CN204322672U - A kind of double side flexible copper coated board - Google Patents
A kind of double side flexible copper coated board Download PDFInfo
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- CN204322672U CN204322672U CN201420376488.3U CN201420376488U CN204322672U CN 204322672 U CN204322672 U CN 204322672U CN 201420376488 U CN201420376488 U CN 201420376488U CN 204322672 U CN204322672 U CN 204322672U
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- double side
- copper foil
- side flexible
- coated board
- flexible copper
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Abstract
The utility model discloses a kind of double side flexible copper coated board, comprising: Copper Foil, coat the thermoset polyimide layer on Copper Foil two sides, coat the thermoplastic polyimide layer of thermoset polyimide layer away from Copper Foil side.The utility model provides a kind of light and thin and have the double side flexible copper coated board of high-fire resistance and high reliability.
Description
Technical field
A kind of copper coin, particularly a kind of double side flexible copper coated board.
Background technology
In recent years along with the development of mechanics of communication, personal electric product is tending towards slimming gradually.Flexible printed-circuit board has been widely used in the consumption electronic products such as notebook computer, mobile phone and digital camera, due to improving constantly of electron trade technical requirement, consumption electronic products move towards compact just fast, day by day require that corresponding flexibility coat copper plate is lighter and thinner and have high-fire resistance and high reliability.
Utility model content
For solving the deficiencies in the prior art, the purpose of this utility model is to provide a kind of light and thin and have the double side flexible copper coated board of high-fire resistance and high reliability.
In order to realize above-mentioned target, the utility model adopts following technical scheme:
The preparation method of double side flexible copper coated board, comprises the following steps:
Step one, prepares Copper Foil, produces TPI precursor aqueous solution, Thermocurable polyimide precursor aqueous solution;
Step 2, Thermocurable polyimide precursor aqueous solution is coated copper foil surface, obtains double-deck single sided board through oven for drying, at single sided board surface drying layer surface coating thermoplastic polyimides precursor aqueous solution, through oven for drying, then obtain the single sided board of three-decker through imidization;
Step 3, by the single sided board of two pieces of three-deckers through pressing machine pressing, obtains the dual platen of five-layer structure.
The preparation method of aforesaid double side flexible copper coated board, comprises the following steps:
Step one, prepares Copper Foil, TPI precursor aqueous solution, Thermocurable polyimide precursor aqueous solution;
Step 2, Thermocurable polyimide precursor aqueous solution is coated copper foil surface, obtains double-deck single sided board through baking oven 120 DEG C of oven dry, at single sided board surface drying layer surface coating thermoplastic polyimides precursor aqueous solution, 120 DEG C of oven dry, then the single sided board of three-decker is obtained through imidization;
Step 3, by the single sided board of two pieces of three-deckers through pressing machine 350 ~ 400 DEG C of pressings, obtains the dual platen of five-layer structure.
The preparation method of aforesaid double side flexible copper coated board, the step producing TPI precursor aqueous solution is:
Step one, produce polyamide thermoplastic acid, take a certain amount of diamine monomer p-phenylenediamine (PPD), 1, 3-pair-(3-amino-benzene oxygen), 4, 4 '-bis-(3-amino-benzene oxygen) diphenyl sulphone (DPS), 2, in 2-two [4-(amino-benzene oxygen) phenyl] propane one or more be dissolved in polar solvent dimethyl formamide, dimethylacetylamide, in 1-METHYLPYRROLIDONE or one or both reagent of dimethyl sulfoxide (DMSO), the mass fraction 15%-20% of diamine monomer, then stirring at normal temperature 1-2 hour, add dianhydride monomer PMDA or BPDA one or both, the mass fraction of dianhydride monomer is 15-20%, divide and add for five times, stirring at normal temperature obtains polyamide thermoplastic acid for 5 hours,
Step 2, by polyamide thermoplastic acid imide, by polyamide thermoplastic acid in 30 minutes by room temperature to 160 DEG C, constant temperature 2 hours, was then warming up to 320 DEG C in 2 hours, constant temperature half an hour, finally in 2 hours, was cooled to room temperature.
The preparation method of aforesaid double side flexible copper coated board, the step producing Thermocurable polyimide precursor aqueous solution is:
Step one, produce thermosetting polyamide acid, take a certain amount of diamine monomer ODA or m-phenylene diamine (MPD) is dissolved in one or both reagent of polar solvent dimethyl formamide, dimethylacetylamide, 1-METHYLPYRROLIDONE or dimethyl sulfoxide (DMSO), the mass fraction of diamine monomer is 10% ~ 15%, then stirring at normal temperature 1-2 hour, add dianhydride monomer PMDA or BPDA one or both, the mass fraction of dianhydride monomer is 10-15%, divide and add for five times, stirring at normal temperature obtains thermosetting polyamide acid for 5 hours;
Step 2, by thermosetting polyamide acid imide, by thermosetting polyamide acid in 30 minutes by room temperature to 160 DEG C, constant temperature 2 hours, was then warming up to 320 DEG C in 2 hours, constant temperature half an hour, finally in 2 hours, was cooled to room temperature.
The preparation method of aforesaid double side flexible copper coated board, Copper Foil is electrolytic copper foil, and the copper foil layer thickness of the dual platen of five-layer structure is 18-35 μm.
The preparation method of aforesaid double side flexible copper coated board, the thickness of double-deck single sided board is 10-15 μm.
The preparation method of aforesaid double side flexible copper coated board, the thickness of the single sided board of three-decker is 15-20 μm.
A kind of double side flexible copper coated board, comprising: Copper Foil, coats the thermoset polyimide layer on Copper Foil two sides, coat the thermoplastic polyimide layer of thermoset polyimide layer away from Copper Foil side.
Aforesaid a kind of double side flexible copper coated board, double side flexible copper coated board is the dual platen of five-layer structure.
Aforesaid a kind of double side flexible copper coated board, Copper Foil is one deck, and thermoset polyimide layer, thermoplastic polyimide layer are two-layer.
Aforesaid a kind of double side flexible copper coated board, the copper foil layer thickness of the dual platen of five-layer structure is 18-35 μm.
Aforesaid a kind of double side flexible copper coated board, Copper Foil is electrolytic copper foil.
Aforesaid a kind of double side flexible copper coated board, the thickness of thermoplastic polyimide layer is 5 μm.
Usefulness of the present utility model is: the utility model provides a kind of light and thin and have the double side flexible copper coated board of high-fire resistance and high reliability.
Accompanying drawing explanation
Fig. 1 is the two-sided sectional view around property copper-clad plate of the utility model;
The implication of Reference numeral in figure:
1 Copper Foil, 2 thermoset polyimide layer, 3 thermoplastic polyimide layers.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, concrete introduction is done to the utility model.
The preparation method of double side flexible copper coated board, comprises the following steps:
Step one, prepares Copper Foil 1, produces TPI precursor aqueous solution, Thermocurable polyimide precursor aqueous solution;
Step 2, Thermocurable polyimide precursor aqueous solution is coated Copper Foil 1 surface, obtain double-deck single sided board through oven for drying, at single sided board surface drying layer surface coating thermoplastic polyimides precursor aqueous solution, through oven for drying, then obtain the single sided board of three-decker through imidization;
Step 3, by the single sided board of two pieces of three-deckers through pressing machine pressing, obtains the dual platen of five-layer structure.
The preparation method of aforesaid double side flexible copper coated board, comprises the following steps:
Step one, prepares Copper Foil 1, TPI precursor aqueous solution, Thermocurable polyimide precursor aqueous solution;
Step 2, Thermocurable polyimide precursor aqueous solution is coated Copper Foil 1 surface, obtain double-deck single sided board through baking oven 120 DEG C of oven dry, at single sided board surface drying layer surface coating thermoplastic polyimides precursor aqueous solution, 120 DEG C of oven dry, then the single sided board of three-decker is obtained through imidization;
Step 3, by the single sided board of two pieces of three-deckers through pressing machine 350 ~ 400 DEG C of pressings, obtains the dual platen of five-layer structure.
The step producing TPI precursor aqueous solution is:
Step one, produce polyamide thermoplastic acid, take a certain amount of diamine monomer p-phenylenediamine (PPD), 1, 3-pair-(3-amino-benzene oxygen), 4, 4 '-bis-(3-amino-benzene oxygen) diphenyl sulphone (DPS), 2, in 2-two [4-(amino-benzene oxygen) phenyl] propane one or more be dissolved in polar solvent dimethyl formamide, dimethylacetylamide, in 1-METHYLPYRROLIDONE or one or both reagent of dimethyl sulfoxide (DMSO), the mass fraction 15%-20% of diamine monomer, then stirring at normal temperature 1-2 hour, add dianhydride monomer PMDA or BPDA one or both, the mass fraction of dianhydride monomer is 15-20%, divide and add for five times, stirring at normal temperature obtains polyamide thermoplastic acid for 5 hours,
Step 2, by polyamide thermoplastic acid imide, by polyamide thermoplastic acid in 30 minutes by room temperature to 160 DEG C, constant temperature 2 hours, was then warming up to 320 DEG C in 2 hours, constant temperature half an hour, finally in 2 hours, was cooled to room temperature.
The step producing Thermocurable polyimide precursor aqueous solution is:
Step one, produce thermosetting polyamide acid, take a certain amount of diamine monomer ODA or m-phenylene diamine (MPD) is dissolved in one or both reagent of polar solvent dimethyl formamide, dimethylacetylamide, 1-METHYLPYRROLIDONE or dimethyl sulfoxide (DMSO), the mass fraction of diamine monomer is 10% ~ 15%, then stirring at normal temperature 1-2 hour, add dianhydride monomer PMDA or BPDA one or both, the mass fraction of dianhydride monomer is 10-15%, divide and add for five times, stirring at normal temperature obtains thermosetting polyamide acid for 5 hours;
Step 2, by thermosetting polyamide acid imide, by thermosetting polyamide acid in 30 minutes by room temperature to 160 DEG C, constant temperature 2 hours, was then warming up to 320 DEG C in 2 hours, constant temperature half an hour, finally in 2 hours, was cooled to room temperature.
Copper Foil 1 is electrolytic copper foil 1, and thickness is 18-35 μm; The thickness of double-deck single sided board is 10-15 μm; The thickness of the single sided board of three-decker is 15-20 μm.Peel strength >1N/MM, soldering resistance is good, good stability of the dimension.
A kind of double side flexible copper coated board, comprising: Copper Foil 1, coats the thermoset polyimide layer 2 on Copper Foil 1 two sides, coat the thermoplastic polyimide layer 3 of thermoset polyimide layer 2 away from Copper Foil 1 side.Double side flexible copper coated board is the dual platen of five-layer structure; Copper Foil 1 is one deck, and thermoset polyimide layer 2, thermoplastic polyimide layer 3 are two-layer.Copper Foil 1 layer thickness of the dual platen of five-layer structure is 18-35 μm.Copper Foil 1 is electrolytic copper foil.The thickness of thermoplastic polyimide layer 3 is 5 μm.
More than show and describe general principle of the present utility model, principal character and advantage.The technical staff of the industry should understand, and above-described embodiment does not limit the utility model in any form, the technical scheme that the mode that all employings are equal to replacement or equivalent transformation obtains, and all drops in protection domain of the present utility model.
Claims (6)
1. a double side flexible copper coated board, is characterized in that, comprising: Copper Foil, coats the thermoset polyimide layer on above-mentioned Copper Foil two sides, coats the thermoplastic polyimide layer of above-mentioned thermoset polyimide layer away from Copper Foil side.
2. a kind of double side flexible copper coated board according to claim 1, is characterized in that, above-mentioned double side flexible copper coated board is the dual platen of five-layer structure.
3. a kind of double side flexible copper coated board according to claim 1, is characterized in that, above-mentioned Copper Foil is one deck, and above-mentioned thermoset polyimide layer, thermoplastic polyimide layer are two-layer.
4. a kind of double side flexible copper coated board according to claim 2, is characterized in that, the copper foil layer thickness of the dual platen of above-mentioned five-layer structure is 18-35 μm.
5. a kind of double side flexible copper coated board according to claim 1, is characterized in that, above-mentioned Copper Foil is electrolytic copper foil.
6. a kind of double side flexible copper coated board according to claim 1, is characterized in that, the thickness of above-mentioned thermoplastic polyimide layer is 5 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201420376488.3U CN204322672U (en) | 2014-07-09 | 2014-07-09 | A kind of double side flexible copper coated board |
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| CN201420376488.3U CN204322672U (en) | 2014-07-09 | 2014-07-09 | A kind of double side flexible copper coated board |
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| CN204322672U true CN204322672U (en) | 2015-05-13 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104057663A (en) * | 2014-07-09 | 2014-09-24 | 苏州城邦达力材料科技有限公司 | Double-sided flexible copper-clad laminate and production method thereof |
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- 2014-07-09 CN CN201420376488.3U patent/CN204322672U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104057663A (en) * | 2014-07-09 | 2014-09-24 | 苏州城邦达力材料科技有限公司 | Double-sided flexible copper-clad laminate and production method thereof |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215300 the southern side of Yingbin West Road, Ba Town, Kunshan City, Suzhou, Jiangsu Patentee after: Suzhou Chengbang Dayi Material Technology Co.,Ltd. Address before: 215300 the southern side of Yingbin West Road, Ba Town, Kunshan City, Suzhou, Jiangsu Patentee before: SUZHOU CHENGBANGDALI MATERIAL TECHNOLOGY Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CB03 | Change of inventor or designer information |
Inventor after: Gao Xiaojun Inventor after: Dong Qingshan Inventor before: Gao Xiaojun Inventor before: Dong Qingshan Inventor before: Fang Yan |
|
| CB03 | Change of inventor or designer information | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230404 Address after: 215300 room 2, No. 399, Dongping Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: KUNSHAN ZHUOYUE LANTIAN ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 215300 the southern side of Yingbin West Road, Ba Town, Kunshan City, Suzhou, Jiangsu Patentee before: Suzhou Chengbang Dayi Material Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |