μm and 25 μm. 前記第一接着層の厚さは１０μｍから５０μｍの間にある、請求項１に記載の被覆膜。   The coating film according to claim 1, wherein the thickness of the first adhesive layer is between 10 μm and 50 μm. 前記カラーインク層の厚さは１２μｍから２５μｍの間にある、請求項１に記載の被覆膜。   The coating film according to claim 1, wherein the color ink layer has a thickness of 12 μm to 25 μm. 前記第一接着層の前記第二側を被覆する離型膜をさらに含む、請求項１に記載の被覆膜。   The coating film according to claim 1, further comprising a release film that covers the second side of the first adhesive layer. 前記耐高温基材の耐熱温度は摂氏２００度である、請求項１に記載の被覆膜。   The coating film according to claim 1, wherein the heat resistant temperature of the high temperature resistant substrate is 200 degrees Celsius. 前記カラーインク層の光遮蔽率は７０％から９０％の間にある、請求項１に記載の被覆膜。   The coating film according to claim 1, wherein the light shielding rate of the color ink layer is between 70% and 90%. 前記耐高温基材はポリエチレンテレフタレート（ＰＥＴ）、ポリイミド（ＰＩ）、ポリフェニレスルファイト（ＰＰＳ）、ポリエチレンナフタレート（ＰＥＮ）、ポリエーテルエーテルケトン（ＰＥＥＫ）によって形成される、請求項１に記載の被覆膜。   The high temperature resistant substrate is formed of polyethylene terephthalate (PET), polyimide (PI), polyphenylsulfurite (PPS), polyethylene naphthalate (PEN), or polyetheretherketone (PEEK). Coating film. 前記第二接着層は樹脂系の接着材料、アクリル系の接着材料、シリコーン系の接着材料、ポリウレタン（ｐｏｌｙｕｒｅｔｈａｎｅ、ＰＵ）系の接着材料によって形成される、請求項１に記載の被覆膜。   2. The coating film according to claim 1, wherein the second adhesive layer is formed of a resin-based adhesive material, an acrylic adhesive material, a silicone-based adhesive material, or a polyurethane (PU) -based adhesive material. 前記保護膜は接着促進層をさらに含み、前記接着促進層は前記耐高温基材と前記第二接着層との間に形成され、
前記接着促進層は、前記第二接着層と同じポリエステル系のポリエステル有機ケイ素共重合体樹脂によって形成される、請求項１１に記載の被覆膜。 The protective film further includes an adhesion promoting layer, and the adhesion promoting layer is formed between the high temperature resistant substrate and the second adhesive layer,
The coating film according to claim 11, wherein the adhesion promoting layer is formed of the same polyester-based polyester organosilicon copolymer resin as the second adhesive layer. 前記接着促進層の厚さは１μｍから３μｍの間にある、請求項１２に記載の被覆膜。   The coating film according to claim 12, wherein the adhesion promoting layer has a thickness between 1 μm and 3 μm. 前記耐高温基材と前記第二接着層との間の剥離力は８０〜２００ｇｆ／ｃｍである、請求項１に記載の被覆膜。   The coating film of Claim 1 whose peeling force between the said high temperature-resistant base material and said 2nd contact bonding layer is 80-200 gf / cm. 前記第二接着層と前記カラーインク層との間の接着力は５〜１５ｇｆ／２５ｍｍである、請求項１に記載の被覆膜。   The coating film according to claim 1, wherein an adhesive force between the second adhesive layer and the color ink layer is 5 to 15 gf / 25 mm. 回路板の製造方法であって、
絶縁膜、第一接着層、カラーインク層及び保護膜を含む被覆膜において、前記第一接着層の第一側が前記絶縁膜の第一表面に接続され、前記カラーインク層が前記絶縁膜の第二表面に形成され、前記保護膜が耐高温基材及び第二接着層を含み、前記第二接着層の第一側が前記耐高温基材に接続され、前記第二接着層の第二側が除去可能に前記カラーインク層に接着された被覆膜を提供するステップと、
前記第一接着層の第二側を少なくとも一つの金属導体に接着させるステップと、
前記被覆膜に対しパンチングプロセスを行うステップと、
前記パンチングプロセスの後に前記保護膜の第二接着層を前記カラーインク層から剥離させるステップとを含む、回路板の製造方法。 A circuit board manufacturing method comprising:
In a coating film including an insulating film, a first adhesive layer, a color ink layer, and a protective film, a first side of the first adhesive layer is connected to a first surface of the insulating film, and the color ink layer is formed on the insulating film. Formed on the second surface, the protective film includes a high temperature resistant substrate and a second adhesive layer, a first side of the second adhesive layer is connected to the high temperature resistant substrate, and a second side of the second adhesive layer is Providing a coating film removably adhered to the color ink layer;
Bonding the second side of the first adhesive layer to at least one metal conductor;
Performing a punching process on the coating film;
Separating the second adhesive layer of the protective film from the color ink layer after the punching process. 前記被覆膜は、前記第一接着層の第二側を被覆する離型膜をさらに含み、
前記製造方法は、前記第一接着層の第二側が前記回路板に接着する前に前記離型膜を除去するステップをさらに含む、請求項１６に記載の回路板の製造方法。 The coating film further includes a release film that covers the second side of the first adhesive layer,
The method of manufacturing a circuit board according to claim 16, wherein the manufacturing method further includes a step of removing the release film before the second side of the first adhesive layer is bonded to the circuit board. 前記保護膜は、前記耐高温基材と前記第二接着層との間に形成された接着促進層をさらに含み、
前記接着促進層は、前記第二接着層と同じポリエステル系のポリエステル有機ケイ素共重合体樹脂によって形成される、請求項１６に記載の回路板の製造方法。 The protective film further includes an adhesion promoting layer formed between the high temperature resistant substrate and the second adhesive layer,
The method of manufacturing a circuit board according to claim 16, wherein the adhesion promoting layer is formed of the same polyester-based polyester organosilicon copolymer resin as the second adhesive layer.
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