CN106658957A - All-polyimide type flexible copper clad laminate base plate and integrated circuit board - Google Patents
All-polyimide type flexible copper clad laminate base plate and integrated circuit board Download PDFInfo
- Publication number
- CN106658957A CN106658957A CN201710163736.4A CN201710163736A CN106658957A CN 106658957 A CN106658957 A CN 106658957A CN 201710163736 A CN201710163736 A CN 201710163736A CN 106658957 A CN106658957 A CN 106658957A
- Authority
- CN
- China
- Prior art keywords
- fccl
- unit
- layer
- soleplates
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 229920001721 polyimide Polymers 0.000 title claims abstract description 35
- 239000004642 Polyimide Substances 0.000 title claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 title abstract description 17
- 239000010949 copper Substances 0.000 title abstract description 17
- 230000009975 flexible effect Effects 0.000 title abstract description 6
- 239000011889 copper foil Substances 0.000 claims abstract description 35
- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 239000004744 fabric Substances 0.000 claims 1
- 239000011888 foil Substances 0.000 abstract description 2
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 101100314299 Listeria innocua serovar 6a (strain ATCC BAA-680 / CLIP 11262) tpi-2 gene Proteins 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 239000003292 glue Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000009719 polyimide resin Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 229920006335 epoxy glue Polymers 0.000 description 3
- 210000004027 cell Anatomy 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to the fields of a copper clad foil board and an integrated circuit board, particularly to an all-polyimide type flexible copper clad laminate base plate and an integrated circuit board. According to the technical scheme, the all-polyimide type flexible copper clad laminate base plate or the integrated circuit board comprises an FCCL (flexible copper clad laminate) base plate, wherein the FCCL base plate comprises multiple layers of FCCL units; the spaces between the FCCL units are coated with TPI; when the product is the integrated circuit board, a hard plate connecting adhesive layer and a copper foil with conduction holes are arranged on the outer surface of the FCCL base plate from inside to outside in sequence; and the hard plate connecting adhesive layer comprises a covering film TPI and a TPI-PP with conduction holes from inside to outside in sequence. The flexible copper clad laminate base plate adopts the all-polyimide type structures, and is high in reliability and stability; and the integrated circuit board does not require a covering film, so that the problem of difficulty in processing is solved.
Description
Technical field
The present invention relates to copper coated foil plate and surface-mounted integrated circuit field, more particularly to a kind of full polyimide type pliability covers copper
Substrate and surface-mounted integrated circuit.
Background technology
Polyimide material is the macromolecular material of a kind of high intensity and high-fire resistance, can at short notice tolerate 500 DEG C
High temperature, and can below 300 DEG C Long-Time Service.While the rigid structure of polyimides gives its premium properties, also cause it
With infusibility, slightly solubility, therefore its moulding processability is poor.
Flexibility coat copper plate (FCCL) is the substrate of flex circuit application (FPC), mainly there is three layers of flexibility coat copper plate (3L-FCCL)
With two kinds of two-layer flexibility coat copper plate (2F-FCCL).Three layers of copper-clad plate are typically led to by Kapton or polyester film with Copper Foil
Cross after adhesive bond hot pressing and solidify afterwards and be obtained.Two-layer flexibility coat copper plate is only made up of Kapton and Copper Foil, is prepared
2007, No.1, p.5-7 technique has rubbing method, three kinds of pressing method and sputtering method (Liu Shengpeng, copper-clad plate information).In recent years, with
And developed towards the direction of high density and miniaturization using the electronic product of flex circuit application (FPC), more frivolous two-layer is scratched
The demand of property copper-clad plate is greatly increased.Clear 61-275325 disclosed in going through in Japan for 1986 is earliest with regard to two-layer method
The patent of FCCL.Patent polyimide resin (PI) copolymer is directly coated on Copper Foil, then Jing hot imidizations prepare coating
Type two layers of polyimide flexibility coat copper plate.Because rubbing method 2L-FCCL equipment investments are low, production technology is relatively easy, in 2L-
The initial stage of FCCL development is more universal.
In prior art, when pliability copper-clad base plate is produced, two-layer or three layers of FCCL units are bondd using epoxy glue
Get up, form 4 layers or 6 layers of softpanel structure.When surface-mounted integrated circuit is produced, using epoxy glue as glue between two-layer FCCL unit
Stick, and be coated with bilayer PP glue in outer layer FCCL cell surfaces and reserve conducting hole site, then the Copper Foil with via is pressed
On PP glue, cover layer is finally inlayed in via, form multilayer Rigid Flex.It is mono- using epoxy glue as two-layer FCCL
Product heat resistance after adhesive between unit is poor, and thermal coefficient of expansion is big, and acid and alkali-resistance erosiveness is weak, causes product integrally may be used
It is poor by property and stability.When Rigid Flex is produced, need to inlay cover layer, work flow is longer, and efficiency is very low, cost
Height, yield is low.
The content of the invention
Instant invention overcomes the deficiencies in the prior art, there is provided a kind of full polyimide structures, do not need cover layer it is flexible
Property copper-clad base plate and surface-mounted integrated circuit, solve existing pliability copper-clad base plate and surface-mounted integrated circuit reliability and stability it is poor,
The problem of processing difficulties.
To solve above-mentioned technical problem, the present invention is employed the following technical solutions：
A kind of full polyimide type pliability copper-clad base plate, including FCCL soleplates, if FCCL soleplates include dried layer
FCCL units, if being coated with adhesive between dried layer FCCL unit；If the adhesive being coated between dried layer FCCL unit is TPI,
The FCCL units include Copper Foil, PI, the Copper Foil for setting gradually from top to bottom.
Used as the preferred version of the present invention, the FCCL soleplates include two-layer FCCL unit or three layers of FCCL units.
Used as the preferred version of the present invention, the FCCL soleplates include one layer of FCCL unit or two-layer FCCL unit,
The outer surface of FCCL soleplates is disposed with from inside to outside TPI and Copper Foil.
A kind of full polyimide type surface-mounted integrated circuit, including FCCL soleplates, if FCCL soleplates include that dried layer FCCL is mono-
Unit, if being coated with adhesive between dried layer FCCL unit, the outer surface of FCCL soleplates is disposed with from inside to outside hardboard company
Connect glue-line and the Copper Foil with via；Characterized in that, if the adhesive being coated between dried layer FCCL unit is TPI, hardboard connects
Glue-line is connect including the overlay film TPI and the TPI-PP with via for setting gradually from inside to outside.
Used as the preferred version of the present invention, the FCCL soleplates include one layer of FCCL unit or two-layer FCCL unit.
Used as the preferred version of the present invention, the FCCL soleplates include one layer of FCCL unit, FCCL soleplates and overlay film
It is disposed with TPI and Copper Foil between TPI from inside to outside.
Used as the preferred version of the present invention, the FCCL units include Copper Foil, PI, the Copper Foil for setting gradually from top to bottom.
Compared with prior art, the invention has the beneficial effects as follows：
If the 1, the adhesive that pliability copper-clad base plate of the invention is coated between dried layer FCCL unit is TPI so that should
Pliability copper-clad base plate has full polyimide structures.Polyimide modified TPI materials not only possess the high resistance to of PI itself
The characteristics of heat, good stability of the dimension, while directly can process within 200 degree after improvement, as the connection between multi-layer sheet
Materials'use, so that the reliability of whole multilayer soft board is significantly improved.
2nd, when FCCL soleplates include two-layer FCCL unit or three layers of FCCL units, and it is coated between FCCL units
TPI, so that original class formation pliability copper-clad base plate resistance to overturning and reliability are improved.
3rd, during the outer surface pressing Copper Foil of FCCL soleplates, TPI glue is also adopted by as adhesive, integrally improve the class formation
Pliability copper-clad base plate heat resistance and thermal coefficient of expansion all accordingly improve.
4th, in surface-mounted integrated circuit of the invention, if the adhesive being coated between dried layer FCCL unit is TPI, and FCCL bases
From inside to outside overlay film TPI is coated with successively and leaves the TPI-PP of via so that this is integrated between plinth plate and outermost layer Copper Foil
Circuit board has full polyimide structures, and the reliability for making whole surface-mounted integrated circuit is significantly improved.Overlay film TPI is using all standing
Coating method, is provided simultaneously with the function of cover layer and connection glue, greatly reduces the flow process of its processing, improve production efficiency and good
Rate, reduces the production cost of product.
5th, when FCCL soleplates include one layer of FCCL unit or two-layer FCCL unit, and it is coated between FCCL units
TPI, so that original such structure assembly circuit board resistance to overturning and reliability are improved.
6th, during the outer surface pressing Copper Foil of FCCL soleplates, TPI glue is also adopted by as adhesive, integrally improve the class formation
Surface-mounted integrated circuit heat resistance and thermal coefficient of expansion all accordingly improve.
7th, FCCL units include Copper Foil, PI, the Copper Foil for setting gradually from top to bottom, and PI sheets are as polyimide structures.
Description of the drawings
Fig. 1 is the structural representation of the pliability copper-clad base plate with two-layer FCCL unit；
Fig. 2 is the structural representation of the pliability copper-clad base plate with three layers of FCCL units；
Fig. 3 be with individual layer FCCL units and surface cover copper pliability copper-clad base plate structural representation；
Fig. 4 be with two-layer FCCL unit and surface cover copper pliability copper-clad base plate structural representation；
Fig. 5 is the surface-mounted integrated circuit with individual layer FCCL units；
Fig. 6 is the surface-mounted integrated circuit with two-layer FCCL unit；
Fig. 7 is the surface-mounted integrated circuit that individual layer FCCL units and FCCL cell surfaces cover copper；
Fig. 8 is the structural representation of FCCL units.
In figure, 1-FCCL units, 2-TPI, 3- Copper Foil, 4-PI, 5- overlay film TPI, 6-TPI-PP.
Specific embodiment
Below in conjunction with the accompanying drawings, the present invention is described in detail.
In order that the objects, technical solutions and advantages of the present invention become more apparent, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, not
For limiting the present invention.
Embodiment one
A kind of full polyimide type pliability copper-clad base plate, including FCCL soleplates, if FCCL soleplates include dried layer
FCCL units 1, if being coated with adhesive between dried layer FCCL unit 1；If the adhesive being coated between dried layer FCCL unit 1 is
TPI2, the FCCL units 1 include Copper Foil 3, PI4, the Copper Foil 3 for setting gradually from top to bottom.The pliability of the present invention is covered copper-based
If the adhesive that plate is coated between dried layer FCCL unit 1 is TPI2 so that the pliability copper-clad base plate has full polyimides
Structure.The characteristics of polyimide modified TPI materials not only possess the high heat-resisting of PI itself, good stability of the dimension, while changing
Directly can process within 200 degree after good, use as the connecting material between multi-layer sheet, so that whole multilayer soft board
Reliability is significantly improved.
Embodiment two
On the basis of embodiment one, as depicted in figs. 1 and 2, the FCCL soleplates include two-layer FCCL unit 1 or three
Layer FCCL units 1.When FCCL soleplates include two-layer FCCL unit 1 or three layers of FCCL units 1, and between FCCL units 1
Coating TPI2, so that original class formation pliability copper-clad base plate resistance to overturning and reliability are improved.
Embodiment three
On the basis of embodiment one, as shown in Figure 3 and Figure 4, the FCCL soleplates include one layer of FCCL unit 1 or two
Layer FCCL units 1, the outer surface of FCCL soleplates is disposed with from inside to outside TPI2 and Copper Foil 3.The appearance of FCCL soleplates
When face pressure closes Copper Foil 3, TPI2 is also adopted by as adhesive, integrally improve the pliability copper-clad base plate heat resistance and heat of the class formation
The coefficient of expansion is all accordingly improved.
Example IV
A kind of full polyimide type surface-mounted integrated circuit, including FCCL soleplates, if FCCL soleplates include that dried layer FCCL is mono-
Unit 1, if being coated with adhesive between dried layer FCCL unit 1, the outer surface of FCCL soleplates is disposed with from inside to outside hardboard
Connection glue-line and the Copper Foil with via 3；If the adhesive being coated between dried layer FCCL unit 1 is TPI2, hardboard connection glue-line
TPI-PP6 including the overlay film TPI5 for setting gradually from inside to outside and with via.In the surface-mounted integrated circuit of the present invention, if dried layer
The adhesive being coated between FCCL units 1 is to apply successively from inside to outside between TPI2, and FCCL soleplates and outermost layer Copper Foil 3
It is furnished with overlay film TPI5 and leaves the TPI-PP6 of via so that the surface-mounted integrated circuit has full polyimide structures, makes whole collection
Reliability into circuit board is significantly improved.Overlay film TPI5 is provided simultaneously with cover layer and connection glue using the coating method of all standing
Function, greatly reduce the flow process of its processing, improve production efficiency and yield reduce the production cost of product.
Embodiment five
On the basis of example IV, as shown in Figure 5 and Figure 6, the FCCL soleplates include one layer of FCCL unit 1 or two
Layer FCCL units 1.When FCCL soleplates include one layer of FCCL unit 1 or two-layer FCCL unit 1, and between FCCL units 1
Coating TPI2, so that original such structure assembly circuit board resistance to overturning and reliability are improved.
Embodiment six
On the basis of example IV, as shown in fig. 7, the FCCL soleplates include one layer of FCCL unit 1, FCCL is basic
It is disposed with TPI2 and Copper Foil 3 between plate and overlay film TPI5 from inside to outside.During the outer surface pressing Copper Foil 3 of FCCL soleplates,
TPI2 is also adopted by as adhesive, the surface-mounted integrated circuit heat resistance and thermal coefficient of expansion for integrally improving the class formation is all accordingly carried
It is high.
Embodiment seven
On the basis of example IV to six any one, as shown in figure 8, the FCCL units 1 include from top to bottom according to
The Copper Foil 3, PI4 of secondary setting, Copper Foil 3, PI sheets do not change product overall permanence as polyimide structures.
Claims (7)
1. a kind of full polyimide type pliability copper-clad base plate, including FCCL soleplates, if FCCL soleplates include dried layer FCCL
Unit (1), if being coated with adhesive between dried layer FCCL unit (1)；If characterized in that, applying between dried layer FCCL unit (1)
The adhesive of cloth is TPI (2), and the FCCL units (1) include Copper Foil (3), PI (4), the Copper Foil for setting gradually from top to bottom
(3)。
2. a kind of full polyimide type pliability copper-clad base plate according to claim 1, it is characterised in that the FCCL bases
Plinth plate includes two-layer FCCL unit (1) or three layers of FCCL units (1).
3. a kind of full polyimide type pliability copper-clad base plate according to claim 1, it is characterised in that the FCCL bases
Plinth plate includes one layer of FCCL unit (1) or two-layer FCCL unit (1), and the outer surface of FCCL soleplates is disposed with from inside to outside
TPI (2) and Copper Foil (3).
4. a kind of full polyimide type surface-mounted integrated circuit, including FCCL soleplates, if FCCL soleplates include dried layer FCCL unit
(1), if being coated with adhesive between dried layer FCCL unit (1), the outer surface of FCCL soleplates is disposed with from inside to outside firmly
Plate connects glue-line and the Copper Foil (3) with via；If characterized in that, the adhesive being coated between dried layer FCCL unit (1) is
TPI (2), hardboard connection glue-line includes the overlay film TPI (5) for the setting gradually from inside to outside and TPI-PP (6) with via.
5. a kind of full polyimide type surface-mounted integrated circuit according to claim 4, it is characterised in that the FCCL soleplates
Including one layer of FCCL unit (1) or two-layer FCCL unit (1).
6. a kind of full polyimide type surface-mounted integrated circuit according to claim 4, it is characterised in that the FCCL soleplates
Including one layer of FCCL unit (1), TPI (2) and Copper Foil are disposed between FCCL soleplates and overlay film TPI (5) from inside to outside
(3)。
7. a kind of full polyimide type surface-mounted integrated circuit according to claim 4～6 any one, it is characterised in that institute
FCCL units (1) are stated including Copper Foil (3), PI (4), the Copper Foil (3) for setting gradually from top to bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710163736.4A CN106658957A (en) | 2017-03-20 | 2017-03-20 | All-polyimide type flexible copper clad laminate base plate and integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710163736.4A CN106658957A (en) | 2017-03-20 | 2017-03-20 | All-polyimide type flexible copper clad laminate base plate and integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106658957A true CN106658957A (en) | 2017-05-10 |
Family
ID=58848399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710163736.4A Pending CN106658957A (en) | 2017-03-20 | 2017-03-20 | All-polyimide type flexible copper clad laminate base plate and integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106658957A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109429441A (en) * | 2017-08-29 | 2019-03-05 | 鹏鼎控股(深圳)股份有限公司 | Rigid Flex and preparation method thereof |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008188792A (en) * | 2007-02-01 | 2008-08-21 | Kurabo Ind Ltd | Flexible laminated sheet having thermoplastic polyimide layer and its manufacturing method |
| CN101365294A (en) * | 2007-08-08 | 2009-02-11 | 富葵精密组件(深圳)有限公司 | Copper coated substrate material and flexible circuit board having the copper coated substrate material |
| CN102088817A (en) * | 2009-12-02 | 2011-06-08 | 台光电子材料股份有限公司 | Multilayer laminated plate with spherical fillers, and circuit board thereof |
| CN201976342U (en) * | 2011-04-03 | 2011-09-14 | 广东生益科技股份有限公司 | Double-face flexibility copper clad laminate by two-layer method |
| CN102630126A (en) * | 2012-04-01 | 2012-08-08 | 松扬电子材料(昆山)有限公司 | Compound double-side copper clad laminate and manufacturing method thereof |
| CN102806723A (en) * | 2012-08-09 | 2012-12-05 | 广东生益科技股份有限公司 | Double-sided flexible copper clad laminate and manufacturing method thereof |
| CN102858084A (en) * | 2012-09-24 | 2013-01-02 | 云南云天化股份有限公司 | Flexible base material and preparation method thereof |
| CN104476847A (en) * | 2014-12-02 | 2015-04-01 | 广州方邦电子有限公司 | Flexible copper-clad plate having high peel strength and manufacture method thereof |
| CN205667014U (en) * | 2015-12-18 | 2016-10-26 | 成都多吉昌新材料股份有限公司 | High heat -resisting high roughness integrated circuit laminated structure has |
| CN206525025U (en) * | 2017-03-20 | 2017-09-26 | 成都多吉昌新材料股份有限公司 | A kind of full polyimide type pliability copper-clad base plate and surface-mounted integrated circuit |
-
2017
- 2017-03-20 CN CN201710163736.4A patent/CN106658957A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008188792A (en) * | 2007-02-01 | 2008-08-21 | Kurabo Ind Ltd | Flexible laminated sheet having thermoplastic polyimide layer and its manufacturing method |
| CN101365294A (en) * | 2007-08-08 | 2009-02-11 | 富葵精密组件(深圳)有限公司 | Copper coated substrate material and flexible circuit board having the copper coated substrate material |
| CN102088817A (en) * | 2009-12-02 | 2011-06-08 | 台光电子材料股份有限公司 | Multilayer laminated plate with spherical fillers, and circuit board thereof |
| CN201976342U (en) * | 2011-04-03 | 2011-09-14 | 广东生益科技股份有限公司 | Double-face flexibility copper clad laminate by two-layer method |
| CN102630126A (en) * | 2012-04-01 | 2012-08-08 | 松扬电子材料(昆山)有限公司 | Compound double-side copper clad laminate and manufacturing method thereof |
| CN102806723A (en) * | 2012-08-09 | 2012-12-05 | 广东生益科技股份有限公司 | Double-sided flexible copper clad laminate and manufacturing method thereof |
| CN102858084A (en) * | 2012-09-24 | 2013-01-02 | 云南云天化股份有限公司 | Flexible base material and preparation method thereof |
| CN104476847A (en) * | 2014-12-02 | 2015-04-01 | 广州方邦电子有限公司 | Flexible copper-clad plate having high peel strength and manufacture method thereof |
| CN205667014U (en) * | 2015-12-18 | 2016-10-26 | 成都多吉昌新材料股份有限公司 | High heat -resisting high roughness integrated circuit laminated structure has |
| CN206525025U (en) * | 2017-03-20 | 2017-09-26 | 成都多吉昌新材料股份有限公司 | A kind of full polyimide type pliability copper-clad base plate and surface-mounted integrated circuit |
Non-Patent Citations (1)
| Title |
|---|
| 李闪;赵清;张双梅;黄利;: "无胶型聚酰亚胺挠性覆铜板专利技术分析" * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109429441A (en) * | 2017-08-29 | 2019-03-05 | 鹏鼎控股(深圳)股份有限公司 | Rigid Flex and preparation method thereof |
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Application publication date: 20170510 |