CN103338593A - Circuit board with large current module and manufacturing method for circuit board - Google Patents
Circuit board with large current module and manufacturing method for circuit board Download PDFInfo
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- CN103338593A CN103338593A CN 201310308839 CN201310308839A CN103338593A CN 103338593 A CN103338593 A CN 103338593A CN 201310308839 CN201310308839 CN 201310308839 CN 201310308839 A CN201310308839 A CN 201310308839A CN 103338593 A CN103338593 A CN 103338593A
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Abstract
The invention discloses a circuit board with a large current module and a manufacturing method for the circuit board and belongs to the technical field of circuit board manufacturing. The manufacturing method comprises the following steps of (1) routing and fusing an inner layer and a prepreg; (2) imbedding the large current module; (3) drilling; and (4) performing process of plated through hole (PTH), pattern plating, outer layer dry film plating, linear plating, solder mask coating and surface treatment. The circuit board with the large current module manufactured by the manufacturing method has the advantages that the integration cost of a system is reduced, the reliability is improved, the capacitance is increased, the impedance is reduced, wiring errors are reduced, a self-inductance coefficient is reduced, the thermal performance is improved and the space is saved. A powerful support in the aspect of electronic parts and components is provided for marketization acceleration of electric vehicles and hybrid electric vehicles.
Description
Technical field
The present invention relates to the circuit board making technical field, particularly relate to circuit board of a kind of tool high-current module and preparation method thereof.
Background technology
Along with the raising of living standards of the people, more and more higher to environment requirement, energy conservation consciousness and energy crisis sense are more and more stronger, and the cry of accelerating the hybrid vehicle research and development is more and more higher.The cost performance of hybrid vehicle and market-oriented degree are also more and more by people's extensive concern simultaneously.And then electronic technology being is also constantly is being researched and developed and is being innovated for the electronic unit of high-end hybrid vehicle in order to adapt to the demand of hybrid vehicle, the step that the boosting hybrid power strides forward to marketization acceleration.Along with the development to the PCB demand, the last integrated function element number of PCB is more and more, current lead-through ability and demands for bearing capacity to circuit are also more and more higher, the space layout of circuit board is diversified development, and to the PCB demand side, need to provide big electric current and ask institute to take up space again when power supply is integrated more and more littler.Therefore, integrated development becomes the key point that solves space problem.
Circuit board with high-current module particularly is applied in high-power high voltage parts such as engine power suppling part branch, automobile central authorities electric power supply part as the automotive electronics parts, require circuit board to have the advantages that heat-resistant aging is good, high-low temperature resistant circulation reliability is good, but present existing high-current module 1 and circuit board 3 are by means combinations such as surface soldered, bonding sheets 2, as shown in Figure 1, not only take up room, and have the q﹠r potential safety hazard aspect the weldering system.
Summary of the invention
Based on this, the objective of the invention is to overcome the defective of prior art, circuit board of a kind of tool high-current module and preparation method thereof is provided, the circuit board of the tool high-current module of making by said method, have system integration height, save the space, the advantage of good reliability.
For achieving the above object, the present invention takes following technical scheme:
A kind of manufacture method of circuit board of tool high-current module may further comprise the steps:
1) internal layer and prepreg gong plate and fusion: earlier internal layer and prepreg are carried out pre-stretching according to 0.2-0.6 mil/inch, carry out the gong plate, then internal layer and prepreg are merged, then go out high-current module potting space according to predetermined design configuration gong on internal layer and prepreg again;
2) high-current module potting: comprise high-current module brown, high-current module composing and potting high-current module pressing step, in potting high-current module pressing step, pressing time is 180-280min, and pressing-in temp is room temperature to 240 ℃, and the control platen pressure is 50-400PSI; System makes vacuum degree less than 20mbar after beginning to vacuumize 5min, holds time to be 100-150min;
3) boring: control is bored and chewed rotating speed is 35-130 rev/min, and it is 15-80 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-800 inch per minute clock that Hui Su is chewed in commentaries on classics;
4) heavy copper; Plate; The outer dried film; Line; Apply solder mask; Surface treatment.
The present invention has opened up a kind of novel high-current module and the intergration model of circuit board, described high-current module is made by the material that copper billet etc. conducts electricity very well, namely by the form of potting copper billet is combined with circuit board, but in the existing multi-layer sheet manufacturing process of contrast, there are many technological difficulties in potting high-current module circuit board technology, after internal layer and prepreg process pressing effect fusion, its size can be owing to the pressing process produces harmomegathus, for internal layer and prepreg are consistent with boring through the size after the pressing harmomegathus, the present invention by internal layer and prepreg are carried out suitable pre-stretching again the gong plate size and boring after its harmomegathus are met; And in copper billet potting operation, the present invention is by a large amount of experimental studies, found out be fit to the pressing parameter, make copper billet peripheral clearance potting resin abundant, fully discharge thermal stress, finally make circuit board reach high reliability request, and have good pressing thickness evenness; In drilling operating, hole at super thick copper, burr and the breaking of rod very likely occur and relevant quality problem such as chew, the present invention has found out the drilling parameter that is fit to through a large amount of experiments, the appearance of problem such as can prevent that effectively burr and the breaking of rod from chewing.The present invention is by a large amount of experimental designs and research, solved the various technological difficulties that exist when the copper billet potting gone into circuit board, and the circuit board for preparing by this process has system integration height, saves the space, the advantage of good reliability.
Therein among embodiment, in the step 1), described internal layer and prepreg are according to 0.2-0.4 mil/inch radially, and broadwise 0.4-0.6 mil/inch carries out pre-stretching.Described radially with broadwise for knitting glass yarn idiom, namely vertically with the horizontal meaning.
Therein among embodiment, in the step 3), described pressing-in temp is according to following change of program:
The 1st program, temperature are set at 150-170 ℃, and the retention time is 5-15min;
The 2nd program, temperature are set at 170-180 ℃, and the retention time is 10-20min;
The 3rd program, temperature are set at 180-200 ℃, and the retention time is 2-10min;
The 4th program, temperature are set at 220-240 ℃, and the retention time is 40-50min;
The 5th program, temperature are set at 190-210 ℃, and the retention time is 25-35min;
The 6th program, temperature are set at 170-190 ℃, and the retention time is 15-25min;
The 7th program, temperature are set at 150-170 ℃, and the retention time is 5-15min;
The 8th program, temperature are set at 130-150 ℃, and the retention time is 5-15min;
The 9th program, temperature are set at 110-130 ℃, and the retention time is 5-15min;
The 10th program, temperature are set at 90-110 ℃, and the retention time is 5-15min;
The 11st program, temperature are set at 70-90 ℃, and the retention time is 5-15min;
The 12nd program, temperature are set at 40-60 ℃, and the retention time is 25-35min.
Therein among embodiment, in the step 3), described platen pressure is according to following change of program:
The 1st program, pressure is set at 50-150PSI, and the retention time is 30-50min;
The 2nd program, pressure is set at 300-400PSI, and the retention time is 70-100min;
The 3rd program, pressure is set at 150-250PSI, and the retention time is 10-30min;
The 4th program, pressure is set at 50-150PSI, and the retention time is 70-100min.
Among embodiment, in the step 4), according to pore size, hole according to following parameter therein:
If bore dia is the 0.075-0.124 millimeter, it is thousand rev/mins of 110.0-130.0 that rotating speed is chewed in commentaries on classics, and it is 15.0-25.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.125-0.174 millimeter, it is thousand rev/mins of 110.0-130.0 that rotating speed is chewed in commentaries on classics, and it is 18.0-28.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.175-0.224 millimeter, it is thousand rev/mins of 110.0-130.0 that rotating speed is chewed in commentaries on classics, and it is 20.0-30.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.225-0.274 millimeter, it is thousand rev/mins of 112.0-122.0 that rotating speed is chewed in commentaries on classics, and it is 21.0-31.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.275-0.324 millimeter, it is thousand rev/mins of 92.2-102.2 that rotating speed is chewed in commentaries on classics, and it is 23.0-33.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.325-0.374 millimeter, it is thousand rev/mins of 79.1-87.1 that rotating speed is chewed in commentaries on classics, and it is 25.0-35.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.375-0.424 millimeter, it is thousand rev/mins of 70.0-77.0 that rotating speed is chewed in commentaries on classics, and it is 26.0-36.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.425-0.474 millimeter, it is thousand rev/mins of 60.0-70.0 that rotating speed is chewed in commentaries on classics, and it is 27.0-37.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.475-0.524 millimeter, it is thousand rev/mins of 53.0-63.0 that rotating speed is chewed in commentaries on classics, and it is 29.0-39.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.525-0.574 millimeter, it is thousand rev/mins of 50.0-55.0 that rotating speed is chewed in commentaries on classics, and it is 29.0-39.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 600-800 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.575-0.624 millimeter, it is thousand rev/mins of 45.0-50.0 that rotating speed is chewed in commentaries on classics, and it is 60.0-80.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 600-800 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.625-0.674 millimeter, it is thousand rev/mins of 40.0-46.0 that rotating speed is chewed in commentaries on classics, and it is 60.0-80.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 600-800 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.675-0.724 millimeter, it is thousand rev/mins of 38.0-45.0 that rotating speed is chewed in commentaries on classics, and it is 32.4-42.4 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 600-800 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.725-0.774 millimeter, it is thousand rev/mins of 35.0-41.0 that rotating speed is chewed in commentaries on classics, and it is 33.0-43.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 600-800 inch per minute clock that Hui Su is chewed in commentaries on classics.
The present invention classifies according to bore diameter, finds out the drilling parameter that is fit under the various boring situations again, the appearance of problem such as can prevent that effectively burr and the breaking of rod from chewing.
Among embodiment, hole according to following parameter therein:
If bore dia is 0.10 millimeter, it is thousand rev/mins of 115.0-125.0 that rotating speed is chewed in commentaries on classics, and it is 17.0-23.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.15 millimeter, it is thousand rev/mins of 115.0-125.0 that rotating speed is chewed in commentaries on classics, and it is 20.0-25.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.20 millimeter, it is thousand rev/mins of 115.0-125.0 that rotating speed is chewed in commentaries on classics, and it is 22.0-28.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.25 millimeter, it is thousand rev/mins of 115.0-120.0 that rotating speed is chewed in commentaries on classics, and it is 23.0-29.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.30 millimeter, it is thousand rev/mins of 95.0-100.0 that rotating speed is chewed in commentaries on classics, and it is 25.0-31.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.35 millimeter, it is thousand rev/mins of 80.0-85.0 that rotating speed is chewed in commentaries on classics, and it is 27.0-33.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.40 millimeter, it is thousand rev/mins of 71.0-76.0 that rotating speed is chewed in commentaries on classics, and it is 28.0-34.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.45 millimeter, it is thousand rev/mins of 61.8-67.8 that rotating speed is chewed in commentaries on classics, and it is 29.0-35.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.50 millimeter, it is thousand rev/mins of 55.7-60.7 that rotating speed is chewed in commentaries on classics, and it is 31.0-37.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.55 millimeter, it is thousand rev/mins of 51.3-54.3 that rotating speed is chewed in commentaries on classics, and it is 31.0-37.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 650-750 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.60 millimeter, it is thousand rev/mins of 46.0-49.0 that rotating speed is chewed in commentaries on classics, and it is 65.0-75.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 650-750 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.65 millimeter, it is thousand rev/mins of 42.0-45.0 that rotating speed is chewed in commentaries on classics, and it is 65.0-75.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 650-750 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.70 millimeter, it is thousand rev/mins of 39.5-43.5 that rotating speed is chewed in commentaries on classics, and it is 35.0-40.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 650-750 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.75 millimeter, it is thousand rev/mins of 37.4-40.4 that rotating speed is chewed in commentaries on classics, and it is 35.0-40.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 650-750 inch per minute clock that Hui Su is chewed in commentaries on classics.
Therein among embodiment, in the step 3), described high-current module is copper billet, and the technological parameter of described copper billet brown is: the mass percent of strong oxidizer is that the mass percent of 3.8%-4.6%, hydrogen peroxide is 3.3%-5%, 32 ℃-38 ℃ of temperature and etch-rate 1.25 μ m/cm
2-1.75 μ m/cm
2, described strong oxidizer is clorox.By brown technology the copper billet specific area is strengthened, the bond strength of copper billet and resin when increasing pressing.
Therein among embodiment, in the step 3), high-current module set type and potting high-current module pressing step between, also comprise the whole operation with the thermal resistance material parcel that delays to conduct heat of high-current module, internal layer and prepreg.The described thermal resistance material that delays to conduct heat can be for leatheroid etc., and selects the parcel thickness that is fit to as required, by the use of thermal resistance material, external temperature is passed in the circuit board uniformly.
The present invention also provides a kind of circuit board of tool high-current module of above-mentioned manufacture method preparation.
Among embodiment, the corner of described high-current module is circular-arc therein.Do not have corner angle around making high-current module, reduce surface tension, increase the adhesion of circular-arc chamfering and resin, prevent that edges and corners localized heat stress and mechanical stress from strengthening, and changes circular-arc chamfer design into and effectively guaranteed reliability of products.
Compared with prior art, the present invention has following beneficial effect:
The manufacture method of the circuit board of a kind of tool high-current module of the present invention by the high-current module potting is gone in the circuit board, opens a kind of new high-current module and circuit board intergration model, has simplified process flow, has saved product cost; And since high-current module be direct potting in circuit board, do not have Welding Problems, improved on the one hand the reliability of circuit board, also avoided on the other hand because problems such as the electric capacity decline that the solder joint loose contact causes, impedance increases; And the high-current module of potting can be finished the function of high-current module, can also play the effect into the circuit board heat radiation, has improved hot property; Simultaneously, the circuit board of this tool high-current module also has advantages such as the wiring error of minimizing, reduction coefficient of self-inductance, saving space.This manufacture method also improves the cost performance of the circuit board of the tool high-current module that makes greatly, makes the quality of product and benefit obtain perfect adaptation.
Description of drawings
Fig. 1 is high-current module and circuit board generalized section in the prior art;
Fig. 2 is the manufacture method process flow chart of the embodiment of the invention 1;
Fig. 3 is the circuit board plane figure of the tool high-current module of the embodiment of the invention 1;
Fig. 4 is circuit board thickness measure area schematic in the embodiment of the invention 6;
Fig. 5 is circuit board A section copper billet and resin part schematic diagram in the embodiment of the invention 1;
Fig. 6 is circuit board B section copper billet and resin part schematic diagram in the embodiment of the invention 2;
Fig. 7 is circuit board C section copper billet and resin part schematic diagram in the embodiment of the invention 3;
Fig. 8 is circuit board D section copper billet and resin part schematic diagram in the embodiment of the invention 4;
Fig. 9 is circuit board E section copper billet and resin part schematic diagram in the embodiment of the invention 5;
Figure 10 is the little slice map of circuit board A section boring part in the embodiment of the invention 1;
Figure 11 is the little slice map of circuit board B section boring part in the embodiment of the invention 2;
Figure 12 is the little slice map of circuit board C section boring part in the embodiment of the invention 3;
Figure 13 is the little slice map of circuit board D section boring part in the embodiment of the invention 4;
Figure 14 is the little slice map of circuit board E section boring part in the embodiment of the invention 5.
Wherein: 1. copper billet; 2. bonding sheet; 3. wiring board; 4. resin; 5. boring.
Embodiment
Describe the present invention in detail below in conjunction with the drawings and specific embodiments.
A kind of manufacture method of circuit board of tool high-current module as shown in Figure 2, may further comprise the steps:
1) internal layer and prepreg gong plate and fusion: earlier with internal layer and prepreg according to 0.3 mil/inch (mil/inch) radially, broadwise 0.5 mil/inch (mil/inch) carries out pre-stretching, carry out the gong plate, then technology merges combination to the good prepreg of gong (5 models are 7628 prepreg) and internal layer (2 thickness are the internal layer of 21mil) routinely, the riveter nail is fixing, and then goes out copper billet potting space according to predetermined design configuration gong on internal layer and prepreg.Wherein, 1mil is 25.4 μ m.
2) high-current module potting: earlier the corner of copper billet is done circular arc chamfering and handle, carry out brown then and handle, the brown parameter is: clorox concentration 4.2%, hydrogen peroxide concentration 4%, 35 ℃ of temperature and etch-rate 1.50 μ m/cm
2Set type then, copper billet is set type to the copper billet potting space of reserving, subsequently with 17 new leatheroid with typesetted copper billet with the internal layer after merging and prepreg parcel, carry out potting copper billet pressing step, pressing-in temp, platen pressure carry out according to following table 1 parameter.
Table 1. potting copper billet pressing parameter
During beginning, system vacuumizes 5min, and vacuum degree is reached below the 20mbar, keep 125min after, when treating that resin almost completely solidifies, stop to vacuumize, vacuum degree is descended naturally.Temperature program(me) stops to heat after finishing, and makes temperature drop to room temperature naturally.
3) boring: hole according to following table 2 parameter:
Table 2. drilling parameter
| Bore dia | Change and chew rotating speed | Change and chew terminal-velocity | Change and chew Hui Su |
| Millimeter | Thousand rev/mins | The inch per minute clock | The inch per minute clock |
| 0.10 | 120.0 | 20.0 | 500 |
| 0.15 | 120.0 | 23.0 | 500 |
| 0.20 | 120.0 | 25.0 | 500 |
| 0.25 | 117.0 | 26.0 | 500 |
| 0.30 | 97.2 | 28.0 | 500 |
| 0.35 | 83.1 | 30.0 | 500 |
| 0.40 | 73.5 | 31.0 | 500 |
| 0.45 | 64.8 | 32.0 | 500 |
| 0.50 | 58.2 | 34.0 | 500 |
| 0.55 | 52.8 | 34.0 | 700 |
| 0.60 | 48.0 | 70.0 | 700 |
| 0.65 | 44.0 | 70.0 | 700 |
| 0.70 | 41.5 | 37.4 | 700 |
| 0.75 | 38.9 | 38.0 | 700 |
4) routinely technology sink copper, plate electricity, the outer dried film, line electricity, apply operations such as solder mask, surface treatment, obtain having as shown in Figure 3 the circuit board of high-current module, i.e. circuit board A.
Manufacture method and the manufacture method among the embodiment 1 of the circuit board of the tool high-current module of present embodiment are basic identical, and difference is:
1) internal layer and prepreg gong plate and fusion: earlier with internal layer and prepreg according to 0.2 mil/inch (mil/inch) radially, broadwise 0.4 mil/inch (mil/inch) carries out pre-stretching.
2) high-current module potting: parameter was clorox concentration 3.8%, hydrogen peroxide concentration 3.3%, 32 ℃ of temperature and etch-rate 1.25 μ m/cm when brown was handled
2When carrying out potting copper billet pressing step, pressing-in temp, platen pressure carry out according to following table 3 parameters.
Table 3. potting copper billet pressing parameter
During beginning, system vacuumizes 5min, makes vacuum degree less than 20mbar, keep 150min after, stop to vacuumize, vacuum degree is descended naturally.
3) boring: hole according to following table 4 parameter:
Table 4. drilling parameter
| Bore dia | Change and chew rotating speed | Change and chew terminal-velocity | Change and chew Hui Su |
| Millimeter | Thousand rev/mins | The inch per minute clock | The inch per minute clock |
| 0.10 | 110.0 | 15.0 | 400 |
| 0.15 | 110.0 | 18.0 | 400 |
| 0.20 | 110.0 | 20.0 | 400 |
| 0.25 | 112.0 | 21.0 | 400 |
| 0.30 | 92.2 | 23.0 | 400 |
| 0.35 | 79.1 | 25.0 | 400 |
| 0.40 | 70.0 | 26.0 | 400 |
| 0.45 | 60.0 | 27.0 | 400 |
| 0.50 | 53.0 | 29.0 | 400 |
| 0.55 | 50.0 | 29.0 | 600 |
| 0.60 | 45.0 | 60.0 | 600 |
| 0.65 | 40.0 | 60.0 | 600 |
| 0.70 | 38.0 | 32.4 | 600 |
| 0.75 | 35.0 | 33.0 | 600 |
4) routinely technology sink copper, plate electricity, the outer dried film, line electricity, apply operations such as solder mask, surface treatment, get the circuit board of tool high-current module, i.e. circuit board B.
Manufacture method and the manufacture method among the embodiment 1 of the circuit board of the tool high-current module of present embodiment are basic identical, and difference is:
1) internal layer and prepreg gong plate and fusion: earlier with internal layer and prepreg according to 0.4 mil/inch (mil/inch) radially, broadwise 0.6 mil/inch (mil/inch) carries out pre-stretching.
2) high-current module potting: parameter was clorox concentration 4.6%, hydrogen peroxide concentration 5%, 38 ℃ of temperature and etch-rate 1.75 μ m/cm when brown was handled
2When carrying out potting copper billet pressing step, pressing-in temp, platen pressure carry out according to following table 5 parameters.
Table 5. potting copper billet pressing parameter
During beginning, system vacuumizes 5min, makes vacuum degree less than 20mbar, keep 100min after, stop to vacuumize, vacuum degree is descended naturally.
3) boring: hole according to following table 6 parameter:
Table 6. drilling parameter
| Bore dia | Change and chew rotating speed | Change and chew terminal-velocity | Change and chew Hui Su |
| Millimeter | Thousand rev/mins | The inch per minute clock | The inch per minute clock |
| 0.10 | 130.0 | 25.0 | 600 |
| 0.15 | 130.0 | 28.0 | 600 |
| 0.20 | 130.0 | 30.0 | 600 |
| 0.25 | 122.0 | 31.0 | 600 |
| 0.30 | 102.2 | 33.0 | 600 |
| 0.35 | 87.1 | 35.0 | 600 |
| 0.40 | 77.0 | 36.0 | 600 |
| 0.45 | 70.0 | 37.0 | 600 |
| 0.50 | 63.0 | 39.0 | 600 |
| 0.55 | 55.0 | 39.0 | 800 |
| 0.60 | 50.0 | 80.0 | 800 |
| 0.65 | 46.0 | 80.0 | 800 |
| 0.70 | 45.0 | 42.4 | 800 |
| 0.75 | 41.0 | 43.0 | 800 |
4) routinely technology sink copper, plate electricity, the outer dried film, line electricity, apply operations such as solder mask, surface treatment, get the circuit board of tool high-current module, i.e. circuit board C.
Manufacture method and the manufacture method among the embodiment 1 of the circuit board of the tool high-current module of present embodiment are basic identical, and difference is:
1) internal layer and prepreg gong plate and fusion: earlier with internal layer and prepreg according to 0.6 mil/inch (mil/inch) radially, broadwise 0.2 mil/inch (mil/inch) carries out pre-stretching.
2) high-current module potting: parameter was clorox concentration 4%, hydrogen peroxide concentration 3.8%, 34 ℃ of temperature and etch-rate 1.35 μ m/cm when brown was handled
2When carrying out potting copper billet pressing step, pressing-in temp, platen pressure carry out according to following table 7 parameters.
Table 7. potting copper billet pressing parameter
During beginning, system vacuumizes 5min, makes vacuum degree less than 20mbar, keep 113min after, stop to vacuumize, vacuum degree is descended naturally.
3) boring: hole according to following table 8 parameter:
Table 8. drilling parameter
| Bore dia | Change and chew rotating speed | Change and chew terminal-velocity | Change and chew Hui Su |
| Millimeter | Thousand rev/mins | The inch per minute clock | The inch per minute clock |
| 0.10 | 115.0 | 17.0 | 450 |
| 0.15 | 115.0 | 20.0 | 450 |
| 0.20 | 115.0 | 22.0 | 450 |
| 0.25 | 115.0 | 23.0 | 450 |
| 0.30 | 95.0 | 25.0 | 450 |
| 0.35 | 80.0 | 27.0 | 450 |
| 0.40 | 71.0 | 28.0 | 450 |
| 0.45 | 61.8 | 29.0 | 450 |
| 0.50 | 55.7 | 31.0 | 450 |
| 0.55 | 51.3 | 31.0 | 650 |
| 0.60 | 46.0 | 65.0 | 650 |
| 0.65 | 42.0 | 65.0 | 650 |
| 0.70 | 39.5 | 35.0 | 650 |
| 0.75 | 37.4 | 35.0 | 650 |
4) routinely technology sink copper, plate electricity, the outer dried film, line electricity, apply operations such as solder mask, surface treatment, get the circuit board of tool high-current module, i.e. circuit board D.
Manufacture method and the manufacture method among the embodiment 1 of the circuit board of the tool high-current module of present embodiment are basic identical, difference is: 1) internal layer and prepreg gong plate and fusion: earlier with internal layer and prepreg according to 0.5 mil/inch (mil/inch) radially, broadwise 0.3 mil/inch (mil/inch) carries out pre-stretching.
2) high-current module potting: parameter was clorox concentration 4.4%, hydrogen peroxide concentration 4.5%, 37 ℃ of temperature and etch-rate 1.6 μ m/cm when brown was handled
2When carrying out potting copper billet pressing step, pressing-in temp, platen pressure carry out according to following table 9 parameters.
Table 9. potting copper billet pressing parameter
As above shown in the table 9, the beginning system vacuumizes 5min, makes vacuum degree less than 20mbar, keep 137min after, stop to vacuumize, vacuum degree is descended naturally.
3) boring: hole according to following table 10 parameter:
Table 10. drilling parameter
| Bore dia | Change and chew rotating speed | Change and chew terminal-velocity | Change and chew Hui Su |
| Millimeter | Thousand rev/mins | The inch per minute clock | The inch per minute clock |
| 0.10 | 125.0 | 23.0 | 550 |
| 0.15 | 125.0 | 25.0 | 550 |
| 0.20 | 125.0 | 28.0 | 550 |
| 0.25 | 120.0 | 29.0 | 550 |
| 0.30 | 100.0 | 31.0 | 550 |
| 0.35 | 85.0 | 33.0 | 550 |
| 0.40 | 76.0 | 34.0 | 550 |
| 0.45 | 67.8 | 35.0 | 550 |
| 0.50 | 60.7 | 37.0 | 550 |
| 0.55 | 54.3 | 37.0 | 750 |
| 0.60 | 49.0 | 75.0 | 750 |
| 0.65 | 45.0 | 75.0 | 750 |
| 0.70 | 43.5 | 40.0 | 750 |
| 0.75 | 40.4 | 40.0 | 750 |
4) routinely technology sink copper, plate electricity, the outer dried film, line electricity, apply operations such as solder mask, surface treatment, get the circuit board of tool high-current module, i.e. circuit board E.
The circuit board performance of embodiment 6 tool high-current modules is investigated
Below the circuit board of tool high-current module that the manufacture method of above-described embodiment 1-5 is prepared test, investigate its every performance.
One, plate thickness and thickness evenness test.
Choose measured zone according to position shown in Fig. 4, utilize miking should the zone in the thickness of copper billet face and fibrous face, the standard of accepting of thickness of slab is 2.2 ± 0.14mm, result such as following table 11.
Table 11. thickness of slab result (unit: mm)
By in the above-mentioned table 11 as can be seen, the circuit board of the tool high-current module that the described manufacture method of employing present embodiment prepares, its thickness meets the requirements, and namely the thickness after prepreg and the internal layer pressing and the copper billet thickness of potting match, and meet the demands, and possess uniformity preferably.
Two, copper billet and resin investigates in conjunction with situation.
The circuit board of the tool high-current module that the described manufacture method of embodiment 1-5 is prepared is cut into slices, observe the combination of copper billet and resin on its section, shown in Fig. 5-9, wherein light grey part is copper billet, Dark grey partly is resin, can see, the combination of copper billet and resin is tight, resin is filled fully, faying face does not have bubble, can fully discharge thermal stress, and all pass through reliability testing (test of instant heating stress impact) and confirm quality problem such as imperforate wall separation, circuit board has reached the requirement of high reliability.Wherein the thermal stress impact test methods is with reference to the IPC-TM-6502.6.8 method in the international standard.
Three, internal layer, prepreg and boring mated condition are investigated.
The circuit board of the tool high-current module that the described manufacture method of embodiment 1-5 is prepared is cut into slices, observe internal layer and prepreg stretching back and boring proportioning situation on its section, show as Figure 10-14, among the figure, light grey part is copper billet, copper billet centre Dark grey partly has bright line or bright spot for the Dark grey centre that the boring 5(on the copper billet namely holes), what Dark grey did not have bright line or bright spot is resin.Good with the boring proportioning after internal layer and prepreg stretch, the copper billet hole wall is smooth simultaneously, the boring excellent quality.
Four, brill is chewed life test in the drilling operating.
By verification experimental verification, under the borehole conditions of embodiment 1-5, it is as shown in table 12 below that brill is chewed the quantity that can hole continuously.
Table 12. bores chews the quantity that can hole continuously
| Bore dia (mm) | 0.10 | 0.15 | 0.20 | 0.25 | 0.30 | 0.35 | 0.40 |
| Drilling hole amount (individual) | 200 | 300 | 500 | 500 | 500 | 800 | 800 |
| Bore dia (mm) | 0.45 | 0.50 | 0.55 | 0.60 | 0.65 | 0.70 | 0.75 |
| Drilling hole amount (individual) | 800 | 800 | 800 | 1200 | 1200 | 1200 | 1200 |
By in the above-mentioned table 12 as can be seen, adopt the described manufacture method of embodiment 1-5, bore and chew not easy fracture, can long-time continuous boring and do not need to change.And the hole that observation gets out is smooth no burr burr all.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. the manufacture method of the circuit board of a tool high-current module is characterized in that, may further comprise the steps:
1) internal layer and prepreg gong plate and fusion: earlier internal layer and prepreg are carried out pre-stretching according to 0.2-0.6 mil/inch, carry out the gong plate, then internal layer and prepreg are merged, then go out high-current module potting space according to predetermined design configuration gong on internal layer and prepreg again;
2) high-current module potting: comprise high-current module brown, high-current module composing and potting high-current module pressing step, in potting high-current module pressing step, pressing time is 180-280min, and pressing-in temp is room temperature to 240 ℃, and the control platen pressure is 50-400PSI; Vacuum degree is less than 20mbar, and vacuum degree is held time and is 100-150min;
3) boring: control is bored and chewed rotating speed is 35-130 rev/min, and it is 15-80 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-800 inch per minute clock that Hui Su is chewed in commentaries on classics;
4) heavy copper; Plate; The outer dried film; Line; Apply solder mask; Surface treatment.
2. the manufacture method of the circuit board of tool high-current module according to claim 1 is characterized in that, in the step 1), described internal layer and prepreg are according to 0.2-0.4 mil/inch radially, and broadwise 0.4-0.6 mil/inch carries out pre-stretching.
3. the manufacture method of the circuit board of tool high-current module according to claim 1 is characterized in that, in the step 3), described pressing-in temp is according to following change of program:
The 1st program, temperature are set at 150-170 ℃, and the retention time is 5-15min;
The 2nd program, temperature are set at 170-180 ℃, and the retention time is 10-20min;
The 3rd program, temperature are set at 180-200 ℃, and the retention time is 2-10min;
The 4th program, temperature are set at 220-240 ℃, and the retention time is 40-50min;
The 5th program, temperature are set at 190-210 ℃, and the retention time is 25-35min;
The 6th program, temperature are set at 170-190 ℃, and the retention time is 15-25min;
The 7th program, temperature are set at 150-170 ℃, and the retention time is 5-15min;
The 8th program, temperature are set at 130-150 ℃, and the retention time is 5-15min;
The 9th program, temperature are set at 110-130 ℃, and the retention time is 5-15min;
The 10th program, temperature are set at 90-110 ℃, and the retention time is 5-15min;
The 11st program, temperature are set at 70-90 ℃, and the retention time is 5-15min;
The 12nd program, temperature are set at 40-60 ℃, and the retention time is 25-35min.
4. the manufacture method of the circuit board of tool high-current module according to claim 1 is characterized in that, in the step 3), described platen pressure is according to following change of program:
The 1st program, pressure is set at 50-150PSI, and the retention time is 30-50min;
The 2nd program, pressure is set at 300-400PSI, and the retention time is 70-100min;
The 3rd program, pressure is set at 150-250PSI, and the retention time is 10-30min;
The 4th program, pressure is set at 50-150PSI, and the retention time is 70-100min.
5. the manufacture method of the circuit board of tool high-current module according to claim 1 is characterized in that, in the step 4), according to pore size, holes according to following parameter:
If bore dia is the 0.075-0.124 millimeter, it is thousand rev/mins of 110.0-130.0 that rotating speed is chewed in commentaries on classics, and it is 15.0-25.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.125-0.174 millimeter, it is thousand rev/mins of 110.0-130.0 that rotating speed is chewed in commentaries on classics, and it is 18.0-28.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.175-0.224 millimeter, it is thousand rev/mins of 110.0-130.0 that rotating speed is chewed in commentaries on classics, and it is 20.0-30.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.225-0.274 millimeter, it is thousand rev/mins of 112.0-122.0 that rotating speed is chewed in commentaries on classics, and it is 21.0-31.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.275-0.324 millimeter, it is thousand rev/mins of 92.2-102.2 that rotating speed is chewed in commentaries on classics, and it is 23.0-33.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.325-0.374 millimeter, it is thousand rev/mins of 79.1-87.1 that rotating speed is chewed in commentaries on classics, and it is 25.0-35.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.375-0.424 millimeter, it is thousand rev/mins of 70.0-77.0 that rotating speed is chewed in commentaries on classics, and it is 26.0-36.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.425-0.474 millimeter, it is thousand rev/mins of 60.0-70.0 that rotating speed is chewed in commentaries on classics, and it is 27.0-37.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.475-0.524 millimeter, it is thousand rev/mins of 53.0-63.0 that rotating speed is chewed in commentaries on classics, and it is 29.0-39.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 400-600 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.525-0.574 millimeter, it is thousand rev/mins of 50.0-55.0 that rotating speed is chewed in commentaries on classics, and it is 29.0-39.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 600-800 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.575-0.624 millimeter, it is thousand rev/mins of 45.0-50.0 that rotating speed is chewed in commentaries on classics, and it is 60.0-80.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 600-800 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.625-0.674 millimeter, it is thousand rev/mins of 40.0-46.0 that rotating speed is chewed in commentaries on classics, and it is 60.0-80.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 600-800 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.675-0.724 millimeter, it is thousand rev/mins of 38.0-45.0 that rotating speed is chewed in commentaries on classics, and it is 32.4-42.4 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 600-800 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is the 0.725-0.774 millimeter, it is thousand rev/mins of 35.0-41.0 that rotating speed is chewed in commentaries on classics, and it is 33.0-43.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 600-800 inch per minute clock that Hui Su is chewed in commentaries on classics.
6. the manufacture method of the circuit board of tool high-current module according to claim 5 is characterized in that, holes according to following parameter:
If bore dia is 0.10 millimeter, it is thousand rev/mins of 115.0-125.0 that rotating speed is chewed in commentaries on classics, and it is 17.0-23.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.15 millimeter, it is thousand rev/mins of 115.0-125.0 that rotating speed is chewed in commentaries on classics, and it is 20.0-25.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.20 millimeter, it is thousand rev/mins of 115.0-125.0 that rotating speed is chewed in commentaries on classics, and it is 22.0-28.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.25 millimeter, it is thousand rev/mins of 115.0-120.0 that rotating speed is chewed in commentaries on classics, and it is 23.0-29.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.30 millimeter, it is thousand rev/mins of 95.0-100.0 that rotating speed is chewed in commentaries on classics, and it is 25.0-31.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.35 millimeter, it is thousand rev/mins of 80.0-85.0 that rotating speed is chewed in commentaries on classics, and it is 27.0-33.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.40 millimeter, it is thousand rev/mins of 71.0-76.0 that rotating speed is chewed in commentaries on classics, and it is 28.0-34.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.45 millimeter, it is thousand rev/mins of 61.8-67.8 that rotating speed is chewed in commentaries on classics, and it is 29.0-35.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.50 millimeter, it is thousand rev/mins of 55.7-60.7 that rotating speed is chewed in commentaries on classics, and it is 31.0-37.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 450-550 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.55 millimeter, it is thousand rev/mins of 51.3-54.3 that rotating speed is chewed in commentaries on classics, and it is 31.0-37.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 650-750 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.60 millimeter, it is thousand rev/mins of 46.0-49.0 that rotating speed is chewed in commentaries on classics, and it is 65.0-75.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 650-750 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.65 millimeter, it is thousand rev/mins of 42.0-45.0 that rotating speed is chewed in commentaries on classics, and it is 65.0-75.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 650-750 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.70 millimeter, it is thousand rev/mins of 39.5-43.5 that rotating speed is chewed in commentaries on classics, and it is 35.0-40.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 650-750 inch per minute clock that Hui Su is chewed in commentaries on classics;
If bore dia is 0.75 millimeter, it is thousand rev/mins of 37.4-40.4 that rotating speed is chewed in commentaries on classics, and it is 35.0-40.0 inch per minute clock that terminal-velocity is chewed in commentaries on classics, and it is 650-750 inch per minute clock that Hui Su is chewed in commentaries on classics.
7. the manufacture method of the circuit board of tool high-current module according to claim 1, it is characterized in that, in the step 3), described high-current module is copper billet, and the technological parameter of described copper billet brown is: the mass percent of strong oxidizer is that the mass percent of 3.8%-4.6%, hydrogen peroxide is 3.3%-5%, 32 ℃-38 ℃ of temperature and etch-rate 1.25 μ m/cm
2-1.75 μ m/cm
2, described strong oxidizer is clorox.
8. the manufacture method of the circuit board of tool high-current module according to claim 1, it is characterized in that, in the step 3), between high-current module composing and the potting high-current module pressing step, also comprise the whole operation with the thermal resistance material parcel that delays to conduct heat of high-current module, internal layer and prepreg.
9. the circuit board of the tool high-current module of each described manufacture method preparation of claim 1-8.
10. the circuit board of tool high-current module according to claim 9 is characterized in that, the corner of described high-current module is circular-arc.
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| CN108601199A (en) * | 2018-03-30 | 2018-09-28 | 奥士康精密电路（惠州）有限公司 | A kind of PCB copper components high reliability oxide method |
| CN113423177A (en) * | 2021-05-13 | 2021-09-21 | 江西景旺精密电路有限公司 | Method for improving position precision of hole-to-hole, line-to-line and line-to-welding prevention |
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| CN108347834A (en) * | 2018-03-09 | 2018-07-31 | 上海温良昌平电器科技股份有限公司 | A kind of preparation process of damascene copper local high current bearing structure |
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| JP2005317903A (en) * | 2004-03-31 | 2005-11-10 | Alps Electric Co Ltd | Circuit component module, circuit component module stack, recording medium and manufacturing method of them |
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| CN102123560B (en) * | 2011-03-01 | 2012-10-03 | 博敏电子股份有限公司 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
| CN102802365B (en) * | 2012-08-24 | 2014-12-17 | 皆利士多层线路版(中山)有限公司 | Manufacturing method for embedding copper heat sink into circuit board |
| CN103179812B (en) * | 2013-04-18 | 2016-05-11 | 梅州市志浩电子科技有限公司 | The preparation method of high multistage HDI printed circuit board (PCB) |
| CN103200779B (en) * | 2013-04-24 | 2016-06-22 | 梅州市志浩电子科技有限公司 | A kind of printed circuit board spacing drawing process |
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| CN106142205A (en) * | 2015-04-22 | 2016-11-23 | 大连崇达电路有限公司 | Diameter 0.25mm following printed wiring board finished hole processing method |
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| CN113423177A (en) * | 2021-05-13 | 2021-09-21 | 江西景旺精密电路有限公司 | Method for improving position precision of hole-to-hole, line-to-line and line-to-welding prevention |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN104159411A (en) | 2014-11-19 |
| CN104159411B (en) | 2017-10-17 |
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Application publication date: 20131002 |