CN113423177A - Method for improving position precision of hole-to-hole, line-to-line and line-to-welding prevention - Google Patents
Method for improving position precision of hole-to-hole, line-to-line and line-to-welding prevention Download PDFInfo
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- CN113423177A CN113423177A CN202110520429.3A CN202110520429A CN113423177A CN 113423177 A CN113423177 A CN 113423177A CN 202110520429 A CN202110520429 A CN 202110520429A CN 113423177 A CN113423177 A CN 113423177A
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- hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Butt Welding And Welding Of Specific Article (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a method for improving the position precision of hole-to-hole, line-to-line and line-to-solder mask, which specifically comprises the following steps of (1) designing an operation board: giving a pretension value in a working unit of the working plate, and compensating expansion and contraction of the working plate in a mode of translation of the working unit after pressing; (2) design of gong belt: optimizing the routing sequence, routing the periphery of the working unit, drilling or routing other holes or grooves in the working unit, releasing the deformation of different areas when the working board is positioned, and dispersing the deformation into a positioning system taking the working unit as a unit; (3) and designing the hole: and drilling a drilling hole smaller than the median of the finished product at the center of all the gongs or grooves related to the drilling hole or groove. The invention can improve the position ability from drilling to the routing process to +/-0.035 mm, the position ability from the line to +/-0.05 mm and the position ability from the line to the solder mask to +/-0.07 mm.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a method for improving the position precision from hole to hole, from line to line and from line to solder mask.
Background
In the machining field of traditional pin (round pin) nail location, because bore, gong have the influence of secondary positioning deviation and PCB board itself harmomegathus, the hole (or slotted hole) of drilling to the hole (or slotted hole) position tolerance limit ability of gong board is at 0.075mm, can't satisfy the increasingly strict position requirement of vapour board customer already.
Disclosure of Invention
The invention aims to solve the problems that: the invention provides a method for improving the position accuracy from hole to hole, line to line and line to anti-welding, which improves the position capability from drilling to plate milling to +/-0.035 mm, the position capability from line to +/-0.05 mm and the position capability from line to anti-welding to +/-0.07 mm.
The technical scheme provided by the invention for solving the problems is as follows: a method of improving hole-to-hole positional accuracy, the method comprising the steps of
(1) And designing the operation plate: giving a pretension value in a working unit of the working plate, and compensating expansion and contraction of the working plate in a mode of translation of the working unit after pressing;
(2) design of gong belt: optimizing the routing sequence, routing the periphery of the working unit, drilling or routing other holes or grooves in the working unit, releasing the deformation of different areas when the working board is positioned, and dispersing the deformation into a positioning system taking the working unit as a unit;
(3) and designing the hole: and drilling a drilling hole smaller than the median of the finished product at the center of all the gongs or grooves related to the drilling hole or groove.
Preferably, in the step (1), the pre-stretching value is in the range of 1% to 3%.
Preferably, the pretension value in the working unit in the step (1) is used for compensating the deformation of the material after being heated.
Preferably, in the step (1), the work unit is translated to eliminate the compression fluctuation between batches in the mass production process.
Preferably, the value of the one drilled hole is 0.2 to 0.4mm smaller than the median value of the finished product.
Preferably, the one bore hole is designed as an acyclic PTH.
The invention also provides a method for improving the position precision of the line-to-line, which comprises the step (1).
The invention also provides a method for improving the position accuracy of the circuit to the welding prevention, which comprises the step (1).
Compared with the prior art, the invention has the advantages that:
1. the influence of the deformation of the material caused by heating on the position precision is reduced;
2. the influence of expansion and contraction on the position precision in the mass production process is eliminated;
3. the influence of the positioning deviation of the secondary pin positioning system on the position precision is reduced;
4. the position ability of the process from drilling to milling is improved to +/-0.035 mm, the position ability of the circuit to the circuit is improved to +/-0.05 mm, and the position ability of the circuit to the solder mask is improved to +/-0.07 mm.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
FIG. 1 is a schematic view of a work plate of the present invention;
FIG. 2 is a schematic diagram comparing an ideal work plate and an actual work plate;
FIG. 3 is a schematic diagram of a conventional method for implementing a hole drill in the center of an inner PAD for global expansion and contraction data;
fig. 4 is a plan view of the present invention with translation to achieve operation board-wide hole drilling in the center of the inner PAD without changing the position in the delivery unit.
FIG. 5 is a schematic diagram of the post-pre-expansion unit and the actual completion unit;
FIG. 6 is a schematic view of a drill slot 0.2-0.4mm smaller than the groove is additionally drilled in advance in the center of the gong-slot.
Detailed Description
The embodiments of the present invention will be described in detail with reference to the accompanying drawings and examples, so that how to implement the technical means for solving the technical problems and achieving the technical effects of the present invention can be fully understood and implemented.
Example 1
A method of improving hole-to-hole positional accuracy, the method comprising the steps of
(1) And designing the operation plate: giving a pretension value in a working unit of the working plate, and compensating expansion and contraction of the working plate in a mode of translation of the working unit after pressing; the prestretching value in the working unit is used for compensating the deformation of the material after being heated, and the working unit is translated to eliminate the compression expansion and shrinkage fluctuation among batches in the mass production process.
(2) Design of gong belt: the milling sequence is optimized, the periphery of the working unit is milled, other holes or grooves in the working unit are drilled or milled, deformation of different areas is released when the working board is positioned, the deformation is dispersed to a positioning system taking the working unit as a unit, and the positioning error of the working board is reduced.
(3) And designing the hole: and (3) additionally drilling a drill hole which is 0.2-0.4mm smaller than the median of the finished product at the center of all the gong holes or grooves related to the drill hole or groove, as shown in fig. 6, additionally drilling a drill groove which is 0.2-0.4mm smaller than the groove at the center of the gong groove in advance, wherein the drill hole is designed into a non-annular PTH due to exceeding the dry film hole sealing capability, when the finished product is processed, the hole diameter of the finished product is drilled by a gong machine, and the step 2 and the step 3 are matched, so that the center of the drill hole (groove) of the gong machine is superposed with the center of the drill hole (groove) to the maximum extent.
By using the technical scheme of the steps (1), (2) and (3), the position tolerance from the hole (or the slotted hole) drilled to the hole (or the slotted hole) of the gong board can be greatly increased to +/-0.035 mm;
example 2
A method of improving line-to-line position accuracy, the method comprising
Designing an operation plate: giving a pretension value in a working unit of the working plate, and compensating expansion and contraction of the working plate in a mode of translation of the working unit after pressing; the prestretching value in the working unit is used for compensating the deformation of the material after being heated, and the working unit is translated to eliminate the compression expansion and shrinkage fluctuation among batches in the mass production process.
Wherein the pre-drawing value is in the range of 1% -3%.
By this step, the line-to-line position capability can be raised to ± 0.05 mm.
Example 3
A method of improving line-to-shield position accuracy, the method comprising
Designing an operation plate: giving a pretension value in a working unit of the working plate, and compensating expansion and contraction of the working plate in a mode of translation of the working unit after pressing; the prestretching value in the working unit is used for compensating the deformation of the material after being heated, and the working unit is translated to eliminate the compression expansion and shrinkage fluctuation among batches in the mass production process.
Wherein the pre-drawing value is in the range of 1% -3%.
By this step, the line-to-solder-mask position capability can be raised to ± 0.07 mm.
The foregoing is merely illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the claims. The present invention is not limited to the above embodiments, and the specific structure thereof is allowed to vary. All changes which come within the scope of the invention as defined by the independent claims are intended to be embraced therein.
Claims (8)
1. A method of improving hole-to-hole positional accuracy, characterized by: the method comprises the following steps
(1) And designing the operation plate: giving a pretension value in a working unit of the working plate, and compensating expansion and contraction of the working plate in a mode of translation of the working unit after pressing;
(2) design of gong belt: optimizing the routing sequence, routing the periphery of the working unit, drilling or routing other holes or grooves in the working unit, releasing the deformation of different areas when the working board is positioned, and dispersing the deformation into a positioning system taking the working unit as a unit;
(3) and designing the hole: and drilling a drilling hole smaller than the median of the finished product at the center of all the gongs or grooves related to the drilling hole or groove.
2. A method of improving hole-to-hole positional accuracy according to claim 1, wherein: in the step (1), the pre-drawing value ranges from 1% to 3%.
3. A method of improving hole-to-hole positional accuracy according to claim 1, wherein: and (2) compensating the deformation of the material after being heated by using the pretension value in the working unit in the step (1).
4. A method of improving hole-to-hole positional accuracy according to claim 1, wherein: and (2) in the step (1), the working unit is translated to eliminate the compression and expansion fluctuation among batches in the mass production process.
5. A method of improving hole-to-hole positional accuracy according to claim 1, wherein: the value of the drill hole is 0.2-0.4mm smaller than the median value of the finished product.
6. A method of improving hole-to-hole positional accuracy according to claim 1, wherein: the one bore hole is designed as an endless PTH.
7. A method of improving line-to-line position accuracy, characterized by: the method comprises the step (1).
8. A method for improving the accuracy of a line to a solder mask position, comprising: the method comprises the step (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110520429.3A CN113423177B (en) | 2021-05-13 | 2021-05-13 | Method for improving position precision of hole-to-hole, line-to-line and line-to-welding prevention |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110520429.3A CN113423177B (en) | 2021-05-13 | 2021-05-13 | Method for improving position precision of hole-to-hole, line-to-line and line-to-welding prevention |
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| CN113423177A true CN113423177A (en) | 2021-09-21 |
| CN113423177B CN113423177B (en) | 2022-08-26 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117156693A (en) * | 2023-10-30 | 2023-12-01 | 圆周率半导体(南通)有限公司 | Method for reducing deformation of ATE product |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| Publication number | Publication date |
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| CN113423177B (en) | 2022-08-26 |
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