CN206481495U - The stiffening plate group of micro- even point flexible PCB - Google Patents
The stiffening plate group of micro- even point flexible PCB Download PDFInfo
- Publication number
- CN206481495U CN206481495U CN201720166194.1U CN201720166194U CN206481495U CN 206481495 U CN206481495 U CN 206481495U CN 201720166194 U CN201720166194 U CN 201720166194U CN 206481495 U CN206481495 U CN 206481495U
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- stiffening plate
- micro
- flexible pcb
- slashing
- linkage section
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Abstract
The utility model discloses a kind of stiffening plate group of micro- even point flexible PCB, the multiple uniform stiffening plates and the slashing between adjacent stiffening plate with stiffening plate edge formed including being punched by die cutting die, not exclusively disconnected between the stiffening plate and the slashing, and there is at least one linkage section between the stiffening plate and slashing.After the stiffening plate group for micro- even point flexible PCB that the utility model is provided is punched via die cutting die, there is at least one linkage section between stiffening plate and slashing, when needing to use single stiffening plate, as long as tear fracture linkage section can remove stiffening plate, formed because stiffening plate uses the direct punching press of material sheet material, without needing to purchase rebasing (carrier film) as half cutting method, thus it is with low cost；In addition, the stiffening plate that the utility model is provided directly is punched on material sheet material, be not in buffings residual and foreign particles, thus quality is good.
Description
Technical field
The utility model is related to a kind of flexible PCB, more particularly to a kind of stiffening plate of micro- even point flexible PCB
Group.
Background technology
Punching block is punched principle：Material is deformed under external force, when external force exceedes the yield strength of material, material
Material starts plastic deformation.If continuing to increase external force, the ultimate strength of material is exceeded, material just starts to be broken, separated.According to
The punching block be punched principle, cut material external form entirely using punching block, rear monolithic cut entirely and is scattered, thus and punching and restocking it is less efficient.
In order to avoid punching and restocking it is less efficient the problem of, the mode of etching cutting die can be used, by material directly half
Cut and form, specifically, the bottom of material sets rebasing, by way of hemisection, material is cut off to be formed one by one
Product, and rebasing do not cut off, that is to say, that after hemisection is finished, product is all off with waste material, but be distributed in it is rebasing it
On.But hemisection mode there is also it is certain the problem of：Need to purchase rebasing (carrier film), thus cost is high；It is residual to there is buffings in hemisection
Stay, foreign particles are produced to product, and need to purchase special hemisection equipment.
Utility model content
In order to solve the above technical problems, the utility model purpose is to provide a kind of stiffening plate of micro- even point flexible PCB
Group, to overcome the deficiencies in the prior art.
To reach above-mentioned purpose, the technical solution of the utility model is as follows：
A kind of stiffening plate group of micro- even point flexible PCB, including the multiple uniform reinforcement formed are punched by die cutting die
Plate and the slashing between adjacent stiffening plate with stiffening plate edge, it is endless between the stiffening plate and the slashing
It is complete to disconnect, and there is at least one linkage section between the stiffening plate and the slashing.
It is preferred that, there is 4-6 linkage section between the stiffening plate and slashing.
Further, there are 4 linkage sections between the stiffening plate and slashing.
Further, it is equidistant between those linkage sections or be non-equally arranged at intervals.
It is preferred that, the linkage section is located at the straight lines edge of the stiffening plate.
It is preferred that, the distance of the linkage section is 1-2mm.
Further, the distance of the linkage section is 1mm.
Compared with prior art, advantage of the present utility model at least that：
The stiffening plate group for micro- even point flexible PCB that the utility model is provided, not exclusively breaks between stiffening plate and slashing
Open, and there is at least one linkage section between stiffening plate and slashing.After being punched via die cutting die, stiffening plate and slashing it
Between have at least one linkage section, using single stiffening plate when, it is only necessary to tear fracture linkage section can remove stiffening plate, because of reinforcement
Plate is formed using the direct punching press of material sheet material, and without needing to purchase rebasing (carrier film) as half cutting method, thus cost is low
It is honest and clean；In addition, the stiffening plate that the utility model is provided directly is punched on material sheet material, be not in buffings residual and foreign matter
Grain, thus quality is good.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
The required accompanying drawing used is briefly described in description or in the prior art.
Fig. 1 is the structural representation of the stiffening plate group of micro- even point flexible PCB disclosed in the utility model embodiment 1；
Fig. 2 is the structural representation of the stiffening plate group of micro- even point flexible PCB disclosed in the utility model embodiment 2.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe.
Embodiment 1：
Shown in Figure 1, the utility model embodiment 1 discloses a kind of stiffening plate group of micro- even point flexible PCB and (mended
Strong plate belongs to a part for flexible circuit board structure composition), including the multiple uniform stiffening plate A formed are punched by die cutting die
And the slashing B, stiffening plate A and slashing B between adjacent stiffening plate A with stiffening plate A edges are together in chi together
The size of the very little material sheet material with before punching is consistent, is not exclusively disconnected between stiffening plate A and slashing B, stiffening plate A and waste material
Have equidistant between 4 linkage section K, those linkage sections K between plate B or be non-equally arranged at intervals.
It is preferred that, linkage section K is located at stiffening plate A straight lines edge.Stiffening plate A arc can certainly be arranged at
At shape line edge.It is preferred that, linkage section K distance is 1-2mm, further, and linkage section K distance is 1mm.
Die cutting die used in the present embodiment 1 is designed accordingly according to the profile of product, the die cutting die
The edge of a knife increases by 4 disconnection mouths, and the Opening length that breaks is 1-2mm or so, and disconnected aperture position need to be arranged on product garbage area.By in mould
On tool design disconnect mouth so that mould be punched material sheet material when so that product (flexible circuit) between garbage area not
It is fully disconnected.
Embodiment 2：
Shown in Figure 2, the utility model embodiment 2 discloses a kind of stiffening plate group of micro- even point flexible PCB, bag
Include and multiple uniform stiffening plate A for being formed are punched by die cutting die and between adjacent stiffening plate A and stiffening plate A edges
Slashing B, stiffening plate A and slashing B it is consistent with the size of the material sheet material before punching together in size together, stiffening plate
Not exclusively disconnect, and have between stiffening plate A and slashing between 4 linkage section K, those linkage sections K between A and slashing B
It is arranged at intervals equidistantly or non-equally.
It is preferred that, linkage section K is located at stiffening plate A straight lines edge.Stiffening plate A arc can certainly be arranged at
At shape line edge.It is preferred that, linkage section K distance is 1-2mm, further, and linkage section K distance is 1mm.
Die cutting die used in the present embodiment 2 is designed accordingly according to the profile of product, the die cutting die
The edge of a knife increases by 4 disconnection mouths, and the Opening length that breaks is 1-2mm or so, and disconnected aperture position need to be arranged on product garbage area.By in mould
On tool design disconnect mouth so that mould be punched material sheet material when so that product (flexible circuit) between garbage area not
It is fully disconnected.
The present embodiment 2 and the difference of embodiment 1 are：The difference of both outer shapes, linkage section K number is according to production
The contour structures and size of product are reasonably designed.
The stiffening plate group for micro- even point flexible PCB that the utility model is provided, between stiffening plate A and slashing B not exclusively
Disconnect, and there is at least one linkage section K between stiffening plate A and slashing.After being punched via die cutting die, stiffening plate A is with giving up
There is at least one linkage section K, when using single stiffening plate A, it is only necessary to which tear fracture linkage section K can remove benefit between flitch B
Strong plate A, is formed because stiffening plate A uses the direct punching press of material sheet material, without needing to purchase rebasing (carrying as half cutting method
Film), thus it is with low cost；In addition, the stiffening plate A that the utility model is provided directly is punched on material sheet material, be not in glue
Bits residual and foreign particles, thus quality is good.
In summary, the stiffening plate group for micro- even point flexible PCB that the utility model is provided, stiffening plate A and slashing B
Between not exclusively disconnect, and between stiffening plate A and slashing have at least one linkage section K.After being punched via die cutting die, mend
There is by force at least one linkage section K, when using single stiffening plate A, it is only necessary to which tear fracture linkage section K is between plate A and slashing B
Stiffening plate A can be removed, is formed because stiffening plate A uses the direct punching press of material sheet material, without needing to purchase pad as half cutting method
Bottom (carrier film), thus it is with low cost；In addition, the stiffening plate A that the utility model is provided directly is punched on material sheet material, will not
There are buffings residual and foreign particles, thus quality is good.
It should be noted that industry is all to obtain multiple stiffening plates not being scattered, i.e. stiffening plate using the method for hemisection at present
It is distributed in after the completion of punching on rebasing, and the utility model has filled up the blank in market, is directly rushed using on material sheet material
The mode cut and the stiffening plate group for obtaining inexpensive, high-quality micro- even point flexible PCB, are not in above-mentioned hemisection
A series of problems.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or new using this practicality
Type.A variety of modifications to these embodiments will be apparent for those skilled in the art, determine herein
The General Principle of justice can in other embodiments be realized in the case where not departing from spirit or scope of the present utility model.Cause
This, the utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The most wide scope consistent with features of novelty.
Claims (7)
1. a kind of stiffening plate group of micro- even point flexible PCB, it is characterised in that：What is formed including being punched by die cutting die is multiple
Uniform stiffening plate and the slashing between adjacent stiffening plate with stiffening plate edge, the stiffening plate and the waste material
Not exclusively disconnected between plate, and there is at least one linkage section between the stiffening plate and the slashing.
2. the stiffening plate group of micro- even point flexible PCB according to claim 1, it is characterised in that：The stiffening plate is with giving up
There is 4-6 linkage section between flitch.
3. the stiffening plate group of micro- even point flexible PCB according to claim 2, it is characterised in that：The stiffening plate is with giving up
There are 4 linkage sections between flitch.
4. the stiffening plate group of micro- even point flexible PCB according to claim 2, it is characterised in that：Between those linkage sections
It is arranged at intervals equidistantly or non-equally.
5. the stiffening plate group of micro- even point flexible PCB according to claim 1, it is characterised in that：The linkage section is located at
The straight lines edge of the stiffening plate.
6. the stiffening plate group of micro- even point flexible PCB according to claim 1, it is characterised in that：The linkage section away from
From for 1-2mm.
7. the stiffening plate group of micro- even point flexible PCB according to claim 6, it is characterised in that：The linkage section away from
From for 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720166194.1U CN206481495U (en) | 2017-02-23 | 2017-02-23 | The stiffening plate group of micro- even point flexible PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720166194.1U CN206481495U (en) | 2017-02-23 | 2017-02-23 | The stiffening plate group of micro- even point flexible PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206481495U true CN206481495U (en) | 2017-09-08 |
Family
ID=59746432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720166194.1U Active CN206481495U (en) | 2017-02-23 | 2017-02-23 | The stiffening plate group of micro- even point flexible PCB |
Country Status (1)
| Country | Link |
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| CN (1) | CN206481495U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111278215A (en) * | 2020-02-18 | 2020-06-12 | 珠海加特精密工业有限公司 | Combined type reinforcing plate and manufacturing method thereof |
| CN111800944A (en) * | 2020-06-19 | 2020-10-20 | 上达电子（深圳）股份有限公司 | Manufacturing method of anti-warping FPC |
| CN114222428A (en) * | 2021-11-29 | 2022-03-22 | 珠海和正柔性线路板有限公司 | Joint strip pasting reinforcing process |
-
2017
- 2017-02-23 CN CN201720166194.1U patent/CN206481495U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111278215A (en) * | 2020-02-18 | 2020-06-12 | 珠海加特精密工业有限公司 | Combined type reinforcing plate and manufacturing method thereof |
| CN111278215B (en) * | 2020-02-18 | 2023-04-18 | 珠海加特精密工业有限公司 | Combined type reinforcing plate and manufacturing method thereof |
| CN111800944A (en) * | 2020-06-19 | 2020-10-20 | 上达电子（深圳）股份有限公司 | Manufacturing method of anti-warping FPC |
| CN114222428A (en) * | 2021-11-29 | 2022-03-22 | 珠海和正柔性线路板有限公司 | Joint strip pasting reinforcing process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190412 Address after: 224000 Intelligent Terminal Industrial Park of Yancheng High-tech Zone, Yancheng City, Jiangsu Province (D) Patentee after: Yancheng Weixin Electronics Co., Ltd. Address before: No. 68 Nanhu Road, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province Patentee before: Suzhou Weixin Electronic Co. Ltd. |
|
| TR01 | Transfer of patent right |