CN109152226B - A kind of method of ultra-thin single side FPC production - Google Patents
A kind of method of ultra-thin single side FPC production Download PDFInfo
- Publication number
- CN109152226B CN109152226B CN201811313317.5A CN201811313317A CN109152226B CN 109152226 B CN109152226 B CN 109152226B CN 201811313317 A CN201811313317 A CN 201811313317A CN 109152226 B CN109152226 B CN 109152226B
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- Prior art keywords
- single side
- copper
- product
- fccl
- clad plate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of methods of ultra-thin single side FPC production, which comprises the following steps: preparation carrying copper-clad plate, adhesives and single side FCCL；Adhesives is bonded on the tow sides of carrying copper-clad plate；Single side FCCL is bonded on every face adhesives；Pressurization, heating and heat cure processing；Microetch, grinding or blasting treatment are carried out to the copper face of single side FCCL, and carry out reduction processing as needed；Photosensitive wet film on photosensitive dry film or silk-screen is bonded on the copper face of single side FCCL；It is exposed by the film with figure with UV light on photosensitive dry film or photosensitive wet film；Pass through developing liquid developing；It is etched by etching solution and removes photosensitive dry film or photosensitive wet film with remover, make the layers of copper for retaining corresponding figure on single side FCCL；It is bonded the cover film to open a window with figure on single side FCCL and presses heat cure；Exposed copper metallic face is surface-treated；Product after completing surface treatment is opened with cutting technique by the shape cutting of product, and required product is obtained.
Description
Technical field
The present invention relates to flexible circuit board manufacture craft field, in particular to a kind of side of ultra-thin single side FPC production
Method.
Background technique
Flexible circuit board is that have height reliability using polyimides or polyester film as one kind made of substrate, excellent
Flexible printed circuit, abbreviation soft board or FPC have the characteristics that Distribution density is high, light-weight, thickness is thin.Wherein ultrasound is visited
The FPC product of head is ultra-thin single side FPC product (thickness is at 0.1 millimeter or less), to the thickness of product, product surface it is smooth
Degree has strict requirements.
It is conventional to there is fitting carrying membrane process production and belt support frame to make work ultra-thin single side FPC production technique
Skill.Wherein, process makes before fitting carrying membrane process can meet the shape cutting (or punching) of product, but completes shape in product
After cutting (or punching), the easy wrinkle of ultra-thin materials and curling, lead to the FPC product large area of ultrasonic probe when removing carrier film
The requirement of client is not achieved in electroplating gold region.And the level of the wet process in manufacturing process can be met using belt support frame manufacture craft
Line makes anti-wrinkle, but the production of the processes such as pressing, exposure, drilling for not being suitable for product, frequently by product in manufacturing process
It fits to frame and will lead to that production efficiency is low and the easy wrinkle of product with removing from frame.
Summary of the invention
The present invention is intended to provide a kind of method of ultra-thin single side FPC production, to solve existing ultra-thin single side FPC product
Manufacturing process be easy to appear wrinkle and the low problem of production efficiency.For this purpose, the specific technical solution that the present invention uses is as follows:
A kind of method of ultra-thin single side FPC production, which is characterized in that can comprise the following steps that
S1. it prepares the carrying copper-clad plate with the first pin hole and first direction hole, there is the second pin hole and second party
To the adhesives with hollow out figure in hole and the single side FCCL (flexible copper-clad with third pin hole and third direction hole
Plate), the carrying copper-clad plate is double face copper, and the hollow out figure corresponds to the shape of product to be produced；
S2. it is bonded the adhesives on the tow sides of the carrying copper-clad plate, and makes the second pin hole and second
Direction hole is aligned with the first pin hole and first direction hole；
S3. it is bonded single side FCCL on every face adhesives, and makes third pin hole and third direction hole and the second pin
Hole and the alignment of second direction hole；
S4. it has been bonded after single side FCCL and has been pressurizeed, heated and heat cure processing according to adhesives characteristic；
S5. microetch and/or reduction processing are carried out to the copper face of single side FCCL；
S6. it is bonded on the copper face of processed single side FCCL anti-etching photosensitive on anti-etching photosensitive dry film or silk-screen
Wet film；
S7. it is exposed by the film with figure with UV light on photosensitive dry film or photosensitive wet film, which corresponds to
The shape of product；
S8. exposed single side FCCL is passed through into developing liquid developing；
S9. the single side FCCL to develop is etched by etching solution and removes photosensitive dry film or photosensitive wet film with remover,
Make the layers of copper for retaining corresponding figure on single side FCCL；
S10. it is bonded cover film open a window with figure on single side FCCL and presses heat cure, figure windowing corresponds to production
The shape of product；
S11. exposed copper metallic face is surface-treated；
S12. the product after completing surface treatment is opened with cutting technique by the shape cutting of product, and required product is obtained.
Further, the size of the hollow out figure can be 3 to 5 millimeters bigger than the shape of product, this may insure producing
After product complete, product will not glued material cling, can with carrying copper-clad plate be automatically separated.
Further, the hollow out figure can be formed by modes such as punching, plane cutting or laser cuttings.
Further, the thickness for carrying copper-clad plate can be selected in the range of 0.3 to 1.0 millimeter, it is preferable that be held
Carry copper-clad plate with a thickness of 0.3 millimeter.
Further, the detailed process of step S4 are as follows: first cover single side FCCL, adhesives and carrying that contraposition is folded
Copper sheet soldering iron melts in quadrangle product dead space point, and single side FCCL, adhesives and carrying copper-clad plate position is made to immobilize, then
Catch up with concora crush real by laminator or high temperature roller press, wherein the temperature of laminator or high temperature roller press is at 100 to 130 DEG C, pressure
2 to 7Kg/cm2, hot setting is finally carried out, temperature is at 150 to 160 DEG C, the time 1 to 2 hour.
Further, the technique of the surface treatment in step S11 may include plating proof gold, electronickelling gold, change nickel gold, changes nickel
Porpezite changes silver or change tin etc..
Further, the method may further comprise the step of: S13. vacuum absorption device and inhale product from carrying copper-clad plate
It walks and is transferred to product container.
The present invention by adopting the above technical scheme, has the beneficial effect that the method for the present invention by the way that single side FCCL to be bonded
On the carrying copper-clad plate two sides with certain thickness and hardness, making single side FCCL and carrying copper-clad plate, whole process is made together, directly
To cutting (or punching) shape, product is separated from carrying copper-clad plate surface automatically, is held since whole process single side FCCL is attached to
It carries in copper-clad plate, therefore the rigidity for carrying copper-clad plate can be to avoid bring product wrinkle problem during working process, simultaneously
It is fitted in because of product on the two sides of carrying copper-clad plate, two products can be made every time, substantially increase producing efficiency.
Detailed description of the invention
To further illustrate that each embodiment, the present invention are provided with attached drawing.These attached drawings are that the invention discloses one of content
Point, mainly to illustrate embodiment, and the associated description of specification can be cooperated to explain the operation principles of embodiment.Cooperation ginseng
These contents are examined, those of ordinary skill in the art will be understood that other possible embodiments and advantages of the present invention.In figure
Component be not necessarily to scale, and similar component symbol is conventionally used to indicate similar component.
Fig. 1 is the flow chart of the method for the present invention；
Fig. 2 is the schematic diagram before each layer structure fitting of product.
Specific embodiment
Now in conjunction with the drawings and specific embodiments, the present invention is further described.
Referring to Fig.1, the method for the ultra-thin single side FPC production of detailed description of the present invention.This method may include following step
It is rapid:
S1. it prepares the carrying copper-clad plate 1 with the first pin hole 11 and first direction hole 12, there is 21 and of the second pin hole
The adhesives 2 with hollow out figure 23 and the single side with third pin hole 31 and third direction hole 32 in second direction hole 22
FCCL (flexible copper-clad plate) 3, as shown in Figure 2.0.3 to 1.0mm double face copper can be used by carrying copper-clad plate 1, and copper is thick
For 1/3OZ to 2OZ.In a preferred embodiment, carrying copper-clad plate 1 is the double face copper of 0.3mm, copper thickness 1/2OZ.
Hollow out figure corresponds to the shape of product to be produced, it is preferable that shape of the size of the hollow out figure 23 of adhesives 2 than product
Big 3 to 5mm, this may insure after the completion of production, product will not glued material cling, can with carrying copper-clad plate from
Dynamic separation.The hollow out figure 23 of adhesives 2 can be formed by modes such as punching, plane cutting or laser cuttings.Pin hole 11,
21,31 it to be used for stationary positioned, and direction hole 12,22,32 is for confirming product layout direction.
Adhesives 2 can high temperature resistant, chemically-resistant liquid medicine attack, with a thickness of 0.01 to 0.05mm.Adhesives 2 usually selects
With the low heat cure adhesives of surface bonding force, contraposition operation is bonded with convenient working person.In a preferred embodiment, it is bonded
Material 2 is 3M D3450 double-sided adhesive, and glue is with a thickness of 0.035mm, and peel strength reaches 31N/CM after pressing thermosetting.
S2. it is bonded adhesives 2 on the tow sides of carrying copper-clad plate 1, and makes the second pin hole 21 and second direction
Hole 22 is aligned with the first pin hole 11 and first direction hole 12.
S3. it is bonded single side FCCL 3 on every face adhesives 2, and makes third pin hole 31 and third direction hole 32 and the
Two pin holes 21 and second direction hole 22 are aligned.
S4. it has been bonded after single side FCCL 3 and has been pressurizeed, heated and heat cure processing according to the characteristic of adhesives 2, with
Single side FCCL 3 is set to fit together with the carrying fixation of copper-clad plate 1, so that it is guaranteed that single side FCCL during subsequent processing
3 be not in wrinkle phenomenon.Detailed process is as follows: single side FCCL 3, adhesives and the copper-clad plate for first folding contraposition are used
Soldering iron melts in quadrangle product dead space point, and FCCL, adhesives and copper-clad plate position is made to immobilize, then passes through laminator or height
Hot rolling machine catches up with concora crush real, wherein the temperature of laminator or high temperature roller press is at 100 to 130 DEG C, and pressure is 2 to 7Kg/cm2,
Hot setting is finally carried out, temperature is at 150 to 160 DEG C, the time 1 to 2 hour.
S5. it is thicker microetch, grinding or blasting treatment, the copper surface for keeping FCCL smooth to be carried out to the copper face of single side FCCL 3
It is rough, to increase the binding force of the photosensitive wet film and copper face on the photosensitive dry film or silk-screen of subsequent technique fitting, and can be according to need
Reduction processing is carried out, so that the copper face of single side FCCL 3 meets the thickness requirement of product.
S6. sense anti-etching on anti-etching photosensitive dry film or silk-screen is bonded on the copper face of processed single side FCCL 3
Light wet film.
S7. it is exposed by the film with figure with UV light on photosensitive dry film or photosensitive wet film, which corresponds to
The shape of product.
S8. exposed single side FCCL 3 is passed through into developing liquid developing.
S9. the single side FCCL 3 to develop is etched by etching solution and removes photosensitive dry film or photosensitive wet with remover
Film makes the layers of copper for retaining corresponding figure on single side FCCL 3.
S10. it is bonded cover film open a window with figure on single side FCCL 3 and presses heat cure, which, which opens a window, corresponds to
The shape of product.The windowing figure of cover film can be formed by modes such as punching, plane cutting or laser cuttings.
S11. exposed copper metallic face is surface-treated.Process of surface treatment has plating proof gold, electronickelling gold, changes
Nickel gold, changes silver or change tin etc. at change NiPdAu.
S12. the product after completing surface treatment is opened with cutting technique by the shape cutting of product, and required product is obtained.
In addition, the method may further comprise the step of: S13. after dicing, product is covered into copper from carrying with vacuum absorption device
Plate siphons away and is transferred to product container, and wrinkle can occur to avoid product in this in transfer process.
The method of the present invention makes list by the way that single side FCCL is fitted in the carrying copper-clad plate two sides with certain thickness and hardness
Whole process makes together for face FCCL and carrying copper-clad plate, and until cutting (or punching) shape, product is automatically from carrying copper-clad plate table
Face separation, since whole process single side FCCL is attached in carrying copper-clad plate, the rigidity for carrying copper-clad plate can be to avoid adding
Bring product wrinkle problem in work treatment process, while being fitted on the two sides of carrying copper-clad plate because of product, it can make every time
Make two products, substantially increases producing efficiency.Since the two sides of carrying copper-clad plate is fitted with identical product simultaneously, electricity
The homogeneous current distribution of plating, electroplating quality are high.
Although specifically showing and describing the present invention in conjunction with preferred embodiment, those skilled in the art should be bright
It is white, it is not departing from the spirit and scope of the present invention defined by the appended claims, it in the form and details can be right
The present invention makes a variety of changes, and is protection scope of the present invention.
Claims (7)
1. a kind of method of ultra-thin single side FPC production, which comprises the following steps:
S1. it prepares the carrying copper-clad plate with the first pin hole and first direction hole, there is the second pin hole and second direction hole
The adhesives with hollow out figure and the single side FCCL with third pin hole and third direction hole, the carrying copper-clad plate
For double face copper, the hollow out figure corresponds to the shape of product to be produced；
S2. it is bonded adhesives on the tow sides of carrying copper-clad plate, and makes the second pin hole and second direction hole and first
Pin hole and the alignment of first direction hole；
S3. single side FCCL is bonded on every face adhesives, and make third pin hole and third direction hole and the second pin hole and
The alignment of second direction hole；
S4. it has been bonded after single side FCCL and has been pressurizeed, heated and heat cure processing according to adhesives characteristic；
S5. microetch, grinding or blasting treatment are carried out to the copper face of single side FCCL, and carries out reduction processing as needed；
S6. it is bonded on the copper face of processed single side FCCL anti-etching photosensitive wet on anti-etching photosensitive dry film or silk-screen
Film；
S7. it is exposed by the film with figure with UV light on photosensitive dry film or photosensitive wet film, which corresponds to product
Shape；
S8. exposed single side FCCL is passed through into developing liquid developing；
S9. the single side FCCL to develop is etched by etching solution and removes photosensitive dry film or photosensitive wet film with remover, make list
Retain the layers of copper of corresponding figure on the FCCL of face；
S10. it is bonded cover film open a window with figure on single side FCCL and presses heat cure, which opens a window corresponding to product
Shape；
S11. exposed copper metallic face is surface-treated；
S12. the product after completing surface treatment is opened with cutting technique by the shape cutting of product, and required product is obtained.
2. the method as described in claim 1, which is characterized in that the size of the hollow out figure 3 to 5 milli bigger than the shape of product
Rice.
3. method according to claim 1 or 2, which is characterized in that the hollow out figure passes through punching, plane cutting or laser
Cutting mode is formed.
4. the method as described in claim 1, which is characterized in that carry copper-clad plate with a thickness of 0.3 to 1.0 millimeter, copper thickness is
1/3OZ to 2OZ.
5. the method as described in claim 1, which is characterized in that the detailed process of step S4 are as follows: the list for first folding contraposition
Face FCCL, adhesives and carrying copper-clad plate soldering iron melt in quadrangle product dead space point, make single side FCCL, adhesives and hold
It carries copper-clad plate position to immobilize, then catches up with concora crush real by laminator or high temperature roller press, wherein laminator or high temperature roller press
Temperature at 100 to 130 DEG C, pressure is 2 to 7Kg/cm2, finally carry out hot setting, temperature at 150 to 160 DEG C, the time 1 to
2 hours.
6. the method as described in claim 1, which is characterized in that the technique of the surface treatment in step S11 include plating proof gold,
Electronickelling gold changes nickel gold, changes NiPdAu, changes silver or changes tin.
7. the method as described in claim 1, which is characterized in that the method also includes steps: S13. after dicing, uses vacuum
Product is siphoned away from carrying copper-clad plate and is transferred to product container by adsorbent equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811313317.5A CN109152226B (en) | 2018-11-06 | 2018-11-06 | A kind of method of ultra-thin single side FPC production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811313317.5A CN109152226B (en) | 2018-11-06 | 2018-11-06 | A kind of method of ultra-thin single side FPC production |
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| CN109152226A CN109152226A (en) | 2019-01-04 |
| CN109152226B true CN109152226B (en) | 2019-12-03 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109890146A (en) * | 2019-02-14 | 2019-06-14 | 广州京写电路板有限公司 | A kind of production method that printed circuit board is used in small component attachment |
| CN110072346B (en) * | 2019-05-13 | 2020-07-21 | 胜宏科技（惠州）股份有限公司 | Gold plating method for key sheet |
| CN110177427A (en) * | 2019-05-24 | 2019-08-27 | 上海温良昌平电器科技股份有限公司 | Depressed structure and its production technology are escaped in a kind of pressure-sensing glue reinforcement |
| CN110299086A (en) * | 2019-07-04 | 2019-10-01 | 信利（惠州）智能显示有限公司 | Display screen, cover board and cover board production method |
| CN110769606B (en) * | 2019-11-13 | 2021-02-19 | 珠海景旺柔性电路有限公司 | Double-sided processing method suitable for single-sided copper-plated panel |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07273424A (en) * | 1994-03-29 | 1995-10-20 | Ibiden Co Ltd | Manufacture of single-sided printed wiring board |
| US10051743B2 (en) * | 2008-04-04 | 2018-08-14 | Hitachi Chemical Company, Ltd. | Two-layered laminate having metal foil cladded on its one surface, method for production of the laminate, single-sided printed wiring board, and method for production of the wiring board |
| KR101055488B1 (en) * | 2009-12-16 | 2011-08-08 | 삼성전기주식회사 | Carrier for manufacturing printed circuit board, manufacturing method thereof and manufacturing method of printed circuit board using same |
| CN102223763B (en) * | 2010-04-16 | 2013-03-06 | 宏恒胜电子科技（淮安）有限公司 | Manufacturing method of connecting sheet circuit board |
| KR20120035007A (en) * | 2010-10-04 | 2012-04-13 | 삼성전기주식회사 | Manufacturing method of printed circuit board |
| CN104754870A (en) * | 2013-12-31 | 2015-07-01 | 昆山意力电路世界有限公司 | HDI high-density composite circuit board structure |
| CN103731993A (en) * | 2014-01-17 | 2014-04-16 | 杨秀英 | Machining method for single-side flexible printed circuit board |
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