CN112888170A - PI (polyimide) reinforcement processing method, manufacturing method of flexible circuit board with PI reinforcement and flexible circuit board - Google Patents
PI (polyimide) reinforcement processing method, manufacturing method of flexible circuit board with PI reinforcement and flexible circuit board Download PDFInfo
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- CN112888170A CN112888170A CN202011605272.6A CN202011605272A CN112888170A CN 112888170 A CN112888170 A CN 112888170A CN 202011605272 A CN202011605272 A CN 202011605272A CN 112888170 A CN112888170 A CN 112888170A
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- reinforcement
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- circuit board
- flexible circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Printing Methods (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a processing method of PI reinforcement, a manufacturing method of a flexible circuit board with PI reinforcement and a flexible circuit board, wherein a cover film with the effect required by a flexible circuit board product is adopted to replace the printing ink of the original PI reinforcement area, the PI reinforcement and characters on the flexible circuit board are separately processed, the top surface and the bottom surface of the PI reinforcement are respectively provided with the cover film and pure glue, and then are divided into small rolls or die-cut into single PCS according to the requirement of corresponding processing equipment, and then subsequent processing is carried out; according to the manufacturing method of the flexible circuit board, the silk-screen printing characters are firstly carried out on the substrate which is not adhered with the PI reinforcement, the surface of the substrate is flat, the silk-screen printing is easy, and the silk-screen printing precision of the characters can be improved; the PI reinforcement is replaced by the attaching covering film, the covering film has high stamping resistance and chemical water resistance, and can not fall off in a layering mode during punching and subsequent processes, so that the defect that original printing ink falls off can be eliminated, and the product quality and the yield are improved.
Description
Technical Field
The invention relates to the technical field of manufacturing of flexible circuit boards, in particular to a processing method for PI reinforcement, a manufacturing method for a flexible circuit board with PI reinforcement and a flexible circuit board.
Background
PI reinforcement is required to be attached to a flexible circuit board used for some electronic products, and printing ink is required to be printed on the PI reinforcement, for example, in the field of backlight electronic products, white ink is required to be printed on the PI reinforcement surface of the flexible circuit board in a silk-screen mode, so that the product performance is improved; in the existing manufacturing method of the flexible circuit board with the PI reinforcement, as shown in fig. 1, PI reinforcement material preparation → PI reinforcement bottom surface glue preparation → PI reinforcement slitting, and then an automatic reinforcement machine with edge punching and edge pasting is adopted to be pasted on a substrate, and is pressed and baked on the substrate, in the screen printing process, characters and printing ink of a PI reinforcement area are printed on the substrate 100 by screen printing, because the substrate is pasted with the PI reinforcement, the heights of different areas on the substrate are different, and during screen printing, the screen printing precision of the printing ink of the characters and the PI reinforcement area is poor, and the product requirements cannot be met. In addition, due to the smooth surface of the PI reinforcement and the characteristics of the ink, the ink on the PI reinforcement is easy to fall off in the subsequent processing process, particularly, when the product is subjected to shape punching, as shown in fig. 2 and 3, the ink in the PI reinforcement area is subjected to brittle fracture and falling off in the PI reinforcement edge area corresponding to the product shape due to impact force after the PI reinforcement area is subjected to punching, and is easy to be attacked by liquid medicine to aggravate the ink falling off in the subsequent processing.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a PI reinforcing processing method which can improve the character silk-screen printing precision and the product quality and yield.
In order to achieve the above purpose, the solution of the invention is:
a processing method for PI reinforcement comprises the following steps:
step B1, PI reinforcement preparation: preparing and processing a needed PI reinforcing material;
step B2, preparing a film on the PI reinforced top surface: pressing a cover film on the PI reinforced top surface through a hot roller, wherein the cover film is provided with an adhesive layer;
step B3, preparing glue on the PI reinforcing bottom surface: pressing pure rubber on the bottom surface reinforced by the PI through a hot roller;
step B4, PI reinforcement slitting: and D, processing and slitting the PI reinforcement obtained in the step B3 into small rolls, so that the operation of the automatic reinforcement laminating machine can be conveniently carried out while punching.
Further, in the PI reinforcement top surface preparation film of the step B2, the color of the cover film is the same as the color of the ink screen printed on the original PI reinforcement.
Further, in the PI reinforced top backup film of step B2, the cover film was a white cover film.
In order to achieve the above object, the present invention may further adopt the following solutions:
a PI reinforcing processing method comprises the following steps:
step B1, PI reinforcement preparation: preparing and processing a needed PI reinforcing material;
step B2, preparing a film on the PI reinforced top surface: pressing a cover film on the PI reinforced top surface through a hot roller, wherein the cover film is provided with an adhesive layer;
step B3, preparing glue on the PI reinforcing bottom surface: pressing pure rubber on the bottom surface reinforced by the PI through a hot roller;
step B4: and D, PI reinforcement die cutting, wherein the PI reinforcement obtained in the step B3 is die cut to be processed into single PCS reinforcement, and the single PCS reinforcement is transferred to the bearing film in an array mode, so that the operation of the automatic reinforcement laminating machine capable of sucking and laminating at the same time is facilitated.
Further, in the PI reinforcement top surface preparation film of the step B2, the color of the cover film is the same as the color of the ink screen printed on the original PI reinforcement.
Further, in the PI reinforced top backup film of step B2, the cover film was a white cover film.
The invention also aims to overcome the defects of the prior art and provide a manufacturing method of the flexible circuit board with the PI reinforcement, which can improve the character silk-screen printing precision and the product quality and yield.
In order to achieve the purpose, the invention adopts the following solution:
a manufacturing method of a flexible circuit board with PI reinforcement manufactured by using the PI reinforcement processing method comprises the following steps:
step A1, silk-screen printing characters: arranging at least 1 circuit board body on a substrate to be processed, and carrying out silk-screen printing on characters at required positions of the substrate;
step A2, baking the ink: baking the substrate with the characters printed on the substrate, and solidifying the printing ink;
step A3, PI reinforcement and lamination: punching the small roll of reinforcement obtained in the step B4 into single PCS reinforcement in sequence, and attaching the PCS reinforcement to the required position of each product on the substrate;
step A4, PI reinforcement pressing: performing PI reinforcement pressing on the substrate obtained in the step A3, and pressing PI reinforcement on each product on the substrate;
step A5, PI reinforcement baking: and baking the PI reinforcement to enable the PI reinforcement to be solidified on the substrate.
In order to achieve the above object, the present invention may further adopt the following solutions:
a manufacturing method of a flexible circuit board with PI reinforcement manufactured by using the PI reinforcement processing method comprises the following steps:
step A1, silk-screen printing characters: arranging at least 1 circuit board body on a substrate to be processed, and carrying out silk-screen printing on characters at required positions of the substrate;
step A2, baking the ink: baking the substrate with the characters printed on the substrate, and solidifying the printing ink;
step A3, PI reinforcement and lamination: c, sequentially sucking and adhering the single PCS reinforcement obtained in the step B4 to the required positions of the products on the substrate;
step A4, PI reinforcement pressing: performing PI reinforcement pressing on the substrate obtained in the step A3, and pressing PI reinforcement on each product on the substrate;
step A5, PI reinforcement baking: and baking the PI reinforcement to enable the PI reinforcement to be solidified on the substrate.
Another objective of the present invention is to provide a flexible printed circuit board capable of improving the precision of the silk-screen printing of characters and improving the quality and yield of products.
In order to achieve the purpose, the invention adopts the technical scheme that:
a flexible circuit board is characterized in that a substrate of the flexible circuit board is subjected to silk-screen printing and reinforcing processing by adopting a manufacturing method of the flexible circuit board with PI reinforcement.
A flexible circuit board comprises a circuit board body and reinforcement, wherein the required position of the circuit board body is attached with the reinforcement, and the reinforcement comprises a covering film, PI reinforcement and pure glue; the top surface of PI reinforcement is provided with the cover film, and the bottom surface of PI reinforcement is provided with the pure glue, and the cover film is white cover film.
After the scheme is adopted, the covering film with the effect required by the flexible circuit board product is adopted to replace the original PI reinforcing area printing ink, the PI reinforcement and the characters on the flexible circuit board are separately processed, the covering film and the pure glue are respectively attached to the top surface and the bottom surface of the PI reinforcement, the PI reinforcement is divided into small rolls or die-cut into single PCS according to the requirement of corresponding processing equipment, and then the subsequent processing is carried out; according to the manufacturing method of the flexible circuit board, the silk-screen printing characters are firstly carried out on the substrate which is not adhered with the PI reinforcement, the surface of the substrate is flat, the silk-screen printing is easy, and the silk-screen printing precision of the characters can be improved; the PI reinforcement is replaced by attaching a covering film, the covering film has higher stamping resistance and chemical water resistance, and can not fall off in a layering manner during punching and subsequent processes, so that the poor falling of the original printing ink can be avoided, and the product quality and yield are improved; in the step A4 PI reinforcement pressing and the step A5 PI reinforcement baking, the PI reinforcement pressing is solidified on the substrate, and meanwhile, the covering film is also pressed and solidified on the PI reinforcement, so that the pressing and baking processes of the covering film and the PI reinforcement are reduced; if the original PI of the product is reinforced by white ink, the invention can be replaced by a white cover film, and the reflectivity of the white cover film is higher than that of the white ink, so that the product performance can be further improved.
Drawings
Fig. 1 is a manufacturing method of a conventional flexible circuit board with PI reinforcement.
Fig. 2 is a schematic diagram of a conventional substrate after finishing reinforcement and screen printing.
Fig. 3 is a schematic cross-sectional view of a conventional flexible circuit board.
Fig. 4 is a manufacturing method of the flexible circuit board with PI reinforcement according to the present invention.
Fig. 5 is another embodiment of the manufacturing method of the flexible circuit board with PI reinforcement according to the present invention.
FIG. 6 is a cross-sectional view of a stiffener according to the present invention.
FIG. 7 is a schematic view of a substrate to be processed according to the present invention.
FIG. 8 is a schematic diagram of a substrate after completing silk-screen printing and reinforcement processing according to the present invention.
Fig. 9 is a perspective view of a flexible circuit board of the present invention.
Fig. 10 is a cross-sectional view of a flexible circuit board of the present invention.
Detailed Description
In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following specific examples.
The invention discloses a PI reinforcing processing method, which comprises the following steps as shown in an auxiliary flow B of FIG. 4:
step B1, PI reinforcement preparation: preparing and processing a needed PI reinforcing material;
step B2, preparing a film on the PI reinforced top surface: pressing a cover film on the top surface of the PI reinforcement 31 through a hot roller, wherein the cover film is provided with an adhesive layer;
step B3, preparing glue on the PI reinforcing bottom surface: hot rolling and laminating pure glue on the bottom surface of the PI reinforcement as shown in FIG. 6;
step B4, PI reinforcement slitting: and D, processing and slitting the PI reinforcement obtained in the step B3 into small rolls, so that the operation of the automatic reinforcement laminating machine can be conveniently carried out while punching.
Further, at step B2: in the PI reinforced top surface prepared film, the color of the covering film is the same as the color of the printing ink silk-screened on the original PI reinforcement.
Further, at step B2: in the PI reinforced top surface preparation film, the covering film is a white covering film.
The invention also discloses a manufacturing method of the flexible circuit board with PI reinforcement manufactured by using the PI reinforcement processing method, as shown in a main flow A of figure 4, the manufacturing method comprises the following steps:
step A1, silk-screen printing characters: as shown in fig. 7, at least 1 circuit board body 20 is arranged on the substrate 200 to be processed, and silk-screen printing characters are performed at positions required by the substrate 200;
step A2, baking the ink: baking the substrate with the characters printed on the substrate, and solidifying the printing ink;
step A3, PI reinforcement and lamination: punching the small roll of reinforcement obtained in the step B4 into a single PCS reinforcement in sequence, and attaching the PCS reinforcement to the required position of each product on the substrate, as shown in FIG. 8;
step A4, PI reinforcement pressing: performing PI reinforcement pressing on the substrate obtained in the step A3, and pressing PI reinforcement on each product on the substrate;
step A5, PI reinforcement baking: and baking the PI reinforcement to enable the PI reinforcement to be solidified on the substrate.
As shown in the auxiliary flow B of fig. 5, another embodiment of the PI reinforcement processing method of the present invention includes the following steps:
step B1, PI reinforcement preparation: preparing and processing a needed PI reinforcing material;
step B2, preparing a film on the PI reinforced top surface: pressing a cover film on the top surface of the PI reinforcement 31 through a hot roller, wherein the cover film is provided with an adhesive layer;
step B3, preparing glue on the PI reinforcing bottom surface: hot rolling and laminating pure glue on the bottom surface of the PI reinforcement as shown in FIG. 6;
step B4: and D, PI reinforcement die cutting, wherein the PI reinforcement obtained in the step B3 is die cut to be processed into single PCS reinforcement, and the single PCS reinforcement is transferred to the bearing film in an array mode, so that the operation of the automatic reinforcement laminating machine capable of sucking and laminating at the same time is facilitated.
Further, in the PI reinforcement top surface preparation film of the step B2, the color of the cover film is the same as the color of the ink screen printed on the original PI reinforcement.
Further, in the PI reinforced top backup film of step B2, the cover film was a white cover film.
As shown in the flow a of fig. 5, another embodiment of the present invention is a method for manufacturing a flexible circuit board with PI reinforcement manufactured by using the PI reinforcement processing method, which includes the following steps:
step A1, silk-screen printing characters: as shown in fig. 7, at least 1 circuit board body 20 is arranged on the substrate 200 to be processed, and silk-screen printing characters are performed at positions required by the substrate 200;
step A2, baking the ink: baking the substrate with the characters printed on the substrate, and solidifying the printing ink;
step A3, PI reinforcement and lamination: sequentially sucking and bonding the single PCS reinforcement obtained in the step B4 to the required positions of the products on the substrate, as shown in FIG. 8;
step A4, PI reinforcement pressing: performing PI reinforcement pressing on the substrate obtained in the step A3, and pressing PI reinforcement on each product on the substrate;
step A5, PI reinforcement baking: and baking the PI reinforcement to enable the PI reinforcement to be solidified on the substrate.
As shown in fig. 9 and 10, the present invention further discloses a flexible circuit board 2, wherein the substrate of the flexible circuit board 2 is manufactured by the manufacturing method shown in fig. 4 or 5 to complete screen printing and reinforcement processing, and then the subsequent manufacturing process and appearance processing are continued to obtain the flexible circuit board 2 of the present invention, the reinforcement 30 is attached to the required position of the flexible circuit board 2, and the reinforcement 30 includes a cover film 32, a PI reinforcement 31 and a pure glue 33; the top surface of the PI reinforcement 31 is provided with a cover film 32, and the bottom surface of the PI reinforcement 31 is provided with a pure glue 33.
Further, the cover film 32 is a white cover film.
As shown in fig. 3 and 10, the thickness H2 of the reinforcement 30 (the sum of the cover film 32, the PI reinforcement 31 and the clear adhesive 33) of the flexible circuit board 20 of the present invention is equivalent to the total thickness H1 of the ink 13, the PI reinforcement 11 and the clear adhesive 13 on the conventional flexible circuit board 1, and is within the specification range required by the product.
The invention adopts the covering film with the effect required by the flexible circuit board product to replace the original PI reinforcing area printing ink, and the PI reinforcement and the characters on the flexible circuit board are separately processed, the top surface and the bottom surface of the PI reinforcement are respectively provided with the covering film and the pure glue, and then are divided into small rolls or die-cut into single PCS according to the requirement of corresponding processing equipment, and then are subsequently processed; according to the manufacturing method of the flexible circuit board, the silk-screen printing characters are firstly carried out on the substrate which is not adhered with the PI reinforcement, the surface of the substrate is flat, the silk-screen printing is easy, and the silk-screen printing precision of the characters can be improved; the PI reinforcement is replaced by attaching a covering film, the covering film has higher stamping resistance and chemical water resistance, and can not fall off in a layering manner during punching and subsequent processes, so that the poor falling of the original printing ink can be avoided, and the product quality and yield are improved; in the step A4 PI reinforcement pressing and the step A5 PI reinforcement baking, the PI reinforcement pressing is solidified on the substrate, and meanwhile, the covering film is also pressed and solidified on the PI reinforcement, so that the pressing and baking processes of the covering film and the PI reinforcement are reduced; if the original PI of the product is reinforced by white ink, the invention can be replaced by a white cover film, and the reflectivity of the white cover film is higher than that of the white ink, so that the product performance can be further improved.
The above embodiments and drawings are not intended to limit the form and style of the present invention, and any suitable changes or modifications thereof by those skilled in the art should be considered as not departing from the scope of the present invention.
Claims (10)
1. A processing method for PI reinforcement is characterized by comprising the following steps:
step B1, PI reinforcement preparation: preparing and processing a needed PI reinforcing material;
step B2, preparing a film on the PI reinforced top surface: pressing a cover film on the PI reinforced top surface through a hot roller, wherein the cover film is provided with an adhesive layer;
step B3, preparing glue on the PI reinforcing bottom surface: pressing pure rubber on the bottom surface reinforced by the PI through a hot roller;
step B4, PI reinforcement slitting: and D, processing and slitting the PI reinforcement obtained in the step B3 into small rolls, so that the operation of the automatic reinforcement laminating machine can be conveniently carried out while punching.
2. The PI reinforcement processing method of claim 1, wherein: in the PI reinforcement top surface preparation film of the step B2, the color of the covering film is the same as the color of the silk-screen printing ink on the original PI reinforcement.
3. The PI reinforcement processing method of claim 2, wherein: in the PI reinforced top preparation film of step B2, the cover film was a white cover film.
4. A reinforced processing method is characterized by comprising the following steps:
step B1, PI reinforcement preparation: preparing and processing a needed PI reinforcing material;
step B2, preparing a film on the PI reinforced top surface: pressing a cover film on the PI reinforced top surface through a hot roller, wherein the cover film is provided with an adhesive layer;
step B3, preparing glue on the PI reinforcing bottom surface: pressing pure rubber on the bottom surface reinforced by the PI through a hot roller;
step B4: and D, PI reinforcement die cutting, wherein the PI reinforcement obtained in the step B3 is die cut to be processed into single PCS reinforcement, and the single PCS reinforcement is transferred to the bearing film in an array mode, so that the operation of the automatic reinforcement laminating machine capable of sucking and laminating at the same time is facilitated.
5. The PI reinforcement processing method of claim 4, wherein: in the PI reinforcement top surface preparation film of the step B2, the color of the covering film is the same as the color of the silk-screen printing ink on the original PI reinforcement.
6. The PI reinforcement processing method of claim 5, wherein: in the PI reinforced top preparation film of step B2, the cover film was a white cover film.
7. A method for manufacturing a flexible circuit board with PI reinforcement manufactured by using the PI reinforcement processing method according to any one of claims 1 to 3, comprising the steps of:
step A1, silk-screen printing characters: arranging at least 1 circuit board body on a substrate to be processed, and carrying out silk-screen printing on characters at required positions of the substrate;
step A2, baking the ink: baking the substrate with the characters printed on the substrate, and solidifying the printing ink;
step A3, PI reinforcement and lamination: punching the small roll of reinforcement obtained in the step B4 into single PCS reinforcement in sequence, and attaching the PCS reinforcement to the required position of each product on the substrate;
step A4, PI reinforcement pressing: performing PI reinforcement pressing on the substrate obtained in the step A3, and pressing PI reinforcement on each product on the substrate;
step A5, PI reinforcement baking: and baking the PI reinforcement to enable the PI reinforcement to be solidified on the substrate.
8. A method for manufacturing a flexible circuit board with PI reinforcement manufactured by using the PI reinforcement processing method according to any one of claims 4 to 6, comprising the steps of:
step A1, silk-screen printing characters: arranging at least 1 circuit board body on a substrate to be processed, and carrying out silk-screen printing on characters at required positions of the substrate;
step A2, baking the ink: baking the substrate with the characters printed on the substrate, and solidifying the printing ink;
step A3, PI reinforcement and lamination: c, sequentially sucking and adhering the single PCS reinforcement obtained in the step B4 to the required positions of the products on the substrate;
step A4, PI reinforcement pressing: performing PI reinforcement pressing on the substrate obtained in the step A3, and pressing PI reinforcement on each product on the substrate;
step A5, PI reinforcement baking: and baking the PI reinforcement to enable the PI reinforcement to be solidified on the substrate.
9. A flexible circuit board, characterized in that: the substrate of the flexible circuit board is processed by silk-screen printing and reinforcement by the manufacturing method of the flexible circuit board with PI reinforcement as claimed in claim 7 or 8.
10. A flexible circuit board, characterized in that: the circuit board comprises a circuit board body and reinforcement, wherein the required position of the circuit board body is attached with the reinforcement, and the reinforcement comprises a covering film, PI reinforcement and pure glue; the top surface of PI reinforcement is provided with the cover film, and the bottom surface of PI reinforcement is provided with the pure glue, and the cover film is white cover film.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011605272.6A CN112888170A (en) | 2020-12-30 | 2020-12-30 | PI (polyimide) reinforcement processing method, manufacturing method of flexible circuit board with PI reinforcement and flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011605272.6A CN112888170A (en) | 2020-12-30 | 2020-12-30 | PI (polyimide) reinforcement processing method, manufacturing method of flexible circuit board with PI reinforcement and flexible circuit board |
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| CN112888170A true CN112888170A (en) | 2021-06-01 |
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| CN202011605272.6A Withdrawn CN112888170A (en) | 2020-12-30 | 2020-12-30 | PI (polyimide) reinforcement processing method, manufacturing method of flexible circuit board with PI reinforcement and flexible circuit board |
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Application publication date: 20210601 |