CN114222428A - Joint strip pasting reinforcing process - Google Patents
Joint strip pasting reinforcing process Download PDFInfo
- Publication number
- CN114222428A CN114222428A CN202111439245.0A CN202111439245A CN114222428A CN 114222428 A CN114222428 A CN 114222428A CN 202111439245 A CN202111439245 A CN 202111439245A CN 114222428 A CN114222428 A CN 114222428A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- reinforcing plate
- reinforcing
- reinforcement
- carrier film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003014 reinforcing effect Effects 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000002699 waste material Substances 0.000 claims abstract description 8
- 238000003698 laser cutting Methods 0.000 claims abstract description 6
- 230000002787 reinforcement Effects 0.000 claims description 23
- 239000003292 glue Substances 0.000 claims description 12
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims description 3
- 239000003351 stiffener Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a joint strip reinforcing process, which comprises the following steps: the method comprises the following steps: providing a whole circuit board, a reinforcing plate blank and a bearing film, wherein the whole circuit board comprises a plurality of circuit board products; step two: attaching the reinforcing plate blank piece to the carrier film; step three: carrying out laser cutting on a reinforcing plate blank on the bearing film according to the arrangement of the circuit board products, separating the reinforcing plate blank into a connected waste material and a plurality of reinforcing plates, removing the connected waste material from the bearing film, and leaving a reinforcing plate assembly formed by the bearing film and the plurality of reinforcing plates; step four: sticking one surface of the reinforcing plate component with the reinforcing plate to the whole circuit board, so that each reinforcing plate is stuck to the corresponding area of the circuit board product to be reinforced; step five: and tearing off the bearing film to finish the pasting and reinforcing.
Description
Technical Field
The invention relates to a strip-connecting reinforcing process.
Background
At present because flexible circuit board itself has pliability, but the circuit board kneck needs certain intensity again owing to need peg graft, therefore flexible circuit board often need paste the stiffening plate in kneck and increase local intensity, and current process flow need paste the stiffening plate one by one to every circuit board product on the whole circuit board, need repetitious repetition take the stiffening plate, align, paste the operation of stiffening plate, and operating efficiency consumes time longer with low costs, and the very big degree has influenced production efficiency's improvement.
Therefore, how to overcome the above-mentioned drawbacks has become an important issue to be solved by those skilled in the art.
Disclosure of Invention
The invention overcomes the defects of the technology and provides
In order to achieve the purpose, the invention adopts the following technical scheme:
a joint strip reinforcing process is characterized by comprising the following steps:
the method comprises the following steps: providing a whole circuit board 1, a reinforcing plate blank 2 and a bearing film 3, wherein the whole circuit board 1 comprises a plurality of circuit board products 11;
step two: attaching the reinforcing plate blank 2 to the carrier film 3;
step three: carrying out laser cutting on the reinforcing plate blank 2 on the bearing film 3 according to the arrangement of the circuit board products 11, separating the reinforcing plate blank 2 into connected waste 21 and a plurality of reinforcing plates 22, removing the connected waste 21 from the bearing film 3, and leaving a reinforcing plate assembly formed by the bearing film 3 and the plurality of reinforcing plates 22;
step four: adhering one surface of the reinforcing plate component with the reinforcing plate 22 to the whole circuit board 1, so that each reinforcing plate 22 is adhered to the corresponding area of the circuit board product 11 needing to be reinforced;
step five: and tearing off the bearing film 3 to finish the reinforcement.
Preferably, one side of the carrier film 3 is provided with glue so as to facilitate the attachment of the reinforcement plate blank 2 thereon, one side of the reinforcement plate blank 2 is provided with glue so as to facilitate the attachment to the circuit board product 11, and the side of the reinforcement plate blank 2 without glue in the second step is attached to the side of the carrier film 3 with glue.
Preferably, the carrier film 3 is made of a transparent material so as to observe the relative positions of the reinforcing plate 22 and the circuit board product 11 when the reinforcing plate assembly is pasted on the whole circuit board 1, and the circuit board product 11 is provided with a mark line 12 so as to judge whether the reinforcing plate 22 is pasted on the opposite position.
Preferably, a plurality of first alignment through holes 13 are formed in the whole circuit board 1, and second alignment through holes 31 corresponding to the first alignment through holes 13 are formed in the carrier film 3 so as to align the whole circuit board 1 and the carrier film 3 through the two through holes.
Preferably, the reinforcing plate blank 2 and the carrier film 3 are both larger than the whole circuit board 1, and the carrier film 3 is cut after the reinforcing plate blank 2 is cut in the third step to form a plurality of reinforcing plate assemblies for the plurality of whole circuit boards 1.
Compared with the prior art, the invention has the beneficial effects that:
the present case is even a reinforcement technology of pasting cuts out required stiffening plate through laser after pasting the stiffening plate blank on the carrier film, the required stiffening plate of whole board circuit board has all been fixed and has formed the stiffening plate subassembly on the carrier film like this, only need to paste the corresponding position on the whole board circuit board with the stiffening plate subassembly and can all paste the stiffening plate with all circuit board products, tear the carrier film at last and just accomplished and paste the reinforcement process, so only need once paste the reinforcement operation that the operation can accomplish whole board circuit board, operation efficiency has greatly been improved and man-hour has been reduced.
Drawings
FIG. 1 is a schematic diagram of a whole circuit board, a reinforcing plate blank and a carrier film.
Fig. 2 is a schematic view of the reinforcing plate assembly of the present disclosure.
Fig. 3 is a schematic diagram of the reinforcing plate assembly attached to the whole circuit board.
Fig. 4 is a schematic diagram of the whole circuit board after the stiffening plate is attached.
FIG. 5 is a second schematic view of the present embodiment of a stiffener assembly.
Detailed Description
The features of the present invention and other related features are further described in detail below by way of examples to facilitate understanding by those skilled in the art:
as shown in fig. 1 to 4, a joint strip reinforcing process is characterized by comprising the following steps:
the method comprises the following steps: providing a whole circuit board 1, a reinforcing plate blank 2 and a bearing film 3, wherein the whole circuit board 1 comprises a plurality of circuit board products 11;
step two: attaching the reinforcing plate blank 2 to the carrier film 3;
step three: carrying out laser cutting on the reinforcing plate blank 2 on the bearing film 3 according to the arrangement of the circuit board products 11, separating the reinforcing plate blank 2 into connected waste 21 and a plurality of reinforcing plates 22, removing the connected waste 21 from the bearing film 3, and leaving a reinforcing plate assembly formed by the bearing film 3 and the plurality of reinforcing plates 22;
step four: adhering one surface of the reinforcing plate component with the reinforcing plate 22 to the whole circuit board 1, so that each reinforcing plate 22 is adhered to the corresponding area of the circuit board product 11 needing to be reinforced;
step five: and tearing off the bearing film 3 to finish the reinforcement.
As mentioned above, the present case even sticks the reinforcement technology and cuts out required stiffening plate 22 through laser after pasting stiffening plate blank 2 on the carrier film 3, the required stiffening plate 22 of whole board circuit board 1 has all been fixed and has formed the stiffening plate subassembly on the carrier film 3 like this, only need to paste the corresponding position on whole board circuit board 1 with the stiffening plate subassembly and can all paste stiffening plate 22 with all circuit board products 11, tear off carrier film 3 at last and just accomplished the reinforcement process, so only need once paste the reinforcement operation that can accomplish whole board circuit board 1, the very big degree has improved operating efficiency and has reduced man-hour.
As shown in fig. 1 to fig. 3, preferably, one side of the carrier film 3 is provided with glue to facilitate the attachment of the stiffening plate blank 2 thereon, one side of the stiffening plate blank 2 is provided with glue to facilitate the attachment to the circuit board product 11, and the side of the stiffening plate blank 2 without glue in step two is attached to the side of the carrier film 3 with glue.
As shown in fig. 1 and fig. 3, preferably, the carrier film 3 is made of a transparent material so as to observe the relative positions of the stiffener 22 and the circuit board product 11 when the stiffener assembly is attached to the entire circuit board 1, and the circuit board product 11 is provided with a mark line 12 so as to determine whether the stiffener 22 is attached to the corresponding position.
As shown in fig. 1 to fig. 3, preferably, a plurality of first alignment through holes 13 are formed in the whole circuit board 1, and a second alignment through hole 31 corresponding to the first alignment through hole 13 is formed in the carrier film 3, so that the whole circuit board 1 and the carrier film 3 are aligned through the two through holes.
As shown in fig. 5, preferably, the reinforcing plate blank 2 and the carrier film 3 are both larger than the whole circuit board 1, and the carrier film 3 is cut to form a plurality of reinforcing plate assemblies for the plurality of whole circuit boards 1 after the reinforcing plate blank 2 is cut in the step three, so that the reinforcing plate assemblies of the plurality of whole circuit boards 1 can be prepared by one-time laser cutting to avoid frequent laser cutting operation.
As mentioned above, the present application protects a joint strip reinforcement process, and all technical solutions identical or similar to the present application should be considered to fall within the scope of the present application.
Claims (5)
1. A joint strip reinforcing process is characterized by comprising the following steps:
the method comprises the following steps: providing a whole-plate circuit board (1), a reinforcing plate blank (2) and a bearing film (3), wherein the whole-plate circuit board (1) comprises a plurality of circuit board products (11);
step two: attaching the reinforcement plate blank (2) to the carrier film (3);
step three: laser cutting is carried out on a reinforcing plate blank (2) on a bearing film (3) according to the arrangement of a circuit board product (11), so that the reinforcing plate blank (2) is separated into a connected waste material (21) and a plurality of reinforcing plates (22), the connected waste material (21) is removed from the bearing film (3), and a reinforcing plate assembly formed by the bearing film (3) and the plurality of reinforcing plates (22) is left;
step four: sticking one surface of the reinforcing plate component with the reinforcing plate (22) to the whole circuit board (1), so that each reinforcing plate (22) is stuck to the corresponding area of the circuit board product (11) needing to be reinforced;
step five: and tearing off the bearing film (3) to finish the pasting reinforcement.
2. The reinforcement process according to claim 1, wherein one side of the carrier film (3) is coated with glue to facilitate the attachment of the reinforcement plate blank (2) thereto, one side of the reinforcement plate blank (2) is coated with glue to facilitate the attachment to the circuit board product (11), and the side of the reinforcement plate blank (2) not coated with glue in step two is coated on the side of the carrier film (3) coated with glue.
3. The joint strip reinforcing process according to claim 1, wherein the carrier film (3) is made of transparent material so as to observe the relative positions of the reinforcing plate (22) and the circuit board product (11) when the reinforcing plate assembly is adhered to the whole circuit board (1), and the circuit board product (11) is provided with a mark line (12) so as to judge whether the reinforcing plate (22) is adhered to the corresponding position.
4. The reinforcement process for joint strip application according to claim 1, wherein the whole circuit board (1) is provided with a plurality of first alignment through holes (13), and the carrier film (3) is provided with second alignment through holes (31) corresponding to the first alignment through holes (13) so as to align the whole circuit board (1) and the carrier film (3) through the two through holes.
5. The strip joint reinforcement process according to any one of claims 1 to 4, wherein the reinforcement plate blank (2) and the carrier film (3) are both larger than the whole circuit board (1), and the carrier film (3) is cut after the reinforcement plate blank (2) is cut in the third step to form a plurality of reinforcement plate assemblies for use with a plurality of whole circuit boards (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111439245.0A CN114222428A (en) | 2021-11-29 | 2021-11-29 | Joint strip pasting reinforcing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111439245.0A CN114222428A (en) | 2021-11-29 | 2021-11-29 | Joint strip pasting reinforcing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114222428A true CN114222428A (en) | 2022-03-22 |
Family
ID=80698922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111439245.0A Pending CN114222428A (en) | 2021-11-29 | 2021-11-29 | Joint strip pasting reinforcing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114222428A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079351A (en) * | 2012-12-28 | 2013-05-01 | 大连吉星电子有限公司 | Linear sticking reinforcing process for PET (Polyethylene Terephthalate) film of flexible circuit board |
| CN105578728A (en) * | 2016-01-29 | 2016-05-11 | 上海温良昌平电器科技股份有限公司 | One-piece aluminum flexible circuit board with support layer switching function and preparation technology |
| CN206481495U (en) * | 2017-02-23 | 2017-09-08 | 苏州维信电子有限公司 | The stiffening plate group of micro- even point flexible PCB |
| CN107995791A (en) * | 2018-01-08 | 2018-05-04 | 奈电软性科技电子(珠海)有限公司 | A kind of applying method for etching steel disc |
| CN111132447A (en) * | 2019-12-25 | 2020-05-08 | 江阴科利达电子有限公司 | Reinforcing process for LCP5G high-frequency signal transmission circuit board |
| CN112040633A (en) * | 2020-08-25 | 2020-12-04 | 上海温良昌平电器科技股份有限公司 | Whole plate reinforcing laser micro-connecting structure and processing technology thereof |
| CN112888184A (en) * | 2020-12-30 | 2021-06-01 | 厦门柔性电子研究院有限公司 | PI (polyimide) reinforcement processing method with marking line and manufacturing method of flexible circuit board |
-
2021
- 2021-11-29 CN CN202111439245.0A patent/CN114222428A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079351A (en) * | 2012-12-28 | 2013-05-01 | 大连吉星电子有限公司 | Linear sticking reinforcing process for PET (Polyethylene Terephthalate) film of flexible circuit board |
| CN105578728A (en) * | 2016-01-29 | 2016-05-11 | 上海温良昌平电器科技股份有限公司 | One-piece aluminum flexible circuit board with support layer switching function and preparation technology |
| CN206481495U (en) * | 2017-02-23 | 2017-09-08 | 苏州维信电子有限公司 | The stiffening plate group of micro- even point flexible PCB |
| CN107995791A (en) * | 2018-01-08 | 2018-05-04 | 奈电软性科技电子(珠海)有限公司 | A kind of applying method for etching steel disc |
| CN111132447A (en) * | 2019-12-25 | 2020-05-08 | 江阴科利达电子有限公司 | Reinforcing process for LCP5G high-frequency signal transmission circuit board |
| CN112040633A (en) * | 2020-08-25 | 2020-12-04 | 上海温良昌平电器科技股份有限公司 | Whole plate reinforcing laser micro-connecting structure and processing technology thereof |
| CN112888184A (en) * | 2020-12-30 | 2021-06-01 | 厦门柔性电子研究院有限公司 | PI (polyimide) reinforcement processing method with marking line and manufacturing method of flexible circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109337600B (en) | Single-sided adhesive with adhesive surface locally free of adhesive and production method thereof | |
| CN108811329A (en) | A kind of method that FPC and FPC double faced adhesive tapes are integrally cut | |
| CN107995791B (en) | Bonding method of etched steel sheet | |
| CN103709950B (en) | Double-sided adhesive tape profile and production method thereof | |
| CN110753439B (en) | Multilayer board and multilayer board layering area windowing method | |
| CN114222428A (en) | Joint strip pasting reinforcing process | |
| CN111766738A (en) | Reflector plate of backlight module and die-cutting and splicing gum technology thereof | |
| CN101634809B (en) | Method for exposing single-sided flexible circuit board | |
| CN202898307U (en) | Back gum composite structure | |
| CN109483642A (en) | A kind of FPC finished product double-sided adhesive exempts to tear the clicking technique of release film | |
| JP2005038953A (en) | Method of replacing defective unit board in printed board | |
| CN212581802U (en) | Easy-to-draw of high accuracy location is glued | |
| CN113894867B (en) | Rubberizing method of flexible circuit board covering film | |
| CN114245580B (en) | Golden finger reinforcement manufacturing method of flexible region and reinforcement structure thereof | |
| CN2778815Y (en) | Connecting adhesive tape with stripping ears for conveying and taping surface mounted devices | |
| CN111378388B (en) | Composite material belt for processing double faced adhesive tape product | |
| CN108456492B (en) | Full-page FPC double faced adhesive tape and use method thereof | |
| CN221051787U (en) | Easily tear formula transport membrane structure | |
| JP5339474B2 (en) | How to connect a no-separator continuous label | |
| CN221315423U (en) | Mobile phone positioning film pasting structure | |
| CN217531109U (en) | Novel handle adhesive tape waste discharge die cutting tool | |
| CN219044915U (en) | Colloid merging and processing structure | |
| CN219153768U (en) | Colloid merging and processing structure | |
| CN209964356U (en) | Flexible circuit board | |
| CN220999577U (en) | Release film for attaching strong and weak adhesive products |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |