CN112888184A

CN112888184A - PI (polyimide) reinforcement processing method with marking line and manufacturing method of flexible circuit board

Info

Publication number: CN112888184A
Application number: CN202011605490.XA
Authority: CN
Inventors: 陈妙芳; 续振林
Original assignee: Xiamen Flexible Electronics Research Institute Co ltd; Xiamen Hongxin Electronic Technology Group Co Ltd
Current assignee: Xiamen Flexible Electronics Research Institute Co ltd; Xiamen Hongxin Electronic Technology Group Co Ltd
Priority date: 2020-12-30
Filing date: 2020-12-30
Publication date: 2021-06-01

Abstract

The invention discloses a PI reinforcement processing method with a mark line and a manufacturing method of a flexible circuit board, wherein the mark line on the PI reinforcement and characters on a product are separately printed by silk, the PI reinforcement is firstly printed with the mark line by a whole plate screen and then is subsequently processed, when the mark line is printed by the PI reinforcement by the whole plate screen, the plate surface of the PI reinforcement is flat and easy to print by the silk, when the PI reinforcement is formed, the mark line on the PI reinforcement is recognized by a camera and then is processed and formed, and the position accuracy of the mark line on the reinforcement can be improved; the substrate without PI reinforcement is subjected to silk-screen printing, the surface of the substrate is flat, silk-screen printing is easy, and the silk-screen printing precision of characters can be improved.

Description

PI (polyimide) reinforcement processing method with marking line and manufacturing method of flexible circuit board

Technical Field

The invention relates to the technical field of circuit board manufacturing, in particular to a PI (polyimide) reinforcement processing method with a marking line and a manufacturing method of a flexible circuit board.

Background

When the flexible circuit board and components such as a connector and the like are connected and installed in a plugging mode, PI reinforcement is required to be attached to the back face of a plugging finger end of the flexible circuit board, marking lines are printed on the PI reinforcement in a silk-screen mode, and therefore the flexible circuit board can be conveniently connected and installed in place in a plugging mode. In addition, due to the smooth surface and the ink characteristic of the PI reinforcement, the mark line on the PI reinforcement is easy to fall off in the subsequent processing process, the product quality is poor, and the reject ratio is high.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a PI reinforcing method with marking lines, which can improve the silk-screen printing precision.

In order to achieve the above purpose, the solution of the invention is:

the invention discloses a PI reinforcing processing method with a marking line, which comprises the following steps:

step B1, PI reinforcement preparation: preparing and processing a needed PI reinforcing material;

step B2, carrying out silk-screen marking on the PI reinforced top surface: silk-screen printing mark lines on the top surface of the PI reinforcement, wherein the silk-screen printing lines are arranged according to the PI reinforcement splicing plate;

step B3, baking ink, namely reinforcing the PI with the silk-printed marking lines for baking, and curing the ink;

step B4, preparing glue on the bottom surface of the PI reinforcement, and pressing pure glue on the bottom surface of the PI reinforcement by hot rollers;

and B5, PI reinforcement molding, namely processing and molding the PI reinforcement obtained in the step B4 into single PCS reinforcement, recognizing the mark line on the PI reinforcement by a camera, then processing and molding to improve the position accuracy of the mark line on the reinforcement, and transferring the array to a bearing film so as to facilitate the operation of an automatic reinforcement laminating machine while sucking.

Further, the processing method for reinforcing the PI with the mark line also comprises the following steps:

step B6, PI strengthening alkali washing: and (4) carrying out alkali washing on the PI reinforcement to improve the binding force of the PI reinforcement and the printing ink.

Further, the alkali washing liquid for the PI reinforcement alkali washing of the step B6 is a sodium hydroxide liquid medicine, and the concentration is 3-5%.

The invention also aims to overcome the defects of the prior art and provide a manufacturing method of a flexible circuit board for improving the silk-screen printing precision by using the PI reinforcing method with the mark lines.

In order to achieve the above purpose, the solution of the invention is:

the manufacturing method of the flexible circuit board using the PI reinforcing processing method with the mark lines comprises the following steps:

step A1, silk-screen printing characters: arranging at least 1 circuit board body on a substrate to be processed, and carrying out silk-screen printing on characters at required positions of the substrate;

step A2, baking the ink: baking the substrate with the characters printed on the substrate, and solidifying the printing ink;

step A3, PI reinforcement and lamination: c, reinforcing and attaching the single PCS obtained in the step B5 to the position required by each product on the substrate;

step A4, PI reinforcement pressing: performing PI reinforcement pressing on the substrate obtained in the step A3, and pressing PI reinforcement on each product on the substrate;

step A5, PI reinforcement baking: and baking the PI reinforcement to enable the PI reinforcement to be solidified on the substrate.

After the scheme is adopted, the manufacturing method of the flexible circuit board separates silk-screen printing of the mark line on the PI reinforcement and the characters on the product, the PI reinforcement is firstly subjected to whole-board silk-screen printing of the mark line and then is subjected to subsequent processing, when the PI reinforcement is subjected to whole-board silk-screen printing of the mark line, the surface of the PI reinforcement board is flat and easy to be subjected to silk-screen printing, when the PI reinforcement is formed in the step B5, the mark line on the PI reinforcement is identified by a camera and then is processed and formed, and the position accuracy of the mark line on the reinforcement can be improved; firstly, silk-screen printing characters are carried out on a substrate which is not reinforced by adhering PI, the surface of the substrate is flat, silk-screen printing is easy, and the silk-screen printing precision of the characters can be improved; furthermore, before PI reinforcing silk screen printing, alkali washing is firstly carried out, and biting and etching are carried out to coarsen the PI reinforcing surface, so that the bonding force with printing ink is improved, the poor falling of the printing ink is improved, and the product quality and the yield are improved.

Drawings

Fig. 1 is a manufacturing method of a conventional PI reinforced flexible circuit board with a mark line.

Fig. 2 is a manufacturing method of the PI reinforced flexible circuit board with the mark line according to the present invention.

FIG. 3 is a plan view of the PI reinforcement of the present invention.

FIG. 4 is a perspective view of the PI reinforced molding process of the present invention.

FIG. 5 is a schematic view of a substrate to be processed according to the present invention.

FIG. 6 is a schematic diagram of a substrate after completing silk-screen printing and reinforcement processing according to the present invention.

Detailed Description

In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following specific examples.

The invention discloses a PI reinforcing processing method with a marking line, which comprises the following steps as shown in an auxiliary flow B of figure 2:

step B2, carrying out silk-screen marking on the PI reinforced top surface: silk-screen printing of a mark line 32 on the top surface of the PI reinforcement 31, wherein the silk-screen printing line is arranged according to the PI reinforcement splicing plate, as shown in figure 3;

step B3, baking the ink: reinforcing the PI with the printed mark lines, baking, and curing the printing ink;

step B4, preparing glue on the PI reinforcing bottom surface: pressing pure rubber on the bottom surface reinforced by the PI through a hot roller;

step B5, PI reinforcement molding: and C, processing and molding the PI reinforcement obtained in the step B4 into the single PCS reinforcement 30, as shown in fig. 4, recognizing the mark line on the PI reinforcement by using a camera, and then processing and molding the mark line to improve the position accuracy of the mark line on the reinforcement 30, transferring the array to a bearing film, and facilitating the operation of an automatic reinforcement laminating machine which can be attached while sucking.

Further, the processing method for reinforcing the marked line PI further comprises the following steps of B6: and (3) performing alkaline washing on the PI reinforcement, wherein the alkaline washing is performed on the PI reinforcement to improve the binding force between the PI reinforcement and the printing ink.

Further, in the step B6, in the PI reinforced alkali washing, the alkali washing liquid is sodium hydroxide liquid medicine, and the concentration is 3-5%.

The invention also discloses a manufacturing method of the flexible circuit board using the marked line PI reinforcing processing method, and a processing flow of the flexible circuit board is shown as a main flow A in figure 2 and comprises the following steps:

step A1, silk-screen printing characters: as shown in fig. 5, at least 1 circuit board body 20 is arranged on a substrate 100 to be processed, and characters are printed on the substrate 100 at desired positions by silk screen printing;

step A3, PI reinforcement and lamination: attaching the single PCS reinforcement 30 obtained in the step B5 to the required position of each product on the substrate, as shown in FIG. 6;

After the scheme is adopted, the mark line on the PI reinforcement and the characters on the product are printed in a screen mode separately, the PI reinforcement is firstly subjected to screen printing of the mark line on the whole plate, then subsequent processing is carried out, when the mark line is printed in the screen printing of the PI reinforcement whole plate, the plate surface of the PI reinforcement plate is flat and easy to print in a screen mode, when the PI reinforcement is formed in the step B5, the mark line on the PI reinforcement is recognized by a camera, then the PI reinforcement plate is processed and formed, and the position accuracy of the mark line on the reinforcement can be improved; firstly, silk-screen printing characters are carried out on a substrate which is not reinforced by adhering PI, the surface of the substrate is flat, silk-screen printing is easy, and the silk-screen printing precision of the characters can be improved; furthermore, before PI reinforcing silk screen printing, alkali washing is firstly carried out, and biting and etching are carried out to coarsen the PI reinforcing surface, so that the bonding force with printing ink is improved, the poor falling of the printing ink is improved, and the product quality and the yield are improved.

The above embodiments and drawings are not intended to limit the form and style of the present invention, and any suitable changes or modifications thereof by those skilled in the art should be considered as not departing from the scope of the present invention.

Claims

1. A PI reinforcing processing method with a marking line is characterized by comprising the following steps:

and B5, PI reinforcement molding, namely processing and molding the PI reinforcement obtained in the B4 into single PCS reinforcement, and processing and molding after a camera is adopted to identify a mark line on the PI reinforcement.

2. The PI reinforcing processing method with the mark line as recited in claim 1, further comprising: step B6, PI strengthening alkali washing: and (5) carrying out alkali washing on the PI reinforcement.

3. The PI reinforcing processing method with the marking line as recited in claim 2, wherein: and B6, wherein the alkali wash solution for PI reinforced alkali wash is sodium hydroxide solution, and the concentration is 3-5%.

4. A manufacturing method of a flexible circuit board using the PI reinforcing processing method with the mark line is characterized by comprising the following steps: