CN104057664A - Double-sided flexible copper-clad laminate and production method thereof - Google Patents
Double-sided flexible copper-clad laminate and production method thereof Download PDFInfo
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- CN104057664A CN104057664A CN201410324144.2A CN201410324144A CN104057664A CN 104057664 A CN104057664 A CN 104057664A CN 201410324144 A CN201410324144 A CN 201410324144A CN 104057664 A CN104057664 A CN 104057664A
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- kapton
- copper foil
- polyimide film
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Abstract
The invention discloses a production method of a double-sided flexible copper-clad laminate, which comprises the following steps: (I) providing a copper foil, a thermoplastic polyimide precursor solution and a thermosetting polyimide film; (II) performing corona treatment on both sides of the thermosetting polyimide film, coating one side with the thermoplastic polyimide precursor solution, and drying with an oven to obtain a polyimide film with a two-layer structure; and coating the other side with the thermoplastic polyimide precursor solution, drying and performing imidization to obtain a polyimide film with a three-layer structure; and (III) pressing the copper foil, the polyimide film with the three-layer structure obtained in the step II and the copper foil by a pressing machine to obtain a double-sided plate with a five-layer structure. The double-sided flexible copper-clad laminate comprises thermoplastic polyimide layers coating both sides of the thermosetting polyimide film and the copper foil of which two layers are pressed on one side of the thermosetting polyimide film respectively. The invention provides a light and thin flexible copper-clad laminate with high heat resistance and high reliability and a production method.
Description
Technical field
A kind of copper coin and preparation method, particularly a kind of flexibility coat copper plate and preparation method thereof.
Background technology
Along with the development of mechanics of communication, personal electric product is tending towards slimming gradually in recent years.Flexible printed-circuit board has been widely used in the consumption electronic products such as notebook computer, mobile phone and digital camera, due to improving constantly of electron trade technical requirement, it is compact that consumption electronic products move towards just fast, day by day requires corresponding flexibility coat copper plate lighter and thinner and have high-fire resistance and a high reliability.
Summary of the invention
For solving the deficiencies in the prior art, the object of the invention is to a kind of light and thin and there is flexibility coat copper plate and the preparation method of high-fire resistance and high reliability.
In order to realize above-mentioned target, the present invention adopts following technical scheme:
A preparation method for double side flexible copper coated board, comprises the steps:
One, provide Copper Foil, TPI precursor aqueous solution, Thermocurable polyimide film;
Two, by the two sides process sided corona treatment of Thermocurable polyimide film, first at its coating thermoplastic polyimides precursor aqueous solution, obtain the Kapton of double-layer structure through oven for drying, at another side coating thermoplastic polyimides precursor aqueous solution, after oven dry, obtain again the Kapton of three-decker through imidization again;
The Kapton of the three-decker three, Copper Foil, step 2 being obtained and Copper Foil, through pressing machine pressing, obtain the dual platen of five-layer structure.
The preparation method of aforesaid a kind of double side flexible copper coated board, comprises the steps:
One, provide Copper Foil, TPI precursor aqueous solution, Thermocurable polyimide film;
Two, by the two sides process sided corona treatment of Thermocurable polyimide film, first at its coating thermoplastic polyimides precursor aqueous solution, obtain the Kapton of double-layer structure through 120 DEG C of oven dry of baking oven, at another side coating thermoplastic polyimides precursor aqueous solution, after 120 DEG C of oven dry, obtain again the Kapton of three-decker through imidization again;
The Kapton of the three-decker three, Copper Foil, step 2 being obtained and Copper Foil, through 350～400 DEG C of pressing machine pressings, obtain the dual platen of five-layer structure.
The product that in the preparation method of aforesaid a kind of double side flexible copper coated board, Thermocurable polyimide film is certain company.
The preparation method of aforesaid a kind of double side flexible copper coated board, the step of producing TPI precursor aqueous solution is:
One, produce polyamide thermoplastic acid: take a certain amount of diamine monomer p-phenylenediamine (PPD), 1, 3-pair-(3-amino-benzene oxygen), 4, 4 '-bis-(3-amino-benzene oxygen) diphenyl sulphone (DPS), 2, in 2-two [4-(amino-benzene oxygen) phenyl] propane one or more be dissolved in polar solvent dimethyl formamide, dimethylacetylamide, in one or both reagent of 1-METHYLPYRROLIDONE or dimethyl sulfoxide (DMSO), the mass fraction 15%-20% of diamine monomer, then stirring at normal temperature 1-2 hour, add dianhydride monomer PMDA or BPDA one or both, the mass fraction of dianhydride monomer is 15-20%, divide and add for five times, stirring at normal temperature 5 hours,
Two,, by polyamide thermoplastic acid imide: polyamide thermoplastic acid was warming up to 160 DEG C by room temperature in 30 minutes, and constant temperature 2 hours was then warming up to 320 DEG C in 2 hours, constant temperature half an hour, finally in 2 hours, be cooled to room temperature.
The preparation method of aforesaid a kind of double side flexible copper coated board, Copper Foil is electrolytic copper foil, thickness is 18-35 μ m.
The preparation method of aforesaid a kind of double side flexible copper coated board, the thickness of the Kapton of two-layer structure is 30um.
The preparation method of aforesaid a kind of double side flexible copper coated board, the thickness of the Kapton of three-decker is 35um.
A kind of double side flexible copper coated board, comprising: the thermoplastic polyimide layer of coating Thermocurable polyimide film two sides obtains the Kapton of three-decker, is pressed on the Copper Foil of the Kapton both sides of three-decker.
Usefulness of the present invention is: the invention provides a kind of light and thin and have flexibility coat copper plate and a preparation method of high-fire resistance and high reliability.
Brief description of the drawings
Fig. 1 is the two-sided sectional view around property copper-clad plate of the present invention;
The implication of Reference numeral in figure:
1 Copper Foil, 2 Thermocurable polyimide films, 3 thermoplastic polyimide layers.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is done to concrete introduction.
A preparation method for double side flexible copper coated board, comprises the steps:
One, provide Copper Foil 1 TPI precursor aqueous solution, Thermocurable polyimide film 2;
Two, by the two sides process sided corona treatment of Thermocurable polyimide film 2, first at its coating thermoplastic polyimides precursor aqueous solution, obtain the Kapton of double-layer structure through oven for drying, at another side coating thermoplastic polyimides precursor aqueous solution, after oven dry, obtain again the Kapton of three-decker through imidization again;
The Kapton of the three-decker three, Copper Foil 1 step 2 being obtained and Copper Foil 1, through pressing machine pressing, obtain the dual platen of five-layer structure.
A preparation method for double side flexible copper coated board, comprises the steps:
One, provide Copper Foil 1 TPI precursor aqueous solution, Thermocurable polyimide film 2;
Two, by the two sides process sided corona treatment of Thermocurable polyimide film 2, first at its coating thermoplastic polyimides precursor aqueous solution, obtain the Kapton of double-layer structure through 120 DEG C of oven dry of baking oven, at another side coating thermoplastic polyimides precursor aqueous solution, after 120 DEG C of oven dry, obtain again the Kapton of three-decker through imidization again;
The Kapton of the three-decker three, Copper Foil 1 step 2 being obtained and Copper Foil 1, through 350～400 DEG C of pressing machine pressings, obtain the dual platen of five-layer structure.
A preparation method for double side flexible copper coated board, the product that Thermocurable polyimide film 2 is certain company.
A preparation method for double side flexible copper coated board, the step of producing TPI precursor aqueous solution is:
One, produce polyamide thermoplastic acid: take a certain amount of diamine monomer p-phenylenediamine (PPD), 1, 3-pair-(3-amino-benzene oxygen), 4, 4 '-bis-(3-amino-benzene oxygen) diphenyl sulphone (DPS), 2, in 2-two [4-(amino-benzene oxygen) phenyl] propane one or more be dissolved in polar solvent dimethyl formamide, dimethylacetylamide, in one or both reagent of 1-METHYLPYRROLIDONE or dimethyl sulfoxide (DMSO), the mass fraction 15%-20% of diamine monomer, then stirring at normal temperature 1-2 hour, add dianhydride monomer PMDA or BPDA one or both, the mass fraction of dianhydride monomer is 15-20%, divide and add for five times, stirring at normal temperature 5 hours,
Two,, by polyamide thermoplastic acid imide: polyamide thermoplastic acid was warming up to 160 DEG C by room temperature in 30 minutes, and constant temperature 2 hours was then warming up to 320 DEG C in 2 hours, constant temperature half an hour, finally in 2 hours, be cooled to room temperature.
Copper Foil 1 is electrolytic copper foil 1, and thickness is 18-35 μ m; The thickness of the Kapton of two-layer structure is 30um; The thickness of the Kapton of three-decker is 35um.Peel strength " 1N/MM, soldering resistance good (300 DEG C/10s sample is good), good stability of the dimension.
A kind of double side flexible copper coated board, comprising: the thermoplastic polyimide layer 3 of coating Thermocurable polyimide film 2 two sides obtains the Kapton of three-decker, is pressed on the Copper Foil 1 of the Kapton both sides of three-decker.
More than show and described general principle of the present invention, principal character and advantage.The technical staff of the industry should understand, and above-described embodiment does not limit the present invention in any form, and all employings are equal to replaces or technical scheme that the mode of equivalent transformation obtains, all drops in protection scope of the present invention.
Claims (8)
1. a preparation method for double side flexible copper coated board, is characterized in that, comprises the steps:
One, provide Copper Foil, TPI precursor aqueous solution, Thermocurable polyimide film;
Two, by the two sides process sided corona treatment of Thermocurable polyimide film, first at its coating thermoplastic polyimides precursor aqueous solution, obtain the Kapton of double-layer structure through oven for drying, at another side coating thermoplastic polyimides precursor aqueous solution, after oven dry, obtain again the Kapton of three-decker through imidization again;
The Kapton of the three-decker three, Copper Foil, step 2 being obtained and Copper Foil, through pressing machine pressing, obtain the dual platen of five-layer structure.
2. the preparation method of a kind of double side flexible copper coated board according to claim 1, is characterized in that, comprises the steps:
One, provide Copper Foil, TPI precursor aqueous solution, Thermocurable polyimide film;
Two, by the two sides process sided corona treatment of Thermocurable polyimide film, first at its coating thermoplastic polyimides precursor aqueous solution, obtain the Kapton of double-layer structure through 120 DEG C of oven dry of baking oven, at another side coating thermoplastic polyimides precursor aqueous solution, after 120 DEG C of oven dry, obtain again the Kapton of three-decker through imidization again;
The Kapton of the three-decker three, Copper Foil, step 2 being obtained and Copper Foil, through 350～400 DEG C of pressing machine pressings, obtain the dual platen of five-layer structure.
3. the preparation method of a kind of double side flexible copper coated board according to claim 1, is characterized in that, Thermocurable polyimide film (certain company's product).
4. the preparation method of a kind of double side flexible copper coated board according to claim 1, is characterized in that, the step of producing TPI precursor aqueous solution is:
One, produce polyamide thermoplastic acid: take a certain amount of diamine monomer p-phenylenediamine (PPD), 1, 3-pair-(3-amino-benzene oxygen), 4, 4 '-bis-(3-amino-benzene oxygen) diphenyl sulphone (DPS), 2, in 2-two [4-(amino-benzene oxygen) phenyl] propane one or more be dissolved in polar solvent dimethyl formamide, dimethylacetylamide, in one or both reagent of 1-METHYLPYRROLIDONE or dimethyl sulfoxide (DMSO), the mass fraction 15%-20% of diamine monomer, then stirring at normal temperature 1-2 hour, add dianhydride monomer PMDA or BPDA one or both, the mass fraction of dianhydride monomer is 15-20%, divide and add for five times, stirring at normal temperature 5 hours,
Two,, by polyamide thermoplastic acid imide: polyamide thermoplastic acid was warming up to 160 DEG C by room temperature in 30 minutes, and constant temperature 2 hours was then warming up to 320 DEG C in 2 hours, constant temperature half an hour, finally in 2 hours, be cooled to room temperature.
5. the preparation method of a kind of double side flexible copper coated board according to claim 1, is characterized in that, above-mentioned Copper Foil is electrolytic copper foil, and thickness is 18-35 μ m.
6. the preparation method of a kind of double side flexible copper coated board according to claim 1, is characterized in that, the thickness of the Kapton of above-mentioned two-layer structure is 30um.
7. the preparation method of a kind of double side flexible copper coated board according to claim 1, is characterized in that, the thickness of the Kapton of above-mentioned three-decker is 35um.
8. a double side flexible copper coated board, is characterized in that, comprising: the thermoplastic polyimide layer of coating Thermocurable polyimide film two sides obtains the Kapton of three-decker, is pressed on the Copper Foil of the Kapton both sides of above-mentioned three-decker.
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| CN201410324144.2A CN104057664A (en) | 2014-07-09 | 2014-07-09 | Double-sided flexible copper-clad laminate and production method thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107249877A (en) * | 2015-02-26 | 2017-10-13 | 宇部兴产株式会社 | The manufacture method of copper-clad laminated board |
| CN109097749A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097751A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097750A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097772A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097748A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109320750A (en) * | 2018-09-28 | 2019-02-12 | 广东圣帕新材料股份有限公司 | A kind of preparation method of thermoplastic polyimides film |
| CN109503836A (en) * | 2018-09-28 | 2019-03-22 | 广东圣帕新材料股份有限公司 | The preparation method of polyamic acid resin and the preparation method of double-faced flexible copper-clad plate |
| CN109867804A (en) * | 2018-12-28 | 2019-06-11 | 宁波激智科技股份有限公司 | A kind of preparation method of no interface thermoplastic heat curable type polyimide composite film |
| CN112373150A (en) * | 2020-11-12 | 2021-02-19 | 西安航天三沃化学有限公司 | Preparation method of glue-free single-sided flexible copper-clad plate based on coating method |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107249877A (en) * | 2015-02-26 | 2017-10-13 | 宇部兴产株式会社 | The manufacture method of copper-clad laminated board |
| CN109097749A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097751A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097750A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097772A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097748A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109320750A (en) * | 2018-09-28 | 2019-02-12 | 广东圣帕新材料股份有限公司 | A kind of preparation method of thermoplastic polyimides film |
| CN109503836A (en) * | 2018-09-28 | 2019-03-22 | 广东圣帕新材料股份有限公司 | The preparation method of polyamic acid resin and the preparation method of double-faced flexible copper-clad plate |
| CN109867804A (en) * | 2018-12-28 | 2019-06-11 | 宁波激智科技股份有限公司 | A kind of preparation method of no interface thermoplastic heat curable type polyimide composite film |
| CN112373150A (en) * | 2020-11-12 | 2021-02-19 | 西安航天三沃化学有限公司 | Preparation method of glue-free single-sided flexible copper-clad plate based on coating method |
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Application publication date: 20140924 |