CN117241503A - Manufacturing process of intelligent control embedded copper-buried high-heat-dissipation circuit board of automobile - Google Patents
Manufacturing process of intelligent control embedded copper-buried high-heat-dissipation circuit board of automobile Download PDFInfo
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- CN117241503A CN117241503A CN202311490807.3A CN202311490807A CN117241503A CN 117241503 A CN117241503 A CN 117241503A CN 202311490807 A CN202311490807 A CN 202311490807A CN 117241503 A CN117241503 A CN 117241503A
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- copper
- copper block
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- etching
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 96
- 229910052802 copper Inorganic materials 0.000 claims abstract description 92
- 239000010949 copper Substances 0.000 claims abstract description 92
- 238000000034 method Methods 0.000 claims abstract description 26
- 238000005530 etching Methods 0.000 claims abstract description 24
- 238000005553 drilling Methods 0.000 claims abstract description 19
- 239000003292 glue Substances 0.000 claims abstract description 14
- 238000009713 electroplating Methods 0.000 claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims abstract description 8
- 238000000151 deposition Methods 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims abstract description 6
- 238000011161 development Methods 0.000 claims abstract description 5
- 230000008719 thickening Effects 0.000 claims abstract description 5
- 239000002253 acid Substances 0.000 claims abstract description 4
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 238000004080 punching Methods 0.000 claims abstract description 4
- 238000003475 lamination Methods 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 7
- 238000003801 milling Methods 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 239000003814 drug Substances 0.000 claims description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 2
- 206010059866 Drug resistance Diseases 0.000 claims 1
- 230000008021 deposition Effects 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract description 2
- 239000006260 foam Substances 0.000 abstract 1
- 238000007788 roughening Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000008685 targeting Effects 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- -1 character printing Chemical compound 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- ing And Chemical Polishing (AREA)
Abstract
The manufacturing process of the intelligent control embedded copper-buried high-heat-dissipation circuit board of the automobile sequentially comprises the following steps of; the method comprises the steps of inner dry film, inner etching, gong embedded groove, riveting, copper block embedding, primary pressing, target hole punching, copper block area windowing etching, glue overflow removal, electroplating thickening, inner wet film exposure, inner wet film development, inner etching, resin filling, browning, secondary pressing, browning copper reduction, drilling, glue removal, conductive film shadow (PTH), copper electroplating filling, microetching copper reduction, drilling, baking, copper deposition, plate copper electroplating, outer dry film, acid etching, AOI, solder mask plugging, solder mask, gong plate and finished product cleaning; wherein the gong-embedded groove further comprises the following steps; preparing a foam brown chemical treatment (roughening the surface of copper) before pressing the copper block; in order to ensure that the copper block does not fall after being embedded, the copper block is correspondingly processed according to the size of +0.1mm; in order to ensure good embedding of the copper block and the PP, the PP and the inner core plate are grooved simultaneously; in order to ensure the stability of the copper block, after the copper block is embedded as a fixing, the PP and the inner core plate are riveted synchronously.
Description
Technical Field
The application relates to the field of circuit board manufacturing, in particular to a manufacturing process of an intelligent control embedded copper-buried high-heat-dissipation circuit board of an automobile.
Background
In the development of the fields of new generation information technology, energy conservation, new energy automobiles, electric power equipment and the like, the solution of the heat dissipation problem is urgent. At present, many approaches are available for solving the heat dissipation problem of the PCB, such as dense heat dissipation hole design, thick copper foil circuit, metal-based (core) plate structure, embedded copper block design, copper-based boss design, high heat conduction material, etc. The direct embedding of the metal copper block in the PCB is one of the effective ways to solve the heat dissipation problem. However, the existing manufacturing process has the problems of insufficient binding force between the copper block and the substrate, poor heat resistance, difficult removal of glue overflow, low product qualification rate and the like, and limits the application and popularization of the technical result of the embedded copper block PCB.
Disclosure of Invention
In order to solve the problems, the technical scheme provides a manufacturing process of the intelligent control embedded copper-buried high-heat-dissipation circuit board of the automobile.
In order to achieve the above purpose, the technical scheme is as follows:
the manufacturing process of the intelligent control embedded copper-buried high-heat-dissipation circuit board of the automobile sequentially comprises the following steps of;
cutting, baking a plate, inner dry film, inner etching, milling an embedding groove, riveting, embedding a copper block, performing one-time lamination, punching a target hole, performing copper block area windowing etching, removing glue overflow for 2 times, electroplating thickening, inner wet film 2 times, inner wet film exposure, inner wet film development, inner etching, outer resin filling, browning, performing two-time lamination, browning copper reduction, drilling, removing glue, PTH shadow, electroplating filling, microetching copper reduction, drilling, baking a plate, copper deposition, plate electroplating, outer dry film circuit, acid etching, AOI, solder resist plug hole, solder resist, nickel deposition gold, character printing, CNC milling a plate and cleaning a finished product;
wherein the gong-embedded groove further comprises the following steps;
preparing the surface of the copper roughened by soaking brown chemical liquid before copper block processing in advance;
in order to ensure that the copper block does not fall after being embedded, the copper block is correspondingly processed according to the size of +0.1mm;
in order to ensure good embedding of the copper block and the PP, the PP and the inner core plate are grooved simultaneously;
in order to ensure the stability of the copper block, after the copper block is embedded as a fixing, the PP and the inner core plate are riveted synchronously.
In some embodiments, the method further comprises the steps of;
and (3) vertically embedding in the copper block embedding process, and checking the embedding flatness after the embedding is finished.
In some embodiments, the method further comprises the steps of;
the gaps among the embedded copper blocks, the PP and the core plate are controlled, the processing is carried out according to +0.1mm, and the large-area glue overflow is effectively controlled to the copper surface;
adopting a mode of adding plating after laminating the 1OZ copper foil; plating conditions 35ASFX35minX6 times;
and removing the gumming residue for 2 times to treat the residual gum on the copper block surface.
In some embodiments, the method further comprises the steps of;
the thickness of the wet film is ensured to be more than 15 micrometers, the 77T screen printing mode is adopted for 2 times for printing, and meanwhile, the wet film is baked at high temperature, so that the etching resistance water is ensured; etching rate: 0.5m/min.
In some embodiments, the method further comprises the steps of;
the method comprises the steps of positioning a target hole which is punched after lamination, firstly stripping a laser target of an inner layer by laser, positioning by using the laser target of the inner layer, and performing laser drilling by using a tensile drilling belt.
The application has the beneficial effects that:
the embedded copper block printed circuit board has the characteristics of high heat conductivity, high heat dissipation, board surface space saving and the like, and can effectively solve the heat dissipation problem of high-power electronic components. The embedded copper block PCB heat dissipation technology is characterized in that a copper block is embedded into an FR4 substrate or a high-frequency mixed-voltage substrate, the heat conductivity coefficient of copper is far greater than that of a PCB dielectric layer, and heat generated by a power device can be effectively conducted to the PCB through the copper block and dissipated through a radiator. The PCB bearing the copper block can be designed into a multi-layer board, and the substrate material is selected from FR4 (epoxy resin) material or high-frequency mixed pressure material according to the structural design requirement of the product.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below.
FIG. 1 is a schematic flow chart of an embodiment of the application.
Description of the embodiments
In order to make the technical problems, technical schemes and beneficial effects solved by the application more clear, the application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
Referring to fig. 1, the manufacturing process of the intelligent control embedded copper-buried high-heat-dissipation circuit board of the automobile sequentially comprises the following steps of;
cutting, baking a plate, inner dry film, inner etching, milling an embedding groove, riveting, embedding a copper block, performing one-time lamination, punching a target hole, performing copper block area windowing etching, removing glue overflow for 2 times, electroplating thickening, inner wet film 2 times, inner wet film exposure, inner wet film development, inner etching, outer resin filling, browning, secondary lamination, browning copper reduction, drilling, removing glue, PTH shadow, copper electroplating filling, microetching copper reduction, drilling, baking a plate, performing electroless copper deposition, plate copper electroplating, outer dry film circuit, performing acid etching, AOI, solder resist plug hole, solder resist, nickel gold deposition, characters, milling a plate and cleaning a finished product;
wherein the gong-embedded groove further comprises the following steps;
preparing the vesicular and browned liquid medicine before pressing the copper block;
in order to ensure that the copper block does not fall after being embedded, the copper block is correspondingly processed according to the size of +0.1mm;
in order to ensure good embedding of the copper block and the PP, the PP and the inner core plate are grooved simultaneously;
in order to ensure the stability of the copper block, after the embedded copper block is used for fixing, the PP and the inner core plate are riveted synchronously, the embedded groove processing and the copper block embedding stability control are carried out, and the copper block can be embedded and cannot fall off in the subsequent processing process.
In this embodiment, the method further includes the following steps;
and (3) vertically embedding in the copper block embedding process, and checking the embedded flatness after the embedding is finished so as to ensure the flatness.
In this embodiment, the method further includes the following steps;
the edge of the embedded copper block is subjected to glue overflow treatment and electroplating thickening, so that the copper-added copper and the copper block are guaranteed to have good binding force, the copper-added copper and the copper block are prevented from being separated in a subsequent finished product thermal shock test, and an effective heat dissipation effect cannot be achieved;
specifically, R-flow PP is not adopted at this time, common PP is adopted for processing, and the gaps among the embedded copper block, the PP and the core plate are controlled by controlling, and the processing is carried out according to +0.1mm, so that the large-area glue overflow on the copper surface is effectively controlled;
the original scheme is to plate to 6OZ according to 3OZ, consider the copper area to be windowed, adopt 1OZ copper foil to press
A post plating mode; plating conditions 35ASFX35minX6 times;
and (3) removing the gumming residue for 2 times to treat the residual gum on the copper block surface, wherein part of residual gum is unclear, and grinding a plate or 1000-mesh fine sand paper after treatment by concentrated sulfuric acid.
In this embodiment, the method further includes the following steps;
the thickness of the wet film is ensured to be more than 15 micrometers, the wet film is printed by adopting a mode of 77T screen printing for 2 times, and meanwhile, the wet film is baked, so that the etching resistance is ensured; etching rate: 0.5m/min.
Filling resin before secondary lamination;
specifically, the 2/5 layers and the 1/6 layers adopt a single 1067 lamination structure, and the 2/5 layers are required to be laminated by adopting a mode of laminating after filling the substrate surface so as to ensure the lamination binding force and avoid the problems of board explosion and the like;
since 2/5 copper layer thickness reaches 201 micrometers, single 1067 can not fill the open area, so the open area needs to be further pressed after being filled with resin.
In this embodiment, the method further includes the following steps;
targeting, copper reduction, brown-out and copper electroplating filling;
and (3) targeting: the minimum aperture of the plate is 0.15mm (laser drilling), and six positioning holes for laser drilling are required to be drilled by using X-RAY.
Copper reduction and browning: copper reduction (8-10 microns) and browning are carried out on the brown wire so as to strengthen the absorption of laser energy by the copper surface and ensure the quality of laser drilling.
Laser drilling: and (5) drilling by using an external laser.
The method comprises the steps of positioning a target hole which is punched after lamination, firstly stripping a laser target of an inner layer by laser, positioning by using the laser target of the inner layer, and performing laser drilling by using a tensile drilling belt.
The problems of product alignment precision, copper block embedded X-plane precision, copper block embedded Z-axis compression precision, thick copper etching, thick copper compression, glue overflow treatment, heat-resistant module binding force, heat-resistant module alignment degree and the like in the product processing are solved through the processing of the embedded high-heat-dissipation product.
The foregoing description of the preferred embodiments of the present application is not intended to limit the scope of the application, but rather is presented in the claims.
Claims (5)
1. The manufacturing process of the intelligent control embedded copper-buried high-heat-dissipation circuit board of the automobile sequentially comprises the following steps of;
cutting, baking a plate, inner dry film, inner etching, milling an embedding groove, riveting, embedding a copper block, performing primary pressing, punching a target hole, performing window cutting etching on a copper block area, removing glue overflow for 2 times, electroplating thickening, performing inner wet film 2 times, performing inner wet film exposure, performing inner wet film development, inner etching, filling resin, browning, performing secondary pressing, performing brown copper reduction, drilling, removing glue, performing PTH shadow, electroplating filling, performing microetching copper reduction, drilling, baking a plate, depositing copper, performing plate copper plating, outer dry film lines, performing acid etching, AOI, performing solder resist hole plugging, performing solder resist, depositing nickel gold, milling a plate, and cleaning a finished product;
the method is characterized in that;
wherein the gong-embedded groove further comprises the following steps;
preparing the vesicular and browned liquid medicine before pressing the copper block;
in order to ensure that the copper block does not fall after being embedded, the copper block is correspondingly processed according to the size of +0.1mm;
in order to ensure good embedding of the copper block and the PP, the PP and the inner core plate are grooved simultaneously;
in order to ensure the stability of the copper block, after the copper block is embedded as a fixing, the PP and the inner core plate are riveted synchronously.
2. The process for manufacturing the intelligent control embedded copper-buried high-heat-dissipation circuit board of the automobile according to claim 1, which is characterized in that: the method also comprises the following steps of;
and (3) vertically embedding in the copper block embedding process, and checking the embedding flatness after the embedding is finished.
3. The process for manufacturing the intelligent control embedded copper-buried high-heat-dissipation circuit board of the automobile according to claim 2, which is characterized in that: the method also comprises the following steps of;
the gaps among the embedded copper blocks, the PP and the core plate are controlled, the processing is carried out according to +0.1mm, and the large-area glue overflow is effectively controlled to the copper surface;
adopting a mode of adding plating after laminating the 1OZ copper foil; plating conditions 35ASFX35minX6 times;
and removing the gumming residue for 2 times to treat the residual gum on the copper block surface.
4. The process for manufacturing the intelligent control embedded copper-buried high-heat-dissipation circuit board of the automobile according to claim 3, wherein the process comprises the following steps of: the method also comprises the following steps of;
the thickness of the wet film is ensured to be more than 15 micrometers, printing is carried out by adopting a mode of 77T screen printing for 2 times, and meanwhile, high-temperature baking is carried out, so that the wet film is solidified, and the etching drug resistance is ensured; etching rate: the etching cylinder was 10 m long at 0.5m/min.
5. The process for manufacturing the intelligent control embedded copper-buried high-heat-dissipation circuit board of the automobile according to claim 4, which is characterized in that: the method also comprises the following steps of;
the method comprises the steps of positioning a target hole which is punched after lamination, firstly stripping a laser target of an inner layer by laser, positioning by using the laser target of the inner layer, and performing laser drilling by using a tensile drilling belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311490807.3A CN117241503A (en) | 2023-11-10 | 2023-11-10 | Manufacturing process of intelligent control embedded copper-buried high-heat-dissipation circuit board of automobile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311490807.3A CN117241503A (en) | 2023-11-10 | 2023-11-10 | Manufacturing process of intelligent control embedded copper-buried high-heat-dissipation circuit board of automobile |
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| Publication Number | Publication Date |
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| CN117241503A true CN117241503A (en) | 2023-12-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311490807.3A Pending CN117241503A (en) | 2023-11-10 | 2023-11-10 | Manufacturing process of intelligent control embedded copper-buried high-heat-dissipation circuit board of automobile |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101790290A (en) * | 2010-01-22 | 2010-07-28 | 东莞生益电子有限公司 | Method for manufacturing embedded high-conductivity printed circuit board (PCB) |
| CN102933032A (en) * | 2012-10-29 | 2013-02-13 | 无锡江南计算技术研究所 | Printed wiring board lamination and copper block embedding method |
| CN103338593A (en) * | 2013-07-22 | 2013-10-02 | 皆利士多层线路版(中山)有限公司 | Circuit board with large current module and manufacturing method for circuit board |
| CN105764273A (en) * | 2016-04-22 | 2016-07-13 | 深圳崇达多层线路板有限公司 | Manufacturing method of PCB embedded with heat dissipation block |
| CN110708859A (en) * | 2019-09-20 | 2020-01-17 | 深圳崇达多层线路板有限公司 | Embedded copper block and manufacturing method for enhancing bonding force of embedded copper block |
-
2023
- 2023-11-10 CN CN202311490807.3A patent/CN117241503A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101790290A (en) * | 2010-01-22 | 2010-07-28 | 东莞生益电子有限公司 | Method for manufacturing embedded high-conductivity printed circuit board (PCB) |
| CN102933032A (en) * | 2012-10-29 | 2013-02-13 | 无锡江南计算技术研究所 | Printed wiring board lamination and copper block embedding method |
| CN103338593A (en) * | 2013-07-22 | 2013-10-02 | 皆利士多层线路版(中山)有限公司 | Circuit board with large current module and manufacturing method for circuit board |
| CN105764273A (en) * | 2016-04-22 | 2016-07-13 | 深圳崇达多层线路板有限公司 | Manufacturing method of PCB embedded with heat dissipation block |
| CN110708859A (en) * | 2019-09-20 | 2020-01-17 | 深圳崇达多层线路板有限公司 | Embedded copper block and manufacturing method for enhancing bonding force of embedded copper block |
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